BRIVO CT315/325 Theory of Operation: GE Healthcare

GE Healthcare
BRIVO CT315/325
THEORY OF OPERATION
Operating Documentation
5306516-1EN
Rev 4
© 2009-2012, General Electric Company,
All Rights Reserved.
Brivo CT315
Brivo CT325
GE HEALTHCARE THEORY OF OPERATION
REV 4 5306516-1EN
警告 • 本维修手册仅提供英文版本。
(ZH-CN) • 如果维修服务提供商需要非英文版本，客户需自行提供翻译服务。
• 未详细阅读和完全理解本维修手册之前，不得进行维修。
• 忽略本警告可能对维修人员，操作员或患者造成触电、机械伤害或其他形式的
伤害。
• THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.

WARNING
• IF A CUSTOMER’S SERVICE PROVIDER REQUIRES A LANGUAGE
(EN) OTHER THAN ENGLISH, IT IS THE CUSTOMER’S RESPONSIBILITY TO
PROVIDE TRANSLATION SERVICES.
Attention
• DO NOT ATTEMPT TO SERVICE THE EQUIPMENT UNLESS THIS
SERVICE MANUAL HAS BEEN CONSULTED AND IS UNDERSTOOD.
• FAILURE TO HEED THIS WARNING MAY RESULT IN INJURY TO THE
SERVICE PROVIDER, OPERATOR OR PATIENT FROM ELECTRIC
SHOCK, MECHANICAL OR OTHER HAZARDS.
DAMAGE IN TRANSPORTATION
All packages should be closely examined at time of delivery. If damage is apparent write “Damage In Shipment” on ALL
copies of the freight or express bill BEFORE delivery is accepted or “signed for” by a GE representative or hospital receiving
agent. Whether noted or concealed, damage MUST be reported to the carrier immediately upon discovery, or in any event,
within 14 days after receipt, and the contents and containers held for inspection by the carrier. A transportation company
will not pay a claim for damage if an inspection is not requested within this 14 day period.
To file a report:
Fill out a report on http://egems.med.ge.com/edq/home.jsp
Contact the local service coordinator.
CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

All electrical Installations that are preliminary to positioning of the equipment at the site prepared for the equipment shall be
performed by licensed electrical contractors. In addition, electrical feeds into the Power Distribution Unit shall be performed
by licensed electrical contractors. Other connections between pieces of electrical equipment, calibrations and testing shall
be performed by qualified GE Medical personnel. The products involved (and the accompanying electrical installations) are
highly sophisticated, and special engineering competence is required. In performing all electrical work on these products,
GE will use its own specially trained field engineers. All of GE’s electrical work on these products will comply with the
requirements of the applicable electrical codes.
The purchaser of GE equipment shall only utilize qualified personnel (i.e., GE’s field engineers, personnel of third-party
service companies with equivalent training, or licensed electricians) to perform electrical servicing on the equipment.
ATTENTION
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IMPORTANT! . . . X-RAY PROTECTION

X-ray equipment if not properly used may cause injury. Accordingly, the instructions herein contained should be thoroughly
read and understood by everyone who will use the equipment before you attempt to place this equipment in operation. The
General Electric Company, Medical Systems Group, will be glad to assist and cooperate in placing this equipment in use.
Although this apparatus incorporates a high degree of protection against x-radiation other than the useful beam, no practical
design of equipment can provide complete protection. Nor can any practical design compel the operator to take adequate
precautions to prevent the possibility of any persons carelessly exposing themselves or others to radiation.
It is important that anyone having anything to do with x-radiation be properly trained and fully acquainted with the
recommendations of the National Council on Radiation Protection and Measurements as published in NCRP Reports
available from NCRP Publications, 7910 Woodmont Avenue, Room 1016, Bethesda, Maryland 20814, and of the
International Commission on Radiation Protection, and take adequate steps to protect against injury.
The equipment is sold with the understanding that the General Electric Company, Medical Systems Group, its agents, and
representatives have no responsibility for injury or damage which may result from improper use of the equipment.
Various protective materials and devices are available. It is urged that such materials or devices be used.
LITHIUM BATTERY CAUTIONARY STATEMENTS
CAUTION
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by the manufacturer. Discard used batteries according to the manufacturer’s
instructions.
OMISSIONS & ERRORS

Customers, please contact your GE Sales or Service representatives.
GE personnel, please use the GEMS CQA Process to report all omissions, errors, and defects in this publication.
ATTENTION
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REVISION HISTORY
REV Date Primary Reason for Change
1 08/06/2009 Initial release.
2 11/16/2009 System Updated system options. (Sec. 1)

Added Power Control Timing Chart. (Sec. 2)
Updated Safety Loop that can be controlled by the TGP and DTB boards. (Sec. 2)
OC Updated OC Block Diagram. (Sec. 1)
Revision History
Updated SATA Port number of Mainboard. (Sec. 2)
Updated SCB Board Block Diagram. (Sec. 3)
Table/Gantry Updated Illustration 2-8 Schematics Diagram of Relay Control in System. (Sec. 2)
Updated system thickness. (Sec. 2)
3 03/09/2012 System Updated figures for safety loop and E-Stop. (Sec.2)
4 06/08/2012 Appendix Updated storage temperature from -30~50 to 0~30.

Updated storage humidity to 0~70%.
REVISION HISTORY
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REVISION HISTORY
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SYSTEM
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 - GENERAL DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 SYSTEM OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-3 SYSTEM SPECIFICATIONS AND DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1-4 SYSTEM OPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Table of Content
SECTION 2 - POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-1 POWER DISTRIBUTION UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 SAFETY LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
2-3 E-STOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
SECTION 3 - SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3-1 WARM-UP SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2 AXIAL SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3-2-1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3-2-2 Scan Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3-2-3 Asymmetric Scan (Only for Dual Slice System). . . . . . . . . . . . . . . . . . . . . . . 3-6
3-2-4 Twin Cine Scan (only for Brivo CT325) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3-2-5 Auto mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3-3 SCOUT SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
TABLE OF CONTENTS i
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ii TABLE OF CONTENTS
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SECTION 1 - GENERAL DESCRIPTION
1-1 INTRODUCTION
The features of this CT (Computed Tomography) system, one of the CT scanners of this series, include the
following:
Workstation type information processing system,
Solid-state x-ray intensity detector,
Continuous rotation type gantry with slip rings and high frequency coupling.

This CT system is comprised of the following main components (called subsystems):
• Operator Console (Host)
• Scanning Gantry
This subsystem further includes the following subsystems:
- DAS/Detector
- X-Ray Generator (XG)
- Power Distribution Unit
• Patient Table
The system may be connected with some of the following customer option equipments:
• Advantage Windows Image Workstation
• Image Camera
1-2 SYSTEM OVERVIEW

The Operator Console (OC) controls the entire system, according to the operator’s operations. The OC sends
instructions to the processor of the TGP board, which then controls the gantry and table subsystems according to
the instructions.
The TGP board processor also passes the OC instructions to the processor of the OGP board which is equipped on
the gantry rotative frame. The OGP board controls the DAS subsystem, the collimator aperture, or positioning lights
according to the passed instructions.
The OGP board processor also passes the instructions from the TGP board to the processor of the x-ray generator
subsystem. The XG processor controls the x-ray generator according to the instructions (originally from the OC).
Reversely, the OC receives status information from the TGP board or other processors (via the TGP board).
SYSTEM 1-1
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Illustration 1-1 System Block Diagram
Tube
JEDI
SR
AC115V
Auxiliary Unit Power Unit XG Power
AC380V
PDU BOX
Temperature
Gantry
Control
Rotational
OC
AC220V
Detector Axial Drive

AC220V
DAS DCP Transmitter Receiver DTB Board
Z-Axial Photo Gantry Cntr/ Axial

Step Motor Servo Motor
Sensor Disp Board Drive
Collimator
TGP Board
Aperture
Step Motor
Encoder
Gantry
OGP Board Stationary
SCB
Monitor
Keyboard
Step Motor Display

Step Motor PS2/USB USB
Driver Card
Cradle COM
Host Processor
Speaker Encoder NIC1
NIC2
Table Connector SATA
Latch Switch
HDD DVD
Table OC
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1-3 SYSTEM SPECIFICATIONS AND DATA

The following tables describe system specifications and data.
Table 1-1 Scan Time
Scan Time [sec]

-
0.7 (Half scan)
1.0
1.5

2.0
3.0
5.0
Table 1-2 Scan/Recon/Cal FOV
Scan/Recon FOV Cal FOV

P-Head (18) Small (25)
Head (25) Small (25)
Body (43) Large (43)
Table 1-3 Image Spatial Resolution Related
No. of Actual Scan Views No. of Detector Active

Recon Matrix
Full Scan Half Scan Channels
685 X 1 (Brivo CT315) 512 X 512
972 635
685 X 2 (Brivo CT325) 256 X 256
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1-3 SYSTEM SPECIFICATIONS AND DATA (CONTINUED)
Table 1-4 KV-MA Stations
KV MA
10, 20, 30, 40, ..., 180, 190, 200
120
(in 5 mA increments)
10, 20, 30, 40, ..., 140, 150, 160
140
(in 5 mA increments)
Table 1-5 Slice Thickness
Single Slice Thickness [mm] Dual Slice Thickness [mm]

1i mode (1 image/rotation) 2i mode (2 images/rotation)
1, 2, 3, 5, 7, 10 1.2, 2, 4, 6, 10 0.6, 1, 2, 3, 5, 7, 10
1-4 SYSTEM OPTIONS
Table 1-6 Main System Options
Category Name Description

60 sec Helical -
Helical scan 90 sec Helical -
Scan/Recon
120 sec Helical -
Collimator 0.6 mm Slice thickness -
Denta Scan -
SmartPrep -
Including Volume Analysis, Volume
Volume Viewer
Rendering, Navigator
Software CTC -
AVA -
Perfusion II -
1s Scan -
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SECTION 2 - POWER DISTRIBUTION
2-1 POWER DISTRIBUTION UNIT

The power distribution unit (PDU) provides powers to all the subsystems.
• Provide AC power for X-Ray Generation, three-phase, 380V.
• Provide AC power for Gantry Axial Drive Motor, single-phase, 220V.
• Provide AC power for Gantry and Table control PS (TGP, DTB and Cradle Motor Driver), 220V.

• Provide AC power for Gantry Power Supply of DAS, OGP, Collimator Control and RF Transmitter, Single
phase, 115.
• Provide AC power for OC, single phase with grounding, 220V.
• Provide a means for emergency stop of all X-Ray and drive power circuits, including JEDI, Axial Drive
Motor and Table Cradle Drive Motor (24V).
Illustration 2-1 Power Distribution to Subsystems
13 14
5 6
3 4 R3
1 2 R2
K11 R1
A1 A2
RMT J8
TS1 F1 TS2
CB1 NZMB1 A80 13 14
L1 1 2 5 6 L1
F2
L2 3 4 3 4 L2
L3 5 6 1 2 L3
F3
N K1
RMT J8 A1 A2
GND
CB6 D10 CB5 D4

1 2 220V 1 2
RMT J5
115V 1 2
SR 115V
CB4 D16
T1
CB7 D10
1 2
OC 220V
CB3 D16
1 2
Sv 220V
CB2 D6
1 2
Gantry P.S 220V
NEUTRAL
K2 N10
1 2
P.S 24V Table 24V
RMT J1 RMT J8
A1
K2
N A2
SYSTEM 2-1
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2-1 POWER DISTRIBUTION UNIT(CONTINUED)

Circuit breakers CB1, CB2, ... , CB7 can turn OFF powers, as written below:
• The ‘SR115/120’ output is not controlled by any contacts; the power is always present in the CT system
unless circuit breakers CB4 or CB6 are turned off.
• The relay K1 is turned on some delay time later after K11 is turned on. The resisters connected to the
relay K11 suppress rush currents.
• Centralized Control Power Switch: CB1 serves as whole system power control switch for service and
operator.
• Gantry/Table Power Switches:
Gantry PS Switch (CB2): Power of RMT (24V), table driver and gantry fans will be cut off when CB2 is
off. And as a result of RMT 24V was cut off, the contactors K1 (K11) and K3 will be in state of break and
cut off, the power of x-ray generator and axial driver will be cut off, too. In case of CB2 is off, only slip
ring (CB4) and OC (CB7) could be power on.
Axial Drive (CB3): When CB2 is ON, CB3 can control power of Axial Drive & Motor.
Slip Ring (CB4): CB4 can control the power of 115V on slip ring, which provides power for DAS Power
Supply, Tube pump and fan (through JEDI) on rotation part of gantry. Detector heating is also controlled
by CB4. CB4 is valid when CB6 is switch ON (power to transformer is ON).
RMT (CB5): CB5 can control 220VAC used by RMT, which provides AC working current for contactors
in PDU box. In case of CB2 is ON, control voltage is valid, contactor can work normally and be controlled
by programmable control units. Except affected by CB2, CB5 is affected by CB6, CB5 is valid only when
CB6 is switch ON (power to transformer is ON).
Operator Console (CB7): CB7 can control the power of OC, and other breaks do not affect CB7 except
centralized control power switch (CB1).
The XG Power Switch is a node of safety loop. The contactor K1 (K11) is off when XG power is off, as a result, no
power on JEDI and axial drive.
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2-1 POWER DISTRIBUTION UNIT(CONTINUED)
Power Control Timing Chart
Illustration 2-2 Power Control Timing Chart
INPUT Control
PON SW
E-OFF
Safety-Loop

