ASM-Thin Die Detachment With Pre-Peeling Mechanism-2004

Thin Die Detachment with
Pre-peeling Mechanism
ASM Advances in Semiconductor Packaging Technologies

Copyright  ASM Pacific Technology Ltd. 2003
Contents
1. Existing Thin Die Detachment Process

2. New Proposed Thin Die Detachment
Process with Pre-peeling Mechanism
3. Finite Element Simulation for Pre-
peeling
4. Design Rule and Implementation
5. Further work

1. Existing Thin Die Detachment
Process
1.1 Multiple ejector pin detachment method
Collet
Die Mylar film
Pin
Supporting
platform
Vacuum
chamber
Ejector

Process
1.2 Arrangement of the multiple ejector pins
Die
Outer pin 8.8 mm x 7.24 mm
location
7.2 mm
3.54 mm Symmetric B.C.
Inner pin 5.64 mm
location
dx
dy
Adhesive film
11.8 mm x 10.24 mm
One-quarter FEM
modeling Fixed boundary
conditions

Process
1.3 Failure mode for die crack during the detachment
Maximum strain
location
Die
Plastic adhesive film

Normal adhesive
Process
20 0.001
Ultimate strain
0.0009 1.4 Critical parameter

15
for the detachment: the
Applied J-integral (J/m )
2
0.0008
location of the outer
maximum strain
0.0007 ejector pins from the
10 edge of the die
0.0006
UV adhesive
0.0005
5
0.0004
0 0.0003
0 50 100 150 200 250
Distance of ejector up 
( m)
dx=1400 max. strain, dx=1400

dx=500 max. strain, dx=500

Process
1.5 Limitations for the existing design
 Localized deformation effect created by
the ejector pins
 Initiation of micro-cracks near the edges
of the die (created in the die saw process)
for ejector pins located near the edges of
die
 More ejector pins are needed for large and
thin die, ejector pins themselves will
inhibit the delamination to propagate to
the center of the die

2. New Proposed Thin Die Detachment
Process with Pre-peeling Mechanism
2.1 Can vacuum pressure act as applied load to pre-
peel mylar from the edges of die with a geometrical
constraints/assistance?
Collet
Die
Mylar
Vacuum sealing ring
Cap
Changeable
chunk head Holes for
vacuum and
ejector pins
Chuck

3. Finite Element Simulation for Pre-
peeling
3.1 Simulation configurations
axis of symmetry
a collet load
die
mylar
b step-up
vacuum load platform
cap

Animation of the Simulation Results
(3-mil die 1mm from edge without collet constraint)

(2-mil die 1mm from edge without collet constraint)

(3-mil die 1mm from edge with collet constraint)

Simulation Results
For 75 m thickness dice
25 0.0014
0.0012
Applied J integral (J/m )
20
2
Extended
Range 0.001
Total strain
15 0.0008
UV 0.0006
10 range
0.0004
5
0.0002
0 0
0 20 40 60 80 100
Vacuum (KPa)
Applied J integral (1mm) J/m^2) Total strain (1mm)

Applied J integral (1mm) collet (J/m^2) Total strain (1mm) collet
Applied J integral (0.8mm) collet (J/m^2) Total strain (0.8mm) collet

Simulation Results
For 50 m thickness dice

25 0.002
20
0.0015
Total Strain (Top)

Applied J (J/m )
Extended
2
Range
15
0.001
UV
10 range
0.0005
5
0 0
0 20 40 60 80 100
Vacuum (KPa)
Applied J a=0.7 (J/m^2) Total Strain a=0.7 (Top)
Applied J a=0.5mm (J/m^2) Total strain a=0.5 (top)

4. Design Rule and Implementation
Positioning of a die
Design considerations:
Collet moves to contact the die
1 : size and thickness of die (Fig. 1)
2 : size and height of the step extrusion

Vacuum is applied to the collet to
hold the die (Fig. 2)
3 : location of the ejector pins
9 : vacuum holes Vacuum is applied to the cap
(Fig. 3)
Ejector moves up from the

reference level (Fig. 4)
Collet moves up and picks up the

die (Fig. 5)

Position and collet moves to contact
the die
Collet
Die
Mylar
Cap
Changeable
vacuum and
ejector pins
Chuck
Fig. 1

Vacuum is applied to the collet to hold the
die
Thin die collet

Die
Mylar
Cap
Changeable
vacuum and
ejector pins
Chuck
Fig. 2

Vacuum is applied to the cap
(Pre-peeling)
collet
Die
Mylar
Cap
Changeable
vacuum and
ejector pins
Chuck
Fig. 3

Ejector moves up from the reference level
collet
Die
Mylar
Cap
Changeable
vacuum and
ejector pins
Chuck
Fig. 4

Collet moves up and picks up the die
collet
Die
Mylar
Cap
Changeable
vacuum and
ejector pins
Chuck
Fig. 5

Further work
 Effect of step height

 The applied J-integral after pre-
peeling
 Verification on the design and
simulation results by testing on 2 mil
thickness die
 Universal tools design to cover a
range size and thickness of die

<<< Questions >>>


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Thin Die Detachment with

ASM Advances in Semiconductor Packaging Technologies

1. Existing Thin Die Detachment Process

ASM Advances in Semiconductor Packaging Technologies

Die Mylar film

ASM Advances in Semiconductor Packaging Technologies

3.54 mm Symmetric B.C.

Inner pin 5.64 mm

ASM Advances in Semiconductor Packaging Technologies

Plastic adhesive film

ASM Advances in Semiconductor Packaging Technologies

0.0009 1.4 Critical parameter

dx=1400 max. strain, dx=1400

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

Applied J integral (1mm) J/m^2) Total strain (1mm)

ASM Advances in Semiconductor Packaging Technologies

For 50 m thickness dice

Total Strain (Top)

ASM Advances in Semiconductor Packaging Technologies

2 : size and height of the step extrusion

Ejector moves up from the

Collet moves up and picks up the

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

Thin die collet

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

 Effect of step height

ASM Advances in Semiconductor Packaging Technologies

ASM Advances in Semiconductor Packaging Technologies

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