Index: Designverifikation Designverifikation Design Verification Design-Verifikation Vérification de La Conception

2601
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Designverifikation
Design verification
Date: 01 MAR 19 P
D Design-Verifikation
F Vérification de la conception Index
This chapter of the Projecting Manual can be used as guide for design verification of assemblies according to IEC/EN 61439. On the following
pages there is a table with the 13 verifications that designs have to undergo. In the table it is described what and how CUBIC has verified the
modular system. The table refers to methods (calculations and comparisons) that can be used for verification of assemblies that deviates from
CUBIC's tested reference design.
Unlike routine verification, the verification of the design is only something that has to be done on every new design, and not every finished
assembly. In this section you have to be aware that CUBIC has conducted verifications on the modular system together with a wide variety of
component brands. Does the assembly manufacturer make modifications on the modular system or installs other parts than the ones CUBIC
has verified, then it is the assembly manufacturer's responsibility to have these parts verified.
CUBIC recommends that the assembly manufacturer has a procedure for how any modifications etc. should be verified. Example: If a wire used
is different from the wire used by CUBIC in the verification test, the technical specifications on the 2 wires should be compared.
Design verification is intended to verify compliance of the design of an assembly or assembly system with the requirements of this series of
standards.
Design verification shall be achieved by the application of one or more of the following equivalent and alternative methods as appropriate:
– verification testing;
– verification comparison with a tested reference design;
– verification assessment, i.e. confirmation of the correct application of calculations and design rules, including use of appropriate safety
margins.
See Annex D or see the table on the folowing pages.
An assembly which is verified in accordance with the IEC / EN 61439 standard by an original manufacturer and manufactured or
assembled by another does not require the original design verifications to be repeated if all the requirements and instructions specified
and provided by the Original Manufacturer are met in full. Where the assembly manufacturer incorporates their own arrangements not
included in the original manufacturer’s verification, the assembly manufacturer is deemed to be the original manufacturer in respect of
these arrangements.
Remember! Routine verification shall be made on every final assembly in accordance with Clause 11 of IEC / EN 61439, see also page
P2623 in this manual.
IEC / EN 61439-1, Clause 10
CUBIC-Modulsystem A/S Tel +45 9882 2400

Skjoldborgsgade 21 E-mail info@cubic.eu
DK-9700 Broenderslev Web www.cubic.eu
2602
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Designverifikation
Design verification
Date: 01 MAR 19 P
Verification options
Clauses or subclauses
available
Comparison with a
reference design
Assessment
No. Characteristic to be verified CUBIC's comments
Testing
Strength of material and parts: 10.2
The modular system have been verification tested for indoor
Resistance to corrosion 10.2.2 YES NO NO use. Cut-outs in the enclosure must be sealed according to
the guidelines in chapter 28 of this manual.
Properties of insulating
10.2.3
materials:
The modular system have been verification tested and found
Thermal stability 10.2.3.1 YES NO NO
in accordance with the standard.
Resistance to abnormal heat
and fire due to internal electric 10.2.3.2 YES NO YES
effects
1 Resistance to ultra-violet (UV) The verification test is not applicable; the modular system is
10.2.4 YES NO YES
radiation only for indoor use.
The modular system have been verification tested for up to
Lifting 10.2.5 YES NO NO 2400 kg per transport section, for further information, see
chapter 30 in this manual.
There is no mechanical impact requirements in
Mechanical impact 10.2.6 YES NO NO
IEC / EN 61439-2
The marking of the assembly is the responsibility of the
assembly manufacturer. Marking made by moulding, pressing,
engraving or similar shall not be submitted to the following
Marking 10.2.7 YES NO NO test:
The test is made by rubbing the marking by hand for 15 s with
a piece of cloth soaked in water and then for 15 s with a piece
of cloth soaked with petroleum spirit.
The modular system have been verification tested at different

Degree of protection of
2 10.3 YES NO YES IP ratings, for further information about the various designs,
enclosures
see chapter 2 in this manual.
The modular system have been clearance distance

verification tested with Impulse withstand voltage Uimp 12 kV
3 Clearances 10.4 YES NO NO
to at least 14 mm
Uimp are depending on the used electrical components.
The modular system have been creepage distance verification

tested for rated insulation voltage Ui 1000 V, pollution degree
4 Creepage distances 10.4 YES NO NO
3, material group II to at least 14 mm.
Ui are depending on the used electrical components.

2603
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Designverifikation
Design verification
Date: 01 MAR 19 P
available
Comparison with a
reference design
Assessment
Testing
Protection against electric
shock and integrity of protective 10.5
circuits:
Effective continuity between the The modular system have been verification tested and found
exposed conductive parts of the in accordance with the standard. For information about
10.5.2 YES NO NO
5 ASSEMBLY and the protective mounting of electrical components in doors and cover plates,
circuit see chapter 24 in this manual.
The CUBIC busbars and PE bar have been verification tested
Short-circuit withstand strength up to 72 kA/ 0.1 sec and 158.4 kA peak (60% of the 3 phase
10.5.3 YES YES NO
of the protective circuit value). For further information about various PE bars, see
chapter 18 in this manual.
Incorporation of switching devices and components in the

original design from CUBIC has been verified by inspection
Incorporation of switching according to the standard. Incorporation of switching devices
6 10.6 NO NO YES
devices and components and components in ASSEMBLIES that deviate from CUBIC's
original design to be verified by inspection according to the
standard.
Internal electrical circuits and connections in the original

design from CUBIC have been verified by inspection
Internal electrical circuits and according to the standard. Internal electrical circuits and
7 10.7 NO NO YES
connections connections in ASSEMBLIES that deviate from CUBIC's
original design to be verified by inspection according to the
standard.
Terminals for external conductors in the original design

from CUBIC have been verified by inspection according to
Terminals for external
8 10.8 NO NO YES standard. Terminals for external conductors in ASSEMBLIES
conductors
that deviates from CUBIC's original design to be verified by
inspection according to the standard.
Dielectric properties: 10.9

The modular system have been verification tested with up to
Power-frequency withstand
10.9.2 YES NO NO 3.5 kV depending on the installed components and found in
9 voltage
accordance with the standard.
The modular system have been verification tested with up to
Impulse withstand voltage 10.9.3 YES NO YES 12 kV depending on the installed components and found in
accordance with the standard.

