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HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page
Page 22
Overview
• To utilize field resources efficiently
• To Complete SSVs in single visit on site
• Avoid delays & extra visit on sites
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page
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How To Perform Site Audit
Rigger must perform following tasks during site audit:
• All riggers must know how to measure RF height, azimuth, M & E tilts
• Use safety belts & helmets while climbing on tower/pole.
• Measure building height (Including foundation height in case of self-support towe
r) using measurement tape.
• Identify Zong antennas by locating Zong asset tags on them.
• Measure antenna height (on tower or pole) using measurement tape.
• Ask DT engineer to hold the base of the measuring tape to avoid swap related erro
r in measurement.
• Note: Measure height from center of antenna.
• RF Height will be sum of building height & antenna height on tower/pole
• In case of any sector blocking due to antenna/Microwave or buildings or shadowing
due to building etc. take pictures & inform DT coordinator.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page
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How To Perform Site Audit (Continued.)
• Measure azimuth, M Tilt & E Tilt of both 2G & 3G antennas & take clear pictures o
f M & E tilts.
• Note: In case of any mismatch between plan & implemented parameters confirm with
DT coordinator. Azimuth should match 2G data & M and E tilt must match design dat
a.
• Communicate audit data with DT coordinator.
• Take snaps of coverage area of all sectors in direction of antennas.
• Identify if there is any issue of Shadowing from building roof / Blocking from ne
arby sites / Blocking from Shades / Fences on sites. Explain to DT coordinator an
d update in SSV issues tab. Even suspected cases should be mentioned and snaps ta
ken. (explained below)
• DT coordinator to record all changes, (probable) issues in a separate sheet in SS
V. This tab will be removed prior to submission to customer.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page
Page 55
How To Measure M Tilt & E Tilt
M.Tilt = 2 E.Tilt = 4
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page
Page 66
Antenna Front View Snap & Azimuth Information
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page
Page 77
Requirements before DT
• Softwares Required for Drive Testing & Analysis Must be Installed on DT Enginee
r’s Laptops. Installation of following softwares is required:
• TEMS Investigation 14.0
• Genex Probe 3.6
• Genex Assistant 3.6
• Dongle Driver
• GPS Driver
• Cell Phone Driver (UMTS USB Universal U2800)
• Data Terminal Driver (Mobile Partner)
• File Zilla Client 3.7.4.1
• Internet Download Manager 6.19
• Net Per Second 1.1
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page
Page 88
Requirements before DT (Continued)
• Updated Cell File
• Drive Test Route
• Drive Test Plan File
• Access to FTP Server for Downloading / Uploading
IP: 10.81.5.62
ID: test
Password: test123
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page
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Requirements before DT ( Continued.)
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
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Requirements before DT ( Continued.)
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
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Requirements before DT ( Continued.)
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 12
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How To Perform SSV
Static Testing
• First DT Engineer should assist rigger in measuring height from Tape (Building +
Tower), not required for monopole / tripod.
• When rigger is performing site audit DT engineer will perform static tastings on
all sectors in parallel
• Find a point where RSCP > -60dBm & EcIo > -5 dBm
• UARFCN, PSC & LAC verification on all sectors
• Sector Swap Verification (Check serving PSC)
• Audio Call testing, 5 calls of 30 sec duration
• Video Call testing, 5 calls of 30 sec duration (On one sector only).
• SMS from MS1 to MS2
• MMS from MS1 to MS2
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 13
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How To Perform SSV (Continued)
• HSDPA functionality & throughput testing using data card for at least 5 minutes
( Acceptable threshold is average 9 Mbps for HSPA+ & 15 Mbps for DC-HS
PA+ throughput is required), take snaps for SSV of TEMS throughput graph as Netme
ter is not accurate, ensure Cell ID is visible in snap.
• HSUPA functionality & throughput testing using data card for at least 5 minutes
( Target threshold is average 1 Mbps & 2Mbps maximum throughput is requi
red), take snaps for SSV.
• Use large files for throughput testing to get required throughputs.
