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Mini Hi-Fi System FWP3200D/05/12/93/85

TABLE OF CONTENTS
Chapter
Technical Specifications ........................................... 1-2
Safety Instructions ........................................................ 1-4
Location of PCB Boards ........................................... 2-1
Version Variation ..................................................... 2-2
Measurement Setup ................................................. 2-3
Service Aids .............................................................. 2-4
Rescue Mode & Repair Instructions.................... ...... 3
Disassembly Instructions & Service positions ........... 4
Block & Wiring Diagram ............................................ 5
Main Board ............................................................... 6
AMP+Powder Board ........................................................ 7
Mic Board.................................................................. 8
Key Board ................................................................ 9
Jack Board ................................................................ 10
Ipod Board ................................................................ 11
USB Board.................................................................. 12
Exploded View........................................................... 13

©Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.


All rights reserved. No part of this publication may be reproduced, stored in
a retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.

Published by PZ-SL WK1209 BG LE Printed in the Netherlands Subject to modication 3141 785 37322
Version 1.2



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1-

2. Safety Instructions, Warnings, Notes, and Abbreviation List


Index of this chapter: • Where necessary, measure the waveforms and voltages
2.1 Safety Instructions with ( ) and without ( ) aerial signal. Measure the
2.2 Warnings voltages in the power supply section both in normal
2.3 Notes operation ( ) and in stand-by ( ). These values are
2.4 Abbreviation List indicated by means of the appropriate symbols.

2.3.2 Schematic Notes


2.1 Safety Instructions
• All resistor values are in ohms, and the value multiplier is
Safety regulations require the following during a repair:
often used to indicate the decimal point location (e.g. 2K2
• Connect the set to the Mains/AC Power via an isolation
indicates 2.2 k:).
transformer (> 800 VA).
• Resistor values with no multiplier may be indicated with
• Replace safety components, indicated by the symbol ,
either an “E” or an “R” (e.g. 220E or 220R indicates 220 :).
only by components identical to the original ones. Any
• All capacitor values are given in micro-farads (P u10-6),
other component substitution (other than original type) may
nano-farads (n u10-9), or pico-farads (p u10-12).
increase risk of fire or electrical shock hazard.
• Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
Safety regulations require that after a repair, the set must be
• An “asterisk” (*) indicates component usage varies. Refer
returned in its original condition. Pay in particular attention to
to the diversity tables for the correct values.
the following points:
• The correct component values are listed in the Spare Parts
• Route the wire trees correctly and fix them with the
List. Therefore, always check this list when there is any
mounted cable clamps.
doubt.
• Check the insulation of the Mains/AC Power lead for
external damage.
• Check the strain relief of the Mains/AC Power cord for 2.3.3 BGA (Ball Grid Array) ICs
proper function.
• Check the electrical DC resistance between the Mains/AC Introduction
Power plug and the secondary side (only for sets that have For more information on how to handle BGA devices, visit this
a Mains/AC Power isolated power supply): URL: www.atyourservice.ce.philips.com (needs subscription,
1. Unplug the Mains/AC Power cord and connect a wire not available for all regions). After login, select “Magazine”,
between the two pins of the Mains/AC Power plug. then go to “Repair downloads”. Here you will find Information
2. Set the Mains/AC Power switch to the “on” position on how to deal with BGA-ICs.
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the BGA Temperature Profiles
Mains/AC Power plug and the metal shielding of the For BGA-ICs, you must use the correct temperature-profile,
tuner or the aerial connection on the set. The reading which is coupled to the 12NC. For an overview of these profiles,
should be between 4.5 M: and 12 M:. visit the website www.atyourservice.ce.philips.com (needs
4. Switch “off” the set, and remove the wire between the subscription, but is not available for all regions)
two pins of the Mains/AC Power plug. You will find this and more technical information within the
• Check the cabinet for defects, to prevent touching of any “Magazine”, chapter “Repair downloads”.
inner parts by the customer. For additional questions please contact your local repair help
desk.
2.2 Warnings
2.3.4 Lead-free Soldering

• All ICs and many other semiconductors are susceptible to


Due to lead-free technology some rules have to be respected
electrostatic discharges (ESD ). Careless handling
during repair can reduce life drastically. Make sure that, by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order
during repair, you are connected with the same potential as
code 0622 149 00106. If lead-free solder paste is required,
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential. please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
• Be careful during measurements in the high voltage
workshops should be avoided because paste is not easy to
section.
• Never replace modules or other components while the unit store and to handle.
• Use only adequate solder tools applicable for lead-free
is switched “on”.
soldering tin. The solder tool must be able:
• When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a – To reach a solder-tip temperature of at least 400°C.
– To stabilize the adjusted temperature at the solder-tip.
circuit becoming unstable.
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around
2.3 Notes 360°C - 380°C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
2.3.1 General Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
• Measure the voltages and waveforms with regard to the
reduce heat.
chassis (= tuner) ground ( ), or hot ground ( ), depending
• Mix of lead-free soldering tin/parts with leaded soldering
on the tested area of circuitry. The voltages and waveforms
tin/parts is possible but PHILIPS recommends strongly to
shown in the diagrams are indicative. Measure them in the
avoid mixed regimes. If this cannot be avoided, carefully
Service Default Mode (see chapter 5) with a colour bar
clear the solder-joint from old tin and re-solder with new tin.
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
1-4

2. Safety Instructions, Warnings, Notes, and Abbreviation List


Index of this chapter: • Where necessary, measure the waveforms and voltages
2.1 Safety Instructions with ( ) and without ( ) aerial signal. Measure the
2.2 Warnings voltages in the power supply section both in normal
2.3 Notes operation ( ) and in stand-by ( ). These values are
2.4 Abbreviation List indicated by means of the appropriate symbols.

2.3.2 Schematic Notes


2.1 Safety Instructions
• All resistor values are in ohms, and the value multiplier is
Safety regulations require the following during a repair:
often used to indicate the decimal point location (e.g. 2K2
• Connect the set to the Mains/AC Power via an isolation
indicates 2.2 k:).
transformer (> 800 VA).
• Resistor values with no multiplier may be indicated with
• Replace safety components, indicated by the symbol ,
either an “E” or an “R” (e.g. 220E or 220R indicates 220 :).
only by components identical to the original ones. Any
• All capacitor values are given in micro-farads (P u10-6),
other component substitution (other than original type) may
nano-farads (n u10-9), or pico-farads (p u10-12).
increase risk of fire or electrical shock hazard.
• Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
Safety regulations require that after a repair, the set must be
• An “asterisk” (*) indicates component usage varies. Refer
returned in its original condition. Pay in particular attention to
to the diversity tables for the correct values.
the following points:
• The correct component values are listed in the Spare Parts
• Route the wire trees correctly and fix them with the
List. Therefore, always check this list when there is any
mounted cable clamps.
doubt.
• Check the insulation of the Mains/AC Power lead for
external damage.
• Check the strain relief of the Mains/AC Power cord for 2.3.3 BGA (Ball Grid Array) ICs
proper function.
• Check the electrical DC resistance between the Mains/AC Introduction
Power plug and the secondary side (only for sets that have For more information on how to handle BGA devices, visit this
a Mains/AC Power isolated power supply): URL: www.atyourservice.ce.philips.com (needs subscription,
1. Unplug the Mains/AC Power cord and connect a wire not available for all regions). After login, select “Magazine”,
between the two pins of the Mains/AC Power plug. then go to “Repair downloads”. Here you will find Information
2. Set the Mains/AC Power switch to the “on” position on how to deal with BGA-ICs.
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the BGA Temperature Profiles
Mains/AC Power plug and the metal shielding of the For BGA-ICs, you must use the correct temperature-profile,
tuner or the aerial connection on the set. The reading which is coupled to the 12NC. For an overview of these profiles,
should be between 4.5 M: and 12 M:. visit the website www.atyourservice.ce.philips.com (needs
4. Switch “off” the set, and remove the wire between the subscription, but is not available for all regions)
two pins of the Mains/AC Power plug. You will find this and more technical information within the
• Check the cabinet for defects, to prevent touching of any “Magazine”, chapter “Repair downloads”.
inner parts by the customer. For additional questions please contact your local repair help
desk.
2.2 Warnings
2.3.4 Lead-free Soldering

• All ICs and many other semiconductors are susceptible to


Due to lead-free technology some rules have to be respected
electrostatic discharges (ESD ). Careless handling
during repair can reduce life drastically. Make sure that, by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order
during repair, you are connected with the same potential as
code 0622 149 00106. If lead-free solder paste is required,
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential. please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
• Be careful during measurements in the high voltage
workshops should be avoided because paste is not easy to
section.
• Never replace modules or other components while the unit store and to handle.
• Use only adequate solder tools applicable for lead-free
is switched “on”.
soldering tin. The solder tool must be able:
• When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a – To reach a solder-tip temperature of at least 400°C.
– To stabilize the adjusted temperature at the solder-tip.
circuit becoming unstable.
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around
2.3 Notes 360°C - 380°C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
2.3.1 General Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
• Measure the voltages and waveforms with regard to the
reduce heat.
chassis (= tuner) ground ( ), or hot ground ( ), depending
• Mix of lead-free soldering tin/parts with leaded soldering
on the tested area of circuitry. The voltages and waveforms
tin/parts is possible but PHILIPS recommends strongly to
shown in the diagrams are indicative. Measure them in the
avoid mixed regimes. If this cannot be avoided, carefully
Service Default Mode (see chapter 5) with a colour bar
clear the solder-joint from old tin and re-solder with new tin.
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
1-5
Safety Instructions, Warnings, Notes, and Abbreviation List
2.3.5 Alternative BOM identification 2.4 Abbreviation List