RESET Emer
OUTPUT Control
XG400(K1)
Resistor(k11)
Note
‘Safety Loop’ is always closed in normal conditions after the system is switched ON or reset; this
means that ‘XG Power’ is always supplied to the gantry in normal conditions.
In the illustration:
‘E-OFF’ turns ‘close’ or ‘open’ when either ‘E-OFF-O’ or ‘E-OFF-G’ turns ‘close’ or ‘open’. That ‘Safety Loop’ turns
‘close’ or ‘open’ means the system safety loop is closed or opened, including both ‘SAFE-O’ and ‘SAFE-G’ turns
‘close’ or ‘open’. (See the ‘Safety Loop’ (3-2) description)
‘Reset Emergency’ turns ‘close’ or ‘open’ when either ‘RST-EM’ or ‘RST-EMG’ turns ‘close’ or ‘open’.
SYSTEM 2-3
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2-2 SAFETY LOOP

Illustration 2-3 shows a diagram of the system safety loop.
As shown, components on the gantry rotational block are not involved in the safety loop.
Illustration 2-3 Safety Loop
Gantry
DTB
J4.5 J4.6
CN17.5 CN17.6
TGPL
CN2.1 CN5.9
CN2.4 CN5.21
PDU On
J2 - 1 J2 - 4
Gantry
RMT
Board
J1.24 J1.23
SCB
Computer
K19 XG Power
will be off
OC
K5 K1
XG Power
Relays will be off
K11
Open of Safety Loop

The safety loop can be opened by any of the following:
• Control by the TGP and DTB boards:
The TGP board opens the safety loop in any of the following cases:
- When the TGP board receives from the OGP board a safety loop open demand due to an
overtime of x-ray exposure.
- When the TGP board detects abnormal communication with the OGP board or the operator
console (host processor) during x-ray exposure.
- When DTB detects scan abort command from OC is failed.
• Control by the host processor (i.e., system software):
The host processor opens the safety loop in any of the following cases:
- When the host processor receives a safety loop open demand from the TGP board.
- When the host processor detects an overtime of x-ray exposure.
- When the host processor detects an extra scan (other than scans which the host processor
instructed the TGP board to perform) performed.
2-4 SYSTEM
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- When DAS data were not transferred to OC without error on time.
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2-3 E-STOP
Illustration 2-4 shows a diagram of the system E-Stop.
Illustration 2-4 E-Stop
Frame 1 Frame 2 Gantry
Front Cover
CN6.1 CN6.2 TGPL

CN3.2
CPU
CN3.1
CN2.3
CN2.6
CN5.20 CN5.8
PDU On
Gantry
J2 - 3 J2 - 6
RMT J1.28 J1.27

Board
Gantry/Table
Power will be off SCB
K6 Computer
K2
K19
OC
K5 K1
XG Power
Relays
will be off
K11
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SECTION 3 - SCAN OPERATION
3-1 WARM-UP SCANS

The system requires the ‘Warm-up’ scans to warm-up the x-ray tube prior to starting the first scan after power-on,
or when more than two hours have elapsed since the last scan.
The warm-up scans also have to be performed before performing phantom calibration which updates the calibration
files (CAL files), if more than three hours have elapsed since the last scan.
The operator selects either the Tube Warm-up or Daily Calibration warm-up scans, as listed in Table 3-1.

Table 3-1 Warm-up Scans
No. of Scans
Type Purpose
Brivo CT315 Brivo CT325
(Until the Anode temperature (Until the tube case temperature reaches
Tube Warm-up for x-ray tube warming reaches 48%.) 10%.)
(Until the Anode temperature (Until the tube case temperature reaches
for x-ray tube warming reaches 48%.) 30%.)
for calibration and x-ray 11 13 (Max.)
alignment - 10mm scan only - Including 8 scans (calibration) + 5 scans
- Using 10mm scan data, warm- (X–ray alignment)
up error is analyzed. - Calibration scans contain 10mm, 7mm,
5mm, 3mm, 2mm, 1mm, 0.6mm, and
Asymmetric scans. (0.6mm is optional.)
Daily Calibration - Using 7 mm scan data, warm-up error is
analyzed.
for system diagnostics 4 6
(IQ Performance Mea- - 1scan for Offset Mean and SD - 1 scan for Offset Mean and SD
surement Scan) - 3 scans for Ratio - 3 scans for Ratio
- 1 scan for A/B ratio
- 1 scan for Z-axis collimator step
operation
The ‘Tube Warm-up’ type scans or the first series of scans of ‘Daily Calibration’ warm-up the x-ray tube.
This means that Tube Warm-up only warms the x-ray tube.
During the scans for calibration (eight scans) the system collects data to analyze it, and update CAL files:
The system stores the data and checks whether the data falls within the specified range. If the data is out of range,
the system reports a ‘WARM-UP ERROR.’ If the data is within range, the system compares the data with the previ-
ous warm–up data and calculates correction factors for CAL files, and updates them.
During the scans for x-ray alignment (three scans), the system collects data to analyze the x-ray alignment.
IIllustration 3-1 shows the warm-up scan sequence.
SYSTEM 3-1
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3-1 WARM-UP SCANS (CONTINUED)
Illustration 3-1 Warm-up Sequence
Start
Tube warm-up
scans
Error Message
Error & Yes

Error code Any error?
No Raw Data Disk
Scans &
Data collection
Raw data
files
Data check
Error Message
Warm-up No Within
Error range?
CAL
Yes files
Calculates
correction
factors System Disk
CAL files
correction
End
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3-1 WARM-UP SCANS (CONTINUED)
IQ Performance Measurement Scan

During the IQ Performance Measurement scans the system collects data to analyze it, and displays the result in
the ‘Status’ column.
Analyzed data: Offset mean, Offset SD, Stability of air calibration, mA-dependent DAS linearity variation, Scan
time–dependent DAS linearity variation, A/B ratio.
For details, refer to the ‘Home’ descriptions, in Section ‘Service Tool’, System tab, of Diagnostics manual.
Warm-up Error Analysis

The analysis for detecting warm-up error is performed using 7 mm scan data (for Twin) or 10 mm scan data (for

Single):
Analysis Items Descriptions Specifications

Ref Count Reference count after offset file correction 3000 ~ 60000
SD/MEAN SD/Mean value after offset file and reference corrections 0 ~ 0.03
Mean after offset file and reference correction / Mean at last
Ratio 0.95 ~ 1.05
daily calibration
HPF (Ratio) HPF of Ratio – 0.01 ~ 0.01
Ratio between [Channel data at the 1/4 intervals from 1st
Aperture Check 0.5 ~ 1.5
view] and [Mean value of all views]
When you analyze a warm-up calibration file, convert the related vector file into the Mean file, then use the Generic
System Analyzer of the Service tool.
SYSTEM 3-3
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3-2 AXIAL SCANS
3-2-1 General
Prior to the actual x-ray exposure, the system collects 256 views of offset data generated from the DAS. The offset
data is used to correct actual x-ray data.
The system performs a full 360 deg. scan (clockwise direction only) during 1.0, 1.5, 2.0, 3.0 or 5.0 sec. These are
called scan speeds or scan times, and not all of them are available to all the systems; the available scan speeds or
times vary according to system models or options installed on the systems.
During a scan, the system collects 972 views of data. A view period differs according to the scan speed. The
following table shows this relation:
Scan Speed (sec) View Period (µsec/view)

1.0 1029
1.5 1543
2.0 2058
3.0 3086
5.0 5144
The view period is synchronized with the azimuth encoder pulse.

Axial scans are initiated from either 0 deg. or 180 deg. azimuth angle except for helical scans; during helical scans,
scans can be initiated from any azimuth angle.
The system knows gantry azimuth position by azimuth encoder pulse counts and the Gantry Pulse which indicates
that the gantry azimuth is at this moment at 0 deg., (i.e., home position).
3-2-2 Scan Sequence

Illustration 3-2 shows the axial scan sequence.
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3-2 AXIAL SCANS (CONTINUED)
Illustration 3-2 Axial Scan Sequence
Parameters (Yes)
change?
Scan parameters setting (KV, MA, Slice Thickness, Scan Time, Slice Interval)
(No)
Cradle positioning (Patient is moved into the gantry scan plane)
Rotor start (The rotor is accelerated to operation speed)

Gantry acceleration (Gantry is accelerated to the constant scan speed)
Offset data collection (256 views of offset DAS data are collected )
High Voltage ON (Start x-ray exposure)
Das enable (DAS is enabled to collect data)
Data collection (972 views of actual DAS data are collected;

view period is synchronized with gantry azimuth position)
High Voltage OFF
Gantry deceleration
(Yes)
Next scan?
(No)
End
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3-2-3 Asymmetric Scan (Only for Dual Slice System)
Asymmetric Mode
In scanning, you can choose either symmetric or asymmetric slices from the twin-detector.
There are three choices in the Asymmetric Mode.
• [OFF] mode: (Symmetric is OFF) acquires slices with the same thickness (symmetric).
• [10:1] mode: acquires slices with different thickness (asymmetric).
- [10:1]: provides 10mm and 1mm slices.
- [10:2]: provides 10 mm and 2 mm slices.
- [6:1]: provides 6 mm and 1 mm slices.
Illustration 3-3 shows how asymmetric slices are obtained.
In Asymmetric Mode, the slice, whose thickness is shown at the Axial Thickness field, asymmetrically straddles the
center of the twin-detector. This slices is called “fused”, whereas the other thinner slices is derived from one detec-
tor.
3-6 SYSTEM
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Illustration 3-3 Asymmetric Slice
Asymmetric slices of [10:1]

Collimator
Radiation area
Center between
detectors A and B

1mm slice
9mm
Detector A Detector B
10mm slice

Collimator
Radiation area
Center between
detectors A and B
2mm slice
8mm
10mm slice

Collimator
Radiation area
Center between
detectors A and B
1mm slice
5mm
6mm slice
SYSTEM 3-7
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3-2-4 Twin Cine Scan (only for Brivo CT325)

In Cine Scan, continuous multiple 360-degree data acquisition is achieved without table travel or at the same loca-
tion.
In Twin Cine Scan, images are displayed in the 1i mode during prospective recon; on the other hand, in retrospective
recon, images from Detector A and images from Detector B can be displayed alternately (2i mode).
The 1i mode display is also possible in retrospective recon.
3-2-5 Auto mA
The Auto mA feature enables the system to reduce mA and patient dose with negligible effect on image quality. The
system varies mA according to patient shape and a predetermined algorithm for scan location.
The Auto mA feature requires one Scout scan, either AP or LAT in the illustration below, to obtain necessary infor-
mation on X-ray attenuation. (The last scout scan data is used for the Auto mA scan.)
The system automatically increases mA at the scan locations where X-ray attenuation is relatively high and decreas-
es mA at the scan locations where X-ray attenuation is relatively low. In the example below, the mA is set low at the
start scan location (lung area), then the mA will increase at the location of liver area, and then it will decline at the
location of abdomen area.
Illustration 3-4 Auto mA
0–degree Scout (AP)
Tube
Patient 90–degree Scout (LAT)

Tube
Start End
mA
0 Scan location
Start End
3-8 SYSTEM
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3-3 SCOUT SCANS

Prior to the actual x-ray exposure, the system collects 64 views of offset data generated from the DAS. The offset
data is used to correct actual x-ray data.
The system advances the cradle and collects data from 685 active channels. The cradle speed is 75 mm/sec, and
data collection timing is synchronized with the cradle encoder pulse.
Illustration 3-5 shows the scout scan sequence.
Illustration 3-5 Scout Scan Sequence

Scan parameters setting (KV, MA, Scan Range)
Cradle positioning (Cradle is moved to the Start + 20 mm position)

Rotor start (The rotor is accelerated to operation speed)
Offset data collection (64 views of offset DAS data are collected )
Cradle acceleration (Cradle is accelerated to the constant scan speed)
High Voltage ON (Start x-ray exposure)
Das enable (DAS is enabled to collect data)
Data collection (Actual DAS data are collected;

view period is synchronized with cradle position)
High Voltage OFF
Cradle Stop Start

position
Cradle
move start Cradle stop
High DAS
Voltage enable
ON
Data collection
Cradle
acceleration
SYSTEM 3-9
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Brivo CT325
3-10 SYSTEM
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OPERATOR CONSOLE
TABLE OF CONTENTS
SECTION PAGE

1-1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 Main Component Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1-3 Operational Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
SECTION 2 - HOST PROCESSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Table of Content
2-1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 Built-in I/O (Input/output) Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
SECTION 3 - SCAN CONTROL BOX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2 FUNCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2-1 Safety Block. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3-2-2 Scan Control and Communication Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3-2-3 Audio Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3-3 CONTROL KEYS/BUTTONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
SECTION 4 - OTHER OC COMPONENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

4-1 KEYBOARD, MOUSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4-2 DISPLAY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
TABLE OF CONTENTS i
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Brivo CT325
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1-1 OVERVIEW
Single stand along workstation is used as Operator’s Console in Brivo CT315/325 system. No special or customized
peripheral equipments. The connections between OC and other subsystem are all standard interface, which
including RS232 (COM), USB, and Ethernet with RJ45 interface.
Standard keyboard and mouse are used as system input device.

