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Manual de Serviço Asus Zen Fone Zoom ZX551ML
Manual de Serviço Asus Zen Fone Zoom ZX551ML
Introduction &Training
ZX551ML Outline
• System Block Diagram
• Component and PCB Board Introduction
• Power On Sequence
• Trouble Shooting Guide
ZX550ML ZX550ML
Block Diagram
Page.48~53
726_RSVD_GPIO1
Moorefield PWM Driver IC
DRV2603RUNR
P/N
Vibrator
Laser sensor
RSVR_GPIO_2 VL6180
14mmx14mm I2C
MOD_RST_OUT_N MIPI_CSI X4 Rear Camera
Stacked SDRAM 726_CORE_DUMP I2C4 13M
(LPDDR2)
MIPI_CSI X2
PMIC_MOD_SWDN_N LPDDR3
PMIC CO-POP Page.20 Page.22
1600MHZ I2C7 Touch IC Front Camera
PMB6830 MDM_CLK_32K_OUT FT5446DQS 5M
Page.84~87
Speaker Out USB I/F Page.17 Micro USB connector
Speaker AMP Line Out Page.26 USB I/F USB I/F
USB SWITCH PC Host
TPA2080D1YZGR SNDA012RSE
Power Rail USB I/F
IN2 I2C0 DC Adapter
FM I2S2
SVID
PMIC VSYS A/D_DOCK_IN
DMIC Audio CODEC I2C1 PMIC_PWRGD PMB6830
DMIC1*2
Page.81
ALC5647 PMIC_RESET#
MONO Out Charger
Receiver PROCHOT# VBATT Page.96
SMB1357
Battery
MIC1 32.768KHz
E-compass
Wifi&BT
SOC
Gyro sensor
PMIC
Charger IC
EMMC
laser CONN SD translator
Rear CAMERA 13M Conn.
Flash LED Driver IC
2. 检查Power Sequence是否有跑完
• PMIC_PWRGOOD电压是否为1.8V
• PMIC_RESET_N电压是否为1.8V
3. 检查为不开机还是屏幕无显
• 电压是否都起来了,并搭配UART
DEBUG LOG检查系统是否有开入
4. 如果确认为PU8401, U1有内部短路,可以检查置件是否有
歪斜,再照X-Ray检查是有短路
5. Power Rail没有起来,且没有对地短路,无UART DEBUG
LOG
• 照XRAY看U1是否空焊
• Reheat U1
• 更换U1
6.根据这几次维修MB不开机的经验来
LCM
屏幕无显或Display异常
• Check LCD CON2101是否有歪斜,破裂或空焊
• Check LCM FPC是否异常
• Check VCC_LCD 点位 C2107.1是否有2.9v(有无对地短路)
• Check V_1P80_VDD1 点位C2108.1是否为1.8v(有无对地短路)
• Check V_LED 点位C2102.1是否为15.6V(有无对地短路)
• Check PANEL_BKLTEN点位T8902是否为High(1.8V)
• Check MIPI 讯号是否有1.2V电压
• Check LCD_PWM 点位T8901是否有将近25.0KHz的PWM
Display 线路&点位图
Touch Panel
• 检查CON2001置件是否有歪斜,破裂或空焊
• 检查V_1P80_VDD1点位C2002.1/C2004.1电压准位
是否为1.8V
• 检查V_3P30_VDD3点位C2001.1/C2003.1电压准位
为3.3V
• 检查I2C_7_SDA, I2C_7_SCL电压准位是否为1.8V
• 检查TOUCH_RST_N点位T2005电压准位为1.8V
Camera
5MP Camera
• 检查Camera是否有插好
• 检查CON2201置件是否有歪斜,空焊或损毁
• 检查周边零件是否有缺件,破裂
• 检查SUB_CAM_2V8_SEN电压准位是否为2.8V,
如无电压请确认R2405有无上件
• 检查SUB_CAM_1V8电压准位是否为1.8V
• 检查SUB_CAM_1V2电压准位是否为1.2V
• 检查SUB_CMMCLK点位T0630是否有24MHz波
形
5M Camera 线路&点位图
