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MC3359

Low Power Narrowband FM IF


. . . includes oscillator, mixer, limiting amplifier, AFC, quadrature
discriminator, op/amp, squelch, scan control, and mute switch. The MC3359 HIGH GAIN
is designed to detect narrowband FM signals using a 455 kHz ceramic filter
for use in FM dual conversion communications equipment. The MC3359 is LOW POWER
similar to the MC3357 except that the MC3359 has an additional limiting IF FM IF
stage, an AFC output, and an opposite polarity Broadcast Detector. The
MC3359 also requires fewer external parts. For low cost applications SEMICONDUCTOR
requiring VCC below 6.0 V, the MC3361BP,BD are recommended. For TECHNICAL DATA
applications requiring a fixed, tuned, ceramic quadrature resonator, use the
MC3357. For applications requiring dual conversion and RSSI, refer to these
devices; MC3335, MC3362 and MC3363.
P SUFFIX
• Low Drain Current: 3.6 mA (Typical) @ VCC = 6.0 Vdc PLASTIC PACKAGE
• Excellent Sensitivity: Input Limiting Voltage – CASE 707
– 3.0 dB = 2.0 µV (Typical)
• Low Number of External Parts Required
DW SUFFIX
• For Low Voltage and RSSI, use the MC3371 PLASTIC PACKAGE
CASE 751D
(SO–20L)

ORDERING INFORMATION Figure 2. Pin Connections and


Operating Functional Block Diagram
Device Temperature Range Package
RF
1 18

Oscillator
MC3359DW SO–20L Crystal Input

Mixer
TA = –30 to +70°C Osc.
2 17 Gnd
MC3359P Plastic DIP

Broadcast Detector
Mixer Audio
3 16
Output Mute
1.8 k
Scan
VCC 4 15
Control
Limiter
Limiter Squelch
5 14
Input Input
1.8 k

Filter
Decoupling 6 13
52 k Output
+
50 k Filter
Decoupling 7 – 12
Input
10 pF
Figure 1. Simplified Application in a Scanner Receiver Quadrature
8 11
Demod
Input Demodulator Output

Figure 2. Demodulator
9 10
Recovered
VCC = 6.0 Vdc Filter Audio

10.245 MHz 0.1 µF


1 18 10.7 MHz CASE 707
Input VCC = 6.0 Vdc
68 pF 51
2 17 NC 1 20 NC
51 k
220 pF
2 19 RF
Ceramic 3 16 Mute Input
Crystal
Filter
Osc.
3 18 Gnd
4 15 Scan Control

Type MC3359 Mixer


4 17
Audio
CFU 5 14 Squelch Input 68 k Output Mute
455 D 50 k
MC3359DW

+ Scan
120 k .47 µF
VCC 5 16
Control
6 13 Output
0.1 µF Inverting
Squelch Limiter Squelch
0.1 µF Sensitivity Input 6 15
0.1 µF Op Amp 390 k Input
7 12 0.001 µF
(Filter) 1N4148 Filter
Input Decoupling 7 14
0.001 µF 750 Output
68 k 8 11 Automatic
Filter
Frequency 18 k Decoupling 8 13
Control
Input
Quad
Coil 9 10 Recovered Audio Quadrature Demod
9 12
Toko 7.5 k
Audio
0.01 µF Input Output
0.01 µF Volume
Type 0.002 µF 10 k Demodulator
10 11
Recovered
Audio Filter Audio
7MC–8128Z 100 pF Out

CASE 751D

8–76 MOTOROLA ANALOG IC DEVICE DATA


MC3359

MAXIMUM RATINGS (TA = 25°C, unless otherwise noted)


Rating Pin Symbol Value Unit
Power Supply Voltage 4 VCC(max) 12 Vdc
Operating Supply Voltage Range 4 VCC 6 to 9 Vdc
Input Voltage (VCC q 6.0 Volts) 18 V18 1.0 Vrms
Mute Function 16 V16 – 0.7 to 12 Vpk
Junction Temperature – TJ 150 °C
Operating Ambient Temperature Range – TA – 30 to + 70 °C
Storage Temperature Range – Tstg – 65 to + 150 °C

ELECTRICAL CHARACTERISTICS (VCC = 6.0 Vdc, fo = 10.7 MHz, ∆f = ± 3.0 kHz, fmod = 1.0 kHz, 50 Ω source, TA = 25°C test circuit
of Figure 3, unless otherwise noted)
Characteristics Min Typ Max Units
Drain Current (Pins 4 and 8) Squelch Off – 3.6 6.0 mA
Squelch On – 5.4 7.0

Input for 20 dB Quieting – 8.0 – µVrms


Input for – 3.0 dB Limiting – 2.0 – µVrms
Mixer Voltage Gain (Pin 18 to Pin 3, Open) – 46 –
Mixer Third Order Intercept, 50 Ω Input – – 1.0 – dBm
Mixer Input Resistance – 3.6 – kΩ
Mixer Input Capacitance – 2.2 – pF
Recovered Audio, Pin 10 450 700 – mVrms
(Input Signal 1.0 mVrms)

Detector Center Frequency Slope, Pin 10 – 0.3 – V/kHz


AFC Center Slope, Pin 11, Unloaded – 12 – V/kHz
Filter Gain (test circuit of Figure 3) 40 51 – dB
Squelch Threshold, Through 10K to Pin 14 – 0.62 – Vdc
Scan Control Current, Pin 15 Pin 14 – High – 0.01 1.0 µA
Pin 14 – Low 2.0 2.4 – mA

Mute Switch Impedance Pin 14 – High – 5.0 10 Ω


Pin 16 to Ground Pin 14 – Low 1.5 – MΩ

Figure 3. Test Circuit


VCC
10.245 MHz
0.1 µF Input
1 18 10.7 MHz
68
51
pF
2 17
Ceramic 220 pF
Filter 2.4 k Audio Gen.
3 16 0.7 Vp–p
muRata
CFU455D +
or I
4 15
Kyocera
KBF455P–20A
5 14 Squelch Input
10 k

6 13 Op Amp Output
0.1 µF 1.0 M
0.1 µF
1.0 k
7 12 Op Amp Input
1.0 µF
68 k
8 11 AFC Output
Lp = 1.0 mH
Cp = 120 pF
Rp = 100 kΩ 9 10 Audio Output
7.5 k 0.002 µF
100 pF

MOTOROLA ANALOG IC DEVICE DATA 8–77


MC3359

Figure 4. Mixer Voltage Gain Figure 5. Limiting IF Frequency Response


400 0
Input po = 10.7 MHz VCC = 9.0 V
Output p0 = 455 kHz IF Output
200 – 10
Output taken at
OUTPUT, 1.8 KΩ [mVrms]

INPUT LEVEL, 50 Ω [dBm]


Pin 3 with filter

RELATIVE OUTPUT [dB]


100 VCC = 6.0 V – 20 Response Taken on
removed (open) a special prototype.
60 – 30
40 Terminals not
available on
– 40 standard device.
20
– 50
10 IF Input for – 3 dB LImiting
– 60
6.0
100 µV
4.0 – 70
0.04 0.1 1.0 10 40 0.1 1.0 10 100
INPUT, 50 Ω (mVrms) FREQUENCY [MHz]

Figure 6. Mixer Third Order


Intermodulation Performance Figure 7. Detector and AFC Responses
20 8.0
VCC = 6.0 Vdc
10 7.0
Output taken at AFC Output Pin 11
6.0
OUTPUT, 1.8 K Ω [dBm]

0 Pin 3 with filter


removed
– 10 VCC = 6.0 Vdc
OUTPUT [Vdc] 5.0

– 20 4.0
Desired Products
– 30 3.0
Detector Output Pin 10
– 40 2.0
– 50 1.0
3rd Order IM Products
– 60 0
– 90 – 80 – 70 – 60 – 50 – 40 – 30 – 20 – 10 0 10 – 10 – 8.0 – 6.0 – 4.0 – 2.0 0 2.0 4.0 6.0 8.0 10
INPUT, 50 Ω [dBm] RELATIVE FREQUENCY [kHz]

Figure 8. Relative Mixer Gain Figure 9. Overall Gain, Noise, and AM Rejection
10 10

0 0
S+N ± 3 KHz FM
RELATIVE OUTPUT [dB]

– 10 – 10
RELATIVE GAIN [dB]

Derived using optimum L/C 25°C


– 20 oscillator values and holding – 20 75°C
IF frequency at 455 kHz VCC = 6.0 Vdc
– 30 – 30
S + N (30% AM)
– 40 – 40
N
– 50 – 50

– 60 – 60
0.1 1.0 10 100 0.001 0.01 0.1 1.0 10 100
FREQUENCY [MHz] INPUT [mVrms]

8–78 MOTOROLA ANALOG IC DEVICE DATA


MC3359

Figure 10. Output Components of Signal, Figure 11. Audio Output and Total Current
Noise, and Distortion Drain versus Supply Voltage
10 8.0 0.8
S+N+D 7.0 0.7
0
f o = 10.7 MHz

SUPPLY CURRENT (mAdc)


6.0 Audio Output 0.6
RELATIVE OUTPUT [dB]

AUDIO OUTPUT (Vrms)


"
– 10 f m = 1 kHz
∆f = 3.0 kHz 5.0 0.5
– 20 Test circuit of ICC, Mute On
Figure 3. 4.0 0.4
– 30 N+D
3.0 0.3
ICC, Mute Off
– 40
2.0 0.2
N
– 50 1.0 0.1

– 60 0 0
0.001 0.01 0.1 1.0 10 100 4.0 5.0 6.0 7.0 8.0 9.0
INPUT [mVrms] VCC, SUPPLY VOLTAGE (Vdc)

Figure 12. L/C Oscillator, Temperature and


Power Supply Sensitivity Figure 13. Op Amp Gain and Phase Response
VCC, SUPPLY VOLTAGE [Vdc]
5.8 5.9 6.0 6.1 6.2
10.706 70
1.0 M 1.0 M

10.704 60 0.1 µF 180


1.0 K
13
10.702 1.0 12
50 150
FREQUENCY [MHz]

Vref
Gain

PHASE [degrees]
10.700 Phase USE CIRCUIT ABOVE
40 120
GAIN [dB]

FOR OPEN LOOP GAIN


10.698 AND PHASE (SOLID LINES)

VCC 30 90
10.696
20 DOTTED CURVES TAKEN 60
10.694 Temp WITH CIRCUIT VALUES
OF FIGURE 3.
10.692 10 30
VCC = 6.0 Vdc
10.690 0 0
20 30 40 50 60 70 1.0 K 10 K 100 K 1.0 M 10 M
AMBIENT TEMPERATURE [°C] FREQUENCY [Hz]

Figure 14. L/C Oscillator Recommended


Component Values Figure 15. The Op Amp as a Bandpass Filter

1000 10 1.0
VCC 7.0
0.001 µF VCC
700 C1
C1
R3
390 K
6.0 V

500 L 5.0 Vin


0.001 µF
– 13

L 1 4.0 0.8 GIVEN fo = CENTER FREQUENCY 0.17


Vrms
R1
18 K R2
12
+ Vout
300 C4 3.0 A(fo) = GAIN AT CENTER FREQUENCY 750

+
Vref
Q
2
CAPACITANCE [pF]

200 C5 2.0 R3
INDUCTANCE [µ H]

p fo C1
OUTPUT [Vrms]

C5 0.6
R1 + 2 R3
A(f )
100 C4 1.0 o

70 0.7 0.4 R2 + 4Q R1R1 R3* R3


2
50 0.5
30 0.3
0.2
20 0.2

10 0.1 0
5.0 7.0 10 20 30 50 70 100 1.0 2.0 5.0 10 20 50 100
OSCILLATOR FREQUENCY [MHz] FREQUENCY [kHz]

MOTOROLA ANALOG IC DEVICE DATA 8–79


8–80
Figure 16. Representative Schematic Diagram Figure 16.