Scan Control Box is used to provide scan control buttons, such as start scan, table movement, stop scan, Dr’s Mic
and Speaker, etc.
The information processing system (operator console) is based on the Intel Core2 Duo CPU architecture.
The host processor of the operator console is a Linux computer, which is on the market.
(You connect it to a monitor, standard keyboard, scan control box and mouse to configure a working system.)
Illustration 1-1 shows a block diagram of the operator console of this CT system.
OPERATOR CONSOLE 1-1

Brivo CT315
Brivo CT325
Illustration 1-1 Operator Console Block Diagram
HIS/RIS
10/100/1000 Mbps
Video Card
10/100/1000 M bps
Monitor
PS/2
Host Processor
Mouse Autovoice USB
USB Port
RS232
USB Port
SATA-1 SATA-2 SATA-4
SCB
Audio System Raw Data DVD Driver
Disk Disk
PS/2
STD Keyboard
Service Key
Scan Room
RS422
TGP
Gantry Mic
Table Speaker
DAS
DTB
Heart Gate
Trigger
1-2 OPERATOR CONSOLE

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1-2 MAIN COMPONENT DESCRIPTION
Host Processor
The host computer performs all of the following operations:
• User interface
• Image processings/display
• Communication
• Database control
• Raw data/image data flow control

• Image storage
• Scan/recon control
• Recon operation
This system disk mainly stores the followings:

• System and application software
• Images
• Calibration files
• System parameters
System Disk Capacity

• Image Storage: 150000 images
DVD Drive
Host PC shall provide DVD recordable drive (CD-R, DVD-RAM, DVD-R media)
Raw Data Disk

A hard disk drive which is a high-speed one for storing raw data.
• Raw Data Storage: <5000 Slice
Scan Control Box

The Scan Control Box is a separate part placed on worktable, convenient for operator’s operation. It provides not
only the system control functions, such as X-Ray on, table movement, scan termination, safety loop forward, patient/
doctor voice switch, but also voice amplifier, audio volume control and USB interface with host.

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1-3 OPERATIONAL DESCRIPTION
Scan Data Main Flow

Illustration 1-2 shows:

The raw data is then stored to a hard disk drive which is a high-speed type and exclusively used for raw data storage;
recon processing is performed to generate images.
The reconstructed images are then read by the host processor which converts the image data to video signal, as
well as stores the image data to the system disk, which also stores system software.

As shown, raw data and image data are mainly transferred over the network.
Illustration 1-2 Scan Data Main Flow
Monitor
Video Signal
System/Image Host
Disk Processor
Image Data
Network
Raw Data
Raw Data DTB

Disk
Raw Data from DAS

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SECTION 2 - HOST PROCESSOR
2-1 OVERVIEW
The host processor is a Linux computer.
The host processor is the central unit within the operator console, performing various operations such are described
below:
• Controls data transfer between data storage units and memory devices, etc.
• Controls the entire scan sequence; it sends necessary instructions to relevant devices, and receives
SECTION 2 -HOST PROCESSOR

status information from those devices.
• Recon operation.
• Performs graphics operations.
The host processor requires AC 220V power input.
Table 2-1 Main Specifications of the Host Processor
Component Specification
Central Processor Model Inter Core2 Duo CPU
Operating Frequency 2.83 GHz
Cache Memory 3 MB L2 Cache
Other 1066 MHz System Bus
Hyper Threading Technology
Main Memory Capacity (standard) 4 GB (2 GB X 2)
Type DDR2 667
Hard Disk Drive Capacity 320 GB (7200 rpm) SATA X 2
(System Disk)
DVD Type Super format: DVD+R, DVD+RW, DVD-RAM, CD-R, SATA
Graphics Card Resolution Nvidia FX570
256 MB DDR Memory: PCI-E X 16
Built-in I/O - PC (PS/2) compatible keyboard and mouse
(Input/Output) 1 x Serial Port
Parallel Port
Two 10/100/1000 Ethernet standard (RJ-45)
PCI-E X 16 Slot
PCI-E X 8 (X 4) Slot
4 PCI Slot
Built-in Audio - Stereo input/output (YES)
Operating System - CTT Linux 6.3.9 or later

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2-2 BUILT-IN I/O (INPUT/OUTPUT) DESCRIPTION

The host processor has input/output ports for the following:
Display Card (Graphics Card)

DVI signals are output from this port.
Keyboard/Mouse
Standard keyboard and 3-button Optical Mouse are connected these ports, respectively.
10/100/1000 Ethernet
A diagnostic console, an independent console, or an HIS/RIS is connected to this port.
DICOM compatible; the operator console can send (push) images to those devices using DICOM protocols at a 10
Mbits/sec maximum (the transfer speed varies according to receiver models, the size of transfer data, protocols,
etc.).
TCP/IP Protocal
Receive raw data from DTB by using TCP/IP protocal.
SATA Port
SATA Port 1: 320GB SATA WDC WD3201ABYS (System)
SATA Port 2: 320GB SATA WDC WD3201ABYS (Rawdata)
SATA Port 4: PLEXTOR DVD-RW
Built-in Audio
Audio in and Audio out is connected to Scan Control Box.

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SECTION 3 - SCAN CONTROL BOX
3-1 OVERVIEW
Scan Control Box is a stand along box to supplement control functions to motion parts (Table) and X-Ray, which is
related to patient safety, and must be ensured being controlled by operator. Which is placed on worktable, and
connected to OC and TGP. To simplify connections between subsystem, signals between OC and TGP were
forwarding (pass through) by Scan Control Box, and besides, Scan Controlo Box provides voice communication
and control function cooperated with OC sound adapter card and software. The electricity power (24V) is provided
by gantry power supply and through TGP forwarding.

Illustration 3-1 Scan Control Box
3-2 FUNCTION
Scan Control Box provides following functions:
• User interface to interact with system to control table movement and touch off x-ray exposure with oper-
ator’s supervision.
• Voice communication and control between operator and patients, including microphone to collect doc-
tor’s voice and transfer to patient, receive patient voice and present patient voice by speaker, and patient
voice volume manually control.
• Signal forwarding between TGP and OC.

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PROPRIETARY TO GENERAL ELECTRIC COMPANY THEORY OF OPERATION
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3-2 FUNCTION (CONTINUED)
Illustration 3-2 SCB Board Block Diagram
SCB
E_stop
PDU Safety
E_reset
Safety Loop Block
Host
TGP Control
TGP Control (RS422)
TGPL X-ray On Scan
USB TO
Control Scan Commun Scan Box
TGP Reset Block ication USB
Block
Power 5V
Audio
and 12V
Mux ctrl
Key button
From Patient Record Autovoice

Audio In
To Patient Audio Play Autovoice Audio Out
Block
To Operator From Operator
The SCB board is connected to the OC and TGP, and as shown in Illustration 3-2.
The SCB board functionally consists of the following three blocks:
• Safety block
• Scan control and communication block
• Audio block
3-2-1 Safety Block

As shown in Illustration 3-2, this block includes the following circuits:
• Emergency Stop Button:
This is a normal connection (NC) node button. When the button is pressed the PDU will stop gantry pow-
er supply until the Emergency reset.
• Emergency Reset:
The Emergency reset is used for reset the PDU from Emergency status.
• Safety Loop:
The safety loop is a relay controlled by host computer. When the data transfer betweem the DTB and
computer works well, the safetyloop is closed. Otherwise, the safetyloop is opened. There is a LED
(safety) at the service window show the safety loop status.

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3-2-2 Scan Control and Communication Block

Keys used for scanning, and a microphone used for intercom, are incorporated into the SCB.
These keys are connected to the host processor via USB to uart chip. FPGA is used to control the communication
and implement the protocol between host processor. There is a download connector at the service window. It could
be used to update firmware.
3-2-3 Audio Block

The audio mixer block of the SCB board includes microphone, speaker, power audio amplifier for external speakers.
Illustration 3-3 Audio Block

Voice-detector

Band-pass From patient
Filter volume
G Mic Analog Switch 2:
PreAmp OP. Amp Talkon PWR Amp OC SPK
From
Gantry Mic
OC Mic Analog Switch 1:

PreAmp OP. Amp Talkon* OP. Amp To Host Audiocard
OC Mic (record autovoice)
Gantry
PWR Amp
SPK
To patient
volume
From Host O P. A m p OP . A m p
Switch 2: Talkon
Audiocard (play
autovoice)
As shown, audio signals from several sources are mixed in this block.
• Audio Input Sources:
- Microphone on the Gantry (Intercom: from patient)
- Microphone in the SCB (Intercom: to patient)
- Audio output on the Host Processor (Auto voice play)
• Audio Output Destinations:
- Speaker on the Gantry
- Speaker in the SCB
- Audio input on the Host Processor (Record auto voice messages)

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3-2-3 Audio Block (Continued)
Audio Input Switch

As shown in Illustration 3-3, analog switches are used to switch audio input sources, and are controlled by the 'Talk
On' button on the SCB.
• An intercom function is provided between the OC room and the gantry room. The 'Talk On' button on
the SCB switches communication direction, as described below:
- While 'Talk On' is pressed, communication of "OC room  Gantry room" is enabled; and both
of Auto Voice (in the gantry room) and sound from the gantry to OC room are disabled.
- While 'Talk On' is released, communication of "Gantry room  OC room" is enabled. And when
a big enough sound trigger the detector circuit , the sound will amplifier out in the OC room. A
jumper at the service window is supplied to disable voice detector function. That means the OC
speaker always amplify out the sound in the gantry.
• Auto Voice messages can be recorded by using the microphone equipped in the SCB .
While Auto Voice is being played, communication of "Gantry room  OC room" is not disabled. The autovoice will
feedback from the gantry microphone to SCB speaker.
Volume Control
The following two kinds of volume control are provided.
• The following can be adjusted with the manual volumes on the keyboard:
- Volume of communication of "OC room  Gantry room" (through the SCB microphone)
- Volume of communication of "Gantry room  OC room" (through the gantry microphone)
• The electronic volumes are controlled by software, controlling the following:
- Auto voice volume in the OC room

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3-3 CONTROL KEYS/BUTTONS

The following keys/buttons place on the Scan Control Box.
• Move to Scan: Table control
• Stop Move: Table control
• Start Scan: X-Ray touch off
• Pause: X-Ray interrupt, after 1 scan finished, and could be resumed
• Stop Scan: X-Ray interrupt, immediately, and could not be resumed
• Emergency Stop: Provide emergency power cut off when being pushed
• Emergency Stop Reset: Different button with emergency stop used to recover power on capability after

Emergency Stop

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SECTION 4 - OTHER OC COMPONENTS
4-1 KEYBOARD, MOUSE

The keyboard used for this operator console integrates the following components:
• Standard Keyboard, Mouse:
This standard keyboard and the mouse have a PS/2 interface for connecting themselves to the host
processor.
SECTION 1 - OTHER OC COMPONENT

4-2 DISPLAY
• LCD (19”): The resolution used for LCD Displayis 1280x1024 matrix.