13MP Camera
• 檢查Camera SUB BD是否有插好
• 檢查CON2402置件是否有歪斜,空焊或損毀
• 檢查週邊零件是否有缺件,破裂
• 檢查V_1P2_DVDD電壓準位是否為1.2V
• 檢查D3V_FUJI電壓準位是否為3.0V
• 檢查V_2V8_CAM電壓準位是否為2.8V,如無電壓請確
認R2401有無上件
• 檢查V_1P80_DVDD電壓準位是否為1.8V
• 檢查+3V7S電壓準位是否為3.7V
• 檢查+D3V3電壓準位是否為3.3V
• 检查M_CMMCLK点位T2413是否有19.2MHz波形
13M Camera 线路&点位图
USB
USB无法辨识
• Check CON1601置件是否有歪斜,空焊或损毁
• Check USB BD上USB_CON1置件是否有歪斜,
空焊或损毁
• Check V_3P30_VUSBPHY, C1034.1/PC8608.1
是否为3.3V
• Check USB SEL,PR8605.1是否为2.5V
SENSORS
E-compass
• U2501外观是否完整,有无损毁
• U2501接脚是否有空焊接触不良的情况
• V_VPROG3_2V9与V_1P80_VDD1电压是否正确
• I2C_8_SDA和I2C_8_SCL是否有正常动作
• 若上述都正常则可尝试更换本体U2501
Gyro + G-Sensor
• U2502是否完整,有无破损
• U2502零件接脚是否有空焊的情况
• V_VPROG3_2V9与V_1P80_VDD1电压是否正
确
• I2C_8_SDA和I2C_8_SCL是否有正常动作
• 是否有受到撞击或摔落
• 若上述都正常则可尝试更换本体U2502
Ambient Light + Proximity Sensor
• 确认U2503是否完整,有无破损
• U2503零件接脚是否有空焊的情况
• V_VPROG3_2V9电压是否正确。
• I2C_8_SCL和I2C_8_SDA是否有动作
• 是否有受到撞击或摔落
• 若上述都正常则可尝试更换本体U2503
Hall sensor
• 确认U0501否完整,有无破损
• 零件接脚是否有空焊的情况
• 电压V_3P30_VDD3是否正确
• 是否有受到撞击或摔落
• 若上述都正常则可尝试更换本体U0501
Codec
DMIC无声音
• Check U2602 电DMIC1_VDD是否正常1.8V
• Check U2601置件是否有歪斜,空焊或损毁
• Check U2601 Power是否正常
• Check U2601周边零件是否正常
• Check DMIC_CLK_D/ DMIC_DAT_D是否有输出
Speaker无声音
• Check U2601 Power是否正常
• Check SPKVDD是否為3.3V
• Check MB上U2609與CON1601置件是否有歪
斜,空焊或損毀
• Check USB BD上CON0301與U0701/ U0702置
件是否有歪斜,空焊或損毀
• Check Speaker本體是否正常
Headphone
• Check U2601 Power是否正常
• Check J2701置件是否有歪斜,空焊或损毁
SD Card
SD Card
• Check SIMFPC是否有插好,歪斜
• Check VDD3_SD_SW是否为3.3V
• Check SDIO0_CD#是否拉Low
• Check U2902,CON1601置件是否有歪斜,空焊
或损毁
SIM Card
SIM Card
• Check SIMFPC是否有插好,歪斜
• Check VSIM1_VAR是否为1.8V
• Check SIM1_CD#是否拉Low
• Check CON1601置件是否有歪斜,空焊或损毁
eMMC
EMMC确认
• 确认各个power domain供电状况
– VCORE_eMMC_S 点位C1903.1/C1905.1------------------ 3.3V
– V_1P80_VDD1点位C1904.1/C1906.1 ------------------- 1.8V
• 确认A/D_DOCK_IN是否5V
• 检查PU8101置件是否有歪斜,空焊或损毁
• 检查周边零件是否有缺件,破裂
• 检查CHG_I2C_SCL, CHG_I2C_SDA偏压是否正常
Charger无法充电
• 首先确认是否为电池过度放电,导致电量过低保
护机制动作
• 电量过低保护机制动作后,需充电至保护机制解除并且电压
达到开机条件,才能正常开机;此保护行为容易被误判为无
法充电
• 确认A/D_DOCK_IN是否5V
• 检查PU8101置件是否有歪斜,空焊或损毁
• 检查周边零件是否有缺件,破裂
• 检查CHG_I2C_SCL, CHG_I2C_SDA偏压是否正常
Modem for example
Typical Smartphone Application
X-GOLD™ 726G Pin Diagram (Top View)
Modem