3 12 13 14 4

7k 7k 1.8 k
Q77 10 k Q60
5k 3.5 k 50 k 20 k
Q1 Q7 Q64
1 6 pF 6 pF Q75
Q2 Q15 Q16 100 k
Q73
15 k Q65

2 Q3 Q4 Q5 Q6
Q71 20 k 5k 15
20 k
Q66
50 k
18 3.6 k Q70
16
Q71
Q8 Q63
Q11
Q67 5k
Q9 Q10 Q12 Q76
Q68
Q69
Q13
Q61
Q14
33 k 33 k 33 k 3.5 k 33 k 33 k 15 k Q62 7k 50 k 2.5 k 750 Ω 50 k
MC3359

Oscillator – Mixer Op Amp Broadcast Detector

Limiting IF Amplifier Detector and AFC

Q17
1.6 k
1.6 k
1.6 k
1.6 k

1.6 k
1.6 k
100 k

Q22
Q37
Q45 Q48 Q46 Q59
10 pF Q47 11
Q18
100 k 10 k 10 k 10 k 10 k 10 k 10 k 10 k 10 k 10 k 10 k 10 k 10 k
Q39 Q50
Q49 10
Q40
Q19 Q36
Q35 Q41 Q42 Q51
9
Q20 Q25 Q27 Q29 Q31 Q33
5 Q52 Q55
Q56
33 k

Q26 Q28 Q30 Q32 Q34 Q43 Q44


7 1.8 k
Q23 Q24 Q53 Q54 Q58
50 k
Q21 10 Q57
10 k 33 k 33 k 33 k 33 k 33 k 10 k
1.6 k

1.6 k
1.6 k

33 k 5k
100 k

k
1.6 k

17

MOTOROLA ANALOG IC DEVICE DATA


MC3359

CIRCUIT DESCRIPTION limiting sensitivity of approximately 100 µV at Pin 5 and a


The MC3359 is a low–power FM IF circuit designed useful frequency range of about 5 MHz as shown in Figure 5.
primarily for use in voice–communication scanning receivers. The frequency limitation is due to the high resistance values
It is also finding a place in narrowband data links. in the IF, which were necessary to meet the low power
In the typical application (Figure 1), the mixer–oscillator requirement. The output of the limiter is internally connected
combination converts the input frequency (10.7 MHz) down to the quadrature detector, including the 10 pF quadrature
to 455 kHz, where, after external bandpass filtering, most of capacitor. Only a parallel L/C is needed externally from Pin 8
the amplification is done. The audio is recovered using a to VCC. A shunt resistance can be added to widen the peak
conventional quadrature FM detector. The absence of an separation of the quadrature detector.
input signal is indicated by the presence of noise above the The detector output is amplified and buffered to the audio
desired audio frequencies. This “noise band” is monitored by output, Pin 10, which has an output impedance of
an active filter and a detector. A squelch–trigger circuit approximately 300 Ω. Pin 9 provides a high impedance (50 k)
indicates the presence of noise (or a tone) by an output which point in the output amplifier for application of a filter or
can be used to control scanning. At the same time, an de–emphasis capacitor. Pin 11 is the AFC output, with high
internal switch is operated which can be used to mute the gain and high output impedance (1 M). If not needed, it
audio. should be grounded, or it can be connected to Pin 9 to double
the recovered audio. The detector and AFC responses are
APPLICATIONS INFORMATION shown in Figure 7.
The oscillator is an internally biased Colpitts type with the Overall performance of the MC3359 from mixer input to
collector, base, and emitter connections at Pin 4, 1 and 2, audio output is shown in Figure 9 and 10. The MC3359 can
respectively. The crystal is used in fundamental mode, also be operated in “single conversion” equipment; i.e., the
calibrated for parallel resonance at 32 pF load capacitance. mixer can be used as a 455 kHz amplifier. The oscillator is
In theory this means that the two capacitors in series should disabled by connecting Pin 1 to Pin 2. In this mode, the
be 32 pF, but in fact much larger values do not significantly overall performance is identical to the 10.7 MHz results of
affect the oscillator frequency, and provide higher oscillator Figure 9.
output. A simple inverting op amp is provided with an output at
The oscillator can also be used in the conventional L/C Pin 13 providing dc bias (externally) to the input at Pin 12,
Colpitts configuration without loss of mixer conversion gain. which is referred internally to 2.0 V. A filter can be made with
This oscillator is, of course, much more sensitive to voltage external impedance elements to discriminate between
and temperature as shown in Figure 12. Guidelines for frequencies. With an external AM detector, the filtered audio
choosing L and C values are given in Figure 14. signal can be checked for the presence of either noise above
The mixer is doubly balanced to reduce spurious the normal audio, or a tone signal.
responses. The mixer measurements of Figure 4 and 6 were The open loop response of this op amp is given in
made using an external 50 Ω source and the internal 1.8 k at Figure13. Bandpass filter design information is provided in
Pin 3. Voltage gain curves at several VCC voltages are shown Figure 15.
in Figure 4. The Third Order Intercept curves of Figure 6 are A low bias to Pin 14 sets up the squelch–trigger circuit so
shown using the conventional dBm scales. Measured power that Pin 15 is high, a source of at least 2.0 mA, and the audio
gain (with the 50 Ω input) is approximately 18 dB but the mute (Pin 16) is open–circuit. If Pin 14 is raised to 0.7 V by
useful gain is much higher because the mixer input the noise or tone detector, Pin 15 becomes open circuit and
impedance is over 3 kΩ. Most applications will use a 330 Ω Pin 16 is internally short circuited to ground. There is no
10.7 MHz crystal filter ahead of the mixer. For higher hysteresis. Audio muting is accomplished by connecting Pin
frequencies, the relative mixer gain is given in Figure 8. 16 to a high–impedance ground–reference point in the audio
Following the mixer, a ceramic bandpass filter is path between Pin 10 and the audio amplifier. No dc voltage is
recommended. The 455 kHz types come in bandwidths from needed, in fact it is not desirable because audio “thump”
± 2 kHz to ± 15 kHz and have input and output impedances of would result during the muting function. Signal swing greater
1.5 k to 2.0 k. For this reason, the Pin 5 input to the 6 stage than 0.7 V below ground on Pin 16 should be avoided.
limiting IF has an internal 1.8 k resistor. The IF has a 3 dB

MOTOROLA ANALOG IC DEVICE DATA 8–81


Tape and Reel Options

In Brief . . .
Motorola offers the convenience of Tape and Reel Page
packaging for our growing family of standard integrated circuit Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2
products. Reels are available to support the requirements of Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4
both first and second generation pick–and–place equipment. Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.

MOTOROLA ANALOG IC DEVICE DATA 12–1


Tape and Reel Configurations

Mechanical Polarization

SOIC and Micro–8 PLCC DEVICES


DEVICES Typical
Typical

PIN 1

User Direction of Feed


User Direction of Feed

DPAK and D2PAK


DEVICES
Typical

User Direction of Feed

SOT–23 (5 Pin) SOT–89 (3 Pin) SOT–89 (5 Pin)


DEVICES DEVICES DEVICES
Typical Typical Typical

User Direction of Feed User Direction of Feed User Direction of Feed

12–2 MOTOROLA ANALOG IC DEVICE DATA


Tape and Reel Configurations (continued)

TO–92 Reel Styles


STYLE A
(Preferred) STYLE E

Carrier Strip
Carrier Strip
Rounded Flat Side
Side Adhesive Tape
Adhesive Tape

ÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ
Feed
ÉÉÉÉÉÉÉ Feed ÉÉÉÉÉÉÉ
Rounded side of transistor and adhesive tape visible. Flat side of transistor and adhesive tape visible.

TO–92 Ammo Pack Styles


STYLE P
(Preferred) STYLE M

Adhesive Tape On Adhesive Tape On


Top Side Top Side

ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ
Feed Feed

ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ
Rounded Side Flat Side

ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ
Carrier Carrier
Strip Strip

Rounded side of transistor and Flat side of transistor and


Label adhesive tape visible. Label adhesive tape visible.

Style P ammo pack is equivalent to Styles A and B of reel pack Style M ammo pack is equivalent to Style E of reel
dependent on feed orientation from box. pack dependent on feed orientation from box.

TO–92 EIA Radial Tape in Fan Fold Box or On Reel

H2A H2A
H2B H2B

W2
H4 H5
T1
L1
H1
W1 W
L T

F1 T2
F2
P2 P2 D

P1
P

MOTOROLA ANALOG IC DEVICE DATA 12–3


Tape and Reel Information Table

Tape
p Width Devices(1) Reel Size Device
Package (mm) per Reel (inch) Suffix
SO–8, SOP–8 12 2,500 13 R2
SO–14 16 2,500 13 R2
SO–16 16 2,500 13 R2
SO–16L, SO–8+8L WIDE 16 1,000 13 R2
SO–20L WIDE 24 1,000 13 R2
SO–24L WIDE 24 1,000 13 R2
SO–28L WIDE 24 1,000 13 R2
SO–28L WIDE 32 1,000 13 R3
Micro–8 12 2,500 13 R2
PLCC–20 16 1,000 13 R2
PLCC–28 24 500 13 R2
PLCC–44 32 500 13 R2
PLCC–52 32 500 13 R2
PLCC–68 44 250 13 R2
PLCC–84 44 250 13 R2
TO–226AA (TO–92)(2) 18 2,000 13 RA, RE, RP, or RM
(Ammo Pack) only
DPAK 16 2,500 13 RK
D2PAK 24 800 13 R4
SOT–23 (5 Pin) 8 3,000 7 TR
SOT–89 (3/5 Pin) 12 1,000 7 T1
(1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
(2) Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.

12–4 MOTOROLA ANALOG IC DEVICE DATA


Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type Package Code MPQ
PLCC
Case 775 0802 1000/reel
Case 776 0804 500/reel
Case 777 0801 500/reel
SOIC
Case 751 0095 2500/reel
Case 751A 0096 2500/reel
Case 751B 0097 2500/reel
Case 751G 2003 1000/reel
Case 751D 2005 1000/reel
Case 751E 2008 1000/reel
Case 751F 2009 1000/reel
Micro–8
Case 846A – 2500/reel
TO–92
Case 29 0031 2000/reel
Case 29 0031 2000/Ammo Pack
DPAK
Case 369A – 2500/reel
D2PAK
Case 936 – 800/reel
SOT–23 (5 Pin)
Case 1212 – 3000/reel
SOT–89 (3 Pin)
Case 1213 – 1000/reel
SOT–89 (5 Pin)
Case 1214 – 1000/reel

MOTOROLA ANALOG IC DEVICE DATA 12–5


12–6 MOTOROLA ANALOG IC DEVICE DATA
Packaging Information

In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:

TJ(max) – TA
PD(TA) =
RθJA(Typ)
where:
PD(TA) = Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
TJ(max) = Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
See individual data sheets for TJ(max)
information.
TA = Maximum desired operating Ambient
Temperature
RθJA(Typ) = Typical Thermal Resistance Junction-to-
Ambient

MOTOROLA ANALOG IC DEVICE DATA 13–1


Case Outline Dimensions

LP, P, Z SUFFIX
CASE 29-04
Plastic Package NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
(TO-226AA/TO-92) Y14.5M, 1982.
ISSUE AD 2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
A IS UNCONTROLLED.
B 4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
R IN P AND BEYOND DIMENSION K MINIMUM.