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TABLE/GANTRY
TABLE OF CONTENTS
SECTION PAGE

1-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 COMPONENTS INTERCONNECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1-3 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
SECTION 2 - SUB-ASSEMBLY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Table of Content
2-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2-2-1 Stationary Gantry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2-2-2 Rotationary Gantry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
2-2-3 SLIP RING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13
2-3 TABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
TABLE OF CONTENTS i
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Brivo CT325
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1-1 INTRODUCTION
The TGP (Table Gantry Processor) board is the main controller of the Table/Gantry subsystem. The TGP board
receives commands from the Operator Console and passes the OC instructions to the OGP (On Gantry Processor)
board, which is installed on the rotational Gantry Frame. The OGP board controls the DAS subsystem, the collima-
tor aperture, or positioning lights according to the passed instructions. The OGP board also passes the instructions
from the TGP board to the X-ray Generator subsystem. The XG processor controls the X-ray Generator according

to the instructions (comes from the OC). Reversely, the OC receives status information from the TGP board or other
processors (via the TGP board).
The Table/Gantry consists of the following components:
• TGP board
• OGP board
• Servo Amp/Servo Motor
• Gantry Display
• Gantry Switch
• Collimator
• Positioning Light
• Cradle drive system
TABLE/GANTRY 1-1
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1-2 COMPONENTS INTERCONNECTION

The illustration 1-1 shows the components of the Table/Gantry.
Illustration 1-1 Table/Gantry
GANTRY
SWITCH GANTRY DISPLAY
PANEL
CRADLE POSIT ION AXIAL MOTOR

POTENTIOMETER
APERTURE
CRADLE ENCODER TGP BOARD MOTOR
OGP BOARD
SERVO AMP/MOTOR CRADLE
STEPPING MOTOR DRIVER MOTOR
GANTRY PULSE
APERTURE SENSORS
LATCH SWITCHES
EMERGENCY SWITCHES
Z–AXIS LIMIT SENSORS

DAS
Z–AXIS MOTOR
1-2 TABLE/GANTRY
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1-3 SPECIFICATIONS
The specifications of the Table/Gantry is as follows:
Gantry Rotation Speed

• 1.0, 1.5, 2.0, 3.0, 5.0 sec/rot.
Cradle Speed
• Slow: 20 mm/sec ± 3%

Fast: 100 mm/sec ± 3%

Scout: 75 mm/sec ± 3%
Home: 100 mm/sec ± 3%
TABLE/GANTRY 1-3
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1-4 TABLE/GANTRY
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SECTION 2 - SUB-ASSEMBLY DESCRIPTION
2-1 OVERVIEW
The Table/Gantry consists of Table and Gantry. The Gantry is divided into Stationary Gantry and Rotationary
Gantry. The communication between stationary and rotationary Gantry is made by slip-ring, a rotation mechanism
that permits electrical power and signals exchange.
The illustration 2-1 shows the Table/Gantry block diagram.
Illustration 2-1 Table/Gantry Block Diagram
SECTION 2 - SUB-ASSEMBLY
GANTRY
DESCRIPTION
STATIONARY GANTRY
PDU
ROTATIONARY GANTRY
POWER
GANTRY
OC DISPLAY
TGP BOARD
GANTRY COLLIMATOR
SWITCH
OGP BOARD
POSITIONING
LIGHT
AXIAL
SLIP
AXIAL DRIVE MOTOR RING
DAS XG
TABLE
Step Motor Driver Board Step Motor
Speaker
Cradle Pot
Cradle Encoder
Latch Switches
TABLE/GANTRY 2-1
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2-2 GANTRY
2-2-1 Stationary Gantry

The stationary Gantry is mainly controlled by the TGP (Table Gantry Processor) board. The Illustration 2-2 shows
the main components of the stationary Gantry.
The TGP board communicates with Operator Console and Table via cables and with the OGP board located in
rotationary Gantry via cable and slipring.
Illustration 2-2 Stationary Gantry main components
PS
㪜㪄㪪㪫㪦㪧
PDU X-DISP ASSY
㪩㪼㪸㫉㩷㪚㫆㫍㪼㫉
MICRPHONE
㪫㫆㩷㪦㪚
㪫㫆㩷㪫㪘㪙㪣㪜 TGP 㪜㪄㪪㪫㪦㪧
㪫㫆㩷㪪㪣㪠㪧㪩㪠㪥㪞 S-DISP ASSY

㪝㫉㫆㫅㫋㩷㪚㫆㫍㪼㫉
DRIVE
MICRPHONE
㪤㪦㪫㪦㪩
㪜㪄㪪㪫㪦㪧
DTB
PS1
Switch Power Supply provides +24VDC to TGP.
2-2 TABLE/GANTRY
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2-2-1 Stationary Gantry (Continued)
TGP Board
TGP board is a communication core on the stationary gantry. It receives the commands from OC and passes the
OC instructions to the OGP board, which is installed on the rotational gantry frame. OGP board controls the DAS
subsystem, the collimator aperture, or positioning lights according to the passed instructions. OGP board also
passes the instructions from the TGP board to the processor of the X-ray Generator subsystem. The XG processor
controls the X-ray Generator according to the instructions.
The TGP Board issues commands to and receives status from the components it controls. The TGP oversees the
following functions:
• Axial Drive Control
• Cradle In/out Drive Control
• Gantry Display Control
DESCRIPTION
• Gantry Control Panel
• Error Detection
Illustration 2-3 TGP Block Diagram
TGP BD Emergency
PDU
Rot Safe
PDU Safety
G-Pulse
Loop
Rot Count C
CAN
SRAM M
Driver
Rotate Enc
monitor
Flash
Test 0,1 Memory
Reset SW Slice Count
C
Status
Reset LED
Patarn DAS Slip
Trig Ring
OC OC Comm NIOS
unication 9600bps Slip
SIO Ring
OC OC Direct CT Lock
Line &Alarm Relay
Control
OC
Flash
Add Cont
16bit Cradle Pot

ADC
Cradle
Cradle
Motor M
Control
Driver
Enc
Display Gantry
Control Display
Gantry
SW
Table
SW
Mat SW
Audio Mic
Amp
Spk
TABLE/GANTRY 2-3
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There are four service switches on the TGP Board which are used to control the Gantry Rotation manually.
Illustration 2-4 TGP Board Service Switches
System Jog
Service ON FAST
Mode Rotation
OFF
Manual Continuous SLOW
Service OFF
Mode Rotation
SW1 SW2 SW3 SW4
• SW1
- Service ON: When the switch is in this position, axial driver would be disabled, and Gantry can
be rotated by hand manuallly.
Note
When TGP finds this switch is toggled to “Service ON” state, TGP should give +0VDC to driver J4-
2 (DINP1) to disable driver. Meanwhile, TGP should give +24VDC to SBRK_+ to open the brake,
thus service guys can rotate the Gantry manually.
- Service OFF: When the switch is in this position, axial driver would be enabled and external
force can’t pull the Gantry. Gantry can only rotate by OC instruction or service switches.
Note
When TGP finds this switch is toggled to “Service OFF” state, TGP should give +24VDC to driver
J4-2 (DINP1) to enable driver. Meanwhile, TGP should give +24VDC to SBRK_+ to open the brake.
• SW2
- System Mode: When the switch is in this position, only instruction from OC can make Gantry
rotate. SW3 and SW4 can’t make Gantry rotate under this condition. (SW1 should be in
“Service OFF” position).
- Manual Mode: When the switch is in this position, TGP do not response to OC instruction. SW3
and SW4 can make Gantry rotate. (SW1 should be in “Service OFF” position).
• SW3
- JOG Rotation: This switch is a spring loaded switch. When the switch toggles to this position,
Gantry will rotate continuously under the speed set by SW4. When releasing this switch, Gantry
rotation will stop.
- OFF/Home: When this switch turns to this position from JOG mode, gantry will stop rotation
immediately. And when this switch turns to this position from continue mode, gantry will stop
rotation at Home position.
- Continuous Rotation: When the switch is in this position, Gantry will rotate according to the
setting of SW4.
2-4 TABLE/GANTRY
Brivo CT315
Brivo CT325
REV 4 5306516-1EN

• SW4
- FAST: When the switch is in this position, Gantry will rotate with speed 1.0 second/revolution.
- SLOW: When the switch is in this position, Gantry will rotate with speed 5.0 second/revolution.
DTB Board
DTB is used on the Gantry Subsystem for data transfer, see below diagram.
Illustration 2-5 DTB Block Diagram
Transceiver Transceiver
DESCRIPTION
DTB Board performs the following functions:
• Read data from fiber interface.
For single system, the raw data volume is 972 x 740 x 2 byte/s (the fastest speed, 1s scan)
For dual system, the raw data volume is 972 x 740 x 2 x 2 byte/s (the fastest speed, 1s scan)
• Send these raw data to OC by using TCP/IP protocol. Refer to software requirements for more detail
information.
• LED is required to report data transfer status.
• DTB is needed to send “open safety loop” signal to TGP in case of “continuous bad raw error”, “no raw
data after X-ray on error” and “ FIFO overrun error”.
• CPU configures FPGA after power on.
• ISP (In System Programming) function is needed for DTB firmware/FPGA image download.
• Log mechanism and should have a way to transfer the log to OC.
TABLE/GANTRY 2-5
Brivo CT315
Brivo CT325
REV 4 5306516-1EN

DTB Hardware Electrical Requirements
• Fiber Connector: A multimode 62.5/125um fiber transceivers (1x9 Package Style) as the raw data re-
ceive. The wavelength is 1300nm.
• RJ45 Connector: A 10/100M Base-TX RJ45 connector for data transmission to OC, and also used for
instructions transfer between DTB & OC.
• Signals between TGP & DTB
Signal Signal Description Active Output/Input
Reset_N Reset DTB, differential 422 signal L I
X-Ray On Inform DTB that X-Ray is on, differential 422 signal H I
Safety Loop Open Inform TGP to open safety loop, differential 422 signal H O
2-6 TABLE/GANTRY
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
S-DISP
The Illustration 2-6 shows the block diagram of S-DISP. The control signals and power signals are transferred to
S-DISP from TGP. The CPLD can decode the control signals and generate the drive signals to control S/I/X-ray
indicators and 5 digit 7-segment displays. When a function key is pressed, the corresponding active signal is trans-
ferred to TGP. Function keys signal also connect with CPLD for test function.
Illustration 2-6 S-DISP Block Diagram
S-DISP
S/I/X-ray indicator 5 digit 7-seg displays
TGP Interface CPLD
CN6
DESCRIPTION
(for test)
Emergency Display drive

5 function keys
interface
The S-DISP Board Assy enables user to control the movement of the cradle and shows some indication information.
• X-Ray Indicator
The X-ray indicator lamp illuminates during X-ray exposure.
• S/I Indicator
The “S” LED is illuminated to indicate the current scanned position is outside the internal landmark.
The “I” LED is illuminated to indicate the current scanned position is inside the internal landmark.
• 5 Digit 7-segment Displays Control
The 5 displays show the reading of the distance (mm) between the landmark and the anatomy in the X-
ray path.
• 5 Function Keys
There are 5 function keys on S-DISP board assy to control the movement of the cradle or turn on/off the
position light.
- In key
Use this key to move the cradle towards the Gantry
- Out key
Use this key to move the cradle away from the Gantry
- Fast key
Use this key to increase the speed of cradle in/out
- PLSW key
Use this key to turn on or off the positioning lights
- EXLMR key
Use this key to move the anatomy beneath the positioning light
TABLE/GANTRY 2-7
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-2 STATIONARY GANTRY (CONTINUED)

• Emergency Stop Interface
The S-DISP interfaces with the emergency button through one 2-pin connector. The signal of emergen-
cy button is transferred to TGP through S-DISP.
X-DISP
The Illustration 2-7 shows the block diagram of X-DISP. The control signals are transferred to X-DISP from TGP to
control the three LEDs on X-DISP board assy.
Illustration 2-7 X-DISP Block Diagram
X-DISP
TGP
CN10
The main function of this board is to get +24V signal and XLED signal and to illuminate the three LEDs on this board.
The three LEDs are illuminated during X-ray exposure.
2-8 TABLE/GANTRY
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
Relay
There are three sets of relay that are used in system, the functions are described below.
• Relay 1: Detect the door state. When the door is closed, the switch on the door is closed also, so the
coil of relay is powered on and the contact of the relay is closed. The TGP can get the state of the door.
• Relay 2: Control the room lamp. The CT system will turn on /off the room lamp by controlling the relay 2.
• Relay 3: Control the ready status lamp. The CT system will turn on/off the ready status lamp by control-
ling the relay 3.
Illustration 2-8 Schematic Diagram of Relay Control in System
+24VDC
㩺㪈㪏㪮㪟㪫
DESCRIPTION
㩺㪈㪏㪙㪣㪢
㩺㪈㪏㪩㪜㪛
㩺㪈㪏㪰㪜㪣
TGP
㩺㪈㪏㪙㪩㪥
㩺㪈㪏㪙㪣㪬
㪈㪋
㪂㪚㪦㪤
㪩㪜㪣㪘㪰㪈㪐
㪛㪚㪉㪋㪭
㪠㪥㪧㪬㪫㪈㩿㪛㪦㪦㪩㩷㪪㪮㪠㪫㪚㪟㪄㪛㫆㫆㫉㩷㪺㫃㫆㫊㪼㪀
㪮㫀㫉㪼㩷㪫㪼㫉㫄㫀㫅㪸㫃㪌㪈
㪘㪮㪞㪉㪉㪄㪘㪮㪞㪈㪉㩺㪈㪏㪩㪜㪛
㩺㪈㪏㪙㪣㪬㪈㪊㪥㪅㪦㪅
㪄
㪫㪈㪄㪈㪫㪈㪄㪉㩺㪈㪏㩷㪞㪩㪥
㪦㪬㪫㪧㪬㪫㪈㩿㪙㪘㪰㩷㪣㪘㪤㪧㪀㪘㪮㪞㪉㪉㪄㪘㪮㪞㪈㪉㪫㪉㪄㪈
㩺㪈㪏㩷㪞㪩㪥
㪫㪉㪄㪉㩺㪈㪏㩷㪙㪣㪢㪚㪦㪤
㪉㪌㪇㪭㪘㪚㩷㪤㪸㫏㪃㩷㪌㪘㩷㪤㪸㫏㪫㪊㪄㪈㪫㪊㪄㪉㪈㪊㪄
㪐
㪩㪜㪣㪘㪰㪉
㪛㪚㪉㪋㪭
㪫㪋㪄㪈㪫㪋㪄㪉
㪦㪬㪫㪧㪬㪫㪉㩿㪩㪼㪸㪻㫐㩷㪪㫋㪸㫋㫌㫊㩷㪣㪘㪤㪧㪀㪘㪮㪞㪉㪉㪄㪘㪮㪞㪈㪉㪫㪌㪄㪈㪫㪌㪄㪉
㩺㪈㪏㩷㪮㪟㪫㪈㪌
㪫㪍㪄㪈㪫㪍㪄㪉㪥㪅㪦㪅㪈㪋㪂

