Design For Thermal Reliability of Electronic Ceramic Substrate

Document Code: DCAVRKMI-F-PSP
MANUEL S. ENVERGA UNIVERSITY FOUNDATION

Lucena City Document Title: Project Study Proposal
An Autonomous University Page No.: Page 1 of 12
Revision No.: 0
DR. CESAR A. VILLARIBA RESEARCH AND Effectivity Date: August 2019
KNOWLEDGE MANAGEMENT INSTITUTE Prepared by: DCAVRKMI
Reviewed by: QMR
QUALITY FORM Approved by: President
Design for Thermal Reliability of Electronic Ceramic Substrate
A Project Study
Presented to the Faculty of the
College of Engineering
Manuel S. Enverga University Foundation University
Lucena City
In Partial Fulfillment
of the Requirements for the Degree
Bachelor of Science in Mechanical Engineering
Expanded Tertiary Education Equivalency and Accreditation Program
by
Glennard B. Galang
November 2019
Revision No.: 0
Reviewed by: QMR
PROJECT STUDY PROPOSAL
I. Research Title: Design for Thermal Reliability of Electronic Ceramic Substrate
II. Name of Researcher : Glennard B. Galang

Degree : B.S in Mechanical Engineering
Researcher’s Contact :
+63946-286-0912
Details
Name of Research Adviser : Engr. Brenda De Vega
III. Project Study Proposal
1. Introduction
1.1. Background of the Study
Ceramic substrate plays a vital role on the reliability of a power module device.
Copper delamination contributes a major impact on poor reliability of the said device
thus this project study will focus on the parametric design of an electronic ceramic
substrate to solve a specific failure mode called Copper delamination. Also, the study will
cover various process that will help the researcher and the reader alike gain common
knowledge on such failure.
1.2. Objectives of the Study
The main objective of this study is to provide a reliable prototype of a ceramic
substrate which can reliably pass the standard Temperature Cycle Test (TCT) conditions
without the occurrence of Copper delamination or Peel off.
Furthermore, this study aims to:

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1. Provide design characterization using 3D modelling and Thermomechanical
Simulations.
2. Gather and Analyze data coming from thermomechanical simulation;
3. Procure the actual prototype from the undisclosed company’s partner suppliers.
4. Test and evaluate the ceramic substrate prototype thru actual TCT and C-mode
Scanning Acoustic Microscopy (CSAM).
5. Analyze data taken from actual tests to finalize the design prototype parameters
in terms of reliability and functionality.
6. Record study results and use as reference for generating company design rules.
1.3. Significance of the Study
Data gathered through this experiment will be used by the undisclosed company as
a valuable reference or guideline on designing electronic substrates. By understanding the
limitations and capabilities of each material and parameters presented, the designer can
balance the substrate design in terms of reliability, performance, and cost-effectiveness;
thus, making the product more competitive in the market.
1.4. Scope and Limitations of the Study
The primary scope of the study will focus on obtaining the optimal parameters
such as metallization thickness, ceramic material, and copper bonding techniques.
Trade-off between the cost and efficiency of the ceramic material is an important
factor thus Thermal Conductivity of the ceramic will be evaluated in order to achieve a
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balanced design. On the other hand, Coefficient of Thermal Expansion or CTE is of equal
importance due to its major contribution to the bonding of copper to ceramic.
The stated parameters will be evaluated using FEA simulations and will be
validated thru actual testing. The experiment will be limited to three (3) types of ceramic
material: Alumina (Al2O3), Aluminum Nitride (AlN), and Silicon Nitride (S3N4); as these
materials are the most commonly used for ceramic material due to their good thermal
conductivity and CTE. The experiment will also focus on three (3) types of technology:
Direct Bond Copper (DBC), Direct Plated Copper (DPC), and Active Metal Brazing
(AMB).
1.5. Conceptual Framework
Figure below shows the workflow of the study that will act as a guideline all
throughout the research,
Failure Analysis
Characterization
of Existing
of Substrate 3D modelling
Substrate
parameters
Design
Evaluation of
Temperature Thermal
Simulation
Cycle Test Simulation
Results
TCT Result
Evaluation
Fig 1. Project study Process Flow

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Reviewed by: QMR
1.6. Definition of Terms
Active Metal Brazing – a metal to ceramic bonding technique achieved by brazing
alloy to promote reaction and wetting with a ceramic substrate. The addition of
titanium to several braze alloy compositions results in increased reactivity and
considerable improvement in wetting behavior. The ceramic is wet by the formation
of an intermetallic interfacial reaction product which can then form a joint with the
braze alloy.
Delamination – is a separation along a plane parallel to a surface, as in the
separation of a coating from a substrate or the layers of a coating from each other
or, in the case of a concrete slab, a horizontal splitting, cracking, or separation near
the upper surface [1].
Direct Bond Copper – One of the most common methods for bonding metal to
ceramic. During the bonding process, thin transition layers are created between
metal and ceramic, which is formed by oxygen bridge between these two materials.
Power Module – is an assembly containing several power components, mostly
power semiconductor devices, properly internally interconnected to perform a
power conversion function [2].
Temperature Cycling Test – Test that determines the ability of parts to resist
extremely low and extremely high temperatures, as well as their ability to withstand
cyclical exposures to these temperature extremes [3].
Thermal Analysis – means the analysis of a change in a property of a sample,
which is related to an imposed temperature alteration [4].

