AS9093Q New PDF

Document Number: Revision:
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Title:
ASSEMBLY SPECIFICATION FOR ENCAPSULATION OF BGA,
LGA AND FLIP CHIP ARRAY PACKAGES
TABLE OF CONTENTS
1.0 PURPOSE
2.0 SCOPE
3.0 REFERENCE DOCUMENTS
4.0 EQUIPMENT
5.0 SUPPLIES AND MATERIALS
6.0 FORMS AND RECORDS
7.0 PROCEDURE
8.0 MOLD DEFECT DEFINITION AND CRITERIA
9.0 SAFETY AND ENVIRONMENTAL REQUIREMENTS
10.0 RESPONSIBILITY
11.0 TOTAL CONTROL METHODOLOGY
12.0 APPENDIX AND TABLES
PRINTED VERSION IS UNCONTROLLED UNLESS STAMPED "CONTROLLED COPY" IN RED BY UNISEM DOCUMENT CONTROL
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1.0. PURPOSE
This document defines the basic guidelines, operating procedure and control for the encapsulation of Ball Grid
Array (BGA), Land Grid Array (LGA) devices, and Flip Chip Array Packages.
2.0. SCOPE
This document covers the entire BGA, LGA and Flip Chip Array Packages molding process procedure, control
procedure, quality requirements and the following auxiliary procedures: On-loading of magazine, Offloading of
magazine, Molding compound loading, Mold die cleaning and conditioning, Clearing of machine alarms, Process
control monitor / Total control methodology, End-of-shift or no material shutdown, General handling requirements
and Inspection procedures for critical characteristics.
3.0. REFERENCE DOCUMENTS
3.1. Towa Mold Y-series operation manual and maintenance manual.
3.2. Fico Mold AMS-36-M2 operation manual and maintenance manual.
3.3. ASAHI Cosmo BGA Auto molding system instruction / operating manual.
3.4. Operating instruction for all mold support equipment.
3.5. Mold Defects Definition & Criteria
3.6. Assembly Control Plan (SOP1158)
3.7. Generic SPC Chart implementation (SC1001)
3.8. Anti mixing Procedure in Handling Production Lots at Assembly and Test (SOP 5065)
3.9. Standard Procedures for Handling Unbonded and Bonded Strips (SOP 5082)
3.10. Hazardous and Non-hazardous Waste Management (SOP 9229)
3.11. Array Package General Manufacturing Procedures and Requirements (SOP5267)
3.12. QA Molding Monitor (QS 1608)
3.13. Quality Non Conformance Disposition Procedure (SOP 3058)
4.0. EQUIPMENT/TOOLS/LOGISTICS
4.1. Fico Mold AMS-36-M2 and applicable Mold chase.
4.2. Fico Mold AMS-36-M2 Strip and Pellet loader for semi-auto operation.
4.3. Towa Mold Y-series and applicable Mold chase
4.4. Towa Mold Y-series pellet loader for semi-auto operation.
4.5. ASAHI Auto Mold Cosmo BGA2-40 and applicable Mold chase.
4.6. Paper Strip for compression melamine cleaning and conditioning.
4.7. Sofray X-ray for wire defects monitoring.
4.8. MFS-4080 E X-ray for wire defects and internal voids monitoring.
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4.9. Low power microscope (10 – 40X).
4.10. Luxo lamp or equivalent 3X magnification inspection device.
4.11. Inspection jigs
4.12. Diamond scriber or equivalent hard and pointed tools
4.13. Knitted hand gloves
4.14. Finger cots
4.15. Ground straps or equivalent grounding devices
4.16. Limited Access/Plastic Tweezers.
4.17. Brass brush
4.18. Brass picks
4.19. Brass plate
4.20. Brass wedge
4.21. Brass hammer
4.22. Mold stain eraser
4.23. Dentist Mirror
4.24. Magazines with end covers
4.25. Substrate Map Reject coding plate
5.0. SUPPLIES/MATERIALS
5.1. Wire bonded units for molding / production lots
5.2. Qualified dummy for buy-off.
5.3. Qualified molding compounds – Table 1
5.4. Qualified mold cleaning materials – Table 2
5.5. Qualified mold conditioning materials – Table 3
5.6. Qualified paper frame – Table 4
5.7. Mold cleaning and conditioning requirements – Table 6.
5.8. Mold cleaning and conditioner sheets placement– Table 7.
5.9. Conditioning sheet for prevention of sticking on first shot after mold idling and mold cleaning.
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6.0. FORMS AND RECORDS
6.1. TCM folder and all its elements
6.2. Production Time Ticket – Appendix 2
6.3. Mold Compound Loading History
6.4. Mold Compound Removal Monitor (Refer to AS1067)
6.5. Fico molding parameters – Table 8, Table 9.
6.6. Towa molding parameters –Table 10, Table 11, Table 12, Table 13, Table 14, Table 15, Table 16.
6.7. Asahi molding parameters – Table 17, Table 18, Table 19, Table 20
6.8. Reject Mapping Form (Refer to SOP 5267 - Form B)
7.0. PROCEDURES
Some of the steps require huge visual aids and demonstrations to comprehensively include in this specification.
These steps or procedures are clearly explained in the manual of the machine.
In such cases, while this specification outlines the procedure briefly, it is required that the operators to be
certified for BGA, LGA and Flip Chip Array molding process be trained using the machine manual and actual
demonstration. Certification be granted base on actual line performance on dummy materials. The steps under
this condition are indicated with triple slash characters at the beginning.
7.1. PRE-PRODUCTION OPERATION PROCEDURE – ALL MACHINES
7.1.1. WORKPLACE PREPARATION PROCEDURE – ALL MACHINES
7.1.1.1. Ensure that the following are met:
7.1.1.1.1. Air ionizer is working by checking the air coming out of the air outlet.
7.1.1.1.2. The ESD groundings on the table are in tact.
7.1.1.1.3. The Table is clean and free of any unnecessary things.
7.1.1.2. The inspection jig and qualified tweezer are available.
7.1.1.3. Mold logistics such as: brass brush, brass picks, mirror, stain eraser are available.
7.1.1.4. Dummy strips are available.
7.1.1.5. The TCM and all its elements are available.
7.1.2. MATERIAL PREPARATION PROCEDURE – ALL MACHINES
7.1.2.1. Verify on the PT that the lot has undergone plasma process, and the time elapsed is
less than 24 hours, otherwise return the lot for re-plasma process. For re-plasma
information, refer to the note at the bottom of the PT: “Plasma prior mold and time of
completion”.
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7.1.2.2. Check all Appendix and special instructions, and follow the prescribed instructions
related to molding process.
7.1.2.3. Make sure that the magazine numbers written on the PT matched with the numbers of
the actual magazines.
7.1.2.4. Count the quantity of strips. It should match with the strip quantity written on the PT.
7.1.2.5. Ensure there is QA stamp on the Molding Material Removal from cold storage Monitor
sticker.
7.1.2.6. Production must perform checking on the compound type and exposure time as
below:
7.1.2.3.1 Production operator should check on the last loaded compound’s

thawing expiration date/time, compound type and size that is
recorded in the “Mold Compound Loading History” (refer to Appendix
# 8A) before loading the next compound box.
7.1.2.3.2 Prior loading new mold compound batch, mold operator must ensure
the following items:
7.1.2.3.2.1 No compound pellet remains in Auto Pellet Loader

Section (pellet box and vibratory bowl)
7.1.2.3.2.2 Compound pellet type and expiration date/time are

same with the previous one
7.1.2.3.2.3 If any differences in above items, all pellets in the pellet

box and vibratory bowl must be taken out from
machine.
7.1.2.3.3 Production operator shall immediately fill up the mold compound

loading history, after she did replacement of mold compound.
7.1.2.7. If in doubt, ask the production supervisor or process engineer for clarification.
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7.1.3. EQUIPMENT AND LOGISTICS PREPARATION PROCEDURE – ALL MACHINES
7.1.3.1. Verify that the mold machine and mold chase to be used correspond to the
requirements on the PT as to the following:
7.1.3.1.1. Mold Cap Thickness (this information is written on the module name card,
chase metal plate ID and imprinted on the cavity bar).
 The module name card and Chase ID markings are used only for easy
location of the mold system and module corresponding to the PT
requirement.
 The operator should make sure that the PT requirement and the
marking on the cavity bar are matched. Use a mirror to easily see the
cavity markings.
 The operators should also check the mold cap height of package on
the lot traveler and compare with mark on machine ID (Machine
Tag) as illustrated on para 7.1.3.1.
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7.1.3.1.2. Substrate thickness (this information is written on the module name card,
chase metal plate ID, and on Die Attach Process Instruction on lot
traveller).
For Fico, Towa and Asahi
Note:
 For Fico, when change substrate thickness, need mold BGA
compensation process.
 For Asahi, when change substrate thickness, need calibration using
same substrate P/N.
 For Towa, when change substrate thickness, need mold tooling set
up by technician.
 Special Case for 119 PBGA 14x22x2.15, reference mold cap height
is note on Mold process “USE CHASE WITH 0.9MM MCH”
7.1.3.2. Make sure that the cavity surface is free of stain; otherwise conduct mold cleaning and
conditioning sheet/pellet. Stain on the surface of the cavity appears as map of colors
other than the shiny metal finish of the cavity. For mold cleaning, refer to auxiliary
procedure – Mold Cleaning Procedure.
7.1.3.3. Make sure the mold chase to be used was not idle for more than sixteen 16 hours,
otherwise perform mold conditioning using conditioning rubber sheets on the cavity
surface and make three dummy shots.
Note: The number of dummy shots maybe increased until the traces of wax disappears.
7.1.3.4. Make sure no foreign materials on the chase or on the mold areas.
7.1.3.5. Conduct all set-up requirements prescribed in the TCM.
7.1.3.6. Set the mold parameters refer to the appropriate mold parameters board and
production material.
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7.1.3.7. Mistake proofing for FULL AUTO mold running with multiple module set-up
7.1.3.7.1. At start and idle time; ALL modules must be DISABLED. (No Possibility of
Molding, Manual and AUTORUN)
7.1.3.7.2. Mold personnel (MFG, EE, PE, and QC) must refer to current module lay
out and status.
Note: Module lay out must be updated by EE whenever necessary (ex:

during set up and conversion).
7.1.3.7.3. Before buy-off run, operator to ask for set-up verification with EE.
7.1.3.7.4. Line EE/Tech./Operator to validate the information on PT vs. the available

Module set-up to run. (Example: Mold Cap, Substrate Thickness, Mold
Compound, etc.)
7.1.3.7.5. Line EE/Tech. To EN-able the module compatible with the Prod. Lot (The
same Mold Cap, Substrate Thickness) to run.
7.1.3.7.6. EE / Production to run one dummy shot to verify the set up (Check actual
Mold Cap Height and Mold buy off criteria). Refer to Para 7.1.4. Buy off
Procedure – All machines.
7.1.3.7.7. Production to proceed until all strips of the lot is completed.
7.1.3.7.8. Once production of the same lot type is completed and no more material to
be processed, operator to call EE/Tech.
7.1.3.7.9. EE/Tech. To disable ALL Module and set the machine to idle mode.
7.1.3.7.10. To start again on different lot type, please repeat item 7.1.3.6.
7.1.3.8. Log all necessary information required on the Production & Equipment Recording
Checksheet (see Appendix 4)
7.1.3.8.1. Visual and X-ray monitoring during Product Monitoring and Set-up /
Conversion will be done by assigned owners according to Control Plan
requirements (refer to SOP1158).
7.1.3.8.2. The following are the definitions for QC X-ray monitoring during set-up
and/or conversion:
Set-up : Change of molding compound or parameters or ball count.
Conversion : Change of mold cap height / change of mold tool
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7.1.4. BUY-OFF PROCEDURE – ALL MACHINES
7.1.4.1. Production to make one dummy shot per chase and perform visual inspection. All units
of the shots should meet external visual defects criteria in table 1. This inspection is
applicable to the following conditions:
7.1.4.1.1. After mold cleaning due to idle time, regular mold cleaning, regular mold
conditioner or other activities which require machine buy off.
7.1.4.1.2. After machine repair due to machine error, or defect found during in-line
monitoring or QC monitoring.
7.1.4.2. Production to make one shot of good or production strips per chase and perform visual
inspection. All units of the shots must meet the external visual defects criteria in table 1.
7.1.4.3. If no external defects are found, the same strips shall be submitted to QC for internal
buy off. Otherwise, the machine shall be down for repair.
7.1.4.4. Status of machine when buy off is being done as below :
7.1.4.4.1. Stop for QC buy off due to mold cleaning after power up the system or
machine idle for more than 16 hours. Resume production after passed QC
buy off.
7.1.4.4.2. Stop for QC buy off after trouble shooting and PM. Resume production after
passed QC buy off.
7.1.4.4.3. Running for QC buy off on regular QC monitoring or after regular cleaning /
conditioner. Stop immediately if this buy off is failed and QC will issue LDA.
7.1.4.4.4. Machine down time will be charge for QC buy off for item 7.1.4.4.1 and
7.1.4.4.2.
7.1.4.5. LINE DISTURBANCE ALERT (LDA) Issuance and Dis-abling of Mold Tool
7.1.4.5.1. QC must issue LDA if discrepancy or defect that is out of mold defect
criteria is encountered during regular monitoring.
7.1.4.5.2. PE/EE/Production shall define the root cause and take necessary corrective
action to address the defect and do confirmation shot to check the
effectiveness.
7.1.4.5.3. Corrective action taken must be recorded in Production Downtime and

Machine Repair Record Form. Any change in mold parameter must be
recorded on parameter column and shall be validated by QC stamp.
7.1.4.5.4. PE/EE/Production shall fill up the LDA and submit it together with mold shot
for QC check. Machine shall resume for production if buy off is Pass.
7.1.4.5.5. Identified mold/chase that takes time (more than 1 shift) for trouble shooting,
repairing or part replacement can be disabled for containment action. On
the other hand, other mold tool/chase of the same system can continue to
run to process production lots using normal monitoring procedure.
 Disabling of mold/chase is allowed after the defect has been verified and
confirmed by PE and EE technicians to be an isolated case.
 Disabling of mold tool/chase shall be done by EE technician.

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 If disabling of problematic mold/chase is part of containment action,
LDA shall be submitted to QC for SPC data entry. Then LDA shall be
posted to system to alert the people that the identified mold/chase was
being disabled.
7.1.4.6. Any mold die set idling for more than 3 months, perform buy-off before running
production/qual lots as below:
7.1.4.6.1. Perform full cleaning (Cleaning and Conditioning)
7.1.4.6.2. Run several dummy shots
7.1.4.6.3. Perform buy off as below:
 Visual inspection
 X Ray inspection
 T-scan on molded part after PMC
7.1.4.6.4. For machine monitoring and idle time, refer to PM (Preventive Maintenance)
ID/Record (MS1089).
7.1.4.7. TOWA auto-mold single shot or limited shot procedure. This procedure is done to
automatically stop the machine after making necessary shots for buy-off purposes.
7.1.4.7.1. Enter the number of strips required on the screen menu under "In L/F Set".
Once done, press <LINE AUTO> & <START> buttons consecutively to start
the cycle. The machine will stop after completion of the specified number of
strips.
7.1.4.8. FICO auto-mold single shot or limited shot procedure
7.1.4.8.1. The operator should watch at the on-load station. When the required strips
is being loaded on the hot plate, set the machine to stand-by mode by
pressing <INSTR> key, Select <2> and then press <ENTER> to bring the
machine to stand-by mode or select <3> and then press <ENTER> if only
one magazine loaded
7.1.4.8.2. Follow instruction at the User Interface (UI) screen until the shots are
completed and off-loaded.
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7.1.4.8.3. Before the machine comes to stand-by mode, the monitor screen or user
interface (UI) will ask whether to empty the pellet buffer or not. Reply “yes”
or press <1> if the stand-by mode will take more than five (5) minutes by
operator estimate.
7.1.4.9. ASAHI auto-mold single shot or limited shot procedure
7.1.4.9.1. Select operation type 1.
7.1.4.9.2. Option 1 : Press “Start Running” button, then on the new display, thick or
activate one shot box follow by pressing “All Press Start Running” button to
process up to degate only. The machine will stop and alarm will be triggered
as soon as the molded frames are already in the lower degater plate. This
will be the visual inspection sample.
7.1.4.9.3. Option 2 : Press “Start Running” button then on the new display do not thick
One shot box, then press “All Press Start Running” button. Then after the 2
substrate pushed on the hot plate, press “F.O.L” button on Magazine
Exchange box. After strips entered to the off load magazine, press “E.O.L”
button on Magazine Exchange box then follow “Lot End” button.
7.2. PRODUCTION PROCEDURE FOR FULL AUTOMATIC MOLDING
7.2.1. TOWA Mold System
7.2.1.1. Proceed with normal production only after all the requirements under item 7.1 are met.
7.2.1.2. Add appropriate dummy strip to the lot to make the total number of strips divisible by
two on the last lot to be processed. Before molding, the dummy strip must be identified
by red marker on gold gate. Make sure the mold caps will not cover the mark.
7.2.1.3. Load maximum of four (4) magazines at the on-load station. See auxiliary procedure –
On-loading Procedure of Magazines.
7.2.1.4. Load maximum of four (4) empty magazines at the off-load station. See auxiliary
procedure – On-loading Procedure of Magazines.
7.2.1.5. Check the machine auto system and choose the correct module that will be used for
production, then (press <SHIFT+F1…F4> to choose module station)
7.2.1.6. Run the machine in Automatic Mode by the following actions according to the machine
being used.
7.2.1.6.1. Set number of strip on In L/F Set as same as number of quantity of strip in
process traveler (PT)
7.2.1.6.2. Press the following buttons in sequence: <LINE AUTO>” and “<START>”.
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7.2.1.7. When it is necessary to stop the machine after the current shot, press <STOP> button.
7.2.1.8. To resume production shots, press <LINE AUTO> and <START> buttons
consecutively.
7.2.1.9. While the machine is in production mode, perform monitoring according to the
requirements described in Total Control Methodology (TCM).
7.2.1.10. When the last slot of the output magazine is filled, the machine will automatically eject
the magazine.
7.2.1.11. After completion of the lot, completely fill up the PT. At the input magazine, remove the
completed magazine from the machine and put the end covers.
7.2.1.12. Make sure that all required information is completed prior to moving the lot to the next
process step.
7.2.1.13. Prepare the next lot when the last magazine of the lot is at the input elevator.
7.2.1.14. Procedure operation for machine to be set for automatically segregate successive
production lots.
7.2.1.14.1. When the “In L/F – Monitor” in the panel shows the same number as the “In
L/F – Set”, the “Stop” button in the panel will blink to indicate end-of-the-lot
at the input section.
7.2.1.14.2. Open the on loading window and take out the empty FOL magazine. Then
st
load next lot and close the window and wait until 1 magazine load on the
magazine elevator.
7.2.1.14.3. Reset the “In L/F-Set” by pressing button <ENTER>, <0>, <ENTER>
consecutively. After “In L/F” Monitor change, press <ENTER>, <Type
number of strip per PT>, <ENTER> consecutively.
7.2.1.14.4. The strips indicator in the monitor display will change color to indicate
processing of the new lot. The monitor will indicate “Lot End” when the
preceding lot is completed and the last strip is unloaded into the output
magazine.
7.2.1.14.5. Unload molded strip magazine form off load magazine and remove dumm
substrate if any.
7.2.2. FICO Mold System
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7.2.2.2. Add appropriate dummy strip to the lot to make the total number of strips divisible by
two on the last lot to be processed. Before molding, the dummy strip must be identified
by red marker around the mold cap outline. Make sure the mold caps will not cover the
mark.
7.2.2.3. Load maximum of four (4) magazines at the on-load station. See auxiliary procedure –
On-loading Procedure of Magazines.
7.2.2.4. Load maximum of four (4) empty magazines at the off-load station. See auxiliary
procedure – On-loading Procedure of Magazines.
7.2.2.5. Check the machine auto system and choose the correct module that will be used for
production.
7.2.2.6. Run the machine in Automatic Mode by the following actions according to the machine
being used. The machine indicator with green background is the active machine. Call
Technician to change the mold machine to be activated if necessary. Make sure the
machine is in production mode. The mode is display on top on screen with “Normal
Production”. Press <Start> button to start the process.
NOTES:
Machine will require BGA Compensation to adjust the substrate thickness. Press <0>
button and enter if the strip thickness is as same as the previous shot. If the strip is
different thickness with previous shot, make sure use dummy substrate with the same
part number was used for lot.
7.2.2.7. When it is necessary to stop the machine after the current shot, press <HALT> button
and to resume production press <RUN> button.
7.2.2.8. While the machine is in production mode, perform monitoring according to the
requirements described in Total Control Methodology (TCM).
7.2.2.9. When the last slot of the output magazine is filled, the machine will automatically eject
the magazine.
7.2.2.10. After completion of the lot, completely fill up the PT. At the input magazine, remove the
completed magazine from the machine and put the end covers.
7.2.2.11. Make sure that all required information are completed prior to moving the lot to the next
process step.
7.2.2.12. Prepare the next lot when the last magazine of the lot is at the input elevator.
7.2.2.13. Procedure operation for machine to be set for automatically segregate successive
production lots.
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7.2.2.13.1. Option 1 is by load the magazines for the existing lots. After push the last
strip of magazine, machine assume it is the last strip of lot and will entered
as last strip on the off load magazine. After entered of the last strip on the
magazine, the off-loader will eject the magazine containing the last strip for
the current lot. The next magazine in the on-loader section is assumed to
belong to the next lot. The process is repeated for the succeeding lots.
7.2.2.13.2. Option 2 is by clearing magazines in the on-load section. After completion of