㪉㪌㪇㪭㪘㪚㩷㪤㪸㫏㪃㩷㪌㪘㩷㪤㪸㫏
㪫㪎㪄㪈㪫㪎㪄㪉
㩺㪈㪏㩷㪙㪩㪥㪚㪦㪤
㪫㪏㪄㪈㪫㪏㪄㪉㪈㪊㪄
㪐
㪩㪜㪣㪘㪰㪊
㪛㪚㪉㪋㪭
㩺㪈㪏㩷㪰㪜㪣㩷㪈㪌
㪥㪅㪦㪅㪈㪋㪂
TABLE/GANTRY 2-9
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
Axial Drive and Motor

The Axial Drive and the Axial Motor work together with the TGP, TGP sends the rotate command to the drive through
Canopen protocol by the control cable, besides the TGP will also supply the power (+24VDC) of brake to the motor
directly. The motor drive supplies three-phase power to the motor through power cable, sends command and re-
ceives feedback through signal cable.
Illustration 2-9 Gantry Rotation Control Diagram
TGP BD ASSY
Control cable
Gantry
Brake cable
Power cable
Signal cable Axial Motor
Driver
Belt Gear Ratio 20:1

Axial Motor with 10000line/rev Encoder
24V Power Supply

The switch power supply transfers the input power of AC 220V to the output power of 24V DC to provide the power
for the parts on gantry subsystem.
Illustration 2-10 24V Power Supply Distribution Diagram

+ 24V DC
220V AC
HW300-24A
DTB BD Step Motor TGP BD Left Top Fan Right Top Fan
RF RCV Signal Brush RMT Board
ASSY Drive BD ASSY ASSY ASSY
Gantry Microphone
Located at upper portion of the entrance of the Gantry opening, at the front and the rear side.
Emergency Switch
Located at left and right sides of the Gantry Frame.
2-10 TABLE/GANTRY
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-2-2 Rotationary Gantry

The Illustration 2-11 shows the main components of the rotationary Gantry.
Illustration 2-11 Rotationary Gantry main components
PHOTO
DAS SENSOR
MOTOR
MOTOR
DRIVER
GPLS
MOTOR
DRIVER MOTOR
TO TGP COLLIMATOR
(SLIP RING)
ENOCODER
OGP BOARD
POSITIONING
LIGHT
DESCRIPTION
PHOTO SENSOR
RELAY
SWITCHING
POWER
SUPPLY
TEMP
CONT
115VAC ASSY
TO DTB DCP DAS/DETECTOR

RF XMT
OGP Board
The OGP (On Gantry Processor) performs the following functions:
• X-ray exposure on/off control
• DAS data transfer timing
• Collimator control
• Beam Tracking Control
• Positioning light control
• Scan control
• The automatic shut-off of the Tube Fan/Pump Power Supply after 30 minutes when the OC has been
powered down.
TABLE/GANTRY 2-11
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-2-2 Rotationary Gantry (Continued)
Switching Power Supply

Supply power to the OGP board, DCP board, RF transmitter, Temp cont, DAS, and positioning light.
Supply power to the DAS and Temperature Control Box.
Collimator
Located at the exposure window of the X-ray tube, controls the aperture of the X-ray beam by moving the blades.
For Brivo CT315: The aperture can be 1, 2, 3, 5, 7 or 10 mm.
For Brivo CT325: The aperture can be 1.2, 2, 4, 6 or 10 mm in 1i mode.
The aperture can be 0.6, 1, 2, 3, 5, 7 or 10 mm in 2i mode.
Motor Driver
Generates five phase pulses to control the stepping motor of the collimator. Receives pulse command from OGP
board and convert it to other type of pulses.
Encoder
Sends the feedback pulse to the OGP to show the moved amount of the blades.
Photo Sensor
Detects when the collimator blades are in 1mm aperture
DAS
Data Acquisition System. Processes the data received from detector and send it to operator console. The detailed
explanations are in the DAS/Detector sections.
Temp Cont Assy

Device that controls the Detector temperature
DCP
Receives parallel data from DAS and convert them to serial data. The detailed explanations are in the DAS/Detector
sections.
RF XMT
Converts Serial signal from DCP2 to RF signal.
GPLS
Notify TGP and OGP board when the Gantry is at zero degree tube position.
2-12 TABLE/GANTRY
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-2-3 SLIP RING

The Slip Ring transfers the following signals;
• DAS Data
• DAS Trigger
• TGP and OGP Communication message
• Safety Loop
MECHANISM
This Gantry slip ring system utilizes:
• Three 380VAC power high-power rings (nine high power brushes)
• Two 120V power rings (six low power brushes)
• One safety ground ring (three ground brushes)
DESCRIPTION
• Two signal rings (four signal brushes)
• RF transmitter / receiver modules
Illustration 2-12 Simplified CT Contactless Slipring Assembly
HSDCD Transmitter HSDCD Receiver

Module Module
DC Power DC Power
TX RX
CT DAS Serial Datastream CT DAS Serial Datastream

From DAS To OC
(Network)
(Fiber)
Illustration 2-13 Control Signal Transfer Strategy
Six channels
TGP OGP
Mux Slipring two Mux

Stator channels Rotor
Cable A Cable B
Two channel cables
TABLE/GANTRY 2-13
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-3 TABLE
The Illustration 2-14 shows the main components of the table.
Illustration 2-14 Table
LATCH SWITCHES
TGP Board
SPEAKER
E
STEP ENCODER
MOTOR
From Gantry NF2 (CRADLE)
SW M
P.S. STEP MOTOR
DRIVER ENCODER
POTENTIOMETER
Cradle
Portion of the Table that executes longitudinal movement. It is controlled by cradle driver board.
Latch Switches
Positioned at both right and left sides of the Table, these switches release or latch the cradle. When both switches
are pressed, the cradle is latched. When one of the switches is depressed, the cradle is released. They are for safety
purpose.
Potentiometer
There is a potentiometer which is used for cradle absolute position.
Encoder
There is a encoder which is used for cradle relative position.
Speaker
Located at the table front bracket, it’s used for broadcasting operator’s voice.
2-14 TABLE/GANTRY
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
DAS/DETECTOR
TABLE OF CONTENTS
SECTION PAGE

1-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
SECTION 2 - DETECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Table of Content
2-2 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-3 HILIGHT DETECTOR MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2-4 CHANNEL DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
2-5 DAS/DETECTOR CONNECTOR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2-5-1 DAS/Detector Connector for Single Slice System . . . . . . . . . . . . . . . . . . . . . 2-5
2-5-2 DAS/Detector Connector for Dual Slice System . . . . . . . . . . . . . . . . . . . . . . 2-6
2-6 QCAL CHANNELS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2-7 AFTER GLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2-8 HEATER AND TEMPERATURE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
SECTION 3 - DATA ACQUISITION SYSTEM (DAS) - SINGLE . . . . . . . . . . . . . . . . . . . . . . 3-1

3-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2 DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3-3 DCP BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3-3-1 DCP Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3-3-2 DCP Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3-4 CONVERTER BOARD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
SECTION 4 - DATA ACQUISITION SYSTEM (DAS)_DUAL. . . . . . . . . . . . . . . . . . . . . . . . . 4-1

4-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4-2 DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4-3 DCP CARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4-3-1 DCP Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4-3-2 DCP Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4-4 CONVERTeR BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9
TABLE OF CONTENTS i
Brivo CT315
Brivo CT325
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
1-1 OVERVIEW
DAS/Detector subsystem consists of Solid State Detector and Data Acquisition System (DAS) that are located on
the rotationary Gantry. X-ray data acquired by the detector is converted to light, then to electrical signal in the
detector and then sent to DAS. The DAS digitizes, serializes and performs offset corrections on the signal and sends
to the Operator Console for image reconstruction.

The X-ray exposure through the scanning object is detected by these modules, converted to light, then converted
to electrical signal and sent to to the DAS. The DAS digitizes and sends this data by slipring and ethernet cable to
the Operator Console, where it is processed for image reconstruction.
Illustration 1-1 X-ray Exposure and Data Flow Block Diagram
OBJECT
X-RAY
DATA DATA
X-RAY DETECTOR ACQUISITION DAS Data PROCESSING
TUBE SYSTEM UNIT
Illustration 1-2 X-ray Exposure and DAS/Detector
X-RAY TUBE
X-RAY BEAM
DETECTOR
DAS
DAS/DETECTOR 1-1
Brivo CT315
Brivo CT325
1-2 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
SECTION 2 - DETECTOR
2-1 OVERVIEW
The detector consists of housing, collimator and detector modules. The detector module is made of scintillator
(lumex crystal), photo-diode and connector. When the X-ray exposure is performed, the X-ray enters through the
collimator and hits the scintillator. The scintillator is made of a material that emits light when hit by X-ray. The
scintillator is in contact with photo-diode so that the light generated by X-ray is converted into electrical current. The
generated current is sent to the DAS (Data Acquisition System) to be processed.
2-2 SPECIFICATIONS
Distance from Focus to ISO: 541 mm.
Distance from Focus to Detector surface: 949.075 mm.
Detector Channel Pitch: 1.15 mm.
Detector Channel angle: 0.06946 degree.
View Number:
• Offset: 256 views
• Active: 972 views
Channel Distribution:
Single Slice Dual Slice

Slice - A Slice B Slice
Active Channel 685 685 685
Reference Channel 3+3 3+3 3+3
QCAL Channel 3 3 3
DAS/DETECTOR 2-1
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-3 HILIGHT DETECTOR MODULE

The module consists of Scintillator cells, Collimator, Photo Diode, Reflex Films and Connector (illustration 2-1 and
2-2). The X-ray enters through the collimator (tungsten plates) and is absorbed by the Scintillator. The Scintillator
is made of Lumex Crystal, the material that emits light when absorbs X-ray radiation. The Scintillator is optically
coupled with Photo Diode which converts light to electrical current. The Photo Diode is electrically connected to
DAS through the connector.
Illustration 2-1 DETECTOR MODULE (Single Slice)
COLLIMATOR (IN THE

DETECTOR HOUSING)
X-RAY
HILIGHT MODULE
LUMEX CRYSTAL
LIGHT
PHOTO DIODE
CONNECTOR (TO DAS)
2-2 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-3 HILIGHT DETECTOR MODULE (CONTINUED)
Illustration 2-2 DETECTOR MODULE (DUAL SLICE)
COLLIMATOR (IN THE

DETECTOR HOUSING)
X–RAY
HILIGHT MODULE LUMEX CRYSTAL
LIGHT
PHOTO DIODE
Slice B
Slice A
CONNECTOR (TO DAS)
DAS/DETECTOR 2-3
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-4 CHANNEL DISTRIBUTION

The illustration 2-3 shows the channel distribution.
Illustration 2-3 DETECTOR CHANNEL DISTRIBUTION
Single Slice System Channel Distribution

J01 J05 J06 J07 J08 J44 J45 J46 J47 J51
1 MOD
1 MOD
1 MOD
1 MOD
1 MOD
1 MOD
Detector
1 MOD 17~19 20~32 33~35 36~48 49~51 52~61 62~64 65~640 641~656 657~672 673~688 689~704 1 MOD
CH CH CH CH CH CH CH CH CH CH CH CH
1~3CH 4~12CH NC REF REF REF

QCAL REF
NC NC
3CH 3 3 3 4CH 3CH 13+ 3 13+ 3 10 3 576CH 16 12+ 4 2+ 14 10 6 7 3 3 3
1:1 3:1 1:1 3:1 2:1 2:1 2:1 1:1 1:1 2:1 3:1 3:1 3:1 NC 3:1 1:1 3:1
DAS
CH: 3 1 3 1 8 8 5 3 576 14 2 8 2 1 1 3 1
Dual Slice System Channel Distribution

