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Module 5
Introduction
• Grinding is done for removing a very small amount of metal
from the work-piece either to bring its dimension within
very close tolerances(+/- 0.02mm) or to give fine finish (0.1
μm) on the workpiece.
1. Plain grinding
2. Surface grinding
3. Cylindrical Grinding Processes
4. Center-less Grinding
3. GRADE
• The degree of hardness possessed by the bond is called the
grade of the wheel and indicates the strength of the grip with
which the abrasive grains are held in the bond.
Types of bonds in grinding wheel
The following bonds are generally employed in manufacture of
grinding wheels:
1.Vitrified bond: It is denoted by letter V and about 80% of the wheels used in
the industry are of this bond.
2.Silicate bond: It is denoted by letter S and silicate of soda (commonly known
as water glass) is the main constituent of this bond.
3.Shellac bond: It is denoted by letter E and shellac (a naturally available
material) is the main constituent of the bond.
4.Rubber bond: Here the abrasive in kneaded in rubber and the wheels are
moulded from this material. Denoted by letter R.
5.Resinoid bond: These wheels are made from bakelite and other resinous
material. It is denoted by letter B.
WHEEL STRUCTURE
• The proportion of bond material in a wheel varies
from about 10% to 30% of its total volume.
• Structure of wheel depends upon this percentage.
1. Abrasive Materials
2. Abrasive Grain Size
3. Wheel Grade
4. Wheel Structure
5. Wheel Bond
6. Grinding Wheel Marking
1. Abrasive Materials
• The abrasives for grinding wheels are generally harder
than the material of a single-point tool.
• In addition to hardness, friability is an important
characteristic of abrasives.
• Conventional Abrasives
– Aluminum oxide, Al2O3 (Corundum),
– Silicon carbide, SiC (Carborundum),
• Super Abrasives:
– CBN
– Diamond
2. Abrasive Grain Size
• The size of an abrasive grain is identified by the grit number,
which is a function of sieve size.
• The smaller the sieve size, the larger the grit number.
• Wheels of open or porous structure are used for high metal removal
rates that produce rough surfaces.
• Thus, the bond acts like a tool post that supports the abrasive
grains.
• In spite of the small size of the layer being cut in grinding, the
chip has the same comma form similar to that obtained by
milling.
• The cutting speeds of GWs are very high, typically 30 m/s, which
together with the minute chip removal of the grains provide high
dimensional and form accuracy along with high surface quality.
Advantages
Grinding possesses certain advantages over other metal cutting
methods:
1. Discoloration
2. Mechanical damage
3. Metallurgical damage
4. Chemical damage
COOLANT
• In the grinding operation, lot of heat is generated. This heat must be
carried away. Hence an effective coolant is used.
• The coolant also washes away the ground chips and swarf.
• The coolant must not have lubricant in it, otherwise, it may lead to
glazing of wheels.
Thank You