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Some questions about Bonding Structure and Properties

Write short answers to the following questions in order to prepare the exam. You can use either your notes or you class copies and even internet or other books. 1. How do some atoms achieve the electron arrangement of the nearest noble gas when forming covalent bonds? 2. What does a covalent molecule consist of? 3. Define diatomic molecule 4. How can be a shared pair of electrons represented? 5. Why do atoms stay together when sharing pairs of electrons? 6. Since we know covalent bonds are strong, we could think that covalent molecular substances have high melting points. Why is this affirmation not true? 7. Why is diamond s structure the hardest known? 8. Why does diamond not conduct electricity? 9. Explain why graphite conducts electricity. 10. What substances can we find silicon dioxide as in nature? 11. Why is graphite so brittle? 12. Why has diamond got a so high melting point? 13. Explain what an empirical formula represents. 14. What are the main features of SiC? 15. How do the atoms taking part in ionic bonding achieve the electron configuration of the nearest noble gas? 16. Summarize the process of bonding in the sodium chloride network using a chemical equation. 17. What is an ionic lattice? Describe it. 18. Why do ionic compounds not conduct electricity in the solid state? 19. Why are the melting points of ionic compounds so high? 20. Explain why ionic compounds conduct electricity when molten. 21. Why do ionic compounds conduct electricity in aqueous solution? 22. Why do ionic lattices break down when it dissolves in water? 23. Why do covalent network compounds not dissolve in water? 24. Explain why sugar and simple alcohols dissolve in water. 25. Most molecular covalent substances dissolve in non-aqueous solvents whereas ionic compounds do not. Explain why. 26. Explain why metals conduct electricity. 27. Explain nuclei and electrons arrangement in a metal. 28. Why have metals got high melting points? 29. Explain what the malleability in metals is.

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