TRACK 2 CONFERENCE AGENDA

DAY ONE - TUESDAY, JUNE 20

TRACK 1: SUPPLY CHAIN AND WORKFORCE / APPLICATION COMFORT OPTIMIZATION TRACK 1: SUSTAINABILITY / CARBON REDUCTION TRACK 2: MANUFACTURING AND PRODUCTION

DAY TWO - WEDNESDAY, JUNE 21

DAY THREE - THURSDAY, JUNE 22

10:00AM Plenary Panel: Understanding and Developing the Incremental Process of 10:00AM Panel: Integrating Next-gen Technologies to Accelerate the Foam
10:00AM Plenary Panel: Navigating the Current Choppy Supply Chain and Workforce Integrating Sustainability into Foam and Adhesives and Adhesives Production Process
Waters to Build for a Sustainable Foam and Adhesives Future

SESSION TAKING PLACE AT TRACK 1

Moderator: Reuben Correia, New Product Development Manager, Adhesives &
Moderator: Rob Einterz, Supply Chain Manager, Monument Chemical Moderator: Robert Render, President, Lakeside 360 Partners
Inks, Birla Carbon

Ara Surenian, Vice President, Product Management, Plex by Rockwell Automation SESSION TAKING PLACE AT TRACK 1
Jon Timbers, Chief Sustainability Officer, Epsilyte
Khaled Boqaileh, CEO, LabsCubed

Nick Brunet, Chief Operating Officer, Foamco Industries Jeffrey Peet, Global R&D Manager, Adhesives Systems, Saint-Gobain Michael Schwab, Process Engineer and Head of Technical Center, UTH GmbH

TRACK 2: APPLICATION SAFETY & SECURITY Ashley Kongs, NA Sustainability Leader, Dow
Sze-Sze Ng, Principal Technical Service Scientist, Dow Inc
11:30AM Panel: Empowering and Enabling Global Electrification Thermal Management
with Advanced Foams and Adhesives TRACK 2: RECYCLING 11:00AM Morning Break

Moderator: Michael Owens, Business Development Manager – EV & OEM Southwest 11:30AM Presentations: Materials Testing
Region H.B. Fuller Engineering Adhesives, H.B. Fuller
11:30AM Presentations: Why We Can’t Just Crank Up the Temperature: Outlining a
Roadmap for Foam Material Recycling
Moderator: Reuben Correia, New Product Development Manager, Adhesives & Inks,
Marlen Valverde, Business Development Manager Global Strategic OEM/EV, H.B Fuller Birla Carbon
Moderator: Joshua Sabrowsky, Material Development Engineer, Hyundai-Kia America
Technical Center, Inc.

Renée Goodman, Physicist, Thermtest Instruments Helen Xiang, Technical Director, Intertek
Shakti Mukerjee, Business Division Manager, Rampf Group Inc

Keigo Shimura, R&D Manager, Sekisui Voltek

Arya Hakimian, Application Scientist, C-Therm Technologies
Tiina Luttikhedde, Head of Innovation & Application Development, QolorTech BV

12:30PM Lunch Break 12:30PM End of Foam Expo and Adhesives & Bonding Expo Conference 2023

1:30PM Panel: Assessing Flame-resistant Materials while Incorporating Mila Skokova, R&D Coordinator & Product Manager, H&S Anlagentechnik GmbH
Sustainability and New Regulations

12:30PM Lunch Break

Moderator: Michael Owens, Business Development Manager – EV & OEM Southwest
Region H.B. Fuller, Engineering Adhesives, H.B. Fuller
1:30PM Presentation: Innovating for Change: Assessing the Opportunities of
Adhesive Recycling and Debonding Technologies
Glade Squires, Product Manager, Omya Inc

Moderator: Joshua Sabrowsky, Material Development Engineer, Hyundai-Kia America

Max VanRaaphorst, Business Development Manager - eMobility and Automotive, Technical Center, Inc.
Avery Dennison Performance Tapes

Dylan De Thomas, VP of Public Policy & Government Affairs, The Recycling Partnership
HOW TO USE SLIDO
Niloofar Ketabi, Senior Technical Project Lead, NanoXplore Inc.
Your chance to pose and vote for questions to
Christopher White, Senior Managing Scientist, Exponent be answered by industry-leading professionals
2:30PM Afternoon Break on this year’s conference at Foam Expo and
Adhesives & Bonding Expo

3:00PM Presentation: All the Eye Can See – Outlining the Importance of Adhesives
in the Future Sensor-based World 2:30PM Afternoon Break Connect to wi-fi using the following login details:

3:00PM Presentation: Analyzing the Role of Foam and Adhesives in the

Stage 1 Stage 2
Dave Dworak, Material Scientist, Dymax Corporation WIFI name: slidostage1 WIFI name: slidostage2
Lifecycle Assessment of Future Applications
Password: confstage1 Password: confstage2
Aravinda Bommareddy, Principal Engineer-Materials, ZF Electronics & ADAS Global
Headquarters Moderator: Joshua Sabrowsky, Material Development Engineer, Hyundai-Kia America
Visit www.slido.com on your smartphone
Technical Center, Inc. or scan the QR-code below and enter the
event code #foam23

Nkiruka Ubah, Senior Sustainabilty Consultant, Intertek Select Stage 1 or Stage 2

4 Once on the website, you will have the option to put a

question to the panel or answer one of the polls we will
be running throughout the day
SCAN HERE
4:00PM Networking Reception in Exhibition Hall
4:00PM Networking reception in the exhibition hall

Please note that all information contained in this document is correct at time of going to print.