2604
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Designverifikation
Design verification
Date: 01 MAR 19 P
available
Comparison with a
reference design
Assessment
Testing
The rated current values in the tables in the respective
chapters for inserts and busbars have been verification tested
and found in accordance with the standard. The values can
be used as reference to verify a design that deviates from that
originally verified by test.
For information on how to do that, see page P2605 in this
chapter.
Temperature-rise verification of assemblies or assembly

10 Temperature-rise limits 10.10 YES YES YES
sections Form 1 with a rated current up to 630A can also be
done by comparison. For further information see page P2606
in this chapter.
Temperature-rise verification of assemblies or assembly

sections Form 1 to 4 with a rated current up to 1600A can also
be done by calculation according to IEC 60890. For further
information see page P2615 in this capter or use CUBIC
Galaxy software.
The short-circuit withstand strength values in the tables in

the respective chapters for inserts and busbars have been
verification tested and found in accordance with the standard.
The values can be used as reference to verify a design that
deviates from that originally verified by test.
For information on how to do that, see page P2622 in this
chapter.
The following circuits in ASSEMBLIES are exempted from the

verification of the short-circuit withstand strength:
- ASSEMBLIES having a rated short-time withstand current
11 Short-circuit withstand strength 10.11 YES YES NO
or rated conditional short-circuit current not exceeding 10 kA
r.m.s;
- ASSEMBLIES protected by current-limiting devices having
a cut-off current not exceeding 17 kA with the maximum
allowable prospective short-circuit current at the terminals of
the incoming circuit of the ASSEMBLY;
- Auxiliary circuits intended to be connected to transformers
whose rated power does not exceed 10 kVA for a rated
secondary voltage of not less than 110 V, or 1,6 kVA for a
rated secondary voltage less than 110 V, and whose short-
circuit impedance is not less than 4 %
The modular system has been verified by assessment

and found in accordance with the standard. Electrical
Electromagnetic compatibility components have to be installed according to the component
12 10.12 YES NO YES
(EMC) manufacturer's recommendation. For further information
about EMC environment A and B, see chapter 28 in this
manual.

13 Mechanical operation 10.13 YES NO NO

2605
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Verifikation av temperaturstegringsgränser
Verification of temperature-rise limits
Date: 01 MAR 19 P
D Nachweis der Einhaltung der Grenzübertemperatur
F Vérification des limites d'échauffement Index
CUBIC tested values as reference design to verify a design that
deviates from that originally verified by test.
Derivation of ratings for similar variants Example: All rated currents for busbars and functional units can
The following sub-clauses define how the rated currents of be used for DC currents
variants can be verified by derivation from similar arrangements
verified by test.
Temperature-rise tests on the circuit(s) carried out at 50 Hz are
applicable to 60 Hz for rated currents up to and including 800 A. In
the absence of tests at 60 Hz for currents above 800 A, the rated
current at 60 Hz shall be reduced to 95 % of that at 50 Hz. Tests
carried out at a particular frequency are applicable at
the same current rating to lower frequencies including DC.
ASSEMBLIES Example: By comparing e.g. a tested functional unit, the IP54

The ASSEMBLY that incorporates non-tested variants shall be rated current can be used for IP43 ASSEMBLIES, and the IP33
verified by derivation from similar tested arrangements. rated current for IP20 ASSEMBLIES
ASSEMBLIES verified in this manner shall comply with the
following: Example: It is allowed to make units, sections or ASSEMBLIES
a) the functional units shall belong to the same group as the larger than the one verified by test.
functional unit selected for test;
b) the same type of construction as used for the test;
c) the same or increased overall dimensions as used for the test;
d) the same or increased cooling conditions as used for the test
(forced or natural convection, same or larger ventilation openings);
e) the same or reduced internal separation as used for the test (if
any);
f) the same or reduced power losses in the same section as used
for the test;
g) the same or reduced number of outgoing circuits for every
section.
The ASSEMBLY being verified may comprise all or only part of the
electrical circuits of the ASSEMBLY previously verified. Alternative
arrangement(s) of functional units within the ASSEMBLY or section
compared to the tested variant is allowed as long as the thermal
influences of the adjacent units are not more severe.
Thermal tests performed on 3-phase, 3-wire ASSEMBLIES are
considered as representing 3- phase, 4-wire and single-phase,
2-wire or 3-wire ASSEMBLIES, provided that the neutral conductor
is sized equal to or greater than the phase conductors arranged in
the same manner.
NOTE: The term ASSEMBLY do also cover a section of an

assembly
Functional units – Device substitution Example: In the tables for functional units, CUBIC states the
A device may be substituted with a similar device from another actual power loss for the electrical component that has been
series to that used in the original verification, provided that the tested in the functional unit. It is allowed to mount a component of
power loss and terminal temperature rise of the device, when a different brand than the one originally tested, if the power loss
tested in accordance with its product standard, is the same or does not exceed the power loss from the originally tested.
lower.
In addition, the physical arrangement within the functional unit and
the rating of the functional unit shall be maintained.