P
L INCHES MILLIMETERS
F DIM MIN MAX MIN MAX
SEATING
PLANE K A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
1 C 0.125 0.165 3.18 4.19
2
3 D 0.016 0.022 0.41 0.55
F 0.016 0.019 0.41 0.48
D G 0.045 0.055 1.15 1.39
X X H 0.095 0.105 2.42 2.66
G J 0.015 0.020 0.39 0.50
H J K 0.500 ––– 12.70 –––
L 0.250 ––– 6.35 –––
V C N 0.080 0.105 2.04 2.66
P ––– 0.100 ––– 2.54
SECTION X–X R 0.115 ––– 2.93 –––
1 N V 0.135 ––– 3.43 –––

KC, T SUFFIX
CASE 221A-06
Plastic Package –T– SEATING
PLANE
ISSUE Y
C NOTES:
–B– F T 1. DIMENSIONING AND TOLERANCING PER ANSI
S Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
4 4 DIM MIN MAX MIN MAX
Q A A 0.560 0.625 14.23 15.87
U B 0.380 0.420 9.66 10.66
1 2 3 C 0.140 0.190 3.56 4.82
D 0.020 0.045 0.51 1.14
H
F 0.139 0.155 3.53 3.93
–Y– G 0.100 BSC 2.54 BSC
K
H ––– 0.280 ––– 7.11
J 0.012 0.045 0.31 1.14
1 K 0.500 0.580 12.70 14.73
2 R L 0.045 0.070 1.15 1.77
3
L N 0.200 BSC 5.08 BSC
J Q 0.100 0.135 2.54 3.42
G R 0.080 0.115 2.04 2.92
D 3 PL S 0.020 0.055 0.51 1.39
0.25 (0.010) M B M Y T 0.235 0.255 5.97 6.47
U 0.000 0.050 0.00 1.27
N

13–2 MOTOROLA ANALOG IC DEVICE DATA


TH SUFFIX
CASE 314A-03
Plastic Package SEATING NOTES:
–T– PLANE
ISSUE D 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
B C 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
–P–
Q E INTERCONNECT BAR (DAMBAR) PROTRUSION.
OPTIONAL DIMENSION D INCLUDING PROTRUSION SHALL
CHAMFER NOT EXCEED 0.043 (1.092) MAXIMUM.

INCHES MILLIMETERS
A DIM MIN MAX MIN MAX
U F A 0.572 0.613 14.529 15.570
L K B 0.390 0.415 9.906 10.541
C 0.170 0.180 4.318 4.572
D 0.025 0.038 0.635 0.965
E 0.048 0.055 1.219 1.397
F 0.570 0.585 14.478 14.859
1 G 0.067 BSC 1.702 BSC
5 G J 0.015 0.025 0.381 0.635
5X J
K 0.730 0.745 18.542 18.923
5X D S L 0.320 0.365 8.128 9.271
Q 0.140 0.153 3.556 3.886
0.014 (0.356) M T P M S 0.210 0.260 5.334 6.604
U 0.468 0.505 11.888 12.827

T, TV SUFFIX NOTES:
B C 1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 314B-05 Y14.5M, 1982.
Q –P– OPTIONAL
Plastic Package CHAMFER E 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
ISSUE J INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
A INCHES MILLIMETERS
U
S L DIM MIN MAX MIN MAX
W V A 0.572 0.613 14.529 15.570
F B 0.390 0.415 9.906 10.541
K C 0.170 0.180 4.318 4.572
D 0.025 0.038 0.635 0.965
E 0.048 0.055 1.219 1.397
F 0.850 0.935 21.590 23.749
1
G 0.067 BSC 1.702 BSC
5 H 0.166 BSC 4.216 BSC
J 0.015 0.025 0.381 0.635
5X J K 0.900 1.100 22.860 27.940
L 0.320 0.365 8.128 9.271
G 0.24 (0.610) M T H N 0.320 BSC 8.128 BSC
5X D Q 0.140 0.153 3.556 3.886
N S ––– 0.620 ––– 15.748
0.10 (0.254) M T P M U 0.468 0.505 11.888 12.827
V ––– 0.735 ––– 18.669
SEATING
–T– PLANE W 0.090 0.110 2.286 2.794

–Q– B SEATING
T SUFFIX –T– PLANE
CASE 314C–01
Plastic Package C
ISSUE A E NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
A Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
1 2 3 4 5 DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.

INCHES MILLIMETERS
L DIM MIN MAX MIN MAX
1
A 0.610 0.625 15.59 15.88
5 K B 0.380 0.420 9.65 10.67
C 0.160 0.190 4.06 4.83
D 0.020 0.040 0.51 1.02
E 0.035 0.055 0.89 1.40
G 0.067 BSC 1.702 BSC
J 0.015 0.025 0.38 0.64
K 0.500 ––– 12.70 –––
G L 0.355 0.370 9.02 9.40
Q 0.139 0.147 3.53 3.73
D 5 PL

0.356 (0.014) M T Q M
J

MOTOROLA ANALOG IC DEVICE DATA 13–3


T, T1 SUFFIX
–T– SEATING
CASE 314D-03 PLANE
Plastic Package C NOTES:
ISSUE D –Q– 1. DIMENSIONING AND TOLERANCING PER ANSI
B E Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
U 3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
A
INCHES MILLIMETERS
L DIM MIN MAX MIN MAX
1 2 3 4 5 A 0.572 0.613 14.529 15.570
B 0.390 0.415 9.906 10.541
K C 0.170 0.180 4.318 4.572
D 0.025 0.038 0.635 0.965
E 0.048 0.055 1.219 1.397
S G 0.067 BSC 1.702 BSC
H 0.087 0.112 2.210 2.845
12
3 J 0.015 0.025 0.381 0.635
45 K 1.020 1.065 25.908 27.051
L 0.320 0.365 8.128 9.271
G J Q 0.140 0.153 3.556 3.886
U 0.105 0.117 2.667 2.972
D 5 PL H S 0.543 0.582 13.792 14.783

0.356 (0.014) M T Q M

DT-1 SUFFIX
CASE 369-07
Plastic Package B C NOTES:
(DPAK) 1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE K V R E Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
4 DIM MIN MAX MIN MAX
4 A 0.235 0.250 5.97 6.35
A B 0.250 0.265 6.35 6.73
1 2 3 C 0.086 0.094 2.19 2.38
D 0.027 0.035 0.69 0.88
S E 0.033 0.040 0.84 1.01
F 0.037 0.047 0.94 1.19
–T– G 0.090 BSC 2.29 BSC
1
2
3
SEATING K H 0.034 0.040 0.87 1.01
PLANE
J 0.018 0.023 0.46 0.58
K 0.350 0.380 8.89 9.65
R 0.175 0.215 4.45 5.46
J S 0.050 0.090 1.27 2.28
F V 0.030 0.050 0.77 1.27
H
D 3 PL
G 0.13 (0.005) M T

DT SUFFIX
CASE 369A-13 NOTES:
Plastic Package –T– SEATING 1. DIMENSIONING AND TOLERANCING PER ANSI
PLANE Y14.5M, 1982.
(DPAK) 2. CONTROLLING DIMENSION: INCH.
ISSUE Y B C
INCHES MILLIMETERS
V R E DIM MIN MAX MIN MAX
A 0.235 0.250 5.97 6.35
4 B 0.250 0.265 6.35 6.73
4 C 0.086 0.094 2.19 2.38
Z D 0.027 0.035 0.69 0.88
1 A E 0.033 0.040 0.84 1.01
S F 0.037 0.047 0.94 1.19
3 1 2 3 G 0.180 BSC 4.58 BSC
U H 0.034 0.040 0.87 1.01
K J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L 0.090 BSC 2.29 BSC
F J R 0.175 0.215 4.45 5.46
L S 0.020 0.050 0.51 1.27
H U 0.020 ––– 0.51 –––
V 0.030 0.050 0.77 1.27
D 2 PL Z 0.138 ––– 3.51 –––
G 0.13 (0.005) M T

13–4 MOTOROLA ANALOG IC DEVICE DATA


DP1, N, P, P1 SUFFIX
CASE 626-05 8 5
NOTES:
Plastic Package 1. DIMENSION L TO CENTER OF LEAD WHEN
ISSUE K –B– FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
1 4 SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

F MILLIMETERS INCHES
DIM MIN MAX MIN MAX
NOTE 2 –A– A 9.40 10.16 0.370 0.400
L B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
8 G 2.54 BSC 0.100 BSC
C H 0.76 1.27 0.030 0.050
1 J 0.20 0.30 0.008 0.012
–T– J K 2.92 3.43 0.115 0.135
L 7.62 BSC 0.300 BSC
SEATING N M ––– 10_ ––– 10_
PLANE
M N 0.76 1.01 0.030 0.040
D K
H G
0.13 (0.005) M T A M B M

N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package NOTES:
ISSUE L 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
14 8 MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
B FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
1 7 FLASH.
4. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
A DIM MIN MAX MIN MAX
A 0.715 0.770 18.16 19.56
F L B 0.240 0.260 6.10 6.60
14
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
1
F 0.040 0.070 1.02 1.78
C G 0.100 BSC 2.54 BSC
H 0.052 0.095 1.32 2.41
J J 0.008 0.015 0.20 0.38
N K 0.115 0.135 2.92 3.43
L 0.300 BSC 7.62 BSC
SEATING
PLANE K M 0_ 10_ 0_ 10_
H G D M N 0.015 0.039 0.39 1.01

DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
NOTES:
ISSUE R –A– 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F C L A 0.740 0.770 18.80 19.55
16 B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
1 D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.70 1.02 1.77
–T– PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
H K M J 0.008 0.015 0.21 0.38
J K 0.110 0.130 2.80 3.30
G L 0.295 0.305 7.50 7.74
D 16 PL
M 0_ 10 _ 0_ 10 _
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01

MOTOROLA ANALOG IC DEVICE DATA 13–5


B, P, P2, V SUFFIX
NOTES:
CASE 648C-03 1. DIMENSIONING AND TOLERANCING PER ANSI
Plastic Package –A– Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
(DIP–16) 3. DIMENSION L TO CENTER OF LEADS WHEN
ISSUE C FORMED PARALLEL.
16 9 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
–B– 5, 12 AND 13.
1 8
L INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.840 18.80 21.34
B 0.240 0.260 6.10 6.60
NOTE 5
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
16 E 0.050 BSC 1.27 BSC
1 C F 0.040 0.70 1.02 1.78
G 0.100 BSC 2.54 BSC
–T– J 0.008 0.015 0.20 0.38
SEATING N M K 0.115 0.135 2.92 3.43
PLANE L 0.300 BSC 7.62 BSC
K M 0_ 10_ 0_ 10_
E
F J 16 PL N 0.015 0.040 0.39 1.01
G
D 16 PL 0.13 (0.005) M T B S

0.13 (0.005) M T A S

P SUFFIX –A–
NOTES:
CASE 648E–01
R 1. DIMENSIONING AND TOLERANCING PER ANSI
Plastic Package Y14.5M, 1982.
(DIP–16) 2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
ISSUE O FORMED PARALLEL.
–B– 4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
1 8 5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
M 6. ROUNDED CORNER OPTIONAL.
P L INCHES MILLIMETERS
F
DIM MIN MAX MIN MAX
A 0.740 0.760 18.80 19.30
B 0.245 0.260 6.23 6.60
C 0.145 0.175 3.69 4.44
16 J D 0.015 0.021 0.39 0.53
1 C F 0.050 0.070 1.27 1.77
–T– G 0.100 BSC 2.54 BSC
SEATING H 0.050 BSC 1.27 BSC
PLANE J 0.008 0.015 0.21 0.38
S K 0.120 0.140 3.05 3.55
L 0.295 0.305 7.50 7.74
H K M 0_ 10 _ 0_ 10 _
G P 0.200 BSC 5.08 BSC
D 13 PL R 0.300 BSC 7.62 BSC
S 0.015 0.035 0.39 0.88
0.25 (0.010) M T B S A S

P SUFFIX
CASE 649-03
Plastic Package P A NOTES:
ISSUE D 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
24 13 POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
L
Q FORMED PARALLEL.
B
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
1 12 A 31.50 32.13 1.240 1.265
B 13.21 13.72 0.520 0.540
M C 4.70 5.21 0.185 0.205
H J D 0.38 0.51 0.015 0.020
F 1.02 1.52 0.040 0.060
F C G 2.54 BSC 0.100 BSC
H 1.65 2.16 0.065 0.085
24 N J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
1
L 14.99 15.49 0.590 0.610
K M ––– 10 ––– 10 _
D N 0.51 1.02 0.020 0.040
G P 0.13 0.38 0.005 0.015
SEATING Q 0.51 0.76 0.020 0.030
PLANE

13–6 MOTOROLA ANALOG IC DEVICE DATA


A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
18 10 MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
B 2. DIMENSION L TO CENTER OF LEADS WHEN
1 9 FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.

