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Datasheet MCC95 12IO1B
Datasheet MCC95 12IO1B
Phase leg
Part number
MCC95-12io1B
Backside: isolated
3 1 2
6 7 5 4
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222c
Thyristor Ratings
Symbol Definition Conditions min. typ. max. Unit
VRSM/DSM max. non-repetitive reverse/forward blocking voltage TVJ = 25°C 1300 V
VRRM/DRM max. repetitive reverse/forward blocking voltage TVJ = 25°C 1200 V
I R/D reverse current, drain current VR/D = 1200 V TVJ = 25°C 200 µA
VR/D = 1200 V TVJ = 125°C 5 mA
VT forward voltage drop I T = 150 A TVJ = 25°C 1.29 V
I T = 300 A 1.50 V
I T = 150 A TVJ = 125 °C 1.28 V
I T = 300 A 1.70 V
I TAV average forward current TC = 85 °C T VJ = 125 °C 116 A
I T(RMS) RMS forward current 180° sine 182 A
VT0 threshold voltage TVJ = 125 °C 0.85 V
for power loss calculation only
rT slope resistance 2.4 mΩ
R thJC thermal resistance junction to case 0.22 K/W
RthCH thermal resistance case to heatsink 0.20 K/W
Ptot total power dissipation TC = 25°C 455 W
I TSM max. forward surge current t = 10 ms; (50 Hz), sine TVJ = 45°C 2.25 kA
t = 8,3 ms; (60 Hz), sine VR = 0 V 2.43 kA
t = 10 ms; (50 Hz), sine TVJ = 125 °C 1.92 kA
t = 8,3 ms; (60 Hz), sine VR = 0 V 2.07 kA
I²t value for fusing t = 10 ms; (50 Hz), sine TVJ = 45°C 25.3 kA²s
t = 8,3 ms; (60 Hz), sine VR = 0 V 24.6 kA²s
t = 10 ms; (50 Hz), sine TVJ = 125 °C 18.3 kA²s
t = 8,3 ms; (60 Hz), sine VR = 0 V 17.7 kA²s
CJ junction capacitance VR = 400 V f = 1 MHz TVJ = 25°C 119 pF
PGM max. gate power dissipation t P = 30 µs T C = 125 °C 10 W
t P = 300 µs 5 W
PGAV average gate power dissipation 0.5 W
(di/dt) cr critical rate of rise of current TVJ = 125 °C; f = 50 Hz repetitive, IT = 250 A 150 A/µs
t P = 200 µs; di G /dt = 0.45 A/µs;
I G = 0.45 A; V = ⅔ VDRM non-repet., I T = 116 A 500 A/µs
(dv/dt)cr critical rate of rise of voltage V = ⅔ VDRM TVJ = 125°C 1000 V/µs
R GK = ∞; method 1 (linear voltage rise)
VGT gate trigger voltage VD = 6 V TVJ = 25 °C 2.5 V
TVJ = -40 °C 2.6 V
I GT gate trigger current VD = 6 V TVJ = 25 °C 150 mA
TVJ = -40 °C 200 mA
VGD gate non-trigger voltage VD = ⅔ VDRM TVJ = 125°C 0.2 V
I GD gate non-trigger current 10 mA
IL latching current tp = 10 µs TVJ = 25 °C 450 mA
IG = 0.45 A; di G /dt = 0.45 A/µs
IH holding current VD = 6 V R GK = ∞ TVJ = 25 °C 200 mA
t gd gate controlled delay time VD = ½ VDRM TVJ = 25 °C 2 µs
IG = 0.45 A; di G /dt = 0.45 A/µs
tq turn-off time VR = 100 V; I T = 150 A; V = ⅔ VDRM TVJ =100 °C 185 µs
di/dt = 10 A/µs dv/dt = 20 V/µs t p = 200 µs
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222c
Ordering Ordering Number Marking on Product Delivery Mode Quantity Code No.
Standard MCC95-12io1B MCC95-12io1B Box 36 458163
I V0 R0 Thyristor
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222c
Outlines TO-240AA
3 1 2
6 7 5 4
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222c
Thyristor
300 2000 105
50 Hz, 80% VRRM VR = 0 V
250
200 1600
IT ITSM 2 TVJ = 45°C
TVJ = 45°C It
150 104 TVJ = 140°C
[A] TVJ = 125°C [A] [A2s]
100 140°C 1200
TVJ = 140°C
50
TVJ = 25°C
0 800 103
0.5 1.0 1.5 2.0 0.01 0.1 1 1 2 3 4 5 6 7 8 910
VT [V] t [s] t [ms]
Fig. 2 Surge overload current 2
Fig. 1 Forward characteristics Fig. 3 I t versus time (1-10 s)
ITSM: crest value, t: duration
tp = 30 µs
tp = 500 µs
100 100.0 200
PGM = 120 W, tP = 30 µs
60 W, tP = 500 µs
PGAV = 8 W dc =
160 1
TVJ = 125°C 0.5
10 10.0 0.4
0.33
VG tgd ITAVM120 0.17
0.08
[V] [μs] lim. [A] 80
1 1.0
typ.
IGT (TVJ = -40°C)
125°C
25°C
250 0.24
dc = RthHA 0.20
200 1
0.1
Ptot 0.5
0.2 0.16
0.4
0.4
150 0.33 ZthJC
0.6
[W] 0.17
0.8 0.12
0.08
1.0
100 [K/W]
0.08 i Rthi (K/W) ti (s)
1 0.0073 0.0001
50 2 0.0128 0.0031
0.04 3 0.1329 0.084
4 0.067 0.42
0 0.00
0 40 80 120 160 0 40 80 120 160 1 10 100 1000 10000
IT(AV) [A] Tamb [°C] t [ms]
Fig. 7a Power dissipation versus direct output current Fig. 8 Transient thermal impedance junction to case
Fig. 7b and ambient temperature
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222c
Thyristor
1200
Circuit
W3 RthKA K/W
1000 3x MCC95 or 0.03
3x MCD95 0.06
0.08
800 0.12
0.15
Ptot 0.3
600 0.5
[W]
400
200
0
0 50 100 150 200 250 0 50 100 150
IRMS [A] Ta [°C]
Fig. 8 Three phase AC-controller: Power dissipation versus
RMS output current and ambient temperature
0.30
RthJC for various conduction angles d:
d RthJK [K/W]
0.4 DC 0.42
30°
180° 0.43
60°
120°
120° 0.45
ZthJK 0.3 180° 60° 0.47
DC 30° 0.48
t [s]
Fig. 10 Transient thermal impedance junction to heatsink (per thyristor/diode)
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222c