Electromagnetic Compatibility

chapter 7
7.1 Reasons for Electromagnetic 7.3 EMC-friendly Power Supplies –
Interference Practical Issues and Requirements
7.2 Coupling Mechanisms 7.4 EMC in Standards
7 Electromagnetic Compatibility (EMC)
Electromagnetic compatibility is
relevant in all fields of electrical Source of Potentially suscepti-
Coupling mechanism
engineering. For this reason, every interference ble equipment
(route)
expert should be familiar with this (emitter) (receiver)
subject. Electromagnetic compatibility
means that electrical equipment, Fig. 7/1: Interference model
plant and systems can be operated
simultaneously without unpermissibly
high interference being generated
which might cause malfunction or
Cause of interference Coupling mechanism
even destruction of equipment.

7.1 Reasons for Switching operations

Electromagnetic
Interference
Electric current flows within an elec-
tric appliance (emitter) and causes a
magnetic field surrounding it. Addi-
tionally, the voltage that drives the
current causes an electric field. The
emitter can also cause electromagne-
tic waves. These magnetic, electric
and electromagnetic fields can gen-
erate voltages and currents in other
electrical appliances which might
cause malfunction, damage or even
destruction of these appliances
(Fig. 7/1). There are three points of
lever-age where you can act upon the
system to ensure electromagnetic
compatibility:
 Emitter (e.g. screening, spectral
limitation)
 Coupling route (e.g. no PEN
conductor, filtering, optical
waveguides)
 Receiver (e.g. screening, filtering)
When an electrical system is planned,
any possible generation, propagation
and introduction of electromagnetic
interference should already be consid-
Electrostatic discharge
Periodic parasitic frequencies
Lightning current arrester
Surge arrester
Strike of lightning Filters
Nuclear blast Equipotential bonding
System perturbations
EMC Grounding
Corona discharge Screening
Galvanic
Inductive
Capacitive
Interference by waves
Interference by radiation
Precautions against interference
Fig. 7/2: Parameters affecting EMC
ered and precautions should be taken
to prevent such interference or keep it EMC according to
at a level which does not cause any DIN VDE 0870 is:
disturbance to the whole system (Fig.
7/2). Subsequent rework to ensure
The capacity of an electrical
system EMC gives rise to considerable appliance to function in a
extra costs. satisfactory manner in its
electromagnetic
environment without
7.2 Coupling impermissibly disturbing this
Mechanisms environment which may also
There are basically three coupling include other appliances.
mechanisms how electromagnetic

7/2 Totally Integrated Power by Siemens

 Electromagnetic Compatibility (EMC)

interference may be transmitted:

Source A Device A
 Galvanic coupling A

 Capacitive coupling
 Inductive coupling
Source B Device B
The following is derived:
B
 Electromagnetic line coupling
 Radiation coupling

7.2.1 Galvanic Coupling

Galvanic coupling is caused by the
U X A/B
connection of two or more circuits
through common impedances. Exam-
ples of such common impedances are ZK
the internal resistance of power
supply units, joint supply and zero Fig. 7/3: Galvanic coupling of two circuits
potential leads, or protective conduc-
tor or grounding systems of facilities.
Fig. 7/3 shows the possible galvanic Zq
coupling in supply and signal circuits.
Circuits A and B are coupled by a
common impedance ZK. Currents IA
and IB flow through the common U St ZS
impedance and cause a voltage drop
UX A/B, which is superimposed on the
signal voltages in the circuits A or B,
ZL
and may there result in interference
A B
or destruction.
U A/B
A further source of electromagnetic
interference as a result of galvanic
St
coupling is the coupling of several
Point A Point B
circuits by so-called ground loops or
ring ground conductors (Fig. 7/4).
Fig. 7/4: Ground loop between two devices A and B
In order to prevent direct contact with
live parts, the casings of both devices
are connected to the grounding Zq and through the receiver impe-
system. Both devices are connected dance Zs, which causes a voltage
by a signal line whose screening is drop in the source and receiver, which
also grounded. A potential difference in turn is superimposed on the signal
UAB between points A and B may arise voltage. With sine-shaped parameters,
either as a result of ground currents the interference voltage may be
(ground-fault currents, lightning calculated as follows:
currents) or by induction. This poten-
tial difference drives a parasitic cur- ZS
U St = U AB -------------------
rent ISt through the source impedance ZS + ZQ

