Ford Spec’s

• DR-180100- Overlaping of requirements

• DR-180100-011037- Link to Share Point

011080_(1801_ED-80): • Eyelet DWG’s
B+ Eyelet Covering
Dip-soldered Eyelets

All exposed powered-at-all-times (B+)
eyelets must be shrouded, insulated or
covered in the crimp area.
Shroud/insulation must cover the entire
crimp and extend a minimum of 3 mm
beyond the terminal/crimp interface
onto the wire insulation.
• RQT-180100-009496/10-EYELET CRIMP SEALING
(Ethan Korte)
Crimps on eyelet terminals must be sealed against water entry when any of the following
circumstances applies:
Requirement Description
Eyelets must be dip-soldered where any of
the following conditions occur:
(a) eyelets with unplated surfaces packaged
in Water Management Zone II or greater (per
test method 00.00-E-
412 as cited by RQT-002600-009611/EY-
0128); (See attachments for water zone
example)
(b) Where stated on eyelet print.
(c) When the following non-compliant eyelets
characteristics are present (Prior to use, EDS
must obtain
approval from EDS Core Connector and
Terminal group): • CETP: 00.00-E-412
1. grip designs and crimps without approved
standards
• DR-180100-714828:
2. contains 15% or greater zinc content Eyelet Sealing
Note: If interlocking eyelets are required to Consideration
be dip-soldered, then dip-soldering must be
performed after the
interlocking eyelets are assembled together.
Require:
1. all the wires to be 3T or 4T • ESLU5T-1A263-AA
2. the equipment requires to allow to control the SPECIFICATION – HEAT SHRINK TUBING
immersion time
3. temperature of the soldering need to be PERFORMANCE
controlled
4. DV/PV to be performed against the DR-180100-
011080_(1801_ED-80): Dip-soldered Eyelets

a. The circuit(s) leading from the eyelet leads directly to a component that can breathe through
the wiring, without any
splice nugget in between;

b. The circuit(s) leading from the eyelet passes through a sealed connector, and at least one
circuit in that connector
goes to a component that can breathe through the wiring, without any splice nugget in between;
or
• Wiring harness DWG
c. The circuit(s) leading from the eyelet leads to an attachment in the exterior underbody or
lower part of the engine
compartment (ref. ED-0051). The low-voltage battery frame ground is exempt; or

d. The circuit uses aluminum wire/cable.

This requirement does not apply to eyelets that cannot get wet during vehicle operation and that
are crimped to copper
wire. If they are crimped to aluminum wire, the crimps must be sealed regardless of location in
the vehicle.

Note: All sealed modules shall be considered "breathable" unless specified on the Device
Transmittal (DT).
 Dip Soldering Process

Yazaki Nursan Based in the Reflux process for PCB’s production

Time (s): Time (s): Ning-Cheng Lee ,”Reflow Soldering Processes and Troubleshooting: SMT,
1. Immersion in flux Follow the Supplier information BGA, CSP and Flip Chip Technologies”, NewNESPRESS, Woburn, MA, 2002
Material: (Supplier/YZK PN) Material: (Supplier/YZK PN)
Qty (g): Qty (g):

To avoid a temperature to raise to quickly affecting the

Time (s): Time (s): 2.1. Pre-Heating
components, causing cracks or other issues
Temperature (C): Temperature (C):
Ramp-up (C/s): Ramp-up (C/s):
To evaporate the solvent and activate the flux, usually it will be
Time (s): Time (s): around 30s to 2.5min, to be followed the supplier information.
Temperature (C): Temperature (C): For example the material used by Nursan, the Flux as a
2.2. Soaking Temperature
Ramp-up (C/s): Ramp-up (C/s): temperature of 100-130C. We shall always have in
consideration the wire spec, that will limit the temperature on
this fase and shall be for 3T: <125C
Senju Metal Industry Co., Ltd, “ECO Solder Environment-friendly Lead-Free
Time (s): Time (s): We have the information that shall be around 3s Solder
3. Immersion in Soldering
Material: (Supplier/YZK PN) Material: (Supplier/YZK PN) The goal is to achieve a thickness of 10~15µm
Qty (g): Qty (g):
We need to have an understanding of this operation in the final
4. Immersion in cooling liquid
Time (s): Time (s): result of the of the surface
Temperature (C): Temperature (C): End
Ramp-down (C/s): Ramp-down (C/s):
Information above is extract based in the process of Reflux, that is common
Mentioned in literature that the pre heating and soaking temperature avoid the voids in the used in PCB production
soldering, creating an uniform nugget, and closing any gap between strands
In house developed equipment
Must be discussed with the suppliers of equipment and raw material and need to be tested in
plant