NBA & NAAC A+ Accredited Dhulapally, Secunderabad-500100
POST EVENT REPORT
Date: 10-06-2022
1. Department: ELECTRONICS AND COMMUNICATION ENGINEERING (ECE)
2. Name of the Event: Industrial Visit to LEDchip Indus Private. Limited
3. Event Date: 08-06-2022
4. Report submitted date: 10-06-2022
5. Brief description about the event:
The Department of Electronics and Communication Engineering has
organized an industrial visit on 8th of June 2022 to LED Chip organization for the II year B.Tech Students. The visit was organized with prior permission and guidance of our beloved Principal, Dr. P. Santosh Kumar Patra Sir and HOD of ECE, Dr. B. Hari Krishna. Mr. S.P. Manikanta is the coordinator and Mr. P. Prasad and Mrs. Kavya Ramesh are the co-organizers of this industrial visit. Following Schedule Provides Event Details: Date: 08th June 2022 Departure (College): 10:00 am Arrive (Industry): 10:45 am Brief Description about session: After reaching the industry, the students were taken to the manufacturing unit and the demonstrator explained the process of manufacturing the LEDs. This explanation helped the students to gain the practical knowledge on LEDs. Detailed Explanation on Manufacturing: The following things were explained by the demonstrator. Making semiconductor wafers Adding epitaxial layers Adding metal contacts Mounting and Packaging There were different teams for each domain. Firstly, he mentioned how a semiconductor wafer is made. The material composition used are GaAs or GaP. This crystalline semiconductor is grown in a high temperature, high pressure chamber. Gallium, arsenic, and/or phosphor are purified and mixed together in the chamber. The heat and pressure will liquify and press the components together so that they are forced into a solution. This is known as liquid encapsulation. Then the material is then sliced into very thin wafers of semiconductor, approximately 10 mm thick. The wafers are polished until the surfaces are very smooth. Secondly, he explained about the cleaning the wafers, where the wafers are cleaned through a rigorous chemical and ultrasonic process using various solvents. This process removes dirt, dust, or organic matter that may have settled on the polished wafer surface. Next, he gave a detailed note on adding the layers on the material. Where additional layers of semiconductor crystal are grown on the surface of the wafer. This is one way to add impurities, or dopants, to the crystal. Metal contacts are then defined on the wafer. The contact pattern is determined in the design stage and depends on whether the diodes are to be used singly or in combination. Contact metal is evaporated onto the pattern, filling in the exposed areas. Then, evaporation takes place in another high temperature chamber. Finally, the demonstration concluded with the explanation of sealing the material, in which the individual dies are mounted on the appropriate package. If the diode is used as an indicator light, it is mounted on two metal leads about two inches long. Finally, the entire assembly is sealed in plastic case for usage. The LED chip Indus Private Limited produces LEDs which are LM80 certified where the LEDs are subject to 9 months of accelerated Life which gives the highest Lumens in their class ensured by the use of high-grade Chips, Silicone & Phosphors. The highest standards of reliability are ensured automatically as all LEDs are produced untouched by the hand. The processes right through Chip bonding, to gold wire bonding to Phosphor coating to testing-sorting-packing are carried out in air-conditioned dust free Class10K clean rooms, to meet highest & stringent standards. This industry produces different types of LEDs like UVC 3535 LED 275-280 nm, High power LED, Medium power LED, COB LED, DIP LED and Hi-Flux LED. Session was ended at 2:00 pm. Lunch: 2:00 pm to 2:30 pm Departure (Industry): 2:30 pm Arrive (College): 3:15 pm
Encl: 4 Photographs ------------------------------------------------------------------------------------------------- Report prepared by: Dr. B. Hari Krishna
Content verified by English Staff Name & Signature:
Softcopy along with photos forwarded for website:
Any remark / suggestion:
Sign of Organizing Faculty Sign of HOD Approved by Principal
The students before going to the industrial visit at the college
Students after visiting the industry
Students observing the components through the microscope
The demonstrator explaining the manufacturing process of LED