BHARAT

ELECTRONICS

PROJECT
REPORT

SUBMITTED BY:

ROLL NO:

1
 CONTENTS

1 : CERTIFICATE
2 : ACKNOWLEDGEMENT
3 : PREFACE
4 : BHARAT ELECTRONICS INDUSTRY
5 : B E: SALES ANS SERVICES
6 : FORMATION OF UNIT
7 : PROJECT : ROTATION
8 : PROJECT : RADAR
9 : TRANSMITTER

2
 TO WHOM SO EVER IT MAY CONCERN

I certify that , student of B.Tech (Electronics and Communication) from

INDERPRASTHA ENGINEERING COLLEGE, GHAZIABAD has joined BEL,
Ghaziabad for six weeks industrial training and he has been constantly working under my
acknowledgement on the project assigned to him. He has worked on project RADAR
TRANSMITTER. His contribution was in Study & Testing of Transmitter.

This report accounts his experience and knowledge of the field he worked in. I have
verified the report and sanction it.

(Project Guide ) (Project Head)

3
 ACKNOWLEDGEMENT
I take this opportunity to express my sincere gratitude towards Training and placement
officer of my college for forwarding my training letter to Bharat Electronics, Ghaziabad
and also to Mr.B.K.Pant (Mgr.) HRD, Bharat Electronics, Ghaziabad for accepting my
letter and allowing me to complete my training in Bharat Electronics Limited.

I am extremely grateful to Mr. Jagdish Chand, (AGM, RADAR SBU), Mr. Dhyan Singh,
(Sr.DGM, RADAR SBU), Bharat Electronics, for permitting me to join CAR- RADAR
SBU.Further I would like to thank Ms Laxmi Chauhan, Mr. Ankur kumar for their time
to time guidance and help extended during each stage our project.

I am grateful to Mr. R.N. Tyagi, HRD to guide and help me throughout my project. It is
not without his help I could have been able to complete my training here. I would like to
express my deep satisfaction and gratitude for their support for their kind help extended
during the entire period of training.

Finally, I would like to thanks each and every member of BEL family for making me feel
comfortable and helping me in every possible manner.

PREFACE

4
The six month training is a part of our B.Tech, Electronics and Communication. Practical
Industrial Training mainly aims at making one aware of industrial environment; which
means that one gets to know the limitation, constraint and freedom under which an
engineer works. One also gets an opportunity to watch from close quarter that indicates
manager relation. This training mainly involves industrial and complete knowledge about
designing, assembling and manufacturing process of various equipments manufactured
by an industry.

During this six month period, as a student, there is a great opportunity of understanding
Industrial practices. Most of the theoretical knowledge that has been gained during our
course is useful only if it can be applied to production and services in the industry. The
learnt is applied, tested, verified and rectified. Apart from this the student gets an
opportunity to learn latest technology and is upgraded of the new trends immersing in the
industry of interest.

I had the opportunity to utilize my six month summer internship in BHARAT

ELECTRONICS LIMITED, GHAZIABAD [U.P.]. I was a part of the company’s new
venture CAR, which provided me a great deal of learning. My sphere of knowledge was
expanded both at technical and personal level. I not only got chance to work on Live
Project but also witnessed the related industrial processes and got acquainted to many of
the prevalent technologies.

5
 INTRODUCTION OF
BEL
BHARAT ELECTRONICS LIMITED
INDUSTRY

Bharat Electronics Limited (BEL) was established in 1954 as a Public Sector

Enterprise under the administrative control of Ministry of Defence as the fountain head to
manufacture and supply electronics components and equipment. BEL, with a noteworthy
history of pioneering achievements, has met the requirement of state-of-art professional
electronic equipment for Defence, broadcasting, civil Defence and telecommunications as
well as the component requirement of entertainment and medical X-ray industry. Over
the years, BEL has grown to a multi-product, multi-unit, and technology driven company
with track record of a profit earning PSU.
The company has a unique position in India of having dealt with all the generations
of electronic component and equipment. Having started with a HF receiver in
collaboration with T-CSF of France, the company's equipment designs have had a long
voyage through the hybrid, solid state discrete component to the state of art integrated
circuit technology. In the component arena also, the company established its own electron
valve manufacturing facility. It moved on to semiconductors with the manufacture of
germanium and silicon devices and then to the manufacture of Integrated circuits. To
keep in pace with the component and equipment technology, its manufacturing and
product assurance facilities have also undergone sea change. The design groups have
CADDs facility, the manufacturing has CNC machines and a Mass Manufacture Facility,
and Quality Control (QC) checks are preformed with multi-dimensional profile
measurement machines, Automatic testing machines, environmental labs to check
extreme weather and other operational conditions. All these facilities have been
established to meet the stringent requirements of MIL grade systems.
Today BEL's infrastructure is spread over nine locations with 29 production
divisions having ISO-9001/9002 accreditation. Product mix of the company is spread
over the entire Electro-magnetic (EM) spectrum ranging from tiny audio frequency
semiconductor to huge radar systems and X-ray tubes on the upper edge of the spectrum.
Its manufacturing units have special focus towards the product ranges like Defence
Communication, Radar's, Optical & Opto-electronics, Telecommunications, Sound and
Vision Broadcasting, Electronic Components, etc.
Besides manufacturing and supply of a wide variety of products, BEL offers a
variety of services like Telecom and Radar Systems Consultancy, Contract
Manufacturing, Calibration of Test & Measuring Instruments, etc. At the moment, the

6
company is installing MSSR radar at important airports under the modernization of
airports plan of National Airport Authority (NAA).
BEL has nurtured and built a strong in-house R&D base by absorbing technologies
from more than 50 leading companies worldwide and DRDO Labs for a wide range of
products. A team of more than 800 engineers is working in R&D. Each unit has its own
R&D Division to bring out new products to the production lines. Central Research
Laboratory (CRL) at Bangalore and Ghaziabad works as independent agency to
undertake contemporary design work on state-of-art and futuristic technologies. About
70% of BEL's products are of in-house design.
BEL was among the first Indian companies to manufacture computer parts and
peripherals under arrangement with International Computers India Limited (ICIL) in
1970s. BEL assembled a limited number of 1901 systems under the arrangement with
ICIL. However, following Government's decision to restrict the computer manufacture to
ECIL, BEL could not progress in its computer manufacturing plans. As many of its
equipment were microprocessor based, the company continued to develop computers
based application, both hardware and software. Most of its software requirements are in
real time. EMCCA, software intensive naval ships control and command system is
probably one of the first projects of its nature in India and Asia.
BEL has won a number of national and international awards for Import Substitution,
Productivity, Quality, Safety Standardization etc. BEL was ranked no.1 in the field of
Electronics and 46th overall among the top 1000 private and public sector undertakings in
India by the Business Standard in its special supplement "The BS 1000 (1997-98)". BEL
was listed 3rd among the Mini Ratanas (category II) by the Government of India, 49th
among Asia's top 100 Electronic Companies by the Electronic Business Asia and within
the top 100 worldwide Defence Companies by the Defence News, USA.

BEL has production units established at different parts of the country. The year of
establishment and location are as follows:

Serial Year of establishment Location

no.

7
1. 1954 Bangalore
2. 1972 Ghaziabad
3.
1979 Pune
4.
5. 1979 Taloja (Maharashtra)

6. 1984 Hyderabad
7.
1984 Panchkula (Haryana)
8.
9. 1985 Chennai

1985 Machhilipathnam
1986 (A.P.)
Kotdwara (U.K.)

Motto Mission and Objectives

8
 The passionate pursuit of excellence at BEL is reflected in a reputation with its
customers that can be described in its motto, mission and objectives:

CORPORATE MOTTO

"Quality, Technology and Innovation."

CORPORATE MISSION
To be the market leader in Defence Electronics and in other chosen fields and
products.

CORPORATE OBJECTIVES
 To become a customer-driven company supplying quality products at
competitive prices at the expected time and providing excellent customer
support.

 To achieve growth in the operations commensurate with the growth of

professional electronics industry in the country.

 To generate internal resources for financing the investments required for

modernization, expansion and growth for ensuring a fair return to the
investor.

 In order to meet the nation's strategic needs, to strive for self-reliance by

indigenization of materials and components.

 To retain the technological leadership of the company in Defence and other

chosen fields of electronics through in-house Research and development as
well as through Collaboration/Co-operation with Defence/National Research
Laboratories, International Companies, Universities and Academic
Institutions.

 To progressively increase overseas sales of its products and services.

 To create an organizational culture which encourages members of the

organization to realize their full potential through continuous learning on the
job and through other HRD initiatives?