7/3 7
Examples:
 PEN conductor in the building
 Suppression devices connected
against PE
 Measuring circuits/screenings
grounded on both sides
Countermeasures:
 Isolating transformers
 Neutralizing transformers
 Optocouplers
 Optical waveguides
7.2.2 Capacitive Coupling
Capacitive (electrical) coupling may
occur between conductors of different
potential (Fig. 7/5). The potential
difference creates an electrical field
between the conductors, which
means that unwanted capacities are
present between the conductors. The
following current flow will result from
a voltage change:
dU
i = C K ⋅ ---------1-
dt
This creates an undesired voltage in
circuit 2:
The value of the coupling capacity CK
depends on the geometry and topo-
logy of the conductors.
dU
u 2 = i ⋅ Z 2 = C K ⋅ Z 2 ⋅ ---------1-
dt
Examples:
 Coupling of interferences between
parallel lines
 Static discharge from operator
 Contactors
Countermeasures:
 Screening of signal lines
 Ground-symmetrical design of the
signal line
 Use of optical waveguide systems
7/4 Totally Integrated Power by Siemens
U1
Circuit 1
Z2 Circuit 2
Fig. 7/5: Capacitive coupling
7.2.3 Inductive Coupling
Inductive (magnetic) coupling is
caused by the interlinking of the
magnetic flux in two or more circuits
(Fig. 7/6). Any change in the magnetic
flux induces interference voltages in
the conductor loops of the circuits.
This means that even a single circuit
may be affected by transient magnetic
fields (lightning discharge, electrosta-
tic discharge).
As a result of the coupling inductance,
any current change in circuit 1 will
induce a voltage in circuit 2. This
voltage depends on the rate of the
current change and the coupling
inductance MK:
di
U 2 = M K ⋅ -----
dt
MK depends on the magnetic flux and
the conductivity of the magnetic field.
Z1
1
2
U2
Examples:
 Transformers, motors, electric
welding devices
 Power lines routed in parallel
 Unfavorable arrangement of
conductors in power lines
 Cabling systems with different phase
and return currents
 Lines in which currents are
frequently switched
 Signal lines with high frequencies
 Unconnected coils
Countermeasures:
 Reduction of the coupling
inductance M by keeping parallel
cable routes as short as possible and
by maintaining large clearances
between interfering and unaffected
systems
 Orthogonal arrangement of
conductor loops for the purpose of
magnetic decoupling
 Twisted cables
 Screening of the affected system

U1 Circuit 1
M1
M2
Z2 Circuit 2
Fig. 7/6: Inductive coupling
7.2.4 Electromagnetic
Line Coupling
Electromagnetic line coupling occurs
when electrical and magnetic inter-
ference is simultaneously present
between two or more electrically long
lines. In electrically long lines, cur-
rents and voltages are not independ-
ent of each other, but they are firmly
interrelated. A line is considered
electrically long if the rise time of
transmitted pulses is in the order of
magnitude of the run time through
the line. For a calculation of the
resulting electromagnetic field, a
differential analysis of the electric and
magnetic fields must be performed,
i.e. the fields are superimposed for
differential elements of an infinitely
short length of line.
Electromagnetic Compatibility (EMC)
Z1
1
2
U2
7.2.5 Radiation Coupling
Radiation coupling means that circuits
are affected by electromagnetic
waves which originate from other
circuits and travel with the speed of
light. As long as you are within a close
range of the interfering system, the
electric field and the magnetic field
are encountered as separate entities
(inductive and capacitive coupling).
But as soon as you are within a
remote range, these two fields are
coupled and we speak of radiation
coupling.
7/5 7

