You are on page 1of 8

FDD5353 N-Channel Power Trench® MOSFET

April 2015

FDD5353
N-Channel Power Trench® MOSFET
60V, 50A, 12.3m
Features General Description
 Max rDS(on) = 12.3m at VGS = 10V, ID = 10.7A This N-Channel MOSFET is produced using Fairchild
Semiconductor‘s advanced Power Trench® process that has
 Max rDS(on) = 15.4m at VGS = 4.5V, ID = 9.5A
been especially tailored to minimize the on-state resistance and
 100% UIL Tested yet maintain superior switching performance.
 RoHS Compliant Application
 Inverter
 Synchronous rectifier
 Primary switch

D
G
G
S
D
TO-P-2A52
K
(T O -252)
S

MOSFET Maximum Ratings TC = 25°C unless otherwise noted


Symbol Parameter Ratings Units
VDS Drain to Source Voltage 60 V
VGS Gate to Source Voltage ±20 V
Drain Current -Continuous TC = 25°C 50
ID -Continuous TA = 25°C (Note 1a) 11.5 A
-Pulsed 100
EAS Single Pulse Avalanche Energy (Note 3) 253 mJ
Power Dissipation TC = 25°C 69
PD W
Power Dissipation TA = 25°C (Note 1a) 3.1
TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C

Thermal Characteristics
RJC Thermal Resistance, Junction to Case 1.8
°C/W
RJA Thermal Resistance, Junction to Ambient (Note 1a) 40

Package Marking and Ordering Information


Device Marking Device Package Reel Size Tape Width Quantity
FDD5353 FDD5353 D-PAK (TO-252) 13’’ 16mm 2500 units

©2013 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com


FDD5353 Rev.1.4
FDD5353 N-Channel Power Trench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics
BVDSS Drain to Source Breakdown Voltage ID = 250A, VGS = 0V 60 V
BVDSS Breakdown Voltage Temperature
ID = 250A, referenced to 25°C 77 mV/°C
TJ Coefficient
IDSS Zero Gate Voltage Drain Current VGS = 0V, VDS = 48V, 1 A
IGSS Gate to Source Leakage Current VGS = ±20V, VDS = 0V ±100 nA

On Characteristics
VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 250A 1.0 1.8 3.0 V
VGS(th) Gate to Source Threshold Voltage
ID = 250A, referenced to 25°C -8 mV/°C
TJ Temperature Coefficient
VGS = 10V, ID = 10.7A 10.1 12.3
rDS(on) Static Drain to Source On Resistance VGS = 4.5V, ID = 9.5A 12.1 15.4 m
VGS = 10V, ID = 10.7A, TJ = 125°C 16.7 20.3
gFS Forward Transconductance VDD = 5V, ID = 10.7A 41 S

Dynamic Characteristics
Ciss Input Capacitance 2420 3215 pF
VDS = 30V, VGS = 0V,
Coss Output Capacitance 215 285 pF
f = 1MHz
Crss Reverse Transfer Capacitance 120 180 pF
Rg Gate Resistance f = 1MHz 1.7 

Switching Characteristics
td(on) Turn-On Delay Time 11 20 ns
tr Rise Time VDD = 30V, ID = 10.7A, 6 11 ns
td(off) Turn-Off Delay Time VGS = 10V, RGEN = 6 36 58 ns
tf Fall Time 4 10 ns
Qg Total Gate Charge VGS = 0V to 10V 46 65 nC
VDD = 30V,
Qg Total Gate Charge VGS = 0V to 4.5V 23 32 nC
ID = 10.7A
Qgs Gate to Source Charge 7 nC
Qgd Gate to Drain “Miller” Charge 9 nC

Drain-Source Diode Characteristics


VGS = 0V, IS = 10.7A (Note 2) 0.8 1.3
VSD Source to Drain Diode Forward Voltage V
VGS = 0V, IS = 2.6A (Note 2) 0.7 1.2
trr Reverse Recovery Time 28 45 ns
IF = 10.7A, di/dt = 100A/s
Qrr Reverse Recovery Charge 21 34 nC
Notes:
1: RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
RJCis guaranteed by design while RJA is determined by the user’s board design.

a) 40°C/W when mounted on a b) 96°C/W when mounted


1 in2 pad of 2 oz copper on a minimum pad.

