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Step by Step Design Tutorial of a

fixed-frequency adapter < 75 W


with very low power consumption
Presented by: Petr Papica
Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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The flyback, a popular structure
 The flyback converter is widely used in consumer products
 Ease of design, low-cost, well-known struture
 Poor EMI signature, bulky transformer, practical up to 150 W

DVD player
flyback ≈ 10 – 35 W

charger
flyback ≈ 3 – 5 W

notebook
flyback ≈ 40 – 180 W

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EPA 2.0 (External Power Supplies)

(was > 0.84 in previous version 1.1)

(< 0.5 W in 1.1)

(< 0.75 W in 1.1)

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EPS 5.0 (ENERGY STAR® Program Requirements
for Computers)
• Defines ETEC for different types of products as a Typical Energy Consumption
• For the desktop and notebook product categories TEC will be determined by the following formula:

ETEC = (8760/1000) * (Poff * Toff + Psleep * Tsleep + Pidle * Tidle)

• where all Px are power values in watts, all Tx are Time values in % of year, and the TEC ETEC is in units
of kWh and represents annual energy consumption based on mode weightings

• The light load efficiency and no load consumption is more important

ETEC requirement desktops and notebooks

Desktops and Integrated Computers (kWh) Notebook Computers (kWh)


Category A: ≤ 148.0 Category A: ≤ 40.0
TEC (kWh) Category B: ≤ 175.0 Category B: ≤ 53.0
Category C: ≤ 209.0 Category C: ≤ 88.5
Category D: ≤ 234.0

• Effective from July 1, 2009 (except: game consoles from July 1, 2010)

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Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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An isolated buck-boost

2 7 8
11

drv SW1 L C
Vout 1 N C Vout
D
Vin 1 4 Vin Vin
5 9 12
D Vout gnd gnd
L C drv
D drv
a b SW1 c SW1

buck-boost buck-boost flyback


ground referenced input referenced isolated ground referenced

 The flyback converter is an isolated version of the buck-boost cell


 By rotating the switch, we obtain a ground-referenced isolated converter
 Keep this in mind for the small-signal analysis!

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On-time and freewheel
V(SW / D) = Vout
V(SW / D) = Vin
SW IL
Vout IL D
Vout

L VL L VL
Vin Vin
R R Vout
C C

IL IL

IL IL

Circulates in the
Vin same direction
I peak = I valley + ton I valley = I peak −
Vout
toff
L L
SW is closed, D is blocked SW is open, D is closed

 When the switch closes, current ramps-up in L


 At the switch opening, the stored energy is dumped into C

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The flyback circuit
1:N D1
Vout
.
Cout Rload
.
Vin

drv

 Similar buck-boost equations hold when scaled by the turn ratio N


 The switch is now ground referenced for an easier drive
 We have galvanic isolation between the primary and the secondary

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The turn-on event
-Vin.N Vout

ILp Vin
IC Son =
Lp
.
Lp Ls VLs R Vin
VLp (Np) . (Ns) C Vout I peak = I valley + ton CCM
Vin
Lp
ILs = 0 IR
Vin
0
D I peak = ton DCM
N = Ns / Np
Lp
SW

S
ILp
PIV = Vin N + Vout Reverse voltage on the diode

 The controller instructs the power switch to turn on


 The current increases in the inductor in relationship to Vin and Lp
 The output capacitor supplies the load on its own
Simplified, no leakage

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Applying volt-second balance, CCM
VLp(t)

Vin
ILs = ILp / N IC IR

Lp
. Ls R
VLs C
VLp=Vout/N (Np) . (Ns) Vout

Vin Vout/N

D
Vin+VLp
ton = DTsw toff = (1-D)Tsw
N = Ns / Np

Vout Reflected
ILp=0
S
VDS ,off = Vin + = Vin + Vr
N voltage

Vout Nton NDTsw ND


= = =
Vin toff (1 − D ) Tsw (1 − D )
dc transfer function in CCM Simplified, no leakage

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Applying volt-second balance, DCM
VLp(t)

ILs = 0 IC
Vin
IR

. DT
Lp Ls VLs R
VLp=0 C
(Np) . (Ns) Vout

Vin
Vout /N
Vin

N = Ns / Np ton = DTsw toff = (1-D)Tsw

VDS ,off = Vin

dc transfer function in DCM


Vout Rload
=D N no longer plays a role
Vin 2 L p Fsw Rload, Lp and Fsw do

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Flyback, typical waveforms
X2
XFMR
RATIO = -0.1 D1
6 1
Vout

Lp
. 3
Cout Rload
2.2m Ls 470u 2
. IC = 10
5
IIn
Vin Vds
100
D
4 2 X1
PSW1
V2 RON = 10m
ROFF = 1Meg
S