the last magazine for the current lot and no magazine loaded on the input
section, the machine goes to stand-by automatically and assumes that the
last shot of the current lot is loaded. When this last shot is completed, the
output magazine containing the last shot will be ejected automatically. The
new magazines loaded on the input section are considered the new lot.
Follow monitor screen inquiries to start processing of the new lot.
7.2.3. ASAHI Mold System
7.2.3.1. Pre Production Procedure
7.2.3.1.1. Select the <Process Program> from the Cosmo Icon Type Menu window
and then choose “P.P Selection from Process Program Menu window.
7.2.3.1.2. Move the cursor to the desired package type and substrate thickness to be
processed. Select “Assign P.P” and “Save Assignment” to convert the
parameter assignment.
7.2.3.1.3. All molding parameters of each package are pre-programmed and it is not
to be modified without the permission of Process Engineer.
7.2.3.1.4. Before start of each lot, shift Technician MUST PERFORM CLAMP
CALIBRATION using the production substrate, to ensure the cavity adjuster
value is catered for the correct substrate thickness.
7.2.3.2. Auto Molding Procedure
7.2.3.2.1. Prepare the lot to be molded I the trolley. Check the magazine traceability
and make sure it coincides with the data on the Process Traveler (P.T.)
7.2.3.2.2. Open the door of the input buffer on the left side of the machine.
7.2.3.2.3. Pick a magazine and carefully remove both end stoppers. Load a maximum
of 3 magazines on the lower input stage with the arrow pointing inside.
Ensure the magazines sets properly at the inner wall of the stage and the
gold gate is on the right side of operator.
7.2.3.2.4. Load a maximum of 3 empty EOL magazines in the EOL buffer section.
7.2.3.2.5. Select <PROCESSING> from the Cosmo Icon Type Menu Window. The
operation-Type 1 Menu window appears in the screen.
7.2.3.2.6. By pushing <Start Running> button, the “Press Selection Dialogue” will be
displayed then select <All Press Start Running> to begin one shot molding
after pass inspection or QC buy off.
7.2.3.2.7. Press “Inspection” button for monitoring while the machine is continue
running.
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7.2.3.2.8. Inspect the sample for visual defects under low power microscope per
rejects criteria in Table 1. Stop the machine and inform technician.
7.3. PRODUCTION PROCEDURE FOR SEMI-AUTOMATIC MOLDING – PER MACHINE MODEL
7.3.1. TOWA MOLD – SEMI-AUTOMATIC MOLDING PROCEDURE
7.3.1.1. Select or activate mold module number to be used.
7.3.1.2. Ensure that the Servo – Motor for the module to be used is turned on by setting the
corresponding I/O state.
7.3.1.4. Set the selector switch to “ORIG”, press <CYCLE/MANUAL> and <UP> buttons. Wait
until the machine reached the original or home position or until the light in the selector
switch stops blinking.
7.3.1.5. Press the <SELECTOR SWITCH> until either of the following options light: “CL”, “TR”
and “Cyc”.
7.3.1.6. Press <CYCLE/MANUAL> and <START/STOP> buttons to activate automatic brush

and vacuum cleaning of chase.
7.3.1.7. Load the strips on the chase using the inspection jig and ensure proper orientation and
alignment. The gold gates of the strip are on the gates of the mold cavities and all the
location pins are inside their respective locations holes on the strip. In loading, extra
care must be taken not to touch the wires.
7.3.1.8. Load the molding compound using the pellet jig.
7.3.1.9. Set selector switch to "Cyc" and simultaneously press <CYCLE/MANUAL> and <UP>
buttons. When full clamping is reached as indicated by the full clamp close position (no
gap between top and bottom molds) and a slight upward motion of the top chase,
release the buttons and wait until the curing process is finished, the mold fully opened
and the doors ready for opening.
7.3.1.10. Remove the molded strips and de-gate manually. The de-gating must simulate
machine butterfly action. Extra care must be taken not to bent the strips. It should be
divided into two independent strips by removing the cull. Refer to item 7.3.3 for the
detailed manual degating procedure.
7.3.1.11. Close the doors and repeat 7.3.1.5 to 7.3.1.10 for succeeding shot until the lot is
completed.
7.3.1.12. After completion of the lot, completely fill up the PT. Make sure that all required
information are completed prior to moving the lot to the next process step.
7.3.2. FICO MOLD – SEMI-AUTOMATIC MOLDING PROCEDURE
NOTE: Fico AMS-36M2 is only designed to run in automatic mode. Manual loading/unloading
on Fico is not recommended. If auto pick & place unit has a problem and cannot be
fixed within one day, manual molding on Fico automatic molding system (AMS) should
be decided by PE, EE and MFG.
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7.3.2.1. Ensure that the modules to be used are selected. NOTE: Manual operation mode is
performed using the option for Transfer Cleaning operation. This is done by pressing
<INSTR> button, selection of “Transfer Clean” option and responding accordingly to the
machine inquiry on the user interface (UI) screen.
7.3.2.3. Load the strip manually on the chase using the manual turntable and substrate-loading
jig
7.3.2.3.1. Load the strips on the manual turntable by carefully pulling the strips from
the edge using duckbill tweezers or equivalent.
7.3.2.3.2. Using the substrate loading jig, transfer the substrates from the manual
turntable to the chase.
7.3.2.3.3. Make sure the strips are completely flat on the bottom mold chase before
loading the pellets.
7.3.2.3.4. In the event of mishandling of strips, affected strips shall be endorsed back
to 3/Opt for re-inspection.
7.3.2.4. Once the strips loaded on chase are already flat, load the molding compound using the
pellet loading jig.
7.3.2.5. Close the door and press <RUN> button.
7.3.2.6. Wait until the cycle is completed.
7.3.2.7. Press <HALT> when the machine request for halt action.
7.3.2.8. Open the door and remove the molded strips for manual de-gating (refer to item 7.3.3).
7.3.2.9. Remove debris on the top and bottom chase manually using the vacuum and brush.
NOTE: when cleaning manually using the brush and vacuum, follow the following
procedure. This procedure is necessary before making a mold shot to ensure that the
location pins on the chase will not get damage and the debris is totally removed.
7.3.2.9.1. Clean the top chase first. This is done by scrubbing the entire area of the
chase at 2-3 times using the brush with vacuum port.
7.3.2.9.2. Totally pull out the brush out of the mold.
7.3.2.9.3. Twist the brush so that it is now facing the bottom mold.
7.3.2.9.4. Then clean the bottom chase. This is done by scrubbing the entire area of
the chase at 2-3 times using the brush with vacuum port.
7.3.2.10. Follow instruction on the User Interface screen for the succeeding shots until the lot is
completed.
7.3.2.11. After completion of the lot, completely fill up the PT. Make sure that all required
information are completed prior to moving the lot to the next process step.
7.3.3. MANUAL DEGATING PROCEDURE FOR FICO, TOWA AND ASAHI
Note : Manual degating will be performed on the following conditions:
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a. If manual molding process was performed
b. If machine was re-initialized and molded strip is still on the chase / machine
c. If strip was removed because of machine assist and/or error
7.3.3.1. After mold, put the molded material on top of the jig surface with one strip hanging. The
worktable for manual degating must have an ionizer.
7.3.3.2. Push the hanging strip down using the right hand while the pushing down the other side
of strip and culls against the jig using the left hand. This way must be done subsequent
on every panel (not incidentally).
7.3.3.3. After removing the right molded strip, remove the culls using the right hand while the left
hand pushes the strip against the jig. This way also must be done subsequent on every
panel.
7.3.3.4. Clean the surface of the manual degating jig using damp cloth after every degating
process.
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7.3.3.5. There are cases that gate remains occur after manual degating, especially if it is
molded using the green compound. In such occasional case, operator must rework and
clean the gate remains by pulling the remaining material carefully with the use of
tweezers.
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7.3.4. MANUAL MOLDING PROCESS FLOWCHART
Manual Molding Process Flowchart
Select the appropriate mode

for manual molding
Load the strips carefully Load pellets on the pellet

on the manual turntable loading jig
Transfer the unmolded strips

to the chase using substrate
loading jig
Load the pellets in the mold

chase using pellet loading jig
After in-mold curing, get the

molded strip and place on
worktable for manual degating
Degate the strips manually

using the manual degating jig
Carefully put the degated strips

in the magazine
Is there
YES any material for
mold?
NO
Put the machine on
standby mode
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7.4. AUXILLARY PROCEDURES
7.4.1. ONLOADING PROCEDURE OF MAGAZINES.
General loading requires that the magazine is transferred / handled using both hands as shown
below.
Do not load magazine into mold Load magazine into machine

machine using one hand only using both hands without
tilting. Observed proper
orientation required by each
machine model.
7.4.1.1. TOWA AUTOMOLD - ONLOADING PROCEDURE.
7.4.1.1.1. Remove the end covers one at a time one at a time, with one hand hold the
magazine on the table, the other one pulling up the cover.
7.4.1.1.2. Using two hands to transfer the magazine with production units from the
working table to the machine on load section. Make sure no strip out from
magazine during transfer and the gold gate facing the magazine elevator
(left hand operator when load).
7.4.1.1.3. Carefully put the magazines on the on-load plate.
7.4.1.1.4. Put maximum of four (4) magazines
7.4.1.1.5. In the offload section, place maximum of four (4) empty magazines. The
golden gate of strips must be on the left side of operator.
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7.4.1.2. FICO AUTOMOLD - ONLOADING PROCEDURE
(face to the machine when load)
7.4.1.2.6. Magazine orientation should follow illustration specific for Fico Auto-Mold.
7.4.1.3. ASAHI AUTOMOLD - ONLOADING PROCEDURE
(right hand operator when load)
7.4.2. OFFLOADING PROCEDURE OF MAGAZINES – ALL MACHINES
7.4.2.1. Using two hands to transfer the magazine from the machine off-load section into the
working table (output table).
7.4.2.2. Put the magazine cover on both ends.
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7.4.2.3. In the on-load section, remove the empty magazines.
7.4.3. MOLD COMPOUND LOADING PROCEDURE / HANDLING AND STORAGE REQUIREMENTS.
7.4.3.1. TOWA AUTOMOLD – MOLD COMPOUND LOADING PROCEDURE
7.4.3.1.1. Make sure no expired or different pellets or compound in any part of the
mold compound feeding system (from Pellet Box, Feeder Bowl, Tracks and
Singulator Block). This can be done by manual removal of pellets and by
machine function. On the machine system menu select "Primary Status".
Turn "On" Discharge option & press start button to automatically discharge
all the pellets in the pellet bowl feeder to a separate container inside the
machine.
7.4.3.1.2. Remove pellet buffer box from the machine and bring to the compound
thawing area. Production supervisor is responsible to assign one operator
who loads the pellet into the pellet buffer box.
7.4.3.1.3. Return the pellet buffer box and pull the pellet stopper to release the pellets
into the pellet buffer.
7.4.3.1.4. Press <LINE AUTO> & <START> button consecutively to load the pellet on
the feeder bowl.
7.4.3.1.5. Fill up the Mold Compound Loading History form (see Appendix 8A).
7.4.3.1.6. Make sure only one mold compound type and size is placed beside the
machine at all times.
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7.4.3.1.7. Do not mix molding compound off different thawing date/time or of different
vendor lot number in the feeder bowl.
7.4.3.1.8. Deplete first all old compound on the feeder bowl or discharge if in expired
thawing date/time before putting new compound of different thawing
date/time or of different vendor lot number.
7.4.3.2. FICO AUTOMOLD – MOLD COMPOUND LOADING PROCEDURE
mold compound feeding system (from Pellet Buffer, Feeder Bowl, Tracks
and Singulator Block). This can be done by manual removal of pellets and
by machine function.
7.4.3.2.2. Load pellet directly into the external pellet hopper. Pellet feeding is
automatic when the machine is run in auto-mode.
7.4.3.2.6. Deplete first all old compound on the feeder bowl or discharge if in expired
thawing date/time before putting new compound of different thawing
date/time or of different vendor lot number.
7.4.3.3. ASAHI AUTOMOLD – MOLD COMPOUND LOADING PROCEDURE
mold compound feeding system (from Pellet Box, Feeder Bowl, Tracks and
Singulator Block). This can be done by manual removal of pellets and by
machine function. On the machine system menu select "Operation 1", on
the screen menu, press “Pellet Discharge”.
7.4.3.3.2. Remove pellet buffer box from the machine and bring to the compound
thawing area. Production supervisor is responsible to assign one operator
who loads the pellet into the pellet buffer box.
7.4.3.3.3. Return the pellet buffer box and pull the pellet stopper to release the pellets
into the pellet buffer.
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7.4.3.3.7. Deplete first all old on the feeder bowl or discharge if in expired thawing
date/time before putting new compound of different thawing date/time or of
different vendor lot number.
7.4.3.4. MOLD COMPOUND HANDLING AND STORAGE REQUIREMENTS – ALL MACHINES

o
7.4.3.4.1. Mold compound is cold stored at maximum 5 C.
7.4.3.4.2. Mold compound removal control from cold storage is refer to table below :
Compound Type Thawing time Max. usage time

(Floor Life)
EME G760V 16 hrs. 48 hrs.

EME 7720TA 16 hrs. 48 hrs.
EME G770 16 hrs. 48 hrs.
EME G770LG
EME G770SF
Nitto HC100 24 hrs. 24 hrs.
NITTO GE100LFCSV
KMC3580L 16 hrs 48 hrs
KMC3580LVA 16 hrs 48 hrs
Note : Floor life is excluding thawing time
7.4.3.4.3. Every container of mold compound should bear the “Molding Material
Removal Monitor” sticker.
7.4.3.4.4. Re-storage the Shinetsu compound (KMC3580L and KMC3580LVA)

back to cold storage is not allowed after taken out the compound from
cold storage room.
7.4.3.4.5. Partial withdrawal of molding compound is allowed with the following

conditions.
 Opening and removal of pellets should be done inside the cold storage.
 The inside plastic box containing the compound must be twisted to

minimize the air inside the plastic and secured by a tape.
 The container must be closed again and taped (use packing tape)
properly to ensure it is always closed.
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 The withdrawn pellets must be placed in sealed plastic with desiccant

inside and attach “Molding Material Removal Monitor” sticker. The
vendor lot number, Type or Grade of material and IQA number must be
written on the “Molding Material Monitor” sticker. This is applicable for
any compound removal from cold storage to control compound moisture
and tracking the batch number.
 Stores should put “Engineering Samples” sticker on the plastic bag upon
withdrawal of the engineering mold compound samples.
7.4.3.4.6. Disposal of expired compound should comply with item 9 (Safety and
Environmental Requirements) and other relevant UNISEM specification.
7.4.4. TOWA AND FICO MOLD CLEANING AND CONDITIONING PROCEDURE
7.4.4.1. The requirements for mold cleaning and conditioning depends on the condition of the
mold. For these requirements, refer to Table 6.
7.4.4.2. After completion of the minimum requirements in table 6, and the mold cavity surface
still needs further cleaning shots call the attention of the Supervisor or Process
Engineer.
7.4.4.3. For Transfer Cleaning and Transfer Conditioning, the steps are the same as outlined in
“PRODUCTION PROCEDURE FOR SEMI-AUTOMATIC MOLDING – PER MACHINE
MODEL.”
7.4.4.3.1. For each shot, make sure to remove all debris on the mold surface prior to
the next shot. This can be done by using brass picks, brass brush and
vacuum.
7.4.4.3.2. After completion of cleaning and conditioning, fill up Production and

Equipment Recording Check Sheet.
7.4.4.4. For Compression Cleaning and Compression Conditioning, the following must be
followed:
7.4.4.4.1. Actual Clamp Tonnage for TOWA should be 15 to 30 tons and should be 7
to 10 for FICO.
7.4.4.4.2. Install bottom chase cover plate/paper frame applicable for the chase being
cleaned or use four (4) pieces of clean regular bond papers or equivalent
material in place of the plate.
7.4.4.4.3. Ask EE support to set corresponding I/O state for compression cleaning.
This is provided in the Operation Manual of each mold machine model.
7.4.4.4.4. TOWA compression cleaning procedure.
 Set the current parameter and machine status on READY.
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 Place compression cleaning sheet (for cleaning) or conditioner sheet
(for conditioning) on the blank paper/paper frame according to the
requirements in table 7.
 Set the selector switch to CYC then press <CYCLE/MANUAL> &
<UP> buttons. Press the two buttons simultaneously until the bottom
cavity move up and reached the desired clamp force.
 After finished cure time, set on CYC then press once
<CYCLE/MANUAL> & <DOWN> buttons together.
 Take the results and clean the cavity using unloader cleaning.
 Repeat procedure above on each cleaning cycle.
7.4.4.4.5. FICO compression cleaning procedure.
 Set the current parameter and machine status on “Compression

Cleaning”.
 Set the plunger position must be set to the pellet loading position
(position 14) by selecting the I/O screen <4.1>. Select the transfer
motor of the mold station that needs to be moved. Ex. Station1-
<M812>, Station2-<M822>, Station3-<M832>. This activity requires
technician supervision.
 Insert compression cleaning sheet (for cleaning) or conditioner sheet

(for conditioning) on the cover plate/paper frame and put on bottom
cavity. It according to the requirements in table 7.
 After 2 items above already complete, then press <RUN>.
 Take the results after finished cure time and clean the cavity with
vacuum brush.
 Repeat procedure above on every compression cleaning shot.
7.4.4.4.6. Clamp or close the mold and wait until the curing time is completed. If the
clamp sensor does not activate during clamping, the mold will not open
automatically. Use manual switches to open the mold after four (4) minutes
from clamping the mold.
7.4.4.4.7. For TOWA, if the clamp pressure does not meet 15-ton minimum
requirement or if the sheet is insufficiently compressed or if the cavities and
runners are not fully covered, call for the attention of supervisor, EE support
or, process engineer.
the next shot.
7.4.4.4.9. After completion of cleaning and conditioning, fill up Production Record

Check-sheet.
7.4.4.5. Perform two dummy shots using molding compound to be used or until the last shot
does not show traces of wax. Presence of wax is characterized by wet-look
appearance on the surface.
7.4.4.6. The last shot will serve as dummy buy-off and must meet all the requirements defined
in table 1.
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7.4.4.7. Cleaning and conditioning materials handling and storage requirements – applicable for
melamine pellets, conditioner pellets, cleaning sheets and conditioner sheets.
o
7.4.4.7.1. Cleaning and Conditioning materials must be stored at maximum 5 C.
7.4.4.7.2. Before use, cleaning and conditioning materials must be thawed at

production room or designated thawing area.
Cleaning/conditioning materials Thawing time
Transfer type (Pellet) 16 hrs.
Compression type (Rubber sheet) 4 hrs.
7.4.4.7.3. The cleaning and conditioning materials expire whichever comes first:
 90 days after removal from cold storage.

