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› Overview
› Ericsson High Capacity BSC
› Ericsson High Density BSC
› BSC Hardware Dimensioning Principles
• by improving • to meet
subscribers current
revenue and future
demand
Expected Expected
› New HW well prepared for future
growth Technology life time functionality growth
Evolution
– IP-connectivity HW integrated in the
BSC provides BSC IP environment for
Allows higher current and future needs.
degree of – New AXE boards designed for future
integration
functionality growth without capacity
degradation
qm
0.5 s
GDM/GEM expansions
High Capacity BSC / BYB501/AXE10 / Compact BSC
LTB 2010-12-31
EGEM expansions
High Capacity BSC / BYB501/AXE10
LTB not defined
DL- 34
GS 890 RPI
RPI ET155-1
RPI
TRA-R7 RPI
Switch
MUX5
CLM Core
DLEB RPI
DLEB
GEM
Transcoder
ET155 magazine
magazine
APG40C 3 ET155-1
(IOG20C) 16 TRA
7 PCU
FAN FAN FAN FAN FAN
2 HSL
16 RPG3 3 ET155-1 7 PCU
FAN
16 TRA
2 HSL 16 RPG3 7 PCU
FAN FAN FAN FAN FAN
2 HSL 4K DLEB
16 RPG3 3 ET155-1 7 PCU 16 RPG3
2 ET155-1
2 HSL 8 TRA
7 PCU 8 TRA 7 PCU 16 RPG3
FAN
FAN FAN FAN FAN FAN
BFZ 102 109 BFZ 102 105 BFZ 102 102 BFZ 102 102 BFZ 102 101 BFZ 102 101
› Strictly non-blocking
› Distributed, 16 kMUPs per GEM. Implemented as a single
15mm XDB board
› Maximal capacity at normal rate is 128K , scalable in steps
of 16K
› Maximal sub-rate capacity is 128K , scalable in steps of 16
K
› Redundant Architecture, meaning that single faults will not
affect traffic
› TS (Time/space) structure
DLEB
DLEB
IRB
IRB
CGB
CGB
XDB
XDB
BSC HW Dimensioning Workshop | Commercial in confidence | 2010-08-11 | Page 18
GS 890 connection to GDM & GEM
Main features:
› One 155 Mbit/s SDH/SONET termination on one board
› ETSI (ITU-T) and ANSI standards
› Optical and electrical STM-1 interface
› Optical OC-3 interface
› 8kHz and 2Mb/s synch signals, with SSM carried by
incoming STM-1
› Network protection, MSP (Multiplex Section Protection)
1+1
› Equipment protection
› Power dissipation < 16 W
› MTBF > 80 years with protection
› EMC Class B
DDF ODF
ETC-E1
ETC-E1
ETC-T1
ETC-T1
ETC-T1
ETC-T1 ET155-1
ET155-1
ETC-E1
ETC-E1 ADM SDH ADM SDH
GS
GS
GS ETC-T1
ETC-T1
ETC-T1
ETC-T1 TM or Network ET155-1
ET155-1 or Network
GS
GS
SDXC SDXC
ETC-E1
ETC-E1
ETC-T1
ETC-T1
ETC-T1
ETC-T1 ET155-1
ET155-1
E1 E1 STM-1 STM-1STM-1
› Transcoders, TRA R7
› Based on a Common Speech Processing Board (CSPB
2.0)
– Reduced footprint (1 Board)
– Reduced Power (1/3 compared to TRA R5)
– Higher capacity (384 Channels/board)
– Supports all codecs used in GSM systems,
i.e. EFR, FR, HR, Adaptive MultiRate codec (AMR) and AMR-WB
› ITU-T C7
– 4 signaling links per board, 64 kb/s each
– ITU-T standard (Q.703 recommendation)
– Placed in GDM-H magazine
› TRH
- 1 RPG3 handles up to 32TRX’s
GPH (PCU)
- PCU is needed for GPRS/EGPRS
- 1 RPP board normally handles 150 channels (16Kbit/s) or,
up to 64 channels (64 Kbits/s)
BSS 06A:
• PGWB is a new HW CP
APZ 212 33C
GS
GS890
Abis over IP
LAN
IO switch ET TRA SIGTRAN PGW
APG40 Summit 48si ET155-1 TRA R6/R7 SLI PGWB
R6 capacity TRH
GPH C7
HSL
(PCU)
GDM
RPG3 RPP
NB
RPG3 RPP
R12 07A
APZ / HSL APG / GDM GEM64K GEM64K PCU RPG BSC LAN Switch
FAN FAN
APG40C 3 ET155-1 TRH,PCU
(IOG20C) 16 TRA IP-conn. TRH,PCU
7 PCU Signaling
FAN FAN FAN FAN FAN
2 HSL FAN FAN
16 RPG3 3 ET155-1 7 PCU
FAN FAN FAN FAN
16 TRA
2 HSL 16 RPG3 7 PCU
Transm. Transm.