V2 4 0 PULSE 0 5 0 10n 10n 3u 10u

 A simple flyback circuit without parasitic elements


 It runs open-loop for the sake of simplicity
 Vout = 8 V

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Flyback, typical waveforms, CCM
1.60
Ipeak Iin(t)
iin in amperes
1.20
plot1
800m
400m
Input current
0 1

1.15
∆I L Ivalley
i(lp) in amperes

1.05 ILp(t)
plot2

950m
850m
2
750m Epeak

Diode blocks
Vout N + Vin
250 E valley
Vout N
vds in volts

190 3
Vin
plot3

130
70.0
10.0
VDS(t)
8.89
4
vout in volts

8.87
plot4

8.85
8.83
8.81
Output cap.
refueling
Output capacitor
supplies the load
Vout(t)
16.0
id(d1) in amperes

12.0 Ipeak / N Id(t)


plot5

8.00 5
4.00
0
3.002m 3.006m 3.010m 3.014m 3.018m
time in seconds

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Flyback, typical waveforms, DCM
iin in amperes 400m
300m
Ipeak Iin(t)
Plot1

200m
100m Input current
0 1

400m
∆I L
i(lp) in amperes

DCM (core reset)


300m ILp(t)
Plot2

200m
100m
0 Epeak 2

Evalley = 0
Vout N + Vin
400
Diode blocks
Vout N VDS(t)
vds in volts

300
Plot3

200
100
Vin
3
0

12.648
4
vout in volts

12.644 VDS is back


Plot4

12.640
to Vin when
12.636 Output capacitor
12.632
Output cap.
refueling supplies the load Vout(t) all SW are
3.00 blocked.
id(d1) in amperes

2.00 Ipeak / N Id(t)


Plot5

1.00
0 5
-1.00
3.002m 3.006m 3.010m 3.014m 3.018m
time in seconds

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Energy transfer in CCM and DCM
1
ELp ,valley = L p I valley 2 Initially stored energy
2
1
ELp , peak = L p I peak 2 Stored energy at ton
2
ELp , accu = L p I peak 2 − L p I valley 2 = L p ( I peak 2 − I valley 2 ) Accumulated energy at Tsw
1 1 1
2 2 2

Power (watts) is energy (joules) averaged over time (a switching cycle, seconds)

( )
1 1
Pout = I peak 2 − I valley 2 Lp Fswη Pout = I peak 2 L p Fswη
2 2
CCM DCM, Ivalley = 0
Eta, the efficiency

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Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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The leakage inductance

 The coupling in a transformer is not perfect


 Some induction lines couple in the air: leakage flux

Closed path
in the air Leakage flux

Closed path
Leakage flux in the air

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An equivalent transformer model

 For a two-winding transformer, the model is simple:


 Two leakage inductors
 One magnetizing inductor

Lleak1 Lleak2

Lp
primary secondary

1:N

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The leakage role
ILp

. Lp
VLp (Vout+Vf) / N
VLp
Lp Ipeak
(Np)

ILp

Vin
Lleak
Vin Lleak Lleak
Ipeak
D
0
D
ILp SW
Clump
Clump VDS
S
ILp
S

The switch closes: The switch opens:


Current flows in Lleak and Lp The current charges the lump capacitor

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Drain-source excursion
X4
XFMR-AUX
RATIO_POW = -0.05 D5
Rprim
RATIO_AUX = -0.06 1N5822
0.5
Vout
12 7
16 V
9

1 Icoil
Resr1
60m Rload
Lprim 9
3m 10 dem
R6 5

4.7k C6 Cout1
3
600p 2.2mF

Vin
Lleak
15u Vdrain
800
VDS,max
350 V 600
750 V VDS(t)

vdrain, v(9) in volts


8

400
Vin
Id 200

11 0 Valley switching
IReso
X3
drv 6 MTP4N85m Creso
1.5n
800m
Ipeak = 695 mA
4
400m
ILp(t)
Rsense
0.5
0

-400m

ILleak(t)
-800m

Reflected Vout 7.940m 7.944m 7.949m


time in seconds
7.953m 7.957m

( +Vf )
Characteristic
V Lleak impedance
=V + + I peak
out
VDS,max in Need to limit the excursion!
N Clump

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The need of a clamp
X2
Rclp Cclp Rs XFMR D1
1n5819
250m RATIO = -0.1
2 1 Vout
5
Vclamp Lp . 3
Cout
{Lp} Ls 470u


IIn 150 VLp
ILp . IC = 10
Vclamp ID1 7
Rload
1k
10 6

Lleak Resr
9 D3 150m


MUR160 VLeak ILeak {Leak}
Vin
100
Lp
Vds
4 8
parameters
Dclp Dbody
C2 Lp=2.2m
V2 100p
k=0.02
Leak=Lp*k
V2 4 0 PULSE 0 5 0 10n 10n 3u 10u