9
Manufacturing Units
Bangalore (Karnataka)

BEL started its production activities in Bangalore in 1954 with 400W high
frequency (HF) transmitter and communication receiver for the Army. Since then, the
Bangalore Complex has grown to specialize in communication and Radar/Sonar Systems
for the Army, Navy and Air Force. BEL's in-house R&D and successful tie-ups with
foreign Defence companies and Indian Defence Laboratories has seen the development
and production of over 300 products in Bangalore alone. The Unit has now diversified
into manufacturing of electronic products for the civilian customers such as D.O.T.,
V.S.N.L., A.I.R. and Doordarshan, Meteorological Dept., I.S.R.O., Police, Civil
Aviation, and Railways. As an aid to Electorate, the unit has developed Electronic Voting
Machines that are produced at its Mass Manufacturing Facility (MMF).

Ghaziabad (Uttar Pradesh)

The second largest Unit at Ghaziabad was set up in 1974 to manufacture special
types of radar for the Air Defence Ground Environment Systems (Plan ADGES). The
Unit provides Communication Systems to the Defence Forces and Microwave
Communication Links to the various departments of the State and Central Govt. and other
users. The Unit's product range included Static and Mobile Radar, Tropo scatter
equipment, professional grade Antennae and Microwave components.

Pune (Maharashtra)

This Unit was started in 1979 to manufacture Image Converter Tubes.

Subsequently, Magnesium Manganese-dioxide Batteries, Lithium Sulphur Batteries and
X-ray Tubes/Cables were added to the product range. At the present the Unit
manufactures Laser Sub-unit for tank fire control systems and Laser Range Finders for
the Defence services.

Machilipatnam (Andhra Pradesh)

The Andhra Scientific Co. at Machilipatnam, manufacturing optics/Opto-

electronic equipment was integrated with BEL in 1983. The product line includes Passive
Night Vision Equipment, Binoculars, Binoculars and Goggles, Periscopes, Gun Sights,
Surgical Microscope and Optical Sights and Mussle Reference Systems for tank fire
control systems. The Unit has successfully diversified to making the Surgical Microscope
with zoom facilities.

To cater the growing needs of Defence Communications, this Unit was

established in 1985. Professional grade Radio-communication Equipment in VHF and
UHF ranges entirely developed by BEL and required by the Defence services are being
met from this Unit.

10
Chennai (Tamil Nadu)

In 1985, BEL established another Unit at Chennai to facilitate manufacture of

Gun Control Equipment required for the integration and installation in the Vijayanta
tanks. The Unit is now manufacturing Stabilizer Systems for T-72 tanks, Infantry Combat
Vehicles BMP-II; Commander's Panoramic Sights & Tank Laser Sights are among
others.

Kotdwar (Uttarakhand)

In 1986, BEL started a Unit at Kotdwara to manufacture Telecommunication

Equipment for both Defence and civilian

Customers Focus is being given on the requirement of the Department of

Telecommunications to manufacture Transmission and Switching Equipment.

Taloja (Maharashtra)

For the manufacture of B/W TV Glass bulbs, this plant was established in
collaboration with coming, France in 1986. The Unit is now fully mobilized to
manufacture 20" glass bulbs indigenously.

Hyderabad (Andhra Pradesh)

To coordinate with the major Defence R&D Laboratories located in Hyderabad,

DLRL, DRDL and DMRL, BEL established a unit at Hyderabad in 1986. Force
Multiplier Systems are manufactured here for the Defence services.

Joint Ventures

BE-Delft Electronics Limited

BE-Delft Electronics Limited, Pune, the first joint venture of the company with
Delft Instruments, Holland and UTI was established in the year 1990 for conducting
research, development and manufacture of Image Intensifier Tubes and associated high
voltage power supplies for use in military, security and commercial systems. Its products
include night vision goggles and binoculars, night vision weapon sights and low light
level input applications.

11
GE BE Private Limited

GE BE Private Limited, Bangalore, a JV with General Electric Medical Systems,

USA has been established in 1997-98 for manufacture of High End Rotating Anode
Medical Diagnostic X-ray tube called CT MAX, which is used in CT Scanners. The joint
venture unit will also establish a reloading facility for X-ray tubes and will also market
the conventional X-ray tubes made at Pune Unit of BEL. South East Asia markets are
addressed by this joint venture.

BEL- Multitone Private Limited

A joint venture between Bharat Electronics and Multitone Electronics Plc, UK has
also been established in Bangalore in 1997-98 to manufacture state-of-art Mobile
Communication for the workplace. Multitone invented paging in 1956 when it developed
the world's first system to serve the "life or death" environment of St. Thomas Hospital,
London. With the strength of Bharat Electronics in the Radio Communications field and
the technology of Multitone, in the field of Radio Paging, the joint venture company is in
a position to offer tailor made solution to the Mobile Communication needs at workplace
in various market segments.

12
Customer Profile & BEL Product Range
Defence
Army Tactical and Strategic Communication Equipment and
Systems, Secrecy Equipment, Digital Switches, Battlefield
Surveillance Radar, Air Defence and Fire Control Radar,
Opto-Electronic Instruments, Tank Fire Control Systems,
Stabilizer Systems, Stimulators and Trainers.
Navy Navigational, Surveillance, Fire Control Radar, IFF,
SONAR Systems, Torpedo Decoys, Display Systems, EW
Systems, Simulators, Communication Equipment and
Systems.
Air Force Surveillance and Tracking Raiders, Communication
Equipment and Systems, IFF and EW Systems.
Non-Defence
Para-Military Communication Equipment and Systems.
Space Department Precision Tracking Radar, Ground Electronics, Flight and
On-Board Sub-systems.
All India Radio MW, SW & FM Transmitters.
Doordarshan Low, Medium and High Power Transmitters, Studio
(TV Network) Equipment, OB Vans, Cameras, Antennae, Mobile and
Transportable Satellite Uplinks.
NCERT TV Studios on Turnkey Basis for Educational Programs.
Department of Transmission Equipment (Microwave and UHF) and PCM
Telecommunications Multiplex, Rural and Main Automatic Exchanges, Flyaway
Satellite Terminals, Solar Panels for Rural Exchanges.
Videsh Sanchar MCPC VSAT, SCPC VSAT, Flyaway Earth Stations. Hub
Nigam and other Stations, Up/Down Converters, LNA Modems
Corporate Bodies
Civil Aviation Airport Surveillance Radar, Secondary Surveillance Radar.
Meteorological Cyclone Warning and Multipurpose Meteorological Radar.
Department
Power Sector Satellite Communication Equipment.
Oil Industry Communication Systems, Radar.
Forest Departments, Communication Systems.
Irrigation &
Electricity Boards
Medical & Clinical and Surgical Microscope with Zoom, Linear
Health Care Accelerators.
Railways Communication Equipment for Metros, Microwave Radio
Relays, And Digital Microwave Radio Relays.

13
 Equipment
Components
Defence Transmitting Tubes, Microwave Tubes, Lasers, Batteries,
Semiconductors-Discrete, Hybrid and Integrated Circuits.
Non-Defence
All India Radio, Transmitting Tubes, Microwave Tubes, and Vacuum
Doordarshan Tubes.
(TV Network),
Department of Telecommunications
And Civil Industries
Entertainment B/W TV Tubes, Silicon Transistors, Integrated Circuits,
Industry Bipolar and CMOS, Piezo Electric Crystals, Ceramic
Capacitors and SAW Filters.
Telephone Industry Integrated Circuits, Crystals.
Switching Industry Vacuum Interrupters.
Instrumentation Industry Liquid Crystal Displays.
Medical &Health Care X-ray Tubes.

Systems/Network

Identity Card Systems Software, Office Automation

Software, LCD On-line Public Information Display
Systems and Communication Networks / VSAT Networks.

14
Financial Performance

BEL has a unique history of profit making Public Sector Enterprise right from its
inception. There have been events of decrease in turnover and profit after Tax due to
reasons beyond reasonable control of the company. But the company's strength lies in its
capability to combat the threats, for example US Embargo on exports to BEL.
BEL hopes to generate 25 per cent increase in turnover with a 15 per cent rise in
net profit in the current fiscal year over the previous. Corrective measures against western
sanctions have been undertaken, which are likely to translate into higher turnover and
profitability. The company is putting all efforts to minimize the effect of the restrictions
by early establishments of alternative arrangements. The Defence Research Laboratories
and Academic Institutions are also being persuaded with for indigenization of certain
special category of devices and components. The company is also opening an office in
Singapore to procure components from Asian markets. Thus in the long run the
restrictions will prove as blessings resulting in self-dependence and better profit margins.
Also several R&D projects with long gestation periods will go into commercial
production during the current fiscal.