A MILLIMETERS INCHES
DIM MIN MAX MIN MAX
L A 22.22 23.24 0.875 0.915
18 C B 6.10 6.60 0.240 0.260
C 3.56 4.57 0.140 0.180
1
D 0.36 0.56 0.014 0.022
F 1.27 1.78 0.050 0.070
N K G 2.54 BSC 0.100 BSC
H 1.02 1.52 0.040 0.060
F M J
D SEATING J 0.20 0.30 0.008 0.012
PLANE K 2.92 3.43 0.115 0.135
H G L 7.62 BSC 0.300 BSC
M 0_ 15_ 0_ 15 _
N 0.51 1.02 0.020 0.040

P SUFFIX
CASE 710-02 NOTES:
Plastic Package 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
ISSUE B CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
28
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
1
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

MILLIMETERS INCHES
28 15 DIM MIN MAX MIN MAX
A 36.45 37.21 1.435 1.465
B 13.72 14.22 0.540 0.560
B C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
1 14 F 1.02 1.52 0.040 0.060
G 2.54 BSC 0.100 BSC
L H 1.65 2.16 0.065 0.085
A C J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
N L 15.24 BSC 0.600 BSC
M 0_ 15_ 0_ 15_
N 0.51 1.02 0.020 0.040
J
H G F M
K
D
SEATING
PLANE

P SUFFIX
CASE 711-03
Plastic Package NOTES:
ISSUE C 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
40 BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
1 2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
40 21 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
B A 51.69 52.45 2.035 2.065
B 13.72 14.22 0.540 0.560
1 20 C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
A L G 2.54 BSC 0.100 BSC
C H 1.65 2.16 0.065 0.085
J 0.20 0.38 0.008 0.015
N K 2.92 3.43 0.115 0.135
L 15.24 BSC 0.600 BSC
M 0_ 15_ 0_ 15_
J N 0.51 1.02 0.020 0.040
K M
H G F D
SEATING
PLANE

MOTOROLA ANALOG IC DEVICE DATA 13–7


F, P, P-3 SUFFIX
CASE 724-03
Plastic Package NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
(NDIP–24) 24 2. DIMENSION L TO CENTER OF LEADS WHEN
ISSUE D FORMED PARALLEL.
1 3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
–A–
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
24 13
A 1.230 1.265 31.25 32.13
–B– B 0.250 0.270 6.35 6.85
1 12 C 0.145 0.175 3.69 4.44
L D 0.015 0.020 0.38 0.51
C E 0.050 BSC 1.27 BSC
F 0.040 0.060 1.02 1.52
G 0.100 BSC 2.54 BSC
J 0.007 0.012 0.18 0.30
–T– K NOTE 1
K 0.110 0.140 2.80 3.55
SEATING L 0.300 BSC 7.62 BSC
PLANE N M M 0_ 15_ 0_ 15_
E
N 0.020 0.040 0.51 1.01
G F J 24 PL

D 24 PL
0.25 (0.010) M T B M

0.25 (0.010) M T A M

H, P, DP SUFFIX NOTES:
CASE 738-03 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
Plastic Package –A– 2. CONTROLLING DIMENSION: INCH.
ISSUE E 3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
20 11 FLASH.
B INCHES MILLIMETERS
1 10 DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
L B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
C D 0.015 0.022 0.39 0.55
E 0.050 BSC 1.27 BSC
20 F 0.050 0.070 1.27 1.77
G 0.100 BSC 2.54 BSC
1 J 0.008 0.015 0.21 0.38
–T– K K 0.110 0.140 2.80 3.55
SEATING M L 0.300 BSC 7.62 BSC
PLANE M 0_ 15 _ 0_ 15_
N N 0.020 0.040 0.51 1.01
E
G F J 20 PL
0.25 (0.010) M T B M
D 20 PL
0.25 (0.010) M T A M

D, D1, D2 SUFFIX
CASE 751-05 D
NOTES:
A 1. DIMENSIONING AND TOLERANCING PER ASME
Plastic Package Y14.5M, 1994.
(SO-8, SOP-8) C 2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
ISSUE R 8 5
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
E H 0.25 M B M 5. DIMENSION B DOES NOT INCLUDE MOLD
1 PROTRUSION. ALLOWABLE DAMBAR
4 PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.

MILLIMETERS
8 B h X 45 _
e q DIM MIN MAX
1 A 1.35 1.75
A1 0.10 0.25
A
C B 0.35 0.49
SEATING C 0.18 0.25
PLANE D 4.80 5.00
E 3.80 4.00
0.10 L e 1.27 BSC
H 5.80 6.20
A1 B h 0.25 0.50
L 0.40 1.25
0.25 M C B S A S q 0_ 7_

13–8 MOTOROLA ANALOG IC DEVICE DATA


D SUFFIX
CASE 751A-03 NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Plastic Package Y14.5M, 1982.
(SO-14) 2. CONTROLLING DIMENSION: MILLIMETER.
–A– 3. DIMENSIONS A AND B DO NOT INCLUDE
ISSUE F MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
14 8 PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
–B– P 7 PL PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
1 7
0.25 (0.010) M B M
MAXIMUM MATERIAL CONDITION.
MILLIMETERS INCHES
14 DIM MIN MAX MIN MAX
1 R X 45 _ F A 8.55 8.75 0.337 0.344
G
B 3.80 4.00 0.150 0.157
C
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
–T– G 1.27 BSC 0.050 BSC
M J J 0.19 0.25 0.008 0.009
SEATING D 14 PL K K 0.10 0.25 0.004 0.009
PLANE
M 0_ 7_ 0_ 7_
0.25 (0.010) M T B S A S
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019

D SUFFIX –A–
CASE 751B-05 NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Plastic Package Y14.5M, 1982.
16 9
(SO-16) 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
ISSUE J MOLD PROTRUSION.
–B– P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
1 8
0.25 (0.010) M B S PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
16 MILLIMETERS INCHES
1 DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
K F B 3.80 4.00 0.150 0.157
R X 45 _
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
C F 0.40 1.25 0.016 0.049
–T– SEATING G 1.27 BSC 0.050 BSC
PLANE J 0.19 0.25 0.008 0.009
M J K 0.10 0.25 0.004 0.009
D 16 PL M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
0.25 (0.010) M T B S A S R 0.25 0.50 0.010 0.019

DW, FP SUFFIX –A– NOTES:


CASE 751D-04 1. DIMENSIONING AND TOLERANCING PER
Plastic Package 20 11 ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
(SO-20L, SO–20) 3. DIMENSIONS A AND B DO NOT INCLUDE
ISSUE E MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
–B– 10X P (0.006) PER SIDE.
0.010 (0.25) M B M 5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
1 10 DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
20X D J MILLIMETERS INCHES
DIM MIN MAX MIN MAX
0.010 (0.25) M T A S B S A 12.65 12.95 0.499 0.510
20 B 7.40 7.60 0.292 0.299
F
C 2.35 2.65 0.093 0.104
1 D 0.35 0.49 0.014 0.019
R X 45 _ F 0.50 0.90 0.020 0.035
G 1.27 BSC 0.050 BSC
C J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
–T– SEATING M 0_ 7_ 0_ 7_
PLANE P 10.05 10.55 0.395 0.415
18X G K R 0.25 0.75 0.010 0.029
M

MOTOROLA ANALOG IC DEVICE DATA 13–9


DW SUFFIX
CASE 751E-04 –A–
Plastic Package 24 13 NOTES:
(SO-24L, 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SOP (16+4+4)L) 2. CONTROLLING DIMENSION: MILLIMETER.
ISSUE E 3. DIMENSIONS A AND B DO NOT INCLUDE
–B– 12X P MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
0.010 (0.25) M B M
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
1 12 PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
24 24X D J
MILLIMETERS INCHES
1
0.010 (0.25) M T A S B S
DIM MIN MAX MIN MAX
A 15.25 15.54 0.601 0.612
F B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
R X 45 _ D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
C J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
–T– M 0_ 8_ 0_ 8_
SEATING M P 10.05 10.55 0.395 0.415
PLANE 22X G K R 0.25 0.75 0.010 0.029

DW SUFFIX
CASE 751F-04
NOTES:
Plastic Package 28 1. DIMENSIONING AND TOLERANCING PER
(SO-28L, SOIC–28) ANSI Y14.5M, 1982.
1 2. CONTROLLING DIMENSION: MILLIMETER.
ISSUE E 3. DIMENSION A AND B DO NOT INCLUDE
–A– MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
28 15
5. DIMENSION D DOES NOT INCLUDE DAMBAR
14X P PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
–B– 0.010 (0.25) M B M (0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
1 14 MILLIMETERS INCHES
DIM MIN MAX MIN MAX
M A 17.80 18.05 0.701 0.711
28X D B 7.40 7.60 0.292 0.299
R X 45 _ C 2.35 2.65 0.093 0.104
0.010 (0.25) M T A S B S D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
J 0.23 0.32 0.009 0.013
C K 0.13 0.29 0.005 0.011
–T– M 0_ 8_ 0_ 8_
26X G SEATING F P 10.01 10.55 0.395 0.415
PLANE R 0.25 0.75 0.010 0.029
K
J

DW SUFFIX –A– NOTES:


CASE 751G-02 1. DIMENSIONING AND TOLERANCING PER ANSI
16 9
Plastic Package Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
(SO-16L, SOP–16L, 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
SOP-8+8L) –B– 8X P PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
ISSUE A SIDE.
0.010 (0.25) M B M
5. DIMENSION D DOES NOT INCLUDE DAMBAR
1 8 PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
J MATERIAL CONDITION.
16X D
16 MILLIMETERS INCHES
0.010 (0.25) M T A S B S DIM MIN MAX MIN MAX
1
A 10.15 10.45 0.400 0.411
F B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
R X 45 _ F 0.50 0.90 0.020 0.035
G 1.27 BSC 0.050 BSC
J 0.25 0.32 0.010 0.012
C K 0.10 0.25 0.004 0.009
–T– M 0_ 7_ 0_ 7_
SEATING M P 10.05 10.55 0.395 0.415
14X G K PLANE R 0.25 0.75 0.010 0.029

13–10 MOTOROLA ANALOG IC DEVICE DATA


D SUFFIX
16
CASE 751K–01 NOTES:
Plastic Package 1 1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
(SO–16) 2 CONTROLLING DIMENSION: MILLIMETER.
ISSUE O –A– 3 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4 MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

S
16 9
SIDE.

B
5 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR

M
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN

0.25 (0.010)
M_ EXCESS OF THE D DIMENSION AT MAXIMUM
–B– P MATERIAL CONDITION.

