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GAN080-650EBE

-8
080
N8
DF 650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN
8 mm x 8 mm package
5 May 2023 Product data sheet

1. General description
The GAN080-650EBE is a general purpose 650 V, 80 mΩ Gallium Nitride (GaN) FET in a DFN
8 mm x 8 mm surface mount package. It is a normally-off e-mode device offering superior
performance.

2. Features and benefits


• Enhancement mode - normally-off power switch
• Ultra high frequency switching capability
• No body diode
• Low gate charge, low output charge
• Qualified for standard applications
• ESD protection
• RoHS, Pb-free, REACH-compliant
• High efficiency and high power density
• Low package inductance and low package resistance

3. Applications
• High power density and high efficiency power conversion
• AC-to-DC converters, totem pole PFC
• DC-to-DC converters
• Fast battery charging, mobile phone, laptop, tablet and USB type-C chargers
• Datacom and telecom (AC-to-DC and DC-to-DC) converters
• Motor drives
• Solar (PV) inverters
• Class D audio amplifiers, TV PSU and LED drivers

4. Quick reference data


Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDS drain-source voltage -55 °C ≤ Tj ≤ 150 °C - - 650 V
VTDS transient drain to pulsed; tp = 1 µs; δfactor = 0.01 - - 800 V
source voltage
ID drain current VGS = 6 V; Tmb = 25 °C [1] - - 29 A
Ptot total power dissipation Tmb = 25 °C; Fig. 1 - - 240 W
Tj junction temperature -55 - 150 °C
Static characteristics
RDSon drain-source on-state VGS = 6 V; ID = 8 A; Tj = 25 °C; Fig. 11; - 60 80 mΩ
resistance Fig. 12; Fig. 13
VGS = 6 V; ID = 8 A; Tj = 150 °C; Fig. 11; - 135 - mΩ
Fig. 14
Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

Symbol Parameter Conditions Min Typ Max Unit


RG gate resistance f = 5 MHz; Tj = 25 °C; open drain - 3 - Ω
Dynamic characteristics
QGD gate-drain charge ID = 8 A; VDS = 400 V; VGS = 6 V; - 2.2 - nC
QG(tot) total gate charge Tj = 25 °C; Fig. 15; Fig. 16 - 6.2 - nC
Qoss output charge VGS = 0 V; VDS = 400 V; Tj = 25 °C [2] - 60 - nC

[1] Limited by device saturation


[2] Qr is not specified separately from Qoss for e-mode GaN FETs, since Qr = Qoss + QD, and QD = 0. (QD is charge associated with
diffusion of minority carriers. Since there is no body diode, no minority carriers in excess of Qoss have to be transferred for e-mode
GaN FETs.)

5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 D drain
4 3 2 1
2 D drain
3 D drain
D
4 D drain
5 S source G

6 S source KS

7 KS kelvin source 5 6 7 8 aaa-036395


S

8 G gate Transparent top view


mb S mounting base; connected DFN8080-8 (SOT8074-1)
to source

6. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
GAN080-650EBE DFN8080-8 plastic thermal enhanced small outline package; no leads; SOT8074-1
8 terminals; body: 8 x 8 x 0.9 mm

7. Marking
Table 4. Marking codes
Type number Marking code
GAN080-650EBE 080IEBE

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 2 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).Tj = 25 °C unless otherwise stated.
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage -55 °C ≤ Tj ≤ 150 °C - 650 V
VTDS transient drain to source pulsed; tp = 1 µs; δfactor = 0.01 - 800 V
voltage
VGS gate-source voltage -6 7 V
Ptot total power dissipation Tmb = 25 °C; Fig. 1 - 240 W
ID drain current VGS = 6 V; Tmb = 25 °C [1] - 29 A
IDM peak drain current pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 2 [1] - 58 A
Tstg storage temperature -55 150 °C
Tj junction temperature -55 150 °C
Tsld(M) peak soldering - 260 °C
temperature

[1] Limited by device saturation

03ne36
120

Pder
(%)

80

40

0
0 50 100 150 200
Tmb (° C)

Fig. 1. Normalized total power dissipation as a function of mounting base temperature

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 3 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

aaa-036242
102
ID Limit RDSon = VDS / ID
(A)

10 tp =10 μS

DC

100 μS
1
1 mS

10-1

10-2
1 10 102 103
VDS (V)

Tmb = 25 °C; IDM is a single pulse


Fig. 2. Safe operating area; continuous and peak drain currents as a function of drain-source voltage