15
Product Range
The product ranges today of the company are:
Radar Systems:
3-Dimensional High Power Static and Mobile Radar for the Air Force.
Low Flying Detection Radar for both the Army and the Air force.
Tactical Control Radar Systems for the Army
Battlefield Surveillance Radar for the Army
IFF Mk-X Radar systems for the Defence and Export
ASR/MSSR systems for Civil Aviation.
Radar & allied systems Data Processing Systems.
Communications:
Digital Static Tropo scatter Communication Systems for the Air Force.
Digital Mobile Tropo scatter Communication System for the Air Force
and Army.
VHF, UHF & Microwave Communication Equipment.
Bulk Encryption Equipment.
Turnkey Communication Systems Projects for defence & civil users.
Static and Mobile Satellite Communication Systems for Defence
Telemetry/Tele-control Systems.
Antennae:
Antennae for Radar, Terrestrial & Satellite Communication Systems.
Antennae for TV Satellite Receive and Broadcast applications.
Antennae for Line-of-sight Microwave Communication Systems.
Microwave Component:
Active Microwave components like LNAs, Synthesizer, and Receivers
etc.
Passive Microwave components like Double Balanced Mixers, etc

Most of these products and systems are the result of a harmonious combination of
technology absorbed under ToT from abroad, Defence R&D Laboratories and BEL's own
design and development efforts.

Organization
The operations at BEL Ghaziabad are headed by General Manager with
Additional / Deputy General Manager heading various divisions as follows:

16
 Design & Engineering Divisions :
Development and Engineering-R
Development and Engineering-C
Development and Engineering-Antenna.

1. Equipment Manufacturing Divisions :

Radar
Communication
Antenna
Systems
Microwave Components.

2. Support Divisions:

Material Management
Marketing & Customer Co-ordination
Quality Assurance & Torque
Central Services
PCB & Magnetics
Information Systems
Finance & Accounts
Personnel & Administration
Management Services.

Design & Engineering:

The pace of development and technological obsolescence in their field of
electronics necessitates a strong Research and Development base. This is all the more
important in the area of Defence Electronics. BEL Ghaziabad has since its inception laid
a heavy emphasis on indigenous research and development. About 70% of its
manufacture today relate to items developed in-house. For the development and
production of the Mobile Tropo scatter System and the IFF equipment, BEL was awarded
the Gold Shield for Import Substitution.
Design facilities are also constantly being modernized and substantial computer-
aided design facilities are being introduced including installation of mini- and micro-

17
computers and dedicated design application. About 170 graduate and post-graduate
engineers are working on research and development and indication of the importance
R&D has in BEL's growth.
Three Design and Engineering groups are product based viz. Communication,
Radar and Antenna. These divisions are further divided into different departments to look
after products of a particular nature. Each of them has a drawing office attached to them,
which are equipped with latest drafting and engineering software. The PCB layout and
PCB master making is done at CADDs Center. A central Records & Printing section takes
care of the preserving the engineering documents and distribution thereof. Most of the
engineering documents are available online.
Equipment Manufacturing Divisions:
As a supplier of equipment to the Defence services and professional user, strict
adherence to specifications and tolerances has to be in-built into the design and
manufacturing process. For this BEL Ghaziabad has well defined standards and processes
for as well as manufacturing and testing activities. Activities are divided into various
departments like Production Control, Works Assembly, and QC WORKS. The
manufacture and control of production is through a central system, BELMAC, BEL's
own homegrown ERP system.
Apart from conventional machines, BEL Ghaziabad has been equipped with
several Computer Numerical Control (CNC) machines for ensuring repeat occurrences
and increased throughput. A separate NC programming cell has been set up to develop
the programs for execution on the CNC machines.
Microwave Component Group:
Frequencies greater than 1 GHz is termed as Microwaves. Microwaves Integrated
Circuits (MIC) used extensively in the production of subsystems for Radar and
Communication equipment constitutes a very vital part of the technology for these
systems and is generally imported. Owing to the crucial and building block nature of the
technology involved, BEL is currently setting up a modern MIC manufacturing facility at
a planned expenditure of Rs. 2 crore. When in full operation, this facility will be the main
center for the MIC requirements of all the units of the company.
The manufacturing facilities of hybrid microwave components available at BEL,
Ghaziabad includes facility for preparation of substrates, assembly of miniaturized
component viz. directional couplers, low noise amplifiers, phase shiftier, synthesizers etc.
involves scalar as well as vector measurements. For this state of the network analysis are
used.
Material Management:
Material Management division is responsible for procurement, storage handling,
issue of purchased parts as well as raw materials required to manufacture various
equipment and spares. It also takes care of disposal of unused or waste material.
The division is divided into Purchase, Component store, Raw material store,
Chemical store, Inwards good store, Custom clearance Cell, Inventory management &
disposal.

18
Marketing and Customer Co-ordination:
This division is responsible for acquisition and execution of customer orders and
customer services. Marketing department looks after order acquisition. Commercial
department looks after order execution. Shipping takes care of packing and dispatch of
material to customer.
Quality Assurance & Torque:
In the area of professional Defence electronics, the importance of Quality and
Reliability is of utmost importance. BEL has therefore established stringent processes and
modern facilities and systems to ensure product quality- from the raw material to the
finished product. IGQA, Environmental Labs, Test Equipment Support and QA
departments are grouped under this division.
All material for consumption in the factory passes through stringent inward goods
screening in IGQA department before being accepted for use.
Subsequent to manufacture and inspection, the end product is again put through a
rigorous cycle of performance and environmental checks in Environmental Labs.
The testing, calibration and repair facility of test Instruments used in the factory is
under the control of Test Equipment Support. All the instruments come to this department
for periodic calibration.
Quality Assurance department facilitates ISO 9000 certification of various
divisions. All production divisions of BEL Ghaziabad are ISO9000 certified. The
microwave division is ISO9001 certified whereas the remaining three division viz. Radar,
Communication and Antennae are also ISO9002 certified.
Central Services:
Central services Division looks after plant and maintenance of the estate including
electrical distribution, captive power generation, telephones, transport etc.

PCB Fabrication & Magnetics:

PCB Fabrication, Coil and Magnetics, Technical Literature, Printing Press and
Finished Goods are the areas under this division.
Single sided PCB blanks- having circuit pattern only on one side of the board and
double sided - having circuit pattern on both sides of the board are manufactured in
house. However, Multi-layered PCBs, having many layers of circuit, are obtained from
other sources.
Magnetic department makes all types of transformers & coils that are used in
different equipment. Coils and transformers are manufactured as per various
specifications such as number of layers, number of turns, types of windings, gap in core,
dielectric strength, insulation between layers, electrical parameters, impedance etc. laid
down in the documents released by the D&E department.

19
Information Systems:
IS Department is responsible for BEL's own home grown manufacturing and
control system called BELMAC. It comprises of almost all modules a modern
ERP system but is Host and dumb terminal based.
Finance & Accounts:
The F&A division is divided into Budget & Compilation, Cost and Material
Accounts, Bills Payable, Bill Receivable, Payrolls, Provident Fund, Cash Sections
Personnel & Administration:
There are at present about 2300 employees at BEL Ghaziabad, of which more
than 400 are graduate and post graduate engineers.
P&A Division is divided into various departments like Recruitment,
Establishment, HRD, Welfare, Industrial Relations, Security and MI Room.

Management Services:
This department deals with the flow of information to or from the company. It is
broadly classified into three major sub-sections - Management Information System,
Industrial engineering department and Safety.

Production Control
The main goals of the production control are:

To improve the profits of the company by better resource management

To ensure on-time delivery products
To improve the quality of product
To reduce the capital investment
To reduce working capital needs by better inventory management

Production control is responsible for producing the products, right from the stage
engineering.
Drawings are received to the stage where it is store credited as finished product. It’s
basic function is to identify the parts/operations to be made, the best way of making
them, the time when they have to be made and to arrange the production resources to the
optimum.
The commercial department obtains orders from equipments through quotations. The
equipment stock order (ESO) is released by commercial department. Then the
management services department issues work order for the quantity of equipment to be
made. This is for the calculation for the cost of the project then D&E department
develops the equipment and releases the following engineering documents:

20
 KS : Key Sheet
PL : Part List
GA : General Assembly Diagram
CL : Connection List
WL : Wiring Diagram
Now the production control takes the responsibility of manufacturing the equipment.
PC decides for items to be purchased from outside, for items to be manufactured by other
companies and prepares documents for items to be made inside the company.
Documents issued by the PC:
I. Process sheet (fabrication): This process sheet indicates the process and the
sequence of operation to be followed in various work cells and work centers. Every
item is timed by productivity services.
II. Process sheet (Assembly): This is similar to PS (fabrication) except that it is
used in electronics assembly, PCB assemblies, cable form and cable assemblies.
III. Process sheet (coils): This indicates operation analysis for transformer and coils.
IV. Schedule for RM, fasteners and PPs: This gives the gross requirements for raw
materials, purchased parts, fasteners etc. Based on this material control department
initiates procurement action and store requisitions are released with reference to this
schedule.

