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PRODUCT AUDIT CHECKLIST (WO Schedule)
PRODUCT AUDIT CHECKLIST (WO Schedule)
5.9 Does the failure pick and place component flag/ alarm and execution stop when abnormal 1
condition detected ?
5.10 Does the program executing appropriated to the product audit ? 1
5.11 Does the component feeder correct with the requirement ? 1
5.12 Does the PWB part number cross-reference to the PCBA part number and revision on 1
BOM/Loading component? (probably part number affix on packaging]
5.13 Does the Wave solder temperature, conveyor speed determined on the Loading component or 1
Work Instruction ?
5.14 Does the S/N label attached properly refer to Work Instruction, location, alignment, legible, no 1
wrinkle or smeared ?
5.15 Is it the qualification maintain? Review record pertaining qualification 1
C. AOI Inspection
5.16 Is the revision and controlled document provided and followed ? 1
5.17 Are AOI complementary methods, which include solder joint inspection, used for all reflowed 1
parts ?
5.18 Is the AOI programmed update with customer feedback or failure ICT/FCT ? 1
5.19 Does the rejected board put sticker and keep separately with passed board ? 1
5.20 Does the AOI program cover the critical component, solder joint and other specify from customer ? 1
5.21 Is the Passed board stamp in a uniquely location to identify after AOI passed ? 1
D. Manual Inspection
5.22 Is the revision and controlled document provided and followed ? 1
5.23 Is the equipment (microscope, luxo lamp, stamp, acetone, ethanol, etc) mentioned and required at 1
Work Instruction ?
5.24 Does the Rejected park identify and separated with passed board? 1
5.25 Does the Critical component inspection addressed on the Work Instruction and followed ? 1
5.26 Is it record maintain ? Review the record pertaining quality product audit. 1
6. AUTO INSERT
6.1 Is the revision controlled Work Instruction displayed for operator to executed ? 1
6.2 Does the part appropriate with the product specification BOM/ Loading list ? 1
6.3 Is the Lead length; lead angle; polarity and value met the requirement ? 1
The minimum sampling taken for verification
7. COMPONENT PREPARATION & MANUAL INSERT
7.1 Is the revision controlled Work Instruction displayed for operator to executed ? 1
7.2 Does the cutted component met the specification and tolerance requirement ? 1
(Check the minimum sampling to verify cut/ forming specification)
7.3 Does the equipment/tools details and assigned as per Work Instruction? 1
7.4 Does the Machine cutting specify and standard usage for the model audit ? 1
(The Work Instruction may requested clarifies machine)
8. MANUAL SOLDER & TOUCH UP
9.1 Is the controlled Work Instruction displayed for the operator at testing station ? 1
9.3 Does the first board run already qualified by good sample or master sample ? 1
Record list may require as evidence
9.4 Does the boards put separately 'before and after' tested according to convention ? 1
9.5 Does the rejected board put on the separately bin/tray with reject name/loc/or 1
test printed result ?
9.6 Does the programmed update with the latest version of program or checksum? (Review the 1
evidence on monitor)
9.7 Does the Passed board stamp with specify marking color to indicated if the board 1
has ICT passed ?
9.8 Does the tested result (Good or Rejected) recorded to FPY performance ? 1
10. REWORK & REPAIR
10.1 Is the controlled/updated Work Instruction displayed for the operator at Rework Station ? 1
10.2 Is the capability of each piece of rework equipment defined to ensure the correct equipment is 1
used for the correct rework operation ?
10.3 Is the rework process and equipment used appropriate to met established industry standards ? 1
10.4 Is there a tracking system in place to monitor and limit the number of Reworks conducted on any 1
given unique board serial number ?
10.5 Is the component reworked, replace conducted on the properly station and standard 1
tools/equipments (i.e. IC's,BGA's, Connectors,etc) ?
10.6 Is there chemical liquid use as Work Instruction i.e. Acetone, Ethanol or IPA ? If yes is it control 1
and clear label identification ?
10.7 Is the Equipment solder tip, temperature, time dwell notice on the Work Instruction ? Over heat 1
and time may cause the solder oxidation
10.8 Does the boards after rework/repair returning to visual or AOI inspection with tag information 1
traveler ?
10.9 Does the Rework board been recorded and make the analysis report for traceability and further 1
investigation for improvement ?