MILLIMETERS INCHES
F DIM MIN MAX MIN MAX
1 8 A 9.80 10.00 0.368 0.393
G B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
R X 45 _ D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
C J 0.19 0.25 0.008 0.009
SEATING K 0.10 0.25 0.004 0.009
–T– PLANE M 0_ 7_ 0_ 7_
14 X D J P 5.80 6.20 0.229 0.244
K R 0.25 0.50 0.010 0.019
0.25 (0.010) M T A S B S

DW SUFFIX –A– NOTES:


CASE 751N–01 T 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
Plastic Package 2. CONTROLLING DIMENSION: MILLIMETER.
16 9
(SOP–16L) 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
ISSUE O 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
–B– P 0.010 (0.25) M B M
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
1 8 EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
16
J MILLIMETERS INCHES
1 13X D DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
0.010 (0.25) M T A S B S B 7.40 7.60 0.292 0.299
F C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
R X 45 _ G 1.27 BSC 0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
C M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
–T– R 0.25 0.75 0.010 0.029
S SEATING M S 2.54 BSC 0.100 BSC
K PLANE T 3.81 BSC 0.150 BSC
9X G

MOTOROLA ANALOG IC DEVICE DATA 13–11


CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C

Q NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
0.25 (0.010) M T A M 1 Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
–A– MILLIMETERS INCHES
U –C– DIM MIN MAX MIN MAX
V
M X A 22.40 23.00 0.873 0.897
B 6.40 6.60 0.252 0.260
S C 3.45 3.65 0.135 1.143
W D 0.40 0.55 0.015 0.021
E 9.35 9.60 0.368 0.377
E F 1.40 1.60 0.055 0.062
Y G 2.54 BSC 0.100 BSC
H 1.51 1.71 0.059 0.067
R J 0.360 0.400 0.014 0.015
B K 3.95 4.20 0.155 0.165
M 30 _BSC 30_BSC
1 9 N N 2.50 2.70 0.099 0.106
Q 3.15 3.45 0.124 0.135
–T– SEATING
K R 13.60 13.90 0.535 0.547
PLANE
0.25 (0.010) M T C M S 1.65 1.95 0.064 0.076
J U 22.00 22.20 0.866 0.874
F G H V 0.55 0.75 0.021 0.029
D 9 PL W 2.89 BSC 0.113 BSC
X 0.65 0.75 0.025 0.029
0.25 (0.010) M T A M Y 2.70 2.80 0.106 0.110

FN SUFFIX
CASE 775-02
NOTES:
Plastic Package 1. DATUMS –L–, –M–, AND –N– DETERMINED
(PLCC-20) WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
1 BODY AT MOLD PARTING LINE.
ISSUE C 2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
B 0.007 (0.180)M T L–M S N S
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
–N– Y BRK U 0.007 (0.180)M T L–M S N S Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
D 6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
–L– –M– Z DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
W GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
D 7. DIMENSION H DOES NOT INCLUDE DAMBAR
20 1 X G1 0.010 (0.250)S T L–M S N S PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
V VIEW D–D DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

INCHES MILLIMETERS
A 0.007 (0.180)M T L–M S N S DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
Z B 0.385 0.395 9.78 10.03
R 0.007 (0.180)M T L–M S N S C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
H 0.007 (0.180)M T L–M S N S
G 0.050 BSC 1.27 BSC
C H 0.026 0.032 0.66 0.81
E
J 0.020 ––– 0.51 –––
0.004 (0.100) K1 K 0.025 ––– 0.64 –––
G J –T– SEATING R 0.350 0.356 8.89 9.04
PLANE K U 0.350 0.356 8.89 9.04
VIEW S V 0.042 0.048 1.07 1.21
G1 F 0.007 (0.180)M T L–M S N S W 0.042 0.048 1.07 1.21
0.010 (0.250)S T L–M S N S X 0.042 0.056 1.07 1.42
VIEW S Y ––– 0.020 ––– 0.50
Z 2_ 10 _ 2_ 10 _
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

13–12 MOTOROLA ANALOG IC DEVICE DATA


FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D
1

B 0.007 (0.180) M T L–M S N S


Y BRK
–N– U 0.007 (0.180) M T L–M S N S

Z
–L– –M–

W
D
X G1 0.010 (0.250) S T L–M S N S

28 1 V
VIEW D–D

A 0.007 (0.180) M T L–M S N S


H 0.007 (0.180) M T L–M S N S
Z
R 0.007 (0.180) M T L–M S N S

C K1
E

0.004 (0.100)
G –T– SEATING K
J PLANE
F 0.007 (0.180) M T L–M S N S
G1 VIEW S
0.010 (0.250) S T L–M S N S VIEW S

NOTES: INCHES MILLIMETERS


1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS DIM MIN MAX MIN MAX
PLASTIC BODY AT MOLD PARTING LINE. A 0.485 0.495 12.32 12.57
2. DIMENSION G1, TRUE POSITION TO BE B 0.485 0.495 12.32 12.57
MEASURED AT DATUM –T–, SEATING PLANE. C 0.165 0.180 4.20 4.57
3. DIMENSIONS R AND U DO NOT INCLUDE E 0.090 0.110 2.29 2.79
MOLD FLASH. ALLOWABLE MOLD FLASH IS F 0.013 0.019 0.33 0.48
0.010 (0.250) PER SIDE. G 0.050 BSC 1.27 BSC
4. DIMENSIONING AND TOLERANCING PER H 0.026 0.032 0.66 0.81
ANSI Y14.5M, 1982. J 0.020 ––– 0.51 –––
5. CONTROLLING DIMENSION: INCH. K 0.025 ––– 0.64 –––
6. THE PACKAGE TOP MAY BE SMALLER THAN R 0.450 0.456 11.43 11.58
THE PACKAGE BOTTOM BY UP TO 0.012 U 0.450 0.456 11.43 11.58
(0.300). DIMENSIONS R AND U ARE
V 0.042 0.048 1.07 1.21
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY W 0.042 0.048 1.07 1.21
EXCLUSIVE OF MOLD FLASH, TIE BAR X 0.042 0.056 1.07 1.42
BURRS, GATE BURRS AND INTERLEAD Y ––– 0.020 ––– 0.50
FLASH, BUT INCLUDING ANY MISMATCH Z 2_ 10_ 2_ 10_
BETWEEN THE TOP AND BOTTOM OF THE G1 0.410 0.430 10.42 10.92
PLASTIC BODY. K1 0.040 ––– 1.02 –––
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

MOTOROLA ANALOG IC DEVICE DATA 13–13


FN SUFFIX
CASE 777-02 B 0.007(0.180) M T L–M S N S

Plastic Package
U 0.007(0.180) M T L–M S N S
(PLCC) 1
ISSUE C
–N– D Z
Y BRK

–L– –M–

X G1
0.010 (0.25) S T L–M S N S
VIEW D–D
V
44 1 W D H 0.007(0.180) M T L–M S N S

A 0.007(0.180) M T L–M S N S

0.007(0.180) M T L–M S N S K1
R
Z
K
J
C E F
0.007(0.180) M T L–M S N S
G 0.004 (0.10)
–T– SEATING VIEW S
PLANE INCHES MILLIMETERS
G1 DIM MIN MAX MIN MAX
VIEW S A 0.685 0.695 17.40 17.65
0.010 (0.25) S T L–M S N S
B 0.685 0.695 17.40 17.65
C 0.165 0.180 4.20 4.57
NOTES: 6. THE PACKAGE TOP MAY BE SMALLER THAN E 0.090 0.110 2.29 2.79
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED THE PACKAGE BOTTOM BY UP TO 0.012 F 0.013 0.019 0.33 0.48
WHERE TOP OF LEAD SHOULDER EXITS (0.300). DIMENSIONS R AND U ARE G 0.050 BSC 1.27 BSC
PLASTIC BODY AT MOLD PARTING LINE. DETERMINED AT THE OUTERMOST H 0.026 0.032 0.66 0.81
2. DIMENSION G1, TRUE POSITION TO BE EXTREMES OF THE PLASTIC BODY J 0.020 ––– 0.51 –––
MEASURED AT DATUM –T–, SEATING PLANE. EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, K 0.025 ––– 0.64 –––
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD GATE BURRS AND INTERLEAD FLASH, BUT R 0.650 0.656 16.51 16.66
FLASH. ALLOWABLE MOLD FLASH IS 0.010 INCLUDING ANY MISMATCH BETWEEN THE U 0.650 0.656 16.51 16.66
(0.25) PER SIDE. TOP AND BOTTOM OF THE PLASTIC BODY.
V 0.042 0.048 1.07 1.21
4. DIMENSIONING AND TOLERANCING PER ANSI 7. DIMENSION H DOES NOT INCLUDE DAMBAR
W 0.042 0.048 1.07 1.21
Y14.5M, 1982. PROTRUSION OR INTRUSION. THE DAMBAR
5. CONTROLLING DIMENSION: INCH. PROTRUSION(S) SHALL NOT CAUSE THE H X 0.042 0.056 1.07 1.42
DIMENSION TO BE GREATER THAN 0.037 Y ––– 0.020 ––– 0.50
(0.940). THE DAMBAR INTRUSION(S) SHALL Z 2_ 10 _ 2_ 10 _
NOT CAUSE THE H DIMENSION TO BE G1 0.610 0.630 15.50 16.00
SMALLER THAN 0.025 (0.635). K1 0.040 ––– 1.02 –––

M SUFFIX NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
CASE 803C –A– Y14.5M, 1982.
PRELIMINARY 7 CONTROLLING DIMENSION: MILLIMETER.
–F– 8 DIMENSIONS A AND B DO NOT INCLUDE MOLD
Plastic Package PROTRUSION.
9 MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
20 11 SIDE.
10 DIMENSION D DOES NOT INCLUDE DAMBAR
–B– K PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
1 10 EXCESS OF THE D DIMENSION AT MAXIMUM
1
MATERIAL CONDITION.
J
20 G MILLIMETERS INCHES
S 10 PL DIM MIN MAX MIN MAX
A 12.35 12.80 0.486 0.504
0.13 (0.005) M B M N B 5.10 5.45 0.201 0.215
C 1.95 2.05 0.077 0.081
D 0.35 0.50 0.014 0.020
E ––– 0.81 ––– 0.032
F 12.40* 0.488*
G 1.15 1.39 0.045 0.055
H 0.59 0.81 0.023 0.032
C J 0.18 0.27 0.007 0.011
K 1.10 1.50 0.043 0.059
E L 0.10 (0.004) L 0.05 0.20 0.001 0.008
D 20 PL M M 0_ 10 _ 0_ 10 _
–T– SEATING
PLANE N 0.50 0.85 0.020 0.033
0.13 (0.005) M T B S A S
S 7.40 8.20 0.291 0.323
*APPROXIMATE

13–14 MOTOROLA ANALOG IC DEVICE DATA


TV SUFFIX
NOTES:
CASE 821C-04 1 1. DIMENSIONING AND TOLERANCING PER ANSI
Plastic Package Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
(15-Pin ZIP) 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
ISSUE D OR PROTRUSIONS.
15 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
SEATING EXCEED 0.010 (0.250).
–T– PLANE 6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
C DIMENSION. AT MAXIMUM MATERIAL CONDITION.
M E
B –Q– INCHES MILLIMETERS
DIM MIN MAX MIN MAX
U –P– A 0.684 0.694 17.374 17.627
B 0.784 0.792 19.914 20.116
K Y C 0.173 0.181 4.395 4.597
A V D 0.024 0.031 0.610 0.787
E 0.058 0.062 1.473 1.574
R G 0.050 BSC 1.270 BSC
H 0.169 BSC 4.293 BSC
S J 0.018 0.024 0.458 0.609
K 0.700 0.710 17.780 18.034
L 0.200 BSC 5.080 BSC
PIN 1 PIN 15 H M 0.148 0.151 3.760 3.835
R 0.416 0.426 10.567 10.820
G L S 0.157 0.167 3.988 4.242
15X D 15X J U 0.105 0.115 2.667 2.921
V 0.868 REF 22.047 REF
0.010 (0.254) M T P Q S 0.024 (0.610) M T Y 0.625 0.639 15.875 16.231

T SUFFIX
CASE 821D-03 NOTES:
Plastic Package 1. DIMENSIONING AND TOLERANCING PER ANSI
1 Y14.5M, 1982.
ISSUE C 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
Q –T– SEATING PROTRUSION. ALLOWABLE PROTRUSION SHALL
PLANE BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
–L– DIMENSION. AT MAXIMUM MATERIAL CONDITION.
B C
E
INCHES MILLIMETERS
–P– U DIM MIN MAX MIN MAX
A 0.681 0.694 17.298 17.627
B 0.784 0.792 19.914 20.116
A C 0.173 0.181 4.395 4.597
R D 0.024 0.031 0.610 0.787
E 0.058 0.062 1.473 1.574
K F 0.016 0.023 0.407 0.584
G 0.050 BSC 1.270 BSC
H 0.110 BSC 2.794 BSC
PIN 1 PIN 15 Y J 0.018 0.024 0.458 0.609
K 1.078 1.086 27.382 27.584
Q 0.148 0.151 3.760 3.835
R 0.416 0.426 10.567 10.820
G 7X F H U 0.110 BSC 2.794 BSC
Y 0.503 REF 12.776 REF
15X D 15X J
0.010 (0.254) M T P L S 0.024 (0.610) M T