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1.7. Acronyms
Al2O3 – Alumina
AlN – Aluminum Nitride
AMB – Active Metal Brazing
Cu – Copper
DBC – Direct Bond Copper
DPC – Direct Plated Copper
Si3N4 – Silicon Nitride
TCT – Temperature Cycling Test
TMS – Thermo Mechanical Simulation
CSAM - Computer Scanning Acoustic Microscopy
2. Review of Literature and Related Studies
2.1. Modules and Ceramic Substrates
The task of Power Electronics is to convert and control the flow of electric energy
from a power source to a user load. A power converter, based on power semiconductor
devices, converts electrical power with high efficiency minimizing energy loses. The
power input (voltage, current, frequency and number of phases), usually from the electric
utility, is converted in order to provide the load with an optimally suited voltage and
current [5].
Currently used high voltage Power Electronics systems are based on an elementary
brick called “power module”, where the active semiconductors are packaged. Inside this
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assembly, one finds different materials, which have functions to assure the inter-
connection, the insulation and the heat exchange between the semiconductor and its
environment[5].
The interconnection of the semiconductors and their insulation from the heat sink
(connected to the ground) is mainly achieved by a single element called “substrate”.
Furthermore, one of its main functions is to warrant the electrical insulation between
the semiconductors and their environment. Furthermore, it must also ensure the
evacuation of the heat generated by the semiconductors. Theses substrates are composed
of metallic conductors and an insulating material. When the thermal requirements are
high, ceramics are the first choice due to their high thermal conductivity (>20 W/m∙K).
Different ceramic materials are used for substrates elaboration (e.g. Al2O3, Si3N4, AlN).
Different technologies allow joining the ceramic to a conducting metal, such as
DBC (Direct Copper Bonding) or AMB (Active Metal Brazing). Reliability of the
substrate is often related to the mechanical properties of the ceramic material coupled
with the metal being used [6].
2.2. Delamination of Copper and Thermal Stress
The technology of high power IGBT modules has been improved significantly these
last years against thermal fatigue [7].
2.3. Coefficient of Thermal Expansion Mismatch between Copper and Ceramic
3. Methods and Procedures
3.1. Research Design

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The research will utilize the R & D approach to achieve the goal. The design of a
ceramic substrate involves numerous amounts of variations between the parameters
(copper thickness, ceramic material, bonding technology) involved. In order to reduce
these variations thus lowering the cost involve in producing sample prototypes,
Thermomechanical simulation will be used through ANSYS platform. Different sets of
parameters will be injected to the 3D models and then be simulated one by one to
determine the most viable combinations.
Results gathered through post-processing will then be materialize to actual
ceramic substrate prototypes.
In order to accurately simulate the actual failure mode, dummy die will be bonded
to a ceramic substrate.
After die bonding, the mechanical prototypes will then be subjected to
temperature cycling test. Temperature parameter will be set to -55~C to 150~C for 100x,
250x, 500x, 1000x cycles. Once TCT is done, the sample will undergo CSAM to gather
data on the magnitude of delamination occurred to the sample.
Raw data gathered through TCT will be post-processed using SAS JMP to finally
identify the optimal parameter for the ceramic substrate.
3.2. Research Environment
Currently, the undisclosed company is experiencing copper delamination on the
substrate during TCT making the substrate unreliable in terms of thermal capability.
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Data gathered thru this research will be used as valuable information in creating
design rules that can be used by the designer as guideline for the design of future devices.
3.3. Procedures
3.3.1 Data Gathering and Analysis
Both Qualitative and Quantitative data analysis method will be utilized as
data to be gathered throughout the study are in the form of images and
waveforms.
Before the actual design and prototyping commenced, Data pertaining to
copper delamination on the existing ceramic substrates are gathered by the
researcher thru available TCT and CSAM reports. This gives the researcher the
necessary details for the study such as standard temperature used in TCT and
magnitude of delamination.
In order to minimize the variation on the design parameters, results
gathered through thermo-mechanical simulation will be post-processed to
eliminate design parameters indicating copper delamination.
3.3.2 Design
3.3.3 Fabrication
Prototype samples shall be procured by the researcher though the
undisclosed company’s partner suppliers. Parameters of the prototype such as