7.3 EMC-friendly
Power Supplies –
Practical Issues and
Requirements
For several years, increasing malfunc-
tion of and damage to electrical and
electronic equipment has been not-
iced, for example
 Unaccountable faults in data trans-
mission networks
 Desktop and server crashes
 Printer failure
 Slowdown of data transmission in
local networks, even to complete
standstill
 Triggering of alarm systems and fire
detectors
 Corrosion in piping and ground
conductors
The reasons for these effects often lie
in an old-style power supply system
where the N conductor and the PE
conductor are combined to form a
single PEN conductor. This wasn’t a
problem as long as the number of
electronic equipment connected into
supply was low.
The phases were loaded nearly sym-
metrically, and consequently the PEN
conductor was hardly loaded. Owing
to an increasing number of high-
power single-phase loads, and loads
with a high proportion of harmonic
contents in the third order (switched
power supply units), the phases are
loaded extremely asymmetrically, and
the N conductor is sometimes loaded
with a higher current than the phase
conductors. As the PE conductor is
meant to carry current only in case of
a fault, the PE conductor and the N
conductor must be laid separately in
new power supply systems (VDE 0100
Part 540 Appendix C.2). If this require-
ment is not observed in an electrical
7/6 Totally Integrated Power by Siemens
installation, part of the return current
might be distributed through all
grounding systems and equipotential
conductors. Current flows back to the
voltage source through the smallest
resistors, so that unwanted currents
might even flow through metal pipes
and screens of data lines. These
“stray” currents may give rise to strong
electromagnetic fields which cause
strange failures and malfunction of
electronic equipment. They may also
cause corrosion in water pipes. Since
higher currents may be present in the
N conductor, as explained above, care
must be taken not to reduce the cross
section of the N conductor as com-
pared to that of the phase conductors,
but even to increase it.
PEN
U>0
G
PEN
Conductive building structure,
water pipe
Fig. 7/7: Current flow for a combined PEN conductor
7.3.1 Effects of
Conductor Design on EMC
Fig. 7/7 demonstrates which problems
must be expected if the PE and N
conductors are combined to form a
PEN conductor. The illustration shows
a device through which the current IL
flows during operation. Normally, this
current should be taken back to the
source through the PEN conductor.
This return current, however, causes a
voltage drop in the PEN conductor,
which acts as an interference voltage
on all systems connected to the PEN
conductor, resulting in a parasitic
current ISt through the device screen-
ing and a parasitic current Ibuilding
in the building. The parasitic currents
flowing through the cable screens
interfere with or destroy equipment
which is susceptible to overvoltages.
Moreover, the parasitic currents in the
L
Distributor
ON
L
N
St
L
Screen
Token ring
St
Distributor
St
L
Transformer L = Current in phase conductor L
N = Neutral conductor current in PEN
G = Stray current in the building
St = Parasitic currents in screens
U = Voltage drop in PEN conductor
(external voltage)
 Electromagnetic Compatibility (EMC)

 The supplying sources for sections A

PE N L and B may be operated in parallel.
Distributor
 A connection between ground and
ON
L
the PE conductor may only be made
N at one point (central grounding
point), as otherwise the PE conduc-
Screen
tor and the N conductor would be
St = 0 connected in parallel, resulting in
L Token ring
unfavorable EMC conditions as
Distributor shown in Fig. 7/5.
 All load feeders are designed as a
U=0

G =0
TN-S system, i.e. with distributed
N-conductor function and separate
PE and N conductors. 3-pole and
4-pole switching devices may be used.
N L

Network configuration for

distributed supply
Transformer L = Current in phase conductor L
= Neutral conductor current in PEN
N
Fig. 7/10 depicts the recommended
G = Stray current in the building
St = Parasitic currents in screens system for distributed supply. Distri-
Conductive building structure, U = Voltage drop in PEN conductor buted supply is encountered if the
water pipe (external voltage)
following applies to the distance
Fig 7/8: Current flow for separate PE and N conductors between sections A and B:
As short-circuit currents decrease with
building may result in corrosion and Network configuration for central distance from the main equipotential
give rise to magnetic fields which may power supply bonding conductor, and protective
cause further damage. Separate devices require a certain minimum
The network configuration shown in
design of the N conductor and PE
Fig. 7/9 is recommended for central a1 >> a2
conductor will prevent such stray
supply, with EMC being ensured even
currents. Thus, the PE conductor only
when the supplying sources of sec-
carries current in case of a fault (Fig. value for safe tripping in the event of
tions A and B are operated in parallel.
7/8). a fault, and as selective grading must
We recommend that the PEN conduc-
also be taken into account, a second
tor be marked in light blue and,
main equipotential bonding conduc-
additionally, in green-yellow through-
7.3.2 Power Supply Sys- out its course.
tor is installed for distributed supply
tems – Network Configu- of the SPS.
ration The following should be observed for
The following should be observed for
this kind of power supply system:
In order to avoid parasitic currents, the this kind of power supply system:
type of power supply system must be  The PEN conductor must be wired
 The PEN conductor must be wired
carefully selected. The following section separately along its whole course,
separately along its whole course in
explains two typical examples for coup- both in the SPS and in the GPS, as
the GPS.
ling the general power supply (GPS well as in the LVMD.
 There must be no connection be-
network) and the safety power supply  There must be no connection be-
tween the neutral point of the
(SPS network). In the first case, the SPS is tween the neutral points of trans-
transformer and ground or the PE
installed in the immediate vicinity of the former and generator, and ground
or the PE conductor, respectively. conductor, respectively. Between
GPS (central supply system) and in the the neutral point of the generator
second case, the SPS is installed remote  The feeder switches for supply from
from the GPS (distributed supply system). SPS and GPS must be in 3-pole
design.