It should be noted that on the European Service website, 0/6/12 SCART switch control signal on A/V
“Alternative BOM” is referred to as “Design variant”. board. 0 = loop through (AUX to TV),
6 = play 16 : 9 format, 12 = play 4 : 3
The third digit in the serial number (example: format
KX 2B0835000001) indicates the number of the alternative 2DNR Spatial (2D) Noise Reduction
B.O.M. (Bill Of Materials) that has been used for producing the 3DNR Temporal (3D) Noise Reduction
specific AV set. In general, it is possible that the same AV AARA Automatic Aspect Ratio Adaptation:
model on the market is produced with e.g. two different types algorithm that adapts aspect ratio to
of display, coming from two different suppliers. This remove horizontal black bars; keeps
will then result in sets which have the same CTN (Commercial the original aspect ratio
Type Number; e.g. MCM394/12) but which have a different ACI Automatic Channel Installation:
B.O.M. number. algorithm that installs TV channels
directly from a cable network by
Also, it is possible that same model on the market is produced means of a predefined TXT page
with two production centers, however their partslist is the same. ADC Analogue to Digital Converter
In such case, no alternative B.O.M. will be created. AFC Automatic Frequency Control: control
signal used to tune to the correct
By looking at the third digit of the serial number, one can frequency
identify which B.O.M. is used for the set he is working with. AGC Automatic Gain Control: algorithm that
If the third digit of the serial number contains the number “1” controls the video input of the feature
(example: KX 1B033500001), then the set has been box
manufactured according to B.O.M. number 1. If the third digit is AM Amplitude Modulation
a “2” (example: KX 2B0335000001), then the set has been ANR Automatic Noise Reduction: one of the
produced according to B.O.M. no. 2. This is important for algorithms of Auto TV
ordering the correct spare parts! AP Asia Pacific
For the third digit, the numbers 1...9 and the characters A...Z AR Aspect Ratio: 4 by 3 or 16 by 9
can be used, so in total: 9 plus 26= 35 different B.O.M.s can be ASF Auto Screen Fit: algorithm that adapts
indicated by the third digit of the serial number. aspect ratio to remove horizontal black
bars without discarding video
Identification: The bottom line of a type plate gives a 14-digit information
serial number. Digits 1 and 2 refer to the production centre (e.g. ATSC Advanced Television Systems
LM is Arts), digit 3 refers to the B.O.M. code, digit 4 refers Committee, the digital TV standard in
to the Service version change code, digits 5 and 6 refer to the the USA
production year, and digits 7 and 8 refer to production week (in ATV See Auto TV
example below it is 2008 week 50). The 6 last digits contain the Auto TV A hardware and software control
serial number. system that measures picture content,
and adapts image parameters in a
Model FWM572/12 dynamic way
220-230 50Hz 60W AV External Audio Video
AVC Audio Video Controller
AVIP Audio Video Input Processor
FWM572/12 B/G Monochrome TV system. Sound
carrier distance is 5.5 MHz
LM1A0850005644 BLR Board-Level Repair
BTSC Broadcast Television Standard
Committee. Multiplex FM stereo sound
Figure 2-1 Serial number (example) system, originating from the USA and
used e.g. in LATAM and AP-NTSC
2.3.6 Module Level Repair (MLR) or Component Level Repair countries
(CLR) B-TXT Blue TeleteXT
C Centre channel (audio)
If a board is defective, consult your repair procedure to decide CEC Consumer Electronics Control bus:
if the board has to be exchanged or if it should be repaired on remote control bus on HDMI
component level. connections
If your repair procedure says the board should be exchanged CL Constant Level: audio output to
completely, do not solder on the defective board. Otherwise, it connect with an external amplifier
cannot be returned to the O.E.M. supplier for back charging! CLR Component Level Repair
COLUMBUS COlor LUMinance Baseband
2.3.7 Practical Service Precautions Universal Sub-system
ComPair Computer aided rePair
CP Connected Planet / Copy Protection
• It makes sense to avoid exposure to electrical shock.
CSM Customer Service Mode
While some sources are expected to have a possible
CTI Color Transient Improvement:
dangerous impact, others of quite high potential are of
manipulates steepness of chroma
limited current and are sometimes held in less regard.
transients
• Always respect voltages. While some may not be
CVBS Composite Video Blanking and
dangerous in themselves, they can cause unexpected
Synchronization
reactions that are best avoided. Before reaching into a
DAC Digital to Analogue Converter
powered TV set, it is best to test the high voltage insulation.
DBE Dynamic Bass Enhancement: extra
It is easy to do, and is a good service precaution.
low frequency amplification
DDC See “E-DDC”
1-6

Safety Instructions, Warnings, Notes, and Abbreviation List

D/K Monochrome TV system. Sound lines. The fields are written in “pairs”,
carrier distance is 6.5 MHz causing line flicker.
DFI Dynamic Frame Insertion IR Infra Red
DFU Directions For Use: owner's manual IRQ Interrupt Request
DMR Digital Media Reader: card reader ITU-656 The ITU Radio communication Sector
DMSD Digital Multi Standard Decoding (ITU-R) is a standards body
DNM Digital Natural Motion subcommittee of the International
DNR Digital Noise Reduction: noise Telecommunication Union relating to
reduction feature of the set radio communication. ITU-656 (a.k.a.
DRAM Dynamic RAM SDI), is a digitized video format used
DRM Digital Rights Management for broadcast grade video.
DSP Digital Signal Processing Uncompressed digital component or
DST Dealer Service Tool: special remote digital composite signals can be used.
control designed for service The SDI signal is self-synchronizing,
technicians uses 8 bit or 10 bit data words, and has
DTCP Digital Transmission Content a maximum data rate of 270 Mbit/s,
Protection; A protocol for protecting with a minimum bandwidth of 135
digital audio/video content that is MHz.
traversing a high speed serial bus, ITV Institutional TeleVision; TV sets for
such as IEEE-1394 hotels, hospitals etc.
DVB-C Digital Video Broadcast - Cable JOP Jaguar Output Processor
DVB-T Digital Video Broadcast - Terrestrial LS Last Status; The settings last chosen
DVD Digital Versatile Disc by the customer and read and stored
DVI(-d) Digital Visual Interface (d= digital only) in RAM or in the NVM. They are called
E-DDC Enhanced Display Data Channel at start-up of the set to configure it
(VESA standard for communication according to the customer's
channel and display). Using E-DDC, preferences
the video source can read the EDID LATAM Latin America
information form the display. LCD Liquid Crystal Display
EDID Extended Display Identification Data LED Light Emitting Diode
(VESA standard) L/L' Monochrome TV system. Sound
EEPROM Electrically Erasable and carrier distance is 6.5 MHz. L' is Band
Programmable Read Only Memory I, L is all bands except for Band I
EMI Electro Magnetic Interference LORE LOcal REgression approximation
EPLD Erasable Programmable Logic Device noise reduction
EU Europe LPL LG.Philips LCD (supplier)
EXT EXTernal (source), entering the set by LS Loudspeaker
SCART or by cinches (jacks) LVDS Low Voltage Differential Signalling
FBL Fast BLanking: DC signal Mbps Mega bits per second
accompanying RGB signals M/N Monochrome TV system. Sound
FDS Full Dual Screen (same as FDW) carrier distance is 4.5 MHz
FDW Full Dual Window (same as FDS) MIPS Microprocessor without Interlocked
FLASH FLASH memory Pipeline-Stages; A RISC-based
FM Field Memory or Frequency microprocessor
Modulation MOP Matrix Output Processor
FPGA Field-Programmable Gate Array MOSFET Metal Oxide Silicon Field Effect
FTV Flat TeleVision Transistor, switching device
Gb/s Giga bits per second MPEG Motion Pictures Experts Group
G-TXT Green TeleteXT MPIF Multi Platform InterFace
H H_sync to the module MUTE MUTE Line
HD High Definition NC Not Connected
HDD Hard Disk Drive NICAM Near Instantaneous Compounded
HDCP High-bandwidth Digital Content Audio Multiplexing. This is a digital
Protection: A “key” encoded into the sound system, mainly used in Europe.
HDMI/DVI signal that prevents video NTC Negative Temperature Coefficient,
data piracy. If a source is HDCP coded non-linear resistor
and connected via HDMI/DVI without NTSC National Television Standard
the proper HDCP decoding, the Committee. Color system mainly used
picture is put into a “snow vision” mode in North America and Japan. Color
or changed to a low resolution. For carrier NTSC M/N= 3.579545 MHz,
normal content distribution the source NTSC 4.43= 4.433619 MHz (this is a
and the display device must be VCR norm, it is not transmitted off-air)
enabled for HDCP “software key” NVM Non-Volatile Memory: IC containing
decoding. TV related data such as alignments
HDMI High Definition Multimedia Interface O/C Open Circuit
HP HeadPhone OSD On Screen Display
I Monochrome TV system. Sound OTC On screen display Teletext and
carrier distance is 6.0 MHz Control; also called Artistic (SAA5800)
I2C Inter IC bus P50 Project 50: communication protocol
I2 D Inter IC Data bus between TV and peripherals
I2 S Inter IC Sound bus PAL Phase Alternating Line. Color system
IF Intermediate Frequency mainly used in West Europe (color
Interlaced Scan mode where two fields are used carrier= 4.433619 MHz) and South
to form one frame. Each field contains America (color carrier PAL M=
half the number of the total amount of
1-7
Safety Instructions, Warnings, Notes, and Abbreviation List

3.575612 MHz and PAL N= 3.582056 V V-sync to the module


MHz) VCR Video Cassette Recorder
PCB Printed Circuit Board (same as “PWB”) VESA Video Electronics Standards
PCM Pulse Code Modulation Association
PDP Plasma Display Panel VGA 640x480 (4:3)
PFC Power Factor Corrector (or Pre- VL Variable Level out: processed audio
conditioner) output toward external amplifier
PIP Picture In Picture VSB Vestigial Side Band; modulation
PLL Phase Locked Loop. Used for e.g. method
FST tuning systems. The customer WYSIWYR What You See Is What You Record:
can give directly the desired frequency record selection that follows main
POR Power On Reset, signal to reset the uP picture and sound
Progressive Scan Scan mode where all scan lines are WXGA 1280x768 (15:9)
displayed in one frame at the same XTAL Quartz crystal
time, creating a double vertical XGA 1024x768 (4:3)
resolution. Y Luminance signal
PTC Positive Temperature Coefficient, Y/C Luminance (Y) and Chrominance (C)
non-linear resistor signal
PWB Printed Wiring Board (same as “PCB”) YPbPr Component video. Luminance and
PWM Pulse Width Modulation scaled color difference signals (B-Y
QRC Quasi Resonant Converter and R-Y)
QTNR Quality Temporal Noise Reduction YUV Component video
QVCP Quality Video Composition Processor
RAM Random Access Memory
RGB Red, Green, and Blue. The primary
color signals for TV. By mixing levels
of R, G, and B, all colors (Y/C) are
reproduced.
RC Remote Control
RC5 / RC6 Signal protocol from the remote
control receiver
RESET RESET signal
ROM Read Only Memory
R-TXT Red TeleteXT
SAM Service Alignment Mode
S/C Short Circuit
SCART Syndicat des Constructeurs
d'Appareils Radiorécepteurs et
Téléviseurs
SCL Serial Clock I2C
SCL-F CLock Signal on Fast I2C bus
SD Standard Definition
SDA Serial Data I2C
SDA-F DAta Signal on Fast I2C bus
SDI Serial Digital Interface, see “ITU-656”
SDRAM Synchronous DRAM
SECAM SEequence Couleur Avec Mémoire.
Color system mainly used in France
and East Europe. Color carriers=
4.406250 MHz and 4.250000 MHz
SIF Sound Intermediate Frequency
SMPS Switched Mode Power Supply
SoC System on Chip
SOG Sync On Green
SOPS Self Oscillating Power Supply
S/PDIF Sony Philips Digital InterFace
SRAM Static RAM
SRP Service Reference Protocol
SSB Small Signal Board
STBY STand-BY
SVGA 800x600 (4:3)
SVHS Super Video Home System
SW Software
SWAN Spatial temporal Weighted Averaging
Noise reduction
SXGA 1280x1024
TFT Thin Film Transistor
THD Total Harmonic Distortion
TMDS Transmission Minimized Differential
Signalling
TXT TeleteXT
TXT-DW Dual Window with TeleteXT
UI User Interface
uP Microprocessor
UXGA 1600x1200 (4:3)


