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Module 2
Module 2
Electronics Engineering
Wafer growth
Wafer cleaning
Oxidation
Lithography
Etching
Doping
Metallization
Packaging
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Classification of Solids
AMORPHOUS
CRYSTALLINE POLYCRYSTALLINE
(Non-crystalline)
Single Crystal
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Chip manufacturing
https://www.youtube.com/watch?v=bor0qLifjz4
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Why study crystal structures?
When we look around much of what we see is non-crystalline (organic things like
wood, paper, sand; concrete walls, etc. some of the things may have some
crystalline parts!).
But, many of the common ‘inorganic’ materials are ‘usually*’ crystalline:
◘ Metals: Cu, Zn, Fe, Cu-Zn alloys
◘ Semiconductors: Si, Ge, GaAs
◘ Ceramics: Alumina (Al2O3), Zirconia (Zr2O3), SiC, SrTiO3.
Also, the usual form of crystalline materials (say a Cu wire or a piece of alumina)
is polycrystalline and special care has to be taken to produce single crystals.
Polymeric materials are usually not ‘fully’ crystalline.
The crystal structure directly influences the properties of the material
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Structures of Solids
Unit Cells
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Crystal system
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Simple Cubic (SC) Lattice + Sphere Motif
Graded Shading to give 3D effect
If these spheres were ‘spherical atoms’ then the atoms would be touching each other.
The kind of model shown is known as the ‘Ball and Stick Model’.
In the true unit cell 1/8th of the atom is within the unit cell. 11
IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Body Centered Cubic (BCC) Lattice + Sphere Motif
=
Unit cell of the BCC lattice
So when one usually talks about a BCC crystal what is meant is a BCC
lattice decorated with a mono-atomic motif
Central atom is coloured differently for better visibility
Note: BCC is a lattice and not a crystal 12
IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Face Centered Cubic (FCC) Lattice + Sphere Motif
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Atomic Packing Factor
Atomic packing factor shows us how dense the unit cell is:
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Simple Cubic Structure (SC)
• Rare due to low packing density (only Po has this structure)
• Close-packed directions are cube edges.
• Coordination # = 6
(# nearest neighbors)
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Atomic Packing Factor (APF)
a
volume
R=0.5a atoms atom
4
unit cell 1 p (0.5a) 3
close-packed directions 3
APF =
contains 8 x 1/8 =
1 atom/unit cell a3 volume
Adapted from Fig. 3.43,
Callister & Rethwisch 4e. unit cell
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Body Centered Cubic Structure (BCC)
• Atoms touch each other along cube diagonals.
--Note: All atoms are identical; the center atom is shaded
differently only for ease of viewing.
ex: Cr, W, Fe (), Tantalum, Molybdenum
• Coordination # = 8
3a
2a
R Close-packed directions:
Adapted from
Fig. 3.2(a), Callister &
a length = 4R = 3 a
Rethwisch 4e.
atoms volume
4
unit cell 2 p ( 3a/4) 3
3 atom
APF = • APF = 0.68
volume
a3
unit cell 20
IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Face Centered Cubic Structure (FCC)
• Atoms touch each other along face diagonals.
--Note: All atoms are identical; the face-centered atoms are shaded
differently only for ease of viewing.
ex: Al, Cu, Au, Pb, Ni, Pt, Ag
• Coordination # = 12
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Atomic Densities
Linear Density
– Number of atoms per length whose centers lie on the direction vector for a
specific crystallographic direction.
Planar Density
– Number of atoms per unit area that are centered on a particular
crystallographic plane.
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Linear and Planar Density
Why do we care?
Properties, in general, depend on linear and planar
density.
• Examples:
Speed of sound along directions
Slip (deformation in metals) depends on linear and planar
density
Slip occurs on planes that have the greatest density of
atoms in direction with highest density
we would say along closest packed directions on the closest packed planes
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Densıty Computatıon
Since the entire crystal can be generated by the
repetition of the unit cell, the density of a
crytalline material can be calculated based on the
density of the unit cell.
: Density of the unit cell
nM n : Number of atoms in the unit cell
M : Mass of an atom
Vc Vc : Volume of the cell
Mass of an atom is given in the periodic table in atomic mass units
(amu) or gr/mol. To convert (amu) to (gr) use avagadro’s number.
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Densıty Computatıon
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Theoretical Density,
nA
=
VC NA
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Theoretical Density
• Ex: Cr (BCC)
A = 52.00 g/mol
R = 0.125 nm
Ra n = 2 atoms/unit cell
(g/cm3 )
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Ceramics have... 4
Titanium
Al oxide
• less dense packing 3
Diamond
Si nitride
Aluminum Glass -soda
• often lighter elements Concrete
Silicon PTFE
Glass fibers
GFRE*
2 Carbon fibers
Polymers have... Magnesium Graphite
Silicone CFRE*
Aramid fibers
PVC
• low packing density PET
PC
AFRE*
1 HDPE, PS
(often amorphous) PP, LDPE
• lighter elements (C,H,O)
0.5
Composites have... 0.4
Wood
# atoms
2
LD 3.5 nm -1
a
length 2a
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Planar Densıty
4*1/4+1 2 y
δ(100)= = a2 (100)
a2
1 x a2
a= 4 r δ(100)=
2 4r2
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Planar Density of (100) Iron
Solution: At T < 912C iron has the BCC structure.