Tool Planning
1. Some of the items while under fabrication require the use of some jigs and
fixtures.
2. The cost estimation, revenue and budget plans are got approved by the board of
management
3. Standard hour is approved by the department. This is the time, which is decided to
complete the job by a worker in a stipulated time, which is decided on the
previous records of the shop, type of machine used and the nature of work.
4. Report on production value is evaluated for each unit.
My Training in BEL, was attended in two phases. In first phase, I was given a
schedule to visit all the departments in BEL, relevant to my field of Electronics and
Communication. In this period of orientation, I visited different departments and was
introduced to the current technology used and the various industrial processes under
practice. In the second phase I was allotted a Project under Project Manager, Mr.
Chaturvedi (CAR- RADAR).

I am briefing my experience and observation about various departments of the

company in next paragraphs.

21
 ROTATION
ABOUT VARIOUS DEPARTMENTS
MICROWAVE INTEGRATED CIRCUITS
Frequencies greater than 1 GHz are termed as Microwaves. Microwave Integrated
Circuit used extensively in production of subsystems for Radar and Communication
equipment constitutes a very important part of technology for these systems are
generally imported. Owing to the crucial and building block nature of the technology
involved, BEL is currently setting up a modern MIC manufacturing facility at a planned
expenditure of Rs. 2 crore. When in full operation this facility will be the main center
for the MIC requirements of all the units of the company.

The manufacturing facility of hybrid microwave components available at BEL

Ghaziabad includes facility for preparation of substrates, assembly of miniaturized
components on substrates, bonding and testing. Testing of these microwave
components viz. Directional couplers, Waveguides, low noise amplifiers, phase
shifters, synthesis etc. involve scalar as well as vector measurements. For this state of
the network, analyses are used. Various losses such as return loss, bending loss,
insertion loss are measured and testing is done in a way to minimize these losses.

MICROWAVE LAB
This section undertakes:
1. Manufacturing of films and microwave components to meet internal
requirements.
2. Testing of low power antenna for which test-site is about 100 Km from the
factory at sohna.
The main component testing in this department is:

Oscillators
Amplifiers
Mixers
Radiation elements (e.g. Feeders)
Microwave components (e.g. Isolators, circulators, waveguides etc.)

22
 Filters (e.g. LPF, BPF, Uniplexers, and Multiplexers etc.)

Functioning of component is listed below:

Frequency response
Noise figure
VSWR
Directivity and coupling
Power measurements

Various instruments in the lab are:

Adaptor
Attenuator
Coupler
Mixer
Detector

ENVIRONMENTAL LAB
Various tests conducted in the environmental lab in BEL in order to ensure
reliability. Reliability is defined as the probability of a device performing its
purpose adequately for the period intended under the given operating conditions.
In a given system reliability is given as
R = R1 * R2 * R3 ……
The standards available here are:

JSS 55555 - Joint Services Specifications (Military Standard of India)

Mil Standards - U.S. Military standards

QM333 - Civil Aviation and Police

TYPES OF TESTS

1. FIRST ARTICLE TEST (FAT)

These tests are performed on the prototype. If these tests are successful then the mass
production is taken up.

23
 The tests are:
1. Vibration Test System
2. High Temperature Operate and Storage
3. Low Temperature Operate and Storage
4. Damp Heat Operate and Storage
5. Altitude Chamber
6. Bump Test Machine
7. Salt Fog Chamber
8. Tropical Storage
9. Mould Growth Chamber

VARIOUS TESTS IN DETAIL:

1. Vibration Test System
The item is vibrated when kept over the plate of the machine. The frequency
Range is 1 to 2,000 Hz.
Radar PCB’s are vibrated at 10 to 50 Hz at 2g (g=9.8m/s2) for 15’.

2. Humidity chamber
Used to test the product under varying humidity conditions.
For Navy instruments conditions for humidity are 95% at +45C for 16 hours.

3. Cold Heat
This chamber has a temperature of –90 to +180. This chamber program is
controlled and has an accuracy of +0.5 and has a graph plotting system.

4. Mould Growth
This chamber is used to test how immune the product is against mould growth.

5. Salt Spray
It is used to check the resistivity of the item produced against salty water.

6. Climatic Chamber
Temperature range of – 65C to +200C and relative humidity is from 20%
To 98%RH.

7. Walk – In Chamber

This is a big chamber of size 2.6m, 2.4m, 3m Temp. range of – 60C to

+100C and the humidity is from 20% to 90% RH.

8. Bump Machine
Item is dropped from a certain height every time it receives bump from
Machine. Maximum capacity of the machine is 11.35 Kg. Drop height is
Around 1 inch.

9. Altitude Chamber
Used to test the item under different temperature and humidity conditions.

24
 The temperature range for this chamber is from -40C to +150C and can create
environmental conditions as per a height of 50,000 feet’s.
For airforce equipment the instrument is kept at a temperature of +40C for
30,000 ft and at 0C for 13,500 ft.

2. ACCEPTANCE TEST PROCEDURE

This sets on the extent to which a test is to be conducted and also decides what
tests should be conducted.

There are three types of tests:

a) Class A test: This test includes visual and dimensional checks. All
equipments of regular production go through these checks. These include
quality control and electrical tests.
b) Class B test: These are quality assurance and reliability tests. Only 10%
of equipments go through these tests. They include quality control,
electrical tests and some environmental tests.
c) Class C test: These are carried out on 1% of the components. All the
environmental tests are performed. If any failure is seen, the component
must be redesigned. Also the customer must be supplied with modified
goods. This test comes in picture for bulk production only.

FAILURE RATE GRAPH

Failure rate graph- It is the failure versus time graph.

The infant morality is the critical period. It is due to:

Weak component
Manufacturing defect

This is the area where the producer tries to cover in the warranty period.
The repeated failures are detrimental to a company’s reputation as these are eliminated by
screening while in manufacturing stage.

The other screening is the stress screening method. This consists of:

a) HUMIDITY TEST: Humidity is created with the help of boilers and fans in the
chamber. Required temperature and duration of the tests are selected as per the
specified BEL standards.
b) ALTITUDE TEST: The conditions such as very low temperature (created with
the help of cooling systems) and very low temperature and pressure (created with
the help of a vacuum pump) are maintained in a chamber. These conditions are
comparable to those at high altitudes where the products have to work.
c) AGEING AND THERMAL SHOCKS: One cycle of ageing is of 7 hours.
Ageing is done to relieve the stresses developed in the PCB due to blazing,
welding, riveting etc. The sample is first kept at ambient temperature (250 degree
Celsius) and then cooled to -400 degree Celsius.

25
 d) BUMP TEST: The sample is given bumps in one direction only, with the help of
machine. The number of bumps to be given is set with the help of proper switches.
The sample is operated after giving bumps. If it works properly, it is passed.
e) VIBRATION TEST: The sample is subjected to vibrations. Required frequency
and amplitude for vibrations is selected accordingly.
f) SALT SPRAY TEST: Salt solution is sprayed in a chamber. The specimens are
hanged in the chamber. The test helps to decide any corrosion that takes place due
to spraying of solution.
g) RAIN TEST: In this test, conditions are created such that the sample is made to
bath in heavy rain, so that if any problem arises in the sample due to rain that can
be sorted accordingly.
h) DROP TEST : The sample is made to survive in such a environment where there
is possibility of snow fall. Such conditions are created in a chamber, to sort out any
problem arises due to this.
i) ROADABILITY TEST: While doing bump test, bumps are given to the sample
in unidirectional only. But in the roadability test, bumps are given to the sample in
all the directions. It means that the test is being carried, considering the device to
be moving in a zigzag manner on an uneven road. For e.g. in sand or in water etc.
This test helps to make out any fault or loosening of components while moving the
specimen from one place to another.
j) BOMB TEST: This is a test conducted for special types of samples. In this the
samples are exposed to a situation like a bomb blast and it is checked whether the
sample is able to bear the bomb explosion.

WALK IN CHAMBER

A very huge used for conducting humidity and temperature tests. The size of the
chamber is such that a person can easily walk into it. It is for large sized specimens.

PCB FABRICATION

PCB is abbreviated form of printed circuit board. As the name suggests, in a PCB
the electrical circuit is printed on a glass epoxy board. This reduces the complex writing
network whose trouble shooting in case of shorting or misconnection is not easy.
PCB fabrication is mostly done for house requirements. It also takes some external jobs.