 After elapse of shelf life indicated on the container.
7.4.4.7.4. Every container of cleaning and conditioning materials should bear the
“Molding Material Removal Monitor” sticker.
7.4.4.7.5. Disposal of expired cleaning and conditioning materials should comply with
item 9 (Safety and Environmental Requirements) and other relevant
UNISEM specification.
7.4.5. ASAHI MOLD CLEANING AND CONDITIONING PROCEDURE
7.4.5.1. The machine is equipped with preset shot counter to alert operator to perform cleaning
shot. Inform technician assigned before resetting the machine. For cleaning frequency
requirements, refer to table 6.
7.4.5.2. After completion of the minimum requirements in table 6 and the mold cavity surface
still needs further cleaning shots call the attention of the Supervisor or Process
Engineer.
7.4.5.3. For Transfer Cleaning and Transfer Conditioning, the steps are the same as outlined in
“PRODUCTION PROCEDURE FOR SEMI-AUTOMATIC MOLDING – PER MACHINE
MODEL.”
the next shot. This can be done by using brass picks, brass brush and
vacuum.
7.4.5.3.2. After completion of cleaning and conditioning, fill up Production and

Equipment Recording Check Sheet.
7.4.5.4. There are 2 types cleaning which are stored in the program of the machine. These are
transfer cleaning type and sheet cleaning (compression) type.
7.4.5.5. Transfer cleaning procedure.
7.4.5.5.1. Do calibration to appropriate the metal frame thickness to be used. Call

technician for calibration.
7.4.5.5.2. At “Operation 1” screen, choose “Cleaning” then select “Melamine” on the

screen in order to start the transfer mold cleaning.
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7.4.5.5.3. Set the curing time refer to table 6 then select “Start” on the screen.
7.4.5.5.4. Place lead frame and melamine cleaning compound per system
instructions.
Note :
 Source of lead frames loading can be either direct place onto mold or
from L/F preheater or input buffer using on loader.
 Melamine cleaning pellets were placed into the plunger pots using
manual pellets loader
7.4.5.5.5. Close the door and press the two “Press Action” buttons located in front of
machine simultaneously to close the mold and commence the cleaning
cycle.
7.4.5.5.6. Wait until the mold open up after the curing time elapsed then remove the
melamine molded strips.
7.4.5.5.7. Clean the mold tool with mexican brush and with air blow to remove
remaining melamine particle.
7.4.5.5.8. Repeat para 7.4.5.5.2 to 7.4.5.5.7 until the mold tool is cleaned.
7.4.5.5.9. Check thoroughly to ensure all cavities and air vents are clean and free on
any stuck flashes or cured cleaning plastic.
7.4.5.5.10. After the mold is cleaned, perform conditioning shot using mold conditioning
compound using same procedure.
7.4.5.5.11. Perform dummy shot using production molding compound to check the
molded packages are free from any mold cosmetic / external defect.
7.4.5.6. Compressive / Sheet cleaning procedure.
7.4.5.6.1. At “Operation 1” screen, choose “Cleaning” then select “sheet” on the

screen in order to start the compressive mold cleaning.
7.4.5.6.2. Set the curing time refer to table 6 then select “Start” on the screen.
7.4.5.6.3. Place the paper clean and cleaning rubber sheet on the cavities and runner
per system instructions.
7.4.5.6.4. Close the door and press the two “Press Action” buttons located in front of
machine simultaneously to close the mold and commence the cleaning
cycle.
7.4.5.6.5. Wait until the mold open up after the curing time elapsed then remove the
rubber melamine molded strips.
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7.4.5.6.6. Clean the mold tool with brass brush and with air blow to remove remaining
rubber melamine.
7.4.5.6.7. Repeat para 7.4.5.6.1 to 7.4.5.6.6 until the mold tool is cleaned.
7.4.5.6.8. Check thoroughly to ensure all cavities and air vents are clean and free on
any stuck flashes or cured rubber melamine.
7.4.5.6.9. After the mold is cleaned, perform conditioning shot using compressive
rubber conditioner using same procedure.
7.4.5.6.10. Perform dummy shot using production molding compound to check the
molded packages are free from any mold cosmetic / external defect.
7.4.5.7. Both of cleaning and conditioning method can be mixed each other. For example clean
using rubber sheet melamine and conditioner using transfer conditioning shot or clean
using transfer melamine shot and conditioner using rubber conditioning shot.
7.4.5.8. All mold cleaning parameters are programmed by Engineer in advance. Do not change
any parameters without permission
7.4.5.9. Operator to do mold cleaning if the machine cycle has reached maximum limit of shot
(refer to table 6) or whenever it is necessary depending on the condition of the mold.
7.4.6. CLEARING OF MACHINE ALARMS / OPERATORS ASSIST – ALL MACHINES
7.4.6.1. Machine alarms causing machine stoppage during operation has individual code and
displayed in the Alarm Code read-out on the main control panel or on the monitor
screen. Production operator will call the attention of technical support / maintenance
support personnel if alarm code displayed is related to sensor, jamming and other
alarms related to the machine. Alarms related to materials such as…. Require Input of
Pellet, Empty Magazine, ..etc, will be cleared by the operator without the assistance of
technical personnel.
7.4.6.2. After clearing the alarm or responded properly to the machine request, press
appropriate button (as required by the machine) to confirm to the machine that error has
been fixed.
7.4.7. PROCESS CONTROL / MONITOR – ALL MACHINES
7.4.7.1. Comply with the required process control / monitor as described the section for Total
Process Control Methodology (TCM). These requirements are translated into the line
and contained in the TCM folder.
7.4.7.2. Comply with any requirement required herein on top of those required in the Total
Control Methodology specification.
7.4.8. END-OF-SHIFT OR NO MATERIAL SHUTDOWN PROCEDURE – ALL MACHINES
7.4.8.1. Make sure no foreign debris on the mold. Use vacuum and other qualified tools to
clean the mold chase section, pre-heater sections and other areas where operator
access is allowed. There must be no objects inside any part or section of the machines
other than its parts that need to be stored in its compartment.
7.4.8.2. Move the clamp until 1/4 to 1/2 inch gap between the top and bottom chases is
observed.
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7.4.8.3. All un-molded strips or units that are not due for molding must be stored in super dry of
Nitrogen purged cabinet.
7.4.8.4. For TOWA, operator should change the machine’s auto system on disable status.
7.4.8.5. Fill-up Log Book Endorsement.
7.4.9. STRIPS HANDLING PROCEDURES – ALL PRODUCTS
7.4.9.1. Never touch the good or production strips with bare hands / fingers. Use qualified
tweezers and jig in handling molded and un-molded strips during inspection,loading
onto the mold and removing or inserting into the magazine slots.
7.4.9.2. Do not put the strip inside the bag.
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7.4.9.3. Always handle magazine with both hands.
7.4.9.4. Always place the magazine at the middle of the table
7.4.9.5. Always use inspection jig during inspection
7.4.10. INSPECTION PROCEDURES FOR DETECTION OF DEFECT OR OUT-OF-CONTROL. (Follow

relevant product and process OCAP, For criteria refer to table 1).
7.4.10.1. VISUAL INSPECTION PROCEDURE
7.4.10.1.1. The following defects are classified as visually detectable defects: (a) Mold
package voids or pits, (b) foreign material, (c) Incomplete fill (d) Dents, (e)
scratch and (f) Damage substrate.
7.4.10.1.2. Visual inspection is performed under 3X magnification or higher as

specified in Table 1.
7.4.10.1.3. Place the strip for inspection on the inspection jig. Use qualified tweezers
in handling the strip. Refer to Strip Handling Procedures.
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7.4.10.1.4. When reject unit is found, immediately mark the reject unit’s location on
corresponding reject mapping form with visible ”DOT”(●) .
7.4.10.2. INTERNAL DEFECTS INSPECTION (X-RAY)
7.4.10.2.1. The following defects are classified as internal defects and are X-Ray
Detectable: (a) Wire sweep, (b) Wires short, (c) Damage wires and (d)
lifted bonds, (e) Internal void.
7.4.10.2.2. X-ray Inspection must be performed by qualified operator using qualified

machine.
7.4.10.2.3. Use inspection jig and tweezers in handling the strip. Refer to Strip
Handling Procedures.
7.4.10.2.4. For procedure on X-Ray Machine operation, refer to operation manual for
the model being used.
7.4.10.2.5. For internal void inspection, use MFS-4080 E or Sofray X-Ray machines.
Use the following parameters for better visual quality.
MFS-4080 E X-Ray parameters setting:
For Internal Voids
Max. Voltage : 50KV max.
Max. Current : 100mA max.
For Wire sway/sweep
Voltage : 50KV
Current : 100mA
Adjust image enhancement until got the sharpest image.
Sofray X-Ray parameters setting:

TV / Display :
Contrast Tuning : Maximum
Bright Tuning : Middle (50 % of maximum turning)
Image (Original Display) :

Contrast Scale : 255 (maximum)
Bright Scale : 20 – 30
X-Ray Current :
Voltage : 50 KV (disregard the value behind coma or point)
Current : 0.05 mA (maximum allowance noted at machine)
7.4.10.2.6. When reject unit is found, immediately mark the reject unit’s location on
corresponding reject mapping form with visible “DOT”( • ).
7.4.10.3. SUBSTRATE CRACK AT MOLD OUTLINE / CLAMPING INSPECTION PROCEDURE

– CRITICAL CHARACTERISTIC (FOR PBGA ONLY)
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7.4.10.3.1. Substrate crack is manifested by the change in solder mask color. The
color changes to whitish. The general guideline for substrate crack criteria
is illustrated in table 1. The photo below is a special / critical response to
excessive mold clamping on the substrate.
7.4.10.3.2. Under 3X magnification, inspect the molded strips for any changes in color
or heavy (unusual) clamping impression. If such manifestation is
observed, verify the existence of substrate crack under 40X minimum
magnification.
7.4.10.3.3. If substrate crack is confirmed, shutdown the machine and inform the
Supervisor and Process Engineer. If no crack is found, continue
processing but inform the Process Engineer.
7.4.10.3.4. If substrate crack is confirmed, follow relevant OCAP in the TCM.
7.4.10.3.5. After the machine is repaired, each repaired module or chase must be
qualified by inspecting 2 shots under 40X minimum magnification.
7.4.10.4. DELAMINATION INSPECTION PROCEDURE – CRITICAL CHARACTERISTIC (FOR

PBGA ONLY)
7.4.10.4.1. Non-sticking of mold compound on the substrate is called mold

Delamination. This defect can be verified by Scanning Acoustic (SAT or C-
SAM).
7.4.10.4.2. Molded strips (dummy or production strips) are subject to SAT or C-SAM
mapping to detect the interface micro-separation or poor sticking. Those
procedure is done offline and optional as determined by the process
engineer in case-to-case basis.
7.4.10.4.3. If Delamination is detected, stop the machine and inform the Supervisor
and Process Engineer.
7.4.10.5. IN PROCESS PRODUCTION INSPECTION MONITORING PROCEDURE.
7.4.10.5.1. Production operator to take one (1) molded strips from top ,middle and
bottom of filled magazine and do visual inspection under luxo lamp to
check for any external visual mold defects.(Refer to Table 1: Mold Defects
Definition and Criteria).
7.4.10.5.2. If monitoring result is FAIL, operator shall call EE / PE tech. to do

verification, define rootcause and take necessary corrective action. Data
result (Lot information, the defect, root cause and corrective action taken)
must be recorded in Production Time ticket / Production Recording
Checksheet.
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Title:
7.4.10.6. DEPRESSED SUBSTRATE PREVENTIVE ACTION
7.4.10.6.1. Operator must perform manual cleaning and checking the cleanliness of
bottom block before processing of each lot.
7.4.10.7. WIRE BOND TO MOLD BUY OFF PROCEDURE
7.4.10.7.1. Form A shall be used for wire bond to mold buy –off.This is applicable to all
linear and staggered pad devices of PBGA and FBGA.
7.4.10.7.2. FOL Production is responsible to provide the form and the person who will
fill the form is stated on the form. The filled form shall then be kept by Mold
PE for future reference.
7.4.10.7.3. Wire bond production can only start once it passed WB QC buy off and
WB-Mold buy off.
7.4.10.7.4. Conditions on device which require WB-Mold buy off are as follows:
 CONDITION A : New device, multi tier bonding and wire length

>120 mils.
 CONDITION B : New device, wire length >180 mils and single

bonding.
 CONDITION C : New device, wire length >120 mils and linear pad
pitch <80 microns.
 CONDITION D : New device, irregular wire lay out and bond pads
row (Special requirement).
7.4.10.8. WHITE INK MARK REJECT CODING PROCEDURE
7.4.10.8.1. Operator to take one molded lot and check for magazine numbering and
number of strips vs. Process traveler (PT) information.
7.4.10.8.2. Pull out the strip one at a time and inspect for any depressed package /
substrate.
 If reject unit is found, immediately mark the reject unit’s location on

corresponding reject mapping form with visible dot and feed back to
mold operator to check the fresh molded strip. If fresh molded strips
have the same defect, call EE sustaining to solve the problem.
7.4.10.8.3. Place the strip on the bottom plate holder, with the mold compound side
facing the operator. Make sure the strip is properly aligned by the locator
pin.
7.4.10.8.4. Place the mapping plate with the same unit matrix location on the molded
strip.
7.4.10.8.5. Mark rejected units with visible white ink on top of package.
7.4.10.8.6. Count the number of marked reject units and ensure that the number and
location of units tally with the number of rejection and location on reject
mapping form.
7.4.10.8.7. Return back the marked strip into the magazine carefully.
AS9093 A
Page 35 of 83
Title:
7.4.10.8.8. Repeat para 7.4.9.8.2 – 7.4.9.8.7 on the next strip.

7.4.10.8.9. Once the lot is completed, check the quantity of PT with the actual
quantity. Any quantity is not tally between PT and actual unit, call
supervisor. If no quantity issue, record Operator ERN on the mold station
of lot traveler and move the lot to FOL trolley.
8.0. MOLD DEFECTS DEFINITION AND CRITERIA
Table 1: MOLD DEFECTS DEFINITION & CRITERIA CRITERIA and

(MEASUREMENT APPLICATION
DEFECT DESCRIPTION / VISUAL AID METHOD)
Gate Chip Reject if the gate chip PBGA, FBGA,

is deeper than ½ of the LGMA, and
mold cap height. FLIP CHIP
ARRAY
Package Edge Chip. PBGA

Package Edge
Reject if more than 20
Chip
mils in length,4 mils in
width and ¼ of
package thickness in
depth.
Package edge chip if FBGA, LGMA,

not more than 40 mils and FLIP CHIP
in any direction is not ARRAY
rejectable, however
the machine shall be
shutdown for repair.
Package Crack- Reject any hairline PBGA, FBGA,

Mold fracture anywhere on LGMA, and
the unit. FLIP CHIP
ARRAY
(Use 3x magnification
or Higher.)
AS9093 A
Page 36 of 83
Title:
Stain / Die Flow Reject any mold stain PBGA, FBGA,

Mark greater than 5% LGMA, and
causing texture and FLIP CHIP
package surface ARRAY
appearance
differences. Flow mark
greater than 50% is a
reject.
(Use naked eyes)
Mixed Molded Any mixing of dummy strips or strips Reject any mixed PBGA, FBGA,
Parts from other lot. molded parts. The LGMA, and
units can be accepted FLIP CHIP
after sorting. As long ARRAY
as there is no mold
compound deviation.
Foreign Material Anything on the package that should not Reject if any foreign PBGA, FBGA,
on Substrate be present by design. Foreign material material on substrate LGMA, and
has thickness. Contamination has no which cannot be FLIP CHIP
thickness. removed. ARRAY
Reject for PBGA/FBGA

contamination more
than 5% of the surface
area.
Reject for LGMA and

contamination >15% of FLIP CHIP
individual land area ARRAY
(Use naked eye)
Package This defect is equivalent to wrong mold Reject if package PBGA, FBGA,
Dimension use. Example: use of 0.70mm mold cap dimesion is not within LGMA, and
while the requirement is 0.50mm. the specified FLIP CHIP
dimension per drawing ARRAY
or requirements in the
PT.
(Verify with Vernier

Caliper or any capable
measuring device.)
AS9093 A
Page 37 of 83
Title:
Mold Voids A hole or more appear on the package 1). Reject if void is FBGA, LGMA,
(External) surface. greater than 10 mils in and FLIP CHIP
any direction on the ARRAY
package surface.
2) Reject if void is PBGA

greater than 20 mils in
any direction on the
package surface.
3) Reject if any void / PBGA, FBGA,

pinhole exposes the LGMA, and
gold wire, bond fingers FLIP CHIP
or the die surface. ARRAY
Use Hisomet or low

power scope with
graduated lens or
reticle.)
Bubble/Blister 1).Reject for PBGA, FBGA,

Buble/Blister greater LGMA, and
than 10 mils in any FLIP CHIP
direction on the ARRAY
package surface.
2).Reject for
Bubble/Blister in the
molded or
encapsulated area that
could interfere with the
marking.
Use Hisomet or low

power scope with
graduated lens or
reticle.)
Incomplete Fill Any amount of insufficient mold ding Reject for any amount PBGA, FBGA,
compound during process. of incomplete fill LGMA, and
FLIP CHIP
(Use naked eyes) ARRAY
AS9093 A
Page 38 of 83
Title:
Mold Protusion Thin line of plastic PBGA, FBGA,

protruding out of the LGMA, and
package surface such FLIP CHIP
as those caused by ARRAY
scratches on the cavity
bar. Reject mold
protrusion greater than
5 mils in width and 1
mil in height.
(Use Hisomet or low

power scope with
graduated lens or
reticle.)
Rough Surface This is similar to cluster of package’s Reject for any amount PBGA, FBGA,
external voids. of clustered pinholes LGMA, and
on the package body FLIP CHIP
caused by lack of ARRAY
compaction.
Exposed Wire Bonding wire exposed out of the Reject for any bonding PBGA,FBGA
package. wire exposed out of and LGMA
the package.
(Use naked eyes)
AS9093 A
Page 39 of 83
Title:
Package Reject if any package PBGA

