ELECTRONIC ASSEMBLIES

NAME : MOHD ROSDAN BIN MOHAMAD IPC-A-610E

E-MAIL : rosdan_Mohamad@psas.edu.my
DATE : 11 OKTOBER 2016
1. Component Mounting – Orientation – Horizontal

Target - Class 1,2,3

• Components are centered between their
lands.
• Component markings are discernible.
• Nonpolarized components are oriented so
that markings all read the same way (left-
to-right or top-to-bottom).

Acceptable - Class 1,2,3

• Polarized and multilead components are
oriented correctly.
• All components are as specified and
terminate to correct lands.
• Nonpolarized components are not oriented
so that markings all read the same way
(left-to-right or top-to-bottom).
1. Component Mounting – Orientation – Horizontal (cont.)

Defect - Class 1,2,3

• Component is not as specified
(wrong part) (A).
• Component not mounted in correct
holes (B).
• Polarized component mounted
backwards (C).
2. Component Mounting – Orientation – Vertical

Target - Class 1,2,3

• Nonpolarized component markings read
from the top down.
• Polarized markings are located on top.

Acceptable - Class 1,2,3

• Polarized marking hidden.
• Nonpolarized component markings read
from bottom to top.

Defect - Class 1,2,3

• Polarized component is mounted
backwards.
3. Radial Leads – Horizontal
Target - Class 1,2,3
• The component body is in flat contact with
the board’s surface.

Acceptable - Class 1,2,3

• Component in contact with board on at least 1 side and/or
surface.
Note: When documented on an approved assembly drawing, a
component may be either side mounted or end mounted. The
body may need to be bonded or otherwise secured to the
board to prevent damage when vibration and shock forces
are applied.

Defect - Class 1,2,3

• Unbonded component body not in contact
with mounting surface.
4. Component Mounting – Lead Forming – Bends

Acceptable - Class 1,2,3

• The inside bend radius of component leads
meets requirements of Table 7-1.
Table 7-1 Lead Bend Radius

Lead Diameter (D) Minimum Inside

or Thickness (T) Bend Radius (R)
<0.8 mm [0.031 in] 1 D/T
1.5 D/T
0.8 mm [0.031 in] to
1.2 mm [0.0472 in]
>1.2 mm [0.0472 in] 2 D/T

Note: Rectangular leads use thickness (T).

Acceptable - Class 1
Process Indicator Class 2
Defect - Class 3
• Inside bend radius does not meet
requirements of Table 7-1.

Defect - Class 1,2,3

 4. Component Mounting – Lead Forming – Bends (cont.)
Acceptable - Class 1,2,3
• Leads of through-hole mounted component
extend at least
1 lead diameter or thickness but not
less than 0.8 mm [0.031 in] from the
body, solder bead, or lead weld.
Figure 7-10
1. Solder bead
2. Weld

Acceptable - Class 1
Process Indicator – Class 2
Defect - Class 3
• Lead bend of through-hole mounted component is
less than 1 lead diameter or 0.8 mm [0.031 in],
whichever is less, from the component body, solder
bead

Defect - Class 1,2,3

Lead damaged more than 10%
5. Axial Leaded – Horizontal

Target - Class 1,2,3

• The entire body length of the
component is in contact with the
board surface.
• Components required to be
mounted off the board are at
least 1.5 mm [0.059 in] from the
board surface.
6. Axial Leaded – Vertical
Target - Class 1,2,3
• The clearance (C) of the component body or
weld bead above the land is 1 mm [0.039 in].
• The component body is perpendicular to the
board.
• The overall height does not exceed maximum
design height requirements (H).

Acceptable - Class 1,2,3

• The component or weld bead clearance (C)
above the land meets the requirements of Table
7-2.
• The angle of the component lead does not cause
a violation of minimum electrical clearance.