2606
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Date: 01 MAR 19 P
Temperature-rise verification of assemblies or assembly ....... continued from previous column
sections Form 1 with a rated current up to 630A.
The effective power losses of all circuits including interconnecting
Introduction. conductors shall be calculated based on maximum load currents
In the series of verification tests according to IEC / EN 61439, of the circuits. The total power loss of the ASSEMBLY is calculated
the verification of the temperature-rise limits is specified in item by adding the power losses of the circuits taking additionally
10.10, and in item 9.2, table 6, where it is stated which limits into account that the total load current is limited to the rated
should be observed. current of the ASSEMBLY. The power losses of the conductors are
determined by calculation (see page P2618).
Regarding table 6 the built-in components will often be the
most critical. It is stated that the instructions of the component Calculation based on IEC/TR 60890.
manufacturers must be followed. These instructions inform For the types of panels, for which the performance of a
typically about the maximum ambient temperatures (°C) in which a temperature-rise test is not feasible or economically justifiable,
component can function satisfactorily. you can instead make a calculation of the temperature-rise by
It is thus not only a matter about the temperature-rise (K) inside using the method stated in IEC/TR 60890.
the panel, but about this temperature-rise plus the temperature of
the panel’s surroundings. The temperature-rise for the outer parts of the panel.
According to IEC / EN 61439-1 the temperature-rise on the front
As panels are usually manufactured on an one-off basis, in of the panel and on the partitions must not surpass 30K, if during
which a more or less random combination of components and normal operation touching the panel is necessary, and 40K if there
equipment is included, the basis for deciding the temperature-rise is no need to touch the panel. This only becomes critical at a
is that an effective power loss calculation is made, see e.g. pages power loss of about 1000 W. (In the below example with a power
P2615-P2618 or use CUBIC Galaxy. loss of 200 W, max. ∆tfront will be 10.8K.)
Based on the effective power loss calculation you can decide CUBIC’s test results:
whether the various parts of the panel follow the instructions in CUBIC’s tests are based on “worst case”, i.e. a centre section of a
IEC / EN 61439-1, table 6. To decide this, i.e. convert the effective panel. In this situation there will be no heat transmission from the
power loss to a temperature-rise, there are two possibilities: sides of the panel.
If you are assessing a complete panel or maybe an end section,
- Interpolation with CUBIC’s test results this only means that the temperature-rise in these situations will
See pages P2605-P2618 be less than those registered by tests.
- Calculation based on IEC/TR 60890 Test results vs the calculation method.

See pages P2615-P2621 For the sake of good order it should be stated that the use of
CUBIC’s test results and calculation according to IEC/TR 60890 is
Conditions for application equal regarding fulfilling the requirements in IEC/ EN 61439-1.
Verification of the temperature rise of a single compartment However, the calculation method results in temperature-rises,
ASSEMBLY with the total supply current not exceeding 630 A and which - dependent on the design of the panel - are much higher
for rated frequencies up to and including 60 Hz may be made by than the tested results. Consequently there is apparently a need
calculation if all the following conditions are fulfilled: for a derating of the components, where it may not be necessary.
- the power loss data for all built-in components is available from The influence of louvres.
the component manufacturer; If in sections with components you install
- there is an approximately even distribution of power losses louvred plates in top and bottom, the
inside the enclosure; temperature-rise will be 10% less the
- the rated current of the circuits of the ASSEMBLY shall not values appearing from CUBIC's tests.
exceed 80 % of the rated conventional free air thermal current
(Ith) of the switching devices and electrical components included If IEC/TR 60890 is used, calculation shall be
in the circuit. Circuit protection devices shall be selected to made compared to a section without
ensure adequate protection to outgoing circuits, e.g. thermal louvres. See page P2619... or use
motor protection devices at the calculated temperature in the CUBIC Galaxy.
ASSEMBLY;
- the mechanical parts and the installed equipment are so Symbols and designations.
arranged that air circulation is not significantly impeded; ∆t0.5 = Temp. rise of air at mid-height of panel.
- conductors carrying currents in excess of 200 A, and the ∆t1.0 = Temp. rise of air at top of panel.
adjacent structural parts are so arranged that eddy-current and ∆tfront = Temp. rise of the front surface of the panel.
hysteresis losses are minimised;
- all conductors shall have a minimum cross-sectional area based
on 125 % of the permitted current rating of the associated circuit.
Selection of cables shall be in accordance with IEC 60364-5-52.
See page P2618 for further information. The cross-section of bars
shall be as tested or as given in IEC / EN 61439-1, Annex N.
Where the device manufacturer specifies a conductor with a larger
cross-sectional area this shall be used;
- the temperature rise depending on the power loss installed in
the enclosure, with or without forced cooling, and for the allowed
different installation methods (e.g. flush mounting, surface
mounting), is available from the enclosure manufacturer.
To be continued in next column......

2607
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Date: 01 MAR 19 P
Type test, example of use. 60
1) Information about the panel ∆t1.0
2) Calculation of power loss 50 ∆t0.5
Temperature-rise, K
3) Use of type test
40
1) Information about the panel.
The following data are necessary to calculate the temperature-rise
30
inside the panel:
20
- the dimensions of the panel, width - height - depth. If the
assembly is provided with vertical partitions, it has to be divided
10
into fictitious sections. 150 250 350 450 550 650
200 Power loss, P
Select worst possible section and select a sections corresponding
to CUBIC's test. If result on this background is satisfactory, the
result for the other sections will also be satisfactory. (The division
into sections makes the calculation of the effective power loss
easier)
The above data are compared with the tests carried out for a panel

section placed against the wall and being Form 1 without any
- the panel’s location: detached or against the wall.
horizontal coverings.
- the design of the panel, i.e. with or without ventilation openings.
- the number of internal horizontal partitions.
From the curve it appears that the temperature-rise in the panel
amounts to 21K. Add to this the ambient tempera-ture of 20°C,
2) Calculation of power loss.
meaning that the components fitted in the upper half of the panel
The power losses from components, equipment, conductors, etc.,
must be able to withstand an operating temperature of 41°C.
installed in the panel, are the power losses at the rated currents of
If this is not so - according to the information given by the
the various circuits. These data can be taken from the information
manufacturer - the parameters should be altered, It could be done
provided by the manufacturer.
e.g. by:
The effective power losses in the installed equipment has to be
- mounting of components in the lower half
calculated.
- derating the component
If the loading current, I, is lower than the operating current, In,
- changing the design of the panel
corrections can be made on the basis of the method shown on
- establishing ventilation by means of louvres or perhaps...
page P2617.
- a reassessment of the power loss, etc.
The pages P2617-P2618 can be a usefull be the calculation.
For the above example there may be the following modifications:
Or much more easy.... use CUBIC Galaxy.
- the temperature-rise in the example will be less than the reading,
as the test panel is a “section”, whereas the tested panel is
Please note that the establishment of a realistic diversity factor is
"complete”, i.e. has a larger effective cooling surface.
very important for a correct calculation.
3) Use of a verification test.

