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Line-2 2 9 NC
GND 3 8 GND
1 2 4 5
Line-3 4 7 NC
3,8 Line-4 5 6 NC
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL RATING UNITS
Peak Pulse Current (tp= 8/20µs) IPP 6 A
Operating Voltage (I/O pin-GND) VDC (GND – 0.5) to 3.6 V
ESD per IEC 61000-4-2 (Air) 18
VESD kV
ESD per IEC 61000-4-2 (Contact) 16
o
Lead Soldering Temperature TSOL 260 (10 sec.) C
o
Operating Temperature TOP -55 to +85 C
o
Storage Temperature TSTO -55 to +150 C
ELECTRICAL CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Reverse Stand-Off
VRWM Pin-1,-2,-4,-5 to pin-3,-8, T=25 oC 3.3 V
Voltage
Channel Leakage VPin-1,-2,-4,-5 = 3.3V, VPin-3,-8 = 0V,
ICH-Leak 1.0 µA
Current T=25 oC
Reverse Breakdown IBV = 1mA, T=25 oC, pin-1,-2,-4,-5 to
VBV 4.5 V
Voltage pin-3,-8
IF = 15mA, T=25 oC, pin-3,-8 to
Forward Voltage VF 0.9 1.1 V
pin-1,-2,-4,-5
ESD Clamping IEC 61000-4-2 +6kV, T=25 oC,
Vclamp 9 V
Voltage Contact mode, any I/O pin to Ground
ESD Dynamic IEC 61000-4-2, 0~+6kV, T=25 oC,
Rdynamic 0.24 Ω
Turn-on Resistance Contact mode, any I/O pin to Ground
Channel Input Vpin-3,-8 = 0V, VIN = 1.65V, f = 1MHz,
CIN 0.45 0.65 pF
Capacitance T=25 oC, any I/O pin to Ground
Channel to Channel Vpin-3,-8 = 0V, VIN = 1.65V, f = 1MHz,
CCROSS 0.05 0.1 pF
Input Capacitance T=25 oC, between I/O pins
Typical Characteristics
Typical Variation of CIN vs. VIN Typical Variation of CIO-to-IO vs. VIN
0.8 0.10
0.09 f = 1MHz, T=25 oC,
0.7 f = 1MHz, T=25 oC,
0.08
0.6
0.07
0.5 0.06
0.4 0.05
0.3 0.04
0.03
0.2
0.02
0.1
0.01
0.0 0.00
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
Input Voltage (V)
Input Voltage (V)
-6 0
Insertion Loss (dB)
-9 -10
-12 -20
-15 -30
-18 -40
-21 -50
-24 -60
8.1GHz : -3dB
-27 -70
-30 -80
1e+8 1e+9 1e+10 1e+8 1e+9 1e+10
Frequency (Hz) Frequency (Hz)
18
16
14
V_pulse
12 Pulse from a
transmission line
TLP_I
10 100ns +
TLP_V DUT
8 -
2 I/O to GND
0
0 1 2 3 4 5 6 7 8 9 10 11
Transmission Line Pulsing (TLP) Voltage (V)
Applications Information
The AZ1143-04F is designed to protect four These pins should be directly connected to the
data lines from transient over-voltage (such as GND rail of PCB (Printed Circuit Board). To get
ESD stress pulse). The device connection of minimum parasitic inductance, the path length
AZ1143-04F is shown in the Fig. 1. In Fig. 1, the should keep as short as possible.
four protected data lines are connected to the AZ1143-04F can provide ESD protection for
ESD protection pins (pin1, pin2, pin4, and pin5) 4 I/O signal lines simultaneously. If the number of
of AZ1143-04F. The ground pins (pin3 and pin8) I/O signal lines is less than 4, the unused I/O pins
of AZ1143-04F are the negative reference pins. can be simply left as NC pins.
GND GND
3 8
Line-3
4 7 NC
Line-4
5 6 NC
I/O 3 I/O 3
To To
data line Protected
I/O-port
Connector IC
I/O 4 data line I/O 4
none adjustment to the board layout parameters example, line 1 enters at pin 1 and exits at Pin 10
to compensate for the added capacitance of the and the PCB trace connects pin 1 and 10
AZ1143-04F. Figure 2 shows how to implement together. Lines 2, 3, and 4 have the same way of
the AZ1143-04F in a HDMI application. connection. The ground pins (pin3 and pin8) of
The AZ1143-04F is designed for allowing the AZ1143-04F are the negative reference pins.
traces to run straight through the device to These pins should be directly connected to the
simplify the PCB layout. As shown in Figure 2, GND plane of PCB. To get minimum parasitic
the best way to design the PCB trace is using the inductance, the path length should keep as short
flow through layout. The solid line represents the as possible. In Figure 2, the none-TMDS
PCB trace. Note that the PCB traces are used to signals, DDC_CLK, DDC_DAT, CE_REMOTE,
connect the pin pairs for each line (pin 1 to pin 10, and HOTPLUG_DET, can be protected with
pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). For another low cost part, e.g., AZC199-04S.
TMDS_D2+
TMDS_D2+ Line-1 1 10 NC
TMDS_D2-
AZ1143-04F
TMDS_GND Line-2 2 9 NC
TMDS_D1+ Line-3 4 7 NC
TMDS_D1+
TMDS_GND Line-4 5 6 NC
TMDS_D1-
TMDS_D1-
TMDS_D0+
TMDS_D0+ Line-1 1 10 NC
TMDS_D0-
2 9
AZ1143-04F
TMDS_GND Line-2 NC
TMDS_CK+ Line-3 4 7 NC
TMDS_CK+
TMDS_GND Line-4 5 6 NC
TMDS_CK-
TMDS_CK-
CE_REMOTE
CE_REMOTE
Via hole to GND
N/C
GND DDC_CLK
3 2 1
DDC_CLK
AZC199-04S
DDC_DAT
4 5 6
GND +5V DDC_DAT
Via hole to +5V
+5V OUT
Via hole to GND
C=100nF HOTPLUG_DET
HOTPLUG_DET (optional)
HDMI
Connector
Fig. 3 shows the HDMI 2.0 (6 Gb/s) eye ultra low capacitance of AZ1143-04F, no
diagrams with and without AZ1143-04F. Due to degradation is observed.
Without AZ1143-04F
With AZ1143-04F
Fig. 3 HDMI 2.0 (6 Gb/s) Eye Diagrams with and without AZ1143-04F.
PACKAGE OUTLINE
(DFN2510P10E)
Millimeters Inches
Symbol
min max min max
A 0.40 0.55 0.016 0.022
A1 0.00 0.05 0.000 0.002
A3 0.152REF. 0.006 BSC
D 2.45 2.55 0.096 0.100
E 0.95 1.05 0.037 0.041
D1 0.35 0.45 0.014 0.018
E1 0.35 0.45 0.014 0.018
b 0.15 0.25 0.006 0.010
e 0.5 BSC 0.019 BSC
L1 0.075 REF 0.0029 REF
L2 0.05 REF 0.0019 REF
b2 0.20 0.30 0.0079 0.012
L 0.35 0.45 0.014 0.018
LAND LAYOUT
D D1
Dimensions
Index Millimeter Inches
A B F
A 0.875 0.034
B 0.20 0.008
E C 0.50 0.02
C1 1.00 0.039
C
D 0.25 0.01
C1 D1 0.4 0.016
E 0.675 0.027
Notes: F 1.55 0.061
This LAND LAYOUT is for reference
purposes only. Please consult your
manufacturing partners to ensure your
company’s PCB design guidelines are met.
MARKING CODE
Ordering Information
Revision History