J01 J05 J06 J07 J08 J44 J45 J46 J47 J51
1 MOD
1 MOD
1 MOD
1 MOD
1 MOD
1 MOD
Detector
1 MOD 17~19 20~32 33~35 36~48 49~51 52~61 62~64 65~640 641~656 657~672 673~688 689~704 1 MOD
CH CH CH CH CH CH CH CH CH CH CH CH
1~3CH 4~12CH NC REF REF REF

QCAL REF
NC NC
3CH 3 3 3 4CH 3CH 13+ 3 13+ 3 10 3 576CH 16 12+ 4 2+ 14 10 6 7 3 3 3
1:1 3:1 1:1 3:1 2:1 2:1 2:1 1:1 1:1 2:1 3:1 3:1 3:1 NC 3:1 1:1 3:1
DAS
A Slice
1:1 3:1 1:1 3:1 2:1 2:1 2:1 1:1 1:1 2:1 3:1 3:1 3:1 NC 3:1 1:1 3:1
B Slice
CH: 3 1 3 1 8 8 5 3 576 14 2 8 2 1 1 3 1
3:1 Three detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the three detector channel current.
2:1 Two detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the two detector channel current.
2-4 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-5 DAS/DETECTOR CONNECTOR
2-5-1 DAS/Detector Connector for Single Slice System

The detector module consists of 16 channels. The illustration 2-4 shows the flexible PWB that connects detector
modules to the DAS Converter Board and its pin configuration.
Illustration 2-4 DAS/DETECTOR CONNECTOR

Connector Side View
Connector Side View

d c b a
TO DETECTOR
1
2
24 PIN 3
CONNECTOR 4
5
6
FLEXIBLE
PWB
Back Side View

a b c d
48 PIN
CONNECTOR 1
2
3
4
5
6
TO DAS 7
8
9
10
11
12
Back Side View
DAS/DETECTOR 2-5
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-5-2 DAS/Detector Connector for Dual Slice System

The detector module consists of 32 channels (A slice and B slice). The illustration 2-5 shows the flexible PWB that
connects detector modules to the DAS Converter Board and its pin configuration.
Illustration 2-5 DAS/DETECTOR CONNECTOR
48 PIN A B C D
CONNECTOR
1 2SG 2SG 2SG 2SG
D C B A
2 2SG 2SG 2SG 2SG
1
2 3 A–1ch B–1ch A–16ch B–16ch
3
5
7
6 A–4ch B–4ch A–13ch B–13ch
8
9
10
FLEXIBLE 11
PWB 8 A–6ch B–6ch A–11ch B–11ch
12
11 FG FG FG FG
12 FG FG FG FG
Note
SG: Signal Ground
FG: Frame Ground
2-6 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-6 QCAL CHANNELS

The X-ray exposure can move along the Z-axis. It can be due to mechanical adjustment or to tube temperature (the
angle of the X-ray output can vary according to the temperature). There is three channels in the left most positioned
detector module that is used for Z-axis data correction. The outputs of the three channels are tied together so that
only one data is taken for three channels. The corresponding intensity according to the position of the X-ray
exposure along the Z-axis is detected (as can be seen at right side of the illustration 2-6), so that the system
recognizes the current X-ray position (along the Z-axis). There is a remaining data for Z-axis data correction in the
system. Therefore, the correction is made according to the data acquired by the Q-CAL channels.
Illustration 2-6 Q-CAL CHANNELS
Q–CAL CHANNELS
A Slice X–RAY INTENSITY
A Slice
DETECTED AC-
X–RAY
CORDING TO THE X–RAY EXPOSURE
B Slice BEAM POSITION EXPOSURE
B Slice
ALONG THE Z–AXIS
Z
Q–CAL CHANNELS
2-7 AFTER GLOW

The Lumex crystal scintillator has a property represented in the illustration 2-7. The scintillator continues emitting
light even after the X-ray radiation is stopped. This phenomenon is called AFTER GLOW. This remaining scintillation
provides incorrect data, but the system performs the error correction to eliminate this portion.
Illustration 2-7 AFTER GLOW
X–RAY ON
scintillation
X–RAY OFF
DAS/DETECTOR 2-7
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-8 HEATER AND TEMPERATURE CONTROL

The detector comprises a heater unit. The heater keeps the detector temperature constant, what is needed for
detector accuracy. The heater is controlled by the Temperature Control Box which supplies power to the heater. The
detector also comprises a thermistor that feeds back the temperature information to the Temperature Control box.
Approximately three hours is needed after turning ON the power to the Temperature Control box to stabilize the
detector temperature. The temperature is controlled to 35  0.5 C. The illustration 2-8 shows its block diagram.
Illustration 2-8 TEMPERATURE CONTROL BLOCK DIAGRAM
Thermistor DETECTOR
Heater DC24V 60W
INPUT POW
ER 24V DC
Driver for
Heater
PS
PS (+12V -> +5V)
(+24V -> +12V)
(OP Amp CPU ROM

Coparato)
Switch LED indication
TEMPERATURE CONT BOX
2-8 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
SECTION 3 - DATA ACQUISITION SYSTEM (DAS) - SINGLE
3-1 OVERVIEW
The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back
Board). Each box contains the set of boards as follows:
• RBB - 1 Converter Board

• CBB - 3 Converter Boards
• LBB - 1 Converter Board
SECTION 3 - DATA ACQUISITION

The Illustration 3-1 shows the DAS boxes.
Illustration 3-1 DAS (RBB, CBB, LBB)
SYSTEM
RBB ASSY
LBB ASSY CBB ASSY
Co rd #6
DC
CONNECTER
Bo
nve
PA
a
(TO DETECTOR)
Boa verter
Con
rte
SS
rd #
r
Y
10
Co rd #
Boa verter
Bo
Co
nve 7
a
n
rd #
Board #8
Converter
rte
DAS CONTROL BOARD

r
9
The DAS channels number is as follows:
Active Channels 685

Reference Channels 3+3
QCAL Channels 3
NC Channels 26
DAS/DETECTOR 3-1
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
3-1 OVERVIEW (CONTINUED)

The illustration 3-2 shows DAS block diagram.
The data coming from the detector is taken by the Converter boards, sequentially channel by channel, digitized,
converted to parallel, then sent to the Operator Console. The DCP receives control and timing signals, and gener-
ates the time signals for data gathering. The DCP Board also generates the test pattern.
Illustration 3-2 DAS/Detector Structure
#45 #35 #34 #27 #26 #19 #18 #11 #10 #1
#10 #9 #8 #7 #6 Converter
Boards
POWER DC+/-5V Analog
SUPPLY
DC+5V
Digital
Data
Flow
Data Flow
DCP
BOARD
Control Signal
3-2 DAS/DETECTOR
REV 4
RBB
GE HEALTHCARE
JP1 1-1 JP4
JP1
Illustration 3-3
2-2
......
8-8 JP4
CBB
JP3 1-1 JP5

JP3
2-2
......
8-8
JP5
CN80
DAS Power Connection
15A
L 4 6 6
110V AC 5 7 7
N 6 8 8
+5V ANALOG
1 3 3
DAS/DETECTOR
ANALOG GND
2 4 4 LBB
-5V ANALOG
3 5 5
+5V DIGITAL
7 1 1
AC + DIGITAL GND
8 2 2
+/- 5 V COM
AC ANALOG -
AC +
+5V
DIGITAL
AC -
5306516-1EN
3-3
THEORY OF OPERATION
Brivo CT325
Brivo CT315

SYSTEM
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
Illustration 3-4 DAS Signal Connection
Collimator Driver
Collimator
LBB ASSY
FC45
J51 CN45
FC44
OGP
J47 CN44
DCP
Converter
Board #10
FC35
J38 CN35
JS4
CBB ASSY
JS3
FC34
Converter J37 CN34
Board #9
DETECTOR
Converter
Board #8
Converter FC11
Board #7 J14 CN11
JS2
RBB ASSY
JS1
FC10
J13 CN10
Converter
Board #6
FC2
J5 CN2
FC1
J1 CN1
3-4 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
3-2 DATA FLOW

The illustration 3-5 shows the data flow. The Detector generates an electrical current proportional to X-ray intensity.
The electrical current is converted to voltage signal in the Converter board. The voltage signal is amplified to an
appropriate level, converted to digital data (serial). The data is then sent to to DCP board where it is converted back
to serial, conditioned and then sent to Operator Console through the RF Slipring.
Illustration 3-5 DAS block diagram
DAS Offset
Trim
DAC
FPGA

Electrical
Current Fold
DETECTOR DCP Board
Control
SYSTEM
3-3 DCP BOARD
3-3-1 DCP Functions

The DCP board performs the following functions:
• Interfaces with the OGP for Rx reception and scan completion via RS422 bus.
• Sets up gain and offset trim and controls the converter cards, via the converter CAN interface.
• Receives triggers and starts acquisitions with the converter cards.
• Performs serial-to-parallel conversion on data streams from the converter cards, does parity checking
on the data, and runs it through a translation table for view data ordering.
• Adds Forward Error Correction (FEC) to the channel data and sends it across the slip ring to the OC via
the high speed serial data interface.
• It provides the A/D converter chip, it acquires the kV and mA values for each scan.
• Monitors the DAS subsystem for various faults.
• Communication with Detector Heater Control Board to monitor the Detector Temperature.
• Trigger jitter detection.
DAS/DETECTOR 3-5
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
3-3-2 DCP Interface

The DCP is the main control board for Data Acquisition System (DAS). It is applicable for DAS converter cards. It
packages all the converter cards data into a single high speed serial data stream to OC, compatible with the receive
function on the DASIFN at 95/110 Mbps slip ring communication. Illustration 3-6 shows the interface of DCP.
Illustration 3-6 DCP Interface
SDCOM/+-
DSCOM/+- CAN_LO
CAN_HI
DASTRIG/+-
OGP GPLS2/+- DATA_ODD/+-
XRON/+- DATA_EVEN/+-
AC/OFF/+- STRIG/+- DAS
RESET/+- DCP SH_CK/+-
DASENABLE/+- CN_FLT CVTR
CN_RST
X-PROG
RAW+5VA W-PRTCT
RAW-5VA IREF.EXT
POWER RAW+5VL AGND
SUPPLY AGND
LGND
Fibre Optical
Cable
Slip Ring
KV Signal
From JEDI
0~10V mA Signal
3-6 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
3-3-2 DCP Interface (Continued)
Inputs
From Converter Boards:
• Inner Row Serial Data Streams (Differential Pairs)
• Converter CAN Bus communication for status, faults, chassis temperature readings, and serial number
information (CAN)
• Converter Board Fault Line (TTL)
From OGP:
• Input View Triggers (Optical Isolated)

• Active/Offset (Optical Isolated)
• High Voltage on to X-ray tube (Optical Isolated)
• DAS enable signal (Optical Isolated)
SYSTEM
• Gplus2 signal (Optical Isolated)
• OGP reset to DCP (Optical Isolated)
• TG CMD send/receive serial port (Optical Isolated)
From Generator (JEDI):
• KV & MA analog signals
From Detector Heater Control Board:
• Serial port communication protocol on differential pair signals. (RS422)
From Backplane:
• Power Supply
Outputs
To Converter Boards:
• Shift clock (Differential Pairs)
• Trigger signal (Differential Pairs)
• Converter CAN Bus communication for control information (CAN Differential Pairs)
• Reset signal (TTL)
• External reference current (Analog)
To OGP:
• TG CMD transmits serial port (RS422)
DAS/DETECTOR 3-7
Brivo CT315
Brivo CT325
REV 4 5306516-1EN

To Detector Heater Control Board:
• Serial port communication protocol differential pair output signals. (RS422)
To Slip-ring (OC):
• High-speed serial data stream containing the view data with embedded FEC (High speed optical fiber
link).
Illustration 3-7 DCP board block diagram
GDAS DCP CLK

32MHz Fiber
CARD ASSY Reset
ARM
ARM RAM
JTAG RAM
AT91
TG com
Flash-ROM
PLL CLK
30MHz
FEC
TAXI
Pulse/
status FPGA CY9689A
Cyclone
CAN
CFG JTAG
ADC LVDS LVDS Iref

AD977 Mx9129 Ds032 Ref200
+5V_Logic
+5V_Analog
-5V_Analog
KV/mA
DHCBCollimator OGP JEDI CVTR Power Supply

Left Backplane Board
3-8 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
3-4 CONVERTER BOARD

The Converter board performs the following functions:
• Conversion of electrical current signals from the detector to voltage signals.
• Signal level conditioning
• Analog to Digital conversion
• Generation of the timing signals for data gathering
The signal from the detector with the level proportional to the X-ray intensity is fed to the Converter board. The
signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed to the
Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data.
Illustration 3-8 Preamplifier Architecture

