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VNN7NV04 / VNS7NV04

 / VND7NV04 / VND7NV04-1
“OMNIFET II”:
FULLY AUTOPROTECTED POWER MOSFET

TYPE RDS(on) Ilim Vclamp 2


VNN7NV04
VNS7NV04 3
60 mΩ 6A 40 V 2
VND7NV04 1
SOT-223 SO-8
VND7NV04-1

n LINEAR CURRENT LIMITATION


3 3
n THERMAL SHUT DOWN 1
2
1
n SHORT CIRCUIT PROTECTION TO251 (IPAK)
TO252 (DPAK)
n INTEGRATED CLAMP
n LOW CURRENT DRAWN FROM INPUT PIN ORDER CODES:
SOT-223 VNN7NV04
n DIAGNOSTIC FEEDBACK THROUGH INPUT SO-8 VNS7NV04
PIN TO-252 (DPAK) VND7NV04
n ESD PROTECTION TO-251 (IPAK) VND7NV04-1
n DIRECT ACCESS TO THE GATE OF THE
POWER MOSFET (ANALOG DRIVING) intended for replacement of standard Power
MOSFETS from DC up to 50KHz applications.
n COMPATIBLE WITH STANDARD POWER
MOSFET Built in thermal shutdown, linear current limitation
and overvoltage clamp protects the chip in harsh
DESCRIPTION
The VNN7NV04, VNS7NV04, VND7NV04 environments.
VND7NV04-1, are monolithic devices designed in Fault feedback can be detected by monitoring the
STMicroelectronics VIPower M0-3 Technology, voltage at the input pin.

BLOCK DIAGRAM
DRAIN
2

Overvoltage
Clamp

INPUT
Gate
1 Control

Linear
Current
Over Limiter
Temperature

3
SOURCE
FC01000

January 2002 1/20

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

ABSOLUTE MAXIMUM RATING


Value
Symbol Parameter Unit
SOT-223 SO-8 DPAK/IPAK
VDS Drain-source Voltage (VIN=0V) Internally Clamped V
VIN Input Voltage Internally Clamped V
IIN Input Current +/-20 mA
R IN MIN Minimum Input Series Impedance 150 Ω
ID Drain Current Internally Limited A
IR Reverse DC Output Current -10.5 A
VESD1 Electrostatic Discharge (R=1.5KΩ, C=100pF) 4000 V
Electrostatic Discharge on output pin only
VESD2 16500 V
(R=330Ω, C=150pF)
Ptot Total Dissipation at Tc=25°C 7 8.3 57 W
Tj Operating Junction Temperature Internally limited °C
Tc Case Operating Temperature Internally limited °C
Tstg Storage Temperature -55 to 150 °C

CONNECTION DIAGRAM (TOP VIEW)

SO-8 Package (*)

SOURCE 1 8 DRAIN
SOURCE DRAIN
SOURCE DRAIN
INPUT 4 5 DRAIN

(*) For the pins configuration related to SOT-223, DPAK, IPAK see outlines at page 1.

CURRENT AND VOLTAGE CONVENTIONS

ID

VDS
DRAIN
IIN RIN
INPUT

SOURCE

VIN

ORDER CODES
SOT-223 SO-8 TO-252 (DPAK) TO-251 (IPAK)
TUBE VNN7NV04 VNS7NV04 VND7NV04 VND7NV04-1
TAPE & REEL VNN7NV0413TR VNS7NV0413TR VND7NV0413TR -

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

THERMAL DATA
Value
Symbol Parameter Unit
SOT-223 SO-8 DPAK IPAK
Rthj-case Thermal Resistance Junction-case}}} MAX 18 2.2 2.2 °C/W
Rthj-lead Thermal Resistance Junction-lead MAX 15 °C/W
Rthj-amb Thermal Resistance Junction-ambient MAX 70(*) 65(*) 52(*) 100 °C/W

(*) When mounted on a standard single-sided FR4 board with 50mm2 of Cu (at least 35 µm thick) connected to all DRAIN pins.
ELECTRICAL CHARACTERISTICS (-40°C < Tj < 150°C, unless otherwise specified)
OFF
Symbol Parameter Test Conditions Min Typ Max Unit
Drain-source Clamp
VCLAMP VIN=0V; ID=3.5A 40 45 55 V
Voltage
Drain-source Clamp
VCLTH VIN=0V; ID=2mA 36 V
Threshold Voltage
VINTH Input Threshold Voltage VDS=V IN; ID=1mA 0.5 2.5 V
Supply Current from Input
IISS VDS=0V; VIN=5V 100 150 µA
Pin
Input-Source Clamp IIN=1mA 6 6.8 8
VINCL V
Voltage IIN=-1mA -1.0 -0.3
Zero Input Voltage Drain VDS=13V; VIN=0V; T j=25°C 30
IDSS µA
Current (VIN=0V) VDS=25V; VIN=0V 75