 The clamp is made by a low impedance voltage source


 When the drain reaches Vin + Vclamp, the clamp diode conducts

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A reduced secondary-side current
260m

ilp in amperes
plot1 180m ILp(t) Ipeak = 236 mA I’peak = 210 mA
100m

20.0m 2
-60.0m

∆t = 480 ns
260m
Leakage inductor Ileak(t)
illeak in amperes

180m
reset sequence
Plot3

100m

20.0m 0 3

-60.0m

trr
2.50
Id,peak=2.1 A Id(t)
id1 in amperes

1.90
plot2

1.30

700m

100m 4

280

200
VDS(t)
vds in volts
Plot4

120
1
40.0

-40.0
3.011m 3.015m 3.019m 3.023m 3.027m
time in seconds

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Ringing and turn-on in the valleys?
570
Vin + Vclamp R

2L
Vr + Vin e

410
Vr Vin
Vr
vdrain in volts
plot1

250

tv
90.0
valleys

1
(L + Lleak ) Clump
1

tv = =π p
-70.0
VDS(t) 2 f0

1.002m 1.008m 1.015m 1.021m 1.028m


time in seconds

 Wait until the drain voltage is minimum and reduce turn-on losses: valley switching!

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Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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Power stage: Schematic of flyback converter

N sec
N=
N prim

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Power stage design: Bulk capacitor
• Output power Pout Pout = Vout ⋅ I out

Pout
• Estimation of input power Pin Pin = Estimate the η based
η on the EPA standard

Pin
• Average input current Iin,avg I in ,avg =
Vbulk ,min

• Design the bulk capacitor for the maximum output power and
the minimum input line voltage.

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Power stage design: Bulk capacitor
• 1st current approach

∆Vbulk
 1  ∆Vbulk 

Vbulk,min
1 I in , avg −1 
Cbulk = ⋅ 1 − ⋅ cos 1 − 

2 ⋅ f line ∆Vbulk  π  V peak 

Simple current approach:

I in ,avg ⋅ t 2
Cbulk =
∆Vbulk
Use t2=7.5 to 8.5ms for fline= 50Hz

• 2nd power approach 1


T=
f line
2 ⋅ Pin ⋅ t2 Consideration:
Cbulk =
V peak − Vmin
2 2
Low volume bulk: large ripple, better PF, lower input RMS current
High volume bulk: low ripple, bad PF, high input RMS current

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Power stage design: Drain voltage
Vds(t)

Vds_max

Vleak
Vclamp

Vr
tleak

Vr
Vds_pk

Vbulk
trec

toff ton

Tsw t

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Power stage design: Transformer ratio
Transformer ratio – consideration of the VDSS of used Q1

kC ⋅ (Vout + V f ,diode ) Vclamp


N= kC =
0.85 ⋅ VDS ,max − 20V − Vbulk ,max Vr
The 20V means margin for clamping diode turning-on overshoot.

Reflected voltage Vr at primary from secondary


Vout + V f ,diode N sec
Vr = N=
N N prim
Maximum duty cycle DCmax
In CCM operation: In DCM operation doesn’t depend on N:

Vr Vout 2 ⋅ L prim ⋅ Fsw


DC max = DC max = ⋅
Vr + Vbulk ,min Vbulk ,min Rload ,min

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Power stage design: Current ripple

The average shared


transformer current reflected
to primary winding IL,avg

∆I
Ipeak
I in ,avg
I L ,avg =

Ivalley
DC max

Choose the relative ripple δIr: it affects the operation in the CCM or DCM
• For universal AC input design use the δIr in range 0.5 to 1.0
• For European AC input use the δIr in range 0.8 to 1.6  δI r 
I peak = I L ,avg ⋅ 1 + 
∆I = δI r ⋅ I L , avg  2 
∆I
δI r =  δI r 
I L ,avg ∆I = I peak − I valley I valley = I L ,avg ⋅ 1 − 
 2 

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Power stage design: Primary inductance
Transformer primary winding inductance Lprim
Vbulk , min ⋅ DC max
L prim =
Fsw ⋅ ∆I
Maximum RMS value of the current flowing through primary winding Iprim,RMS

 ∆I 2 
= DC max ⋅  I peak − I peak ⋅ ∆I + 
2
I primRMS
 3 
Maximum RMS value of the current flowing through secondary winding Isec,RMS
I peak ∆I
I sec, peak = ∆I sec =
N N
 ∆I sec 
2

= (1 − DC max ) ⋅  I sec, peak − I sec, peak ⋅ ∆I sec + 


2
I sec RMS
 3 

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Power stage design: Q1 selection
Conduction loss at Q1 should be approx. 1% of the Pout
Pout
R DSon ≤
100 ⋅ I prim , RMS
2

Then the right device is chosen by parameters VDSmax, Ipeak, ton, toff

Current sensing resistor Rsense selection


VILIM
Rsense = Psense = I primRMS ⋅ Rsense
2

1.1 ⋅ I peak

The 1.1 factor means 10% margin for Lprim and other
parameters spread, to be able to deliver maximum power.

