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AON6786 AlphaOmegaSemiconductors
AON6786 AlphaOmegaSemiconductors
DFN5X6
Top View D
Top View Bottom View
1 8 SRFETTM
2 7 Soft Recovery MOSFET:
3 6
Integrated Schottky Diode
4 5
G
PIN1
S
Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 15 20 °C/W
RθJA
Maximum Junction-to-Ambient A D Steady-State 42 50 °C/W
Maximum Junction-to-Case Steady-State RθJC 1.1 1.5 °C/W
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
100 100
3V VDS=5V
80 4.5V 80
7V
10V
60 60
ID (A)
ID(A)
125°C
40 40
20 20
25°C
VGS=2.5V
0 0
0 1 2 3 4 5 1 1.5 2 2.5 3
VDS (Volts) VGS(Volts)
Fig 1: On-Region Characteristics (Note E) Figure 2: Transfer Characteristics (Note E)
5 2
Normalized On-Resistance
4 1.8
VGS=4.5V
VGS=4.5V ID=20A
1.6
RDS(ON) (mΩ )
3
17
1.4
5
2
VGS=10V VGS=10V 2
1.2
ID=20A 10
1
1
0 0.8
0 5 10
15 20 25 30 0 25 50 75 100 125 150 175 200
ID (A)
Temperature (°C) 0
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E) 18
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
8 1.0E+02
ID=20A
1.0E+01 125°
6
1.0E+00
40
RDS(ON) (mΩ )
4
1.0E-02
2 1.0E-03
25°C 1.0E-04
0 1.0E-05
2 4 6 8 10 0.0 0.2 0.4 0.6 0.8 1.0
VGS (Volts) VSD (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage Figure 6: Body-Diode Characteristics (Note E)
(Note E)
10 6000
VDS=15V
ID=20A 5000
8 Ciss
Capacitance (pF)
4000
VGS (Volts)
6
3000
4
2000
2 Coss
1000 Crss
0 0
0 20 40 60 80 0 5 10 15 20 25 30
Qg (nC) VDS (Volts)
Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics
1000.0 200
Power (W)
10.0
100µs 120 17
DC 1ms
5
1.0 10ms 80 2
10
TJ(Max)=150°C
0.1 40
TC=25°C
0.0 0
0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10
VDS (Volts) 0
Pulse Width (s)
Figure 9: Maximum Forward Biased Safe 18
Figure 10: Single Pulse Power Rating Junction-to-
Operating Area (Note F) Case (Note F)
10
D=Ton/T In descending order
Zθ JC Normalized Transient
RθJC=1.5°C/W 40
1
0.1 PD
1000 100
IAR (A) Peak Avalanche Current
TA=25°C 80
TA=150°C 40
10
TA=125°C
20
1 0
1 10 100 1000 0 25 50 75 100 125 150
µs)
Time in avalanche, tA (µ TCASE (°C)
Figure 12: Single Pulse Avalanche capability Figure 13: Power De-rating (Note F)
(Note C)
100 10000
TA=25°C
80 1000
Current rating ID(A)
Power (W)
60
17
100 5
2
40
10
10
20
1
0 0.00001 0.001 0.1 10 1000
0 25 50 75 100 125 150 0
TCASE (°C) Pulse Width (s) 18
Figure 14: Current De-rating (Note F) Figure 15: Single Pulse Power Rating Junction-to-
Ambient (Note H)
10
D=Ton/T In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
Zθ JA Normalized Transient
TJ,PK=TA+PDM.ZθJA.RθJA
Thermal Resistance
1 RθJA=50°C/W 40
0.1
PD
0.01
Single Pulse
Ton
T
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)
1.0E-01 0.7
20A 10A 5A
0.6
1.0E-02
0.5
VDS=30V
0.4
VSD (V)
IR (A)
1.0E-03
0.3
IS=1A
VDS=15V 0.2
1.0E-04
0.1
1.0E-05 0
0 50 100 150 200 0 50 100 150 200
Temperature (°C) Temperature (°C)
Figure 17: Diode Reverse Leakage Current vs. Figure 18: Diode Forward voltage vs. Junction
Junction Temperature Temperature
30 12 14 4
di/dt=800A/µs 125ºC di/dt=800A/µs 125ºC
12 3.5
10
25
3
10 trr
Qrr 25ºC 8 25ºC 2.5
20
Qrr (nC)
8
trr (ns)
Irm (A)
S
6
125ºC 6
15 125ºC 1.5
Irm 4
4 S
25ºC 1
10
2 2 25ºC 0.5
5 0 0 0
0 5 10 15 20 25 30 0 5 10 15 20 25 30
IS (A) IS (A)
Figure 18: Diode Reverse Recovery Charge and Peak Figure 19: Diode Reverse Recovery Time and
Current vs. Conduction Current Softness Factor vs. Conduction Current
30 20 21 4
Is=20A Is=20A
18 3.5
25 125ºC
15 trr 25ºC 3
15
20 25ºC 2.5
Qrr (nC)
12
Irm (A)
trr (ns)
125ºC
15 Qrr 10 2
S
9
1.5
10
6 S 25ºC
125ºC 5 1
5 Irm
3 0.5
25ºC 125º
0 0 0 0
0 200 400 600 800 1000 0 200 400 600 800 1000
µs)
di/dt (A/µ µs)
di/dt (A/µ
Figure 20: Diode Reverse Recovery Charge and Peak Figure 21: Diode Reverse Recovery Time and
Current vs. di/dt Softness Factor vs. di/dt
DUT -
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
DUT
+ Vdd
Vgs VDC
Rg - 10%
t on toff
Id Vds
Vgs + Vdd I AR
Vgs VDC
Rg - Id
DUT
Vgs Vgs
Vds + Q rr = - Idt
DUT
Vgs
t rr
Vds - L Isd IF
Isd dI/dt
+ Vdd I RM
Vgs VDC
Vdd
Ig
- Vds