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Spectroscopy (XPS)
David Echevarría Torres
University of Texas at El Paso
College of Science
Chemistry Department
Outline
XPS Background
XPS Instrument
How Does XPS Technology Work?
Auger Electron
Cylindrical Mirror Analyzer (CMA)
Equation
KE versus BE
Spectrum Background
Identification of XPS Peaks
X-rays vs. e- Beam
XPS Technology
XPS Background
XPS technique is based on Einstein’s idea about the
photoelectric effect, developed around 1905
Core e-
Atom
Binding Energy (BE)
The Binding Energy (BE) is characteristic of the core electrons for each element. The BE is
determined by the attraction of the electrons to the nucleus. If an electron with energy x
is pulled away from the nucleus, the attraction between the electron and the nucleus
decreases and the BE decreases. Eventually, there will be a point when the electron will
be free of the nucleus.
x
These electrons are
attracted to the
p+ proton with certain
binding energy x
Energy Levels
Vacumm Level
X-Ray Source
Ion Source
SIMS Analyzer
Sample introduction
Chamber
Sample Introduction Chamber
The sample will be introduced
through a chamber that is in
contact with the outside
environment
First Chamber
Second Chamber UHV
Diagram of the Side View
of XPS System
X-Ray source
Ion source
Detector
SIMS
Analyzer Axial Electron Gun
Sample introduction
Chamber
Sample
Holder
sample
CMA
Removing contamination
To remove the contamination the sample surface is bombarded
with argon ions (Ar+ = 3KeV).
heat and oxygen can be used to remove hydrocarbons
Valence electrons
proton
neutron
electron
Core electrons
electron vacancy
Atoms layers
X-Rays on the Surface
The X-Rays will penetrate to the core e- of the atoms in
the sample.
Other e-s will come from inner layers and collide with other
e-s of upper layers
These e- will be lower in lower energy.
They will contribute to the noise signal of the spectrum.
X-Rays and the Electrons
Electron without collision X-Ray
Auger electrons
e- Vacancy
Atom layers
Cylindrical Mirror Analyzer (CMA)
The electrons ejected will pass through a device
called a CMA.
The voltages on the CMA for XPS and Auger e-s are
different.
Cylindrical Mirror Analyzer (CMA)
When the e-s pass through the metal cylinders,
they will collide with one of the cylinders or they
will just pass through.
If the e-’s velocity is too high it will collide with the
outer cylinder
If is going too slow then will collide with the inner
cylinder.
Only the e- with the right velocity will go through the
cylinders to reach the detector.
Slit
0V 0V
+V +V
+V +V
Sample
Holder
0V 0V
Detector
Equation
KE=hv-BE-Ø
1000 eV 0 eV
E E E
KE increase from left to right
Binding energy
(eV)
Interpreting XPS Spectrum:
Background
The X-Ray will hit the e-s
in the bulk (inner e-
layers) of the sample N = noise
# of electrons
e- will collide with other e-
from top layers, N4
decreasing its energy to
contribute to the noise, at
lower kinetic energy than N3
the peak . N2
The background noise N1
increases with BE because
the SUM of all noise is
taken from the beginning
of the analysis. Binding energy
Ntot= N1 + N2 + N3 + N4
XPS Spectrum
The XPS peaks are sharp.
O Auger
O because
of Mg source
C O 2s
Al
Al
Electron Beam
It can be focused on a particular area
of the sample to determine the
composition of selected areas of the
sample surface.
XPS Technology
Consider as non- Applications in the
destructive industry:
because it produces soft Polymer surface
x-rays to induce Catalyst
photoelectron emission
from the sample surface Corrosion
Adhesion
Provide information Semiconductors
about surface layers Dielectric materials
or thin film structures Electronics packaging
Magnetic media
Thin film coatings
References
Dr.William Durrer for explanations on XPS
technique, Department of Physics at UTEP.
www.uksaf.com
www.casaxps.com
www.nwsl.net
XPS instrument from the Physics
Department.
Acknowledgements
Elizabeth Gardner, Ph.D.
from the Department of Chemistry at the
University of Texas at El Paso