Misalignment misalignment greater
than 5 mils with
reference to the
package centerline.
This is measured as
I (x1-x2) / 2 I or
I (y1-y2) / 2 I
(Use Hisomet scope to

verify as necessary)
Reject any saw street FBGA, LGMA,

line is out of the mold and FLIP CHIP
compound. ARRAY
Reversed Mold This defect is equivalent to misoriented Reject if units do not PBGA
molding. conform to the
appropriate
requirement such as
pin1 orientation, … etc.
Wrong / Expired This defect is a material requirement Reject any wrong or PBGA,FBGA,
/ Different Mold deviation. expired molding LGMA, and
Compound. compound. FLIP CHIP
The different compound is shown on ARRAY
different color of mold cap. (Refer to mold
compound sticker)
AS9093 A
Page 40 of 83
Title:
Pin 1 Reject if pin one PBGA

Identification / identification features
Ejector Pin on the package are not
visible. Reject if ejector
pin greater than 8 mils
deep or higher than
the surface of the
package.
(Use Hisomet scope or

other capable
measuring device)
Mold Flash Reject for mold flash PBGA

on substrate surface
50 mils in width and 85
% in legth.
Depressed Depressed package is a small depression Reject any amount of PBGA,FBGA,

Substrate greater than 1 mil depth on the package depressed package LGMA, and
caused by foreign material attached on visible through naked FLIP CHIP
the mold cavity surface. eye or through low ARRAY
power scope
(Use Hisomet or low

power scope with
graduated lens or
reticle.)
Flash On Pad Reject for mold flash PBGA, FBGA

contamination on the
ball pad that caused
missing ball/joined
ball/misalign ball.
Wrong Gating This is misoriented molding where the Reject if units do not PBGA
mold gate does not correspond to the conform to the
gold gate on the unit. appropriate
requirement.
AS9093 A
Page 41 of 83
Title:
Substrate Crack Reject any crack on PBGA,FBGA,

functional area in the LGMA, and
topside of the FLIP CHIP
package. Reject any ARRAY
crack on functional
area in the bottom side
of the package only if
any metal is exposed.
Functional area
extends 5 mils beyond
the outermost via.
(Use naked eyes, 3X

or 40X microscope as
necessary)
Package “Crying” – Reject if PBGA,FBGA,

Warpage package warpage is LGMA, and
greater than 3 mils FLIP CHIP
ARRAY
“Smiling” – Reject if
package warpage is
greater than 8 mils
Package Any grease,oil,metal or any other Not allowed PBGA,FBGA,

Contamination substance on the package surface that LGMA, and
is not intended as part of package. FLIP CHIP
ARRAY
Scratch Package Shallow stretch of uneven package Marking area – not PBGA,FBGA,
texture due to sticking. allowed LGMA, and
FLIP CHIP
Other area – 30 mils ARRAY
max.
Broken/Damage An FOL / Wirebond defect where the Reject any broken PBGA,FBGA,
Wire wire is cut at the span. wire. and LGMA
(Detected in X-Ray)
AS9093 A
Page 42 of 83
Title:
Wire Short-EOL For Linear 1st and 2nd PBGA,FBGA,

bond: and LGMA
Reject if wires in the

same horizontal plane
has no visible gap
when viewed from the
top.
(Use X-ray machine)
For staggered 1st PBGA,FBGA,

and/or 2nd bond: and LGMA
Reject if the long wires

is already crossing two
consecutive of short
wire. Except bonded
into one bond finger or
by design
(Use X-ray machine)
Handling Wire Reject any evidence of PBGA,FBGA,

Short (X-ray) deformed wire as and LGMA
caused by mishandling
of units.
(Use X-ray machine)
Lifted ball (X-ray) An FOL / Wirebond defect where the Reject any wire PBGA,FBGA,
terminal of the wire on the die is removed from its and LGMA
disconnected. connection on the die
or chip.
(Use X-Ray Machine)
AS9093 A
Page 43 of 83
Title:
Lifted wedge An FOL / Wirebond defect where the Reject any wire PBGA,FBGA
(X-ray) terminal of the wire on the substrate removed from its and LGMA
lead is disconnected. connection on the
substrate or lead
finger.
(Use X-Ray Machine)
Incomplete Bond An FOL reject where there is missing or Reject any incomplete PBGA,FBGA
/ Extra Wire excess connecting wire. bond or extra wires. and LGMA
(X-ray)
(Use X-Ray Machine)
Wrong Bond (X- This defect is not monitored at mold. Any bonding PBGA,FBGA
ray) This is Wire Bond Lay-out Defect configuration different and LGMA
from the build sheet
requirement is a
reject.
(Use X-Ray Machine)
Internal Void Internal void is detectable by SAT,cross Reject if greater than PBGA,FBGA,
sectioning and X-ray machine. 10 mils in any direction LGMA, and
in any part of the FLIP CHIP
package.Multiple voids ARRAY
is not allowed.
AS9093 A
Page 44 of 83
Title:
Wire Sway (X- A group of wires(more than 2 wires) that Reject wire deflection FBGA and
ray) sway/deflect following the compound > 8.0% of wire length LGMA
flow direction. using 25 microns wire
diameter.
Reject wire deflection

> 10.0% of wire length
using < 25 microns
wire diameter
Reject for wire PBGA

deflection greater than
10% of wire length.
(Use X-Ray Machine)
Wire Clearance 1 or 2 wires that have changed its curve 1 wire diameter PBGA,FBGA
pattern in any direction that disturbing and LGMA
wire to wire distance.
Misalign bump Bump which not align with the bump Reject for any FLIP CHIP
pads as per showed on the build sheet. misalign bump ARRAY
(Use X-Ray machine)
Missing bump Bump not present on the pads as Reject for any missing FLIP CHIP
shown on the build sheet. bump ARRAY
(Use X-Ray machine)

Shorted bump Any two or more bumps connected to Reject for any shorted FLIP CHIP
each other. bump ARRAY
(Use X-Ray machine)
9.0. SAFETY AND ENVIRONMENTAL REQUIREMENTS – ALL MACHINES
9.1. Only qualified and certified personnel / operator can operate the machine.
9.2. Never by pass any safety feature of the machine. The machine is equipped with safety curtains and
switches to ensure that the operator is fully protected against any accident and machine mal-functions.
9.3. Wear knitted hand gloves on both hands to protect from burns.
9.4. Operator must wear allowable anti-static uniform before enter to the molding production area.
9.5. Technician must wear blue anti-static uniform before enter to the molding production area.
AS9093 A
Page 45 of 83
Title:
9.6. Avoid inhaling molding compound dust.
9.7. Wash hands thoroughly before consuming any food after handling the molding compound.
9.8. Wear grounding device when handling the strips or production units. The grounding device must have at
least one mega-ohm resistor at the contact with the operator.
9.9. If maintenance or equipment fixing activities on progress, place a bold note in front of the machine
indicating that the machine is under set-up or equipment group.
9.10. Never touch wire-bonded strips. Use prescribed tweezers on the area outside of mold cap outline or
outside the Singulation holes outline or outside the fiducial marks outline.
9.11. Do not stop the press when the cycle is “on” unless necessary. For emergency purposes only, press the
emergency stop on the mold press.
9.12. Do not use any materials and tools other than those specified. Like use of brass material only in clearing
the molds of any sticking debris.
9.13. Do not leave any foreign object inside the mold sections and cabinets. Foreign object means any object
that should not be inside the mold, and this includes even tools and logistics provided for mold process.
9.14. After using the machine, perform proper shutdown.
9.15. Ensure that the mold is free of any foreign materials, debris. Use vacuum and other prescribed tools to
remove these materials.
9.16. Close the mold leaving about 1 / 2 to 2.0 inch gap with plunger raise up for Towa and Asahi. Mold Fico is
automatically close by system when in standby mode.
9.17. Press emergency stop, motor stop as necessary depending on the machine model. If the mold will not be
used for a long period (more than 2 days), inform the technical support. The technical support personnel /
maintenance personnel may place the machine to appropriate status depending on the requirements on
applicable maintenance specification.
9.18. Dispose waste materials such as cotton gloves, rags, finger cots, papers, tissues and other materials
contaminated with chemicals and other hazardous materials into the hazardous waste container.
9.19. Hazardous waste in liquid form shall be stored and disposed with its original or compatible container
properly labeled and tightly covered.
9.20. Empty containers used for chemicals and other hazardous materials shall be considered as hazardous,
and must be disposed accordingly.
9.21. Non-hazardous materials must be disposed or place into non-hazardous waste container.
9.22. Do not clean tools, other items, or any body parts contaminated with hazardous with hazardous material
into an open drain or sink connected directly into an open drain. These must be cleaned into a sink
connected to a treatment facility, or collected into a container and disposed accordingly.
9.23. Containers of chemicals, solvents, oil, paints, spray wax and other hazardous materials must be covered
tightly when not in use.
9.24. Provide secondary containers on areas with chemicals, oil, paints, solvents and other hazardous materials
for the collection of leaks and spills.
9.25. Immediately contain and clean up spills and leaks of chemicals, oil, paints or other hazardous materials
using absorbent materials. Absorbent materials used shall be considered as hazardous hence shall be
disposed accordingly.
AS9093 A
Page 46 of 83
Title:
9.26. All requirements on Handling of Waste Materials are not stated in this specification. In general, disposal
of waste must comply with any related UNISEM specification.
9.27. Operators in the line must be use different gloves during manual production, especially during take the
compound.
10.0. RESPONSIBILITY
10.1. PROCESS ENGINEERING
10.1.1. It is the responsibility of Process Engineering to keep this specification updated covering related
improvement, development and changes in procedure, equipment, materials, parameters and
product criteria.
10.1.2. Define and / or develop an effective process control plan and improvement programs geared
towards quality, cost improvement and productivity.
10.2. PRODUCTION
10.2.1. It is the responsibility of Production to ensure that all procedures herein are carried out
accordingly.
10.2.2. Production should ensure that only certified operators perform activities for this specification.
10.2.3. Production operator has the full responsibility to ensure that the lot / material is in good condition
until properly endorsed to next process step. Before touching / moving the production lot / strips,
the operator must be informed first.
10.2.4. Production is responsible to ensure that TCM is properly filled up, neatly kept and complete. This
folder should always be ready for audit activities.
10.3. TECHNICAL SUPPORT / EQUIPMENT ENGINEERING
10.4. It is the responsibility of Equipment Engineering to ensure that machines are in good condition and
properly set up as required in the TCM.
10.5. Maintain all equipment operating capabilities and performance to optimum conditions according to
applicable preventive maintenance.
10.6. Assist production on equipment related activities.
10.7. QUALITY CONTROL
10.7.1. QC/QA should ensure that all requirements stated in this specification are complied by periodic
audit as determined by the QC/QA applicable specifications.
10.7.2. Solicit corrective actions for quality discrepancies.
10.8. TRAINING
10.8.1. Training should conduct defined training for BGA mold operators and issue certification as proof
of passing the requirements.
11.0. TOTAL CONTROL METHODOLOGY FOR BGA MOLDING
11.1. The Total Control Methodology (TCM) specification is translated into working forms (as below) and
contained in the TCM folder provided in every machine.
AS9093 A
Page 47 of 83
Title:
11.2. The contents of TCM folder must be kept updated. Minimum two weeks (consecutive) data entries should
be maintained in the folder.
11.3. The following are the minimum components or elements of TCM folder.
11.3.1. Total Control Methodology (TCM) Cover Page and List of Elements – Appendix 1
11.3.2. Production Down Time and Machine Repair Record – Appendix 2
11.3.3. Positive Control (Positrol) Plan – Appendix 3
11.3.4. Production and Equipment Recording Checksheet – Appendix 4
11.3.5. Wirebond to Mold Buy –off Form – Appendix 5
11.3.6. Product OCAP – Appendix 6A
11.3.7. Product OCAP for Wire Sway (Affected Lot) – Appendix 6B
11.3.8. Product OCAP for Wire Sway (Lots before Affected Lot) – Appendix 6C
11.3.9. Process OCAP for Mold Temperature – Appendix 6D
11.3.10. Process OCAP for Misalign Mold – Appendix 6E
11.3.11. Process OCAP for Voids, Blister, Incomplete, Surface Roughness – Appendix 6F
11.3.12. Process OCAP for Wire Sway, Wire Short, Damage Wire – Appendix 6G
11.3.13. Process OCAP for Damage Wire, Depressed Wire, Broken Wire– Appendix 6H
11.3.14. Process OCAP for Damage / Color Change Solder Mask – Appendix 6J
11.3.15. Process OCAP for Warpage – Appendix 6K
11.3.16. Process OCAP for Mold Flash – Appendix 6L
11.3.17. BGA Auto Mold Shiftly Machine Checklist – Appendix 7A
11.3.18. Towa Auto Mold Maintenance Checklist – Appendix 7B
11.3.19. Towa Auto Mold Maintenance Checklist – Appendix 7C
11.3.20. Mold Compound Loading History – Appendix 8A
11.3.21. Mold Parameters Board – Appendix 9.
12.0. APPENDIX AND TABLES (Note: Printable files in excel and power point kept by process engineer and
production supervisor)
12.1. APPENDIX 1 – BGA AUTOMOLD TOTAL CONTROL METHODOLOGY (TCM)
AS9093 A
Page 48 of 83
Title:
BGA AUTOMOLD TCM LIST
OPERATION : MOLD ARRAY REV. DATE : 16 OKTOBER 2007 REVISION : 02

NO ELEMENT DESCRIPTION
1.POSITROL PLAN
2.PRODUCTION AND EQUIPMENT RECORDING CHECKSHEET
3.PRODUCTION TIME TICKET AND MACHINE REPAIR RECORD
4.BGA AUTOMOLD SHIFTLY MACHINE CHECKLIST
5.MOLD DAILY - WEEKLY MAINTENANCE CHECKLIST
5.1. FICO AUTOMOLD MAINTENANCE CHECKLIST
5.2. TOWA / ASAHI AUTOMOLD MAINTENANCE CHECKLIST
6. MOLD VARIABLE CONTROL CHART (X-BAR) CHART - SPC
7. OUT OF CONTROL ACTION PLAN
Note :
Check and record of all checklist and checksheet of TCM element every end of the shift by operator
Legend :
G/ERN/Group GOOD / ERN # / Group Example : G / 01122 / X
All checklist and checksheet are filled up correctly Checklist and checksheet are correct,
No missing checklist and checksheet filled up properly and no missing checklist
and checksheet of TCM.
Checked by 01122 group X
No./ERN/Group No. of checklist / ERN # / Group Example : 2,4 / 01122 / X

Any checklist or checksheet of TCM elements are
Something wrong with "Production and
not correct / improperly filled up. Or any missing
Equipment Recording Cheksheet" and
checklist / checksheet. "BGA Automold Shiftly Machine Cheklist"
Checked by 01122 group X
AS9093 - ASSEMBLY SPECIFICATION FOR ENCAPSULATION OF BGA, LGA AND FLIP CHIP ARRAY PACKAGES
AS9093 A
Page 49 of 83
Title:
12.2. APPENDIX 2 – PRODUCTION DOWN TIME AND MACHINE REPAIR RECORD

Date Shift ERN Operator STATION
PRODUCTION TIME TICKET AND MACHINE REPAIR RECORD MOLDING
SYSTEM #: TOOL #:
OPERATOR OPERATOR, EE / PE TECHNICIAN QA D/T CODE

BALL
PT NO
TIME TIME PROD QTY QTY DOWNTIME DOWNTIME TECH. PROBLEM
CORRECTIVE ACTION / REMARKS
M/C 1. SCHEDULE
COUNT START STOP TIME IN OUT CODE MINS ERN DESCRIPTION STATUS 10 PREVENTIVE MAINTENANCE
11 MOLD CLEANING
12 PARAMETER CHECK
13 PROJECT / UNDER VENDOR
14 CHANGE COMPOUND
18 CHANGE FILL
19 CHANGE DAM
2. CONVERSION
20 MOLD CONVERSION / SETUP
21 SYSTEM CONVERSION / SETUP
3. MATERIAL
30 MATERIAL SHORTAGE
4. UNSCHEDULE
42 FOREIGN MATERIAL
43 POROSITY / SURF. ROUGHNESS
45 PACKAGE CHIP
47 PACKAGE CRACK
48 E-PIN DEPTH
49 FLASH ON PAD
4A WIRE SWAY / CLEARANCE / SHORT
4B MISSLOAD
4C PACKAGE DIRTY / CONTAMINATION
4D STICKING STRIP / COMPOUND
4E INCOMPLETE FILL
4F VOID / INTERNAL VOID / BLISTER
4K BROKEN/DEPRESSED WIRE
4L MOLD FLASH
4M CRUMPLE / DAMAGE STRIP
4N BROKEN / STUCK UP POT / PLUNGER
4P EXPOSED WIRE / PAD
70 SUBSTRATE CRACK
71 PACKAGE WARPAGE
72 MOLD PROTUSION
73 DEPRESSED SUBSTRATE
74 PACKAGE SCRATCH
75 INCOMPLETE DAM (ASYMTEK)
76 DEFORMED DAM (ASYMTEK)
77 OFFSET DAM (ASYMTEK)
78 FILL OVERFLOW (ASYMTEK)
60 MOLD TEMPERATURE
61 CLAMP / SOFT CLOSE
62 PRESS RELATED
63 ELECTRICAL/ELECTRONICS
65 ONLOAD / INPUT ELEVATOR
66 KICKER / PUSHER
67 HOT PLATE
68 ROTARY / TURNTABLE
69 PELLET RELATED
6A LF FEEDER/DRAGGER
6B OFFLOAD / OUTPUT ELEVATOR
6C LOADER / PICK & PLACE
6D UNLOADER
6E AUTO CLEANER
6F DEGATOR / TURNOVER
6K VISION / MONITOR / PANNEL
6L SOFTWARE /SYSTEM HANG UP
80 CARRIER (TOWA)
81 PICK UP UNIT (TOWA)
82 VACUUM
83 FSL RELATED (ASYMTEK)
84 CONVEYOR RELATED (ASYMTEK)
85 DISPENSE HEAD RELATED (ASYMTEK)
86 WEIGHT UNIT RELATED (ASYMTEK)
5. O T H E R S
50 FACILITIES / UTILITIES
51 PROCESS RELATED
52 QC BUY OFF / MONITORING
53 BREAKTIME
54 MEETING
55 WAITING PLASMA
56 CHECK MATERIAL / MACHINE
57 WAITING COMPOUND
58 NO OPERATOR / TRANSFER MACHINE
59 PRAYING
5A DUMMY RELATED
5B HOUSE KEEPING (5 R)
5C FOL RELATED
5D WAITING TECHNICIAN
5E REWORK UNIT (ASYMTEK)
5F WAITING DAM (ASYMTEK)
5G WAITING FILL (ASYMTEK)
5L WAITING PE
5M MATERIAL PROBLEM
5N LOADING PELLET / PELLET EMPTY
AVAILABLE TIME :
AS9093 - ASSEMBLY SPECIFICATION FOR ENCAPSULATION OF BGA, LGA AND FLIP CHIP ARRAY PACKAGES Rev. 03
PRINTED VERSION IS UNCONTROLLED UNLESS STAMPED "CONTROLLED COPY" IN RED B Y UNISEM DOCUMENT CONTROL
AS9093 A
Page 50 of 83
Title:
12.3. APPENDIX 3 – POSITIVE CONTROL (POSITROL) PLAN
POSITIVE CONTROL (POSITROL) PLAN Revision Date : 14 July 2008
PROCESS : MOLD (BGA,LGA)
SET -UP IN - PROCESS MONITOR