• Forced dedicated CS IRAT testing 3G2G
• Forced idle cell reselection testing 3G2G & 2G3G
• Send the snaps of Throughput / RSCP / EcIo from the site to coordinator for verif
ication.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 14
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How To Perform SSV (Continued)
Coverage Testing
• Coverage testing for complete site on given routes. MS1 in idle mode & MS 2 in de
dicated mode. (at least HO to neighboring site and stable on it) if neighboring s
ite is not 3G do more than 85% of inter site distance.
• Drag in direction of sector where there is no 3G site for PS IRAT testing.
• In case of coverage issue in front of antenna inform DT coordinator.
• Check for Blocking / Shadowing from neighboring high-rise buildings causing low R
SCP. Also do other routes where this shadowing can be avoided to confirm.
• Take snaps of that building from shadowing position.
• Send the exports from the site to coordinator for verification.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 15
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How To Perform SSV (Continued)
Parameters to be monitored
• UARFCN
• PSC
• RSCP
• EcIo
• LAC, etc.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 16
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How To Perform SSV (Continued)
Throughput Snap
• TEMS throughput graphs are required.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 17
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Possible Issues During SSV ( Continued.)
Sector Swap
• Wrong PSC Serving
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 18
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Possible Issues During SSV ( Continued.)
Weak Coverage
• Bad RSCP
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 19
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Possible Issues During SSV ( Continued.)
Weak Coverage
• Bad EcIo
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 20
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Possible Issues During SSV ( Continued.)
Shadowing
• Bad RSCP & EcIo
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
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Possible Issues During SSV ( Continued.)
Shadowing
• Bad RSCP & EcIo
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 22
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Possible Issues During SSV ( Continued.)
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 23
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How To Perform Cluster DT
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 24
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How To Perform Cluster DT (Continued)
• Team 1: should connect 2 cell phones with laptop. UE 1 on CS state & UE2 on PS R9
9. CS call duration is 180 sec with 15 sec idle period. PS R99 duration is 90 sec
with 15 sec idle period.
• Team 2: should connect 1 HSPA terminal & a cell phone with laptop. Using script a
file of 15~20 MB will be downloaded with 15 sec idle period. Cell phone will be c
onnected in idle mode throughout the DT.
• Team 3: should connect 1 HSPA terminal with laptop. Using script a file of 4~6 GB
will be downloaded with 15 sec idle period.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 25
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How To Perform Cluster DT (Continued)
• Cluster DT includes CS short call, PS R99 short call, HSPA Short Secessions and H
SDPA continuous downloading test. (These tasks are distributed to 3 teams.)
• No extra routes to be covered except given routes (If in case moving further requ
ired do stop the logs & resume when come inside cluster)
• If DT on any given route is not possible find a parallel road & cover it.
• Monitor RSCP & do inform immediately in case of any low RSCP patch observed
• Inform about any sector swap, weak coverage (i.e. RSCP), bad EcIo patches, unders
erving or overshooting sector
• Do not go to routes in coverage of any down site. (coordinator to check before se
nding team for any persistent down site and remove its area) to be performed sepa
rately. Sites observed down during testing cannot be avoided. Will also be tested
later.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 26
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How To Perform Cluster DT (Continued)
• More than 85% of cluster sites should be integrated & coverage should be continuo
us.
• UE should be adjusted as GSM/UMTS auto mode
• Each team should use Drive Test Plan File to conduct cluster DT.
• Each log file should be up to 5MB size.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 27
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Responsibilities of DT Coordinator
a) Ensure installation of all required softwares & implement all settings on laptop
of DT Engineers.
b) Arrange DT teams (i.e. car, engineer with DT kit, rigger with kit) on required s
ites/clusters on time.
c) Coordination with Huawei / Zong representatives for access on sites.
d) Provide updated cell files to teams.
e) Share access of FTP server with teams
f ) Provide approved DT routes to teams.
g) Maintain activity / site audit trackers
h) Maintain TEMS RSCP, EcIo, DL & UL Throughput based worksheet of every cell
i ) Sharing SSV / Cluster DT reports on time.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 28
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Attachments
• SSV Template
Microsoft Excel
Worksheet
• Cluster DT Template
Microsoft Word
Document
Microsoft Excel
Worksheet
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 29
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Thank you
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