Professional Documents
Culture Documents
Sector:
ELECTRONICS
Qualification:
ELECTRONIC PRODUCTS ASSEMBLY AND SERVICING NC II
Unit of Competency:
ASSEMBLE ELECTRONIC PRODUCTS
Module Title:
ASSEMBLING ELECTRONIC PRODUCTS
If you have questions, don’t hesitate to ask your Trainer for assistance.
You have already some basic knowledge and skills covered in this module
because you have been working for some time; on already completed training in
this area.
After completing this module, ask your Trainer to assess your competence.
Result of your assessment will be recorded in your competency profile. All the
learning activities are designed for you to complete at your own pace.
In this module, you will find the activities for you to complete and relevant
information sheets for each learning outcome. Each learning outcome may have
more than one learning activity.
Document No.01
LEARNING OUTCOMES:
1. Prepare to assemble electronic products
2. Prepare/make PCB modules
3. Mount and solder electronic components
4. Assemble electronic products
5. Test and inspect assembled electronic products
ASSESSMENT CRITERIA:
1.1 Assembly workplace is prepared in accordance with OH&S policies and
procedures
1.2 Established risk control measures for work preparation are followed.
1.3 Work instructions are obtained and clarified based on job order or client
requirements
1.4 Responsible person is consulted for effective and proper work
coordination
1.5 Required materials, tools and equipment are prepared and checked in
accordance with established procedures
1.6 Parts and components needed to complete the work are identified, prepared
and obtained according to requirements
PREREQUISITE: NONE
Document No.01
CONTENTS:
Identify the different tools and materials in assembling electronic products
Make simple PCB design, etch PCB, drill PCB, clean PCB
Mount and solder electronic components following the diff. soldering
techniques
Assemble electronic products in accordance with the standard
Conduct testing of assembled electronic products
ASSESSMENT CRITERIA:
1.6 Assembly workplace is prepared in accordance with OH&S policies and
procedures
1.7 Established risk control measures for work preparation are followed.
1.8 Work instructions are obtained and clarified based on job order or client
requirements
1.9 Responsible person is consulted for effective and proper work coordination
1.10 Required materials, tools and equipment are prepared and checked in
accordance with established procedures
1.6 Parts and components needed to complete the work are identified, prepared and
obtained according to requirements
CONDITION:
The students/trainees must be provided with the following:
Masking tape
Protractor/ruler
Paper sand
Blade cutter
Soldering iron
Desoldering pump
Solder lead
Sets of pliers
Sets of screw drivers
EVALUATION METHOD:
Hands-on
Direct observation
Practical demonstration
Project making laboratory
Document No.01
Document No.01
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
SELF CHECK No.1.1-1
Identify the different tools and materials in assembling electronic
products
Matching Type: Match the Hand Tools in Column A with its function in
Column B. Write your answer in sheet of paper.
Column A Column B
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
ANSWER KEY OF 1.1-1
1.SOLDER LEAD
2. Soldering stand
3. Side Cutter Pliers
4. Philips Screw Driver
5. Soldering iron
6. Desoldering Tool
7. Long nose plier
8. Analog multimeters
CONTENTS:
Identify the different tools and materials in assembling electronic
products
Make simple PCB design, etch PCB, drill PCB, clean PCB
Mount and solder electronic components following the diff. soldering
techniques
Assemble electronic products in accordance with the standard
Conduct testing of assembled electronic products
ASSESSMENT CRITERIA:
1.11 PCB layout is verified for conformity with the schematic diagram in
accordance with the layout rules
1.12 PCB layout is transferred to copper-cladded board following acceptable
methods and standards
1.13 Visual inspection is performed based on standards procedures.
1.14 Thru-hole is drilled based on standards procedures
1.15 PCB is cleaned based on standards procedures
Functionality of PCB is tested and visual inspection is performed based on
standards procedures
CONDITION:
The students/trainees must be provided with the following:
Masking tape
Protractor/ruler
Paper sand
Blade cutter
Soldering iron
De soldering pump
Solder lead
Sets of pliers
Sets of screw drivers
EVALUATION METHOD:
Hands-on
Direct observation
Practical demonstration
Project making laboratory
LEARNING EXPERIENCE
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Learning Outcome 2: Make PCB design
Etch PCB, Drill PCB, Clean PCB
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Make PCB design
Etch PCB, Drill PCB, Clean PCB
Steps and procedure how to make PCB design
If you are into electronics, PCBs are some of the most common things
you will see. These boards make our lives easier by eliminating all those
conductive tracks, pads, and other features etched from copper sheets
reduce the wiring, thereby reducing the faults arising due to loose
connections. One simply needs to place the components on the PCB and
solder them.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Since laser method is the industrial method to make PCBs, we will go
PCB Design:
diagram into a PCB layout using PCB layout software. There are many
cool open source software packages for PCB layout creation and design.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
You also need: FeCl3 powder/solution (same as etching solution),
Take a print out of your PCB layout using a laser printer and the A4
Cut the copper board according to the size of the layout using a hacksaw
or a cutter.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Copper clad plate
Next, rub the copper side of the PCB using steel wool or abrasive sponge
scrubs. This removes the top oxide layer of copper as well as the
photoresist layer. Sanded surfaces also allow the image from the paper to
stick better.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Rubbing away the top oxide layer
Transfer the printed image (taken from a laser printer) from the photo
paper to the board. Make sure to flip top layer horizontally. Put the
copper surface of the board on the printed layout. Ensure that the board
is aligned correctly along the borders of the printed layout and use tape
to hold the board and the printed paper in the correct position.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Place the printed side of the paper on the plate
Using the circuit as a reference, draw a basic sketch on the copper plate
with a pencil. Once your sketch looks good, trace over it with a
STEP 4: Iron the Circuit from the Paper onto the PCB Plate
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Put the board and photo paper arrangement on a
steady. Then put the hot iron on the other end for
about 5 to 15 mins.