11. FCT
11.1 Is the controlled Work Instruction displayed for the operator at testing station ? 1
11.2 Does the first board run already qualified by good sample or master sample ? Record list may 1
require as evidence.
11.3 Does the boards put separately 'before and after' tested according to convention ? 1
11.4 Does the rejected board put on the separately bin/tray with reject name/loc/or test printed result ? 1
Score '0' for unidentify unit rejected.
11.5 Does the programmed update with the latest version of program or checksum? (Review the 1
evidence on monitor) demonstrate if the programmed is appropriate with the latest product
version/revision
11.6 Does the Passed board stamp with specify marking color to indicated if the board has ICT 1
passed ?
11.7 Does the testing result recorded in purpose for FPY performance ? 1
12. FINAL VISUAL INSPECTION
12.1 Is the controlled Work Instruction displayed for the operator at final visual station ? 1
12.2 Is the operator inspect the critical point, location, assy. based on the Work Instruction? 1
12.3 Is the customer defect/complaint (if any) summaries and highlighted ? 1
12.4 Is the operator separate the rejected board and make the identity before send it to Rework/repair 1
in convension ?
12.5 Does the result inspection for total output being recorded for FPY performance ? 1
12.6 Inspect the passed boards with minimum sampling quantity, and check the rejected boards (if 1
available), score '0' for undefined label of rejection.
12.7 Does the passed board packing/wrap properly when it submit to next level ? 1
13. OUT GOING INSPECTION
13.1 Is the controlled Work Instruction displayed for the operator at OQA inspection station ? 1
13.2 Is the operator inspect the critical point, location, assy. based on the Work Instruction? 1
13.3 Is the Customer spec. involved at the inspection instruction? (if available) 1
13.4 Does the AQL inspection established and appropriate with model inspected ? 1
13.5 Is the customer defect/complaint (if any) summaries and highlighted ? 1
13.6 Is the unit inspect under the proper light, magnifying or microscope define on Work Instruction the 1
product requirement ?
13.7 Take the minimum sampling for verify the products met requirement: 1
a) Is the Label serial attached properly ? 1
b) Is the Solder anomalies met requirement ? (Refer to IPC-610D) 1
c) Is stamp ICT,FCT, FVI, AOI, Rework avaliable ? Verify the stamp uniformity location. 1
d) Is the component orientation, alignment correct ? 1
e) Is the board free contamination (cleaning sufficient) ? Verify the units. 1
f) Is date code present on board, location, legible and correct ? 1
13.8 Is the communication conducted when the nonconforming find ? CAR, NCR, etc. 1
13.9 Inspect the passed boards with minimum sampling quantity, and check the rejected boards (if 1
available)
13.10 In case of Rework submission, Is the OQC perform the 100 % inspection ? 1
Score '0' for sampling use.
Tar. Act. Note, Objectives Evidence
S/N Question / Description
Score Score [Document number listed]
13.11 Does the data inspected per sampling record and maintained for traceability retained 1
Tar. Act. Note, Objectives Evidence
S/N Question / Description
Score Score [Document number listed]
14. PACKING
14.1 Is the controlled Work Instruction displayed for the operator at packaging station ? 1
The packaging list established ? .
14.2 Is the any method to maintain packing area to ward off messy or disarrangement ? 1
At least the FIFO or chain link system is provided.
14.3 Does the packing material (box/carton, bubble bag, antistatic bag, etc) part number listed on the 1
Work Instruction or standard operating procedure ?
14.4 Review the packing, does the packing met requirement ? (check the units inside box with minimum 1
sampling)
a) Is carton box correct (part number, size) ? 1
b) Is the bubble bag, antistatic bag correct and present ? 1
c) Is the board direction correct inside box ? 1
d) Is the label box correct i.e. model name, part name, customer 1
name, quantities, date, signet ?
e) Are the actual quantities appropriate with label ? 1
f) Is the label patched after the unit insert ted and before selaed the box ? 1
f) Is the packaging sealed properly ? 1
14.5 Is the loose box notified and recorded ? 1
a) Is the support part/material determined for loose box and documented ? 1
14.6 Does the packaging result recorded and maintain ? 1
The retention time may required for tracebility of customer feedback or complaining.
MAXIMUM SCORE 147 147
OBTAINED SCORE 147 0
OBTAINED % 100% 0%
PASSED % 80% 80%
OUT COME Pass Fail
Ref: QEP-GEN-006
PRODUCT AUDIT SUMMARY
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