9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-c) thermal resistance from Fig. 3 - - 0.52 K/W
junction to case
Rth(j-a) thermal resistance from - - 33.6 K/W
junction to ambient

aaa-036237
10
ZthJC
(K/W)
1

10-1

10-2

0.5
tp
10-3 0.2 P δ=
0.1 T
0.05
10-4 0.02
tp t
0.01
Single shot T
10-5
10-7 10-6 10-5 10-4 10-3 10-2 10-1
tP (S)

Fig. 3. Transient thermal impedance from junction to case as a function of pulse duration

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 4 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
VGS(th) gate-source threshold ID = 30.7 mA; VDS = VGS; Tj = 25 °C; 1.2 1.7 2.5 V
voltage Fig. 8
ID = 30.7 mA; VDS = VGS; Tj = 150 °C; - 1.6 - V
Fig. 8
IDSS drain leakage current VDS = 650 V; VGS = 0 V; Tj = 25 °C; - 1 65 µA
Fig. 9
VDS = 650 V; VGS = 0 V; Tj = 150 °C; - 13 390 µA
Fig. 9
IGSS gate leakage current VGS = 6 V; VDS = 0 V; Tj = 25 °C; - 163 - µA
Fig. 10
RDSon drain-source on-state VGS = 6 V; ID = 8 A; Tj = 25 °C; Fig. 11; - 60 80 mΩ
resistance Fig. 12; Fig. 13
VGS = 6 V; ID = 8 A; Tj = 150 °C; Fig. 11; - 135 - mΩ
Fig. 14
RG gate resistance f = 5 MHz; Tj = 25 °C; open drain - 3 - Ω
Dynamic characteristics
QG(tot) total gate charge ID = 8 A; VDS = 400 V; VGS = 6 V; - 6.2 - nC
QGS gate-source charge Tj = 25 °C; Fig. 15; Fig. 16 - 0.5 - nC
QGD gate-drain charge - 2.2 - nC
VGS(pl) gate-source plateau ID = 8 A; VDS = 400 V; Tj = 25 °C; - 2.2 - V
voltage Fig. 15
Ciss input capacitance VDS = 400 V; VGS = 0 V; f = 100 kHz; - 225 - pF
Coss output capacitance Tj = 25 °C; Fig. 17 - 70 - pF
Crss reverse transfer - 0.5 - pF
capacitance
Co(er) effective output 0 V ≤ VDS ≤ 400 V; VGS = 0 V; [1] - 105 - pF
capacitance, energy Tj = 25 °C; Fig. 18
related
Co(tr) effective output 0 V ≤ VDS ≤ 400 V; VGS = 0 V; [2] - 150 - pF
capacitance, time Tj = 25 °C
related
td(on) turn-on delay time VDS = 400 V; VGS = 6 V; Tj = 25 °C; ID - 3 - ns
tr rise time = 16 A; L = 318 μH; Ron = 10 Ω; Roff = 2 - 4 - ns
Ω; Fig. 19; Fig. 20
td(off) turn-off delay time - 5 - ns
tf fall time - 4 - ns
Qoss output charge VGS = 0 V; VDS = 400 V; Tj = 25 °C [3] - 60 - nC
Source-drain characteristics
VSD source-drain voltage IS = 8 A; VGS = 0 V; Tj = 25 °C; Fig. 21; - 2.3 - V
Fig. 22; Fig. 23; Fig. 24

[1] CO(er) is the fixed capacitance that gives the same stored energy as COSS while VDS is rising from 0 to 400 V
[2] CO(tr) is the fixed capacitance that gives the same charging time as COSS while VDS is rising from 0 to 400 V
[3] Qr is not specified separately from Qoss for e-mode GaN FETs, since Qr = Qoss + QD, and QD = 0. (QD is charge associated with
diffusion of minority carriers. Since there is no body diode, no minority carriers in excess of Qoss have to be transferred for e-mode
GaN FETs.)