Types of PCB’s
Single Sided: Having circuit pattern only on one side of the board.
Double Sided: Having circuit pattern on both sides of the board.
Multilayered: Having many layers of circuit.

BEL – Ghaziabad produces only single-sided and double-sided PCB’s.

FABRICATION OF SINGLE SIDED PCB’s:

1. A copper clad sheet is taken. It is cleaned and scrubbed.

26
 2. The sheet is laminated with a photosensitive solution.
3. Positive photo paint of the required circuit is placed over the laminated sheet and
it is subjected to the UV light. As a result the transparent plate gets polymerized
and the opaque part remains unpolymerized.
4. The plate is now dipped in solution in which the non-polymerized part gets
dissolved.
5. Tin plating is done on the tracks obtained.
6. Lamination of the plate is removed (stripping).
7. The unwanted copper from the plate is also removed by dipping it in the solution
that dissolves copper but not tin (etching).
8. Now drilling is done on the paths where the components are to be mounted. This
process fabricates PCB.

P C B MANUFACTURING PROCESS:

1. Copper clad
2. Drill location holes
3. Drill holes for T.H.P. (Through Hole Plating)
4. Clean scrub and laminate
5. Photo print
6. Develop
7. Copper electroplate
8. Tin electroplate
9. Strip film
10. Etch and clean
11. Strip tin
12. L.P.I.S.M. (Liquid Photo Imageable Solder Mask)
13. Photo print
14. Develop
15. Thermal baking
16. Hot air level
17. Legend marking/Reverse marking
18. Route and clean

But these PCB’s have the following disadvantages:

Due to very narrow spacing between adjacent tracks, there may be a chance
of short circuit if the soldering is done by hands between the components on
opposite side.
Moisture or dust between the gaps may disrupt smooth soldering.

These disadvantages are overcome by soldered mask PCB’s. in the later one an additional
film is put on the earlier fabricated PCB, leaving points where components are to be
soldered.

27
 TEST EQUIPMENT & AUTOMATION
TEST EQUIPMENT SUPPORT (TES)

Main functions are:

Develops technical support to other departments.

Repair of equipment in case of failure.
Maintenance of equipments.
Periodic calibration of equipments.
Provide technical support to other departments. This includes:
1. Handling requests from the other department for equipments.
2. Storage of rejected equipments.
3. Approval of equipments to be purchased.

This section deals with testing and the calibration of electronic equipments only the
standards of this department are calibrated by National Physics Laboratory (NPL).

AUTOMATION TEST EQUIPMENT (ATE)

1. Component testing gives faults of various discrete components of a PCB.

2. Integrated circuits tester tests various IC’s.
3. Functional testing compares output to decide whether the function is being
performed to the desired level of accuracy.

WORKS ASSEMBLY

This department plays an important role in the production. Its main function is to
assemble various components, equipment’s and instruments in a particular procedure. It
has two sections, namely:

1. PCB assembly
2. Electronic assembly

In PCB assembly, the different types of PCB are assembled as per BEL standards. PCB is
received from the PCB department on which soldering of component is done either by
hand soldering or wave soldering.

HAND SOLDERING: In case of hand soldering, soldering is done manually.

WAVE SOLDERING: Wave soldering is a procedure in which PCB’s are fed to
the wave soldering machine from the opening on one side
and the soldering is done by machine and after the
soldering is done PCB’s are collected from the another
opening of the machine and after that cleaning is done.

28
 The PCB’s are than send to testing department for testing according to the product
Test procedure issued by the D&E department. After testing PCB’s are lacquered and
Send to the planning store for storage.

In electronic assembly, the cable assemblies, cable forms modules, drawers, racks
and shelters are assembled. Every shelter (e.g. - DMT) is made of racks, racks are made
up of drawers, drawers are made up of modules and modules are made up of PCB’s,
cable assembly and cable forms.

Every module or drawer before using in next assembly is sent for testing
according to their PTP. Shop planning collects the purchase from the IG store, takes
fabricated parts, PCB’s etc. from planning stores and issued to the assembly department
as per the part list of the assembly to be made.
The documents issued to the assembly are:

KS : Key Sheet
PL : Parts List
CL : Connection List for cable form
WL : Wiring List for modules
WD : Wiring Diagram
GA : General Assembly diagram

This department has been broadly classified as:

1. WORK ASSEMBLY RADAR e.g. : INDRA-2 , REPORTER ,CAR

2. WORK ASSEMBLY COMMUNICATION e.g. : EMCCA , MSSR , MFC

EMCCA: EQUIPMENT MODULAR FOR COMMAND CONTROL APPLICATION

MSSR: MONOPULSE SECONDARY SURVEILLANCE RADAR

MFC: MULTI FUNCTIONAL CONSOLE

The stepwise process followed by work assembly department is:

1) Preparation of part list that is to be assembled.

2) Preparation of general assembly.
3) Schematic diagram to depict all connection to be made and brief idea about all
components.
4) Writing list of all components.

METHOD OF PCB PROCESSING

1. Tinning
2. Preparation
3. Mounting
4. Wave soldering
5. Touch up

29
 6. Quality control
7. Ageing
8. Testing
9. lacquering (AV)
10. Storing

SURFACE MOUNTING TECHNOLOGY

The works assembly has a totally computerized section of PCB assembling of SMD
(Surface Mounting Device). In this section the operation of PCB assembling is totally
controlled by computers. The various steps taken in computer PCB assembling of SMD’s
are as follows:

1. Application of solder paste: Solder paste is applied onto the places on PCB
where the SMD’s are to be soldered. This is done by computer controlled
machine. The program is loaded in the machine; it reads the program and applies
the solder paste at the required place.

2. Fixture of SMD’s:
a) The SMD’s are fixed at the right place on PCB by another computer
controlled machine.
b) The components (SMD) are first fed to various feeder lines that are
attached to the machine and the related software and program is loaded
in computer.
c) There is a provision for a camera also so that we can monitor the entire
operation.
d) The PCB is then fed to the machine.
e) When the appropriate command is given to the computer, it initiates
the machine attached to it
f) The machine picks the correct SMD from the feeder line and fix it at
the right place on the PCB and within seconds all SMD’s are fixed on
the PCB.

3. Thermal Baking: After the fixture of SMD’s, thermal baking is done. In this
the PCB is fed to the oven and after 10 to 20 minutes PCB is taken out.

NOTE: Surface Mounting Device (SMD) does not require any hole on PCB as
they are mounted directly on the PCB. The pins of SMD components are called
’legs’ as they have leg like structure unlike simple components that have straight
pins that are soldered in the holes on the PCB manually.

SHOP ORDER

Process Sheet (assembly)

All operations fill the work order and shop order in operator’s time card
(OTC). They punch the time of starting the job and its finishing time. By this
productivity services calculates the time taken to complete the job.

30
 Efficiency = time allotted in shop order
X 100
Actual time taken
Time allotted is so called standard hours.

This deals with the assembly of common projects e.g. DMT, 2 GHz radio relay, Mobile
tropo, Static RRD etc.

MAGNETICS
This department manufactures all types of transformers and coils that are used in
various equipments manufactured by BEL. This department basically consists of four
sections:
1. Planning section
2. Mechanical section
3. Moulding section
4. Inspection section

The D&E department gives the following descriptions to the magnetics department.
They are as follows:

Number of layers
Number of turns
Type of winding
Gap in core
Insulation between layers
Ac/dc impedance
Dielectric strength
Electrical parameters and
Earthing

The various transformers being made are:

Open type transformer

Oil cooling type transformer
Moulding type transformer
PCB moulding type transformer

The transformer is mechanically assembled, leads are taken out and checking of
specification is done.

Winding machines are of three types:

Heavier ones- DNR for 0.1 to 0.4 mm diameter

LC controlled machines
Torroidal machines having 32 operations from winding to mechanical assembly.

31
 The various types of windings used are:

Hand winding
Torroidal winding
Sector winding
Pitch winding
Variable pitch winding
Wave winding

Two main types of core used are:

E-type for 3-phase

C-type for single phase

Following procedure involved in the manufacture of the transformer is as follows:

1. Formers of glass epoxy

2. Winding
3. Core winding
4. Varnishing
5. Impregnation – In this process various varnished coils are heated, then
cooled, reheated and put into vacuum. Then air is blown to remove the
humidity.
6. Moulding – Araldite (a certain type of strong glue) mixed with black dye is
used to increase mechanical as well as electrical strength. Moulding is done
at 120 degree Celsius for 12 hours.
A RDB compound is used for leakage protection. Oil is then boiled at 70 to
80 degree Celsius under vacuum condition to remove air bubbles trapped
inside during manufacturing process. After this the coils are dipped in
varnish and core is attached.
7. Painting
8. Mechanical assembly
9. Termination
10. Stenciling
11. Testing – Dielectric testing (both ac/dc) is done at 50 KV voltage
is applied for a minimum of one minute. During inspection, the following
characteristics are checked:

a. Turns ratio
b. DC resistance for each coil
c. Inductance
d. No load voltage
e. Leakage

This section the material used for making transformer is Bakelite comprising male
and female plates which are joined alternately to form a hollow rectangular box on which
winding is done. Winding is done with different material and thickness of wire. The

32
winding has specified number of layers with each layer having a specified number of
turns. The distance between the two turns should be maintained constantly that is there
should be no overlapping. The plastic layer is inserted between two consecutive layers.