7/7 7
 Section A Section B
Source

Equipotential Equipotential Main equipotential

bonding – bonding – bonding –
transformer transformer generator
Low-voltage main distribution

GPS SPS

L1 L1
L2 L2
L3 L3
PEN
PE

Central
g rounding
p oint Main
for sections e quipotential
A and B b onding

Fig. 7/9: Network configuration for central supply

Section A Section B

Central
g rounding
Source

p oint
for section B
Equipotential
Equipotential bonding – Main
bonding – transformer a1 equipotential
transformer bonding
a2

generator
Low-voltage main distribution

Interlock
GPS SPS

L1 L1
L2 L2
L3 L3
PEN N
PE PE

Central
g rounding
p oint Main
for section A e quipotential
b onding

Fig. 7/10: Network configuration for distributed supply

7/8 Totally Integrated Power by Siemens

 Electromagnetic Compatibility (EMC)

and ground or the PE conductor,
respectively, a connection for an
additional equipotential bonding
conductor is installed.
 A parallel operation between sec-
tions A and B is impermissible. The
transformers may supply sections A
and B at the same time. The gener-
ator, however, may only supply
section B.
Note: During changeover from trans-
former to generator operation, there
may occur parallel operation under
unfavorable EMC conditions for a
short time, for example during back
synchronization.
 The switches of the changeover
connection in the SPS and the gener-
ator supply must be in 4-pole design.
The feeder switches for supply of
section A must be in 3-pole design.
 All load feeders are designed as a
TN-S system, i.e. with distributed
conductor function and separate PE
and N conductors. 3-pole and 4-pole
switching devices may be used.
By implementing a central grounding
point in the power supply systems
described above, suitable measuring
devices can be used to make sure that
no further – impermissible – splitter
bridge between the N conductor and
the PE conductor was installed.
7.3.3 Interference Limits
With flux densities above 1 µTesla (14/15
inch screens), or 0.5 µTesla (17/21 inch
screens), a display screen (CRT monitor)
starts flickering. In order to observe
these limits, the magnetic flux density
can be reduced by both increasing
conductor clearance and a suitable
conductor arrangement. The following
illustration shows the magnetic flux
density curve and the interference limits,
to demonstrate when a screen will start
flickering. This illustration shows the
minimum conductor clearances, in a
given conductor arrangement, for which
screen interference limits are observed.
Flux density is minimized in a symmetri-
cal conductor arrangement of type E, in
which the clearance between the indivi-
dual conductors should be kept as low as
possible.
Comparison of conductor arrangements
B and C2 shows that even a slightly
imbalanced load results in a large
increase of magnetic flux density, and
that the clearance required for observ-
ing screen interference limits rises in
consequence.

Conductor arrangements
100
L1
Magnetic flux density B in T

10 cm
L 1 = 1,000 A e -j0∞
B L2 L 2 = 1,000 A e -j120∞
10 cm L = 950 A e -j240∞
3
L3
10
L1
10 cm
L 1= 200 A e -j0∞
C1 L2 L 2= 200 A e -j120∞
10 cm L 3= 200 A e -j240∞
L3 Interference limit for 14/15 inch display screen
1
L1 Interference limit for 17/21 inch display screen
10 cm
L 1 = 1,000 A e -j0∞
C2 L2 L 2 = 1,000 A e -j120∞
10 cm L 3 = 1,000 A e -j240∞
L3
0.1
L1
E L 1 = 1,000 A e -j0∞
3c
m
3c

L 2 = 1,000 A e -j120∞
L 3 = 1,000 A e -j240∞
L3 3 cm L2
0.01
1 5 10 50 100
Distance to source of interference in m

Fig. 7/11: Field strength for different conductor arrangements

7/9 7
The following factors show a favora-
ble impact by reducing magnetic flux
density:
 Symmetrical conductor arrangement
 Small clearances between
conductors
 Symmetrical conductor loads
 Large clearances between conductors
and the potentially susceptible
equipment
7.4 EMC in
Standards
DIN EN 50174-2
(VDE 0800 Part 174-2):
Information technology – Cabling
installation – Part 2: Installation
planning and practices inside buildings
DIN EN 50310
(VDE 0800 Part 2-310):
Application of equipotential bonding
7/10 Totally Integrated Power by Siemens
and earthing in buildings with infor- Section 444: Protection against elec-
mation technology equipment tromagnetic interferences (EMI) in
installations of buildings
DIN VDE 0100-443
(VDE 0100 Part 443):
Erection of low-voltage installations –
Part 4: Protection for safety; Chapter
44: Protection against overvoltages;
Section 443: Protection against over-
voltages of atmospheric origin or due
to switching
DIN VDE 0100-540
(VDE 0100 Part 540):
Erection of power installations with
nominal voltages up to 1,000 V;
selection and erection of equipment;
earthing arrangements, protective
conductors, equipotential bonding
conductors
DIN VDE 0100-444
(VDE 0100 Part 444):
Electrical installations of buildings –
Part 4: Protection for safety; Chapter
44: Protection against overvoltages;