ON
Symbol Parameter Test Conditions Min Typ Max Unit
Static Drain-source On VIN=5V; ID=3.5A; Tj=25°C 60
RDS(on) mΩ
Resistance VIN=5V; ID=3.5A 120

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

ELECTRICAL CHARACTERISTICS (continued) (Tj=25°C, unless otherwise specified)


DYNAMIC
Symbol Parameter Test Conditions Min Typ Max Unit
Forward
gfs (*) VDD=13V; ID=3.5A 9 S
Transconductance
COSS Output Capacitance VDS=13V; f=1MHz; VIN=0V 220 pF

SWITCHING
Symbol Parameter Test Conditions Min Typ Max Unit
td(on) Turn-on Delay Time 75 300 ns
VDD=15V; ID=3.5A
tr Rise Time 150 500 ns
Vgen=5V; Rgen=RIN MIN=150Ω
td(off) Turn-off Delay Time 400 1200 ns
(see figure 1)
tf Fall Time 230 700 ns
td(on) Turn-on Delay Time 1.2 4 µs
VDD=15V; ID=3.5A
tr Rise Time 4.5 13.5 µs
Vgen=5V; Rgen=2.2KΩ
td(off) Turn-off Delay Time 7 21 µs
(see figure 1)
tf Fall Time 4 12 µs
VDD=15V; ID=3.5A
(dI/dt)on Turn-on Current Slope 3 A/µs
Vgen=5V; Rgen=RIN MIN=150Ω
VDD=12V; ID=3.5A; VIN=5V
Qi Total Input Charge 18 nC
Igen=2.13mA (see figure 5)

SOURCE DRAIN DIODE


Symbol Parameter Test Conditions Min Typ Max Unit
VSD (*) Forward On Voltage ISD=3.5A; VIN=0V 0.8 V
trr Reverse Recovery Time ISD=3.5A; dI/dt=20A/µs 220 ns
Qrr Reverse Recovery Charge VDD=30V; L=200µH 0.28 µC
IRRM Reverse Recovery Current (see test circuit, figure 2) 2.5 A

PROTECTIONS (-40°C < Tj < 150°C, unless otherwise specified)


Symbol Parameter Test Conditions Min Typ Max Unit
Ilim Drain Current Limit VIN=5V; VDS=13V 6 9 12 A
Step Response Current VIN=5V; VDS=13V
tdlim 25 µs
Limit
Overtemperature
T jsh 150 175 °C
Shutdown
Tjrs Overtemperature Reset 135 °C
Igf Fault Sink Current VIN= 5V; VDS=13V; Tj=Tjsh 15 mA
starting T j=25°C; VDD=24V
Single Pulse
Eas VIN=5V; Rgen=RIN MIN=150Ω; L=24mH 200 mJ
Avalanche Energy
(see figures 3 & 4)

