CONVECTION AND RADIATION

Convection
Characteristics of convection:
• The convection heat transfer mode is comprised of two mechanisms.
oEnergy transfer due to random molecular motion (diffusion),
oEnergy transfer by motion of the fluid.
• Large numbers of molecules are moving collectively or as aggregates. Such motion, in the presence
of a temperature gradient, contributes to heat transfer.
• The convection heat transfer mode is sustained both by random molecular motion and by the bulk
motion of the fluid within the boundary layer.

A consequence of the fluid–surface interaction is the

development of a region in the fluid through which the
velocity varies from zero at the surface to a finite value u
associated with the flow. This region of the fluid is known
as the hydrodynamic, or velocity, boundary layer.
 Convection heat transfer may be classified according to the nature of the flow.
• Forced convection when the flow is caused by external means, such as by a fan, a pump, or atmospheric winds.
• Free (or natural) convection, the flow is induced by buoyancy forces, which are due to density differences caused by
temperature variations in the fluid.

Mechanism of free convection:

•Air that makes contact with the components experiences an increase in temperature and hence a reduction
in density.
•Since it is now lighter than the surrounding air, buoyancy forces induce a vertical motion for which warm air
ascending from the boards is replaced by an inflow of cooler ambient air.

a. As an example of forced convection, consider the use of a fan to provide forced convection air cooling of hot
electrical components on a stack of printed circuit boards
b. An example of free convection is the free convection heat transfer that occurs from hot components on a
vertical array of circuit boards in air.
 Convection
Typical values of the convection heat transfer coefficient

Regardless of the nature of the convection heat transfer process, the appropriate rate equation is The
Newston´s Law of Cooling
where :
•the convective heat flux (W/m2), is proportional to the difference between the surface and fluid
temperatures, Ts and T∞, respectively.
•the parameter h (W/m2 K) is termed the convection heat transfer coefficient which depends on
conditions in the boundary layer, which are influenced by surface geometry, the nature of the fluid
motion, and an assortment of fluid thermodynamic and transport properties.
the convection heat flux is presumed to be positive if heat is transferred from the surface
and negative if heat is transferred to the surface .
Convection – Accelerating Heat Transfer

and

Turbulence flow
increase h coefficient

Fan to increase heat

flux and h coefficient
In particular, an analogy exists between the diffusion of heat and electrical
charge. Just as an electrical resistance is associated with the conduction of
electricity, a thermal resistance may be associated with the conduction of heat.

the thermal resistance for conduction in a plane wall is

A thermal resistance may also be associated with heat transfer by convection at a

surface. From Newton’s law of cooling

The thermal resistance for convection is then

Thermal Resistance and Circuit
qx is constant throughout the network

Because the conduction and convection resistances are

in series and may be summed, it follows that

Radiation exchange between the surface and surroundings may also be important if the convection
heat transfer coefficient is small (as it often is for natural convection in a gas). A thermal resistance for
radiation may be defined by
Composite Wall
Equivalent thermal circuits may also be used for more complex systems, such as composite walls. Such
walls may involve any number of series and parallel thermal resistances due to layers of different
materials. Consider the series composite wall. The one-dimensional heat transfer rate for this system may
be expressed as

Since qx is constant, then

Equivalent thermal circuit
Composite walls may also be characterized by
series–parallel configurations. Subject to this
assumption, two different thermal
circuits may be used.

2 cases applied
(a) it is presumed that surfaces normal to the x-
direction are
Isothermal

(b) it is assumed that surfaces parallel to the x-

direction
are adiabatic.

In this class, we will apply the first case (case A)

Radiation heat transfer can be written also in
the form of thermal circuit analogy

Or

Where
Summary
Summary of 1D planar heat transfer:
1.Qx is constant accros all points independent of x
2.Temperature depends on x and it‘s linearly depdendent
3.Thermal resistance can be written as absolut or per
unit area

Thermal resistance for 1D planar coordinate:

Exercise
1. Thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-
thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed
surfaces are cooled by air, which is at a temperature of 25C and provides a convection
coefficient of 100 W/m2 K. If the chip dissipates 104 W/m2 under normal conditions, will
it operate below a maximum allowable temperature of 85C?
1 Dimensional Steady State Radial Systems

For steady-state conditions with no heat generation, the appropriate form of the heat equation