Types of Windings:
1) Layer Winding
2) Wave Winding
3) Bank Winding

Different types of windings are done to control some parameters such as inductance and
capacitance. Varying the spacing between the two turns can vary these parameters. Two
consecutive turns act as capacitor. As gap between the turns increases the capacitance
decreases and inductance increases. Since capacitance is inversely proportional to the gap
between the plates of capacitor and inductance is directly proportional. After winding the
core is inserted between the primary and secondary. Contact leads are taken out and
molding is done for maximum heat dissipation. Rubber solution is used to give strength
to the wires, so that they cannot break. This is done before molding. Varnishing is done
as anti fungus prevention for against environmental hazard. After compilation of
manufacturing process it is sent for testing. Different parameters such as inductance,
capacitance efficiency, turns ration, continuity are tested.

QUALITY CONTROL WORKS

According to some laid down standards, the quality control department ensures
the quality of the product.
The raw materials and components etc. purchased are inspected according to the
specifications by the IG department. Similarly QC works department inspects all the
items manufactured in the factory.
The fabrication inspection checks all the fabricated parts and ensures that these
are made as per the part drawing. Plating, Painting and stenciling etc are done and
checked as per the BEL standards.
The assembly inspection department inspects all the assembled parts such as PCB,
cable assembly, cable form, modules, racks and shelters as per latest documents and BEL
standards.
The mistakes in the PCB can be categorized as:

D&E mistake
Shop mistake
Inspection mistake

A process card is attached to each PCB under inspection. Any error in the PCB is
entered into the process card by certain codes specified for each error or defect.

After mistake is detected, following actions are taken:

Observation is made.
Object code is given.

33
 Division code is given.
Change code is prepared.
Recommended action is taken.

RADAR ASSEMBLY

This deals with the assembly of RADARS, e.g. INDRA-I, INDRA-II, FLY
CATCHER, EMMCA, IRMA, REPORTER, CAR etc.

The main projects under construction are:

CAR

In RADAR section RADAR being tested is REPORTER, FLY CATCHER,

EMCCA, etc.

34
 PROJECT

PROJECT : RADAR (RADIO DETECTION AND RANGING)

35
 PROJECT: AN OVERVIEW

RADAR AND ITS COMPOSITE

ENVIRONMENT

36
INTRODUCTION

The two most basic functions of radar are inherent in the word, whose letters stand for
RAdio Detection And Ranging. Measurement of target angles has been included as a
basic function of most radar, and Doppler velocity is often measured directly as a fourth
basic quantity. Discrimination of the desired target from background noise and clutter is a
prerequisite to detection and measurement, and resolution of surface features is essential
to mapping or imaging radar. The block diagram of typical pulsed radar is shown in
Figure. The equipment has been divided arbitrarily into seven subsystems, corresponding
to the usual design specialties within the radar engineering field. The radar operation in
more complex systems is controlled by a computer with specific actions initiated by a
synchronizer, which in turn controls the time sequence of transmissions, receiver gates
and gain settings, signal processing, and display. When called for by the synchronizer,
the modulator applies a pulse of high voltage to the radio frequency (RF) amplifier,
simultaneously with an RF drive signal from the exciter. The resulting high-power RF
pulse is passed through transmission line or waveguide to the duplexer, which connects it
to the antenna for radiation into space. The antenna shown is of the reflector type, steered
mechanically by a servo-driven pedestal. A stationary array may also be used, with
electrical steering of the radiated beam. After reflection from a target, the echo signal
reenters the antenna, which is connected to the receiver preamplifier or mixer by the
duplexer.

37
A local oscillator signal furnished by the exciter translates the echo frequency to one or
more intermediate frequencies (IFs), which can be amplified, filtered, envelope or
quadrature detected, and subjected to more refined signal processing. Data to control the
antenna steering and to provide outputs to an associated computer are extracted from the
time delay and modulation on the signal. There are many variations from the diagram of
Figure that can be made in radars for specific applications, but the operating sequence
described in the foregoing forms the basis of most common radar systems. This project
provides the basics of radar and many of the relationships that are common to most forms
of target-detection radar. The emphasis is on the goals established for the radar or the
system that contains the radar.

38
 SYSTEM
DEFINITION

CENTRAL ACQUISITION
RADAR

39
INTRODUCTION
The designed Radar would be a stand-alone all weather 3D surveillance radar. The radar
operates in S-band and is capable of Track-While-Scan [TWS] of airborne targets up to
130 Kms, subject to line-of-sight clearance and radar horizon. The radar employs
Multibeam coverage in the receive mode to provide for necessary discrimination in
elevation data. It employs 8 beams to achieve elevation coverage of prescribed margin
and a height ceiling of prescribed margin. The antenna is mechanically rotated in azimuth
to provide 360 coverage. To get an optimum detection performance against various class
of targets, different Antenna Rotation Rate [ARR] RPM modes are implemented and
these can be selected by the operator.

The unique feature of the radar is, its operation is fully automated and controlled from a
Radar Console with sufficient menus, keys and Hot keys. The designed Radar is an
offshoot of the fully and successfully developed and demonstrated radar called as 3D
Central Acquisition Radar (3D-CAR).

3D-CAR is designed to play the role of medium range surveillance radar mounted on a
mobile platform. The radar carries out detection, tracking and interception of targets with
an RCS of 2m2 upto 130 Kms in range.
The antenna can be manually positioned at different look angles in steps. In the receive
mode the eight beams cater for a height coverage of required margin. The IFF antenna is
placed atop the main antenna and it integrates the IFF for including of IFF data with the
Primary Radar Data.

The RDP (Radar Data Processor) is implemented on a SBC and is fully software-based
system with adequate memory and external interfaces to handle upto 150 target tracks.
Robust algorithms for filtering are used to lock on to maneuvering target upto 6g without
loss of tracking.

LAN interfaces are used to communicate with external systems. High-speed data transfer
of target parameters can be done. This helps in data remoting upto a distance of 500 mtrs
that can be extended with suitable repeaters. Facility for manual track indication for low
speed targets and targets in heavy clutter zones are available to the console operator.

The color display has features for monitoring of radar performance, the radar output
selection for radar modes of operation. Interfaces to radar control signals are built-in. The
Radar generates different videos viz., Analog and Digital videos at the Receiver and
Signal Processor. These are interfaced to the display over dedicated lines and displayed
In addition to providing real time data on screen for viewing, the consoles will provide
facility for training controllers/operators/ technical crew. The system is capable of
creating targets and assigns values for range, azimuth, height and speed as defined by
operator. It will enable the operator to control the motion of these targets for gaining/
loosing height, turning left/right, cruising, and rolling out. The software running on
console will provide an online handy aid, for target interception. The training part of the
software will be active as an offline facility or with tracked targets in real time. The
offline mode will be capable of using recorded data.

40
Salient features Radar are:

1. 3D Surveillance Radar
2. S-BAND
3. Capable of Track While Scan (TWS) of airborne Targets upto 150 Kms
4. Coherent TWT based Transmitter
5. Planar Array Antenna with low side lobes
6. Multiple beams in the receive mode.
7. ECCM (Side lobe blanking, Frequency Agility, Jammer analysis)
8. Integrated IFF
9. System operation is controlled from Radar Console in Data centre.
10. Redundant Power supply unit with UPS backup.

I have been working in Transmitter section of CAR developed by BEL, Ghaziabad.

Before explaining the technical details of Transmitter of Radar, it is necessity to
understand the general working of Radar.

This designed Radar has the following subsystems:

1. Multi-beam Antenna system

2. Transmitter
3. Receiver
4. Signal Processor
5. Radar Console
6. Data centre
7. Mobile Power Source
8. IFF System

The Multi beam antenna system for Radar is planned to be realized to have 360
Coverage in Azimuth and prescribed coverage in elevation. The antenna will have a wide
beam in transmit mode and eight simultaneous narrow beams in receive mode to give
prescribed coverage in elevation.