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 5 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

aaa-036222 aaa-036223
100 50
ID ID VGS = 6V
(A) (A)

80 VGS = 6V 40

VGS = 5V
60 VGS = 5V 30

VGS = 4V VGS = 4V
40 20

VGS = 3V VGS = 3V
20 10
VGS = 2V VGS = 2V

0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
VDS (V) VDS (V)

Tj = 25 °C Tj = 125 °C
Fig. 4. Output characteristics: drain current as a Fig. 5. Output characteristics: drain current as a
function of drain-source voltage; typical values function of drain-source voltage; typical values
aaa-036231 aaa-036239
40 100
ID QOSS
(A) (nC)
TC=25° C
80
30

60

20

40
TC=125° C

10
20

0 0
0 1 2 3 4 5 6 0 100 200 300 400 500 600
VGS (V) VDS (V)

Freq. = 100 kHz


Fig. 6. Transfer characteristics; drain current as a
function of gate-source voltage; typical values Fig. 7. Output charge as a function of drain-source
voltage; typical values

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 6 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

aaa-036235 aaa-036234
3 10-4
VGS(th) IDSS
(V) (A)
TC = 125° C
2.5 10-5

2 10-6

1.5 10-7

TC = 25° C
1 10-8

0.5 10-9

0 10-10
-50 -25 0 25 50 75 100 125 150 0 100 200 300 400 500 600 700 800
Tj (° C) VDS (V)

VGS = VDS ; ID = 30.7 mA VGS = 0 V


Fig. 8. Gate-source threshold voltage as a function of Fig. 9. Drain-source current as a function of drain-
junction temperature source voltage; typical values
aaa-036233 aaa-036236
0.7 m 2.5
IG a
(A)

2
0.5 m

1.5

0.3 m
Drain open
1

0.1 m
0.5

-0.1 m 0
-7 -5 -3 -1 1 3 5 7 -50 -25 0 25 50 75 100 125 150
VGS (V) TJ (° C)

Ig reverse turn on by ESD unit


Fig. 10. Gate-source current as a function of gate-
source voltage; typical values Fig. 11. Normalized drain-source on-state resistance
factor as a function of junction temperature

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 7 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

aaa-036509 aaa-036224
200 0.25
RDSon RDS(on)
(mΩ) 2.0 V (Ω) ID = 2A
3.0 V
160 ID = 4A
4.0 V 0.2 ID = 6A
ID = 8A
ID = 10A
120
5.0 V
0.15

80

VGS = 6.0 V
0.1
40

0 0.05
0 10 20 30 40 50 60 70 80 1 2 3 4 5 6
ID (A) VGS (V)

Tj = 25 °C T j = 25 °C
Fig. 12. Drain-source on-state resistance as a function Fig. 13. Drain-source on-state resistance as a function
of drain current ; typical values of gate-source voltage; typical values
aaa-036225
1
RDS(on)
VDS
(Ω) ID = 2A
0.8 ID = 4A
ID
ID = 6A
ID = 8A
ID = 10A
0.6
VGS(pl)

0.4
VGS(th)

VGS
0.2
QGS2

QGS1
0
1 2 3 4 5 6 QGS QGD
VGS (V) QG(tot)
Tj = 125 °C 003aaa508

Fig. 14. Drain-source on-state resistance as a function Fig. 15. Gate charge waveform definitions
of gate-source voltage; typical values

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 8 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

aaa-036241 aaa-036238
6 104
VGS CXSS
(V) (pF)
5
103
CISS
4
102
COSS
3

10
2 CRSS

1
1

0 10-1
0 1 2 3 4 5 6 10-1 1 10 102 103
QG (nC) VDS (V)

TJ = 25 °C ; ID = 8 A
Fig. 17. Input, output and reverse transfer capacitances
Fig. 16. Gate-source voltage as a function of gate as a function of drain-source voltage; typical
charge; typical values values
aaa-036240
16
EOSS L D
(µJ)
+
Drain Cdc Vdc
12 RG(ON)
PWM Gate
Driver DUT

RG(OFF)
8 Source

aaa-036287

VDS = 400 V; ID = 10 A; L = 318 μH; VGS = 6 V;


4
Ron = 10 Ω; Roff = 2 Ω
Fig. 19. Typical switching times with inductive load

0
0 100 200 300 400 500 600
VDS (V)

Freq. = 100 kHz


Fig. 18. COSS stored energy as a function of drain-
source voltage; typical values

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 9 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

VDS aaa-036227
0
90 %
ID
(A)
-10

-20

10 %
VGS
-30
tr tf
td(on) td(off) VGS = 0V
ton toff -40
aaa-032510 VGS = -2V

-50
Fig. 20. Switching time waveform VGS = -4V

VGS = -6V
-60
-10 -8 -6 -4 -2 0
VDS (V)