The following applies as an example:
- that the panel is 4x10x2 modules (one section for components,
one section for inlet and outlet cables)
- that the panel is placed against a wall.
- that the panel is Form 1.
- that the panel is without ventilation openings.
- that the effective power loss is 200W
- that the ambient temperature is 20°C.

2608
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Date: 01 MAR 19 P
Panel placed against wall Verification tests

Size of
Internal Other characteristics Power loss
panel / section Test, see page
separation Inserts / Form covering
max.
Width / Height / Depth
3x2x1 modules Form 1 100 W P 2609

4x5x1 modules Form 1-2 200 W P 2610



4x10x2 modules Form 1-2 Form covering, one vertical 1200 W P 2613
Panel, detached on all sides Verification tests

Size of
Internal Other characteristics Power loss
panel / section Test, see page
separation Inserts / Form covering
max.
Width / Height / Depth


2609
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Date: 01 MAR 19 P
Panel placed against wall Part of panel: Complete

30
Panel: 3x2x1 modules
3x2x1M ∆t
Internal separation:
Temperature-rise, K
Form 1 20 ∆t
Space for: 3x3x1M

54 units, 18 mm each 10
distributed on 2 DIN-rails.
Outgoing cables: 0
10 20 30 40 50 60 70 80 90 100
- 4 units per DIN-rail. Power loss, P

Form 1
Space for:
108 units, 18 mm each
Outgoing cables:
- 4 units per DIN-rail.
Symbol acc.
to IEC 60890
40
3x5x1M ∆t
30
Temperature-rise, K
Form 1
∆t
20
Space for: 5x3x1M
10
Outgoing cables: 0
20 40 60 80 100 120 140 160 180 200

Form 1
Space for:
Outgoing cables:
- 4 units per DIN-rail.
Symbol acc.
to IEC 60890

2610
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Date: 01 MAR 19 P

30
Internal separation: ∆t
Temperature-rise, K
Form 1-2 20
Space for:
Outgoing cables: 0
20 40 60 80 100 120 140 160 180 200
Symbol acc.
to IEC 60890
30

Temperature-rise, K
∆t
20
Form 1-2
10
Space for:
distributed on 6 DIN-rails. 0
20 40 60 80 100 120 140 160 180 200
Symbol acc. Power loss, P

to IEC 60890

2611
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Date: 01 MAR 19 P

60
Panel: 4x10x1 modules 50 ∆t
Temperature-rise, K
Form 1-2 40
30
Space for:
distributed on 13 DIN-
rails. 10
100 150 250 300 350 400 450 500

to IEC 60890
40
Panel: 6x10x1 modules 30

Temperature-rise, K
Internal separation: ∆t
Form 1-2 20
Space for: 10
distributed on 8 DIN-rails. 0
100 150 250 300 350 400 450 500

to IEC 60890

2612
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Date: 01 MAR 19 P
Panel placed against wall Centre section of panel

60
∆t1.0
50
Section: 4x10x2 modules
Temperature-rise, K
Internal separation: 40 ∆t0.5
Form 1-2
30
No. of Form-coverings:
20
Vertical covering: 0
Horizontal covering: 0 10
150 250 350 450 550 650

to IEC 60890
70
∆t1.0
Section: 4x10x2 modules 60

Temperature-rise, K
∆t0.5
Form 1-2 50
No. of Form-coverings: 40
650 750 850 950 1050 1150

to IEC 60890
90 Note:
∆t1.0 If during normal
80 operation
Section: 4x10x2 modules ∆t0.5 touching
Temperature-rise, K
Internal separation: 70 the panel is

necessary, the
Form 1-2 60
power loss must
not be more
than 1000 W
50 corresponding
No. of Form-coverings: to a maximum
Vertical covering: 0 40 ∆tfront temperature-rise
∆tfront of 30K.
1100 1200 1300 1400 1500 1600 1700 1800

to IEC 60890

2613
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Date: 01 MAR 19 P
Panel placed against wall Centre section of panel

∆t1.0
70
∆t0.5
Temperature-rise, K
Internal separation: 50
Form 1 40
∆tfront
30
Vertical covering: 1 20
500 600 700 800 900 1000 1100 1200

to IEC 60890
65 ∆t1.0
55
Section: 9x10x4 modules ∆t0.5
Temperature-rise, K
Form 1 35
25 ∆tfront
500 1000 1500 2000 2500 3000

to IEC 60890

2614
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Date: 01 MAR 19 P
Panel, detached on all sides Centre section of panel

50
∆t1.0
Temperature-rise, K
Internal separation: ∆t0.5
Form 1-2 30
No. of Form-coverings: 20
150 250 350 450 550 650

to IEC 60890
65
∆t1.0
55
Section: 9x10x4 modules
Temperature-rise, K
∆t0.5
Form 1-2 35
25 ∆tfront
500 1000 1500 2000 2500 3000

to IEC 60890

2615
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Date: 01 MAR 19 P
Temperature-rise verification of assemblies or assembly The effective power losses of all circuits including interconnecting
sections Form 1 to 4 with a rated current up to 1600A conductors shall be calculated based on maximum load currents
of the circuits. The total power loss of the ASSEMBLY is calculated
Introduction by adding the power losses of the circuits taking additionally
The possibility for verification of the temperature-rise limits by into account that the total load current is limited to the rated
calculation is stated in IEC / EN 61439-1, clause 10.10 where IEC/ current of the ASSEMBLY. The power losses of the conductors are
TR 60890 is mentioned as reference. determined by calculation (see page P2618).
In the introduction to IEC/TR 60890 it is informed is given that the Calculation