1$#-PDBUJPO7JFX
2-2

FWP3200D
/05 /12

: 220~240V
300W

FWP3200D
/93/85 /05/12
MLR+CLR

AMP+Power Board MLR+CLR

KEY +MIC Board MLR+CLR

USB+Remote Board MLR+CLR

Jack Board MLR+CLR

IPod Board MLR


2-3
Measurement Setup

 

  


 
2-4

   

  

    

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3-2 3-2
4-1 4-1

DISASSEMBLY INSTRUCTIONS

4.1 Dismantling of Main Unit Dismantling of Back Panel Ass’y


1)Upward the apparatus as shown in figure1 1)Loosen 12 screw“G”as shown in figure8
2) Loosen 8 screws“A”open Top cover as shown figure3 2)Disconnet the wires to draw out the Back Panel as shown in figure9
3) Disconnect the wires in the canbinet as shown in B

Figure 1 Figure2 Figure3


Figure8 Figure9
Dismantling of Main Board Dismantling of AMP+Power Board & Jack Board
1)Keep flat the Top cover ASS’Y as shown in figure 4
2)Loosen 6screw”C” as shown in figure5 to detach Main Board 2)Loosen 6screw“H” as shown in figure10to detach Remote Board
2)Loosen 4screw“I” as shown in figure11 to detach Jack Board in figure12

Figure 4 Figure5

Dismantling of MIC Board &VFD Board Figure 10 Figure 11


1)Loosen 4screw“D”detach MIC Board & loosen 5 screw”E” detach KEY Board as shown in figure6
1)Loosen 2screw“F” detach KEY Board as shown in figure7

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'

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Figure 11

Figure6 Figure7
4-2 4-2
Service Position

Note: Refer to the wiring Diagram for the correct cable connection between boards.

,&:#PBSE
7'%#PBSE

.*$#PBSE

".1 1PXFS#PBSE

+BDL#PBSE

Service Position
Main Board, AMP+Power Board, KEY Board, MIC Board, Jack Board, VFD Board

Note: In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or metallic parts.
To prevent such short-circuit use a piece of hard paper or other insulating material between them.
- -

MAIN VOL BOARD


Encode VOL

Headphone A/B SWITCH 5XKEYS


IR BOARD
IR ADC C
LCD FLIP SWITCH

USB_A BOARD MAIN BOARD


LED_Ligh LCD
SDRM X2
FLASH
t A SLIDE B
USB1 1MX4X16 Bit
USB EN25T80 A
A A641604L 6TE LCD Driver
SW
(ET6622)
SGM4 ADC D
717+S
Ipod A SPI
GM47 I2C
UART A Tuner
17
Decoder A_I2S FM_I2S Si4705
(SPHE8104GW) MCU
2CH UART B (PIC18F46J11)
ADC STM8S10
8X I2C
ADC A MCU
KEYS+3LED SDRM X2 MFI337S3959 AMP BOARD
MP3LINK IN A
1MX4X16 Bit 25v
2.0C CLASS6 I2C
A641604L 6TE I2C
STANDBY CTL DIGITAL AMP
MFI337S3959 EEPROM
USB1 USB 2.0C CLASS6 (24C02) Digital Audio PWM 1,2,3,7 TAS5342 60W
B X2 X4
SW I2C FM_I2S PWM Processor
SGM4 IR TAS5538
74HV157
717+S CH A_I2S
(I2S SWITCH)
Ipod B GM47 Decoder MIC/HP BOARD
MCLK/BCLK/LRCLK CH B_I2S DO OP MIC
17 (SPHE8104GW) MIC I2S_DATE 2CH ADC
B_I2S VOLX2 MIC X2
2CH SLAVE MASTER CS5343 (SGM8904 )
MP3LINK IN B FM I2S_DATE
KEY+3LED ADC MIC BOARD
CS8422 A_USB I2S_DATE
(SRC) B_USB I2S_DATE 74LVC1G04 headphone
8X FLASH PWM
ADC B SN74LV40 TLV320DAC2 hearphone
KEYS+3LED EN25T80

USB_B BOARD

LDO LDO SYSTEM 5V LDO


(1117 1.25V) (1117 3.3V) IPOD POWER 5V (1117 3.3V)

M+5.2V 5A
PUS ADC5V , STB5V
100mA
-2 -2
6-1 6-1

STM8S105XX DIAGRAM

Reset block XTAL 1-16 MHz


Clock controller

Reset Reset
RC int. 16 MHz

Detector
POR BOR
RC int. 128 kHz
Main Board
Clock to peripherals and core

Window WDG
STM8 core

Independent WDG

Single wire Debug/SWIM Up to 32 Kbytes


debug interf.
program Flash

Master/slave
autosynchro UART2
LIN master 1 Kbytes
SPI emul. data EEPROM
TABLE OF CONTENTS
400 Kbit/s 2
I C Up to 2 Kbytes
Circuit Diagram................................................................................................................ 6-2 RAM
PCB Layout Top View ..................................................................................................... 6-
8 Mbit/s SPI Boot ROM
PCB Layout Bottom View.............................................................................................. 6-
Address and data bus

Up to
16-bit advanced control 4 CAPCOM
timer (TIM1) channels +3
complementary
outputs
Up to
16-bit general purpose
5 CAPCOM
timers (TIM2, TIM3)
channels

Up to 10 channels
ADC1 8-bit basic timer
(TIM4)

1/2/4 kHz Beeper


beep AWU timer
-2 -2
-

5 4 3 2 1

M+5V
AB_MIX ADC ADJ
MCU+3V3 L3V3
U1 1117-33/SOT-223
600/100MHZ L1 FB120R 3 2
L2 IN OUT
MCU+3V3
EC1 BC1 EC2 BC2 R237
10K R1 0 AD_MIX 4.7K

GND
BC12 47uF/16V 0.1uF 47uF/16V 0.1uF

R9
RDJ1

1
104 C1

MCU_IROUT
104

MCU_IRIN

MCU_TX
MCU_SDA
MCU_SCL
AMP_MUTE
GND GND

ADC_DIF_RST
D MIC_DET D

HP_DET
R2 10K MCU_TX

10K
GND MCU+3V3 8104_RX 2 GND
R4 10K MCU_RX
8104_TX 2 CN1

R7
R8

R6
R11
R12

R61
R13
R14 10KMCU_SCL MCU/DEBUG/DIP2.0/NC

R115
R15
MCU+3V3 MCU_SCL 2
R16 10KMCU_SDA MCU_SDA 2 REST_MCU 1 1
MCU+3V3 2 2
R69 10K 3 3
GND D_PGD 4

100
100

100
100
220
100
100
100
ADC_DIF_RST 4

100
32.768kHz/10PPM ADC_DIF_RST 2 D_PGC 5
TOSC1 5
NC/XT1 BC11

0.1uF

44
43
42
41
40
39
38
37
36
35
34
U2
MCU+3V3
C2 C3 GND

NC
22p 22p
R17

RC5/SDO1
RC6/TX/CK
TOSC2
4.7K
CN2

RD3/PSP3/SS2
RC2/CCP1/P1A
MCU_RX R20 100 1

RC4/SDI1/SDA1
RC3/SCK1/CSL1
RC7/RX/DT

RD2/PSP2/SDO2
IP_DET R18 100 FM_REST TO/IR/SMT2.0MM
2 33

RC1/T1OSI/CCP2*
A_IP_DET R19 100 RD4/PSP4 NC RDS_INT FM_REST 2
3 32 GND R21 1K
RD5/PSP5/P1B RC0/T1OSO/T1CKI RDS_INT 1 IR_IN L3 FB

RD1/PSP1/SDI2/SDA2
IUA_POWER_ON R22 PCON 3

RD0/PSP0/SCK2/SCL2
100 4 31 R23 100 R24 10K A_8104_RX 3
FM_REST R25 100 RD6/PSP6/P1C OSC2/RA6 I2S_SW_CTL MCU+3V3 2
5 30 R26 1K R27 A_8104_TX 2
RD7/PSP7/P1D OSC1/RA7 10K R28 10 GND 1
6 VSS VSS 29 1
7 PIC18F46J11/TQFP44 28 R36 HP_DET AMP_MUTE
MCU+3V3 VDD VDD MCU+3V3 10K HP_DET 2 AMP_MUTE 1
IR_IN R29 1K 8 27 R30 100 LCD_CS
HP_AB SW R31 RB0/INT0/FLTO/AN12 RE2/CS/AN7 LCD_CLK
1K 9 26 R32 100 CN3
AD_HP_VOL R33 RB1/INT1/AN10 RE1/WR/AN6 LCD_DATA
33 10 25 R34 100 PCON TO/KEY/SMT2.0MM
AD_MIX R35 RB2/INT2/AN8 RE0/RD/AN5 PCON 1
33 11 24 MCU_IROUT
RB3/AN9/CCP2* RA5/AN4/SS1/C2OUT
BC3 33PF 23 MCU_IROUT 1 AD_KEY3 L4 FB
VDDCORE/VCAP 5 5
MCU+3V3
MCU+3V3 4 4
BC4 33PF EC3 BC5 MCU_IRIN VOLB_CTL L5 FB 3
0.1uF MCU_IRIN 1 VOLA_CTL L6 FB 3
BC7 2 2
BC6 33PF R37
100uF/10V 0.1uF 1 1
C BC8 33PF 10K C
GND