EQUIPMENT BUY OFF MACHINE MATERIAL PROCESS PARAMETERS QUALITY CHARACTERISTICS
W Mold Set-up 1.External Defects Mold tool cleaning 1.Molding Compound 1. Pellet Preheat Time 1. Mold Temperature 1.External Defects 1.Internal Defects
H 2.Internal Defects Thawing time: 2. Clamping Tonnage 2.Warpage (Spec: AS 9093
A 3.Warpage Sumitomo -16 hrs. 3. Transfer Pressure (Spec: AS 9093 table 1) table 1)
T 4.Mold Cap Height Shinetsu - 16 hrs. 4. Transfer time
5.Substrate thickness Nitto - 24 hrs. 5. Cure Time
6.Cull Height Usage time: 6. Hot Plate Temp.
Sumitomo -48 hrs.
Shinetsu - 48 hrs.
Nitto - 24 hrs.
Type / Size per
requirement
2.Production lot
H Per set-up Per criteria in AS 9093 Per AS 9093 1.Molding material 1.Machine Display Digital Thermometer 1.Per criteria in AS 9093 1.Per criteria in AS
O Checklist (table 1) removal monitor Monitor ;table 1 9093;table 1
W ( AS 9093) -Compound loading 2.3X magnification 2.X-Ray machine
history 3.10X - 40X (Verification)
-PT / Compound Sticker 4.For warpage - Profile
correlation projector or hisomet
-PT and magazine no.
verification
W EE EE (External) Production Operator Production Operator / QC EE / QC EE Production operator / QC operator
H QC ( External / Internal) QC (External defects)
O Production (Warpage,
Mold Cap Height, Subs.
Thickness)
W - Every 1.After eqpt.set-up 1. After 600 shots for Prod'n. Operator: Sample size / Sample size / Sample size / Frequency Sample size /
H conversion 2.After shutdown 7720 TA and 400 shots -Every change of lot Frequency as per SOP Frequency as per as per SOP 1158 - Frequency as per
E - After PM 3.Change of Mat'l. for G760V -Every change of 1158 - Asembly SOP 1158 - Asembly Assembly Control Plan SOP 1158 -
N - After offline 4.Start of Shift 2. After 16 hours stand compound box Control Plan Control Plan Assembly Control
cleaning 5.After mold cleaning by QC: 1X / shift Plan
6.1x / shift or every set -up 3. Presence of rejectable
stain
C M Production and 1.Production and EE 1.Production and EE 1.Production and EE 1.Production and EE 1.X -bar & R Chart 1.Production and EE 1.AIMS SPC -
O E EE Record Recording Checksheet Record Checksheet recording checksheet recording checksheet recording checksheet attributre data
N T Checksheet 2.Die set metal ID 2.Mold compound sticker 2.AIMS SPC - attributre
T H 3.Module Name Card 3.QC stamp data
R O 4.Cavity Bar Engrave 4.Mold Compound
O D Removal Monitor
L
WHY To ensure equipment readiness for

To ensure equipment,process parameters and quality responses are maintained during production operation
production mode
AS9093 A
Page 51 of 83
Title:
12.4. APPENDIX 4 – PRODUCTION AND EQUIPMENT RECORDING CHECK SHEET
PRODUCTION & EQUIPMENT RECORDING CHECKSHEET
AREA : MOLD (BGA, LGA, AND FLIP CHIP ARRAY)
SAMPLE SIZE : ACCEPT = 0
DATE : / / (DD/MM/YY) Revision Date : 25 November 2007
PER CONTROL PLAN OTHERWISE ONE MOLD SHOT PER CHASE REJECT = 1
SYSTEM / TOOL NO. :
1. EQUIPMENT, MATERIALS, MONITORING, SHOT COUNTER AND INSPECTION >>>>> TO BE FILLED UP BY OPERATOR
Mold Station Used (1 / 2) / / / / / / / / / / / / /
Mold Station Used (3 / 4) / / / / / / / / / / / / /
PT Number
Sublot Quantity
Package Type
Ball Count
Operator ERN / Grp / / / / / / / / / / / / /
Time Lot Finish
/ / / / / / / / / / / / /
Magazine Out Number / / / / / / / / / / / / /
/ / / / / / / / / / / / /
Package Warpage (Min/Max/Ave) / / / / / / / / / / / / / / / / / / / / / / / / / /
Shot Counter (1 / 2) hourly record / / / / / / / / / / / / /
Shot Counter (3 / 4) hourly record / / / / / / / / / / / / /
B = Buy-off & M = Monitor
Qty Reject
Defect Code
AA - Gate Chip / Chip BA - Voids / Blister BC - Protrusion BL - Misoriented Mold OE - Mold Flash HN - WireSweep OTH - Others
AB - Package Crack BB - Incomplete BD - Rouch/ Pitted BR - Pin1 or Ejector Defect HB - Wire Short FOL - FOL Defects NP - Flash on Pad
2. PRODUCTION LOT BY LOT CHECKLIST >>>>>> TO BE PERFORMED BY OPERATOR
PROD'N LOT BY LOT CHECKLIST (CP / RESULT) :
Items Production Checklist Checkpoint (CP) Result Recording Method
Compound and other material information 1. Substrate Thickness 3. Compound Type / PN 5. Compound Expiration 7. Strip Code 9. Pass previous process G = Pass 1. Production Checksheet References : PT, Compound Sticker, Mold IDs, Control Plan
Tooling information 2. Mold Cap Height 4. Compound Size 6. Magazine Numbers 8. Strip Count 10. <24 hours elapsed after plasma F = Fail 2. Lot by lot basis
3. ALL CHECKLIST, CHECKSHEET, RECORD OF TCM ELEMENTS MUST BE PROPERLY CHECKED ON SHIFTLY BASIS BY PRODUCTION OPERATOR (EVERY END OF SHIFT) >>>>>> TO BE PERFORMED BY OPERATOR
TCM CHECKLIST AND RECORD STATUS / / / / / / / / / / / / / / / / / / / / / / / / / /
GUIDANCE LEGEND Recording Method / Frequency
All correct and complete : G / ERN / Group 1. Production & Equipment recording checksheet 3. BGA Automold Shiftly Machine Checklist G. Good TCM 1. Production & Equipment Recording Checksheet
Something wrong with TCM : No / ERN / Group 2. Production Time Ticket and Machine Repair Record 4. Mold Daily - Weekly Mainternance Checklist 2. Every end of shift
4. MOLD CLEANING & CONDITIONING >>>>>> TO BE FILLED UP BY OPERATOR
Start Time
Finish Time
Mold Station Cleaned (1 / 2) / / / / / / / / / / / / /
Mold Station Cleaned (3 / 4) / / / / / / / / / / / / /
Number of Cleaning Shot
Number of Conditioning Shot
5. SET-UP / CONVERSION / MONITOR AND PARAMETERS >>>>>> TO BE FILLED UP BY TECHNICIAN
ITEM RQMT RESULTS
Pellet Pre-heat Time
Hot Plat Temperature
Top Mold Temp. (Min./Max.) / / / / / / / / / / / / /
Bottom Mold Temp. (Min./Max.) Refer to / / / / / / / / / / / / /
Transfer Pressure parameter
Clamp Pressure (Tonnage Setting) board
Transfer Time
Cure Time Setting
Mold Compound Type
Technician ERN
Lead Tech Verification (ERN)
QC STAMP
AS9093 A
Page 52 of 83
Title:
12.5. APPENDIX 5 – WIREBOND TO MOLD BUY OFF FORM

FORM A : Wire Bond to Mold Buy Off Form Rev : 04
1.0. BILL OF MATERIALS / PACKAGE INFORMATION (Resp : PE)
- Package Desc'n : - Gold Wire diameter :
- Substrate Desc'n : - Mold Cap Height :
- Substrate Thickness : - Mold Cpd Type :
- Epoxy : - Mold Cpd Size :
2.0. TYPE OF BUY-OFF (Resp : EE/Prod'n/QA-Rel)
[ ] CONDITION A [ ] CONDITION B [ ] CONDITION C [ ] CONDITION D
- New Device - New Device - New Device - New Device
- Multi Tier Bonding - Wire Length > 180 mils - Linear Pad Pitch < 80 mm - Irregular wire lay out
- Wire Length > 120 mils - Single Bonding - Wire Length > 120 mils and bond pads row
3.0. LOT INFORMATION (Resp : FOL EE / Production)
- Wire Bond Machine : - Date / Shift / Time :
- Device : - PT # :
- No. of Buy off : - Magazine # :
- Prepared By : - Pkg Decap (Yes / No) :
4.0. WIRE BOND BUY OFF (Resp : FOL QC)
4.1. Wire Length (Avg) :
4.2. Loop Height Data (1st K / 2nd K) Side 1 Side 2 Side 3 Side 4
Highest Loop _____ / _____ _____ / _____ _____ / _____ _____ / _____
1 4
Note : Measure from die surface to highest point of loop
2 3
4.3. Visual Inspection (Wire Related Defects Only)
[ ] ACC [ ] REJECT If Reject, Specify defects :
QA Approval : [ ] ACC [ ] REJECT, Affix QA Stamp : ____________________________
5.0. MOLD BUY OFF (Resp : EOL Spv/QA Rel/Mold PE)
S/S : 1 Strips (at least 2/3 must be good bonded inked die)
5.1. Molding Parameters
- Mold Temperature : - Clamping Press :
- Transfer Time : - Transfer Pressure :
- Curing Time : - Hot Plate Temperature :
5.2. Warpage Data : [ ] ACC [ ] REJECT
Note : Use separate sheet for warpage data.
5.3. X-Ray Result after Mold : [ ] ACC [ ] REJECT Mold M/C No :
(Attache X-Ray photos if any. If reject, identify strip & unit) Auto-Mold
MGP Semi-Auto mold
5.4. Wire Sweep Data : [ ] ACC [ ] REJECT S/S : 1 unit at 3 Corner wires (die to bond lead)
Gate 1 4 Data : 1 = ____%, 2 = ____%, 3 = ____%
Note : Criteria is 7% max.
2 3
5.5. Decap Inspection (If any) : Requested : [ ] Yes Result : [ ] ACC [ ] REJECT S/S : 1 strips
[ ] NO
Mold Approval : [ ] ACC [ ] REJECT Approved by :

Mold Supervisor
Acknowledged/Revieved by :
Wire Bond PE
Note : 1. If Reject, Mold production to inform & pass samples to FOL EE/EOL PE immediately
2. If Accept, Mold prodUCtion to inform & pass FORM A to PE Molding for filing
3. For lInear pad devices, do 5.3 dan 5.4. At 5.3, do 3D to verify wire short.
4. For staggered pad devices, do 5.3, 5.4, and 5.5. If 5.5. cannot be done, use X-Ray machine for 3D wire short
(5.5. is required only during 1st to 3rd on line buy off)
AS9093 - Assembly Specification for Encapsulation of BGA and LGA Packages
AS9093 A
Page 53 of 83
Title:
12.6. APPENDIX 6A – PRODUCT OCAP
Product OCAP (Out-of-Control Action Plan)
Operation : Array Molding

Revision Date : 7 December 2005
Out -of-Control Condition
Mold Press : All
Mold Tool : All
Follow Process
A defect is found or Parameter Out of
OCAP according to
Control
Generate Low Yield Report and Relase Defect / Parameter
to next Process
(Resp: Production)
Inspect last two mold shots from

affected chases.Inspect for Visual and
Internal.
(Resp:Prod'n.)
Release to next process step
(Resp: Production)
No
No Any defect found ?
Yes
Low Yield ? Yes
Pepare Lot Backtrack Sheet to record all

information.
Inform PE for disposition and further
(Resp: Prod'n.)
instruction.Instruction to be written on
the Lot Backtrack Sheet.
(Resp: Production)
Backtrack lots form recently molded lots until the two

unaffected lots are found.inspect for same defect at
sample size 2 strips per module per lot or equivalent
Hold the lots and attach Hold Tag qty.If the last lot in packing contain the same
(Resp: Production) defect,Qa to convene PE and CS on disposition
regarding the shipped lots.
(Resp:QA)
Perform 100% inspection on afected lots

to sort out all defective parts
(Resp: Production)
AS9093 A
Page 54 of 83
Title:
12.7. APPENDIX 6B – PRODUCT OCAP FOR WIRE SWAY (AFFECTED LOT)

Operation : Molding
Found wire sway out of specs. by QC,and ITR is Mold Press : All
issued by QC operator Mold Tool : All
Defect Mode : Wire Sway (Affected
Lot)
Verify wire to wire clearance

(Resp: PE Tech./Engr.)
No
Clearance < 1X wire diameter?
Yes
No
Due to wire bond process?
Yes
Decap the affected unit
S/S : 1 unit
Resp: QC
No
Yes
Re-screen 100% (X-Ray)

Resp: Production
QC re-sampling PASS?
No
Yes
Release the Lot
AS9093 A
Page 55 of 83
Title:
12.8. APPENDIX 6C – PRODUCT OCAP FOR WIRE SWAY (LOT BEFORE AFFECTED LOT)

Operation : Molding
Mold Press : All
Wire Sway Mold Tool : All
( Out of Specs.) Defect Mode : Wire Sway (For
lots processed before and the affected
lot)
Immediately hold all lots that still at assembly Follow Process

(Resp:Production) OCAP
Immediately check the first lot before the affected

lot (Use X-Ray)S/S:1 mold shot(2 strips) / module
(Resp:Prod'n. / QA)
Release all lots

No
Clearance < 1X wire diameter? from hold status
(Resp: Production)
Yes
Step (1)
Check the most previous lot or earliest lot
processed that still at Assembly (Use X-Ray)
S/S : 1 mold shot(2 strips) / module
(Resp: Prod'n. / QA.)
Need to check the

No suspected lots one by one
until the cut off is defined
(Resp: Production)
Yes
No
Step (2)
Due to Molding process? Call FOL PE
Yes
s
Step (3)
Re-screen 100% (Use X-ray)the affected lot and
mark the reject units accordingly
(Resp:Production)
Repeat Steps (1) to (3) for other affected lots

which are on hold
No QC Re-sampling PASS?
S/S : 1 mold shot (2 strips)/module
Yes
Release the lot
AS9093 A
Page 56 of 83
Title:
12.9. APPENDIX 6D – PROCESS OCAP FOR MOLD TEMPERATURE

Process OCAP (Out-of-Control Action Plan)
Verify out of control by Mold Temperature

technician / Operator / QC Operation : Molding
and issued ITR by QC Mold Press : Fico, Towa
Mold Tool : All
Production Operator stop the Rev. Date : 1 June 2006
machine and call PE / EE
tech.Check paramters actual vs
parameter board
Resp : PE / EE tech
YES Adjust Temp. setting

Out of spec temperature setting?
Resp : EE Tech
NO
YES Replace heater fuse with good one

Heater Power fuse problem?
Resp : EE Tech
NO
YES Retighten wire connection

Loose wire connection?
Resp : EE Tech
NO
YES Replace heater with good one

Heater problem?
Resp : EE Tech
NO
YES Replace sensor with good one

Sensor problem?
Resp : EE Tech
NO
YES Replace temp controller with

Temp. Controller good one
problem? Resp : EE Tech
NO
Solid state relay YES Replace solid state relay

problem? Resp : EE Tech
Remeasure actual temp.

Resp : EE Tech
Call Engineer
Fill ITR
Resp : EE Tech
NO
QC re-issue ITR Passed QC buy Off ?
YES
Resume for Production
AS9093 A
Page 57 of 83
Title:
12.10. APPENDIX 6E – PROCESS OCAP FOR MISALIGN MOLD
Verify out of control by Mold Misalign

technician / Operator / QC
and issued ITR by QC Operation : Molding
Mold Press : Fico, Towa
Mold Tool : All
machine and call PE / EE tech
Check material and machine

condition
Resp : PE / EE tech
YES Do X-Ray for internal visual

Any mold flash out inspection
from substrate ? Resp : Production
NO
YES Clean btm loading bar from any
Any flash on mislalign compound flash out.
btm laoding bar? Resp : EE tech
NO
YES Replace broken pin with new one.
Any broken pin?
Resp : EE tech
NO
Teaching IT arm or on loader
Bad IT arm or onloader YES
alignment to the mold.
alignment to the mold? Resp : EE tech
NO
Call Engineer
Fill ITR and buy off
Resp : PE / EE Tech
NO
YES
AS9093 A
Page 58 of 83
Title:
12.11. APPENDIX 6F – PROCESS OCAP FOR EXTERNAL/INTERNAL VOIDS, INCOMPLETE FILL and
Surface Roughness
Verify out of control by Mold Misalign

Mold Tool : All
Check material and machine

condition
Resp : PE / EE tech
YES Do X-Ray for internal visual

Any mold flash out inspection
from substrate ? Resp : Production
NO
YES Clean btm loading bar from any
Any flash on mislalign compound flash out.
btm laoding bar? Resp : EE tech
NO
YES Replace broken pin with new one.
Any broken pin?
Resp : EE tech
NO
Teaching IT arm or on loader
Bad IT arm or onloader YES
alignment to the mold.
alignment to the mold? Resp : EE tech
NO
Call Engineer
Resp : PE / EE Tech
NO
YES
AS9093 A
Page 59 of 83
Title:
12.12. APPENDIX 6G – PROCESS OCAP FOR WIRESHORT, WIRESWAY
Verify out of control by Wire Short, Wire Sway

Mold Tool : All
Check the abnormalities

Resp : PE / EE tech
Set the mold paramters

Yes
Incorrect mold parameters set up follow AS9093
per AS9093? Resp: EE Tech.
No
No
Bad IT arm or onloader alignment
to the hot plate or mold?
Yes
Re-teach IT and / or perform
mechanical troubleshooting from
strip pusher to on-mold loading.
(Resp: EE Tech.)
No
Good alignment or
result?
Yes
Yes Change compound within

Expired mold compound usage time
usage time? (Resp: Prod'n. Operator.)
No
Yes Release internal feedback

Verified FOL / Design to FOL & hold the lot.
related ? (Resp: Prod'n. Supv.)
No
Call Engineer
Resp : PE / EE Tech
NO
YES
AS9093 A
Page 60 of 83
Title:
12.13. APPENDIX 6H – PROCESS OCAP FOR DAMAGE WIRE, DEPRESSED WIRE, BROKEN WIRE
Verify out of control by Damage Wire, Depressed

technician / Operator / QC Wire, Broken Wire
Mold Press: Fico, Towa
Mold Tool : All

Resp : PE / EE tech
No
No
Bad IT arm or onloader alignment
to the hot plate or mold?
Yes
Re-teach IT and / or perform
mechanical troubleshooting from
strip pusher to on-mold loading.
(Resp: EE Tech.)
No
Good alignment or
result?
Yes
Yes Release internal feedback

Verified FOL Related ? to FOL & hold the lot.
(Resp: Prod'n. Supv.)
No

Call Engineer Resp : PE / EE Tech
NO
YES
AS9093 A
Page 61 of 83
Title:
12.14. APPENDIX 6J – PROCESS OCAP FOR DAMAGE / COLOR CHANGE SOLDER MASK
Verify out of control by Damage / Color Change

technician / Operator / QC Solder Mask
Mold Tool : All

Resp : PE / EE tech
Set the mold clamping

Yes
Incorrect mold clamping press pressure follow AS9093
per AS9093? Resp: EE Tech.
No
Clean mold flash and correct mold
Yes chase set up per substrate thickness
Any mold flash on center block?
dimension.
(Resp: EE Tech.)
No
Correct mold chase set up per
Visible heavy clamp Yes
substrate thickness dimension.
impression? (Resp: EE Tech.)
No
Check bare substrate with same
batch/lot number.
(Resp: PE / EE Tech.)
Release MRB and feed back to