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Power stage design: Secondary rectification
D1 selection: Cout selection:
Minimum Cout value
Reverse voltage across D1
I out ⋅ DC max
PIV = Vbulk ,max ⋅ N + Vout C out ≥
Vout ,ripple ⋅ Fsw
The next important parameters for
D1 selection are Isec,peak, Iout and The maximum allowed ESR of Cout
the fast and soft recovery
Vout ,ripple
ESR ≤ Dominant part
I sec, peak

I Cout ,rms = I sec, rms − I out


2 2

It is recommended to use more parallel


Cout for lowering the output voltage ripple.

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Power stage design: Clamping network
TVS – losses in the suppressor: better at no load conditions

1 Vclamp
= Eclamp ⋅ Fsw = ⋅ Lleak ⋅ I peak ⋅ Fsw ⋅
2
Pclamp
2 Vclamp − Vr

RCD clamp – 1st iteration: better EMI response

2 ⋅ Vleak ⋅ Vclamp Vclamp


2
Rclamp = Pclamp =
Lleak ⋅ I peak ⋅ Fsw
2
Rclamp

Vclamp These values need to be optimized for the


C clamp > no load consumption and losses in slow
Vripple ⋅ Rclamp ⋅ Fsw clamping diode D2

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TVS vs RCD clamp comparison

Drain voltage ringing with TVS as clamp Drain voltage ringing with RCD as clamp
Different Rdamp used in clamp
Ch1 – Drain, Ch3 – Clamp node

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Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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Application schematic

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The losses distribution
Losses distribution measured without EMI filters and surge protecting NTC

3.00

2.78
2.50
2.53
2.44
2.00

Power loss [W] 1.50


1.52

1.00

0.50

0.00

h
er
er

r
itc

ie
i

rm
ti f

if
sw

ct
ec

re
sf

y
tr

ar
an

ry
pu

im

da
Tr
In

Pr

n
co
Se
Input line Input power Output power Total loss power Efficiency
110 V / 60 Hz 72.5 W 63.62 W 8.88W 87.75%

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Optimization of efficiency
• There was not found excessive contributor of losses in the
power stage of the flyback converter
• Losses in all components should be decreased
• Optimization approach:
1) decreasing the losses in power stage by selection of
primary switch Q1 and secondary rectifier D1
2) decreasing the losses in power stage by decreasing
losses in transformer
3) try to improve the bridge rectifier (not much space)
4) decreasing the conductive losses in EMI filters
5) Do we need surge protecting NTC in case of “low value”
bulk capacitor ?

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Influence of EMI filters
• Input EMI filter contributes to the conductive losses mainly at full load
and low line condition
• The high inductance 22mH or more is needed to reject the “low”
frequency emissions ( below 1 MHz )
• There is needed to use two chamber CM choke or 2 CM mode chokes
to reject the high frequency emissions above 10MHz
• Output EMI filter (CM choke) reject the high frequency emissions from
the DC cord, only low inductance is needed → low Rdc → low
conduction losses
• The most important are losses in the high inductance input common
choke from the efficiency optimization point of view

Note from experiments:


There was found an influence of HF ripple at input current to the precision of measurement of input power
using wattmeter YOKOGAWA WT210. There were measured lower input power with the connected 100uH
common choke in comparison without any EMC filter. (at the same conditions) It is better always to use some
EMI filter, with small Rdc to reject the error given by the noisy HF currents.

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Transformer optimization result
Q1 breakdown
area Transformer ratio Ns/Np optimization

89.50% The optimum ratio is


given by the Q1
maximum break down
89.00%
voltage with 15%
derating factor
88.50%

Optimum ratio Decreasing the Ns/Np


88.00%
decreases the
Efficiency [%]

secondary winding
87.50% losses and primary
RMS current
87.00%

Decreasing the Ns/Np


86.50% increases the Q1
switching losses and
86.00%
secondary RMS
current

85.50%
0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
Transformer ratio Ns/Np [-]

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Improving Efficiency
• Sources of loss:

– Switching losses:
1
Ploss ( switching ) = ⋅ C DRAIN ⋅ VDRAIN ( turn−off ) ⋅ FSW
2

2
– Losses caused by leakage inductance:
1
Ploss(leak) = ⋅ Lleak ⋅ I peak ⋅ FSW
2

• Ways to improve efficiency:

– Lower the switching frequency FSW  frequency foldback at light loads

– Lower the Drain voltage at turn-off  valley switching

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Synchronous rectification

• New SR controller NCP4303


coming in 2010

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Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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Application schematic

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The voltage-mode PWM generation
6.50
Verror
4.50

verr, ramp in volts


plot1
2.50

497m 2
1

PWM -1.50

modulator
7.00

+ 5.00
100 %
D
out in volts
plot2
3.00

- 1.00 0% 3

-1.00

10.0u 30.0u 50.0u 70.0u 90.0u


time in seconds

 In voltage-mode, one compares the error voltage to a fix ramp


 This is « Pulse Width Modulation » also called « PWM »

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The voltage-mode PWM generation

Vin Vout
This level
sets the duty-cycle
Rupper
Error
Amplifier PWM
- comparator

+
+
-

Vref
Rlower I > Imax ? Rsense
--> reset

 The inductor current is sensed for safety only

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The current-mode PWM generation
3.00 3.50

r ror v ol tage 2
1
2.00 2.50
E

idrain in amperes

vfb in volts
plot1
1.00 1.50

0 500m

-1.00 -500m

S 1.31m 1.65m 1.99m


time in seconds
2.33m 2.67m

Q MOSFET

Q
3.50 3.00

3
4
2.50 2.00
R
idrain in amperes
vfb in volts
Plot2

1.50 1.00

500m 0

-500m -1.00 Inductor peak current


2.50m 2.57m 2.65m 2.72m 2.80m
time in seconds

 In current-mode, the error voltage fixes the peak current

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The current-mode PWM generation

Vin Vout
This level
sets the peak current
Rupper
clock
Error
Amplifier
-
S
+
Q
Q

Current sense
R
comparator
-
Rlower
Vref +

Rsense

 The sense resistor provides a pulse-by-pulse current limit

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Same modulation between VM and CM
 Both modulators use trailing edge modulation
feedback
on

Trailing edge
off modulation

Clock
feedback
on

off
Leading edge
off
modulation

Clock

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NCP1237/38/87/88 flyback controller
Value Proposition
The NCP1237/38/87/88 series represents the next generation of fixed frequency PWM controllers. It targets
applications where cost-effectiveness, reliability, design flexibility and low standby power are compulsory.
Unique Features Benefits Application Data
 High-voltage current source  Fewer components and
with built-in Brown-out and rugged design
mains OVP  Extremely low no-load
 Freq. reduction in light load standby power
conditions and skip mode  Simple option to alter the
Dual Auto
 Adjustable Over Power max. peak current set DSS Latch
OCP Recovery
Protection point at high line NCP1237A Yes Yes Yes
NCP1237B Yes Yes Yes
NCP1238A Yes No Yes
Others Features NCP1238B Yes No Yes
 Latch-off input for severe fault conditions, allowing NCP1287A HV only Yes Yes
NCP1287B HV only Yes Yes
direct connection of NTC NCP1288A HV only No Yes
 Timer-based protection: auto-recovery or latched NCP1288B HV only No Yes
 Dual OCP option available
 Built-in ramp compensation Various options available depending
 Frequency jittering for a softened EMI signature
 Vcc operation up to 30 V upon end applications needs
Market & Applications Ordering & Package Information
 AC-DC adapters for notebooks, LCD monitor, game
 NCP1237/38xDR2G - NCP1287/88xDR2G
console, printers
 SOIC-7 2500p per reel Pb O, DW
 CE applications (DVD, STB)

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52
NCP1237/38/87/88 – Built-in Startup FET

A flyback auxiliary winding supplies


biasing voltage in normal condition to
save power

High startup current to


reduce charging time

Low initial startup current to prevent


damage if Vcc pin is shorted to ground.

Saves PCB area


No startup resistor!
& saves power
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53
NCP1237/38/87/88 – Dynamic Self Supply (optional)

Vcc
How it works... Vccon
11.3V avg
(HV) Vccoff
pin8
2
4 +
ON/OFF
3

-
(Vcc)
pin6

10.5V/12V C ON
Current
source
OFF

10.00M 30.00M 50.00M 70.00M 90.00M

Power ON  Current Source turns ON  Vcc is rising; no output pulses


Vcc reaches Vcc(on)  Current Source turns OFF  Vcc is falling; output is pulsing
Vcc falls to Vcc(off)  Current Source turns ON  Vcc is rising; output is pulsing

Dynamic Self-Supply No need of auxiliary winding!


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NCP1237/38/87/88 – Dual startup current level

Startup current is Startup current is


low initially to off when VCC
prevent damage reaches VCC(on)
when VCC pin is
grounded.

Startup current is activated when VCC


drops to VCC(off). Hence, the voltage
never drops below VCC(off) after startup.