2: Pulse Test: Pulse Width < 300s, Duty cycle < 2.0%.
3: EAS of 253mJ is based on starting TJ = 25°C, L = 3mH, IAS = 13A, VDD = 60V, VGS = 10V. 100% test at L = 0.1mH, IAS = 41A.

©2013 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com


FDD5353 Rev.1.4
FDD5353 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
100 3.0

DRAIN TO SOURCE ON-RESISTANCE


VGS = 10V
VGS = 3V VGS = 3.5V
80 VGS = 4.5V 2.5
ID, DRAIN CURRENT (A)

VGS = 4V
VGS = 4V

NORMALIZED
60 2.0
VGS = 3.5V VGS = 4.5V
40 1.5
PULSE DURATION = 80s
DUTY CYCLE = 0.5%MAX
20 1.0 VGS = 10V
VGS = 3V PULSE DURATION = 80s
DUTY CYCLE = 0.5%MAX
0 0.5
0 1 2 3 4 5 0 20 40 60 80 100
VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A)

Figure 1. On-Region Characteristics Figure 2. Normalized On-Resistance


vs Drain Current and Gate Voltage

2.0 40
PULSE DURATION = 80s
DRAIN TO SOURCE ON-RESISTANCE

ID = 10.7A
1.8

SOURCE ON-RESISTANCE (m)


VGS = 10V DUTY CYCLE = 0.5%MAX
32
1.6 rDS(on), DRAIN TO
ID = 10.7A

1.4
NORMALIZED

24
1.2 TJ = 125oC
16
1.0

0.8
8 TJ = 25oC
0.6

0.4 0
-75 -50 -25 0 25 50 75 100 125 150 2 3 4 5 6 7 8 9 10
TJ, JUNCTION TEMPERATURE (oC) VGS, GATE TO SOURCE VOLTAGE (V)

Figure 3. Normalized On- Resistance Figure 4. On-Resistance vs Gate to


vs Junction Temperature Source Voltage

100 200
PULSE DURATION = 80s 100
IS, REVERSE DRAIN CURRENT (A)

VGS = 0V
DUTY CYCLE = 0.5%MAX
80
10
ID, DRAIN CURRENT (A)

VDS = 5V
TJ = 150oC
60
1 TJ = 25oC
TJ = 150oC
40 0.1
TJ = 25oC
20 0.01 TJ = -55oC
TJ = -55oC
0 0.001
1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)

Figure 5. Transfer Characteristics Figure 6. Source to Drain Diode


Forward Voltage vs Source Current

©2013 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com


FDD5353 Rev.1.4
FDD5353 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
10 10000
VGS, GATE TO SOURCE VOLTAGE(V)

ID = 10.7A
VDD = 20V Ciss
8

CAPACITANCE (pF)
1000
6 Coss
VDD = 30V

4
VDD = 40V 100
Crss
2 f = 1MHz
VGS = 0V

0 10
0 10 20 30 40 50 0.1 1 10 30
Qg, GATE CHARGE(nC) VDS, DRAIN TO SOURCE VOLTAGE (V)

Figure 7. Gate Charge Characteristics Figure 8. Capacitance vs Drain


to Source Voltage

100 60

50
IAS, AVALANCHE CURRENT(A)

ID, DRAIN CURRENT (A)


VGS = 10V
40
TJ = 25oC Limited by Package
10 30
VGS = 4.5V
20
TJ = 125oC o
RJC = 1.8 C/W
10

1 0
0.01 0.1 1 10 100 25 50 75 100 125 150
o
tAV, TIME IN AVALANCHE(ms) TC, CASE TEMPERATURE ( C)

Figure 9. Unclamped Inductive Figure 10. Maximum Continuous Drain


Switching Capability Current vs Case Temperature

5
200 10
P(PK), PEAK TRANSIENT POWER (W)

100
VGS = 10V
ID, DRAIN CURRENT (A)

4
10
100µs
SINGLE PULSE
10
RJC = 1.8oC/W
3
THIS AREA IS 10 TC = 25oC
LIMITED BY rDS(on) 1ms
1 SINGLE PULSE 2
TJ = MAX RATED 10ms 10
o
RJC = 1.8 C/W DC
TC = 25oC
0.1 10
-6 -5 -4 -3 -2 -1
1 10 100 200 10 10 10 10 10 10 1
VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)