After ironing, place the printed plate lukewarm water for about 10
minutes. The paper will dissolve, then you can remove the paper gently.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Peeling the paper
In some cases, when removing the paper, some of the tracks get fainted.
In the figure below, you can see that the track is light in color, hence we
Light trace
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Darkening the trace
water.
Etched copper
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
plate
STEP 6: Cleaning, Disposal, and the Final Touches for the Circuit
Board
Be careful while disposing of the etching solution, it’s toxic to fish and
sink when you are done, it is ILLEGAL and might damage your pipes
(who knew you could get arrested while making a PCB?!). Instead, dilute
the etching solution and then throw it away somewhere safe.
cotton wool will remove completely the toner/ink on the plate, exposing
the copper surface. Rinse carefully and dry with a clean cloth or kitchen
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Removing the ink
Now, drill holes using a PCB driller like this PCB driller and solder all
your cool components to the board. If you want that traditional green
PCB look, apply solder resistant paint on top PCB lacquer. And finally,
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
SELF CHECK No.1.1-2
TEST 1: ENUMERATION
PLEASE READ CAREFULLY THE GIVEN QUESTION
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Answer key of 1.1-2
1,
6. Cleaning, Disposal, and the Final Touches for the Circuit Board
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
LEARNING OUTCOME SUMMARY
LEARNING
OUTCOME 3
Mount and solder electronic components
CONTENTS:
Identify the different tools and materials in assembling electronic
products
Make simple PCB design, etch PCB, drill PCB, clean PCB
Mount and solder electronic components following the diff. soldering
techniques
Assemble electronic products in accordance with the standard
Conduct testing of assembled electronic products
ASSESSMENT CRITERIA:
1.16 Knowledge of lead and lead-free soldering characteristics and
requirements are applied to mounting and soldering process in accordance
with OH&S standards
1.17 Components are mounted and soldered in accordance with soldering
principles.
1.18 Soldering/De soldering techniques and procedures are applied in
accordance with established standards and requirements.
Soldered products are checked and complied with international standards and
task specifications
CONDITION:
The students/trainees must be provided with the following:
Soldering iron
De soldering pump
Solder lead
Sets of pliers
Sets of screw drivers
EVALUATION METHOD:
Hands-on
Direct observation
Practical demonstration
Project making laboratory
LEARNING EXPERIENCE
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Learning Outcome 3: Mount and solder electronic components
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Mount and solder electronic components fallowing the different
solder techniques
SOLDERING PROCEDURE
Step 1 Check that your soldering iron tip is suitable for the Project. (no larger than the
diameter of the pad).
Check the tip is clean and shiny. If not, tin it by adding a small amount of
solder to the tip.
Step 2 Adjust the temperature of the soldering station to 3500 C (degrees Celsius )
Step 3 Ensure the solder sponge is damp. A dry sponge will not clean the tip
effectively, and one that is too wet will lower the temperature of the tip making
for an ineffective solder joint.
Step 4 Carefully wipe the tip on the damp sponge until clean. Continually wipe the tip
while soldering a circuit board.
Step 5 Insert the component to be soldered into the circuit board and bend the leads
protruding from the bottom of the circuit board at an angle of approx 450.
Step 6 Cut the leads of the component close to the outer edge of the solder pad.
Step 7 When ready, hold the soldering iron at a 45 angle, and heat both the lead and
the pad simultaneously. Touch the solder wire in the space between the iron
tip and the lead.
Keep the soldering iron tip still while moving the solder around the joint as it
Step 7 melts.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Step 8 Remove the solder tip first and the solder wire next, (prevents spiking).
Step 9 Allow to the joint to cool naturally and undisturbed, do not blow on the solder
joint to cool it.
Step 10 When you have completed all solder joints thoroughly clean your board, using
Isopropyl Alcohol, and a bristle brush, to remove the flux residue and other
contaminants.