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55
NCP1237/38/87/88 – Brown-out and Mains OVP

Detection independent of Can be connected to the


Ripple on HV pin half-wave rectified ac line
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56
NCP1237/38/87/88 – Brown-out and Mains OVP
VHV

VHV(start)
VHV(stop)

Starts
time
only at
VCC(on) HV HV
timer timer
starts restarts

One Shot

40ms min.

time
DRV
Brown-out

time

Timer-based detection Passes full line cycle drop-out

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57
Current overshoot: do not underestimate it…
ILp
Turn off is
Detection delayed …
occurs here ∆Ipeak
Ipeak,max
real

Ipeak,max
controller
SLp

tprop

t
Vsense,max Vin ,max
I peak ,max = + t prop
Rsense Lp

 Watch-out for clamp voltage variations, at start-up or in short-circuit


 The main problem comes from the propagation delay!

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58
NCP1237/38/87/88 – Over Power Protection

Need to compensate for the The compensation current


effect of the propagation delay creates an offset on the
Current Sense signal

Over Power Protection Maximum output power clamped

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59
NCP1237/38/87/88 – Dual OCP threshold
Output still in regulation
Fault timer Fault timer
VOUT starts
VOUT starts

Over Over
load Transient load
peak
power

Max Max Max


Skip Output Skip DC
Output
output peak
power load power power load
0.7V at 0.5V at 0.7V at
CS pin CS pin CS pin
Accommodates large output
Suitable for printers
power transients
These protections use the Up/Down counters, like classical analog integration.

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60
NCP1237/38/87/88 – 4 ms Soft Start

voltage / current without soft-start


with soft-start

time
VCC
Max. current setpoint envelope

time

4 ms “digital” soft-start operation

4 ms Soft Start Stressless start-up phase


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61
NCP1237/38/87/88 – Frequency Foldback

Switching frequency
Increased efficiency
lowered at light load

Switching frequency
No audible noise
clamped at 25 kHz
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62
NCP1237/38/87/88 – Recover from Standby

Soft-Skip
mode is left as
soon as the
voltage on the
feedback pin
reaches the
TLD threshold

Transient Load Detect Improved Load Transient


Function (TLD) response time
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63
NCP1237/38/87/88 – Latch-off Protection
VLATCH

Latch!

OK

Latch!

time

An NTC thermistor can be directly connected to the IC

Less external components needed


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64
CCM operation, current instabilities
IL
clock
Ipeak

IL(0)
∆IL(0)
Duty-cycle < 50%
t
Asymptotically stable Perturbation has gone…

IL
clock
Ipeak

Duty clamp

IL(0)
Duty-cycle > 50%
∆IL(0)

t
Asymptotically unstable

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65
CCM operation, curing current instabilities
IL n
 Sa 
 1 − 
S2
Verr ∆I L (nTsw ) = ∆I L (0)  −  = ∆I L (0) ( −a )
n

b c Ri  d ' + Sa 
 d S 2 
Sa
S1 Must stay
below 1
∆IL(0)
S2 IL(Tsw)
Sa
1−
IL(0)

∆t IL(Tsw) S2
Up to
d = 100%
<1
Sa
0+
t S2
dTsw d’Tsw
Tsw

Inject ramp compensation Sa > 50% S2

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66
NCP1237/38/87/88 – Slope compensation
• There is a built in slope compensation with no external setting
• The internal slope compensation is activated if the duty cycle is higher
than 40%
• The amount of slope compensation is 5mV/% observed at CS pin

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67
Block schematic

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68
Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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69
Reducing No-load Input Power
• Static losses in the start-up circuit:
– Start-up resistor permanently drawing current from the bulk capacitor

• Ways to lower the start-up circuit losses


– With external start-up resistor  Extremely low start-up current
– Integrated start-up current source  Extremely low leakage when off
– Connect the start-up circuit to the half-wave rectified ac input

HV rail

1
NCP1351
8
Start-up resistors
2 7
Vcc
3 6

4 5

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70
Reducing No-load Input Power

Selected from Vpeak


Rstartup bulk connection 350

RstartupHW =
π I1
250

150

50.0

RstartupHW
-50.0

Mains 10.0M 30.0M 50.0M 70.0M 90.0M

input Cbulk time in secs

Vcc
auxiliary
CVcc winding

PRstartup π
PRstartupHW = Brings a 21% reduction in power
4

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71
No load input power reducing approach

• Decrease the transformer leakage inductance


• Use the controller IC with the frequency foldback and skip mode features
• Do not allow the DSS operation (Vcc cap increase)
• In case of low Vcc and high aux winding leakage increase the aux number of turns
to disable the DSS
• Decrease the value of the Vcc damping resistor (may affect the EMI)

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72
No load input power reducing approach