factors and coefficients have been derived from measurements Necessary information
on numerous of ASSEMBLIES and that the method(s) has been The following data are needed to calculate the temperature-rise of
verified by comparison with test results. the air inside an enclosure:
The method described in IEC/TR 60890 can be used for - the dimensions of the enclosure: height / width / depth;
assemblies where temperatur-rise test is either not feasible or - the type of installation of the enclosure according to
economically not justifiable. Fig. 4, page P2619;
In relation to this it can be mentioned that ASSEMBLIES normally - the design of the enclosure, i.e. with or without ventilation
are manufactured or assembled on an one-off basis, incorporating openings;
a more or less random combination of devices and components. - the number of internal horizontal partitions;
- the effective power losses of the equipment installed in the
ASSEMBLIES, where the temperature-rise limits are verified by enclosure.
calculation, are on the same basis as ASSEMBLIES, where the
temperature-rise limits are verified by test, when the requirements Note!
in IEC / EN 61439-1 are fulfilled. (See here below) The effective power losses of the equipment installed in the
circuits of the assembly used for this calculation are the power
The method described on the following pages to calculate power losses at the rated currents of the various circuits to be taken from
loss and temperature-rise is based on IEC/TR 60890. the information provided by the manufacturer.
The power losses of the conductors, page P2618, are based on
Conditions for application IEC / EN 61439
Verification of the temperature-rise of a multiple compartment
ASSEMBLY with the total supply current not exceeding 1600 A and Calculation procedure
for rated frequencies up to and including 60 Hz, may be made by The effective power losses of the equipment installed may be
calculation in accordance with the method of IEC/TR 60890 if all calculated by using the tables on pages P2617 and P2618. If the
the following conditions are fulfilled: current, I (loading), is lower than the operating current, In then the
- the power loss data for all built-in components is available from equation shown on page P2617 may be used.
the component manufacturer;
- there is an approximately even distribution of power losses For the enclosures specified in the head lines on pages P2619,
inside the enclosure; P2620 and P2621, the calculation of the temperature-rise of the
- the rated current of the circuits of the ASSEMBLY does not air inside the enclosures is carried out by using the formula and
exceed 80% of the rated conventional free air thermal current figurers stated on the individual pages.
(Ith) of the switching devices and electrical components included
in the circuit. Circuit protection devices shall be selected to Note!
ensure adequate protection to outgoing circuits, e.g. thermal For calculating purpose, enclosures without vertical partitions
motor protection devices at the calculated temperature in the or individual sections e. g. Form 1-2 panels having an effective
ASSEMBLY; cooling surface greater than 11.5 m² or a width greater than about
- the mechanical parts and the installed equipment are so 1.5 m should be divided into fictitious sections, the dimensions of
arranged that air circulation is not significantly impeded; which approximate the foregoing values. The surface factor, b, is
- conductors carrying currents in excess of 200 A, and the by Form 1-2 panels zero in relation to the side faces.
adjacent structural parts are so arranged that eddy-current and
hysteresis losses are minimised; For calculating purpose, enclosures with vertical partitions or
- all conductors shall have a minimum cross-sectional area based individual sections e. g. Form 3-4 panels having an effective
on 125 % of the permitted current rating of the associated circuit. cooling surface greater than 11.5 m² or a width greater than about
Selection of cables shall be in accordance with IEC 60364-5-52. 1.5 m should be divided into fictitious sections, the dimensions of
See page P2618 for further information. The cross-section of bars which approximate the foregoing values. The surface factor, b, is
shall be as tested or as given in IEC / EN 61439-1, Annex N. by Form 1-2 panels 0.5 in relation to the side faces.
Where the device manufacturer specifies a conductor with a larger
cross-sectional area this shall be used; Symbols and designations:
- for enclosures with natural ventilation, the cross section of the Ao = Surfaces on the outer side of panel
air outlet openings is at least 1,1 times the cross section of the air A e = Efficient cooling surface of panel
inlet openings; ∆t0.5 = Temp. rise of air at mid-height of panel
- there are no more than three horizontal partitions in the ∆t1.0 = Temp. rise of air at top of panel
ASSEMBLY or a section of an ASSEMBLY;
- for enclosures with compartments and natural ventilation the
cross section of the ventilating openings in each horizontal
partition is at least 50% of the horizontal cross section of the
compartment.
Note: VAV has a ventilation opening ≥ 50%

2616
GB
S Verifikation av temperaturstegringsgränser
Date: 01 MAR 19 P
ASSEMBLY closed, examples ASSEMBLY ventilated, examples
Equation in relation to lower current (operating)
( II )
2 2.6
n 2.4
2.2
2.0 The power losses given in the tables on page P2618 are based on
the relevant rated current for conductors.
Power loss factor
1.8
1.6
At a lower or higher load the following equation may be used:
1.4
1.2 P = Pn ( II )2
n
1.0
I = current (loading / actual)
0.8
P = power losses in watts at I
0.6
In = rated current (operating)
0.4 Pn = power losses at In
0.2
0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6
I
In

2617
S
GB
Date: 01 MAR 19 P
Calculation of power losses for components and devices

Reference I In Pn P No. Ploss Reference I In Pn P No. Ploss
[A] [A] [W/pcs] [W/pcs] [pcs] [W] [A] [A] [W/pcs] [W/pcs] [pcs] [W]
Column 1 Brought forward from column 1
Bring forward to column 2 Bring forward to column 3, next page

Example 1: Example 2:
MCCB 250A, 3 P Contactor 18 A, 3 P (AC 3)

Current (Load), I 180 A Current (Load), I 14 A
Rated current, In 250 A Rated current, In 18 A
Power loss Pn at In for 3 P 63 W Effekttab Pn ved In for 3 P 2.4 W
Power loss P at I (180/250)2 x 63 32.66 W Power loss P at I (14/18)2 x 2.4 1.45 W
Power loss per coil (no equation can be used) 3.8 W