Step 11 Wipe or pat dry with a lint free tissue to remove traces of residue.
Step 12 Inspect for a good solder connection. The solder joint should be clean, smooth
and shiny.
The solder fillet should be concave in shape, feathering out smoothly to the
edge of the pad. In the diagram below figure b) is the ideal solder joint.
Figure a) the amount of solder applied is minimal and may result in a poor
electrical connection over time.
Step 13 Leave a large blob of solder on the tip when switching the iron off as this will
protect the tip from oxidation and contamination.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
SELF CHECK No.1.1-3
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
ANSWER KEY OF 1.1-3
1. Soldering iron
2. Soldering pump
3. Soldering lead
4. Soldering Stand
5. Soldering paste
6. PCB clad Board
7. Mini Drill
8. Test jigs
1. Check that your soldering iron tip is suitable for the Project
2. Adjust the temperature of the soldering station to 3500 C
3. Ensure the solder sponge is damp
4. Carefully wipe the tip on the damp sponge until clean
5. Bend the lead of the component
6. Cut the leads of the component close to the outer edge of the solder pad.
7. When ready, hold the soldering iron at a 45° angle, and heat both the lead
and the pad simultaneously.
8. Remove the solder tip first and the solder wire next, (prevents spiking)..
9. Allow to the joint to cool naturally and undisturbed, do not blow on the solder
joint to cool
10. When you have completed all solder joints thoroughly clean your board
11. Wipe or pat dry with a lint free tissue to remove traces of residue.
12. Inspect for a good solder connection. The solder joint
13. Leave a large blob of solder on the tip when switching the iron off as this
will protect the tip from oxidation and contamination.
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
LEARNING OUTCOME SUMMARY
LEARNING
Perform electronic products assembly
OUTCOME 4
CONTENTS:
Identify the different tools and materials in assembling electronic
products
Make simple PCB design, etch PCB, drill PCB, clean PCB
Mount and solder electronic components following the diff. soldering
techniques
Assemble electronic products in accordance with the standard
Conduct testing of assembled electronic products
ASSESSMENT CRITERIA:
1.19 Work instructions is followed based on job order or client requirements
1.20 Assembly procedures are performed in accordance with OH&S policies
and work instructions
1.21 Modules and accessories are connected/integrated into the final product
based on the client specifications
CONDITION:
The students/trainees must be provided with the following:
Soldering iron
De soldering pump
Solder lead
Sets of pliers
Sets of screw drivers
EVALUATION METHOD:
Hands-on
Direct observation
Practical demonstration
Project making laboratory
LEARNING EXPERIENCE
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Learning Outcome 4: Perform electronic products assembly
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Assemble electronic products in accordance with the standard
Screw driver
1. screw driver
2. long nose
3. diagonal cutter
4. de soldering pump
5. Soldering iron
7. Electrolytic capacitor
8. 1k resistor
9. Rotary switch
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
16. Multiple transformer
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
SELF CHECK NO:1.1-4
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Answer key of 1.1-4
TEST I:
1. Soldering iron
2. Soldering pump
3. Soldering stand
4. Resistor
5. Electrolytic capacitor
6. Rectifier diode
7. Lead wire
8. Stranded wire
9. Power supply casing
10. Rotary switch
11. Single pole double throw switch
12. Led power indicator
13. Multiple transformer
14. Long nose
15. Diagonal cutter
16. Plug cord
17. Alligator clip
18. Screw driver
19. PCB design
20. Sets of screw
TEST II:
1. 20 STEPS
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
LEARNING OUTCOME SUMMARY
LEARNING TEST AND INSPECT ASSEMBLED ELECTRONIC
OUTCOME 5 PRODUCTS
CONTENTS:
Identify the different tools and materials in assembling electronic
products
Make simple PCB design, etch PCB, drill PCB, clean PCB
Mount and solder electronic components following the diff. soldering
techniques
Assemble electronic products in accordance with the standard
Conduct testing of assembled electronic products
ASSESSMENT CRITERIA:
1.23 Finished products are subjected to final visual/sensory inspection and
testing in accordance with quality standards, procedures and requirements
1.24 Mechanical and electrical/electronic testing is performed in accordance
with quality standards, procedures and requirements
1.25 Work completion is documented and responsible person is informed in
accordance with established procedures
Housekeeping procedures are observed in accordance with 5S discipline and
established procedures
CONDITION:
The students/trainees must be provided with the following:
Soldering iron
De soldering pump
Solder lead
Sets of pliers
Sets of screw drivers
Multi-tester
EVALUATION METHOD:
Hands-on
Direct observation
Practical demonstration
Project making laboratory
LEARNING EXPERIENCE
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Learning Outcome 5: TEST AND INSPECT ASSEMBLED ELECTRONIC PRODUCTS
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016
Conduct testing of assembled electronic products
Document No.01
Date Developed: Developed by:
Assemble Electronic
January JOEL D. SUTIO
Products
01,2016