The rate at which energy is conducted across any cylindrical surface in the solid may be expressed as

where A 2rL is the area normal to the direction of heat transfer

the temperature distribution in the cylinder

Note that the temperature distribution without internal energy generation associated with radial
conduction through a cylindrical wall is logarithmic, not linear, as it is for the plane wall under the
same conditions. the

heat transfer rate

For radial conduction in a cylindrical wall, the thermal resistance is of

the form
Consider now the composite system of Figure 3.8. Recalling how we treated the
composite plane wall and neglecting the interfacial contact resistances, the heat
transfer rate may be expressed as

or
Exercise

A steam pipe of 0.12-m outside diameter is insulated with a layer of

calcium silicate. If the insulation is 20 mm thick and its inner and outer
surfaces are maintained at Ts,1 800 K and Ts,2 490 K, respectively, a. The
thermal resistance b. what is the heat loss per unit length (q) of the pipe?
Exercise
A spherical Pyrex glass shell has inside and outside diameters of D1 0.1 m and D2
0.2 m, respectively. The inner surface is at Ts,1 100C while the outer surface is at
Ts,2 45C.
(a) Determine the temperature at the midpoint of the shell thickness, T(rm 0.075
m).
(b) For the same surface temperatures
Summary

One-dimensional, steady-state solutions to the heat equation with no internal

energy generation
Radiation
Thermal radiation is energy emitted by matter that is at a non-zero temperature. Although we will focus
on radiation from solid surfaces, emission may also occur from liquids and gases. Characteristics:
• The energy of the radiation field is transported by electromagnetic waves (or alternatively,
photons).
• In fact, radiation transfer occurs most efficiently in a vacuum. While the transfer of energy by
conduction or convection requires the presence of a material medium, radiation does not.
Radiation that is emitted by the surface originates from the thermal energy of matter bounded by the
surface, and the rate at which energy is released per unit area (W/m2) is termed the surface emissive
power, E. There is an upper limit to the emissive power, which is prescribed by the Stefan–Boltzmann law

where Ts is the absolute temperature (K) of the surface and is the Stefan–Boltzmann constant (σ = 5.67
10-8 W/m2 .K4). Such a surface is called an ideal radiator or blackbody. where is a radiative property of the
surface termed the emissivity. With values in the range , this property provides a measure of how
efficiently a surface emits energy
relative to a blackbody. It depends strongly on the surface material and finish.
Radiation

A special case that occurs frequently involves radiation exchange between a small surface at Ts and a much
larger, isothermal surface that completely surrounds the smaller one (Figure 1.6b). The surroundings could,
for example, be the walls of a room or a furnace whose temperature Tsur differs from that of an enclosed
surface
Radiation – Deccelerating Heat Transfer

Covering the surface by ladle cover or slag additive

Summary of 3 heat transfer processes
The concept of thermal resistance

the heat transfer rate can be expressed in the form

where T is a relevant temperature difference and A is the area normal to the direction
of heat transfer. The quantity Rt is called a thermal resistance and takes different forms
for the three different modes of heat transfer.
 2. Convection
With the surface of your hand at a temperature of 30C, determine the convection
heat flux for
(a) a vehicle speed of 35 km/h in air at 5 °C with a convection coefficient of 40 W/m2. K
and
(b) a velocity of 0.2 m/s in a water stream at 10 °C with a convection coefficient of 900
W/m2.K.
3. Radiasi
• Latihan Soal
• Suatu Pipa horizontal yang terbuat dari logam teroksidasi
dengan diameter luar 0,0254 m (1 inchi) dan Panjang 0,61 m
(2ft) dengan suhu permukaan 588 K (600 F) berada dalam
dapur luas dengan dinding batu tahan api dan lingkungan
udara pada 1088 K (150 F). Emisivitas pipa logam adalah 0,6
pada 1088 K dan 0,46 pada 588 K. Hitung laju perpindahan
panas ke pipa radiasi?
Thank you 
Convection
Example of free convection:
• Boiled liquid moves from bottom to top
• Cold air of air conditioning system moves to bottom of the conditioned room
• Hot air in heat furnace treatment is on the top part of the furnace (Pay attention on the temperature
differnce on the metal that you heat treated)
• Trapped gas in the bottom of ladle tries to escape from the ladle. And it always causes explosion or
metal splashing (which causes injury or death)