NC
NC
RB4/KBI0/AN11
RB5/KBI1/T0CKI/C1OUT
RB6/KBI2/PGC
RB7/KBI3/PGD
MCLR
RA0/AN0
RA1/AN1
RA2/AN2
RA3/AN3
GND IUA_POWER_ON IUA_POWER_ON
GND A_IP_DET 2
GND MIC_DET
MIC_DET 2

12
13
14
15
16
17
18
19
20
21
22
R38 10K 8104_RX
MCU+3V3 22K 8104_TX 8104_RX 1
10K R40 MCU+3V3
MCU+3V3 R39 MCU+3V3 8104_TX 1
R41 22K A_8104_RX
A_8104_TX A_8104_RX 1
VOLA_CTL R42 100 R46

R44
R45 22K A_8104_TX 1

D_PGC
VOLB_CTL R43 100
10K
BC9
R47 100 AD_KEY3
0.1uF R48

R49 D_PGD
100
R50 100 IP_DET
AD_KEY2
R51 100 A_IP_DET
MCU+3V3 100 AD_KEY1 A_IP_DET 2

1K
GND IP_DET
R52 100 A_8104_RX IP_DET 2
A_8104_TX
BC10 C4 103
U3 0.1uF LCD_FLIP

REST_MCU
1 8 C12 104 C5 103
A0 VCC GND
2 A1 WP 7 GND
3 6 R53 100 MCU_SCL C6 103 AD_KEY2
A2 SCL R54 100 MCU_SDA AD_KEY2 2
4 GND SDA 5 AD_KEY1
GND AD_KEY1 2
24C02 I2C ADDR = 0XA0
GND MCU+3V3

AD_HP_VOL
AD_HP_VOL 2
HP_AB SW
EC5 HP_AB SW 2
R55 I2S_SW_CTL
10u/16V 10K I2S_SW_CTL 2
R56 100 LCD_FLIP
LCD_FLIP 2

R57 IN4148
10K Q1
B 3904 B
D1

SEG19

CON3

SEG0 1

52
51
50
49
48
47
46
45
44
43
42
41
40
SEG1 SEG1
2 SEG2
SEG2 3
SEG3 SEG3
4 SEG4
R58 10k LCD_CS 1 39 SEG18 SEG4 5

SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
/CS SEG18 SEG5
SEG5 6
2 38 SEG17 SEG6 SEG6
/RD SEG17 7 SEG7
SEG7 8
R59 10k LCD_CLK 3 37 SEG16 SEG8 SEG8
/WR SEG16 9 SEG9
SEG9 M+5V R60 NC
U4 10 SEG10
R62 10k LCD_DATA 4 36 SEG15 SEG10 11 R63
DATA SEG15 SEG11 L3V3 0
SEG11 12
5 35 SEG14 SEG12 SEG12
VSS ET6622(QFP52) SEG14 13 SEG13
SEG13 14
6 34 SEG13 SEG14 SEG14
CSCI SEG13 15 SEG15 R65
SEG15 16 R82
R64 10R 7 33 SEG12 SEG16 SEG16
L3V3 VDD SEG12 17 SEG17
SEG17 18
EC6 + VLCD 8 32 SEG11 SEG18 SEG18 150
19 150

C8
C9
VLCD SEG11 SEG19
C7 SEG19 20
100uF/10V 9 31 SEG10 SEG20
104 /IRQ SEG10
COM0 21
1 LED+

COM0
1 LED+

10 30 SEG9 COM1 22
T1 SEG9

102pF
102pF
102pF C10
COM2 COM1
23 COM2 D2
11 29 SEG8 COM3 24 D10
R66 T2 SEG8 COM3 LCD BL LCD BL
COM4 25
12 28 SEG7 COM5 COM4
T3 SEG7 26 COM5
COM6 27
2

COM0 COM6
2

2K 13 COM0 27 SEG6 COM7


SEG6 28 COM7

COM1
COM2
COM3
COM4
COM5
COM6
COM7
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
A VLCD A
LED+
GND

14
15
16
17
18
19
20
21
22
23
24
25
26
R67
32
33

NC LCD/DISPLAY

GND
SEG3

COM5
COM6
COM7
SEG0
SEG2
SEG4
SEG5

COM1
COM2
COM3
COM4
SEG1 Title
MCU LCD
Size Document Number Rev
C 2.0
CEA88-SCH-FWP3200D
Date: Saturday, February 25, 2012 Sheet 1 of 10
5 4 3 2 1
6-3 6-3
Circuit Diagram - Part 2

5 4 3 2 1

CON12 CON13
TO/ipod/A/BOARD TO/ipod/B/BOARD
GND M+5V 1 1 A_IPOD_5V 1
M+5V 2 1 IPOD_5V AMP_MUTE
CN15 2 2 2 AMP_MUTE 1
3 3 GND 3
4 3 GND
1 L9 FB100/OHM/2A 4 4
2 5 4 PCON
L8 FB100/OHM/2A 5 M+5V 5 M+5V PCON 1
3 6 5 MCU_IROUT
6 6 6 MCU_IROUT 1
4 GND
L10 FB100/OHM/2A

220uF/16V

220uF/16V
5
6 FB600/OHM/500mA GND MCU_IRIN
L11 MCU_IRIN 1
7 ADC5V
FORM/AMP/BOARD

EC58

EC57
D D

100P BC15
0.1uF BC14
IUA_POWER_ON IUA_POWER_ON
GND GND 2

AM5V
STB5V
MCU+3V3 M+5V
M+5V BM+5V
L15 Q2 FB100/OHM/2A
1 5 FB
VIN OUT 1 3 L12 FB100/OHM/2A
Q3
EC7 BC200 2 EC8 BC17 BC18 1 3 L13
GND GND R68 APM3401

2
47uF/16V 0.1uF R79 10K 3 4 47uF/16V 0.1uF 1000pF
EN NC APM3401

2
TP2 100K
U6 ET53333-3.3V Test
GND GND

R70

220R

R75 1K Q4
IUA_POWER_ON
2N3904

CON4 GND
FORM/AMP/BOARD
C C
1 L16 FB600/OHM PCON
1 L17 FB600/OHM
2 STB5V MCU+3V3
2
3 3
L18 FB100/OHM I2S_MCLK CON7
4 4
5 TO/MIC/HP
5 R78
6 L21 FB100/OHM I2S_LRCK
6 150
7 1 1
7 L22 FB100/OHM I2S_SCLK 22p MIC_I2S_DATA
BC44 L84
8 2 2 FB100/OHM
8
1

9 3 3
9 L23 FB100/OHM A_USB_DATA 22p BC34 I2S_MCLKL91
10 D3 4 4
10 L24 FB100/OHM B_USB_DATA FB100/OHM
11 STANDBY LED 5 5
11 22p BC33 I2S_SCLKL92
12 6 6 FB100/OHM
12 L27 FB100/OHM MIC_I2S_DATA
13 7 7
13 L28 FB100/OHM FM_I2S_DATA 22p BC32 I2S_LRCKL93
14 8 8 FB100/OHM
14
2

15 R76 9
15 BC28 HP_DATA L94 9
16 L26 FB600/OHM MCU_IROUT 22p 10 FB100/OHM
16 PCON Q6 10
17 L25 FB600/OHM MCU_IRIN ADC5V 11
17 2N3906 GND 11
18 R77 12 12
18 L20 FB600/OHM AMP_MUTE
19 4.7K C14 L3V3 13 13
19 LCD_FLIP L95
20 14 14 FB600/OHM
20 AD_HP_VOL L96
104 15 15 FB600/OHM
10K HP_AB SW L97 16 FB600/OHM
I2C_SCL L98 16
17 17 FB600/OHM
I2C_SDA

BC19
BC20
L99

BC22
BC21
18

BC24
FB600/OHM

BC26

BC23
BC25
MIC_DET L100 18
GND 19 19 FB600/OHM
20

102
102
102
102
20

102
PCON: L: POWER OFF,STB LED LIGHT; H:POWER OFF,STB LED OFF

100P
21

100P
100P
100P BC27
100P BC29
100P BC30
100P BC31
HP_DET L7 21
22 22 FB600/OHM
M+5V
GND
GND
R205 10

BC35
0.1uF + EC21
I2S_SW_CTL: H: USB MCLK; L:FM MCLK 47uF10V
U7
MIC_DET
B I2S_SW_CTL 1 16 MIC_DET 2 B
SELECT VDD GND
HP_DET
FM_MCLK 2 15 HP_DET 2
1A STROBE
A_USB_MCLK 3 14
1B 4A
I2S_MCLK 4 13
1Y 4B
FM_BCLK 5 12
2A 4Y
C41 C40 C35 C36 C37 C38
A_USB_BCLK 6 11 FM_LRCK GND
2B 3A
22p 22p 22p 22p 22p 22p 33R
I2S_SCLK 7 10 A_USB_LRCLK
2Y 3B CS8422
I2S_LRCK R203
8 9 1 31 FM_MCLK
GND 3Y RX0 RMCK
R20433R
74VHC157 2 29 I2S_LRCK
RX1 U80 LRCK1 AD_HP_VOL
R20933R AD_HP_VOL 2
5 28 I2S_SCLK HP_AB SW
U10 RX2 BCK1 HP_AB SW 2
U26
R96 100 R20633R
FM_BCLK 12 13 1 5 6 27 B_USB_DATA I2S_SW_CTL
FM_BCLK 1 X0 X NC VCC RX3 SDOUT1 R225 33R
FM_LRCK 14 25 FM_LRCK I2S_SW_CTL 2
FM_LRCK 1 X1 GND 22 LRCK2 R226
FM_I2S_DATA 15 3 2 USB_LRCLKR85 13 24 33R FM_BCLK LCD_FLIP
FM_DATA 1 X2 Y IN 2 USB_LRCLK 22 ILRCK BCK2 LCD_FLIP 2
11 BC57 C21 USB_BCLK R84 14 23
FM_I2S_DATA X3 2 22 ISCLK DOUT2
1 3 4 L3V3 L30 2 USB_BCLK USB_DATA R83 15 26 I2C_SCL
Y0 GND OUT USB_DATA SDIN TDM_IN R207 33R 12.288MHz/20PPM MCU_SCL 2
5 104 475 FB600/OHM 3 11 XTAL_OUT I2C_SDA
A_USB_DATA Y1 VA XTI R218 33R MCU_SDA 2
2 74LVC1G04 12 XT3
B_USB_DATA Y2 GND GND BC50 + XTO R208 33R
4 32 ADC_DIF_RST
Y3
EC11