SYSTEM
DAS/DETECTOR 3-9
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
3-4 CONVERTER BOARD (CONTINUED)
Illustration 3-9 Converter Board Block Diagram
2
IREF_INT VOLTAGE
REFERENCE
IREF_EXT
GDAS ASIVS (2)
..
Chan_1
Odd # Chan
Chan_127
. Anti_Alias
Filter CHARGE TO
DIGITAL
CONVERTERS
..
Chan_2
Even # Chan
Chan_128
. (2 x 64 CH.) D0:D9
10
ASIC/FPGA INTERFACE
10
2.5 VOLT BANK
LVDS D_OUT_ODD +/-

Differential D_OUT_EVN +/-
D_IN_ODD +/- LVDS Drivers
D_IN_EVN +/- 4
Differential 3.3 GAB 3.3
S_TRIG +/-
SH_CK +/-
Receivers V V
O (FPGA or ASIC) O
L L CV_FLT*
T T
7 1.5V Core
CVB_ADDR B 2.5, 3.3 VIO B
A A 2
N N I C I/F 2
I C
K K TEMPERATURE
CAN_HI CAN 2 SENSOR
CAN_LO I/F
3.3 VOLT BANK
DSP INTERFACE
Flash Boot
SDRAM SHARC DSP
Prom
CPLD
INTERFACE
CV_RST CPLD 14 Pin JTAG
HEADER
3-10 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
SECTION 4 - DATA ACQUISITION SYSTEM (DAS)_DUAL
4-1 OVERVIEW
The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back
Board). Each box contains the set of boards as follows:
• RBB: 2 Converter Boards
• CBB: 6 Converter Boards
• LBB: 2 Converter Boards

The Illustration 4-1 shows the DAS boxes.
Illustration 4-1 DAS (RBB, CBB, LBB)
SYSTEM
RBB ASSY
LBB ASSY CBB ASSY
Co rd #6
rter
CONNECTER
DC
nve
PA
(TO DETECTOR)
a
Boa verter
Co r d # 1
rter
B o
5
SS
rd #
nve
Boa verter
a
10
Con
o
Y
B
rd #
Con
Co rd #7
rter
Boa verter
4
nve
Co rd #2
rd #
rter
a
Boa verter
Bo
9
DAS CONTROL BOARD

Con
nve
rd #
Converter
Converter
a
Board #3
Board #8
o
Con
The DAS channels number is as follows:
Slice A Slice B Slice

Active Channel 685 685
Reference Channel 3+3 3+3
QCAL Channel 3 3
GND Channel 26 26
DAS/DETECTOR 4-1
Brivo CT315
Brivo CT325
REV 4 5306516-1EN

The illustration 4-2 shows DAS block diagram.
The data coming from the detector is taken by the Converter boards, sequentially channel by channel, digitized,
converted to parallel, go through offset correction, then sent to the Operator Console. The DCP Card is an interface
with OGP (On Gantry Processor) receiving control and timing signals, and generates the timing signals for data
gathering. The DCP Card performs offset correction and generates the test pattern.
Illustration 4-2 DAS/Detector Structure
#45 #35 #34 #27 #26 #19 #18 #11 #10 #1
#5 #10 #4 #9 #3 #8 #2 #7 #1 #6 Converter
POWER
Boards
DC+/-5V Analog
SUPPLY
DC+5V
Digital
Data Flow
Data Flow
DCP Data Flow
Card
Control Signal
4-2 DAS/DETECTOR
4-1
REV 4
RBB
JP1 1-1 JP4
JP1
GE HEALTHCARE
2-2
Illustration 4-3
......
8-8
JP4
CBB
OVERVIEW (CONTINUED)
JP3 1-1 JP5
JP3
2-2
......
8-8
JP5
CN80
15A
L 6
DAS Power Connection
4 6
110V AC 5 7 7
N 6 8 8
+5V ANALOG
1 3 3
ANALOG GND
2 4 4 LBB
-5V ANALOG
DAS/DETECTOR
3 5 5
+5V DIGITAL
7 1 1
AC + DIGITAL GND
8 2 2
+/- 5 V COM
AC ANALOG -
AC +
+5V
DIGITAL
AC -
5306516-1EN
4-3
THEORY OF OPERATION
Brivo CT325
Brivo CT315

SYSTEM
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
Illustration 4-4 DAS Signal Connection

Collimator Driver
Collimator
LBB ASSY
FC45
J51 CN45
FC44
OGP
J47 CN44
DCP
Converter
Board #5
Converter
FC35
Board #10 J38 CN35
JS4
CBB ASSY Converter

JS3
Board #4 FC34
J37 CN34
4onverter
Board #9
DETECTOR
Converter
Board #3
Converter
Board #8
Converter
Board #2
FC11
CN11
Converter J14
Board #7 JS2
RBB ASSY
JS1
FC10
J13 CN10
Converter
Board #1
Converter
FC2
Board #6 J5 CN2
FC1
J1 CN1
4-4 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
4-2 DATA FLOW

The illustration 4-5 shows the data flow. The Detector generates an electrical current proportional to X-ray intensity.
The electrical current is converted to voltage signal in the Converter board. The voltage signal is amplified to an
appropriate level, converted to digital data (serial). The data is then sent to DCP Card where it is converted back to
serial, conditioned and then sent to Operator Console through the RF Slipring.
Illustration 4-5 DAS block diagram
DAS Offset
Trim
DAC

FPGA
Electrical
Current Fold
DETECTOR DCP Board
Control
SYSTEM
4-3 DCP CARD
4-3-1 DCP Functions

The DCP Card performs the following functions:
• Interfaces with the OGP for Rx reception and scan completion via RS422 bus.
• Sets up gain and offset trim and controls the converter cards, via the converter CAN interface.
• Receives triggers and starts acquisitions with the converter cards.
• Performs serial-to-parallel conversion on data streams from the converter cards, does parity checking
on the data, and runs it through a translation table for view data ordering.
• Adds Forward Error Correction (FEC) to the channel data and sends it across the slip ring to the OC via
the high speed serial data interface.
• It provides the A/D converter chip, it acquires the kV and mA values for each scan.
• Monitors the DAS subsystem for various faults.
• Communication with Detector Heater Control Board to monitor the Detector Temperature.
• Trigger jitter detection.
DAS/DETECTOR 4-5
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
4-3-2 DCP Interface

The DCP is the main control board for Data Acquisition System (DAS). It is applicable for GDAS converter cards.
It packages all the converter cards data into a single high speed serial data stream to OC, compatible with the re-
ceive function on the DASIFN at 95/110 Mbps slip ring communication. Illustration shows the interface of DCP.
Illustration 4-6 DCP Interface
SDCOM/+- CAN_LO
DSCOM/+- CAN_HI
DATA 2_ODD/+-
DASTRIG/+- DATA 2_EVEN/+-
OGP GPLS2/+- DATA 1_ODD/+-
XRON/+- DATA 1_EVEN/+-
AC/OFF/+- STRIG/+- DAS
RESET/+- DCP SH_CK/+-
DASENABLE/+- CN_FLT CVTR
CN_RST
X-PROG
RAW+5VA W-PRTCT
RAW-5VA IREF.EXT
POWER RAW+5VL AGND
SUPPLY AGND
LGND
Fibre Optical
Cable
Slip Ring
KV Signal
From JEDI
0~10V mA Signal
BW LMT
FW LMT
FW+
FW-
BW+
BW-
Collimator & Driver
4-6 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
Inputs
From Converter Boards:
• 2 Inner Row Serial Data Streams (Differential Pairs)
• Converter CAN Bus communication for status, faults, chassis temperature readings, and serial number
information (CAN)
• Converter Board Fault Line (TTL)
From OGP:
• Input View Triggers (Optical Isolated)

• Active/Offset (Optical Isolated)
• High Voltage on to X-ray tube (Optical Isolated)
• DAS enable signal (Optical Isolated)
SYSTEM
• Gplus2 signal (Optical Isolated)
• OGP reset to DCP (Optical Isolated)
• TG CMD send/receive serial port (Optical Isolated)
From Collimator:
• Collimator forward and backward position limit feedback (TTL)
From Generator (JEDI):
• KV & MA analog signals
From Backplane:
• Power Supply
Outputs
To Converter Boards:
• Shift clock (Differential Pairs)
• Trigger signal (Differential Pairs)
• Converter CAN Bus communication for control information (CAN Differential Pairs)
• Reset signal (TTL)
• External reference current (Analog)
To OGP:
• TG CMD transmits serial port (RS422)
DAS/DETECTOR 4-7
Brivo CT315
Brivo CT325
REV 4 5306516-1EN

To Collimator:
• Beam tracking control pulse output (Differential pairs)
To Slip-ring (OC):
• High-speed serial data stream containing the view data with embedded FEC (High speed optical fiber
link).
Illustration 4-7 DCP Card block diagram
GDAS DCP CLK

32MHz Fiber
CARD ASSY Reset
ARM
ARM RAM
JTAG RAM
AT91
TG com
Flash-ROM
PLL CLK
30MHz
FEC
TAXI
Pulse/
status FPGA CY9689A
Cyclone
CAN
CFG JTAG
ADC LVDS LVDS Iref

AD977 Mx9129 Ds032 Ref200
+5V_Logic
+5V_Analog
-5V_Analog
KV/mA
DHCBCollimator OGP JEDI CVTR Power Supply

Left Backplane Board
4-8 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
4-4 CONVERTER BOARD

The Converter board performs the following functions:
• Conversion of electrical current signals from the detector to voltage signals.
• Signal level conditioning
• Analog to Digital conversion
• Generation of the timing signals for data gathering
The signal from the detector with the level proportional to the X-ray intensity is fed to the Converter board. The
signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed to the
Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data.

Illustration 4-8 Preamplifier Architecture
SYSTEM
DAS/DETECTOR 4-9
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
4-4 CONVERTER BOARD (CONTINUED)
Illustration 4-9 Converter Board Block Diagram
2
IREF_INT VOLTAGE
REFERENCE
IREF_EXT
GDAS ASIVS (2)
..
Chan_1
Odd # Chan
Chan_127
. Anti_Alias
Filter CHARGE TO
DIGITAL
CONVERTERS
..
Chan_2
Even # Chan
Chan_128
. (2 x 64 CH.) D0:D9
10
ASIC/FPGA INTERFACE
10
2.5 VOLT BANK
LVDS D_OUT_ODD +/-

Differential D_OUT_EVN +/-
D_IN_ODD +/- LVDS Drivers
D_IN_EVN +/- 4
Differential 3.3 GAB 3.3
S_TRIG +/-
SH_CK +/-
Receivers V V
O (FPGA or ASIC) O
L L CV_FLT*
T T
7 1.5V Core
CVB_ADDR B 2.5, 3.3 VIO B
A A 2
N N I C I/F 2
I C
K K TEMPERATURE
CAN_HI CAN 2 SENSOR
CAN_LO I/F
3.3 VOLT BANK
DSP INTERFACE
Flash Boot
SDRAM SHARC DSP
Prom
CPLD
INTERFACE
CV_RST CPLD 14 Pin JTAG
HEADER
4-10 DAS/DETECTOR
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
X-RAY GENERATOR
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 - GENERAL DESCRIPTION - I. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1-1 GLOSSARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 JEDI HIGH LEVEL BOLCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
SECTION 2 - GENERAL DESCRIPTION - II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Table of Content
2-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 STANDARD FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-3 APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2-4 ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2-4-1 Kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2-4-2 Options Depending on the Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2-4-3 A Packaging Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
SECTION 3 - TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3-1 JEDI TYPICAL SIGNALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
TABLE OF CONTENTS i
Brivo CT315
Brivo CT325
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
SECTION 1 - GENERAL DESCRIPTION - I
1-1 GLOSSARY
Glossary of terms used in this document:
Term Definition
Automatic Brightness Control. Regulation loop which makes the measured
ABC
brightness equal to brightness demand
SECTION 1 - GENERAL DESCRIPTION-I

Automatic Exposure Control. Exposure cut off technique which uses the
AEC
brightness signal to cut the exposure
CAN Controller Area Network. A network used for localized control.
Control Processor Unit. Microprocessor and peripherals which run the
CPU
software/firmware
EPLD Erasable Programmable Logic Device.
Electro Magnetic Compatibility. The EMC function prevents the generator
EMC
from polluting the power source.
Field Programmable Gate Array. It is programmed by the CPU core after
FPGA the reset and handles all the exposure control logic including the system
interface real–time lines.
High voltage variations due to inverter current pulses. Typically a few
HV Ripple
percent.
Software or hardware function which handles the state of a system and
State Machine
authorize to go to the next state upon reception of specific events.
IGBT Insulated gate bipolar transistor. A type of power switch
Ilp HV power inverter parallel resonant current; current in the parallel inductor
Ilr HV power inverter serial resonant current; current in the serial inductor.
MOS Metal Oxide Semiconductor. A type of power switch
OGP On Gantry Processor. Unit which drives the generator in CT systems
PDU Power Distribution Unit
RMS Root Mean Square
X-RAY GENERATOR 1-1