The requirement of Transmitter is to amplify the pulsed RF signal from few watts to high
power RF signal while maintaining the phase noise (additive noise) to its minimal as
demanded by the system.

The Low Power Microwave Subsystem includes the major portion of Receiver RF
System of the 3D-Radar. The Multibeam Antenna receives the reflected signals from the
target. These signals are amplified by the Low Noise Amplifier, down converted to IF
Frequency using two-stage superheterodyne receiver. The IF Output is given as final
output of the Low Power Microwave Subsystem to be further processed in the signal
processor.
Customization of the console for user application will be carried out in the software and
hardware. The Display Console is the operator's center to initialize, remotely setup,
operate, observe, and diagnose the radar, both online and offline. The Primary and

41
secondary radar video, target tracks, plots, geographical map along with other diagnostic
and configuration messages are presented in 2D.
The Signal Processor for Radar is realized as 8 parallel and identical channels. Each
Signal Processor accepts IF videos from the corresponding RF Receiver channel (8
beams + 1 Omni) and provides detection reports to the Radar Data Extractor (RDE)
independently for these 8 channels. The detection reports for each channel must have
range and strength information in addition to the associated flags. Jammer data is also to
be reported. Configuration and mode control, diagnostics and status reporting are done
through a Radar Controller (RC).
The electronic equipment cabin is provided for installation of transmitter, signal
processor, receiver, display console, IFF equipment and a working place for maintenance.
The Data centre is required to provide basic functions like viewing of the air picture,
remote operation of radar, and radio communication. At the same time the cabin provides
shelter for the operators, with reasonable level of comfort and, protected against heat, rain
and dust.
Mobile power source is required to provide the main supply to Radar and Data Centre for
electronic and mechanical units of Radar including air conditioning units.
The Identification Friend or Foe (IFF) system is a good example of a secondary radar
system that is in wide use in the military environment. A great deal of valuable
information can be provided to the secondary radar by the target’s transponder. The
transponder provides an identifying code to the secondary radar that then uses the code
and an associated data base system to look up aircraft origin and destination, flight
number, aircraft type and even the numbers of personnel onboard. This type of
information is clearly not available from a primary radar system.

42
TRANSMITTER

43
Transmitter
INTRODUCTION
The transmitter for Radar is Coherent MOPA type that operates in S Band using TWT as
the final amplifier. The transmitter is used to amplify the pulsed RF signal from low
power RF signal to High power RF signal as demanded by the system. TWT dissipates
large amount of energy, therefore it is subjected to both air and liquid cooling.

The input to the transmitter is 3 phase, 415V, 50 Hz, which is later amplified to the
optimal value for driving the TWT amplifier.
A generalized diagram here briefly explains the inputs and outputs of the transmitter.

3-phase,400V,50Hz

3-channel liq cooling in

3-channel liq cooling out

RF out
ROHINI
Air cooling in TRANSMITTER

Air cooling out

System status
BIT0 SP signals
BIT1
RF PULSE Dry air
PRETRG
GRID PULSE

RF input

Input output diagram of Transmitter

The transmitter is designed to operate in the following modes defined as adequate

controlled states

44
Transmitter modes

a) OFF : All subsystems switched OFF

b) Cold Standby : Only LVPSU’s , TWT heater and Grid biases are
switched ON. No High Voltage applied.

c) Hot Stand By : High Voltages applied, No RF and No grid

Pulsing.

d) Transmission : RF power delivered to Antenna / Matched load.

i) Full Power mode : Full RF Power delivered to the

Antenna

ii) Reduced Power mode : The transmitter is operated at 1/10 of

its full power based on the selection by the
user.

iii) Fail safe mode : A low power at required duty

delivered to antenna through Solid State
Power Amplifier when liquid cooling fails.

Modes are selected by the operator.

Transmitter control

a) Local : To control through control panel on the

transmitter.

b) Remote control : To control from the operator console through

control interface RS422.

45
MECHANICAL DESCRIPTION
Three rack configuration of Transmitter describes complete functionality of
Transmitter

1. Control Rack
 Monitoring panel
 Control panel
 Synoptic panel
 CPC
 Inverter

2. High Voltage Rack

 FDM (Solid state Switching)
 Cathode Assembly
 Collector Assembly
 Blower Unit
 Heater Unit

3. Microwave Rack
 TWT
 RF Plumbing
 RF Drive Unit
 SSPA
 ION Pump Controller

46
CONTROL RACK HIGH VOLTAGE RACK MICROWAVE RACK

47
GENERAL DESCRIPTION
The Transmitter amplifies the pulsed RF signal from few Watts to many KW while
maintaining the phase noise (additive noise) to prescribed margin as demanded by the
system. In addition, a Solid State Power Amplifier (SSPA) is provided, as a stand by
option, to ensure fail-safe mode, in case of failure of liquid coolant.

It employs a Traveling Wave Tube as final power amplifier. Low power amplifier stage
(RF Driver) amplifies pulsed RF signal from 1mW (0 dBm) to few W which is necessary
to drive the TWT amplifier.

The RF Driver stage uses a PIN attenuator transistor followed by power amplifiers to
amplify RF signal. This is followed by an isolator. The isolator protects the transistor
power amplifiers against excessive reflections from TWT. The signal is thereafter passed
through a DC, a RF switch and an attenuator to cater for the three transmission modes.
The sampled output of the DC is used for monitoring the input RF signal to the TWT.

The RF Driver output is given to the input of TWT, which amplifies the pulsed RF signal
from few Watts to a level of many kW at the TWT output. High power RF plumbing
components are connected at the output of TWT.

The TWT output is given to an arc detector followed by a ferrite circulator. The Ferrite
circulator is used to protect the microwave tube against failure /damage due to reflected
power in case of excessive VSWR at Antenna input port. The output of

Ferrite Circulator is given to High Power Dual Directional Coupler (DDC), which is used
for measuring the transmitted and reflected power. If reflected power exceeds the
specified limit of VSWR, a video signal is generated to cut off the RF drive through
control and protection circuit.
The output of the DDC is given to Antenna. To connect all the components in the
required form, flexible sections, E-bends, H-bends and straight sections are used.

Control and Protection Circuit ensures the sequential switching ON of the transmitter,
continuous monitoring and interlocking of various parameters, detection and indication of
errors.
All these are achieved by dedicated hardware and software.
Synoptic Panel consists of LEDs, switches and LCD display. LEDs are used to show the
status of the transmitter. They also show the fault, if any, in the transmitter. The LCD
display, mounted on Synoptic panel, is used to show the value of cathode voltage &
current, collector voltage and current. It also displays the Filament voltage and current,
Grid + ve and -ve voltages and RF forward power.

The Inverter unit converts the incoming ac supply to DC and then converts the DC to
high frequency AC (Pulse width controlled square wave) operating at 20 kHz. The output
of the Inverter unit is given to HV rack for generation of Cathode and Collector voltages
of the TWT amplifier.

48
High Voltage Power Supply unit (HVPSU) is used to supply high voltage to collector and
cathode of the TWT.

The Floating Deck Modulator (FDM) unit generates filament voltage with surge current
protection and also generates grid +ve and grid -ve voltages. Switching of grid voltage as
per pulse width and PRF requirements are also provided by FDM.

Cooling Unit is used to cool the various components of the transmitter. The TWT, High
Power Ferrite Isolator, high Voltage Power supplies and RF dummy load are cooled with
de-ionized water and ethylene glycol mixture.

Forced air-cooling is employed to cool other components using ambient air which is
filtered to ensure dust free air. The Dry Air unit ensures that the wave guide is at all times
pressurized and dry.

SSPA

W/G
RF DRIVER TWT COUPLER SWITCH

TO
ANTENNA

FWD AND
RFLECTED
PWR MONITOR
LIQUID
FIL., GRID, CATHODE, COOLING
COLLECTOR SUPPLY

49
DETAILED DESCRIPTION

Control Rack

Control Rack provides the protection controls and indications. As mentioned before, this
rack is divided in five sections according to their functions.
1. Monitoring Panel

The Monitoring Panel provides monitoring ports for measuring of trigger signals to the
transmitter, liquid cooling status, collector and cathode Inverter currents and bridge
voltages. It provides an emergency switch OFF button and digital displays for collector
and cathode voltages.

50
2. Control Panel

The control panel controls the power supplies of various units such as the fans, heater,
LVPSU, Inverter, Modulator, RF Drive Unit and SSPA. The hour meters for filament,
EHT and RF are also placed on the control panel.

3. Synoptic Panel

Synoptic Panel is located above the Control and Protection Circuit (CPC). It indicates the
faults and status signals generated by CPC. Green LEDs represent status signals while
Red LEDs represent faults. Audio alarms are also provided to indicate faults.