RRT
VDD 16 R215 22 R86 22 HP_DATA ADC_DIF_RST
HP_AB SW 1k R216 104 R21033R
I2C_SCL
10uF10V

10 4 9 ADC_DIF_RST 2
IUA_POWER_ON 1K R98 A AGND SCL C13 C16
9 R87 L29 FB600/OHM 22
B VL R21233R
7 10 I2C_SDA
VEE L60 600 SDA 22p 22p
R217 47K 19 V_REG
8 20 7 R211 4.7K
VSS VD_FILT AD0 4.7K
6 8 R213
INHIBIT AD1 GND
EC38

BC36 + BC38 + BC39 16


47K GPO0
EC51

+
CD74HC4052-SOP-16PIN
MC14052B-D_SO-16 104 104 104 17 R164 4.7K
A A
10uF10V

GPO1 R214 4.7K


GND 21 DGND GPO2 18
A_USB_MCLK GND 33 30 GND
T_P GPO3
10uF10V
10uF10V EC50

A_USB_BCLK A_USB_MCLK 2
A_USB_LRCLK A_USB_BCLK 2
A_USB_LRCLK 2 M+5V
A_USB_DATA
A_USB_DATA 2
R171 22

EC52 +
BC16
47uF10V 0.1uF
Title
POWER
Size Document Number Rev
GND C 2.0
CEA88-SCH-FWP3200D
Date: Saturday, February 25, 2012 Sheet 2 of 10
5 4 3 2 1
6-4 6-4
Circuit Diagram - Part 3

5 4 3 2 1

R123 47K FM_VDD

RDS_INT
2 C11 18PF
2
1 1
R88 300 FM_BCLK

FM ANT L31 R89 300 FM_WCLK

NC
CN4
D D

20
19
18
17
16
L41 U9
FMGND GND

27nH
NC
GPO1
FMGND

DFS/LIN
1 15 R90 300 FM_DATA

GP02/INT
NC DOUT/RIN

GPO3/DCLK
2 14 47P BC121
FMIP LOUT/DFS
3 13 47P BC122
FMGND RFGND ROUT/DOUT
BC123 47P 4 12 TUNER_3V3
AMI GND FMGND
L3V3
L19 FB 1GHZ 10UF/6.3V/0805
5 11 FM_VDD
RST VDD
EC12 EC56 BC42 EC13 EC55
BC41 +

SEN
SCLK
SDIO
RCLK
VIO
BC40 + + +
22nF 0.1uF 10UF/6.3V/0805

6
7
8
9
47P 10UF/6.3V/0805
SI4705
10UF/6.3V/0805
FM_REST R92 100 FM_VDD R93 47K FMGND
FMGND FMGND
FMGND

FM_VDD 10
MCU_SCL R94 100 FM_SCL FMGND
C C
MCU_SDA R95 100 FM_SDA BC13
FM_BCLK R97 33 FM_CLOCK 0.1uF

C19 FMGND
22P
MCU_SCL
MCU_SDA MCU_SCL 1
MCU_SDA 1
FMGND FM_REST
RDS_INT FM_REST 2
RDS_INT 1

FM_BCLK
FM_WCLK FM_BCLK 1
FM_DATA FM_LRCK 1
B FM_DATA 1 B

A A

A&D TEC
Title
FM RADIO
Size Document Number Rev
B 2.0
CEA88-SCH-FWP3200D
Date: Saturday, February 25, 2012 Sheet 3 of 10
5 4 3 2 1
6-5 6-5
Circuit Diagram - Part 4

C53 C54 C52


ADC5V
22P 22P 22P GND
L136 100/100MHZ I2S_DATA_I
10 VA SDTO 1
EC31
A_DVCC3 BC84 +
GND 1 GND VCC 8 DVCC3
9 2 USB_BCLK BCP_SDA 2 7 BCP_RESET 100
100P 10UF/16V GND SCLK B_CLKIN SDA RST
B_CLKIN 2 3 6 BCP_SCL R153
CON1 4.7UF/16V NC SCL
10K 4 NC NC 5 GND
TO/iPod/B/board 1.25MM INR R116 EC32 8 3 USB_LRCLK
AINR LRCK

+
AGND
INL R245 CP UA1
1 1 B_CLKIN
2 10K 7 4 USB_MCLK
2 AGND VQ MCLK
3 INR
3 R152 100 MP3_DET 4.7UF/16V
4 4 10K C26 DVCC3
5 INL R108 EC33 6 5
R156 R157 R158 R159
5 GND AINL FILT+

+
6 R71 0 USB_DM NC/10P
6 NC 100K 100K 10K
7 R72 0 USB_DP EC34 R160
7 L71 600/100MHZ R162
8 IP_DET 10UF/16V DVCC3
8 L72 600/100MHZ ACCESSOR R233 R234 C49 C46 C47 C48 CS5343
9 8.2K 10K 10K
9 L78 600/100MHZ IPUSB_SW U19
10 10 GND TP9
11 L79 600/100MHZ B_USB_POWER_ON + 1000P 33P 33P BC86
11 8.2K 1000P
12 L80 600/100MHZ AD_KEY2 GND
12 L81 600/100MHZ USB_LED BC85 EC35 + C50 BCP_SCL
13 BCP_SDA 0.1uF
13 L82 600/100MHZ MP3LINK_LED 0.1UF CVBS
14 14
L83 600/100MHZ IPOD_LED 10UF/16V BC87 33P
15 15
16 GND AGND 0.1UF GND
16

GND
AGND

GND
GND
GND
GND

GND
VVCC3
VVCC3

RF3.3V
USB_PLLVCC3

PLLVCC1.2
VCC1.25
AGND
L3V3
BC88 100PF
DVCC3
GND AGND BC89 100PF
GND C27 1uF V_COMP TV_DAC0
R107 TP10 VVCC3
4.7K R

V_COMP

B_CLKIN
USB_DM
USB_DP
V_FSADJ
EC36 R166

TV_DAC0
L GND R165 1K V_FSADJ
R167
BM+5V B_USB_POWER_ON TP11 NC/75
10u/16V 10K
TP12

102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87 USB_POWER
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
Q12 1k R100 USB_POWER R168 100
2N3904 RESET_B DAC_REF

F
E
A
B
C
D
EC37 BC90 BC91 BC92 EC9 R104

RFIS
R169 D8 EC39 C28 GND

CLKIN

OPVIP
OPVIN
100u/16V 0.1u 330p 33p 100u/16V Reset

RFSUM
10K 1N4148 Q8 C29

VDD_12
VDD_12
AOUT_L

USB_DP

CLKOUT
AOUT_R
4.7K

USB_DM

AGCCAP
V_COMP

PLL_VSS
V_FSADJ

PLL_VDD
TV_AVSS
TV_AVSS

TV_DAC3
TV_DAC2
TV_DAC1
TV_DAC0

AD_AVSS
TV_AVDD
TV_AVDD
2N3904 10u/16V 0.1uF

AD_AVDD

APC_AVSS
USB_AVSS
GND

USB_AVDD
0.1uF 103 64
NC ADAC_AVSS GND

LDSW/GPIO67
HOME/GPIO66
104 CDLDO ADAC_AVDD 63 AVCC3
GND GND DAC_REF
105 NC VREF 62
R170 0 GND
106 CDMDI AIN_R 61
GND 107 60
RF3.3V SRV_AVDD AD_AVDD AD_VCC3 GND
108 V21 AD_AVSS 59 GND
109 58 TX_IP
V165 GPIO54 RX_IP TX_IP
ROM_VCC3 GND 110 DA_AVSS GPIO53 57 RX_IP
111 56 R173 33 BCP_RESET
DA_TEO GPIO52 R174 33 BCP_SDA BCP_RESET
112 DA_FEO GPIO51 55 BCP_SDA
R175 10K SPI_CE 113 54 R176 33 BCP_SCL
RF3.3V DA_AVDD GPIO50 D9 IP_DET BCP_SCL
R177 10K DQ2 114 SPDC_OUT/GPIO70 SPDIF_IN/GPIO48 53
115 52 ACCESSOR R178 1N4148
R179 10K DQ3 10K R181 SC_OUT/GPIO71 SPDIF_OUT/GPIO47 GND

VCC1.25
U21 EDJ1117-125/SOT-223 R180 CD_IR 33 116 SPHE8104G-128 51 MA3 10K
GPIO72 M_A3 MA2
3 2 L85 1uH PLLVCC1.2 117 DMEA M_A2 50
IN OUT USB_LED 118 49 MA1
MP3LINK_LED CARD_SENSE/GPIO74 M_A1 MA0
119 SD_D0/GPIO75 M_A0 48
+ EC40 BC94 BC95 IPOD_LED 120 47 MA10
SD_CLK/GPIO76 M_A10

GND
IPOD_CHARGE_CTL 121 46 M_BA1
MP3_DET SD_SMD/GPIO77 M_BA1 M_BA0
220uF/16V 0.1uF 1000p 122 45

1
GPIO78 M_BA0 M_RAS
123 GPIO79 M_RAS 44
IPUSB_SW 124 43 M_CAS
GND SPI_CE R182 33 CDVR M_CAS M_WE
125 SPI_CE M_WE 42
SPI_D0 R183 33 126 41 DQM0
SPI_CLK R184 33 SPI_D0 M_DQM0 MA4
127 SPI_CLK M_A4 40
GND BC96 SPI_D1 R185 33 128 39 MA5
33P SPI_D1 M_A5
VCC3 RF3.3V GND BC97
ROM_VCC3
U22 1117-33/SOT-223 U23
3 2 SPI_CE 1 8 10PF
IN OUT SPI_D0 CE# VDD DQ3
2 7

GPIO86
VFD_CLK
VFD_STB
VFD_DATA
VDD_33
RESET_B
VSS
IR_IN/GPIO3
GPIO4
GPIO5
VDD_12
HSYNC/GPIO7
VSYNC/GPIO8
M_D0
M_D1
M_D2
M_D3
M_D4
M_D5
M_D6
M_D7
M_D15
M_D14
M_D13
M_D12
M_D11
M_D10
M_D9
M_D8
M_DQM1
VSS
M_CLK
VDD_33
M_A11
M_A9
M_A8
M_A7
M_A6

DQ2 DOUT HOLD# SPI_CLK


EC41 BC98 3 6 GND
WP# SCK U20

1
2
3
4
5
6
7
8
9
4 5 SPI_D1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38