Any similar defect Yes
incoming material. Hold the lot
found? (Resp: PE Tech.)
No
Call Engineer
Resp : PE / EE Tech
NO
YES
AS9093 A
Page 62 of 83
Title:
12.15. APPENDIX 6K– PROCESS OCAP FOR WARPAGE
Verify out of control by Warpage

Operation : Molding
and issued ITR by QC
Mold Tool : All
Rev. Date : 1 June 2006
Production Operator stop the

Resp : PE / EE tech
Set the mold curing time

Incorrect mold curing time Yes
follow AS9093
per AS9093?
Resp: EE Tech.
No
Correct handling and / or strip
Any abnormality on Yes alignment on the degater as
handling ordegater? necessary.
(Resp: EE Tech.)
No
Buy off on two consecutive mold

shot per affected chase.
(Resp: PE / EE Tech.)
Any similar defect No

found?
Yes
Resp : PE / EE Tech
Call Engineer
NO
YES
AS9093 A
Page 63 of 83
Title:
12.16. APPENDIX 6L – PROCESS OCAP FOR MOLD FLASH
Verify out of control by Mold Flash

Mold Tool : All

Resp : PE / EE tech
Set the mold set up follow

Incorrect mold set up Yes
substrate thickness
per substrate dwg?
Resp: EE Tech.
No
Remove any flash on mold cavity

Any misload substrate Yes and use right alignment of
during process? substrate
(Resp: EE Tech.)
No
Remove any dirt on mold cavity /

Any dirt or double Yes use similar substrate dimension
substrate during process? (Resp: EE Tech.)
No
Replace broken locator pin on
Any broken locator pin or the affected chase / ensure
flexible pin? flexible pin is flexible
(Resp: EE Tech.)
No
Reshot using substrate with

same part number
(Resp: EE Tech.)
Any similar defect No

found?
Yes Fill ITR and buy off

Resp : PE / EE Tech
Call Engineer
NO
YES
AS9093 A
Page 64 of 83
Title:
12.17. APPENDIX 7A – BGA AUTOMOLD SHIFTLY MACHINE CHECKLIST
BGA AUTOMOLD SHIFTLY MACHINE CHECKLIST

YEAR : ………….. DAY SUNDAY MONDAY TUESDAY WEDNESDAY THURSDAY FRIDAY SATURDAY
WW : ………….. GROUP
SYSTEM NO. : ………….. OPERATOR ERN.
MOLD TOOL NO. : ………….. SHIFT N M A N M A N M A N M A N M A N M A N M A
NO. TASK DESCRIPTION CHECK POINT
1 CHECK MACHINE STATUS : (option) A. Run Production.
B. Material shortage for 1 (one) SHIFT.
C. Machine shutdown for PM schedule.
D. Machine shutdown on holiday.
2 CHECK MACHINE ALARM/ERROR VISUAL CHECK :
Look at monitor.
3 CHECK MOLD TOOL :
- LOCATOR PIN VISUAL CHECK :
Complete and no broken.
- ANTI MISLOAD PIN VISUAL CHECK :
4 CHECK DEGATOR, L/F GUIDE PIN OR BLOCK VISUAL CHECK :
5 CHECK SAFETY DOOR FUNCTIONALITY CHECK :
- The mold door are mechanically locked.
- The alarm sound and m/c will stop when
the door is opened.
6 CHECK SUBSTRATE SCRAPPER PLATE VISUAL CHECK :
ON PRODUCTION WORKING TABLE Installed and no worn out or saw teeth
scrapper blade.
7 5R ACTIVITY : VISUAL CHECK :
- CLEAN LOADING TURNTABLE AREA - No dirt / dust accumulation.
- CLEAN PELLET SEPARATOR UNIT AREA - No dirt / dust accumulation.
- CLEAN DEGATE PUSHER AREA (Fico only) - No dirt / dust, no broken runner scattered.
- EMPTY CULL BIN AND PELLET WASTE BIN - No pellet, broken runner scattered.
- CLEAN PRODUCTION WORKING TABLE AREA - No unnecessary tool (e.g. tweezer) scattered.
Confirmed by line technician (ern)
OPERATOR IS RESPONSIBLE TO CHECK & ENSURE THE MACHINE IN GOOD CONDITION BEFORE
OPERATE THE MACHINE & INFORM TECHNICIAN/GROUP LEADER IF ANY ABNORMALITY FOUND LEGEND :
NOTE : 1. FOR SHIFTLY MACHINE CHECKING TASKS WILL REQUIRE MACHINE SHUTDOWN FOR 10 (ten) MINUTES " V " : GOOD or NO ABNORMALITY "X" : CORRECTIVE ACTION REQUIRED
2. IF THE MACHINE STATUS IS MATERIAL SHORTAGE FOR 1 (one) SHIFT OR PM SCHEDULE
OR SHUTDOWN FOR HOLIDAY THEN NO CHECKING OR CLEANING IS REQUIRED. " C " : CORRECTED "N/A" : NOT APPLICABLE
3. MATERIAL SHORTAGE FOR 1 (one) SHIFT CONFIRMED BY SUPERVISOR.
AS9093 A
Page 65 of 83
Title:
12.18. APPENDIX 7B – TOWA / ASAHI AUTOMOLD MAINTENANCE CHECKLIST
TOWA / ASAHI AUTOMOLD MAINTENANCE CHECKLIST

DAILY CHECKLIST WW ….. WW ….. WW ….. WW …..
YEAR : ……………………… S M T W T F S S M T W T F S S M T W T F S S M T W T F S
SYSTEM NO. : ……………………… DAY U O U E H R A U O U E H R A U O U E H R A U O U E H R A
MOLD TOOL NO. : ……………………… N N E D U I T N N E D U I T N N E D U I T N N E D U I T
GROUP
TECH. ERN
MODULE/AREA TASK DESCRIPTION CHECK POINT
CHECK MOLD HEATERS STATUS Mold heaters "ON" Station 1 Station 2
MOLD HEATERS
Mold heaters "OFF" Station 3 Station 4
CHECK ALIGNMENT BETWEEN SUBS. PUSHER, VISUAL CHECK :
INPUT STATION
TRACK & LOADING TURN TABLE Subs. Smoothly move and allign to the track.
CHECK ALIGNMENT AT : - TURN TABLE VISUAL CHECK :
ONLOADER STATION - MOLD CHASE Properly allign.
- PELLET SHOOTER
CHECK ALL PINS ( ORIENT., SUBS. PRESENT VISUAL CHECK :
AND GRIPPER. Complete set, no bent or broken.
CHECK ALIGNMENT AT : - MOLD CHASE VISUAL CHECK :
OFFLOADER STATION - CARRIER Properly allign.
CHECK VACUUM PAD SUCTION AND GRIPPER VISUAL CHECK :
Complete set, no bent or broken.
A. CLEAN OFFLOADER UNIT VISUAL CHECK :
B. CLEAN BACK SIDE OF MACHINE - No dust acumulation.
5 R ACTIVITY
C. CLEAN PELLET STATION - No cull, pellet or broken pellet scattered.
D. EMPTY BOX COOL WATER BIN
CHECK TABLES / TROLLEYS AND VISUAL CHECK :
ESD
PLATFORM GROUNDING PROPERLY CONNECTED / NOT LOOSE
CHECKED BY SHIFT LEADER (ERN)
WEEKLY CLEANING CHECKLIST WW ….. WW ….. WW ….. WW …..

DAY …………………………… …………………………… …………………………… ……………………………
TECH. ERN / GROUP ……… / ….. ……… / ….. ……… / ….. ……… / …..
- CLEAN IN MAG. AREA, ROTARY/TURNTABLE VISUAL CHECK: No dust/dirt accumulation.
INPUT STATION
- CLEAN SURROUNDING INPUT STATION VISUAL CHECK: No dust/dirt accumulation.
- CLEAN PELLET FEEDER, PELLET HOPPER, VISUAL CHECK:
PELLET STATION PELLET HOLDER & PELLET SHOOTER No dust/dirt accumulation
- CLEAN AREA SURROUNDING PELLET STATION VISUAL CHECK: No dust & pellet scattered.
- CLEAN INSIDE ONLOADER UNIT VISUAL CHECK:
ONLOADER STATION - CLEAN HOLD DOWN STRIPS & GUIDE PINS No dust/dirt accumulation.
- CLEAN PELLET GUIDE AND PELLET SHUTTER No jamming mechanism.
- CLEAN GRIPPER SLOT AREA, INTERLOCK AND VISUAL CHECK:
SURROUNDING AREA No dust, dirt, cull & pellet scattered.
MOLD TOOL STATION
- CLEAN ALL PLUNGER AND POT BUSHING VISUAL CHECK:
No dust accumulation, no chip or broken
- CLEAN INSIDE OFFLOADER UNIT VISUAL CHECK:
OFFLOADER STATION - CLEAN CULL DETECTION ROD & VACUUM PAD No dust/dirt accumulation.
- CLEAN CLEANING BRUSHES No jamming mechanism.
- CLEAN CARRIER, PICK UP UNIT, CULL CLAMPER VISUAL CHECK:
OUTPUT STATION CULL SEPARATOR & OUT MAG. AREA No dust, dirt, cull & pellet scattered.
- CLEAN AREA SURROUNDING OUTPUT STATION VISUAL CHECK: No dust/dirt accumulation.
VACUUM - CLEAN VACUUM FILTER No dust/dirt accumulation
- CLEAN TOP, BACK DOOR/COVER AND VISUAL CHECK:
GENERAL HOUSE KEEPING
UNDERNEATH OF THE MACHINE No dust, dirt, cull & pellet scattered.

NOTE : 1. For daily checking tasks will not require m/c shutdown. LEGEND : "V" - GOOD, "X" - CORRECTIVE ACTION REQUIRED, "C" - CORRECTED
2. For weekly cleaning tasks will require m/c shutdown for 2 (two) hour.
3. If the machine is shutdown or heaters is "OFF" for 24 hours (1 day), then no need to do daily checking activity
4. If the machine is shutdown or heaters is "OFF" for 24 hours (1 day), then weekly cleaning must be performed wherever it is possible.
AS9093 A
Page 66 of 83
Title:
12.19. APPENDIX 7C – FICO AUTOMOLD MAINTENANCE CHECKLIST
FICO AUTOMOLD MAINTENANCE CHECKLIST

DAILY CHECKLIST WW ….. WW ….. WW ….. WW …..
YEAR : ……………………… S M T W T F S S M T W T F S S M T W T F S S M T W T F S
SYSTEM NO. : ……………………… DAY U O U E H R A U O U E H R A U O U E H R A U O U E H R A
MOLD TOOL NO. : ……………………… N N E D U I T N N E D U I T N N E D U I T N N E D U I T
GROUP
TECH. ERN
CHECK MOLD HEATERS STATUS Mold heaters "ON" Station 1 Station 2
MOLD HEATERS
Mold heaters "OFF" Station 3 Station 4
CHECK ALIGNMENT BETWEEN SUBS. PUSHER, VISUAL CHECK :
INPUT STATION
TRACK & LOADING TURN TABLE Subs. Smoothly move and allign to the track.
CHECK ALIGNMENT AT : - LOADING TURN TABLE VISUAL CHECK :
- MOLD CHASE Properly allign.
- PELLET SEPARATOR
PICK AND PLACE UNIT
- TURN OVER UNIT
CHECK ALL PINS ( ORIENT., SUBS. PRESENT VISUAL CHECK :
AND GRIPPER. Complete set, no bent or broken.
A. CLEAN THE CLEANING UNIT VISUAL CHECK :
5 R ACTIVITY B. CLEAN BACK SIDE OF MACHINE - No dust acumulation.
C. CLEAN THE PELLET HOPPER - No cull, pellet or broken pellet scattered.
CHECK TABLES / TROLLEYS AND VISUAL CHECK :
ESD
PLATFORM GROUNDING PROPERLY CONNECTED / NOT LOOSE
WEEKLY CLEANING CHECKLIST WW ….. WW ….. WW ….. WW …..

DAY …………………………… …………………………… …………………………… ……………………………
TECH. ERN / GROUP ……… / ….. ……… / ….. ……… / ….. ……… / …..
INPUT STATION - CLEAN THE LOADING UNIT VISUAL CHECK: No dust/dirt accumulation.
- CLEAN PELLET HOPPER & PELLET BRAKER VISUAL CHECK:
No dust/dirt accumulation
PELLET STATION
- CLEAN PELLET SEPARATOR, PELLET CARRIER VISUAL CHECK:
& DOWNLOAD UNIT. No dust & pellet scattered.
- CLEAN UNDER THE MOLDS & INSIDE FRONT VISUAL CHECK:
COVERING No dust, dirt, cull & pellet scattered.
MOLD TOOL STATION - CLEAN THE CULL DETECTOR SENSOR VISUAL CHECK: No dust/dirt block it.
- CLEAN ALL PLUNGER AND POT BUSHING VISUAL CHECK:
No dust accumulation, no chip or broken
- CLEAN INSIDE PICK AND PLACE UNIT VISUAL CHECK: No dust/dirt accumulation.
PICK & PLACE UNIT - CLEAN HOLD DOWN STRIPS & GUIDE PINS VISUAL CHECK: No dust/dirt accumulation.
No jamming mechanism.
DEGATING UNIT - CLEAN DEGATING TURNTABLE AND PUSHER VISUAL CHECK: No dust/dirt accumulation.
OFFLOADING UNIT - CLEAN THE OFFLOADING UNIT VISUAL CHECK: No dust/dirt accumulation.
- CLEAN HAND EXHAUST & PELLET TRANSPORT VISUAL CHECK:
VACUUM UNIT FILTER CANISTER No dust/dirt accumulation
- CLEAN & EMPTY EXHAUST UNIT FILTER BOX VISUAL CHECK: No dust/dirt accumulation.
- CLEAN FRONT & REAR LEXAN PANELS VISUAL CHECK:
GENERAL HOUSE KEEPING
- CLEAN UNDERNEATH THE MACHINE No dust, dirt, cull & pellet scattered.
NOTE : 1. For daily checking tasks will not require m/c shutdown. LEGEND : "V" - GOOD, "X" - CORRECTIVE ACTION REQUIRED, "C" - CORRECTED
2. For weekly cleaning tasks will require m/c shutdown for 2 (two) hour.
3. If the machine is shutdown or heaters is "OFF" for 24 hours (1 day), then no need to do daily checking activity
4. If the machine is shutdown or heaters is "OFF" for 24 hours (1 day), then weekly cleaning must be performed wherever it is possible.
AS9093 A
Page 67 of 83
Title:
12.20. APPENDIX 8A – MOLD COMPOUND LOADING HISTORY
MOLDING COMPOUND LOADING HISTORY
SYSTEM:
COMPOUND LOADING THAWING EXPIRATION UNLOADING
NO ERN ERN
TYPE IQA No. DATE TIME DATE TIME DATE TIME
Note :
1. Loading date means time of filling compound to the compound loader.
2. Unloading date means time of removing compound from the compound loader.
3. If undloading date is no record, means the compound is totally used for production.
AS 9093 : ASSEMBLY SFECIFICATION FOR ENCAPSULATION OF BGA (Ball Grid Array) AND LGA (Land Grid Array) PACKAGES
Revision : 02
AS9093 A
Page 68 of 83
Title:
12.21. TABLE 2. QUALIFIED MOLDING COMPOUND.

This table does not define the requirements for production lot but an aid to the requirements prescribed in
the Process Traveller (PT).
PART NUMBER DESCRIPTION DIA x WT. PACKAGE MACHINE
PBGA 23x23, 7UP TOWA
31772184 EME7720TA 13 x 4.8
31772180 EME7720TA 14 x 4.5 FBGA 197.5x50 STRIP TOWA
31772181 EME7720TA 14 x 6.2
FBGA 233x62 STRIP FICO
31772185 EME7720TA 16 x 8.2 PBGA 35x35, 4UP TOWA
31100178 HC100-XJAA 14 x 4.5 FBGA 197.5x50 STRIP TOWA
FBGA 233x62 STRIP TOWA
31100188 HC100-XJAA 14 x 6.2
PBGA 40x40,5 UP TOWA
31760189 EME G760V 14 x 6.3
FBGA 233x62 STRIP TOWA
31760190 EME G760V 14 x 4.6 FBGA 197.5x50 STRIP TOWA
31760192 EME G760V 16 x 8.5 PBGA 35x35, 4UP TOWA
31760211 EME G760V 13 x 4.9
31770253 EME G770LG 14 x 5.8 FBGA 234x62, MCH 0.7 ASAHI
PBGA 14x22, 10UP ASAHI
31770255 EME G770 14 x 4.7 PBGA 27x27, 8UP ASAHI
FBGA 234x62, MCH 0.5 ASAHI
31770256 EME G770SF 14 x 4.7 PBGA 27x27, 8UP ASAHI
NITTO
31100276 14 x 4.7 PBGA 27x27, 8UP ASAHI
GE100LFCSV
NITTO FBGA 233x62 STRIP TOWA
31100269 14 x 6.3
GE100LFCSV FBGA 233x62 STRIP FICO
SHINETSU
31358250 14 x 5.8 FBGA 234x62, MCH 0.7 ASAHI
KMC3580L
SHINETSU
31358251 14 x 4.7 PBGA 27x27, 8UP ASAHI
KMC-3580LVA
SHINETSU
31358266 14 x 5.8 FBGA 234x62, MCH 0.7 ASAHI
KMC-3580LVA
SHINETSU
31358268 14 x 4.7 PBGA 27x27, 8UP ASAHI
KMC3580L
12.22. TABLE 3. QUALIFIED MOLD CLEANING MATERIALS

AS9093 A
Page 69 of 83
Title:
TABLE 3. QUALIFIED MOLD CLEANING MATERIALS

PART DESCRIPTION SIZE PACKAGE MACHINE
69A00001 MELAMINE 13 x 4.0
PBGA27x27, 12UP TOWA
69A00002 MELAMINE 16 x 6.0 PBGA 35x35, 4UP TOWA
69A00003 MELAMINE 14 x 6.0 PBGA 23x23, 14UP TOWA, ASAHI
TOWA, FICO,
64132008 Superclean (SC5000) 235 x 15 x 5 ALL PACKAGES
ASAHI
12.23. TABLE 4. QUALIFIED MOLD CONDITIONING MATERIALS
TABLE 4. QUALIFIED MOLD CONDITIONING MATERIALS

PART
DESCRIPTION SIZE PACKAGE MACHINE
NUMBER
69A00101 KNR-2 13 x 4.6
69A00107 KNR-2 16 x 8.2 PBGA 35x35, 4UP TOWA
69A00108 EMEC110S 13 x 5.1
ALL PACKAGES ASAHI
TOWA, FICO,
64132009 Superwax (SW 9000) 230 x 15 x 5 ALL PACKAGES
ASAHI
12.24. TABLE 5. QUALIFIED PAPER FRAME
TABLE 5. QUALIFIED PAPER FRAME

PART DESCRIPTION PACKAGE MACHINE
NUMBER
5E0000FC FBGA Paper Substrate FBGA 233X62 mm STRIP Towa / Fico / Asahi
AS9093 A
Page 70 of 83
Title:
12.25. TABLE 6. MOLD CLEANING AND CONDITIONING REQUIREMENTS
Table 6. MOLD CLEANING AND CONDITIONING REQUIREMENTS