• Scan U4800 by Xray
• Reheat U4800、replace U4800
• Check X5101 clock32.768khz
• Check T5200 clock26Mhz
• Check accessory staff around U4800
• Check power rail、Reset
• Check IMEI(whether the last 4 bits of IMEI is
0000 or not. Sole IMEI is stored in every cell
phone.)
Modem
• Check Power Rail: if short to GND or not:
• 0.9V ─ 1.28V VSD1_VAR
• 1.8V VSD2_1V8
• 1.2V 85V/3.1V VUSB_IO_VAR
• 1.8VVSD2_1V2
• 2.5V/2. VRTC_1V8
• 1.3V VPMU_1V3
• 1.8V VSIM1_VAR
VSD1_VAR
VDD_CORE_MAIN
Power rail VSD3_1V2
1
U4800D VDD_LDO_PLL
C5001 VDD_CORE_MAIN U12 AD18 VDD_EMIC_IO
1
0.47UF/6.3V V13 VDD_CORE_MAIN0 VDD_EMIC_IO_0 AD15 C5009
2
c0201 AA11 VDD_CORE_MAIN1 VDD_EMIC_IO_1 AF17 1UF/6.3V
AA13 VDD_CORE_MAIN2 VDD_EMIC_IO_2 AE13 c0201
2
VDD_CORE_3G AB13 VDD_CORE_MAIN3 VDD_EMIC_IO_3 AE11
AD4 VDD_CORE_MAIN4 VDD_EMIC_IO_CA AD12 VDD_EMIC_1V8
1
VDD_CORE_MAIN5 VDD_EMIC_1V8_IO AG17 VDD_LDO_EMIC VDD_LDO_CORE
C5003 VDD_CORE_3G R9 VDD_LDO_DLL_EMIC
1
0.47UF/6.3V U7 VDD_CORE_3G_0 AA1 VDD_SMB_IO C5012
2
c0201 U9 VDD_CORE_3G_1 VDD_SMB_IO Y6 VDD_HSI_IO 1UF/6.3V
Y 10 VDD_CORE_3G_2 VDD_HSI_IO c0201
2
VDD_CORE_LTE VDD_CORE_3G_3
VDD_CORE_LTE J16 AG3 VDD_LDO_USB_SS
1
1 VDD_CORE_LTE0 VDD_LDO_USB_SS
K7 AH4 VDD_EMIC_IO
C5005 C5006 L4 VDD_CORE_LTE1 LDO_MON_USB_SS AH2 VDD_USB_SS_IO
2
0.47UF/6.3V 0.47UF/6.3V L8 VDD_CORE_LTE2 VDD_USB_SS_IO AB1 VDD_LDO_USB_HSIC C5002
2
1
VDD_CORE_DSP N9 VDD_CORE_LTE5 VDD_USB_HSIC_IO R2 VDD_LDO_DIG_PHY
VDD_CORE_DSP AG7 VDD_CORE_LTE6 VDD_LDO_DIGRF_PHY 1 P3
1
1
0.47UF/6.3V LDO_MON_DIGRF2 P19 VDD_LDO_USB_MPHY C5004
2
2
VDD_CORE_TD LDO_MON_PLL VDD_LDO_PCIE U17
V19 LDO_MON_PCIE Y 18 VDD_PCIE_1V8
VRTC_1V8 VDD_RTC VDD_PCIE_1V8
VDD_SIM1 P6 VDD_LDO_USB_SS
K14 VDD_SIM1_IO
1
AA8 VDD_SIM2_IO AA5 MODEM_VPP 1 T5000 C5014
VDD_MMC_IO VPP 1UF/6.3V
c0201
2
VDD_IO_1V8 N15
R10 VDD_IO_1V8_0
VSD2_1V8 W4 VDD_IO_1V8_1 A1 VDD_LDO_DIG_PHY
U11 VDD_IO_1V8_2 DUMMY _BALL0 A20
1
VDD_HSI_IO Y 12 VDD_IO_1V8_3 DUMMY _BALL1 AH20 C5016
AC10 VDD_IO_1V8_4 DUMMY _BALL2 AH1 1UF/6.3V
VDD_IO_1V8_5 DUMMY _BALL3 c0201
2
VDD_EMIC_1V8 VREF_0V6 F9
VDD_LDO_CORE AG18 VREF_0V6
2
1
0.1UF/6.3V C5018
1
2
VDD_PCIE_1V8 H13 VSS1 VSS_PLL0 AA6
H16 VSS2 VSS_PLL1 R3
VDD_IO_1V8 J3 VSS3 VSS_MPHY _MAIN0 T3 VDD_LDO_PCIE