• Lower the M1 switching losses


• Optimize the clamping circuitry
• Reduce the losses in the secondary rectifier and its snubber
• Decrease the TL431 biasing
• Decrease the cross current through the feedback resistor divider
• Set a stable operation for all loading currents
• Do not use the output voltage indication LED
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73
Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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74
Area product AP
• There is defined the area product AP [m4]
• Product of effective window area Wa [m2] and iron cross
section area Ac [m2]

AP = Wa ⋅ Ac

• Allows fast, effective and optimal magnetic design


• Should be published in core datasheet

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75
Window utilization factor Ku
Ku is a measure of the amount of copper that appears in
the window area of transformer. This window utilization
factor is affected by:

1) Wire insulation
2) Wire lay (fill factor)
3) Bobbin area
4) Insulation required for multilayer windings or between windings

Typical values lay in range 0.35 to 0.48

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76
The load coefficient Kload
• Flux density in magnetic should be designed at Ipeak with
some margin (5%) to avoid saturation
• Do you really need 100% Iout for 100% time??

If not, decrease core size!!


I out ,,RMS
K load = RMS

Example: I out , RMS ,max


• Maximum DC output current is 3.5A, but it’s only needed for
transients
• The long term RMS value is only 1.75A (at least 10 min.)
• Loading coefficient is only 0.5 (not 1) → core size is smaller
→ losses in core and in copper are smaller

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77
Flyback transformer core sizing
The core size can be calculated by the AP factor in case of these inputs:

1. Converter parameters: Lprim, Ipeak, Kload, δIr, DCmax


2. Core maximum flux density Bmax considered with the hysteresis and
eddy current losses at switching frequency Fsw
3. Winding parameters (utilization factors for primary and secondary
windings Kuprim, Kusec), (current densities in primary and secondary
windings Jprim, Jsec

L prim ⋅ I peak
2
 DC max 1 − DC max  δ I r + 12
2

AP = ⋅ K load ⋅  + ⋅
Bmax  J prim ⋅ Ku prim J sec ⋅ Ku sec  3 ⋅ (δI + 2)2
  r

Now the appropriate core can be selected from the vendor products list by
the AP factor .

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78
Windings design
• Number of turns of primary winding
L prim ⋅ I peak
NT prim =
B max ⋅ A c

• Number of turns of secondary winding


NTsec = N ⋅ NT prim

• Number of turns of auxiliary winding


VCC + V f ,Vcc
NTaux = ⋅ NTsec
Vout + V f ,diode

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79
Air gap length lg
N ⋅ µ 0 ⋅ I peak MPL
lg = − in case of l g << MPL
Bmax µr

MPL – core magnetic path length


µ0 - permeability of vacuum
µr - permeability of core lg

In case an EE, RM or pot core is used, divide Ac


the calculated lg by factor 2, because your
core has 2 air gaps in magnetic path

MPL

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80
Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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81
How to improve EMI of my design?
Diode snubber

AC line filter

DC output filter

Clamping loop

DRV damping
Power switch loop

• All switching loops with RF currents should have small area


• Divide input AC filter at two chokes to decrease the parasitic capacitance
coupling
• CY – closes the current loop for the RF currents injected via transformer

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82
Diode snubber design
• Snubber resistance value should be close to the characteristic
impedance of ringing circuitry

Lleak,SEC –the transformer leakage


Lleak , SEC inductance observed from
Rsnubber = secondary side
Cd
Cd – reverse direction diode
capacitance

• RC time constant of the snubber should be small compared to the


switching period but long compared to the voltage rise time

C snubber ≈ 3 ÷ 4 ⋅ C d

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83
PCB Layout tips
DRV loop Clamping loop

Output loop Power switch loop Capacitor pads arrangement for


better filtering RF currents
Diode snubber

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84
Agenda
• Application and requirements
• Flyback converter basics
• Flyback converter parasitic
• Design step 1: Power stage
• Design step 2: Efficiency optimization
• Design step 3: Control mode and protections
• Design step 4: No Load Input Power
• Design step 5: Magnetics
• Design step 6: EMI
• Demoboard example

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85
Preliminary demonstration board
A typical 65 W notebook adapter (19 V output)

(optimized for EPS 2.0)

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86
Schematic of preliminary demonstration board

A typical 65 W notebook adapter (19 V output)

(optimized for EPS 2.0)

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87
Demonstration board Efficiency (measured with DC cord)
The DC cord length is 1.05m and copper cross sec. is 0.75mm2

VIN
115 Vac/60Hz 230 Vac/60Hz
% of POUTnom
100 %
(65 W)
87.10 % 87.37 %
75 %
(49 W)
87.52 % 87.63 %
50 %
(32 W)
87.54 % 87.88 %
25 %
(16 W)
87.79 % 85.96 %