1-2
1-2
REV 4
JEDI GENERATOR / TWIN FUNCTIONAL ARCHITECTURE

GE HEALTHCARE
System Control Bus

Illustration 1-1
System
Interface
Low Voltage
kV Control Heater heater supply Rotation
Power
JEDI HIGH LEVEL BOLCK DIAGRAM
bus
Supply
DC Bus
AC/DC
X-RAY GENERATOR
rotation phases
JEDI Generator / TWIN Functional Architecture
High Voltage High Voltage HV Cables

EMC Inverter Tank
Filter
X-Ray Tube 1
1 phase
3 phase power
tube cooling
input
input
5306516-1EN
THEORY OF OPERATION
Brivo CT325
Brivo CT315
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
SECTION 2 - GENERAL DESCRIPTION - II
2-1 INTRODUCTION
Jedi is the engineering name for a family of compact high frequency X-Ray generators. This generator family covers
a wide range of applications from mobile equipment up to vascular systems:
JEDI 12-25 kW: Mobile applications
SECTION 2 - GENERAL DESCRIPTION-II

JEDI 24-48 kW: CT applications
JEDI 32-50 kW: RAD applications
JEDI 50-65-80 kW: RF applications
JEDI 100 kW: VASCULAR applications
2-2 STANDARD FEATURES

Jedi is a family of 150 kV generators operating from 12 kW up to 100 kW for all the major radiological, fluoroscopic
and CT applications. The family handles 1 ms to continuous exposures with tube currents ranging from 0mA up to
1000 mA.
The generators feature the very latest technology available:
• Constant potential independent of line voltage variations
• Power generation by a high-frequency converter (High voltage ripple: 40 kHz-140 kHz)
• Distributed micro-processor controlled functions (CAN bus)
Other features include:
• Single phase, three phase or battery power source
• Very low kV and mA ripple, excellent accuracies and dose reproducibility
• Compatible with a wide range of tubes, high speed or low speed, can supply up to 3 different tubes.
Thermal load interactive integrator ensuring optimum use of the heat protection curve of the x-ray tube
• Available in various packaging configurations: gantry, under-table, cabinet
• Serviceability: high reliability, fast installation (no generator calibration), application error codes ensure
fast troubleshooting
• Meets CE marking (and in particular EMC), IEC, UL, CSA, MHW regulations (if required)
• Optional pulsed fluoroscopy
X-RAY GENERATOR 2-1

Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-3 APPLICATIONS
Vascular/
RAD Surgery RF CT
Cardiac
3 Points Mode x x x
2 Points Mode x x x
1 Point Mode x x x
0 Point Mode x x
AEC x x x
Tomography x x
AET x x
Continuous/Pulsed Fluoroscopy x x x
Rad Exposures x
Cinema 30 fr/s x
Cinema 90 fr/s x
ABC x x
Variable mA Scans x
Low mA Fluoroscopy x
Legend:
• AEC - Automatic Exposure Control
• AET - Automatic Tomographic Exposure
• ABC - Automatic Brightness Control in fluoroscopy
2-2 X-RAY GENERATOR

Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-4 ARCHITECTURE
The Jedi family is composed of 3 elements:
2-4-1 Kernel
• High voltage chain composed of kV control, HV power inverter and HV tank
• Anode rotation function
• Tube filaments heater function
• Control bus for communication between the functions

• DC bus for power distribution to each function
• Input voltage to DC conversion: AC/DC function
• Low voltage power supply
• Application software, running on the kV control board
These functions are the Jedi core. They are present in all versions of the generator.
A function can be unique for all products, or can have several different releases based on product specification.
Examples:
• The anode rotation function is available in 2 releases:
- low speed rotation for applications where the tube has a max rotation of 3000 rpm
- high speed/low speed rotation for applications where at least one of the tubes can use
8000-10000 rpm
• The control bus is unique.
2-4-2 Options Depending on the Application

A System Interface which can be:
• CT interface
• RAD interface (console interface, room interface, AEC management present or not)
• ATLAS interface
EMC function
Grid function (RF, vascular)
Bias function (RF, vascular)
Tube management (2 tubes or 3 tubes option)
X-RAY GENERATOR 2-3

Brivo CT315
Brivo CT325
REV 4 5306516-1EN
2-4-3 A Packaging Architecture

The packaging architecture consists in a set of boxes which can be put together in several ways to make Jedi fit
either in a cabinet, or a console foot, or a table foot. The boxes can also be split in 2 units distant of several meters
(example: CT gantry).
The boxes normally consist of the following:
Auxiliaries Box
Rotation function
Heater function
Low voltage power supply (which can also be in the AC/DC box)
This box is always present.
Power Box
HV tank
HV power inverter
kV control
System interface (for the less complex system interface)
AC/DC Box
MC filter (optional)
AC/DC function
Low voltage power supply (which can also be in the auxiliaries box)
2-4 X-RAY GENERATOR

Brivo CT315
Brivo CT325
REV 4 5306516-1EN
Illustration 2-1 Jedi Generator / Packaging Architecture
Inverter Assembly
Dual Snub
AC/DC
Tube Board
Gate Command
HV Board
+ -
KV Measure

HV Tank Rectifier
Block
CT
Inter KV Control Board
face
EMC Filter
POWER BOX AC/DC BOX
LVPS Rotation Board

Heater Board Board
Rotation Rotation
Capacitor Capacitor
AUXILIARIES BOX
X-RAY GENERATOR 2-5

Brivo CT315
Brivo CT325
2-6 X-RAY GENERATOR

Brivo CT315
Brivo CT325
REV 4 5306516-1EN
SECTION 3 - TYPICAL SIGNALS
3-1 JEDI TYPICAL SIGNALS

The following table describes the main signals of the generator. For each of them, typical values are presented for
the main applications:
Signal/Application PoSpeed AII/EII/FII Values

Anode Rotation:
Phase P current during high speed run 2 A peak / 144 Hz
SECTION 3 - TYPICAL SIGNALS

Phase A current during high speed run 2 A peak / 144 Hz
Filament Drive:
Inverter current in standby 2.5 A 3.3 A peak / 35 kHz
Heater DC input voltage in standby 160V
kV Control:
DC bus measure at 400 VAC 560 V
ILR at full power at 400 VAC 300 A peak / 50 kHz
ILR at min power at 400 VAC 80 A peak / 25 kHz
ILP at full power at 400 VAC 150 A peak / 50 kHz
ILP at min power at 400 VAC 150 A peak / 25 kHz
X-RAY GENERATOR 3-1

Brivo CT315
Brivo CT325
3-2 X-RAY GENERATOR

Brivo CT315
Brivo CT325
REV 4 5306516-1EN
APPENDIX A - SYMBOLS AND CLASSIFICATION
Symbol Publication Description

417-5032 Alternating Current
335-1 Three-phase Alternating Current

3
335-1 Three-phase Alternating Current with neutral
APPENDIX A - SYMBOLS AND

conductor
3N
CLASSIFICATION
Direct Current
417-5019 Protective Earth (Ground)
348 Attention, consult ACCOMPANYING DOCUMENTS
417-5008 OFF (Power: disconnection from the mains)
417-5007 ON (Power: connection to the mains)
Warning, HIGH VOLTAGE
Emergency Stop
APPENDIX 1
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
Symbol Publication Description
Type B
417-5339 X-ray Source Assembly Emitting
417-5009 Standby
Start
Table Set
Abort
Intercom
(on Operator Console)

Power On: light on
Standby: light off
Warning sign :
Radiation of Laser Apparatus
2 APPENDIX
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
Symbol Description
Microphone (Mic)
Contrast
Brightness
APPENDIX A - SYMBOLS AND

CLASSIFICATION
30C System storage prior to installation:
Maintain storage temperature between 0 C and +30 C
0C
System storage prior to installation:

Maintain non-condensing storage
humidity below 70%
DO NOT store system longer than 90 days
Humidity 0-70%
Excluding Condensation
Air Pressure System storage and shipment:

Maintain Air Pressure between 700 and 1060hPa
700-1060hPa
APPENDIX 3
Brivo CT315
Brivo CT325
REV 4 5306516-1EN
CLASS 1 EQUIPMENT
Any permanently installed equipment containing operator or patient accessible surfaces must provide backup
protection against electric shock,in case the BASIC INSULATION fails. In addition to BASIC INSULATION,Class1
equipment contains a direct connection to a PROTECTIVE(EARTH) CONDUCTOR which prevents shocks when a
person touches a broken piece of equipment or touches two different equipment surfaces simultaneously.
TYPE B EQUIPMENT
CLASS I, II, or III EQUIPMENT or EQUIPMENT with INTERNAL ELECTRICAL POWER SOURCES provide an
adequate degree of protection against electric shock arising from (allowable) LEAKAGE CURRENTS or a
breakdown in the reliability of the protective earth connection.
ORDINARY EQUIPMENT
Enclosed EQUIPMENT without protection against the ingress of water.
OPERATION 0f EQUIPMENT
CONTINUOUS OPERATION WITH INTERMITTENT LOADING.
Operation in which EQUIPMENT is connected continuously to the SUPPLY MAINS.The stated permissible loading
time is so short that the long term on-load operating temperature is not attained.The ensuing interval in loading is,
however, not sufficiently long for cooling down to the long term no-load operating temperature.
EQUIPMENT not suitable for use in the presence of a FLAMMABLE ANESTHETIC MIXTURE WITH AIR or WITH
OXYGEN or NITROUS OXIDE
CLEANING
The system is NOT WATERPROOF. It is NOT designed to protect internal components against the ingress of
liquids.Clean external system surfaces(Gantry,table,consoles and accessories)with a soft cloth dipped in hot water
and wrung DAMP/DRY. (NOT dripping!) IF NECESSARY, use only mild (dish washing liquid) soap to remove dirt.
Avoid damage to equipment! Some îspray and wipeîcleaners etch and permanently cloud
clear plastic surfaces!! Use only warm water and mild liquid soap to clean surfaces.
4 APPENDIX
www.gehealthcare.com
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GE Healthcare

• THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.

CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

IMPORTANT! . . . X-RAY PROTECTION

LITHIUM BATTERY CAUTIONARY STATEMENTS

OMISSIONS & ERRORS

2 11/16/2009 System Updated system options. (Sec. 1)

OC Updated OC Block Diagram. (Sec. 1)

4 06/08/2012 Appendix Updated storage temperature from -30~50 to 0~30.

SECTION 1 - GENERAL DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

SECTION 3 - SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

SECTION 1 - GENERAL DESCRIPTION

SECTION 1 - GENERAL DESCRIPTION

1-2 SYSTEM OVERVIEW

Illustration 1-1 System Block Diagram

Detector Axial Drive

DAS DCP Transmitter Receiver DTB Board

Z-Axial Photo Gantry Cntr/ Axial

Step Motor Display

1-3 SYSTEM SPECIFICATIONS AND DATA

Table 1-1 Scan Time

Scan Time [sec]

SECTION 1 - GENERAL DESCRIPTION

Table 1-2 Scan/Recon/Cal FOV

Scan/Recon FOV Cal FOV

Table 1-3 Image Spatial Resolution Related

No. of Actual Scan Views No. of Detector Active

1-3 SYSTEM SPECIFICATIONS AND DATA (CONTINUED)

Table 1-4 KV-MA Stations

Table 1-5 Slice Thickness

Single Slice Thickness [mm] Dual Slice Thickness [mm]

1-4 SYSTEM OPTIONS

Table 1-6 Main System Options

Category Name Description

SECTION 2 - POWER DISTRIBUTION

2-1 POWER DISTRIBUTION UNIT

SECTION 2 - POWER DISTRIBUTION

Illustration 2-1 Power Distribution to Subsystems

CB6 D10 CB5 D4

2-1 POWER DISTRIBUTION UNIT(CONTINUED)

2-1 POWER DISTRIBUTION UNIT(CONTINUED)

Power Control Timing Chart

Illustration 2-2 Power Control Timing Chart

SECTION 2 - POWER DISTRIBUTION

2-2 SAFETY LOOP

Illustration 2-3 Safety Loop

Open of Safety Loop

SECTION 2 - POWER DISTRIBUTION

Illustration 2-4 E-Stop

Frame 1 Frame 2 Gantry

CN6.1 CN6.2 TGPL

RMT J1.28 J1.27

SECTION 3 - SCAN OPERATION

3-1 WARM-UP SCANS

SECTION 3 - SCAN OPERATION

3-1 WARM-UP SCANS (CONTINUED)

Illustration 3-1 Warm-up Sequence

Error & Yes

No Raw Data Disk

3-1 WARM-UP SCANS (CONTINUED)

IQ Performance Measurement Scan

Warm-up Error Analysis

SECTION 3 - SCAN OPERATION