J7 VSS4 VSS_MPHY _MAIN1 V3
2
2
M4 VSS14 VSS30 W11 C5021
2
1
0.1UF/6.3V P10 VSS17 VSS33 AA19
1
1
GND_OSC T19 VSS22 VSS38 AE2 C5007
39 GND_OSC VSS23 VSS39
U8 AE4 1UF/6.3V
U10 VSS24 VSS40 AE17 c0201
2
U13 VSS25 VSS41 AG4
2
36 VREF_PMU
@ PMB9933
1
VDD_USB_SS_IO
C5020
1
2
0.01UF/10V C5017
2
c0201 0.1UF/6.3V
1
Sequence
• power on sequence:
XG726Gsmarti4.5G26MHz
Sequence
ASUS
ZX551ML
(YZ3)
RF Hardware Trouble Shooting Guide
(*) DUT
Discrete PA
FEMid
(div)
modem
FEMid
Transceiver (main)
2/3/4G test
MMPA point (main)
GPS LNA
WiFi/BT Switch
WiFi/BT
IC
GPS IC
2/3/4G(Bottom)
• Modem :
• Transceiver : U7201
• MMPA : U7406
• FEMid(main) : U7301
• FEMid(div) : U7406
• Discrete PA : U7402, U7404
WiFi/BT/GPS(Top)
• WiFi/BT IC : U5700
• WiFi/BT Switch : U7901(5G), U7902(2.4G)
• GPS IC : U5800
• GPS LNA : U7802
Key part
Test point
VDD point
RFE_VDD_APT
PA out
PA in
RF CONN
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out
PA in RF CONN
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out
PA in RF CONN
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out
PA in RF CONN
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA in
RF CONN
PA out
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
RF CONN
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out RF CONN
PA in
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out RF CONN
PA in
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out RF CONN
PA in
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out RF CONN
PA in
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out RF CONN
PA in
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out PA in
RF CONN
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
RF CONN
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out
PA in
RF CONN
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out
RF CONN
PA in
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out
RF CONN
PA in
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA in RF CONN
PA out
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out PA in RF CONN
VSYS
RF BOT
RF DIV CONN
Key part
Test point
VDD point
Div Rx path
Main Rx path
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out RF CONN
