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TIN 207 MATERIAL TEKNIK

II. ATOMIC STRUCTURES OF MATERIALS

Widodo Widjaja Basuki


13 September 2021
Kampus BSD

Faculty of Engineering, Atma Jaya Catholic University of Indonesia

1 Atma
13 Jaya – Catholic
September 2021 Widodo
University Widjaja Basuki – Atomic Structures of Materials
of Indonesia Faculty of Engineering, Atma Jaya Catholic University of Indonesia
www.atmajaya.ac.id
Periodic Table of Elements

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Electronegativity of Elements

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Atomic Structure of metals

Primary quantum orbits: 1, 2, 3, 4, …


or K, L, M, N, …

Secondary quantum orbits; s, p, d, f

Every atoms attempt to bring the outer


electron shell (valence shell) in a
stable energy state (noble gas
configuration)

Noble gas (He, Ne, Ar, Kr, Xe, Rn)

→ This is the reason for chemical


bonding

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Electron Configuration (H – Ar)

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Electron Configuration (K – Kr)

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Atomic Interaction

𝐹 = 𝐾𝐴 + 𝐾𝑅

𝐸 = න 𝐾 𝑑𝑎
𝑎
∞ ∞
= න 𝐾𝐴 𝑑𝑎 + න 𝐾𝑅 𝑑𝑎
𝑎 𝑎
= 𝐸𝐴 + 𝐸𝑅
𝑑𝐸
𝐸𝑚𝑖𝑛 → ≡𝐹=0
𝑑𝑎
at 𝑎 = 𝑎0

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Types of atomic bonding

Primary (or Intramolecular) bonds:

• Ionic or heteropolar bonding

• Covalent or homopolar bonding

• Metallic bonding

Secondary (Intermolecular) bonds:

• Van-der-Waals bonding

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Primary Bonds: Ionic or Heteropolar Bonding

Usually anorganic substances


Non metal + metal → Ionic bond, usually poor electrical conductors, ionic conductor

11Na +
Na Cl Cation with 10 Cl −
17
electrons = Ne Anion with 18
𝐸𝐿, 𝑁𝑎𝐶𝑙 = 8.2 𝑒𝑉 electrons = Ar
𝐸𝐿, 𝑀𝑔𝑂 = 39.9 𝑒𝑉
→ High melting and boiling points, very high strength, brittle

1 eV = 1.60218 x 10-19 J
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Sifat-sifat dari Kristal Ion

❖ Titik lebur yang tinggi dan keras


Muatan ion, Radius Ion dan energi kisi
❖ Kompresibilitas dan thermal expansion
Simetri yang tinggi dan gaya elektrostatis yang tinggi
❖ Kegetasan

❖ Resistensi terhadap korosi


Oxid metal merupakan ikatan yang stabil (ion metal dan O2- ion)
Tahan terhadap oksidasi pada temp. tinggi
❖ Isolator elektris dan panas
❖ Transmisi sinar (single crystal Al2O3, NaCl), Gaya elektrostatis yang tinggi

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Primary Bonds: Covalent or Homopolar Bonding

Organic and anorganic substances


Non metal + non metal → covalent bond, electrical insulators (beside graphite)

Diatomic Polymers
𝐻2 , 𝑁2 , 𝑂2 , PE (𝐶2 𝐻2 )
𝐹2 𝐶𝑙2 , … PTFE (𝐶2 𝐹2 )

Diamond, …
𝐸𝐵, 𝑠𝑖𝑚𝑝𝑙𝑒 𝑏𝑜𝑛𝑑 ≅ 1.5 − 5 𝑒𝑉
𝐸𝐵, 𝑑𝑜𝑢𝑏𝑏𝑙𝑒 𝑏𝑜𝑛𝑑 ≅ 5 − 8 𝑒𝑉 Graphite, …
𝐸𝐵 𝑆𝑖𝐶 ≅ 12.75 𝑒𝑉
→ Melting and boiling points usually lower than those of ionic bonds,
very high strength, brittle
At a pressure of 1 atm, graphite and diamond do not have metling or boiling points

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Primary Bonds: Metallic Bonding

Metal + Metal → metallic bond, good electrical conductors


(free electrons)

𝐸𝐵 ≅ 0.64 𝑒𝑉 (Hg) ÷ 8.81 𝑒𝑉 (W)


→ Melting and boiling points lower than those of ionic bonds,
good mechanical properties (high strength, plastically deformable), good
thermal and electrical conductivity
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Sifat-sifat Metal
• Kerapatan yang tinggi
Kebanyakan metal memiliki kerapatan 6 – 9 gr/cm3
• Titik lebur
Tergantung pada besarnya ikatannya
Mulai dari -39 oC Hg hingga 3410 oC Tungsten
• Konduktifitas listrik tinggi
Akan tetapi makin tinggi temperature maka kondiktifitas listrik akan turun
• Konduktifitas panas yang tinggi
• Kekuatan
Makin banyak elektron yang dilepas makin besar gaya elektrostatiknya
(Coulomb)

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Sifat-sifat Metal
• Plastisitas dan kegetasan

• Sifat terhadap cahaya


Tidak dapat mentransmisi sinar

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Secondary Bonds: Van-der-Waals Bondíng

• Forming of center of charges (electrostatic attraction)


• Weak bond between each molecules
• In polymers, responsible for the cohesion of
H
macromolecules
C

Polyethylen (−𝐶𝐻2 −)
𝐸𝐵 ≅ 0.1 𝑒𝑉 (typical)

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Secondary Bonds: Hydrogen Bonding

• A special case of polar molecule bonding


• Bonding between molecules, in which H is covalently
bonded to F (as in HF), O (as in H2O) or N (NH3)

O
H

Formation of water

𝐸𝐵 is usually higher than Van-del-Waals bonding

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Mixed Bond

Metals: metallic bond with small portion of covalent bond


Intermetallic: strong increase of ionic bond

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