CLEANING TYPE CONDITIONING TYPE MINIMUM
CODNITIONS – MOLD TRANSFER COMPRESSION TRANSFER COMPRESSION DUMMY
COMPOUND TYPE
Mold Cure Mold Cure Mold Cure Mold Cure Mold Shot
Shot Time Shot Time Shot Time Shot Time
Every 4 hours during
continuous running – ALL
– – – – 2–4 240 sec 2–4 240 sec 2–4
Compounds,
(Applicable for Fico only)
Sixteen (16) hours after last
shot and no significant stain
– – – – 2–4 240 sec 2–4 240 sec 2–4
on cavity surface – ALL
Compounds
Evidence of significant stain
on the surface of cavity or
reached required number of – – 4 240 sec – – 2–4 240 sec 2–4
production shots –
EME7720TA, G760V
Evidence of significant stain
on the surface of cavity or
reached required number of – – 4 240 sec 2–4 240 sec 2–4 240 sec 2–3
production shots – HC-100-
XJAA.
Different mold compound
type preceded the
compound to be used and
– – 4 240 sec – – 2–4 240 sec 2–3
no stain on the mold surface
– ALL COMPOUND
TYPES.
The number on Shot
2–4
counter shows 600 – EME 4 240 s 4 240 s 240 sec 3–4 240 sec 1–2
(KNR-2)
7720 TA
The number on Shot
counter shows 400 – EME- 2–4
4 240 s 4 240 s 240 sec 3–4 240 sec 1–2
G760V, HC-100-XJAA and (KNR-2)
other green compound type
Note : The requirement stated both of transfer and compressive are choose one of the type, or mix each other
with same total number of shot.
AS9093 A
Page 71 of 83
Title:
12.26. TABLE 7. MOLD CLEANING AND CONDITIONER SHEETS PLACEMENT.
Strips on the cavity bars must be centered with respect to the cavity bars, and strips on the center
block must be placed right over the pots.
TABLE 7. MOLD CLEANING / CONDITIONER SHEETS PLACEMENT.
NUMBER OF LAYER PER SYSTEM

Towa / Fico / Asahi
MOLD CHASE
MACHINE MODEL
DESCRIPTION CENTER
LEFT CAV RIGHT CAV
BLOCK /
BAR BAR
POT
All PBGA
Towa Y-Series / Fico
FBGA 233x62 mm strip
AMS –36 – M2 / 1/1/1 1/1/1 1 / 1/ 1
FBGA 197.5x50 mm strip
Asahi Cosmo
FBGA 234x62 mm stril
CLEANING SHEET PLACEMENT REQUIREMENTS (Looking at end or from operator side).
Pot
Bushing
AS9093 A
Page 72 of 83
Title:
12.27. TABLE 8. FICO TRANSFER PARAMETERS TABLE USING EME G760V Size 14mm x 6.3gr
FICO MOLD USING EME G760V or Series of EME G760 Size 14 x 6.3gr
Substrate Pellet
Package Mold Cap Mold Transfer Transfer Transfer Clamping Cure
Ball Package Preheat Preheat
No. Reference Size Height Temp Time Pressure Distance Pressure Time
Count Type Temp Time
(mm) (mm) (deg. C) (deg. C) (sec) (PSI) (mm) (tonF) (sec) (sec)
1. Fico FB01 4.5 x 7.0 0.5 52 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
2. Fico FB01 6.0 x 6.0 0.5 64 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
3. Fico FB01 6.0 x 7.0 0.5 48 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
4. Fico FB01 6.0 x 8.0 0.5 48 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
5. Fico FB01 7.0 x 7.0 0.5 48 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
6. Fico FB01 8.0 x 9.5 0.5 48 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
7. Fico FB01 6.0 x 6.0 0.5 100 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
8. Fico FB01 8.0 x 8.0 0.5 196 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
9. Fico FB17 7.0 x 7.0 0.5 129 FBGA 175 ± 5 175 ± 10 11.6 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
10. Fico FB03 7.0 x 7.0 0.7 64 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 90
11. Fico FB03 7.0 x 7.0 0.7 72 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 90
12. Fico FB03 9.9 x 9.9 0.7 140 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 90
13. Fico FB05 8.0 x 8.0 0.7 64 FBGA 175 ± 5 175 ± 10 8.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
14. Fico FB08 5.5 x 13.5 0.7 96 FBGA 175 ± 5 175 ± 10 12.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
15. Fico FB08 7.0 x 7.0 0.7 49 FBGA 175 ± 5 175 ± 10 12.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
16. Fico FB09 5.5 x 16.0 0.7 114 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 90
17. Fico FB11 8.0 x 8.0 0.7 64 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
18. Fico FB11 8.0 x 8.0 0.7 81 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
19. Fico FB11 8.0 x 8.0 0.7 145 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
20. Fico FB11 8.0 x 8.0 0.7 196 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
21. Fico FB11 12.0 x 12.0 0.7 196 LGMA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
22. Fico FB11 All Size 0.7 ALL FLIP CHIP 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
23. Fico FB13 15.0 x 15.0 0.7 256 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
24. Fico FB14 13.0 x 13.0 0.7 144 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
25. Fico FB14 13.0 x 13.0 0.7 169 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
26. Fico FB14 13.0 x 13.0 0.7 288 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
27. Fico FB14 13.0 x 13.0 0.7 361 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
28. Fico FB14 14.0 x 14.0 0.7 289 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
29. Fico FB15 15.0 x 15.0 0.7 208 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
30. Fico FB15 15.0 x 15.0 0.7 196 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
31. Fico FB15 15.0 x 15.0 0.7 236 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
32. Fico FB15 15.0 x 15.0 0.7 265 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
33. Fico FB15 15.0 x 15.0 0.7 289 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
34. Fico FB15 17.0 x 17.0 0.7 256 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
35. Fico FB15 17.0 x 17.0 0.7 280 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
36. Fico FB15 17.0 x 17.0 0.7 361 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
37. Fico FB15 19.0 x 19.0 0.7 324 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
38. Fico FB16 13.0 x 15.1 0.5 165 FBGA 175 ± 5 175 ± 10 13 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
39. FicoG760V - 1 Generic 0.5 ALL FBGA 175 ± 10 175 ± 10 11.5 ± 6 900 - 1300 21 ± 1 30 ± 10 5±5 90
40. FicoG760V - 2 Generic 0.7 ALL FBGA 175 ± 10 175 ± 10 13.5 ± 6 900 - 1300 21 ± 1 30 ± 10 5±5 90
Note :
1. Generic is applicable for all packages that have no specific setting parameters or new package using above
mold compound
2. Use bottom loading bar vacuum suction.
AS9093 A
Page 73 of 83
Title:
12.28. TABLE 9. FICO TRANSFER PARAMETERS TABLE USING EME 7720TA Size 14mm x 6.2gr
FICO MOLD USING EME 7720TA or Series of EME 7720 SIZE 14 x 6.2gr
Substrate Pellet
1. Fico FB02 4.5 x 7.0 0.5 52 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 60
2. Fico FB04 7.0 x 7.0 0.7 64 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 60
3. Fico FB04 7.0 x 7.0 0.7 72 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 60
4. Fico FB06 8.0 x 8.0 0.7 64 FBGA 175 ± 5 175 ± 10 8.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 60
5. Fico FB07 8.0 x 8.0 0.7 81 FBGA 175 ± 5 175 ± 10 8±2 900 - 1300 21 ± 1 30 ± 10 5±5 60
6. Fico FB10 5.5 x 16.0 0.7 114 FBGA 175 ± 5 175 ± 10 8.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 60
6. Fico FB12 5.5 x 13.5 0.7 96 FBGA 175 ± 5 175 ± 10 10 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 60
7. Fico7720TA - 1 Generic 0.5 ALL FBGA 175 ± 10 175 ± 10 10 ± 6 900 - 1300 21 ± 1 30 ± 10 5±5 60
8. Fico7720TA - 2 Generic 0.7 ALL FBGA 175 ± 10 175 ± 10 10 ± 6 900 - 1300 21 ± 1 30 ± 10 5±5 60
Note :
mold compound.
2. Use bottom loading bar vacuum suction.
12.29. TABLE 10. TOWA TRANSFER PARAMETERS TABLE USING EME G760V Size 14mm x 6.3gr
TOWA MOLD USING EME G760V or Series of EME G760 SIZE 14mm X 6.3gr
Substrate Pellet
(mm) (mm) (deg. C) (deg. C) (sec) (ton) (mm) (tonF) (sec) (sec)
1. Towa 32 LGMA 13.0 x 13.0 1.1 32 LGMA 175 ± 5 165 ± 25 13 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
2. Towa FB03 4.5 x 7.0 0.5 52 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
3. Towa FB03 6.0 x 7.0 0.5 48 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
4. Towa FB03 6.0 x 8.0 0.5 48 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
5. Towa FB03 7.0 x 7.0 0.5 48 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
6. Towa FB03 8.0 x 9.5 0.5 48 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
4. Towa FB03 5.0 x 5.0 0.5 64 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
5. Towa FB03 6.0 x 6.0 0.5 64 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
6. Towa FB03 8.0 x 8.0 0.5 184 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
7. Towa FB03 8.0 x 8.0 0.5 196 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
8. Towa FB03 6.0 x 6.0 0.5 100 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
9. Towa FB03 7.0 x 7.0 0.5 129 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
10. Towa FB 008 7.0 x 7.0 0.7 49 FBGA 175 ± 5 165 ± 25 13 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
11. Towa FB 008 5.5 x 13.5 0.7 96 FBGA 175 ± 5 165 ± 25 13 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
12. Towa FB 011 8.0 x 8.0 0.7 81 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
13. Towa FB 011 8.0 x 8.0 0.7 145 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
14. Towa FB 014 8.0 x 8.0 0.7 196 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
15. Towa FB 016 8 x 13 0.5 150 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
16. Towa FB 016 5 x 11.5 0.5 96 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
17. Towa FB 017 17.0 x 17.0 0.9 256 FBGA 175 ± 5 165 ± 25 13.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
18. Towa FB 018 6 x 15 0.5 176 FBGA 175 ± 5 165 ± 25 14 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
19. Towa FB 019 5.0 x 5.0 0.5 56 FBGA 175 ± 5 165 ± 25 11.0 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
20. Towa G760V Generic ALL ALL FBGA 175 ± 5 165 ± 25 11.0 ± 5 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
AS9093 A
Page 74 of 83
Title:
Note :
mold compound.
2. No bottom loading bar vacuum suction.
Substrate Pellet
1. Towa FB01 4.5 x 7.0 0.5 52 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
4. Towa FB04 5.0 x 5.0 0.5 64 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
4. Towa FB07 5.5 x 13.5 0.7 96 FBGA 175 ± 5 165 ± 25 12.5 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
5. Towa FB09 ALL 0.5 100 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
7. Towa FB 012 9 x 13 0.5 160 FBGA 175 ± 5 165 ± 25 12.5 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
8. Towa FB 013 8.0 x 8.0 0.5 184 FBGA 175 ± 5 165 ± 25 13.0 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
9. TOWA G760V - 1 Generic ALL ALL FBGA 175 ± 5 165 ± 25 12.0 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
Note :
mold compound.
12.31. TABLE 12. TOWA TRANSFER PARAMETERS TABLE USING NITTO HC100XJ Size 14mm x 6.2gr
TOWA MOLD USING EME 7720TA or Series of EME 7720 SIZE 14mm X 6.2gr
Substrate Pellet
1 Towa FB 005 8.0 X 8.0 0.7 81 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 60
2 Towa FB 015 5.5 X 13.6 0.7 96 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 60
3. Towa 7720TA - 1 Generic 0.5 / 0.7 ALL FBGA 175 ± 5 165 ± 25 12 ± 6 0.9 - 1.3 15 ± 1 30 ± 10 5±5 60
Note :
mold compound.
2. No bottom loading bar vacuum suction
12.32. TABLE 13. TOWA TRANSFER PARAMETERS TABLE USING EME 7720TA Size 14mm x 4.5gr
TOWA MOLD USING EME 7720TA SIZE 14mm X 4.5gr
Substrate Pellet
1 Towa FB 002 4.5 x 7.0 0.5 52 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 60
2 Towa FB 006 5.5 x 13.6 0.7 96 FBGA 175 ± 5 165 ± 25 9±2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 60
3 Towa FB 010 11.0 x 11.0 0.7 100 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 60
4. Towa 7720TA - 2 Generic 0.5 / 0.7 ALL FBGA 175 ± 5 165 ± 25 12 ± 6 0.9 - 1.3 15 ± 1 30 ± 10 5±5 60
Note :
mold compound.
AS9093 A
Page 75 of 83
Title:
12.33. TABLE 14. TOWA TRANSFER PARAMETERS TABLE USING NITTO HC100XJAA Size 14mm x 4.5gr
TOWA MOLD USING NITTO HC100XJAA SIZE 14mm X 4.5gr
Substrate Pellet
1. Towa LG 001 3.0 x 3.0 0.5 9 LGMA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
2. Towa LG Nitto Generic ALL ALL LGMA 175 ± 5 165 ± 25 11.5 ± 6 0.9 - 1.3 15 ± 1 30 ± 10 5±5 90
Note :
mold compound.
2. No bottom loading bar vacuum suction
Substrate Pellet
1. TOWA PB 001 23 x 23 1.17 ALL PBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 19 ± 1 30 ± 10 5±5 90
2. TOWA PB 002 27 x 27 1.17 ALL PBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 19 ± 1 30 ± 10 5±5 90
Substrate Pellet
1. TOWA PB 003 35 x 35 1.17 ALL PBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 19 ± 1 30 ± 10 5±5 90
2. TOWA PB 004 40 x 40 1.17 ALL PBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 19 ± 1 30 ± 10 5±5 90
12.36. TABLE 17. ASAHI TRANSFER PARAMETERS TABLE USING EME G770 Size 14mm x 5.8gr
ASAHI MOLD USING EME G770 Series Size 14mm x 5.8gr
L/F PHT Pellet
Package Temp of Mold Clamping Injection Package Transfer Cure
Ball Package on L/F loading
No Process Program Name Size L/F Heater Temperture Force Time Pressure Distance Time
Count Type Heater delay time
(mm) (deg. C) (sec) (sec) (deg. C) (ton) (sec) (kgf/cm2) (mm) (sec)
1. BC256_CBGA_0.7t_LF0.36mm ALL 256 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.6 ± 2 70 ± 10 31.5 ± 1 85
2. BC256_CBGA_0.7t_LF0.58mm_vacuum ALL 256 FBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10.3 ± 2 70 ± 10 31.5 ± 1 85
3. BC256_CBGA_0.7t_LF0.58mm ALL 256 FBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.8 ± 2 70 ± 10 31.5 ± 1 85
4. BF208_CBGA_0.7t_LF0.36mm_vacuum ALL 208 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10 ± 2 70 ± 10 31.5 ± 1 85
5. BF208_CBGA_0.7t_LF0.36mm ALL 208 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.6 ± 2 70 ± 10 31.5 ± 1 85
6. BF208_CBGA_0.7t_LF0.58mm_vacuum ALL 208 FBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10 ± 2 70 ± 10 31.5 ± 1 85
7. BF208_CBGA_0.7t_LF0.58mm ALL 208 FBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 7.5 ± 2 70 ± 10 31.5 ± 1 85
8. BF96_CBGA_0.7t_LF0.36mm_vacuum 5.5 x 13.5 96 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10 ± 2 70 ± 10 31.5 ± 1 85
9. BF96_CBGA_0.7t_LF0.36mm 5.5 x 13.5 96 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 7.1 ± 2 70 ± 10 31.5 ± 1 90
Legend
L/F = Leadframe PHT = Pre-Heat Time
Note :
1. Except specified on the program name, Mold compound is applicable for EME G770, EME G770LG, EME G770SF and Nitto GE100LFCSV
2. Mold Compound Size 14mm x 5.8gr is applicable for Mold Cap Height 0.7 mm, The rest packages are use size 14mm x 4.7gr
AS9093 A
Page 76 of 83
Title:
12.37. TABLE 18. ASAHI TRANSFER PARAMETERS TABLE USING EME G770 Size 14mm x 4.7gr
ASAHI MOLD USING EME G770 Series Size 14mm x 4.7gr
L/F PHT Pellet
Package Temp of Mold Clamping Injection Package Transfer Cure
No Process Program Name Size L/F Heater Temperture Force Time Pressure Distance Time
1. BB416_PBGA_27x27_Thick 27x27 416 PBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 8±2 70 ± 10 31.5 ± 1 90
2. BG119_PBGA_14x22_Thick 14x22 119 PBGA 120 ± 20 20 - 40 0 - 40 180 ± 5 30 ± 10 8.5 ± 2 70 ± 10 28.0 ± 1 100
3. BG272_PBGA_27x27_Thick 27x27 272 PBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 8 ±2 70 ± 10 28.0 ± 1 90
4. BVG52_CBGA_0.5t_LF0.21mm_vacuum 4.5 x 7.0 52 FBGA 70 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 8.6 ± 2 70 ± 10 28.0 ± 1 85
5. BVG52_CBGA_0.5t_LF0.21mm 4.5 x 7.0 52 FBGA 70 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.2 ± 2 70 ± 10 28.0 ± 1 85
6. PBGA_14x22_Thin 14x22 Generic PBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.8 ± 2 70 ± 10 28.0 ± 1 90
7. PBGA_27x27_Thin 27x27 Generic PBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.8 ± 2 70 ± 10 28.0 ± 1 90
Legend
Note :
12.38. TABLE 19. ASAHI TRANSFER PARAMETERS TABLE USING SHINETSU KMC3580 Series Size
14mm x 5.8gr
ASAHI MOLD USING SHINETSU KMC3580 Series Size 14mm x 5.8gr
L/F PHT Pellet
Package Temp of L/F Mold Clamping Injection Package Transfer Cure
No Process Program Name Size Heater Temperture Force Time Pressure Distance Time
1. BC256_CBGA_0.7t_LF0.36mm_vacuum_Shinetsu ALL 256 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10 ± 2 70 ± 10 31.5 ± 1 85
2. BC256_CBGA_0.7t_LF0.58mm_vacuum_Shinetsu ALL 256 FBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10 ± 2 70 ± 10 31.5 ± 1 85
3. BC256_CBGA_0.7t_LF0.58mm_Shinetsu ALL 256 FBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.8 ± 2 70 ± 10 31.5 ± 1 85
4. BF208_CBGA_0.7t_LF0.36mm_vacuum_Shinetsu ALL 208 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10 ± 2 70 ± 10 31.5 ± 1 85
5. BF208_CBGA_0.7t_LF0.36mm_Shinetsu ALL 208 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.6 ± 2 70 ± 10 31.5 ± 1 85
6. BF208_CBGA_0.7t_LF0.58mm_vacuum_Shinetsu ALL 208 FBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10 ± 2 70 ± 10 31.5 ± 1 85
7. BF208_CBGA_0.7t_LF0.58mm_Shinetsu ALL 208 FBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 7.5 ± 2 70 ± 10 31.5 ± 1 85
8. BF96_CBGA_0.7t_LF0.36mm_vacuum_Shinetsu 5.5 x 13.5 96 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 10 ± 2 70 ± 10 31.5 ± 1 85
9. BF96_CBGA_0.7t_LF0.36mm_Shinetsu 5.5 x 13.5 96 FBGA 100 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 7.1 ± 2 70 ± 10 31.5 ± 1 90
Legend
Note :
12.39. TABLE 20. ASAHI TRANSFER PARAMETERS TABLE USING SHINETSU KMC3580 Series Size
14mm x 4.7gr
ASAHI MOLD USING SHINETSU KMC3580 Series Size 14mm x 4.7gr
L/F PHT Pellet
Package Temp of L/F Mold Clamping Injection Package Transfer Cure
No Process Program Name Size Heater Temperture Force Time Pressure Distance Time
1. BB416_PBGA_27x27_Thick_Shinetsu 27x27 416 PBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 8±2 70 ± 10 31.5 ± 1 90
2. BG119_PBGA_14x22_Thick_Shinetsu 14x22 119 PBGA 120 ± 20 20 - 40 0 - 40 180 ± 5 30 ± 10 8.5 ± 2 70 ± 10 28.0 ± 1 100
3. BG272_PBGA_27x27_Thick_Shinetsu 27x27 272 PBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 8 ±2 70 ± 10 28.0 ± 1 90
4. BVG52_CBGA_0.5t_LF0.21mm_vacuum_Shinetsu 4.5 x 7.0 52 FBGA 70 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 8.6 ± 2 70 ± 10 28.0 ± 1 85
5. BVG52_CBGA_0.5t_LF0.21mm_Shinetsu 4.5 x 7.0 52 FBGA 70 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.2 ± 2 70 ± 10 28.0 ± 1 85
6. PBGA_14x22_Thin_Shinetsu 14x22 Generic PBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.8 ± 2 70 ± 10 28.0 ± 1 90
7. PBGA_27x27_Thin_Shinetsu 27x27 Generic PBGA 120 ± 20 20 - 40 0 - 40 175 ± 5 30 ± 10 6.8 ± 2 70 ± 10 28.0 ± 1 90
Legend
Note :
AS9093 A
Page 77 of 83
Title:
12.40. TABLE 21. FICO TRANSFER PARAMETERS TABLE USING NITTO GE100 Series Size 14mm x 6.3gr
FICO MOLD USING NITTO GE100LFCSV or Series of Nitto Low Alpha