2618
S
GB
Date: 01 MAR 19 P
Calculation of power losses for busbars and conductors

Reference I In Pn P Amount Ploss Reference I In Pn P No.: Ploss
[A] [A] [W/M] [W/M] [M] [W] [A] [A] [W/m] [W/m] [m] [W]
Brought forward from column 2 Brought forward from column 3

System 225 vertical busbars Insulated conductors, power loss per meter
2 - 5 x 5 Cu, 3P + N 250 19 Air temperature around the conductors 55°C
1.5 mm2 - one length 8 0.8
System 2000 and 2000D vertical busbars
2 - 10 x 10 Cu, 3P + N 770 47
2 - 10 x 20 Cu, 3P + N 1150 54
2 - 10 x 30 Cu, 3P + N 1500 63
10 mm2 - one length 24 1.3
2 - 10 x 40 Cu, 3P + N 1650 60
2 - 10 x 50 Cu, 3P + N 1850 62
2 - 10 x 60 Cu, 3P + N 2000 61
System 2000HD horizontal busbars 50 mm2 - one length 65 2.0
2 - 10 x 10 Cu, 3P + N 485 19 70 mm2 - one length 83 2.2
2 - 10 x 40 Cu, 3P + N 1640 59
Insulated conductors, power loss per meter
2 - 10 x 50 Cu, 3P + N 1830 60
Air temperature around the conductors 55°C
55º
2 - 10 x 60 Cu, 3P + N 2020 63
2 - 10 x 80 Cu, 3P + N 2400 70
System 7000 horizontal busbars 6.0 mm2 - one length 23 2.0
C
Bring forward to column 4
120 mm2 - one length 165 5.0
150 mm2 - one length 191 5.4
185 mm2 - one length 220 5.7
240 mm2 - one length 260 6.1
NOTE: Insulated conductors, power loss per meter
Assemblies or sections must not be loaded more than 1600A, when Air temperature around the conductors 55°C
the temperature-rise is verified by calculation.
When the temperature-rise is calculated according to IEC/TR 60890, 25 mm2 - one length 89 6.9
wires and components etc. are not allowed to be loaded more than 35 mm2 - one length 110 7.7
80% of the tested values. 50 mm2 - one length 134 8.3
Big “M” for busbars is equal to Modules
Small “m” for wires is equal to meters 95 mm2 - one length 208 10.0
120 mm2 - one length 242 10.7
150 mm2 - one length 278 11.5
Example 3: 185 mm2 - one length 318 12.0
240 mm2 - one length 375 12.7
Conductor 1.5 mm2, 100 m in common bundle
Current (load), I 5 A Insulated conductors, power loss per meter
Rated current, In 8 A Air temperature around the conductors 55°C
Power loss Pn at In per meter 0.8 W
0.50 mm2 - one length 4.2 0.8
Power loss P at I (5/8)2 x 0.8 0.32 W
Power loss P for 100 meter 32 W 0.75 mm2 - one length 5.4 0.8
1.00 mm2 - one length 6.1 0.8
Example concerning rated diversity factor (RDF): Total power loss
Rated diversity factor, RDF (see chapter 2)
Total power loss according to the
Effective power loss P in W
calculation above: 300 W
(total power loss x RDF2)
Rated diversity factor for the panel, total: 0.6
Effective power loss 300 x 0.62 108 W
IEC / EN 61439-1 Annex H og N

2619
DK Beregning af luftens temperaturstigning i tavler
GB
S Beräkning av luftens temperaturstegring i kapslingar
Calculation of temperature-rise of air inside assemblies
Date: 01 MAR 19 P
D Berechnung der Übertemperatur der Luft im Gehäuse
F Calcul de l'échsuffement de l'intérieur des enveloppes Index
Enclosure WITHOUT ventilation openings and a total effective cooling surface > 1.25 m2
Identification: Dimensions:
Date: Init: Version: Width: Height: Depth:
Table III Effective cooling surface Ae A0 Surface A0 x b

factor b
Surface Surface factor according
b mxm m2 to Table III m2
Exposed top surfaces 1.4 2 3 4 5
Covered top surfaces 0.7 Top
Exposed side surfaces (e.g.front) 0.9 Front
Covered side faces (backside) 0.5 Rear
Sides faces, central 1) (e.g. Form 3-4) 0.5 Left-hand side
Fictitious sides 2) (e.g. Form 1-2) 0.0 Right-hand side
Floor surface, not considered -
Total effective cooling surface: Ae = ∑ (A0 x b)
1)
Sections with vertical covering e.g. Form 3-4 panels.
2)
Sections without vertical covering e.g. Form 1-2 panels.
Table IV Height / base factor:

h1.35
Number of horizontal partitions 0 1 2 3 f= = =

Ab
f = Height / base factor
Factor d 1.00 1.05 1.15 1.30
h = Enclosure height
Ab = Enclosure base surface (width x depth)
1.35 = Exponent to h
Fig.3
1 Calculation of ∆t0.5 and ∆t1.0
0.9 Air inlet openings in cm2
0.8 Effective power loss P in W

PX = P0.804
0.7
Enclosure constant k
Factor d according to Table IV

0.6
Enclosure constant k according to Fig.3
0.5
∆t0.5 = PX x d x k
0.4 Distribution factor c according to Fig.4
0.3 ∆t1.0 = c x ∆t0.5
0.2 1.0
Note!
Multiple of enclosure
0.1
0.75 The temperature of air
0
0 1 2 3 4 5 6 7 8 9 10 11 12
inside the enclosure is
0.5 the ambient tempera-
Effective cooling surface Ae (m2) ture + the temperature-
rise, Tamb. + ∆t.
height
Fig.4
1
Temperature distribution factor c
1.6
2 Temperature-rise of air
3 inside the enclosure ∆t
1.5 4
5 Evaluation of the design
1.4 It shall be determined whether the equipment within the
ASSEMBLY can operate satisfactorily at the relevant calculated
1.3
temperature-rise.
1.2 If not so, the parameters will have to be changed and the
calculation repeated.
1.1
1
0 1 2 3 4 5 6 7 8 9 10 11 12 13
Height / base factor f
Symbol Curve
= Separate enclosure, detached on all sides 1
= Separate enclosure for wall-mounting 3
= First or last enclosure, detached type 2
= First or last enclosure, wall-mounting type 4
= Central enclosure, detached type 3
= Central enclosure, wall-mounting type 5
= Central enclosure for wall-mounting andwithcovered top surface 4