GND DIN

GND
100u/16V 0.1u 8104_RX 8104_RX 2
EN25T80 8104_TX

1
8104_TX 2
GND
GND RFGND SPI_D0 R186 NC SPI_D1 BC99
1000P
DVCC3 DVCC3
MD15
MD14
MD13
MD12
MD11
MD10

RESET_B
RX1
TX1
MD0
MD1
MD2
MD3
MD4
MD5
MD6
MD7
MD9
MD8
DQM1
SDRAM_CLK
MA11
MA9
MA8
MA7
MA6

GND

R187 4.7K
USB_PLLVCC3 R188 4.7K
R189

L86 FB R194 100 8104_TX


GND

33GND
33 R190
33 R193

R195 100 8104_RX


DVCC3
DVCC3

M+5V
VCC1.25

EC42 BC100
33 R192

USB_MCLK A_IPOD_CHARGE_CTL
33 R191

USB_BCLK A_IPOD_CHARGE_CTL 2
AD_VCC3 100u/16V 0.1u
USB_LRCLK R220
USB_DATA
L87 FB C30 10p
GND I2S_DATA_I 4.7K
GND M+5V
BC101 EC43 AVCC3 R198
SDRAM_CLK R196 33 RAM_CLK IPOD_5V
IPOD_CHARGE_CTL 1K Q9 U24 FB/0805/2A
0.1u 10u/16V R197 2.2-0805 R221 1K FB2
1 CTLA AO 8
U25 2N3904 R199 10K 2 7
M+5V FLGA IN
EC44 BC102 MA0 23 2 MD0 C33 R219 3 6 EC45 R201
A0 D0 2 USB_LRCLK R223 4.7K FLGB GND
GND MA1 24 4 MD1 R200 1K 4 5 + C31
MA2 A1 D1 MD2 2 USB_BCLK 104 CTLB BO 470
100u/16V 0.1u 25 5 4.7K
MA3 A2 D2 MD3 104
26 7 2 USB_DATA AIC1519
MA4 A3 D3 MD4 220uF16V
29 A4 D4 8
MA5 30 10 MD5
MA6 A5 D5 MD6
GND 31 11
MA7 A6 D6 MD7
32 13
GND

A7 D7 R222
MA8 33 42 MD8 Q10
MA9 A8 D8 MD9 A_IPOD_CHARGE_CTL 1K A_IPOD_5V
34 A9 D9 44 FB/0805/2A
MA10 22 45 MD10 2N3904 FB3
MA11 A10/AP D10 MD11
35 47 C34 R224
DQM0 A11 D11 MD12 R202
VVCC3 15 48 EC46
DQM1 LDQM D12 MD13 C32
39 50 104 4.7K + 470/0805
M_WE UDQM D13 MD14
L88 FB 16 51
M_CAS WE D14 MD15 VVCC3 RF3.3V 104
17 CAS D15 53 DVCC3 VCC1.25 220uF16V
SD_VCC3 EC47 BC103 M_RAS 18 36
RAS NC
L89 FB GND 19 40
CS NC/RFU GND TP16
47u/16V 100p TX1
BC107 BC108 BC109
SD_VCC3 37 CKE VSS 28 GND BC104 BC110 BC105 BC106 BC111 RX1
ROM_VCC3 RAM_CLK 38 41
CLK VSS 0.01uF 0.1uF 0.01uF IP_DET
L90 FB M_BA0 20 54 0.1u 0.1u 0.1u 0.1u 0.1u TP15 IP_DET 2
M_BA1 BA0 VSS
GND 21 1 SD_VCC3
BA1 VDD AD_KEY2
VDD 14 AD_KEY2 2
VDD 27 GND RFGND
6 VSSq VDDq 3 GND GND
12 VSSq VDDq 9
46 VSSq VDDq 43 ROM_VCC3
52 VSSq VDDq 49 SD_VCC3
SDRAM/1Mx16x4
GND
GND RFGND BC112
EC48 EC49 BC113 BC114 BC115 BC116 BC117 BC118 BC119
0.1uF
10u/16V 100u/16V 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF

GND GND
GND
6-6 6-6
Circuit Diagram - Part 5

5 4 3 2 1

C56 C57 C55


ADC5V
22P 22P 22P GND
L43 100/100MHZ A_I2S_DATA_I
10 VA SDTO 1
EC14
BC46 + CLKOUT R102 33 A_CLKIN
9 2 A_USB_BCLK GND 1 GND VCC 8 A_DVCC3
A_DVCC3 100P 10UF/16V/0805 GND SCLK ACP_SDA 2 7 ACP_RESET 100
CON2 R103 33 B_CLKIN SDA RST
4.7UF/16V/0805 3 6 ACP_SCL R106
NC SCL
A_INRR105 10K EC15 A_USB_LRCLK C20 4 5
TO/iPod/A/board 1.25MM 8 AINR LRCK 3 NC NC GND

+
AGND 27MHz 20PF +/-20PPM
BC48 NC/10PF
1 A_INL R239 22PF CP UA2
1 10K XT4 C39
2 AGND 7 4 A_USB_MCLK
2 A_INR VQ MCLK
3 3
4 R238 100 A_MP3_DET 4.7UF/16V/0805 100K R101 NC A_DVCC3
4 10K EC16 R109 R110 R111 R112 BC47
D 5 A_INLR91 6 5 D
5 GND AINL FILT+ GND

+
6 R74 0 A_U_DM
6 NC 100K 100K 10K 22PF
7 R73 0 A_U_DP GND R113
7 L47 600/100MHZ R114
8 A_IP_DET R232 R231
8 L48 600/100MHZ GND A_DVCC3
9 A_ACCOR C42 C43 C44 C45 CS5343 GND 10K
9 L53 600/100MHZ 10K
10 A_IPUSB_SW 8.2K U12 TP4
10 L55 600/100MHZ USB_POWER_ON EC17 + 1000P 33P 33P
11 11 1000P
L56 600/100MHZ AD_KEY1 8.2K GND
12 12
L57 600/100MHZ A_USB_LED BC49 EC18 + ACP_SDA ACP_SCL
13 13 C51 BC320
L58 600/100MHZ A_MP3LINK_LED 0.1UF CVBS
14 14
L59 600/100MHZ A_IPOD_LED 10UF/16V/0805 104
15 15 BC51 33P
10UF/16V/0805
16 16 GND AGND GND
0.1UF
CLOSE TO 8104GW

GND
AGND

GND
GND
GND
GND

GND
A_USB_PLLVCC3
A_VVCC3

A_RF3.3V
A_VVCC3

A_VCC1.25

A_PLLVCC1.2
L3V3
AGND

BC52 100PF
R81 GND AGND BC53 100PF
DGND GND C22 1uF A_V_COMP A_TV_DAC0
4.7K A_DVCC3 A_VVCC3
TP5
AM5V R

CLKOUT
USB_POWER_ON

A_V_COMP

A_USB_POWER
A_CLKIN
A_U_DM
A_U_DP
A_V_FSADJ
R118

A_TV_DAC0
L GND R117 1K A_V_FSADJNC/75
EC19 TP6
Q11 1k R80 A_USB_POWER
R119
2N3904

102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
R99 10u/16V 10K
TP7 A_DAC_REF

F
E
A
B
C
D
EC20 BC55 BC54 BC56 EC10 R120 100
A_RESET

RFIS
4.7K EC22 C24 GND

CLKIN

OPVIP
OPVIN
330p 33p

RFSUM
100u/16V 0.1u 100u/16V

VDD_12
VDD_12
AOUT_L

USB_DP

CLKOUT
AOUT_R

USB_DM

AGCCAP
V_COMP

PLL_VSS
V_FSADJ
R121 D6

PLL_VDD
TV_AVSS
TV_AVSS

TV_DAC3
TV_DAC2
TV_DAC1
TV_DAC0

AD_AVSS
TV_AVDD
TV_AVDD
10u/16V 0.1uF

AD_AVDD
Reset

APC_AVSS
USB_AVSS
GND

USB_AVDD
10K 1N4148 Q7 C23
GND 2N3904 103 NC ADAC_AVSS 64 GND

LDSW/GPIO67
HOME/GPIO66
0.1uF 104 CDLDO ADAC_AVDD 63 A_AVCC3
GND A_DAC_REF
105 NC VREF 62
R122 0 GND
106 CDMDI AIN_R 61
A_RF3.3V 107 SRV_AVDD AD_AVDD 60 A_AD_VCC3
C 108 59 GND C
GND V21 AD_AVSS GND
109 58 R150 NC/33 RX_IP
V165 GPIO54 R124 NC/33 TX_IP
A_ROM_VCC3 GND 110 DA_AVSS GPIO53 57
111 56 R125 33 ACP_RESET
R154 NC/33 BCP_RESET
DA_TEO GPIO52 R126 33 ACP_SDA R151 BCP_SDA
112 55 NC/33
R127 10K A_SPI_CE DA_FEO GPIO51 R128 33 ACP_SCL R161 BCP_SCL
A_RF3.3V 113 54 NC/33
DA_AVDD GPIO50 D7 A_IP_DET
R129 10K A_DQ2 114 SPDC_OUT/GPIO70 SPDIF_IN/GPIO48 53
115 52 A_ACCOR R130 1N4148
R131 10K A_DQ3 R132 SC_OUT/GPIO71 SPDIF_OUT/GPIO47 GND
U15 EDJ1117-125/SOT-223
10K A_CD_IR R133 33 116 SPHE8104G-128 51 A_MA3 10K
GPIO72 M_A3 A_MA2

A_VCC1.25
3 2 L61 1uH A_PLLVCC1.2 117 DMEA M_A2 50
IN OUT A_USB_LED 118 49 A_MA1
2bit SPI 1bit SPI A_MP3LINK_LED CARD_SENSE/GPIO74 M_A1 A_MA0
119 SD_D0/GPIO75 M_A0 48
+ EC23 BC58 BC59 A_IPOD_LED 120 47 A_MA10
SD_CLK/GPIO76 M_A10

GND
R94 NC 0 A_IPOD_CHARGE_CTL 121 46 A_M_BA1
A_MP3_DET SD_SMD/GPIO77 M_BA1 A_M_BA0
220uF/16V 0.1uF 1000p 122 45

1
GPIO78 M_BA0 A_M_RAS
123 GPIO79 M_RAS 44
A_IPUSB_SW 124 43 A_M_CAS
GND SPI_CLCK.,SD_CLK ,SDRAM_CLKֵোᖙ䳔ࣙഄ. A_SPI_CE R134 33 CDVR M_CAS A_M_WE
125 SPI_CE M_WE 42
A_SPI_D0 R135 33 126 41 A_DQM0
A_SPI_CLK R136 33 SPI_D0 M_DQM0 A_MA4
127 SPI_CLK M_A4 40
GND BC60 A_SPI_D1 R137 33 128 39 A_MA5
System +3.3V 33P SPI_D1 M_A5
A_VCC3 A_RF3.3V GND BC61
A_ROM_VCC3
U16 1117-33/SOT-223 U17
3 2 A_SPI_CE 1 8 10PF
IN OUT A_SPI_D0 2 CE# VDD A_DQ3
7