FAN FAN FAN FAN FAN Transm.
TRC TRC
2 HSL
16 RPG3 4K DLEB 7 PCU 16 RPG3
3 ET155-1
2 ET155-1 FAN FAN FAN
2 HSL 8 TRA
7 PCU 8 TRA 7 PCU 16 RPG3
FAN FAN FAN FAN
FAN FAN FAN FAN FAN
APZ 7 PCU 4K DLEB 7 PCU 16 RPG3 Transm.
3 ET155-1 CP & IO Transm.
212 33C 2 ET155-1 TRC
8 TRA
7 PCU 8 TRA (2 HSL) 16 RPG3
FAN FAN FAN FAN
BFZ 102 109 BFZ 102 105 BFZ 102 102 BFZ 102 102 BFZ 102 101 BFZ 102 101
BYB501
– 19” ETSI
GEM compatible
Dual Fan trays
24 user slots
– 15 mm width
– 50 W
Ethernet stars
– 2 x 1GE/slot
– 2 x 10GE/2 slots Benefits:
Optimized capacity vs. footprint
› Ethernet RP bus
› eGEM Technology
– 256 EGPRS
– 512 GPRS
› eGEM Technology
– 256 TRXs
› eGEM Technology
GARP 2
GARP 2
A
G G
R
W W
P
› Capacity (per board)
B B
2
– 200 TRXs
› eGEM Technology
› eGEM Technology
› eGEM Technology
e-GEM Magazine
Two monoliths each occupying one
BYB501 magazine 06B 07B
S S
C C A A C A A C
A
B P P P M P P P B
L
APZ - U U A U U -
APG40 A
21233C R B B disk U B B disk R
R
P - - - B - - - P
M
/ A A A B B B /
4 4
STEB
APG40C ET155-1 TRA R7 TRHB GPHB or SLI PGWB
• New IP infrastructure,
substituting the Extreme Switches
eGEM 16K GS
FAN
S S
APZ 212 55 C C
APG43 E E E E
B S S T T T T T G G GG B
X T T I C T T A A C C X
- T T R R R R R P P P P -
FAN
D 1 1 R G 1 1 G G D DD
R E E H H H H H H H H H R
B 5 5 B B 5 5 WW B BB
P BB B B B B B B B B B P
5 5 5 5
/ /
4 4
eGEM 16K GS
FAN FAN
PGW, AGW S S
APZ 212 55 TRA R7
APG 43 C T T T T T T T T T C
ET155 E E E E
B R RR R R R R R R B
X T T P P P T T AA A A X
FAN FAN - A AA A A A A A A -
D 1 1 G GG 1 1GGG G D
R R
B 5 5 W WW 5 5 WW W W B
P R RR R R R R R R P
5 5 5 5
/ 7 7 7 7 7 7 7 7 7 /
4 4
eGEM 16K GS
S S
C C
E E E E
B S S T T T T T T T T T G G B
X T T I C T T C C X
- T TR R R R R R R R R P P -
D 1 1 R G 1 1 D D D
R E EH H H H H H H H H H H R
B 5 5 B B 5 5 B B B
P B BB B B B B B B B B B B P
5 5 5 5
/ /
4 4
eGEM 16K GS
FAN FAN FAN
R HHH R
B 5 5 5 5 B
P R R R R R R R R R R R R R BBB P
5 5 5 5
/ 7 7 7 7 7 7 7 7 7 7 7 7 7 /
4 4
› Minimal Footprint
– 0.24 sqm / cabinet
SMPC
(SMLC)
A-bis (Remote) Lb
BSC
(A)
A-ter MSC
MSC
TRC A
A
BSC
PCU SGSN
A-bis Gb
TRX
EPDCH P 64
Locating
TCH T S
CP
TCH T S
etc
GS,
TCH
TCH
T S
T S TRHs TRAs ETCs,
BPDCH P 16
S RP bus
SDCCH S etc
T
BCCH S
A-if
Abis-if
T T
No7
S P T
T
P MSC
... ...
SGSN
One 64 Kbps TS on a 2 Mbps PCM link P
can carry 8/16/32/64 Kbps bit-streams
T = CS traffic Gb-if
S = CS signalling (LAPD)
P = PS traffic/signalling PCU Ethernet
ETC
Ethernet
RPP
Gb-if
(Frame High Dense HW
Relay) “All in GEM”
GPHB
64 Kbps TSs,
X ETC
each with
- 4 BPDCHs
or
- 1 EGPDCH
GS Abis
BSC HW Dimensioning Workshop | Commercial in confidence | 2010-08-11 | Page 51
General BSC dimensioning
Abis Optimization/IP!
