Professional Documents
Culture Documents
1.Description:
Besides diamond,sapphire is the most hard material. Sapphire crystal is easy to break and have
chipping, so this kind of material is relatively difficult for elaborate processing.
Sub nanosecond, long laser pulse, fastest speed and highest precision sapphire crystal laser cutting
machine, which is a new generation of laser precision machining equipment to meet the demands
of sapphire crystal applicable industries.
Fastest cutting speed, highest dimensional accuracy, no consumables, complete functions, easy
operation, stable and reliable of all performance indicators under continuous operating conditions.
This machine has been inspected in the area of sapphire crystal cutting and drilling, and acquires
customers full affirmation and recognition.
2.Cutting range:
Thickness: below 2mm
Accuracy:0.003mm (depends on the thickness of material)
High efficient cutting, good quality of cutting edge. Sapphire plate cutting , sapphire fine panel
cutting. Sapphire has
outstanding optical property, mechanical
strength and high hardness. Widely used
in mobile
high
etc.
Material thickness under 1mm:
Cutting shape: wafer, oval tablets, oblique wafer, stairs window film, oblique films and any
arbitrary shape
Min. hole diameter: 0.03mm
Accuracy : +-5um smooth vertical wall, no chipping
3.Characteristics:
stability
4.Technology advantages:
Compared with traditional processing, quality and quantity have been greatly improved;
Fastest speed, highest accuracy and easy operation made this a best choice for batch
processing;
5. Photos: