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ch30 of Mikell P Groover: Principles of Modern Manufacturing, 5th Edition
ch30 of Mikell P Groover: Principles of Modern Manufacturing, 5th Edition
Groover 2013
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© Mikell P. Groover 2013
30.12 Vapor phase epitaxy is based on which one of the following: (a) chemical vapor deposition,
(b) diffusion, (c) ion implantation, (d) physical vapor deposition, or (e) thermal oxidation?
30.13 Which of the following processes are used to add layers of various materials in IC
fabrication (three best answers): (a) chemical vapor deposition, (b) diffusion, (c) ion
implantation, (d) physical vapor deposition, (e) plasma etching, (f) thermal oxidation, and
(g) wet etching?
30.14 Which of the following are doping processes in IC fabrication (two best answers): (a)
chemical vapor deposition, (b) diffusion, (c) ion implantation, (d) physical vapor
deposition, (e) plasma etching, (f) thermal oxidation, and (g) wet etching?
30.15 Which one of the following is the most common metal for metallization in a silicon
integrated circuit: (a) aluminum, (b) copper, (c) gold, (d) nickel, (e) silicon, or (f) silver?
30.16 Which etching process produces the more anisotropic etch in IC fabrication: (a) plasma
etching or (b) wet chemical etching?
30.17 Which of the following are the two principal packaging materials used in IC packaging: (a)
aluminum, (b) aluminum oxide, (c) copper, (d) epoxies, and (e) silicon dioxide?
30.18 According to Rent’s rule the number of input/output terminals in an integrated circuit is (a)
greater than or (b) less than the number of devices (logic gates) in the IC?
30.19 Which one of the following technologies in IC packaging provides the greater packing
densities in circuit board assembly: (a) pin-in-hole technology, (b) surface-mount
technology, or (c) through-hole technology?
30.20 Which one of the following IC packaging styles provides the opportunity for the largest
number of terminals in the package: (a) ball grid array, (b) dual in-line package, (c) pin grid
array, or (d) square package?
30.21 Multiprobe testing is a computer-controlled testing method that is performed on the
integrated circuits immediately after they have been separated from the wafer: (a) true or
(b) false?
30.22 Which of the following metals are commonly used for wire bonding of chip pads to the
lead frame (two best answers): (a) aluminum, (b) copper, (c) gold, (d) nickel, (e) silicon,
and (f) silver?
30.23 Which one of the following major phases in IC processing is the most important in
determining the overall yield of ICs: (a) chip separation from the wafer, (b) crystal growing
of the starting ingot, (c) packaging of the individual ICs, (d) slicing the ingot into wafers, or
(e) wafer processing of the individual ICs on the wafer?
Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to
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