Substrate Pellet
1. Fico FB01 4.5 x 7.0 0.5 52 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
2. Fico FB01 6.0 x 6.0 0.5 64 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
3. Fico FB01 7.0 x 7.0 0.5 48 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
4. Fico FB01 6.0 x 6.0 0.5 100 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
5. Fico FB01 8.0 x 8.0 0.5 196 FBGA 175 ± 5 175 ± 10 11.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
6. Fico FB17 7.0 x 7.0 0.5 129 FBGA 175 ± 5 175 ± 10 11.6 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
7. Fico FB03 7.0 x 7.0 0.7 64 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 90
8. Fico FB03 7.0 x 7.0 0.7 72 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 90
9. Fico FB03 9.9 x 9.9 0.7 140 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 90
10. Fico FB05 8.0 x 8.0 0.7 64 FBGA 175 ± 5 175 ± 10 8.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
11. Fico FB08 5.5 x 13.5 0.7 96 FBGA 175 ± 5 175 ± 10 12.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
12. Fico FB08 7.0 x 7.0 0.7 49 FBGA 175 ± 5 175 ± 10 12.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
13. Fico FB09 5.5 x 16.0 0.7 114 FBGA 175 ± 5 175 ± 10 9±2 900 - 1300 21 ± 1 30 ± 10 5±5 90
14. Fico FB11 8.0 x 8.0 0.7 64 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
15. Fico FB11 8.0 x 8.0 0.7 81 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
16. Fico FB11 8.0 x 8.0 0.7 145 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
17. Fico FB11 8.0 x 8.0 0.7 196 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
18. Fico FB11 12.0 x 12.0 0.7 196 LGMA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
19. Fico FB13 15.0 x 15.0 0.7 256 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
20. Fico FB14 13.0 x 13.0 0.7 144 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
21. Fico FB14 13.0 x 13.0 0.7 169 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
22. Fico FB14 13.0 x 13.0 0.7 288 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
23. Fico FB14 13.0 x 13.0 0.7 361 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
24. Fico FB14 14.0 x 14.0 0.7 289 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
25. Fico FB15 15.0 x 15.0 0.7 208 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
26. Fico FB15 15.0 x 15.0 0.7 196 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
27. Fico FB15 15.0 x 15.0 0.7 236 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
28. Fico FB15 15.0 x 15.0 0.7 265 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
29. Fico FB15 15.0 x 15.0 0.7 289 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
30. Fico FB15 17.0 x 17.0 0.7 256 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
31. Fico FB15 17.0 x 17.0 0.7 280 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
32. Fico FB15 17.0 x 17.0 0.7 361 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
33. Fico FB15 19.0 x 19.0 0.7 324 FBGA 175 ± 5 175 ± 10 13.5 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
34. Fico FB16 13.0 x 15.1 0.5 165 FBGA 175 ± 5 175 ± 10 13 ± 2 900 - 1300 21 ± 1 30 ± 10 5±5 90
35. FicoGE100LFCSV - 1 Generic 0.5 ALL FBGA 175 ± 10 175 ± 10 11.5 ± 6 900 - 1300 21 ± 1 30 ± 10 5±5 90
36. FicoGE100LFCSV - 2 Generic 0.7 ALL FBGA 175 ± 10 175 ± 10 13.5 ± 6 900 - 1300 21 ± 1 30 ± 10 5±5 90
AS9093 A
Page 78 of 83
Title:
12.41. TABLE 22. TOWA TRANSFER PARAMETERS TABLE USING NITTO GE100 Series Size 14mm x 6.3gr
TOWA MOLD NITTO GE100LFCSV or Series of Nitto Low Alpha

Substrate Pellet
1. Towa 32 LGMA 13.0 x 13.0 1.1 32 LGMA 175 ± 5 165 ± 25 13 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
2. Towa FB03 4.5 x 7.0 0.5 52 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
3. Towa FB03 6.0 x 7.0 0.5 48 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
4. Towa FB03 6.0 x 8.0 0.5 48 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
5. Towa FB03 7.0 x 7.0 0.5 48 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
6. Towa FB03 8.0 x 9.5 0.5 48 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
4. Towa FB03 5.0 x 5.0 0.5 64 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
5. Towa FB03 6.0 x 6.0 0.5 64 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
6. Towa FB03 8.0 x 8.0 0.5 184 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
7. Towa FB03 8.0 x 8.0 0.5 196 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
8. Towa FB03 6.0 x 6.0 0.5 100 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
9. Towa FB03 7.0 x 7.0 0.5 129 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
10. Towa FB 008 7.0 x 7.0 0.7 49 FBGA 175 ± 5 165 ± 25 13 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
11. Towa FB 008 5.5 x 13.5 0.7 96 FBGA 175 ± 5 165 ± 25 13 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
12. Towa FB 011 8.0 x 8.0 0.7 81 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
13. Towa FB 011 8.0 x 8.0 0.7 145 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
14. Towa FB 014 8.0 x 8.0 0.7 196 FBGA 175 ± 5 165 ± 25 12 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
15. Towa FB 016 8 x 13 0.5 150 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
16. Towa FB 016 5 x 11.5 0.5 96 FBGA 175 ± 5 165 ± 25 11.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
17. Towa FB 017 17.0 x 17.0 0.9 256 FBGA 175 ± 5 165 ± 25 13.5 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
18. Towa FB 018 6 x 15 0.5 176 FBGA 175 ± 5 165 ± 25 14 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
19. Towa FB 019 5.0 x 5.0 0.5 56 FBGA 175 ± 5 165 ± 25 11.0 ± 2 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
20. Towa GE100 Generic ALL ALL FBGA 175 ± 5 165 ± 25 11.0 ± 5 0.9 - 1.3 21 ± 1 30 ± 10 5±5 90
AS9093 A
Page 79 of 83
Title:
12.42. APPENDIX 9. MOLD PARAMETERS BOARD
MOLD PARAMETERS BOARD
MOLD MACHINE :
PACKAGE TYPE :
MOLD CAP HEIGHT :
STRIP OUT LINE :
SYSTEM NO. :
AFFECTED SPEC NO. :
EFFECTIVE DATE :
PARAMETERS UNIT SPECS TARGET
1. Mold Temperature C
2. Transfer Time Sec
3. Pellet Preheat Time Sec
4. Transfer Distance Mm
5. Curing Time Sec
6. Clamping Pressure Tons or Kg/cm²
7. Transfer Pressure Tons or PSI
8. Hot Plate Temperature °C
9. Vacuum Option Yes / No
10. Mold Compound Type N/A
11. Mold Compound Size mm x gr
Reference / Process Program Name :
Acknowledge by: PE EE QA
AS9093 - ASSEMBLY SPECIFICATION FOR ENCAPSULATION OF BGA, LGA AND FLIP CHIP ARRAY PACKAGES Revision : 01
AS9093 A
Page 80 of 83
Title:
1. Transfer Cleaning Procedure
TRANSFER CLEANING PROCEDURE

TRANSFER CLEANING PROCEDURE EXPIRED DATE : NA
FOR
FOR FICO
FICO USING
USING PAPER
PAPER LEADFRAME
LEADFRAME
PROCEDURE RESP
1. Select “Transfer Cleaning” mode (Menu 1.3). Optr
2. Before pressing RUN, open the chase/s to be used manually Tech

using menu 4.1 (password 4).
3. In menu 4.1, select the chase to be opened: 811-M1, 821-M2, Tech

831-M3. Select motor position 5 to open each chase.
4. Insert the substrates (figure 1) and paper leadframe (figure 2) Tech

on each chase.
Figure 1 Figure 2
5. On menu 5.2, set the pellet loading position <28> to 300. Tech
6. Press RUN to start transfer cleani ng process. Optr
7. Machine will ask “Select leadframe loading mode (0=Automatic,

1=Manual)”, Select “1” to run manual transfer cleaning mode. Optr
8. Machine will ask “Select station number to clean (0=Standby, Optr

4=All)”, Select appropriate chase to be cleaned then press RUN.
9. Machine will ask “Insert the leadframes and pellets, then press RUN”. Optr
Put the substrates (figure 1) and leadframes (figure 2).
10. Insert the Melamine Pellets into the pot bushing, then press “RUN”. Optr
11. After mold curing, the machine will ask “Remove material from mold(s).
Optr
(Stop=0, Next Cycle=1) then press RUN”.
12. If “0” is selected, machine will go to standby. If “1” is selected,
repeat items 9 and 10 to continue next cleaning process. Optr
AS9093 A
Page 81 of 83
Title:
2. Magazine Orientation on Fico and Towa Mold
MAGAZINE ORIENTATION ON TOWA MOLD
OFF LOAD DOOR

ON LOA D COVE R MAGAZINE ARROW MAGAZINE ARROW
GOLD
GATE
GOLD GA TE
TOWA MOLD ON-LOAD TOWA MOLD OFF-LOAD
MAGAZINE ORIENTATION ON FICO MOLD

ON LOAD DOOR GOLD GA TE MAGAZINE ARROW GOLD GA TE
OFF LOAD DOOR MAGAZINE ARROW

FICO MOLD ON-LOAD FICO MOLD OFF-LOAD
AS9093 A
Page 82 of 83
Title:
3. Manual Molding Procedure on Fico Mold
MANUAL MOLDING PROCEDURE ON FICO MOLD
MANUAL MOLDING PROCEDURE FOR FICO AMS-36M2
PROCEDURE RESP REMARKS
1. Select “Transfer Cleaning” mode (Menu 1.3). Optr Online
2. Check molding parameters if it is set for production use. PE Online
3. Press RUN to start manual molding process. Optr Online
4. Machine will ask “Select leadframe loading m ode (0=Automatic, Optr Online
1=Manual)”, Select “1” to run manual trans fer cleaning m ode.
5. Machine will ask “Select station number to clean (0=Standby, Optr Online
4=All)”, Select appropriate chase to be used then press RUN.
6. Machine will ask “Insert the leadf rames and pellets, then press RUN”. Optr Online
7. Manual loading of substrate: Optr Offline
a. Place the magazine, containing production material,on the
substrate loading table.
b. Using duckbill tweezer, hold the edge of the strip to the table.
Make sure it is properly positioned on the guide pins.
c. Rotate the table 180° and repeat item b.
d. With substrate grippers opened, place the pellet loader on
the table.
e. Close the grippers.
8. On the HALT status, open the door. Optr Online

9. Place the loader, containing the substrates, into the chase. Make Optr Online
sure the substrates are already flat on the chase.
10. Using the pellet loader, carefully place the pellets into the chase. Optr Online
11. Close the door then press “RUN”. Optr Online

12. Repeat items 6 – 11 when loading production materials until all the Optr Online
selected chases are loaded.
13. Degate the strips carefully using the manual degating jig. Optr Offline
14. Wipe off the mold debris from the degating jig after every degating Optr Offline
process.
15. After mold curing, the machine will ask “Remove material from m old(s ). Optr Online
(Stop=0, Next Cycle= 1) then press RUN”. Remove the material from
chase/s, then press run.
16. Clean the chase/s using vacuum brush or blow gun. Optr Online
17. If “0” is selected, machine will go to standby. If “1” is selected, Optr Online
repeat items 6 - 12 to continue next manual molding process.
AS9093 A
Page 83 of 83
Title:
REVISION HISTORY
Revision
(ECN#) Effective
Description of Change Originator
/Submission Date
Date
Revise para 7.1.3.6.2 and note – add MFG, EE, PE and QC,
para 7.1.3.6.6 – remove word ‘operators’.
Re-phrase Para 7.1.4.3 – change fr “production must submit
one mold shot of production lot to QC for Buy Off” into “if no
L
external defects are found, the same strips…..”
(BT19006) Raynold V. 7-Dec-06
Insert para & subparas 7.1.4.5 and renumber – ITR issuance
29-Nov-06
and Dis-abling of Mold Tool
Update Attachment 3 (positrol plan) – to align with control
plan
M Revise para 1.0 – Purpose, 8.0 – Defect criteria

(BT19250) Iwan Budi 30-Apr-07
Add Parameter Board to include Flip Chip LGMA package
17-Apr-07
Change all attachments to appendix
N
Complete Rewrite
(BT19669) Suprapto 07-Nov-07
Change fr AIT to UNISEM
02-Nov-07
Revise Appendix 4 : to add "Area" and "Date" on Header
- Remove "Spec#'"
- Add "magazine out number"
- Remove '"Mold Cap Height (PT Rqmt / Cav. Bar Mark)"' on
Item 1
- Change "Product type" to "Package type"
- Move column: "Operator ERN / Grp, Time Lot Finish,
P Package Warpage (Min/Max/Ave), Shot Counter, Buy-off and
(BT19730) Monitor, Qty Reject, Defect Code" from item 4 to item 1 Dwi Arif S. 14-Dec-07
03-Dec-07 column
- Add '"<24 hours elapsed after plasma'" on item 2
- re-numbering "legend" on item 3
- Remove column "Number of Pellet Melamine/ Chase, Number
of Cleaning Sheet/ Chase, Number of Pellet Conditioner/ Chase,
Number of Conditioner Sheet/ Chase"...change with column
"Number of Cleaning Shot and Number of Conditioning Shot"
Revise para 12.25 table 6, 12.38 – table 19
Revise para 7.1.3.1.1 – to add “(Machine tag) as illustrated on
para 7.1.3.1.2”, 7.1.3.1.2 – to add “ towa” & “note”, to change
fr “calibration to calibrate”, to add “note”, 7.4.3.4.2 – to change
fr 48 to 24 hours, 7.4.3.4.4 – re-storage the shinetsu
compound…, Appendix 3 – Positrol plan: to change fr Nitto 48
Q
to 24 hours, 12.25 – table 6 : to add “(applicable for fico
(BT20157) Isabella F. 15-Jul-08
only)”, 12.27 – table 8: to change fr FCLGMA to Flip chip”,
15-Jul-08
12.29 – table 10: to insert para table# 8, 9, 16, 12.36 – table
17: to add “note”, 12.37 – table 18: to add “note”, 12.38 –
table 19: to update “note”, 12.39 – table 20: to add “note”,
Add para 12.40, 12.41 and renumber
Revise para 7.1.2.4 – mold compound handling procedure

R
and re-phrase para 7.1.2.3 to phrase 7.1.2.6

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3.0 REFERENCE DOCUMENTS

5.0 SUPPLIES AND MATERIALS

6.0 FORMS AND RECORDS

8.0 MOLD DEFECT DEFINITION AND CRITERIA

9.0 SAFETY AND ENVIRONMENTAL REQUIREMENTS

11.0 TOTAL CONTROL METHODOLOGY

12.0 APPENDIX AND TABLES

3.0. REFERENCE DOCUMENTS

3.1. Towa Mold Y-series operation manual and maintenance manual.

3.2. Fico Mold AMS-36-M2 operation manual and maintenance manual.

3.4. Operating instruction for all mold support equipment.

3.5. Mold Defects Definition & Criteria

3.6. Assembly Control Plan (SOP1158)

3.7. Generic SPC Chart implementation (SC1001)

3.10. Hazardous and Non-hazardous Waste Management (SOP 9229)

3.11. Array Package General Manufacturing Procedures and Requirements (SOP5267)

3.12. QA Molding Monitor (QS 1608)

3.13. Quality Non Conformance Disposition Procedure (SOP 3058)

4.1. Fico Mold AMS-36-M2 and applicable Mold chase.

4.3. Towa Mold Y-series and applicable Mold chase

4.4. Towa Mold Y-series pellet loader for semi-auto operation.

4.6. Paper Strip for compression melamine cleaning and conditioning.

4.7. Sofray X-ray for wire defects monitoring.

4.9. Low power microscope (10 – 40X).

4.10. Luxo lamp or equivalent 3X magnification inspection device.

4.11. Inspection jigs

4.12. Diamond scriber or equivalent hard and pointed tools

4.13. Knitted hand gloves

4.14. Finger cots

4.15. Ground straps or equivalent grounding devices

4.16. Limited Access/Plastic Tweezers.

4.17. Brass brush

4.18. Brass picks

4.19. Brass plate

4.20. Brass wedge

4.21. Brass hammer

4.22. Mold stain eraser

4.23. Dentist Mirror

4.24. Magazines with end covers

4.25. Substrate Map Reject coding plate

5.1. Wire bonded units for molding / production lots

5.2. Qualified dummy for buy-off.

5.3. Qualified molding compounds – Table 1

5.4. Qualified mold cleaning materials – Table 2

5.5. Qualified mold conditioning materials – Table 3

5.6. Qualified paper frame – Table 4

5.7. Mold cleaning and conditioning requirements – Table 6.

5.8. Mold cleaning and conditioner sheets placement– Table 7.

6.1. TCM folder and all its elements

6.2. Production Time Ticket – Appendix 2

6.3. Mold Compound Loading History

6.4. Mold Compound Removal Monitor (Refer to AS1067)

6.5. Fico molding parameters – Table 8, Table 9.

6.8. Reject Mapping Form (Refer to SOP 5267 - Form B)

7.1. PRE-PRODUCTION OPERATION PROCEDURE – ALL MACHINES

7.1.1. WORKPLACE PREPARATION PROCEDURE – ALL MACHINES

7.1.1.1. Ensure that the following are met:

7.1.1.1.2. The ESD groundings on the table are in tact.

7.1.1.1.3. The Table is clean and free of any unnecessary things.

7.1.1.2. The inspection jig and qualified tweezer are available.

7.1.1.4. Dummy strips are available.

7.1.1.5. The TCM and all its elements are available.