2620
GB
Date: 01 MAR 19 P
Enclosure WITH ventilation openings and a total effective cooling surface > 1.25 m2

factor b
1)
2)
Table V Height / base factor:

h1.35
Number of horizontal partitions 0 1 2 3 f= = =

Ab
f = Height / base factor
Factor d 1.00 1.05 1.10 1.15
Ab = Enclosure base surface (width x depth)
1.35 = Exponent to h
Fig.5
0.38 Calculation of ∆t0.5 and ∆t1.0
Effective cooling surface Ae (m2)
0.36 1
Air inlet openings in cm2
0.34
1.5
0.32 Effective power loss P in W
2
0.30
PX = P0.715
2.5
0.28
0.26
3 1)
The cross-section of Factor d according to Table V
the corresponding air
0.24
4
outlet openings should Enclosure constant k according to Fig.5
0.22
5 be at least 1.1 times that
6 of the air inlet openings. ∆t0.5 = PX x d x k
0.20 7
0.18 8 CUBICS's louvres: Distribution factor c according to Fig.6

10 1 As outlet = 5.0 cm2
0.16 1.5
As inlet = 4.5 cm2 ∆t1.0 = c x ∆t0.5
12 2
0.14 14 2.5
3
0.12 4
5 1.0
0.10 6
Note!
7
0.08 8
10 0.75 The temperature of air
12
0.06 14
inside the enclosure is
0 100 200 300 400 500 600 700 0.5 the ambient tempera-
Cross-section of air inlet openings1) (cm2) ture + the temperature-
rise, Tamb. + ∆t.
height
Fig.6 Height / base factor

2.2
10 Temperature-rise of air
9
2.1 8 inside the enclosure ∆t
7
6
2
5
4 Evaluation of the design
1.9
3
2 It shall be determined whether the equipment within the
1.5
1.8 1)
The cross-section of
the corresponding air
temperature-rise.
1.7 outlet openings should If not so, the parameters will have to be changed and the
1.6
be at least 1.1 times that calculation repeated.
of the air inlet openings.
1.5 CUBICS's louvres:
As outlet = 5.0 cm2
1.4
As inlet = 4.5 cm2
1.3
1.2
1.1
1
0 100 200 300 400 500 600 700
Cross-section of air inlet openings1) (cm2)

2621
GB
Date: 01 MAR 19 P
Enclosure WITHOUT ventilation openings and a total effective cooling surface ≤ 1.25 m2

factor b
1)
2)
Height / base factor:

h
g= = =

w
g = Height / width factor
w = Enclosure width
Fig.7
Calculation of ∆t0.5 and ∆t1.0
5 Air inlet openings in cm2
4 Effective power loss P in W
3
PX = P0.804
2.5
2 Enclosure constant k according to Fig.7
1.5
∆t0.5 = PX x d x k
Distribution factor c according to Fig.8
∆t1.0 = c x ∆t0.5
1
0.8 1.0
Note!
0.7
0.6 0.75 The temperature of air
0.5 inside the enclosure is
0.05 0.07 0.1 0.15 0.2 0.3 0.4 0.5 0.7 1 1.3
0.5 the ambient tempera-
Effective cooling surface Ae (m ) 2
ture + the temperature-
rise, Tamb. + ∆t.
height
Fig.8
Temperature-rise of air
1.25 inside the enclosure ∆t
Evaluation of the design

1.20 It shall be determined whether the equipment within the
temperature-rise.
If not so, the parameters will have to be changed and the
1.15
calculation repeated.
1.10
1.05
1
0.05 0.5 1 1.5 2 2.5
Height / width factor g

2622
DK Verifikation af kortslutningsholdbarhed
GB
S Verifikation av kortslutningshållfasthet
Verification of short-circuit withstand strength
Date: 01 MAR 19 P
D Verifikation von Kurzschlussfestigkeit
F Vérification de tenue au court-circuit Index
Short-circuit verification by design rules
The short-circuit withstand strength values in the tables in the respective chapters for inserts and busbars have been verification
tested. The values can be used as reference to verify a design that deviate from that original verified by test.
Verification is undertaken by comparison of the ASSEMBLY to be verified with an already tested design using the check list provided in
Table 13.
Should any elements identified in the check list not comply with the requirements of the check list and be marked ‘NO’, one of the fol-
lowing means of verification shall be used: (see IEC / EN 61439-1, 10.11.4 og 10.11.5.)
IEC / EN 61439-1, 10.11.4, Verification by comparison with a reference design

Assessment of the rated short-time withstand current of an ASSEMBLY and its circuits, by calculation, shall be undertaken by a compari-
son of the ASSEMBLY to be assessed with an ASSEMBLY, already verified by test.
The assessment to verify the main circuits of an ASSEMBLY shall be in accordance with IEC/TR 61117. In addition each of the circuits of
the ASSEMBLY to be assessed shall meet the requirements of items 6, 8, 9 and 10 in Table 13.
The data used, calculations made and comparison undertaken shall be recorded.
If the assessment in accordance with IEC/TR 61117 is not passed or any of the items listed bellow are not fulfilled then the ASSEMBLY
and its circuits shall be verified by test in accordance with IEC 61439
IEC 61439-1, Table 13, check list