MOTOROLA ANALOG IC DEVICE DATA 13–15


FTB SUFFIX
CASE 824D–01
Plastic Package 1
(TQFP–44)
ISSUE O

L
–T–, –U–, –Z–
–Z–

44 34

1 33

S
AE G

T–U

T–U
S

S
AE

AB Z

AC Z
–T– –U– DETAIL AA

V
L

0.05 (0.002) Z
M

M
0.20 (0.008)

0.20 (0.008)
PLATING F
BASE METAL

ÉÉÉÉ
ÇÇÇÇ
DETAIL AA

11

12 22
23 J
ÇÇÇÇ
ÉÉÉÉ D
N

A 0.20 (0.008) M AC T–U S Z S

0.20 (0.008) M AB T–U S Z S SECTION AE–AE


0.05 (0.002) T–U
S NOTES:
0.20 (0.008) M AC T–U S Z S 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
M DETAIL AD 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
–AB– INCLUDE MOLD MISMATCH AND ARE DETERMINED
C E
AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
0.10 (0.004) PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
–AC– (0.021).
H
Y
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 9.950 10.050 0.392 0.396
R B 9.950 10.050 0.392 0.396
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC 0.031 BSC
K H 0.050 0.150 0.002 0.006
W Q J 0.090 0.200 0.004 0.008
K 0.450 0.550 0.018 0.022
X L 8.000 BSC 0.315 BSC
M 12_REF 12_REF
VIEW AD N 0.090 0.160 0.004 0.006
Q 1_ 5_ 1_ 5_
R 0.100 0.200 0.004 0.008
S 11.900 12.100 0.469 0.476
V 11.900 12.100 0.469 0.476
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF
Y 12_REF 12_REF

13–16 MOTOROLA ANALOG IC DEVICE DATA


FB SUFFIX
CASE 824E–02 44
Plastic Package 1
(QFP)
ISSUE A

S
–L–, –M–, –N–
0.20 (0.008) M T L–M S N S

A
0.20 (0.008) M H L–M S N S

PIN 1 0.05 (0.002) L–M


IDENT J1 G

44 34 J1
1 33 VIEW Y
3 PL

S
S

N
N

S
S
F

T L–M
H L–M
PLATING

ÉÉÉ
ÇÇÇ
BASE METAL
–L– –M–

ÇÇÇ
ÉÉÉ
V
B

0.05 (0.002) N

M
M
J B1

0.20 (0.008)
0.20 (0.008)
D
VIEW Y
0.20 (0.008) M T L–M S N S

11 23 SECTION J1–J1
G 40X 44 PL
12 22

–N– NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
M AT DATUM PLANE –H–.
VIEW P 5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
C E –H– DATUM (0.010) PER SIDE. DIMENSIONS A AND B DO
PLANE INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
0.01 (0.004) 7. DIMENSION D DOES NOT INCLUDE DAMBAR
W –T–
PROTRUSION. DAMBAR PROTRUSION SHALL
Y NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).

MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 9.90 10.10 0.390 0.398
B 9.90 10.10 0.390 0.398
q1 C
D
2.00
0.30
2.21 0.079 0.087
0.45 0.0118 0.0177
E 2.00 2.10 0.079 0.083
R R1 F 0.30 0.40 0.012 0.016
G 0.80 BSC 0.031 BSC
J 0.13 0.23 0.005 0.009
DATUM –H– K 0.65 0.95 0.026 0.037
PLANE R R2 M 5_ 10 _ 5_ 10_
S 12.95 13.45 0.510 0.530
V 12.95 13.45 0.510 0.530
W 0.000 0.210 0.000 0.008
K Y 5_ 10 _ 5_ 10 _
A1 q2 A1 0.450 REF 0.018 REF
B1 0.130 0.170 0.005 0.007
C1 C1 1.600 REF 0.063 REF
R1 0.130 0.300 0.005 0.012
VIEW P R2 0.130 0.300 0.005 0.012
q1 5_ 10 _ 5_ 10 _
q2 0_ 7_ 0_ 7_

MOTOROLA ANALOG IC DEVICE DATA 13–17


FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
64 1

L
–Z–
64 49

1 48
–T–, –U–, –Z–

S
T–U

T–U
P

S
AB Z

AC Z
AE
L B V

Z
AE G

0.20 (0.008) M

M
0.050 (0.002)

0.20 (0.008)
–T– –U–
DETAIL AA
DETAIL AA

16 33

S
17 32

Z
BASE

ÉÉÉ
ÇÇ
A METAL N

S
0.20 (0.008) M AB T–U S Z S

ÉÉÉ
ÇÇ

AC T–U
0.050 (0.002) T–U

S
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
0.20 (0.008) M AC T–U Z F D

M
S S

0.20 (0.008)
C E
M ÉÉÉ J

–AB– SECTION AE–AE

0.10 (0.004)
H Y –AC–
DETAIL AD

MILLIMETERS INCHES
DIM MIN MAX MIN MAX
NOTES: A 9.950 10.050 0.392 0.396
1. DIMENSIONING AND TOLERANCING PER ANSI B 9.950 10.050 0.392 0.396
Y14.5M, 1982. C 1.400 1.600 0.055 0.063
Q 2. CONTROLLING DIMENSION: MILLIMETER. D 0.170 0.270 0.007 0.011
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF E 1.350 1.450 0.053 0.057
LEAD AND IS COINCIDENT WITH THE LEAD
F 0.170 0.230 0.007 0.009
WHERE THE LEAD EXITS THE PLASTIC BODY AT
R G 0.500 BSC 0.020 BSC
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED H 0.050 0.150 0.002 0.006
K AT DATUM PLANE –AC–. J 0.090 0.200 0.004 0.008
5. DIMENSIONS S AND V TO BE DETERMINED AT K 0.450 0.550 0.018 0.022
W SEATING PLANE –AC–. L 7.500 BSC 0.295 BSC
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD M 12° REF 12° REF
X PROTRUSION. ALLOWABLE PROTRUSION IS N 0.090 0.160 0.004 0.006
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO P 0.250 BSC 0.010 BSC
DETAIL AD INCLUDE MOLD MISMATCH AND ARE Q 1° 5° 1° 5°
DETERMINED AT DATUM PLANE –AB–. R 0.100 0.200 0.004 0.008
7. DIMENSION D DOES NOT INCLUDE DAMBAR S 11.900 12.100 0.469 0.476
PROTRUSION. DAMBAR PROTRUSION SHALL V 11.900 12.100 0.469 0.476
NOT CAUSE THE D DIMENSION TO EXCEED
W 0.200 REF 0.008 REF
0.350 (0.014).
X 1.000 REF 0.039 REF
Y 12° REF 12° REF

13–18 MOTOROLA ANALOG IC DEVICE DATA


DM SUFFIX
CASE 846A–02
Plastic Package
8
(Micro–8)
1
ISSUE C

NOTES:
–A– 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
K –B– EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.

PIN 1 ID MILLIMETERS INCHES


G DIM MIN MAX MIN MAX
D 8 PL A 2.90 3.10 0.114 0.122
0.08 (0.003) M T B S A S B 2.90 3.10 0.114 0.122
C ––– 1.10 ––– 0.043
D 0.25 0.40 0.010 0.016
G 0.65 BSC 0.026 BSC
SEATING H 0.05 0.15 0.002 0.006
–T– PLANE J 0.13 0.23 0.005 0.009
K 4.75 5.05 0.187 0.199
0.038 (0.0015) C L 0.40 0.70 0.016 0.028

J L
H

MOTOROLA ANALOG IC DEVICE DATA 13–19


FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52) 52 1
ISSUE C

39 27
40 26

S
S

D
D
B
DETAIL A

S
S

C A–B
H A–B
B
–A– –B–

0.05 (0.002) A–B


B

V
L

M
M
–A–, –B–, –D–

0.20 (0.008)
0.20 (0.008)
DETAIL A

52 14

1 13

–D–
B F
0.20 (0.008) M H A–B S D S

0.05 (0.002) A–B


V J N
0.20 (0.008) M C A–B S D S

BASE METAL

D
DETAIL C
C M_
E 0.02 (0.008) M C A–B S D S

DATUM
SECTION B–B
–H– PLANE

0.10 (0.004)
H –C– SEATING
G M_ PLANE

NOTES: MILLIMETERS INCHES


U_ 1. DIMENSIONING AND TOLERANCING PER ANSI DIM MIN MAX MIN MAX
Y14.5M, 1982. A 9.90 10.10 0.390 0.398
2. CONTROLLING DIMENSION: MILLIMETER. B 9.90 10.10 0.390 0.398
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF C 2.10 2.45 0.083 0.096
LEAD AND IS COINCIDENT WITH THE LEAD WHERE D 0.22 0.38 0.009 0.015
THE LEAD EXITS THE PLASTIC BODY AT THE E 2.00 2.10 0.079 0.083
BOTTOM OF THE PARTING LINE. F 0.22 0.33 0.009 0.013
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT G 0.65 BSC 0.026 BSC
R DATUM PLANE –H–. H ––– 0.25 ––– 0.010
5. DIMENSIONS S AND V TO BE DETERMINED AT
Q_ SEATING PLANE –C–.
J
K
0.13
0.65
0.23
0.95
0.005
0.026
0.009
0.037
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 L 7.80 REF 0.307 REF
(0.010) PER SIDE. DIMENSIONS A AND B DO M 5_ 10_ 5_ 10 _
T K INCLUDE MOLD MISMATCH AND ARE DETERMINED N 0.13 0.17 0.005 0.007
AT DATUM PLANE –H–. Q 0_ 7_ 0_ 7_
W 7. DIMENSION D DOES NOT INCLUDE DAMBAR R 0.13 0.30 0.005 0.012
X PROTRUSION. ALLOWABLE DAMBAR PROTRUSION S 12.95 13.45 0.510 0.530
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D T 0.13 ––– 0.005 –––
DIMENSION AT MAXIMUM MATERIAL CONDITION. U 0_ ––– 0_ –––
DETAIL C DAMBAR CANNOT BE LOCATED ON THE LOWER V 12.95 13.45 0.510 0.530
RADIUS OR THE FOOT. W 0.35 0.45 0.014 0.018
X 1.6 REF 0.063 REF

13–20 MOTOROLA ANALOG IC DEVICE DATA


FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
52 1

4X 4X TIPS
0.20 (0.008) H L–M N 0.20 (0.008) T L–M N –X–
X=L, M, N
52 40
CL
1 39
AB G

3X VIEW Y
AB
–L– –M–
B V VIEW Y

B1
V1

ÉÉÉ
BASE METAL
PLATING F

ÇÇÇ
ÉÉÉ
13 27
14 26

ÇÇÇ
ÉÉÉ
J U
–N–
A1
D
S1 0.13 (0.005) M T L–M S N S
A
SECTION AB–AB
S ROTATED 90_ CLOCKWISE

4X θ2
C
0.10 (0.004) T
–H–

–T–
SEATING 4X θ3
PLANE

VIEW AA

MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 10.00 BSC 0.394 BSC
NOTES: A1 5.00 BSC 0.197 BSC
0.05 (0.002) S 1. DIMENSIONING AND TOLERANCING PER ANSI
B 10.00 BSC 0.394 BSC
Y14.5M, 1982.
B1 5.00 BSC 0.197 BSC
2. CONTROLLING DIMENSION: MILLIMETER.
W 3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF C ––– 1.70 ––– 0.067
2XR R1 C1 0.05 0.20 0.002 0.008
θ1 LEAD AND IS COINCIDENT WITH THE LEAD
C2 1.30 1.50 0.051 0.059
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE. D 0.20 0.40 0.008 0.016
0.25 (0.010) 4. DATUMS –L–, –M– AND –N– TO BE DETERMINED E 0.45 0.75 0.018 0.030
C2
θ AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
F 0.22 0.35 0.009 0.014
G 0.65 BSC 0.026 BSC
GAGE PLANE SEATING PLANE –T–. J 0.07 0.20 0.003 0.008
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD K 0.50 REF 0.020 REF
PROTRUSION. ALLOWABLE PROTRUSION IS R1 0.08 0.20 0.003 0.008
K 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO S 12.00 BSC 0.472 BSC
C1 INCLUDE MOLD MISMATCH AND ARE
S1 6.00 BSC 0.236 BSC
E DETERMINED AT DATUM PLANE -H-.
U 0.09 0.16 0.004 0.006
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL V 12.00 BSC 0.472 BSC
Z V1 6.00 BSC 0.236 BSC
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
VIEW AA (0.018). MINIMUM SPACE BETWEEN W 0.20 REF 0.008 REF
PROTRUSION AND ADJACENT LEAD OR Z 1.00 REF 0.039 REF
PROTRUSION 0.07 (0.003). θ 0_ 7_ 0_ 7_
θ1 0_ ––– 0_ –––
θ2 12 _ REF 12 _ REF
θ3 5_ 13 _ 5_ 13 _

MOTOROLA ANALOG IC DEVICE DATA 13–21


B SUFFIX
CASE 858–01
Plastic Package
ISSUE O

42

–A– NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
42 22 3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
–B– FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).