GPIO86
VFD_CLK
VFD_STB
VFD_DATA
VDD_33
RESET_B
VSS
IR_IN/GPIO3
GPIO4
GPIO5
VDD_12
HSYNC/GPIO7
VSYNC/GPIO8
M_D0
M_D1
M_D2
M_D3
M_D4
M_D5
M_D6
M_D7
M_D15
M_D14
M_D13
M_D12
M_D11
M_D10
M_D9
M_D8
M_DQM1
VSS
M_CLK
VDD_33
M_A11
M_A9
M_A8
M_A7
M_A6

A_DQ2 DOUT HOLD# A_SPI_CLK


EC24 BC62 3 6 GND
WP# SCK U14

1
2
3
4
5
6
7
8
9
4 5 A_SPI_D1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
33
34
35
36
37
38

GND
GND DIN
100u/16V 0.1u
EN25T80

1
GND
GND RFGND A_SPI_D0R138 NC A_SPI_D1 BC63
1000P
A_DVCC3 A_DVCC3
A_MD15
A_MD14
A_MD13
A_MD12
A_MD11
A_MD10

GND
A_RESET
A_RX1
A_TX1
A_MD0
A_MD1
A_MD2
A_MD3
A_MD4
A_MD5
A_MD6
A_MD7
A_MD9
A_MD8
A_DQM1
A_SDRAM_CLK 32
A_MA11
A_MA9
A_MA8
A_MA7
A_MA6

R139 4.7K
B A_USB_PLLVCC3 B
R140 4.7K
33

R141
R144

L62 FB R146 100 A_8104_RX


GND

33 R145

33GND

R147 100 A_8104_TX


EC25 BC64
33 R143
A_DVCC3
A_DVCC3

Audio ADC+3.3V A_USB_MCLK


A_VCC1.25

33 R142

A_AD_VCC3 100u/16V 0.1u A_USB_BCLK


A_USB_LRCLK
A_USB_DATA
L63 FB C25 10p
GND A_I2S_DATA_I
GND Audio DAC+3.3V
BC65 EC26 A_AVCC3 BCP_RESET
A_SDRAM_CLK R148 33 A_RAM_CLK BCP_RESET
BCP_SDA
0.1u 10u/16V R149 2.2-0805 BCP_SCL BCP_SDA
U18 BCP_SCL
EC27 BC66 A_MA0 23 2 A_MD0 RX_IP
A0 D0 TX_IP RX_IP 1
GND A_MA1 24 4 A_MD1
A1 D1 TX_IP 1
100u/16V 0.1u A_MA2 25 5 A_MD2
A_MA3 A2 D2 A_MD3
26 A3 D3 7
A_MA4 29 8 A_MD4
A_MA5 A4 D4 A_MD5
30 A5 D5 10
GND A_MA6 31 11 A_MD6 B_CLKIN
A_MA7 A6 D6 A_MD7 B_CLKIN 1
32 A7 D7 13
A_MA8 33 42 A_MD8
A_MA9 A8 D8 A_MD9
34 A9 D9 44 A_IPOD_CHARGE_CTL
A_MA10 22 45 A_MD10 A_IPOD_CHARGE_CTL 2
Video DAC +3.3V A_MA11 A10/AP D10 A_MD11
35 A11 D11 47 A_8104_RX
A_VVCC3 A_DQM0 15 48 A_MD12 A_8104_TX A_8104_RX 1
34ma~58ma(64Mx1) A_DQM1 LDQM D12 A_MD13 A_8104_TX 1
39 UDQM D13 50
L64 FB A_M_WE 16 51 A_MD14 A_USB_MCLK
SDRAM +3.3V A_M_CAS WE D14 A_MD15 A_VVCC3 A_RF3.3V A_USB_BCLK A_USB_MCLK 2
17 CAS D15 53 A_DVCC3 A_VCC1.25
A_SD_VCC3 A_M_RAS A_USB_LRCLK A_USB_BCLK 2
EC28 BC67 18 36 CN5 AM5V
RAS NC A_USB_DATA A_USB_LRCLK 2
L65 FB GND 19 40
CS NC/RFU 1 A_USB_DATA 2
47u/16V 100p A_TX1
BC73 BC74 BC75 2
A_SD_VCC3 37 CKE VSS 28 GND BC69 BC70 BC68 BC71 BC72 A_RX1
A_ROM_VCC3 A_RAM_CLK 38 41 3
A_M_BA0 CLK VSS 0.01uF 0.1uF 0.01uF 4
L66 FB 20 54 0.1u 0.1u 0.1u 0.1u 0.1u
A A_M_BA1 BA0 VSS A
GND 21 1 A_SD_VCC3 GND
BA1 VDD
VDD 14
VDD 27 GND RFGND UART/PORT/debug/NC
6 VSSq VDDq 3 GND GND
G5 12 9 A_IP_DET
G4 A_IP_DET 2

9
8
G2 G3 VSSq VDDq

9
8
G1

9
8
9
8
46 43

9
8
3_5mm_8via 3_5mm_8via 3_5mm_8via 3_5mm_8via VSSq VDDq A_ROM_VCC3
3_5mm_8via 52 49 AD_KEY1
1 7 1 7 1 7 1 7 VSSq VDDq A_SD_VCC3 AD_KEY1 2
1 7 2 6
2 6 2 6 2 6 SDRAM/1Mx16x4
2 6 3
3 3 3 GND
3
BC76

4
5
EC30 BC77 BC78 BC79 BC80 BC81 BC82 BC83

4
5
EM638165TS-6G EC29

4
5
4
5

4
5
0.1uF Title
GND GND GND 54-Pin TSOPII(400mil x 875mil) 10u/16V 100u/16V 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
GND GND A SPHE8104GW
GND RFGND GND GND Size Document Number Rev
GND C 2.0
CEA88-SCH-FWP3200D
Date: Saturday, February 25, 2012 Sheet 4 of 10
5 4 3 2 1
6-7 6-7
PCB Layout Top View
6- 6-
PCB Layout Botto View
 - 1 - 1

AMP+Power Board

TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 7-2
PCB Layout View ......................................................................................................................................... 7-6
PCB Layout View ......................................................................................................................................... 7-7
7- 2 7- 2
Circuit Diagram - Part 1
7-3 7-3
Circuit Diagram - Part 2
7-4 7-4
Circuit Diagram - Part 3
7-5 7-5
Circuit Diagram - Part 4
7- 6 7-6
PCB Layout Top View
7- 7 7- 7
PCB Layout Botto View
8-1 8-1

MIC Board

TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 8-2
PCB Layout View ............................................................................................................................... 8-3
PCB Layout View......................................................................................................................... 8-4
8-2 8-2
CIRCUIT DIAGRAM

L3.3V
C OL L3.3V
L3.3V
MIC3.3V
LCD/FLIP R339 SW323 HP/AB/SW
MGND C386 R341

0.1uF
4.7K 4.7K 4.7K

BC354
100M/2K FB322 100uF/16V 22pF 0 SW324 A B
R345 R334 A B HP_AB
LCD_FLIP
EC302 R348
BC355 33P MGND C395
MGND 200 GND HPGND
MGND C396 103

R331
6
7
8
9
10
+ M+5V 103

CP
U38

4.7K
-INL
GND

GND

104 BC156
SGM8904

C387
C304 GND
FB 1GHZ 10
104 L339 R343

CN
PVSS PVDD
EN
OUTR OUTL
-INR
MGND MIC_DATA

1UF
MGND 10 VA SDTO 1
EC310

5
4
3
2
1
10K BC337 +
RDJ32 MGND MIC_I2S_BCLK
100K BC357 9 GND SCLK 2
R332 100P 100UF/16V
820P MGND
BC158 100PF
C388 R333 10K MICIN 8 3 MIC_I2S_LRCLK
AGND AINR LRCK
1UF
C389 225
MIC_OUT C315 2.2UF 7 4 MIC_I2S_MCLK
MGND 22pF VQ MCLK
R335 10K
R395

R398
C336
C337
R396

C390
R397

C335

C316 2.2UF 6 5
AINL FILT+
MGND
NC
22P
22P

MICIN
100K
10K

100K

22P

C303 C310C309 C301 CS5343


C302 U38
1000P 33P1000P 33P EC311 +
GND
R347 10UF/16V BC33833P EC312 + BC339 C311
MIC3.3V 0.1UF OL C
R302 NC L3.3V
CON38 0 10UF/16V
0.1UF 33P
MIC/JACK
600/100MHZ 105 R390 0
1 L328 MIC1_IN C313 154 C391 MGND 10K
1
2 2 R342 0 HPADC
3 C321 33P MGND
3 RDJ33
4 4 100P
R337 C397
C392 L316 100 E313 100uF/CC3258 BC349 104
33K L3.3V
100P TLV320DAC23PW 0.1UF
BC3040.1uF
CON39 C393 GND
MIC/JACK C317 33P 1 28
MGND 105 HPGND BVDD DGND
600/100MHZ R38333R 2 CLKOUT DVDD 27
1 L330 MIC2_IN C322 154 C394 OBCLK 3 26 C31833P
GND C31833P
1 BCLK XT0
2 2 R38433R R38933R
3 C320 33P MIC3.3V HPDATA 4 25 OMCLK 1
3 DIN U31 XT1/MCLK MIC_DATA 1
4 4 R38533R R39033R 2
R303 NC R340 OLRCLK SCL-MCU GND 2 CON37 0.5mm 20pin
5 24 3 3
LRCIN SCLK OMCLK
MGND ᬍЎR R39133R 4 4 TO/MAIN
33K C319 33P SDA-MCU 5
HPGND 6 NC SDIN 23 5
MGND 7 OBCLK 6
R3860 NC R39210K 6
22 7 7
600/100MHZ EC307 MODE OLRCLK
L335 MIC_DET 8 R39310K 8 8
MGND 220uF/16V HPVDD GND
L317 FB 1GHZ 21 9 9
EAR-HP-L R304 32/0805 CS HPDATA
9 10 10
EC308 LHPOUT C329 222
20 M+5V 11 11
EAR-HP-R R302 32/0805 L318 FB 1GHZ LINEIN GND
10 12 12
RHPOUT C330 222
220uF/16V 19 L3.3V 13 13
RLINEIN LCD_FLIP
11 14 14
HPGND HPADC
C305 C308 12 18 HPGND 15 15
CON310 LOUT NC EC309 10uF/16V HP_AB
17 16 16
HP/JACK NC SCL-MCU
13 16 17 17
33P 33P ROUT VMID SDA-MCU 18 18
1 EAR-HP-L 14 15 C331 0.1uF MIC_DET 19
1 AVDD AGND 19
2 20 20
2 EAR-HP-R C325 C326 EC306
3 21 21
3 HPDET HPDET
4 HPGND 22 22
4 104 104 10uF/16V HPGND GND