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copper thickness, ceramic material and technology to be used will entirely depend
on the results taken from Thermomechanical simulations.
3.3.4 Testing and Evaluation
3.4. Design Concept
Autodesk Inventor 2019
The platform to be used for Thermomechanical 3D model of the prototype. Partial
parameters shall be injected to individual 3D models.
Ansys Workbench 2019
The software to be used for the simulation of the 3D thermomechanical model.
SAS JMP
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4. References
[1] S. T. Methods, P. L. Crystal, C. Material, F. Toughness, and I. F. Analysis, “Delamination
Learn more about Delamination Delamination-dominated failures in polymer composites
High speed machining processes for fiber-reinforced composites,” 2010.
[2] E. Santi, S. Eskandari, B. Tian, and K. Peng, “Power Electronic Modules,” Power
Electron. Handb., pp. 157–173, Jan. 2018.
[3] “Thermal Cycle Test.”
[4] Hot Topics in Thermal Analysis and Calorimetry. .
[5] F. M. Lozano and X. J. Sanuy, “Thermal Conductivity and Specific Heat Measurements
for Power Electronics Packaging Materials Acknowledgments,” no. June, 2005.
[6] Z. Jouini, Z. Valdez-Nava, and D. Malec, “Failure Analysis of Ceramic Substrates Used in
High Power IGBT Modules,” Engineering, vol. 08, no. 09, pp. 561–571, 2016.
[7] Z. Khatir and S. Lefebvre, “Thermal analysis of high power IGBT modules,” in IEEE
International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2000, pp.
271–274.
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5. Appendixes
GANTT CHART
Activities Months
1 2 3 4 5 6 7 8 9 10 11 12
1. Data gathering of existing
substrate delamination reports
2. Formulation of title
3. Preparation of proposal paper
(Introduction, review of related
literature, methods and
procedures)
4. Proposal defense
5. Submission of Final Proposal
paper
6. Characterization of Substrate
parameters
7. Parametric 3D modelling
8. Thermal Simulation
9. Evaluation of Simulation
Results
10. Sample prototype procurement
11. Temperature Cycling Test
12. CSAM Evaluation
13. Data gathering and analysis
thru SAS JMP
14. Evaluation, Post Processing,
Conclusion
15. Continuation and Completion
of the manuscript
16. Final defense
17. Final revision
18. Submission of hardbound.

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Document Code: DCAVRKMI-F-PSP

MANUEL S. ENVERGA UNIVERSITY FOUNDATION

Presented to the Faculty of the

Manuel S. Enverga University Foundation University

of the Requirements for the Degree

Bachelor of Science in Mechanical Engineering

Expanded Tertiary Education Equivalency and Accreditation Program

PROJECT STUDY PROPOSAL

I. Research Title: Design for Thermal Reliability of Electronic Ceramic Substrate

II. Name of Researcher : Glennard B. Galang

III. Project Study Proposal

1.1. Background of the Study

knowledge on such failure.

1.2. Objectives of the Study

The main objective of this study is to provide a reliable prototype of a ceramic

without the occurrence of Copper delamination or Peel off.

Furthermore, this study aims to:

1. Provide design characterization using 3D modelling and Thermomechanical

2. Gather and Analyze data coming from thermomechanical simulation;

Scanning Acoustic Microscopy (CSAM).

in terms of reliability and functionality.

1.3. Significance of the Study

a valuable reference or guideline on designing electronic substrates. By understanding the

balance the substrate design in terms of reliability, performance, and cost-effectiveness;

thus, making the product more competitive in the market.

1.4. Scope and Limitations of the Study

such as metallization thickness, ceramic material, and copper bonding techniques.

importance due to its major contribution to the bonding of copper to ceramic.

1.5. Conceptual Framework

Fig 1. Project study Process Flow

1.6. Definition of Terms

Active Metal Brazing – a metal to ceramic bonding technique achieved by brazing

titanium to several braze alloy compositions results in increased reactivity and

considerable improvement in wetting behavior. The ceramic is wet by the formation

Delamination – is a separation along a plane parallel to a surface, as in the

the upper surface [1].

Power Module – is an assembly containing several power components, mostly

power semiconductor devices, properly internally interconnected to perform a

power conversion function [2].

cyclical exposures to these temperature extremes [3].

Thermal Analysis – means the analysis of a change in a property of a sample,

which is related to an imposed temperature alteration [4].

AlN – Aluminum Nitride

AMB – Active Metal Brazing

DBC – Direct Bond Copper

DPC – Direct Plated Copper

Si3N4 – Silicon Nitride

TCT – Temperature Cycling Test

TMS – Thermo Mechanical Simulation

CSAM - Computer Scanning Acoustic Microscopy

2. Review of Literature and Related Studies

2.1. Modules and Ceramic Substrates

(connected to the ground) is mainly achieved by a single element called “substrate”.

Different technologies allow joining the ceramic to a conducting metal, such as

with the metal being used [6].

2.2. Delamination of Copper and Thermal Stress

last years against thermal fatigue [7].

2.3. Coefficient of Thermal Expansion Mismatch between Copper and Ceramic

3. Methods and Procedures

3.1. Research Design

ceramic substrate involves numerous amounts of variations between the parameters

(copper thickness, ceramic material, bonding technology) involved. In order to reduce