INCHES MILLIMETERS
1 21 DIM MIN MAX MIN MAX
L A 1.435 1.465 36.45 37.21
B 0.540 0.560 13.72 14.22

C H C 0.155 0.200 3.94 5.08


D 0.014 0.022 0.36 0.56
F 0.032 0.046 0.81 1.17
G 0.070 BSC 1.778 BSC
H 0.300 BSC 7.62 BSC
–T– J 0.008 0.015 0.20 0.38
SEATING K 0.115 0.135 2.92 3.43
PLANE N L 0.600 BSC 15.24 BSC
F G M M 0_ 15 _ 0_ 15 _
K J 42 PL N 0.020 0.040 0.51 1.02
D 42 PL
0.25 (0.010) M T A S 0.25 (0.010) M T B S

B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O

56

–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
56 29 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
–B– FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)

INCHES MILLIMETERS
1 28 DIM MIN MAX MIN MAX
A 2.035 2.065 51.69 52.45
L B 0.540 0.560 13.72 14.22
C 0.155 0.200 3.94 5.08
C H D 0.014 0.022 0.36 0.56
E 0.035 BSC 0.89 BSC
F 0.032 0.046 0.81 1.17
G 0.070 BSC 1.778 BSC
H 0.300 BSC 7.62 BSC
–T– K J 0.008 0.015 0.20 0.38
SEATING K 0.115 0.135 2.92 3.43
PLANE
G N M L 0.600 BSC 15.24 BSC
F M 0_ 15 _ 0_ 15 _
E N 0.020 0.040 0.51 1.02
D 56 PL J 56 PL

0.25 (0.010) M T A S 0.25 (0.010) M T B S

13–22 MOTOROLA ANALOG IC DEVICE DATA


FB, FTB SUFFIX
CASE 873-01
Plastic Package 1
(TQFP–32)
ISSUE A

24 17

25 16

S
D

D
S

S
B

C A–B

H A–B
–A– –B– B P

0.05 (0.002) A–B


L B V

M
0.20 (0.008)

0.20 (0.008)
–A–, –B–, –D–
DETAIL A
DETAIL A
32 9

1 8
BASE
F
METAL
–D–
A
0.20 (0.008) M C A–B S D S

0.05 (0.002) A–B


J N
S
0.20 (0.008) M H A–B S D S
D
0.20 (0.008) M C A–B S D S

M DETAIL C
SECTION B–B
VIEW ROTATED 90 _CLOCKWISE

C E DATUM
–H– PLANE

–C– 0.01 (0.004)


SEATING H M
PLANE G

U MILLIMETERS INCHES
NOTES: DIM MIN MAX MIN MAX
1. DIMENSIONING AND TOLERANCING PER ANSI A 6.95 7.10 0.274 0.280
Y14.5M, 1982. B 6.95 7.10 0.274 0.280
T 2. CONTROLLING DIMENSION: MILLIMETER. C 1.40 1.60 0.055 0.063
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF D 0.273 0.373 0.010 0.015
LEAD AND IS COINCIDENT WITH THE LEAD WHERE E 1.30 1.50 0.051 0.059
THE LEAD EXITS THE PLASTIC BODY AT THE
–H– R BOTTOM OF THE PARTING LINE.
F 0.273 ––– 0.010 –––
G 0.80 BSC 0.031 BSC
DATUM 4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–. H ––– 0.20 ––– 0.008
PLANE
5. DIMENSIONS S AND V TO BE DETERMINED AT J 0.119 0.197 0.005 0.008
SEATING PLANE –C–. K 0.33 0.57 0.013 0.022
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD L 5.6 REF 0.220 REF
K PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 M 6_ 8_ 6_ 8_
Q
(0.010) PER SIDE. DIMENSIONS A AND B DO N 0.119 0.135 0.005 0.005
X INCLUDE MOLD MISMATCH AND ARE DETERMINED P 0.40 BSC 0.016 BSC
AT DATUM PLANE –H–. Q 5_ 10_ 5_ 10_
DETAIL C 7. DIMENSION D DOES NOT INCLUDE DAMBAR R 0.15 0.25 0.006 0.010
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION S 8.85 9.15 0.348 0.360
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D T 0.15 0.25 0.006 0.010
DIMENSION AT MAXIMUM MATERIAL CONDITION. U 5_ 11_ 5_ 11_
DAMBAR CANNOT BE LOCATED ON THE LOWER
V 8.85 9.15 0.348 0.360
RADIUS OR THE FOOT.
X 1.00 REF 0.039 REF

MOTOROLA ANALOG IC DEVICE DATA 13–23


T SUFFIX
CASE 894-03 NOTES:
1
Plastic Package 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
(23-Pin SZIP) 2. CONTROLLING DIMENSION: INCH.
ISSUE B 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
23
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
C 6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
E SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
B Y K A 0.684 0.694 17.374 17.627
–N– V B 1.183 1.193 30.048 30.302
L
M C 0.175 0.179 4.445 4.547
U P D 0.026 0.031 0.660 0.787
F
S E 0.058 0.062 1.473 1.574
F 0.165 0.175 4.191 4.445
G 0.050 BSC 1.270 BSC
H 0.169 BSC 4.293 BSC
J 0.014 0.020 0.356 0.508
A H K 0.625 0.639 15.875 16.231
R W L 0.770 0.790 19.558 20.066
M 0.148 0.152 3.760 3.861
–T– N 0.148 0.152 3.760 3.861
SEATING P 0.390 BSC 9.906 BSC
23X J PLANE
R 0.416 0.424 10.566 10.770
PIN 1 S 0.157 0.167 3.988 4.242
PIN 23 0.024 (0.610) M T U 0.105 0.115 2.667 2.921
G V 0.868 REF 22.047 REF
W 0.200 BSC 5.080 BSC
Y 0.700 0.710 17.780 18.034
23X D
0.010 (0.254) M T Q S N S

13–24 MOTOROLA ANALOG IC DEVICE DATA


FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D 48 1
P

4X

0.200 (0.008) AB T–U Z

DETAIL Y
9 A
A1
48 37
AE AE
1 36
–T– –U–

B V

B1
V1 –T–, –U–, –Z–
12 25
DETAIL Y

13 24

–Z–
S1
M_
TOP & BOTTOM
S R
4X

0.200 (0.008) AC T–U Z GAUGE PLANE


0.250 (0.010)
C E

G 0.080 (0.003) AC

–AB–
H W
–AC– Q_
AD DETAIL AD K
X

ÇÇÇ
BASE METAL
MILLIMETERS INCHES

ÉÉÉ
ÇÇÇ
NOTES: DIM MIN MAX MIN MAX
1. DIMENSIONING AND TOLERANCING PER ANSI A 7.000 BSC 0.276 BSC

ÉÉÉ
ÇÇÇ
Y14.5M, 1982. A1 3.500 BSC 0.138 BSC
N J 2. CONTROLLING DIMENSION: MILLIMETER. B 7.000 BSC 0.276 BSC
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF B1 3.500 BSC 0.138 BSC
LEAD AND IS COINCIDENT WITH THE LEAD C 1.400 1.600 0.055 0.063
WHERE THE LEAD EXITS THE PLASTIC BODY AT D 0.170 0.270 0.007 0.011
THE BOTTOM OF THE PARTING LINE. E 1.350 1.450 0.053 0.057
F 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED F 0.170 0.230 0.007 0.009
AT DATUM PLANE –AB–. G 0.500 BASIC 0.020 BASIC
D 5. DIMENSIONS S AND V TO BE DETERMINED AT
H 0.050 0.150 0.002 0.006
SEATING PLANE –AC–.
J 0.090 0.200 0.004 0.008
0.080 (0.003) M AC T–U S Z S 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS K 0.500 0.700 0.020 0.028
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO M 12 _REF 12 _REF
SECTION AE–AE N 0.090 0.160 0.004 0.006
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–. P 0.250 BASIC 0.010 BASIC
7. DIMENSION D DOES NOT INCLUDE DAMBAR Q 1_ 5_ 1_ 5_
PROTRUSION. DAMBAR PROTRUSION SHALL R 0.150 0.250 0.006 0.010
NOT CAUSE THE D DIMENSION TO EXCEED S 9.000 BSC 0.354 BSC
0.350 (0.014). S1 4.500 BSC 0.177 BSC
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE V 9.000 BSC 0.354 BSC
0.0076 (0.0003). V1 4.500 BSC 0.177 BSC
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF

MOTOROLA ANALOG IC DEVICE DATA 13–25


D2T SUFFIX
CASE 936–03
Plastic Package 1 2
ISSUE B 3 NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
TERMINAL 4 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
K A U 4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
S V AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
B H
F 1 2 3
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.386 0.403 9.804 10.236
J B 0.356 0.368 9.042 9.347
D C 0.170 0.180 4.318 4.572
G D 0.026 0.036 0.660 0.914
0.010 (0.254) M T E 0.045 0.055 1.143 1.397
–T– F 0.051 REF 1.295 REF
G 0.100 BSC 2.540 BSC
OPTIONAL
CHAMFER E H 0.539 0.579 13.691 14.707
J 0.125 MAX 3.175 MAX
K 0.050 REF 1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
C R 5 _ REF 5 _ REF
S 0.116 REF 2.946 REF
M L U 0.200 MIN 5.080 MIN
V 0.250 MIN 6.350 MIN

N P
R

D2T SUFFIX
CASE 936A–02
Plastic Package
(D2PAK) 1 NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE A 5 Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
TERMINAL 6 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
U MOUNTING SURFACE FOR TERMINAL 6.
A
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
V AND GATE PROTRUSIONS NOT TO EXCEED
K S 0.025 (0.635) MAXIMUM.

B
H
1 2 3 4 5 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.386 0.403 9.804 10.236
B 0.356 0.368 9.042 9.347
D C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
0.010 (0.254) M T E 0.045 0.055 1.143 1.397
G G 0.067 BSC 1.702 BSC
–T– H 0.539 0.579 13.691 14.707
OPTIONAL K 0.050 REF 1.270 REF
CHAMFER E L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R 5 _ REF 5 _ REF
S 0.116 REF 2.946 REF
U 0.200 MIN 5.080 MIN
C V 0.250 MIN 6.350 MIN
M L

N P
R

13–26 MOTOROLA ANALOG IC DEVICE DATA


DT, DTB SUFFIX 20

CASE 948E–02
Plastic Package NOTES:
1 1. DIMENSIONING AND TOLERANCING PER ANSI
(TSSOP–20) Y14.5M, 1982.
ISSUE A 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
20X K REF K (0.006) PER SIDE.