Item Requirements to be considered YES NO
No.
1 Is the short-circuit withstand rating of each circuit of the ASSEMBLY to be assessed, less than or equal to,
that of the reference design?
2 Is the cross sectional dimensions of the busbars and connections of each circuit of the ASSEMBLY to be
assessed, greater than or equal to, those of the reference design?
3 Is the spacing of the busbars and connections of each circuit of the ASSEMBLY to be assessed, greater
than or equal to, those of the reference design?
4 Are the busbar supports of each circuit of the ASSEMBLY to be assessed of the same type, shape and ma-
terial and have, the same or smaller spacing, along the length of the busbar as the reference design?
5 Are the material and the material properties of the conductors of each circuit of the ASSEMBLY to be asses-
sed the same as those of the reference design?
6 Are the short-circuit protective devices of each circuit of the ASSEMBLY to be assessed equivalent, that
is of the same make and seriesa) with the same or better limitation characteristics (I2t, Ipk) based on the
device manufacturer’s data, and with the same arrangement as the reference design?
7 Is the length of unprotected live conductors, in accordance with 8.6.4, of each non-protected circuit of the
ASSEMBLY to be assessed less than or equal to those of the reference design?
8 If the ASSEMBLY to be assessed includes an enclosure, did the reference design include an enclosure when
verified by test?
9 Is the enclosure of the ASSEMBLY to be assessed of the same design, type and have at least the same
dimensions to that of the reference design?
10 Are the compartments of each circuit of the ASSEMBLY to be assessed of the same mechanical design and
at least the same dimensions as those of the reference design?
‘YES’ to all requirements – no further verification required.
‘NO’ to any one requirement – further verification is required, see IEC 61439-1 clause 10.11.4 and 10.11.5.
a)
Short-circuit protective devices of the same manufacture but of a different series may be considered equivalent where the device manufacturer declares the performance characteri-
stics to be the same or better in all relevant respects to the series used for verification, e.g. breaking capacity and limitation characteristics (I2t, Ipk), and critical distances.

2623
DK Rutineverifikation
S
GB
Rutinmässig verifikation
Routine verification
Date: 01 MAR 19 P
D Routine Verifikation
F Vérification de routine Index
Routine verification
Routine verification is intended to detect faults in materials and workmanship and to ascertain proper functioning of the manufactured
ASSEMBLY. It is made on every ASSEMBLY. The ASSEMBLY manufacturer shall determine if routine verification is carried out during and/
or after manufacture. Where appropriate, routine verification shall confirm that design verification is available.
Routine verification is not required to be carried out on devices and self-contained components incorporated in the ASSEMBLY when they
have been selected in accordance with IEC / EN 61439-1, 8.5.3 and installed in accordance with the instructions of the device manufactu-
rer.
Verification shall comprise the following categories:
Construction (For further information: see IEC / EN 61439-1, 11.2 to 11.8):

a) degree of protection of enclosures;
b) clearances and creepage distances;
c) protection against electric shock and integrity of protective circuits;
d) incorporation of built-in components;
e) internal electrical circuits and connections;
f) terminals for external conductors;
g) mechanical operation.
Performance (For further information: see IEC / EN 61439-1, 11.9 to 11.10):

a) dielectric properties;
b) wiring, operational performance and function.


Index: Designverifikation Designverifikation Design Verification Design-Verifikation Vérification de La Conception

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Index: Designverifikation Designverifikation Design Verification Design-Verifikation Vérification de La Conception

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2601

IEC / EN 61439-1, Clause 10

CUBIC-Modulsystem A/S Tel +45 9882 2400

The modular system have been verification tested at different

The modular system have been clearance distance

The modular system have been creepage distance verification

CUBIC-Modulsystem A/S Tel +45 9882 2400

Incorporation of switching devices and components in the

Internal electrical circuits and connections in the original

Terminals for external conductors in the original design

Dielectric properties: 10.9

CUBIC-Modulsystem A/S Tel +45 9882 2400

Temperature-rise verification of assemblies or assembly

Temperature-rise verification of assemblies or assembly

The short-circuit withstand strength values in the tables in

The following circuits in ASSEMBLIES are exempted from the

The modular system has been verified by assessment

The modular system have been verification tested and found

CUBIC-Modulsystem A/S Tel +45 9882 2400

ASSEMBLIES Example: By comparing e.g. a tested functional unit, the IP54

NOTE: The term ASSEMBLY do also cover a section of an

CUBIC-Modulsystem A/S Tel +45 9882 2400

- Calculation based on IEC/TR 60890 Test results vs the calculation method.

To be continued in next column......

CUBIC-Modulsystem A/S Tel +45 9882 2400

3) Use of a verification test.

CUBIC-Modulsystem A/S Tel +45 9882 2400

Panel placed against wall Verification tests

3x2x1 modules Form 1 100 W P 2609

4x5x1 modules Form 1-2 200 W P 2610

4x10x1 modules Form 1-2 500 W P 2611

4x10x2 modules Form 1-2 650 W P 2612

Panel, detached on all sides Verification tests

4x10x2 modules Form 1-2 650 W P 2614

CUBIC-Modulsystem A/S Tel +45 9882 2400

Panel placed against wall Part of panel: Complete

Space for: 3x3x1M

Panel: 3x3x1 modules

Panel: 5x3x1 modules

CUBIC-Modulsystem A/S Tel +45 9882 2400

Panel placed against wall Part of panel: Complete

Panel: 6x5x1 modules

Symbol acc. Power loss, P

CUBIC-Modulsystem A/S Tel +45 9882 2400

Panel placed against wall Part of panel: Complete

Panel: 4x10x1 modules 50 ∆t

Symbol acc. Power loss, P

Panel: 6x10x1 modules 30

Symbol acc. Power loss, P

CUBIC-Modulsystem A/S Tel +45 9882 2400

Panel placed against wall Centre section of panel

Symbol acc. Power loss, P

Section: 4x10x2 modules 60

Symbol acc. Power loss, P

Internal separation: 70 the panel is

Symbol acc. Power loss, P

CUBIC-Modulsystem A/S Tel +45 9882 2400

Panel placed against wall Centre section of panel

Symbol acc. Power loss, P

Symbol acc. Power loss, P

CUBIC-Modulsystem A/S Tel +45 9882 2400

Panel, detached on all sides Centre section of panel

Section: 4x10x2 modules 40