PA in
VSYS
RF BOT
Key part
Test point
VDD point
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out RF CONN
PA in
VSYS
RF BOT
Key part
Test point
VDD point
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
PA out PA in RF CONN
VSYS
RF BOT
Key part
Test point
VDD point
RF CONN
RF BOT
Key part
Test point
VDD point
RF CONN
RF BOT
Key part
Test point
VDD point
RFE_VDD_APT
RF CONN
PA out
PA in
VSYS
RF BOT
Key part
Test point
VDD point
RF CONN
RF BOT
Key part
Test point
VDD point
RF CONN
RF BOT
Analysis Action
確認異常的頻段,並確認對應的TRX路徑完件是否都正常。
Tx 異常
ex. LTE Band8 tx fail,可參考P.24路徑上的各元件是否有空和或偏移
LTE/WCDMA頻段RX分為MAIN與DIV兩路徑,請根據log判斷是哪一條
RX 異常
路徑,並確認路徑元件是否有異常。
共同路徑主要元件有:
Tx : U7406、U7301、U7302、U7303、CON7301
MAIN Rx : U7301、U7302、U7303、CON7301
共同路徑 DIV RX : U7601、U7607、 CON7601
若發現異常狀況為多個頻段,請先檢查共同路徑上的原件,若外觀
無異常,請隊主要元件做X-ray確認是否有空焊或吃席不良等問題
頂針有接觸與耗損問題,若異常持續發請先檢查制具接觸狀況,並
頂針異常 利用Golden機台驗證是否有因為頂針接觸或損耗造成的測試問題。
RF路徑上任何相關元件的更動,請務必要重新回流Cal站
ERROR
造成主因是DUT與測試儀器無法完成同步,可能問題如下
1. 儀器本身出現暫時的物動作,須重啟儀器
9005 2. 程式執行的過程中,受到干擾,僅需重新測試
3. 制具異常或損壞導致
DUT與程式間溝通介面異常,主要是環境造成,如USB接觸異常,
427 電源供應異常導致DUT開機問題
請先行確認發生頻段POWER的CPK是否有異常,是否有制具集中性,
TX POWER OUT OF 是否有Cal站集中性,若有此情事,請使用Golden確認環境是否都正
RANGE 常
需判別是否是該頻段TX POWER過大所導致,此時應請使用Golden確
ACLR OUT OF RANGE 認環境是否都正常。
Diplexer
Filter
2G Switch LNA
Diplexer
Filter
2G Switch LNA
TCXO
Diplexer
Vdd 3.3V
2G Switch LNA
Vsys 5V
Diplexer
2G Switch LNA
Vsys 5V
Analysis Action
確認測試站環境狀況
目檢零件是否有偏移等SMT問題, X-ray 檢視 U5700,測試clock &
power voltage
加熱U5700, X5700, U7902, U7903, U7901, U7904
或重新放置X5700, U7902, U7903, U7901, U7904
Wi-Fi 異常
更換順序:
73
Inspiring Innovation.Persistent Perfection
Outline
Diplexer
2G Switch LNA
Vsys 5V VDD_WL_LNLDO_1V2
Analysis Action
確認測試站環境狀況
目檢零件是否有偏移等SMT問題, X-ray 檢視 U5700,測試clock &
power voltage
加熱U5700, X5700, U7902, U7903, U7904
BT 異常 或重新放置X5700, U7902, U7903, U7904
更換順序:
1. U7906, U7907彈片是否有頂好
2. 2G TX/RX有問題 : U7902, U7903, U7904, C7916
VDD_GPS_IO_1V8
TCXO
VDD_GPS_CORE_1V1
VDD_GPS_GRF_1V2
VDD_GPS_AUX_1V8 VDD_GPS_3V3
Analysis Action
確認:
1. 測試站環境狀況
2. 天線有無破損
3. 機台與GPS antenna 接觸情況
目檢零件是否有偏移與毀損(包含U7804\U7805) 等SMT問題,
X-ray 檢視 U5800, OSC5800, U7802, U7803測試clock & power
GPS 異常 voltage