ÍÍÍÍ
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
0.15 (0.006) T U S 0.10 (0.004) M T U S V S K1 FLASH OR PROTRUSION. INTERLEAD FLASH OR

ÍÍÍÍ
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR

ÍÍÍÍ
20 11
J J1 PROTRUSION. ALLOWABLE DAMBAR
2X L/2 PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
B SECTION N–N 6. TERMINAL NUMBERS ARE SHOWN FOR
L –U– REFERENCE ONLY.
PIN 1 7. DIMENSION A AND B ARE TO BE DETERMINED
IDENT AT DATUM PLANE –W–.
N 0.25 (0.010)
1 10
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
M A 6.40 6.60 0.252 0.260
0.15 (0.006) T U S
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
A D 0.05 0.15 0.002 0.006
–V– N F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
F H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
DETAIL E J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
C K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
–W– M 0_ 8_ 0_ 8_
D G
H
0.100 (0.004)
–T– SEATING
PLANE DETAIL E

DTB SUFFIX
16 NOTES:
CASE 948F–01 1. DIMENSIONING AND TOLERANCING PER ANSI
Plastic Package 1 Y14.5M, 1982.
(TSSOP–16, TSSOP–16L) 2. CONTROLLING DIMENSION: MILLIMETER.
16X K REF 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
ISSUE O PROTRUSIONS OR GATE BURRS. MOLD FLASH
0.10 (0.004) M T U S V S OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.

ÇÇÇ
0.15 (0.006) T U S 4. DIMENSION B DOES NOT INCLUDE INTERLEAD
K FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
K1

ÉÉÉ
ÇÇÇ
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR

ÉÉÉ
ÇÇÇ
16 9 PROTRUSION. ALLOWABLE DAMBAR
2X L/2 J1 PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
B SECTION N–N 6. TERMINAL NUMBERS ARE SHOWN FOR
L –U– REFERENCE ONLY.
J 7. DIMENSION A AND B ARE TO BE DETERMINED
PIN 1 AT DATUM PLANE –W–.
IDENT.
1 8
N MILLIMETERS INCHES
0.25 (0.010) DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
0.15 (0.006) T U S M B 4.30 4.50 0.169 0.177
A C ––– 1.20 ––– 0.047
–V– D 0.05 0.15 0.002 0.006
N F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
F H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
DETAIL E K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
C M 0_ 8_ 0_ 8_

0.10 (0.004) –W–


–T– SEATING H
PLANE D G
DETAIL E

MOTOROLA ANALOG IC DEVICE DATA 13–27


DTB SUFFIX
CASE 948G–01 14
Plastic Package 1
(TSSOP–14)
ISSUE O

14X K REF NOTES:


1 DIMENSIONING AND TOLERANCING PER ANSI
0.10 (0.004) M T U S V S Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
0.15 (0.006) T U S 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
N (0.006) PER SIDE.
0.25 (0.010)
14 8 4 DIMENSION B DOES NOT INCLUDE INTERLEAD
2X L/2 FLASH OR PROTRUSION. INTERLEAD FLASH OR
M PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
L B 5 DIMENSION K DOES NOT INCLUDE DAMBAR
–U– N PROTRUSION. ALLOWABLE DAMBAR
PIN 1 PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
IDENT. F EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1 7 6 TERMINAL NUMBERS ARE SHOWN FOR
DETAIL E REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
0.15 (0.006) T U S
A K
MILLIMETERS INCHES

ÉÉÉ
ÇÇÇ
–V– K1 DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200

ÇÇÇ
ÉÉÉ
B 4.30 4.50 0.169 0.177
J J1 C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
SECTION N–N G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
C –W– K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
0.10 (0.004) L 6.40 BSC 0.252 BSC
M 0_ 8_ 0_ 8_
–T– SEATING D G H DETAIL E
PLANE

13–28 MOTOROLA ANALOG IC DEVICE DATA


DTB SUFFIX
CASE 948H–01
Plastic Package 24

ISSUE O
1

24X K REF

0.10 (0.004) M T U S V S

0.15 (0.006) T U S

24 13 NOTES:
2X L/2 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
B
L PROTRUSIONS OR GATE BURRS. MOLD FLASH
–U– OR GATE BURRS SHALL NOT EXCEED 0.15
PIN 1 (0.006) PER SIDE.
IDENT.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
1 12 PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
0.15 (0.006) T U S
A PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
–V– MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.

MILLIMETERS INCHES
DIM MIN MAX MIN MAX
C A 7.70 7.90 0.303 0.311
B 4.30 4.50 0.169 0.177
0.10 (0.004) C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
–T– SEATING D G H F 0.50 0.75 0.020 0.030
PLANE
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0_ 8_ 0_ 8_
–W–

DETAIL E

N 0.25 (0.010)
K

ÉÉÉ
ÇÇÇ
K1 M

ÇÇÇ
ÉÉÉ
N
J1
F
SECTION N–N
DETAIL E
J

MOTOROLA ANALOG IC DEVICE DATA 13–29


DTB SUFFIX
CASE 948J–01 8
Plastic Package 1
(TSSOP–8)
ISSUE O

8x K REF NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
0.10 (0.004) M T U S V S Y14.5M, 1982.
0.15 (0.006) T U S 2 CONTROLLING DIMENSION: MILLIMETER.
K 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH

ÉÉ
ÇÇÇ
K1 OR GATE BURRS SHALL NOT EXCEED 0.15
8 5 (0.006) PER SIDE.
2X L/2

ÇÇÇ
ÉÉ
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
J J1 FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
B PER SIDE.
L
–U– 5 DIMENSION K DOES NOT INCLUDE DAMBAR
PIN 1
SECTION N–N PROTRUSION. ALLOWABLE DAMBAR
IDENT. PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
1 4 EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
N 6 TERMINAL NUMBERS ARE SHOWN FOR
0.25 (0.010) REFERENCE ONLY.
0.15 (0.006) T U S
A 7 DIMENSION A AND B ARE TO BE DETERMINED
M AT DATUM PLANE –W–.
–V–
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
N A 2.90 3.10 0.114 0.122
B 4.30 4.50 0.169 0.177
F C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
DETAIL E F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
C –W– J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
0.10 (0.004)
G SEE DETAIL E K1 0.19 0.25 0.007 0.010
–T– SEATING D L 6.40 BSC 0.252 BSC
PLANE H M 0_ 8_ 0_ 8_

M SUFFIX
CASE 967–01
Plastic Package 20
(EIAJ–20)
1
ISSUE O NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
LE FLASH OR PROTRUSIONS AND ARE MEASURED
20 11
AT THE PARTING LINE. MOLD FLASH OR
Q1 PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
M_
E HE 4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
L DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
1 10 TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
Z DETAIL P DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
D BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
VIEW P MILLIMETERS INCHES
e A DIM MIN MAX MIN MAX
c A ––– 2.05 ––– 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.18 0.27 0.007 0.011
D 12.35 12.80 0.486 0.504
b A1 E 5.10 5.45 0.201 0.215
e 1.27 BSC 0.050 BSC
0.13 (0.005) M 0.10 (0.004) HE 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0_ 10 _ 0_ 10 _
Q1 0.70 0.90 0.028 0.035
Z ––– 0.81 ––– 0.032

13–30 MOTOROLA ANALOG IC DEVICE DATA


FTB SUFFIX
CASE 976–01 NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Plastic Package Y14.5M, 1982.
(TQFP–20) 20 1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
ISSUE O LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4X 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
9 AT DATUM PLANE –AB–.
0.200 (0.008) AB T–U Z 5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
A 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
A1 0.250 (0.010) PER SIDE. DIMENSIONS A AND B
20 16
DETAIL Y DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
1 15 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
–T– –U–

MILLIMETERS INCHES
V B DIM MIN MAX MIN MAX
A 4.000 BSC 0.157 BSC
A1 2.000 BSC 0.079 BSC
B 4.000 BSC 0.157 BSC
B1 B1 2.000 BSC 0.079 BSC
5 11 C 1.400 1.600 0.055 0.063
V1 D 0.170 0.270 0.007 0.011
E 1.350 1.450 0.053 0.057
F 0.170 0.230 0.007 0.009
G 0.650 BSC 0.026 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
6 10 K 0.500 0.700 0.020 0.028
M 12_REF 12 _REF
–Z– N 0.090 0.160 0.004 0.006
S1 P 0.250 BSC 0.010 BSC
Q 1_ 5_ 1_ 5_
S R 0.150 0.250 0.006 0.010
4X S 6.000 BSC 0.236 BSC
S1 3.000 BSC 0.118 BSC
0.200 (0.008) AB T–U Z V 6.000 BSC 0.236 BSC
V1 3.000 BSC 0.118 BSC
W 0.200 REF 0.008 REF
DETAIL AD X 1.000 REF 0.039 REF

ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
–AB– J N

–AC–
F
D
0.080 (0.003) AC
0.080 (0.003) S AC T–U S Z S
M_
TOP & BOTTOM SECTION AE–AE

R
–T–, –U–, –Z–

C E

AE AE

W
H Q_ GAUGE
PLANE
K
0.250 (0.010)
X
G
DETAIL AD DETAIL Y

MOTOROLA ANALOG IC DEVICE DATA 13–31


FTA SUFFIX
CASE 977–01
NOTES:
Plastic Package 1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE O 24 1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
4X 5. DIMENSIONS S AND V TO BE DETERMINED AT
9 DATUM PLANE –AC–.
0.200 (0.008) AB T–U Z 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
A 0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
A1 DETERMINED AT DATUM PLANE –AB–.
24 19
DETAIL Y 7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

1 18
–T– –U– MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 4.000 BSC 0.157 BSC
V B A1 2.000 BSC 0.079 BSC
B 4.000 BSC 0.157 BSC
B1 2.000 BSC 0.079 BSC
C 1.400 1.600 0.055 0.063
B1 D 0.170 0.270 0.007 0.011
6 13 E 1.350 1.450 0.053 0.057
V1 F 0.170 0.230 0.007 0.009
G 0.500 BSC 0.020 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M 12_REF 12 _REF
7 12 N 0.090 0.160 0.004 0.006
P 0.250 BSC 0.010 BSC
–Z– Q 1_ 5_ 1_ 5_
S1 R 0.150 0.250 0.006 0.010
S 6.000 BSC 0.236 BSC
S S1 3.000 BSC 0.118 BSC
4X V 6.000 BSC 0.236 BSC
V1 3.000 BSC 0.118 BSC
0.200 (0.008) AB T–U Z W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF

DETAIL AD

–T–, –U–, –Z–


–AB–

–AC– AE AE

M_ 0.080 (0.003) AC
TOP & BOTTOM

ÇÇÇÇ
ÉÉÉÉ
R G

ÉÉÉÉ
ÇÇÇÇ
C E DETAIL Y

ÉÉÉÉ
ÇÇÇÇ
J N

W F
H Q_ GAUGE
PLANE D
K
0.250 (0.010)
X
0.080 (0.003) S AC T–U S Z S
DETAIL AD
SECTION AE–AE

13–32 MOTOROLA ANALOG IC DEVICE DATA


N SUFFIX
CASE 1212–01
1
Plastic Package
(SOT–23)
ISSUE O

NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
A2 2. INTERPRET DIMENSIONS AND TOLERANCES
A D B PER ASME Y14.5M, 1994.
0.05 S A1 3. DATUM C IS A SEATING PLANE.

MILLIMETERS
5 4
DIM MIN MAX
E L A1 0.00 0.10
1 2 3
A2 1.00 1.30
E1 B 0.30 0.50
C 0.10 0.25
L1 B 5X
C D 2.80 3.00
C E 2.50 3.10
0.10 M C B S A S
E1 1.50 1.80
e e 0.95 BSC
e1 e1 1.90 BSC
L 0.20 –––
L1 0.45 0.75

H SUFFIX
CASE 1213–01 1
Plastic Package
(SOT–89)
ISSUE O

NOTES:
A D A2 1. DIMENSIONS ARE IN MILLIMETERS.
C 2. INTERPRET DIMENSIONS AND TOLERANCING
D1 B PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.

MILLIMETERS
DIM MIN MAX
E E1 A2 1.40 1.60
B 0.37 0.57
B1 0.32 0.52
L1 C 0.30 0.50
D 4.40 4.60
B D1 1.50 1.70
C
0.10 M C B S A S E ––– 4.25
E1 2.40 2.60
e 1.50 BSC
B1 2X
e1 3.00 BSC
e 0.10 M C B S A S L1 0.80 –––
e1

MOTOROLA ANALOG IC DEVICE DATA 13–33

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