Table 7-2 Component to Land Clearance

Class 1 Class 2 Class 3

C (min) 0.1 mm 0.4 mm 0.8 mm
[0.0039 in] [0.016 in] [0.031 in]
C (max) 6 mm 3 mm 1.5 mm
[0.24 in] [0.12 in] [0.059 in]
6. Axial Leaded – Vertical (cont.)
Acceptable - Class 1
Process Indicator - Class
2,3
• The component or weld bead clearance (C) is
greater than the maximum given in Table 7-2
• The component or weld bead clearance (C) is
less than the minimum given in Table 7-2.

Defect - Class 1,2,3

• Components violate minimum electrical
clearance.
 7. Radial Leads – Vertical
Target - Class 1,2,3
• Component is perpendicular and base is parallel
to board.
• Clearance between base of component and
Figure 7-33
board surface/ land is between 0.3 mm [0.012 in]
and 2 mm [0.079 in].

Acceptable - Class 1,2,3

• Component tilt does not violate minimum
electrical clearance.
Process Indicator - Class 2,3
C
• Space between component base and board
surface/land is less than 0.3 mm [0.012 in] or
more than 2 mm [0.079 in]

Defect - Class 1,2,3

• Violates minimum electrical clearance.
Note: Some components cannot be tilted due to mating
requirements with enclosures or panels, for example toggle
switches, potentiometers, LCDs, and LEDs.
 8. Component Mounting – Lead Forming – Stress Relief

Acceptable - Class 1,2,3

• Leads are formed to provide stress relief.
• Component lead exiting component body
is approximately parallel to major body
axis.
• Component lead entering hole is
approximately perpendicular to board
surface.
• Component centering may be offset as a
result of the type of stress relief bend.
Figure 7-13
1.Typically 4 - 8 wire diameters
2.1 wire diameter minimum
3.2 wire diameter minimum
8. Component Mounting – Lead Forming – Stress Relief
(cont.)

Acceptable - Class 1 Process

Indicator - Class 2
Defect - Class 3
• Lead bends less than 1 lead diameter or 0.8 mm [0.031
in] away from body seal.

Defect - Class 1,2,3

• Damage or fracture of component body-to-
lead seal.
• No stress relief.
 9. Wire/Lead Protrusion
Table 7-3 Protrusion of Wires/Leads in Supported Holes
Class 1 Class 2 Class 3
(L) min. End is discernible in the solder.1
(L) max.2 No danger of shorts 2.5 mm [0.0984 in] 1.5 mm [0.059 in]

Acceptable - Class 1,2,3

• The leads protrude beyond the land within
the specified minimum and maximum (L) of
Table 7-3, provided there is no danger of
violating minimum electrical clearance.
• The leads meet the design length (L)
requirements when specified.
10. Devices and Sockets

Target - Class 1,2,3

• Standoff step on all leads rests on the land.
• Lead protrusion meets requirements.

Acceptable - Class 1,2,3

10. Devices and Sockets (cont.)

Defect - Class 1,2,3

• Lead protrusion does not meet acceptance requirements
11. Component Mounting – Leads Crossing Conductors

Acceptable - Class 1,2,3

• Sleeve does not interfere with formation of the
required solder connection (A).
• Sleeve covers area of protection designated (B).

Defect - Class 2,3

• Splitting and/or unraveling of
sleeving (A).

Defect - Class 1,2,3

• Component leads and wires required to have
sleeving are not sleeved.
• Damaged/insufficient sleeving does not provide
protection from shorting.
• Sleeving interferes with formation of the required
solder connection.
• A component lead crossing an electrically
noncommon conductor violates minimum
electrical clearance (B).
12. Component Mounting – Lead Forming – Damage

Acceptable - Class 1,2,3

• No nicks or deformation exceeding 10% of
the diameter, width or thickness of the lead.

Defect - Class 1,2,3

• Lead is damaged more than 10% of the lead
diameter or thickness.
• Lead deformed from repeated or careless bending.
13. Jumper Wires – Wire Routing

Target - Class 1,2,3

• Wire routed shortest route.
• Wire does not pass over or under component.
• Wire does not cross component.