Figure 11. Forward Bias Safe Figure 12. Single Pulse Maximum
Operating Area Power Dissipation

©2013 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com


FDD5353 Rev.1.4
FDD5353 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted

2
1 DUTY CYCLE-DESCENDING ORDER

D = 0.5
NORMALIZED THERMAL

0.2
IMPEDANCE, ZJC

0.1
0.1 0.05
0.02 PDM
0.01

0.01 t1
t2
NOTES:
SINGLE PULSE DUTY FACTOR: D = t1/t2
o
RJC = 1.8 C/W PEAK TJ = PDM x ZJc x RJc + TC
0.001
5E-4
-6 -5 -4 -3 -2 -1
10 10 10 10 10 10 1
t, RECTANGULAR PULSE DURATION (sec)

Figure 13. Transient Thermal Response Curve

2
1 DUTY CYCLE-DESCENDING ORDER
NORMALIZED THERMAL

D = 0.5
0.1
IMPEDANCE, ZJA

0.2
0.1 PDM
0.05
0.01 0.02
0.01
t1
t2
SINGLE PULSE NOTES:
0.001 o
DUTY FACTOR: D = t1/t2
RJA = 96 C/W
PEAK TJ = PDM x ZJA x RJA + TA
(Note 1b)

0.0001
-4 -3 -2 -1
10 10 10 10 1 10 100 1000
t, RECTANGULAR PULSE DURATION (sec)

Figure 14. Transient Thermal Response Curve

©2013 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com


FDD5353 Rev.1.4
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower F-PFS OPTOPLANAR®
®*
AttitudeEngine™ FRFET®
SM
Awinda® Global Power Resource ®
TinyBoost®
AX-CAP®* GreenBridge Power Supply WebDesigner TinyBuck®
BitSiC Green FPS PowerTrench® TinyCalc
Build it Now Green FPS e-Series PowerXS™ TinyLogic®
CorePLUS Gmax Programmable Active Droop TINYOPTO
CorePOWER GTO QFET® TinyPower
CROSSVOLT IntelliMAX QS TinyPWM
CTL ISOPLANAR Quiet Series TinyWire
Current Transfer Logic Making Small Speakers Sound Louder RapidConfigure TranSiC
DEUXPEED® and Better™  TriFault Detect
Dual Cool™ MegaBuck TRUECURRENT®*
EcoSPARK® Saving our world, 1mW/W/kW at a time™ μSerDes
MICROCOUPLER
EfficientMax SignalWise
MicroFET
ESBC SmartMax
MicroPak
® SMART START
MicroPak2 UHC®
Solutions for Your Success
® MillerDrive Ultra FRFET
Fairchild SPM®
Fairchild Semiconductor® MotionMax UniFET
STEALTH
MotionGrid® VCX
FACT Quiet Series SuperFET®
FACT® MTi® VisualMax
SuperSOT-3
FAST® MTx® VoltagePlus
SuperSOT-6
FastvCore MVN® XS™
SuperSOT-8
mWSaver® Xsens™
FETBench SupreMOS®
FPS OptoHiT
SyncFET 仙童™
OPTOLOGIC®
Sync-Lock™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. TO OBTAIN THE LATEST, MOST UP-TO-DATE DATASHEET AND PRODUCT INFORMATION, VISIT OUR WEBSITE
AT HTTP://WWW.FAIRCHILDSEMI.COM. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY


FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or
intended for surgical implant into the body or (b) support or sustain system whose failure to perform can be reasonably expected to
life, and (c) whose failure to perform when properly used in cause the failure of the life support device or system, or to affect its
accordance with instructions for use provided in the labeling, can be safety or effectiveness.
reasonably expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors
are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS


Definition of Terms
Datasheet Identification Product Status Definition
Datasheet contains the design specifications for product development. Specifications may change
Advance Information Formative / In Design
in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Preliminary First Production
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
No Identification Needed Full Production
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
Obsolete Not In Production
The datasheet is for reference information only.
Rev. I74

© Fairchild Semiconductor Corporation www.fairchildsemi.com


Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Fairchild Semiconductor:
FDD5353

You might also like