Abis OPT
ETC TRA TRH
(without IP)
GS
BYB501
R5B 24 channels per board
AXE810
R6A 192 channels per board
128 ch/board for TFO
64 channels AMR-WB (TFO)
AXE810
R7 384 channels per board
256 channels AMR-WB
BSC HW Dimensioning Workshop | Commercial in confidence | 2010-08-11 | Page 53
Transcoder
› Total traffic in the BSC 5000 erlang
Percentage Full Rate 40%
percentage Enhanced Full rate 40%
Percentage Half Rate 20%
› FR traffic 2000erl.
EFR traffic 2000erl.
HR traffic 1000erl.
*) GOS 0.1%
AXE810
RPG3 31 TRUs per board R R R R R R R R
24-25 more realistic P P P P P P P P
G G G G G G G G
3 3 3 3 3 3 3 3 T
R
AXE810 H
TRHB 256 TRUs per board B
Can (will) be lower depending on the traffic model, LAPDC/SDCCH, size of BTSs and
size of Location Area.
Calculation formulas included in dimensioning handbook
BYB501
RPG2 4 C7 signaling links per board
AXE810 Nb SS7
RPG3 4 C7 signaling links per board R R R R R R R R
P P P P P P P P
G G G G G G G G S
3 3 3 3 3 3 3 3
T
AXE810 E
R R R R B
STEB 128 C7 per board P P P P
STEB 4 HSL P P P P
HSL
BYB501/AXE810
RPP 1 HSL (ATM or TDM) per board
C7 ETC ETC C7
Number of C7 connections:
Total octets/sec(TDM) / ( 8000 * 0.3)
alt.
Number of HSL(ATM)
Total octets/sec (ATM) / (240000 * 0.4)
alt.
Number of HSL(TDM)
Total octets/sec (TDM) / (240000 * 0.4)
Example:
Number of TRUs connected to the BSc 1000
Number of TS connected 3000
Utilization degree of the E1 70%*)
Number of E1 required = 3000 / (31 *70%) 139
Calculation example:
Calculation example
Remote BSC1 500 erlang/2 C7
Remote BSC2 1000 erlang/4 C7
Remote BSC3 1000 erlang/4C7
Number of E1 for BSC1 = (555 + 2) / 31 = 18 E1
Number of E1 for BSC2 = (1072 + 4) / 31 = 35 E1
Number of E1 for BSC3 = (1072 + 4) / 31 = 35 E1
Total requirement = 88 E1
Capacity of ET155
Redundancy of ET155
The ET155-1 supports two types of protection mechanisms:
– network protection (MSP 1+1)
– equipment protection.
One GEM magazine, up to 8 working ET155-1 and 8 protected (to
achieve full protection) ET155-1 can be fitted.
Gb over IP calculation:
Throughput kbit/s(user plane IP level) *1.37 * 0.8
(1,37= IP overhead, 80% utlization)
Note1! General 0.5-1 PDCH/E-PDCH per Cell are sufficient and reasonable to use in the BSC dimensioning, however
sometimes high number of PDCH/E-PDCH per Cell are required then this could be considered as a peak rate requirement.
The BSC dimensioning approach could in this case be to dimensioning for an average load of PDCH/E-PDCH, assuming
PDCH are dynamically set-up and all cells don’t peak simultaneously.
71 / 31 = 3 Gb RPP’s
300 – 3 x 90 = 30 BPDCH requiring one more RPP
3 Gb RPP + 1 A” RPP + 1 redundancy = 5 RPP’s in total (7 RPP in PP)
[300 EPDCH => 3 Gb RPP + 4 A” RPP + 1 red = 8 RPP’s (14 RPP in PP)]
16 150 46
24 118 38
31 90 31
Applications in SW
Applications in SW
STM-1
TRAB GSPU ET155
Generic speech Generic 155 Mbit
processing unit SDH Exchange Terminal
EC
GEM
4 * DL-3
RPBs 16 K MUP RPBs
A-plane B-plane
Interface
22 pos.
DLEB Device boards
DL3 MUX
GS plane A GS plane B
BSC HW Dimensioning Workshop | Commercial in confidence | 2010-08-11 | Page 75
PGW dimensioning
› The capacity of PGW/2 is twice more than PGWB (Only for HD BSC)
› Maximum 32 PGWB for High Capacity BSC, and 21 PGWB for High Dense
BSC.
~ 5%
Idle Load
Basic load when no traffic or
O&M; size (HW) dependent
~ 10 %
0%
BSC HW Dimensioning Workshop | Commercial in confidence | 2010-08-11 | Page 80