Tj = 25 °C
Fig. 21. Source current as a function of source-drain
voltage; typical values
aaa-036228 aaa-036229
0 0
ID ID
(A) (A) VGS = 0V
-10
VGS = 2V
-10
-20

-20 -30
VGS = 0V

VGS = -2V -40


-30
VGS = -4V VGS = 4V
-50

VGS = -6V VGS = 6V


-40 -60
-10 -8 -6 -4 -2 0 -10 -8 -6 -4 -2 0
VDS (V) VDS (V)

Tj = 125 °C Tj = 25 °C
Fig. 22. Source current as a function of source-drain Fig. 23. Source current as a function of source-drain
voltage; typical values voltage; typical values

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 10 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

aaa-036230
0
ID
(A)

-10 VGS = 0V

VGS = 2V

-20

-30 VGS = 4V

VGS = 6V

-40
-10 -8 -6 -4 -2 0
VDS (V)

Tj = 125 °C
Fig. 24. Source current as a function of source-drain voltage; typical values

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 11 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

11. Package outline


DFN8080-8: plastic thermal enhanced small outline package; no leads;
8 terminals; body: 8 × 8 × 0.9 mm SOT8074-1

e b (8×) v C A B
(6×) w C
L 1 4
(8×)

detail X

E1

e1 A
C
k
A2
8 5
seating plane y C A1
v C A B D1
(9×)

u C

terminal1
index area

B D A
0 5 mm
scale

Dimensions (mm are the original dimensions)

Unit A A1 A2 b D D1 E E1 e e1 k L y u v w

max 1.0 0.05 1.05 7.04 3.3 0.6


0.203 8 8 2 0.9 1
mm nom 0.9 0.02 1.00 6.94 3.2 0.5 0.1 0.1 0.1 0.05
REF BSC BSC BSC BSC REF
min 0.8 0.00 0.92 6.84 3.1 0.4
sot8074-1_po

Outline References European


Issue date
version IEC JEDEC JEITA projection
MO-229 23-03-03
SOT8074-1
compatible

Fig. 25. Package outline DFN8080-8 (SOT8074-1)

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 12 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

12. Soldering
Footprint information for reflow soldering of DFN8080-8 package SOT8074-1

8.6

7.5

7.35

3.025

1.65
3.7 3.55
0.9
1.35
9.4 (10×) 9.05

0.075

1.15 1.45
(10×) (8×)
3.925

1.35 1.2 1.05


(8×) (8×) (8×)

1.2 2
(8×) (6×)
1.35
(8×)

1.5
(8×)

recommended stencil thickness: 0.125 mm

occupied area solder resist

solder land solder paste

Dimensions in mm

Issue date 23-03-17 sot8074-1_fr

Fig. 26. Reflow soldering footprint for DFN8080-8 (SOT8074-1)

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Product data sheet 5 May 2023 13 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package
injury, death or severe property or environmental damage. Nexperia and its

13. Legal information suppliers accept no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
Data sheet status product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Document status Product Definition Applications — Applications that are described herein for any of these
[1][2] status [3] products are for illustrative purposes only. Nexperia makes no representation
Objective [short] Development This document contains data from or warranty that such applications will be suitable for the specified use
data sheet the objective specification for without further testing or modification.
product development. Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability for
Preliminary [short] Qualification This document contains data from
any assistance with applications or customer product design. It is customer’s
data sheet the preliminary specification.
sole responsibility to determine whether the Nexperia product is suitable
Product [short] Production This document contains the product and fit for the customer’s applications and products planned, as well as
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Customers should provide appropriate design and operating safeguards to
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[2] The term 'short data sheet' is explained in section "Definitions". or problem which is based on any weakness or default in the customer’s
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Definitions Limiting values — Stress above one or more limiting values (as defined in
Draft — The document is a draft version only. The content is still under the Absolute Maximum Ratings System of IEC 60134) will cause permanent
internal review and subject to formal approval, which may result in damage to the device. Limiting values are stress ratings only and (proper)
modifications or additions. Nexperia does not give any representations or operation of the device at these or any other conditions above those
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GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

Product data sheet 5 May 2023 14 / 15


Nexperia GAN080-650EBE
650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8 mm x 8 mm package

Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 4
10. Characteristics............................................................ 5
11. Package outline........................................................ 12
12. Soldering................................................................... 13
13. Legal information......................................................14

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Date of release: 5 May 2023

GAN080-650EBE All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved

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