Average at 115Vac is 87.32% and at 230 Vac is 87.21 %

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88
Demonstration board Standby Power
Light load and no load input power with the NCP1237

VIN
115 Vac/60Hz 230 Vac/50Hz
POUT

10 % 86.55 % 83.74 %
(6.5 W)

5% 85.40 % 78.72 %
(3.3 W)

1% 77.49 % 73.77 %
(0.65 W)

No load 51.1 mW 73.5 mW

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89
Demonstration board Efficiency
90

88

86

84
Efficiency [%]

82

80

78

76 – 115 Vac - NCP1237


74
– 230 Vac - NCP1237
72

70
0 10 20 30 40 50 60 70

Pout [W]

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Demonstration board conducted EMI

80% of full load (2.72A) at 230V/50Hz NCP1237B65kHz

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91
NCP1237B100kHz frequency jittering

Ref1 – DRV frequency

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92
NCP1237B100kHz frequency foldback

Ch1 – DRV, Ch2 – FB, Ref1 – DRV frequency

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93
Load transient response from 20% to 100%

Ch1 – Drain, Ch2 – FB, Ch3 – Vout (AC coupling), Ch4 - Iout

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94
Load transient response from 100% to 20%

Ch1 – Drain, Ch2 – FB, Ch3 – Vout (AC coupling), Ch4 - Iout

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95
Conclusion
• Meeting the most recent requirements from ENERGY STAR®
or IEC is possible with the classical Flyback converter
• The new controller NCP1237/37/87/88 with frequency
foldback and skip-mode at light load makes it possible
• Average efficiencies above 87% are possible
• No-load input power below 300 mW is possible
• No-load input power below 100 mW is achievable, although
the controller alone cannot ensure this. The whole power
supply must be designed to reduce power waste.

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References
Tutorial and Application notes:

http://www.onsemi.com/pub_link/Collateral/TND376-D.PDF

http://www.onsemi.com/pub_link/Collateral/AND8461-D.PDF

http://www.onsemi.com/pub_link/Collateral/DN06074.PDF

Feedback loop design spreadsheet:

http://www.onsemi.com/pub/Collateral/FLYBACK DWS.XLS.ZIP

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97
Thank You! Any Questions?
Backup

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99
Over power compensation
The overpower compensation affects the primary peak current, by the following
formula:
VCS int t R  R
I PEAK = + Vbulk ⋅  PROP − g OPP ⋅ OPP  + Voff ⋅ g OPP ⋅ OPP
Rsense  LP Rsense  Rsense

Then the overpower compensation resistor can be calculated:

t PROP ⋅ Rsense
ROPP =
LP ⋅ g OPP

The over power compensating resistor affects only the Ipeak value, but in CCM the
output power is given by the following formula, where Ivalley plays a role:

Pout
1
2
(
= ⋅ η ⋅ L prim ⋅ Fsw ⋅ I peak − I valley
2 2
)

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2nd level over current protection

The overpower compensation affects the 2nd level over current


protection by the addition of bulk voltage feed forward.

− (Vbulk − Voff )⋅ g OPP ⋅


VCStran ROPP
I TRAN =
Rsense Rsense

The 2nd level over current protection can be used for


reducing the transformer size to ½ and keeping the peak
power capability.

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Spread sheet design of OPC
OPC design spread sheet was created and the user can choose the right
ROPP and it’s effect to Ipeak, Itran, Pout and Ptran:

Inputs: Output voltage


Primary turns
Vout [V]
N1 [-]
19
100
Secondary turns N2 [-] 25
Ramp Comp at CS RaCo [mV/%] 5
Maximum int set point Vilimit [V] 0.7
Sensing resistor Rsense [Ohm] 0.235
Propagation delay tprop [ns] 100
Primary inductance Lp [uH] 560
Vin to Iopp ratio gopp [uS] 0.5
Over power comp resistor Ropp [Ohm] 680
Switching frequency Fsw [kHz] 65
2nd level overcurrent prot Vcstran [V] 0.5

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Spread sheet design of OPC
Ipeak & Itran vs line input voltage Pmax & Ptran vs line input voltage

3.5 140.0

3.0 120.0

2.5 100.0
Ipeak [A], Itran [A]

Pmax [W], Ptran [W]


2.0 80.0

1.5 60.0

1.0 40.0

0.5 20.0

0.0 0.0
0 50 100 150 200 250 300 350 400 0 50 100 150 200 250 300 350 400
Vin [V] Vbulk [V]

Ipeak Itran Ptran Pmax

Keeping constant Ipeak in CCM mode tends to Ivalley decreasing with


increasing the Vin. That’s why the maximum output deliverable power
Pout increases with increasing Vin. Choose the right compensation.

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