4. Control and Protection Circuits

The CPC ensures the sequential switching ON/OFF of the transmitter, continuous
monitoring and interlocking of various parameters, detection and indication of errors.

RF DRIVER
CPC BLOCK DIAGRAMO
RF PARAMETERS SSPA RADAR P
& TIMING TIMINGS
DIR COUPLERS CTRL T
CARD CARD
CROW BAR SIGNAL O

C I
EHT VOL STATUS STATUS
SAMPLES O S
HV POWER M
SUPPLIES EHT CURR
O
EHT PROBES SAMPLES
P L
CROW BAR A A
R
BEAM CURR, TMICRO
COLL CURR A
TWT CATH CURR O -
T
O RCONT
COOLING
R C
ROLLER
LIQUID CONDITIONS
ACARD
COOLING C
R TO RADAR
UNIT A CONTROLLER
R D
D
SWITCH ON S GRID
COMMANDS PULS
TO SOLID
STATE RELAYS E SWITCH ON
FOR HV, MAINS ON OPTICAL COMMANDS
INPUT LINKS&
POWER F/V CARD
STATUS
LCD
FIL INTERFACE
VOL & I
POWER SAMPLES
DISTRIBUTION GRID VOL
SAMPLES

FLOATING FRONT
DECK PANEL
MODULATOR WITH
3Ø 50Hz SWITCHES,
400V AC IN AT - 45KV
LED
& LCD
DISPLAY

CPC card Configuration comprises of ten different cards.

 COMPARATOR CARD-I
 COMPARATOR CARD-II
 COMPARATOR CARD-III

51
  TIMING CARD
 SSPA CTRL CARD
 F TO V CARD
 OPTPISOLATOR CARD
 MC-I CARD
 MC-II CARD
 OPTO TRANSCEIVER CARD

5. Inverter

The Inverter is the main functional block of the (cathode/collector) HV Power supplies. A
number of indicators are placed on the front panel of the Inverter unit.

 AC-DC CARD
 CATHODE PROTECTION CARD
 CATHODE IGBT DRIVER CARD
 COLLECTOR PROTECTION CARD
 COLLECTOR IGBT DRIVER CARD
 SOFT START CARD
 TEMPERATURE SENSOR CARD
 ZENER CARD (For Cathode and Collector)
 CURRENT SENSOR CARD (For Cathode and Collector)
 CURRENT SENSOR (PEAK) CARD (For Cathode and Coll.)

52
High Voltage Rack

53
This is central block of the transmitter, where cabins for HV Cathode and Collector are
assembled. Above this is a FDM block where all the cards are installed and insulated
from the transmitter that works on HV.
As mentioned earlier, High Voltage Rack is divided in five more units. Each unit has its
defined working.

1. FDM (Floating Deck Modulator)

Isol FIL
atio
230V- ph-ph n
50Hz tran FDM GRID To TWT
sfor
mer
CATHODE

Fil Voltage
To CPC
Optical links Fil Current
Grid Positive
Grid negative

From CPC
Grid Pulse
Optical link

Further in FDM there seven functional cards, which are as follows:

• LVPS Card
• Grid Bias Card
• Positive Grid Supply Card
• Switch Card
• Filament Supply & Timer Card-1
• Filament Supply & Timer Card-2
• V to F Card

54
Microwave Rack

55
The functional block diagram of microwave unit is shown in the figure. The microwave
unit consists of the following functional assemblies:

56
  Low power amplifier [RF drive unit]
 High power TWT amplifier
 RF Plumbing, Wave-guide switch & dummy load
 Solid state power amplifier (2 kW) for low power transmission mode
 TWT ion pump supply
 Resistive TWT anode divider
 Microwave power measurement circuits
 Air cooling components

Low Power Driver for TWT (RF Driver)

Low Power amplifier stage (RF Driver) amplifies pulsed RF signal from 1mW (0dBm) to
few Watts power, necessary to drive the TWT amplifier. This low power RF Driver
consists of following stages:

(a) Transistor Power amplifier : Amplifies the Pulsed signal from

0dBm to 37dBm

(b) Separating isolator : Used to protect the transistor power amplifier

against excessive reflections
from TWT.

(c) Directional Coupler : To monitor the power available at the input TWT.

Figure given below shows the Input and output diagram of RF Driver

RF IN To SSPA i/p

To TWT i/p
Control i/p from
CPC RF DRIVER To CPC for RF drive fail
protection
TWT drive MONITOR

High Power Microwave Stage

High Power Microwave consists of mainly TWT, which amplifies the pulsed RF signal
received from the RF Driver of few watt power to a level of 120 -185 KW at the TWT

57
output followed by High Power RF plumbing components. Figure given below shows
the block diagram of high power chain.

High Power RF stage consists of:

 Traveling Wave Tube (TWT)

 Ferrite Circulator
 Dual Directional Coupler (DDC)
 High Power dummy load
 Wave guide channel
 Wave guide switch

Traveling Wave Tube (TWT)

TWT is available in three different constructs, these are listed here:

1. Helix TWTs

These amplify relatively to low power levels, but it provides a very wide bandwidth, both
in octave and multioctave.

2. Ring Loop / Ring Bar TWTs

58
These amplify at relatively high power levels, and provide a wideband, that is of 25 % of
bandwidth.

3. Coupled Cavity TWTs

This TWT in family of TWTs provides highest amplified power levels. It has relatively
narrower bandwidth that is 10% to 15 % of bandwidth.

TWT is the main power amplifier used in the transmitter. A coupled cavity TWT type is
selected for this transmitter.

The collector in the TWT is further divided as:

1. Ground collector

2. Depressed collector

 Single stage depressed collector

 Double depressed collector
 Multi stage depressed collector

59
 LIQUID COOLING

RF IN RF OUT

-10V,10A

+800
-600 3kV,ION PUMP

-45kV,5kW

33kV,18kW

TWT POWER SUPPLIES CONNECTION DIAGRAM

Ferrite circulator

Ferrite circulator is used to protect the microwave tube against failure / damage due to
reflected power in case of excess VSWR at Antenna input port. The Four port Ferrite
circulator type is used as an isolator.

Dual Directional Coupler

High Power Dual Directional Coupler (DDC) is used for measuring the Transmit Power
and reflected power. If reflected power exceeds the specified limit of 2:1 VSWR, video
signal is generated to cut-off the RF drive through control and protection unit.

High power dummy load

High power dummy load is used to test the transmitter with out connecting the antenna
during standalone testing.

Wave-guide Channel

To connect all the components in the required form, flexible sections, E-bends, H-bends
and straight sections are used. Standard W/G sections are being used for this purpose.
Microwave Channel (High Power)

60
Figure below shows the schematic diagram of the microwave channel. The microwave
channel consists of high power amplifier using TWT amplifier and high power RF
plumbing components.

Schematic Diagram of microwave channel

Antenna channel matching requirements

Mismatch in the antenna channel, being the load of the transmitter, significantly decides
of VSWR as seen from the TWT output. According to the Antenna System requirements,
matching of the antenna channel at the transmitter output should be equivalent to VSWR
prescribed margin in frequency range of S band in which the radar operates. It seems to
be difficult to satisfy, because the TWT should operate at VSWR <1, the isolator of
proper directivity has to be applied in the wave-guide channel.

Power Variation along RF line

Max. RF power losses along the output wave-guide channel altogether with VSWR
losses taken into consideration, were calculated for operation on the antenna. Assuming
that RF pulse power at the TWT output is equal 120 kW (min), RF pulse power at the
transmitter output should be contained within in the range of 90 kW in the case of
operation on the antenna. Figure given above shows the power variation along the RF
line.

Solid State Power amplifier

This Solid-state power amplifier is used during the fail-safe mode. A power of 1.5 KW
peak at required duty is delivered to antenna through Solid State Power Amplifier when
liquid cooling fails. This Mode is selected by the operator.

Ion Pump Supply

Ion pump supply is a source of positive voltage about 3.3kV, intended to supply TWT ion
pump, which is integral part of the TWT to maintain the vacuum level inside TWT.
Transmitter Cooling

61
This system is a forced liquid-to-air type, used for cooling sub systems of the F-Band
Transmitter. The primary coolant used for circulation through this transmitter heat loads
is Dematerialized water / Glycol for operation from required range of temperature. The
transmitter employs liquid cooling for TWT, high power circulator, RF dummy load and
high voltage inverter and forced air-cooling for all other sub-assemblies. Independent of
air-cooling, a dry air with low dew point and dust particles should be applied for wave-
guide pressurizing and for TWT. General design of the cooling is worked out in such a
way that the temperature rise for outlet coolant is around 10C as compared to the inlet
coolant.

62