ESO 205

Nature and Properties of Materials

Prof. Sandeep Sangal

Department of Materials Science and Materials
Indian Institute of Technology Kanpur

Email: sangals@iitk.ac.in

Course Website: lattice.mse.iitk.ac.in/~sangals

 Plastic Deformation: Some Experimental Observations

- No change in crystal structure and inter-atomic

spacing (i.e., lattice parameter): confirmed by X-Ray
Diffraction
- No change in volume of the material
- Observation of slip traces on the sample surface

TensileStress
Tensile Stress

Slip
Slip Slip
Slip
Lines
Lines Plane
Plane

Slip Lines
within grains
 Plastic Deformation: atomistic mechanism


x
x
d   G  G
d

b
b/2

Permanent
Displacement
Plastic Deformation: atomistic mechanism

x
d


2x b 
   max sin  G max
b
b/2 b
x
for small displacement x
max is the theoretical
2x x Gb
   max G   max  yield stress
b d 2d
For cubic close packed (consider slip on
close packed planes & along directions)
G 3 G
 max  
2 2 5
 G
The theoretical yield stress  max  5
- For metals,Young' s Modulus, E  2.67G
- Shear yield stress is roughly half of tensile yield stress
- Hence the theoretical tensile yield stress becomes :
E
Y 
6

Material E  Y(theoretical)  Y(experimental)

(GPa) (MPa) (MPa)
Iron 211 35000 130
Copper 120 20000 69
Aluminium 70 12000 35
Edge Dislocation
Schematic of an edge dislocation in a
simple cubic crystal
 Burgers Vector, b
Burgers Circuit

S 6 steps 1 S 6 steps 1
F F

5 steps 5 steps 5 steps 5 steps

3 5 steps 2 3 5 steps 2

Burgers Circuit around an Identical Circuit in a perfect

edge dislocation: S123F crystal: S123F

Right Hand FS (or simply RH/FS) convention

Screw Dislocation
Mixed Dislocation
Wide and Narrow Dislocation – dislocation width
Stress needed to move a dislocation – Peierels-Nabarro Stress
  2𝜋 𝑤
−
𝑏
𝜏 𝑝 =3 𝐺 𝑒
In terms of tensile yield stress and the Youngs Modulus (E):
  2𝜋𝑤
−
𝑏
𝜎𝑌 ≈ 2 𝐸 𝑒
Assuming a minimum dislocation width, w  b:

𝜎 𝑌 ≈ 2 𝐸 𝑒− 2 𝜋 ≈ 𝐸 /300
 

Material E  Y(computed)  Y(experimental)

(GPa) (MPa) (MPa)
Iron 211 703 130
Copper 120 400 69
Aluminium 70 230 35
 Common Surface Defects
• Free Surface
• surface energy related to the crystallographic
orientation of the free surface

• Grain Boundaries
• a surface demarcating two crystals (or grains in a
polycrystal) of different orientations

• Stacking Faults
• Fault in the stacking of planes
• e.g., consider the cubic close-packed spacing:
• … ABCABCABCABCABCABCACB ….
• A stacking fault is generated in the case below:
• … ABCABCABABCABCABC …
• C layer is changed to A layer
• Locally, HCP packing
Single Crystal, Polycrystalline and Amorphous
Solids
Different length scales over which the atoms are related to
one another by translational symmetry
Crystal Defects
 Microstructure

(b)
(a)

(c)
(a) Grain structure on a 2D-planar
section of a polycrystal. (b) Highly
magnified view of a small region in
the polycarystal. (c) 3D polyhedral
shape of individual grains.