C323
C324
HPGND
33P MIC_I2S_MCLK R399 22 OMCLK
33P MIC_I2S_BCLK R300 22 OBCLK
MIC_I2S_LRCLK R301 22 OLRCLK
8-3 8-3
PCB LAYOUT TOP VIEW
8-4 8-4
PCB LAYOUT BOTTOM VIEW
9- 1 9-1

Key Board

TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 9-2
PCB Layout Top View ................................................................................................................................. 9-3
PCB Layout Bottom View ......................................................................................................................... 9-4
9-2 9- 2
CIRCUIT DIAGRAM
5 4 3 2 1

D D
R640 0/1206
R627 18K R639 0/1206
R628 12K R638 0/1206
R629 6.8K R637 0/1206
KEY_3 R630 2.7K R636 0/1206
SW620 R635 0/1206
SW617 SW618 SW619 SW621 R634 0/1206
C681 DBB R633 0/1206
DSC
R632 0/1206
103

TUNER
POWER
R631 0/1206

MAX/SOUND
C
GND C

GND

P1

U636
1 VOLA GND
A VOLB CN612
2 FROM MAIN BOARD
GND
C682 C683
KEY_3 5
B 3 5
33P 33P 4 4
VOLB 3
vol VOLA 3
2 2
1 1
B GND B
GND
KEY/MAINVOL ᇣᵓ

A A
Title
KEY MAIN VOL
Size Document Number Rev
A 3.0
CEA88-SCH-FWP3200D
Date: Saturday, February 25, 2012 Sheet 9 of 10

5 4 3 2 1
9- 3 9- 3
PCB LAYOUT TOP VIEW
9- 4 9- 4
PCB LAYOUT BOTTOM VIEW
10 - 1 10- 1

Jack Board

TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 10-2
PCB Layout View ........................................................................................................................................ 10-3
 -  - 
CIRCUIT DIAGRAM

   

-.5&$&+ -. 9


  5%
5


.
  5% 92/&+ 
5  /,1287B/  
$ 5  /,1287B5  $
5

  5  ,5B287  92/
.  

 95
3)9
3)9

5
  5  ,5B,1 ,5B,1$  95. 5/&+


5  5B,1 5B,1$ 


. 5
5  /B,1 /B,1$    .
&
&

 
95
&13
95.

 

3)9
3)9
3)9
3)9
3)9
3)9
-.
-.5&$&+
,5B,1$
5

&
&
&
&
&
&

5 5(



6:5(/$<
5

9

%  %
5 




5


,5B,1$

5
5
5
5

5 5 .


5B,1 8) & )% *+] & 3)9




. . & 3) ,&$


5 &
& 3) 
. 9
,5B,1

9 )%
,5B287

&  5B,1$
2
,5B,1

5 )% %
 *+]


. *+] 5&'

&
3)
3)9 &

& & . &


&
9&&23

.

5

5 5 .


/B,1 8) & )% *+] & 3)9

. . & 3)


& & ,&%
9 9 3) 
5 )%
&  /B,1$
5 )% 2
.  %
*+]


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&
3)

3)9 & 5&' &


& 7LWOH 31
& . . 3)

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'2&1DPH SDUW\ER[VLVFK 6KHHWRI


 
 9&&23 & 8)9
9
&
' &  5HY'DWH 5HY 6L]H 0RGHO1R ( '

$ 0RGHO1R &

'HVLJQHU &KHFNHU $SSURYHU

3'&6=
    )
10- 3 10- 3
PCB LAYOUT VIEW
11- 1 11- 1

Ipod Board

TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 11-2
PCB Layout Top View ................................................................................................................................. 11-3
PCB Layout Bottom View ......................................................................................................................... 11-4
11- 2 11- 2
CIRCUIT DIAGRAM

5 4 3 2 1

D D

JK51

34
33
DGND 30
Audio Return 29

DGND
DGND
R-AUDIO-OUT 28
L-AUDIO-OUT 27
R-AUDIO-IN 26
L-AUDIO-IN 25
Remote Sense 24
Composite Video 23
22 TP15
S_Video_C
21 TP16
S_Video_Y
Accessory Detect 20
TX 19
18 CN56
RX TO/MAIN
Reserved 17
DGND 16
DGND 15
14 1 IPOD_DET
Reserved
C Accessory Power 13 5 C
USB_POWER
F/W PWR+ 12 6 USB_POWER
F/W PWR+ 11 7 USB_POWER
Accessory Identify 10 2
USB_D- ACCESSOR
TPB- 9 3
USB_D+ D-
USB Vbus 8 4 D+
TPB+ 7 8
USB_D- C533 EC550 EC552 C534 GND
USB D- 6 9 GND
TPA- 5 C535 10
USB_D+ 22P GND
USB D+ 4
TPA+ 3 104 47uF/10V47uF/10V 22P
DGND 2
1

DGND
DGND
DGND
ipod_Connect-30

31
32
FB506
FB507

FB/0805
FB/0805

B B

IPOD ᇣᵓ

A A

<OrgAddr1>

Title
IPOD
Size Document Number Rev
B 3.0
CEA88-SCH-FWP3200D
Date: Saturday, February 25, 2012 Sheet 6 of 10
5 4 3 2 1
11- 3 11- 3
PCB LAYOUT TOP VIEW
11- 4 11- 4
PCB Layout Bottom View
12- 1 12- 1

USB Board

TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 12-2
PCB Layout Top View ................................................................................................................................. 12-3
PCB Layout Bottom View ......................................................................................................................... 12-4
12 - 2 12 - 2
CIRCUIT DIAGRAM

A_IPOD_5V

PIN䞡ᮄᅮН
CN408
TO ipod board + EC457 C462 C463

100uF16V 104 33P


1 L491 FB A_IPOD_DET
IPOD_DET
USB_POWER 2 A_IPOD_5V
USB_POWER 3 GND
USB_POWER 4 R454 100K
5 L498 FB A_ACCESSOR_3.3V
ACCESSOR R421 0 A_IPOD_USB_D- R455 51K
D- 6 R418 15K A_ACCESSOR
7 R422 0 A_IPOD_USB_D+ A_ACCESSOR_3.3V R456 30K
D+
GND 8 R457 18K
GND 9 R420
10 R459 12K
GND
100K R460 6.8K

15PF BC425
L1409

33PF BC423
15PF BC424
KEY_1 K_1 R461 2.7K
GND 100M/2K SW44
SW41 SW42 SW43 SW45 SW46 SW47 SW48
A_M5V A_M5V
C459 NEXT iPod/iPhone
GND PREV
103
BC428 BC426
0.1uF 0.1uF

PLAY/PAUSE
DOWN/PRESET-
UP/PRESET+

GND GND
U47 U46 MP3LINK USB
1 10 A_USB_DM 1 V+ NO2 10
V+ NO2
2 9 A_USB_DP A_M5V
A_USB_DP 2 9 A_IPOD_USB_D- NO1 COM2
NO1 COM2
A_IPOD_USB_D+ A_USB_DM 3 8
3 COM1 IN2 8 COM1 IN2
A_CD_USB_DP R463
4 7 4 IN1 NC2 7
IN1 NC2 150
A_CD_USB_DM 5 6
5 NC1 GND 6 NC1 GND
1
1

A_IPOD_5V A_IPOD_USB_SW
1

SGM4717 A_IPOD_USB_SW
R430 SGM4717 D411
75K_1% R431 D410 D412
A_IPOD_5V
49.9K_1% R433 43.2K_1%
GND 49.9K_1% GND
2
2
2

4.7K
R432
R435 A_UB_LED R464 470 Q412 Q413 Q414
GND 2N3904
2N3904 2N3904
GND A_ML_LED R465 470
JK43 A_IP_LED R466 470
6 R467 10K
4
R468 10K
3
2 R469 10K
5
MP3_LINE IN 7
1
mp3link
FB413
3 A_AD_R 100M/2K
3
2 GND
2
1 1A_AD_L 100M/2K
FB414
FROM MAIN BOARD
BC434
CON49

47PBC436

47P BC435
47P
CN409
5

A_VCC_USB
AGND 1 R449 0 A_CD_USB_DM
2 R450 0 A_CD_USB_DP
3
6

4
FB415
USB C456 C457
R451 R452
100M/2K
15PF 15PF NC NC
CON47 A_IPOD_5V L408
FROM MAIN BOARD GND GND
R470 GND GND
1 A_MP3_DET CON48
1 GND FB
2 2 FROM MAIN BOARD C465 0
A_USB_DM + EC458 C464 GND
3 3
A_USB_DP 1 1 A_IPOD_5V
4 4 100uF16V 104 33P TP20
R453 100 A_IPOD_DET 2 2
5 5 PGND
A_ACCESSOR 3 3 GND
6 6
A_IPOD_USB_SW 4 4
7 7
A_USB_PON 5 5 A_M5V
8 8 GND
KEY_1 6 6
9 9
10 A_UB_LED
10 A_ML_LED A_M5V
11 11
12 A_IP_LED
12
13 13 GND

+ EC459 C466 C467

100uF16V 104 33P

GND

IR ᇣᵓ
CN613
FROM MAIN BOARD C460
U637 A_M5V

OUT 1 3 3 104
2 2 U41
GND 2 1 1
C602 GND A_VCC_USB
FB/ 1A 0805
3 1 6 FB416
VCC IN Vout
C601 106 /0805 R471 52K
GND 2 GND ILIM 5
IR 104 R458 + EC456 C458
A_USB_PON 100K 3 4
EN FLAUE 104
100uF16V

GND
TPS2553DBV
R472 0

C461

104

GND
12- 3 12- 3
PCB LAYOUT TOP VIEW
12- 4 12- 4
PCB LAYOUT BOTTOM VIEW
'81%&YQMPEF7JFX
14-1

Version History

V1.0: initial release

V1.1: Add /93 version


V1.2: Add /85 version

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