Professional Documents
Culture Documents
(Disain RF)
GUNAWAN WIBISONO
Chapter 1 Introduction to RF and Wireless
Technology
A Wireless World
RF Design Challenges
Big Picture of
Wireless Communication RF System
in Life Multitude of
Trend in RF Development Disciplines TX and RX
RF Trade-offs
Demand for cost and
performance
The affordability of low cost and multiple functions finds its roots in
Integration
Performance of RF circuits has also improved.
0.9 G 1G (GSM-900)
Year
1980 1990 2000 2010
Tremendous market
Cellular phones: 400 million sold in 2002, 15% growth rate
Wireless LAN cards: 20 million sold in 2002, 40% growth rate
1997 2002
Single-mode / Single-band Dual-mode / Tri-band
PCB size: ~ 90 cm2 PCB size: ~ 35 cm2
Radio: 60 cm2 and 280 components Radio: 15 cm2 and 60 components
Baseband
DSP
2002 2004 2005
802.11a RF transceiver 802.11a/b/g RF transceiver 802.11g SoC
(D. Su, et al. ISSCC’02) (M. Zargari, et al. ISSCC’04) (S. Mehta, et al. ISSCC’05)
0.25-mm CMOS 0.25-mm CMOS 0.13-mm CMOS w/ Deep N-Well
20 mm2 in 64-pin QFN 23 mm2 in 64-pin QFN 41 mm2 in 224-ball PBGA
40 inductors > 80 inductors 25% for RF + analog
Friis transmission formula for path loss in free space, line of sight (LOS)
The V.34 modem standard advertises a rate of 33.6 kpbs, and V.90 claims a
rate of 56 kbps, apparently in excess of the Shannon capacity. In fact, neither
standard actually reaches the Shannon limit. Both use compression, but
compute bit rates based on uncompressed data size.
The noise generated at the resistor can transfer to the remaining circuit; the
maximum noise power transfer happens with impedance matching when the
Thévenin equivalent resistance of the remaining circuit is equal to the noise
generating resistance. In this case each one of the two participating resistors
dissipates noise in both itself and in the other resistor. Since only half of the source
voltage drops across any one of these resistors, the resulting noise power is given
by
Close-in
In-band
interferers
if
if
rf Received channels after
Received channels after frequency translation
Received Channels at RF frequency translation
LO
Sensitivity
The minimum (available) signal power needed at the receiver input to provide
adequate SNR at the receiver output to data demodulation
Noise
Insertion Loss
Inter-modulation products
Selectivity
Blockers (in-band and out-of-band)
Phase Noise
Image-Rejection (will be discussed with radio architecture)
Pass Loss
Noise Floor
Receiver selectivity
Nonlinearity
gain compression
inter-modulation
desensitization
cross modulation
Phase noise and blockers
Receiver spurious-free dynamic range (SFDR)
Lower limit set by sensitivity
Upper limit set by selectivity
61
Microwave Active Circuit Design
Prerequisites & Grading Policy
• Prerequisites:
Electromagnetics I & II.
• Grading Policy:
– Homework: 20%
(2 reports for paper review, 4 pages for each,
choosing two topics as introduced in this course )
– Midterm: 40%
– Final Project: 40%
(Circuit design and presentation, choosing one of
the papers you studied)
62
Radio-Frequency Bands (1)
63
Radio-Frequency Bands (2)
64
Radio-Frequency Bands (3)
65
Microwave Communication System (1)
67
Microwave Communication System (3)
68
Microwave Communication System (4)
70
Microwave Communication System (6)
71
Wireless Local Area Network (WLAN)
72
Digital Cellular and Cordless Phone Standards
Standard Multiple Receive Transmit Channel Mod. Region
Access Frequency Frequency Spacing Scheme
(MHz) (MHz) (kHz)
DAMPS TDMA/FDMA 869-894 824-849 30 /4 DQPSK USA
(IS-54)
GSM TDMA/FDMA 935-960 890-915 200 GMSK Europe
73
Specifications for 2G Communication
GSM (Global System for Mobile Communications)
74
Specifications for 3G/4G Communication
77
RF ICs and Modules (1)
LDMOS PA for VHF band GaAs X-band PA SiGe PA for WiMAX
78
System on Chip (SoC)
79
Microwave/millimeter-wave Applications (1)
80
Microwave/millimeter-wave Applications (2)
77 GHz
Automotive Radar
81
Microwave/millimeter-wave Applications (3)
84
S-parameter (2)
Limitations of lumped models At low frequencies most circuits behave in a predictable
manner and can be described by a group of replaceable, lumped-equivalent black
boxes. At microwave frequencies, as circuit element size approaches the wavelengths of
the operating frequencies, such a simplified type of model becomes inaccurate. The
physical arrangements of the circuit components can no longer be treated as black boxes.
We have to use a distributed circuit element model and s-parameters.
85
S-parameter (3)
86
S-parameter (4)
87
S-parameter (5)
88
Network Analyzer (1)
S11,S12 S22,S21
S11,S21 S22,S12
Vector network analyzer (VNA): The vector network analyzer, VNA is a more useful
form of RF network analyzer than the SNA as it is able to measure more parameters about
the device under test. Not only does it measure the amplitude response, but it also looks at
the phase as well. As a result vector network analyzer, VNA may also be called a gain-phase
meter or an Automatic Network Analyzer.
DUT must be measured under a small input power (small-signal operation)
89
Network Analyzer (2)
Formats of S parameters
Log scale plot
Polar
Smith chart
90
Network Analyzer (3)
Large Signal Network Analyzer (LSNA): The large signal network analyzer, LSNA is a
highly specialized for of RF network analyzer that is able to investigate the characteristics
of devices under large signal conditions. It is able to look at the harmonics and non-
linearties of a network under these conditions, providing a full analysis of its operation. A
previous version of the Large Signal Network Analyzer, LSNA was known as the
Microwave Transition Analyzer, MTA
[S]p,f,n
p: input power
f: operation frequency
n: harmonic order
91
Network Analyzer (4)
X-parameters are a unified way of describing nonlinear device-under-test (DUT) behavior:
• Harmonics
• Large signal input & output match
• Large signal isolation and transmission
92
Network Analyzer (5)