2D repeat unit
(100) 4 3
a R
3
Adapted from Fig. 3.2(c), Callister & Rethwisch 4e. Radius of iron R = 0.1241 nm
atoms
2D repeat unit 1
1 atoms atoms
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Planar Density = = 2 = 12.1 = 1.2 x 10
area a2 4 3 nm 2 m2
R
2D repeat unit 3
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3
h a
2
2
4 3 16 3 2
area 2 ah 3 a 3
2
R R
atoms 3 3
2D repeat unit 1
atoms = atoms
Planar Density = = 7.0 0.70 x 1019
nm 2 m2
area 16 3 2
R
2D repeat unit 3
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Miller Indices
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Procedure for finding Miller Indices
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Illustration
Step 1 : intercepts - 2a,3b and 2c
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Directions
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Directions Continued
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Directions Continued
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
CrystalPlanes
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
IndexingPlanes
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Important Features Of Miller Indices
(1/2,1/2,1)
(0,0,0) (0,1,0)
(0,1/2,1/2)
(0,0,1) (0,1,1)
(Simple Cubic Lattice) (f.c.c Lattice)
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Zincblende structure
Two interpenetrating f.c.c sublattice
(1/4, 1/4, 1/4) (1/4, 3/4, 3/4)
(3/4, 1/4, 3/4) (3/4, 3/4, 1/4)
Eg: GaAs
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Zincblende structure
Minimum distance between two atoms:
1 1 1
2 2 2
3
-0 -0 -0
4 4 4 4
3
If the lattice constant is ‘a’, minimum distance = 4
a
1
Contribution of f.c atoms = x6 3
2
Contribution of the second Total atoms=8 (full sphere)
sublattice atoms = 1x4 4
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
4 3
pr For one sphere
3
4 3
3
So, the volume occupied by the atoms inside the crystal w.r.t the total
crystal volume 3p ≈ 34%
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Note: zinc blende structure, the packing density is 34% i.e., 34% of the total
unit cell volume is occupied by the atoms.
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Doping in Si
• The impurity atoms should replace the silicon atoms.
• Many of these positions should be taken off by the impurity atoms.
• One impurity atom it goes and substitutes one silicon atom.
• r0 of Si = 1.18.
• The impurity atom may or may not have the same tetrahedral radius
Strain dictate the electronic activity.
• The impurity atoms will be electronically active only when they have
occupied the proper positions in the lattice by substituting a Si atom.
Material Si P As Sb B
r0 (A0) 1.18 1.1 1.18 1.36 0.88
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
• ε = misfit factor
• The tetrahedral radius of the impurity atom as rimpurity = r0 (1+ ε)
Tetrahedral radius of Si
Material Si P As Sb B
r0 (A0) 1.18 1.1 1.18 1.36 0.88
ε 0.068 0 0.15 0.25
Note 1: The larger the ε, the more difficult it is going to be to make the dopant
electronically active.
Note 2: It is more difficult to have a heavily doped p-type region in silicon
compared to an n+ region in silicon it is easier to fabricate an npn transistor
than a pnp transistor
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Crystal Planes
x (1 0 0)
{1 1 1}
Definition of a plane
x y z
1
a b c
(0 1 0)
hx ky lz 1
y
Miller Indices
z {1 1 0}
(0 0 1)
The entire family = {1 0 0} intercept to only one axis and parallel to
other two
• Depending on the particular plane, the properties of the material will differ 55
IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
{1 0 0} family
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
{1 1 0} family
√2a
x
h
x/2 3
h x x 2a
2
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Few other properties
Angle θ between two planes (u1 v1 w1) and (u2 v2 w2) is
u1u2 v1v2 w1w2
cos
u2
1
v12 w12 u22 v22 w22
Line of intersection of three planes [u v w]
u = v1w2 – v2w1
v = w1u2 – w2u1
w = u1v2 – u2v1
a
Separation between two adjacent parallel planes: d
h2 k 2 l2
• Note: the relation of the angle between two planes and the separation between two
planes are going to be quite important along with the atomic density of each plane
• that will tell us for any particular application what should be the crystal orientation.
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Eg: (1 0 0), the separation is simply ‘a’
a
d a
1 0 0
2 2 2
a a
Eg: (1 1 0), the separation is: d
1212 02 2
a a
Eg: (1 1 1), the separation is: d
1212 12 3
• The (1 1 1) planes are the least spacing between two adjacent parallel
planes/closely spaced together.
• it is easiest to grow it in the [1 1 1] direction because, the (1 1 1)
planes are most closely spaced together. cheaper All BJT
• Difficult to etch 61
IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
• Suppose you have an (1 0 0) wafer. You have exposed it to a selective etchant,
which is going to expose the (1 1 1) planes
54.740
• V-group etching
Advantage of (1 0 0) plane
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
Suppose you have (1 1 1) wafer natural cleavage plane is (1 1 1)
• The surface (1 1 1) plane must meet the bulk (1 1 1) plane
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
• Si degenerated zincblende diamond
• Properties & Orientations
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IC Fabrication Dr. Satyendra K Mourya BITS Pilani, Pilani Campus
BITS Pilani
Pilani Campus
Thank You