Electrical Engineer: 

Bachelors of Science in Electrical Engineering (BSEE), “Electrical Engineer” AND

Electronics AND “High Speed” AND Digital AND Analog, PCB Circuit, Layout Tools: OrCAD, Cadence
Allegro. USB, HDMI, Consumer Device, Electronics Companies: Intel, Facebook, Xerox, Hewlett Packard,
Dell, Lenovo, IBM

RF Engineers or RF Wireless Engineers: RF Test, Desense Test, RF Design Circuit, Rx Sensitivity, Tx

Power, Tx Quality, CMW500, WireShark
Companies: Motorola, Apple, Qualcomm, Google, Honeywell

Hardware Test Engineer: Bachelors of Science in Electrical Engineering (BSEE), “Hardware Test” AND
Electronics AND “i2c OR SPI OR USB”     (you can add, specifics at the end:  Camera, Display, Audio)
Companies: Intel, Facebook, Xerox, Hewlett Packard, Lenovo, IBM

Mechanical Engineer:  Bachelors of Science in Mechanical Engineering (BSME) “Mechanical Engineer”

AND “Creo OR ProE”AND “Injection Molding” AND Surfacing, consumer device
Companies: Intel, Facebook, Xerox, Hewlett Packard, Microsoft, Stryker (Physio Control) (Stay Away
from Aerospace companies ie Boeing)

PCB Designer:  “PCB Layout”AND “Cadence Allegro”AND OrCAD AND Circuits AND “Flex Circuit”
Companies: Intel, Microsoft, Product Development shops (ex. Synapse, Stratos, Product Creation
Studio, Pensar)

Software Engineer or SDET or STE:  Bachelors in Science in Computer Science, SDET AND “Software
Design Engineer in Test” AND C#, Python, PowerShell, Visual Studio, Team Foundation Services (TFS),
Windows Test Tool (WTT)
Companies: Microsoft, Google, Intel, Dell, IBM, Lenovo, Hewlett Packard

Software Design Engineer (SDE): Bachelors in Science in Electrical Engineer (BSEE) or Bachelors of
Science in Computer Science, C, C++, C#, Software Design: Visual Studio, Team Foundation Services.
(Specialized: Device Driver, KMDF, UMDF, Kernel Mode)
Companies: Microsoft, Google, Intel, Dell, IBM, Lenovo, Hewlett Packard

Embedded Engineer or Firmware Engineer or Software Design Engineer:  BSEE (Bachelors of Science in
Electrical Engineering) Embedded AND C/C++ AND Microcontroller AND Firmware (You can add, “Bare
Metal” , ARM, Circuit if the position has specifics)
Companies: Intel, Facebook, Xerox, Hewlett Packard, Medical Device Companies

Technical PM: PMP, Agile or SCRUM, Hardware or Software, Program Management, Deliverables,
someone who’s worked on a product ie (Samsung Galaxy, iPhone, Microsoft Surface, Microsoft Xbox)
Companies: Any companies that’s worked on product: Google, Apple, Microsoft, any kind of
consumer product
Look at our competitors for these profiles that have finished or worked at Microsoft: H10 Capital,
HCL, Aerotek, Volt, Excell Data/Compucom

Technicians: Soldering, SMT (Surface Mount), IPC Certification, Testing, Oscilloscope, Component
Testing:
Hololens: Please note this team is a specialized team, so focus will be more on Optical or Virtual
Reality (VR) These will be specialized searches.

Optomechanical Design and Test Engineer: BS degree in Mechanical Engineering, Electrical

Engineering, Mechanical design experience (any 2D/3D CAD), Knowledge of 3D printing, CNC, and
other prototyping methods, Prototyping and test setup experience.  Preferably Opto-Mechanical
Test experience, Basic EE knowledge, Optical test and test setup experience
Companies: Facebook Reality Labs, Zemax, Samsung, any places that works on Virtual Reality (VR)
or any Optical Company.

Optical Engineer: B.S. in Optical Engineering, Optical Science, Electrical Engineering or Physics,
Optical engineering experience, including a strong background in hands on experimentation and
complex optical system alignments, Experience in optical manufacturing and optical assembly ,
Experience in optical test setup such as calibration, repeatability/reproducibility tests, Experience in
opto-electric devices (lasers, photodiodes, etc.)
Companies: Facebook Reality Labs, Zemax, Samsung, any places that works on Virtual Reality (VR) or
any Optical Companies

Assembly Technician: 3+ years assembly experience in a manufacturing environment, Strong ability

to communicate and identify issues/anomalies that appear during assembly , Familiarity with Silicon
Processing/Assembly, Experience working in a clean room, Knowledge/Experience with CNC
machines, Experience with adhesive based assembly, Experience with wire bonding,
Proficient in Excel/Word/PowerPoint
Companies: Any Companies that has use of CNC Machines and Manufacturing Assembly
This position the person has to be a US person (US Citizen or Green Card)