Conductor are materials that allow the free flow of electric current through them

Insulator are material that does not allow electric current to pass through them

Semiconductor are materials whose conductivity is between a conductor and insulator.

The two impurities doped with a semiconductor are : pentvalent and trivalent materials

Types of semiconductor:

1. Intrinsic semiconductor: This semiconductor’s are in the purest form. They have low conductivity
2. Extrinsic semiconductor: This semiconductor’s are doped which means inpurities has been added to it.
It has high conductivity. They are sub divided into.
N Type semiconductor and P Type semiconductor
1. N Type is formed when a pure semiconductor Is doped with a pentvalent impurities. Electrons are
the majority carriers while holes are the minority carriers
2. P Type is formed when a pure semiconductor is doped with a trivalent impurities. They form covalent
bonding. Electrons is the minority carrier while holes is the majority carrier.

Doping is a mechanism of applying impurities to a semiconductor.

P-N junction diode is formed when a P Type Is sandwiched with a New Type semiconductor

Biasing is the application of appropriate potential difference to a diode.

Two types of biasing is forward biasing and reverse biasing

Breakdown voltage is the that can breakdown a P-N junction.

Transistor is a solid state semiconductor device which can be used for amplification, switching,
voltage stabilization, signal modulation and many other functions.

Types of Transistor

1. Bipolar junction transistor (BJT):

It is a type of semiconductor which is doped and has the two charge carriers (i.e electron
and holes). It is made from SILICON. It has three layers which are BASE, EMITTER,
COLLECTOR Which is sandwiched of differently doped section 1.e N Type|P Type|N
Type Transistor(NPN), P Type|N Type|P Type transistor (PNP). It can be tested using a
multimeter or a simple tester (battery, resistor and led).
NPN Transistor PNP Transistor

Collector Collector

Base Base

Emitter Emitter

2. Field Effect Transistor(FET):

It has two layers of semiconductor material one ontop of another that is CHANNEL and
GATE. Electricity flows through one of the layers, called the channel. A voltage
connected to the other layer, called the gate, interferes with the current flowing in the
channel. Thus, the voltage connected to the gate controls the strength of the current in
the channel. The two varieties of FET are 1. Jnction Field Effect Transistor (JFET). 2.
Metal oxide Semiconductor Field Effect Transistor (MOSFET).
N CHANNEL FET
Drain

Gate Source

Integrated circuit IC is a thin chip consisting of at least two interconnected semiconductor

devices like transistor, resistors. It contains millions of other devices fabricated on it.

IC are classified by the number of transistor and other components thet contains
 1. SSI ( Small Scale Integration): It has up to 100 electronic components per chip
2. MSI (Medium Scale Integration): From 100 to 3000 components per chip
3. LSI (Large Scale Integration): From 3000 to 100,000 components per chip
4. VLSI (Very Large Scale Integration): From 100,000 to 1,000,000 Components per chip
5. ULSI (Ultra Large Scale Semiconductor): More than 1 million components per chip

IC Packages

Chips come in variety of packages. The three most common are

1. DIP’s Dual Inline Packages are chips that have from 8 to 40 legs, evenly divided in two
rows
2. PGA’s Pin Grid Arrays are square chips in which the pins are arranged in concentric
squares
3. SIP’s Single Inline Packages are chips that have just one row of legs in straight line like
a comb.
4. SIMM’s Single Inline Memory Modules.
5. DIMMs Dual Inline Memory Modules.

Maintainance Is the routine and recurring process of keeping a particular machine in its normal
condition for better performance.

Two maintainance are preventive maintenance and corrective maintenance

Preventive maintenance is the regular inspection, cleaning and replacement of parts of a

system.

Factor that causes the need for preventive maintenance

1. Computer location and environment: e.g dusty environment

2. Computer use: High traffic network might require scanning and removal of malicious
software
Components to inspect for damage by dust Includes CPU heat sink and fan, RAM module,
Storage devices, adapter cards, cables, Keyboard and mouse, power devices

Corrective maintenance are maintainable performed to rectify And repair faulty systems and
equipment.

Example of corrective maintenance

1. Production line 2. HVAC systems 3. Public works

Benefits of corrective maintenance

1. Reduce emergency maintenance orders

2. Increase employee safety

3. Reduce service interruption

4. Extend asset lifetime

5. Decrease downtime

Advantage of corrective maintenance

1. Lower cost 2. Simple process 3. Inspection opportunity

Disadvantage of corrective maintenance

1. unpredictability 2. Interruption to production 3. Shortened asset lifespan

Difference between corrective and preventive maintenance

1. Corrective Maintenance is performed after equipment failure While preventive is performed

before equipment failure

2. Corrective maintenance are all activities that restore a failed system to normal working
conditions while preventive are activities that maintain and prevent system from failing

3.Corrective maintenance is reactive in nature While preventive is preventive in nature