(*) Pulsed: Pulse duration = 300µs, duty cycle 1.5%

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

PROTECTION FEATURES - OVERTEMPERATURE AND SHORT CIRCUIT


During normal operation, the INPUT pin is PROTECTION: these are based on sensing the
electrically connected to the gate of the internal chip temperature and are not dependent on the
power MOSFET through a low impedance path. input voltage. The location of the sensing element
on the chip in the power stage area ensures fast,
The device then behaves like a standard power accurate detection of the junction temperature.
MOSFET and can be used as a switch from DC to Overtemperature cut-out occurs in the range 150
50KHz. The only difference from the user’s to 190 °C, a typical value being 170 °C. The device
standpoint is that a small DC current IISS (typ. is automatically restarted when the chip
100µA) flows into the INPUT pin in order to supply temperature falls of about 15°C below shut-down
the internal circuitry. temperature.
The device integrates: - STATUS FEEDBACK: in the case of an
- OVERVOLTAGE CLAMP PROTECTION: overtemperature fault condition (Tj > Tjsh), the
internally set at 45V, along with the rugged device tries to sink a diagnostic current Igf through
avalanche characteristics of the Power MOSFET the INPUT pin in order to indicate fault condition. If
stage give this device unrivalled ruggedness and driven from a low impedance source, this current
energy handling capability. This feature is mainly may be used in order to warn the control circuit of
important when driving inductive loads. a device shutdown. If the drive impedance is high
enough so that the INPUT pin driver is not able to
- LINEAR CURRENT LIMITER CIRCUIT: limits supply the current Igf, the INPUT pin will fall to 0V.
the drain current ID to Ilim whatever the INPUT pin This will not however affect the device
voltage. When the current limiter is active, the operation: no requirement is put on the current
device operates in the linear region, so power capability of the INPUT pin driver except to be
dissipation may exceed the capability of the able to supply the normal operation drive
heatsink. Both case and junction temperatures current IISS.
increase, and if this phase lasts long enough,
junction temperature may reach the Additional features of this device are ESD
overtemperature threshold Tjsh. protection according to the Human Body model
and the ability to be driven from a TTL Logic
circuit.

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

Figure 1: Switching Time Test Circuit for Resistive Load

VD

Rgen
Vgen

ID

90%

tr tf
10%
t
td(on) td(off)
Vgen

Figure 2: Test Circuit for Diode Recovery Times

A
A
D
I FAST L=100uH
OMNIFET DIODE

S B
B

150Ω D
VDD
R gen
I
OMNIFET

Vgen
S

8.5 Ω

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

Figure 3: Unclamped Inductive Load Test Circuits Figure 4: Unclamped Inductive Waveforms

RGEN
V IN

PW

Figure 5: Input Charge Test Circuit

V IN

Thermal Impedance for DPAK/IPAK Thermal Impedance for SOT-223

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

Source-Drain Diode Forward Characteristics Static Drain Source On Resistance


Vsd (mV) Rds(on) (mOhm)
1000 500
Tj= - 40ºC
950 450
Vin=0V Vin=2.5V
900 400

850 350
Tj=25ºC
800 300

750 250
Tj=150ºC
700 200

650 150

600 100

550 50

500 0
0 2 4 6 8 10 12 14 0 0.25 0.5 0.75 1 1.25
Id(A) Id(A)

Derating Curve Static Drain-Source On resistance Vs. Input


Voltage
Rds(on) (mOhm)
120

110
Id=3.5A
100

90
Tj=150ºC
80

70

60

50
Tj=25ºC
40

30
Tj= - 40ºC
20

10

0
3 3.5 4 4.5 5 5.5 6 6.5 7
Vin(V)

Static Drain-Source On resistance Vs. Input Transconductance


Voltage
Rds(on) (mOhm) Gfs (S)
140 20

18
120 Vds=13V
Tj=150ºC 16
Tj=-40ºC
100 14 Tj=25ºC
Id=6A Tj=150ºC
Id=1A 12
80
10
60 Tj=25ºC
8

Tj=-40ºC Id=6A
40 6
Id=1A
Id=6A 4
20 Id=1A
2

0 0
3 3.5 4 4.5 5 5.5 6 6.5 0 1 2 3 4 5 6 7 8
Vin(V) Id(A)

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

Static Drain-Source On Resistance Vs. Id Transfer Characteristics

Rds(on) (mOhm) Idon(A)


140 10
Tj=25ºC
9
120 Tj=-40ºC
Vds=13.5V
8 Tj=150ºC
Vin=3.5V

100 7
Tj=150ºC
Vin=5V
6
80
5
60 Vin=3.5V
4
Tj=25ºC
Vin=5V
40 3
Vin=3.5V
Tj=-40ºC
Vin=5V
2
20
1

0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Id(A) Vin(V)

Turn On Current Slope Turn On Current Slope

di/dt(A/us) di/dt(A/us)
8 2.25

7 2
Vin=3.5V
6 1.75 Vdd=15V
Id=3.5A
5 1.5

4 1.25

3 1

2 0.75

1 0.5

0 0.25
100 200 300 400 500 600 700 800 900 1000 1100 100 200 300 400 500 600 700 800 900 1000 1100

Rg(ohm) Rg(ohm)

Input Voltage Vs. Input Charge Turn off drain source voltage slope
dv/dt(V/us)
Vin(V)
300
8

7 250
Vds=12V
Id=3.5A Vin=5V
6
200 Vdd=15V
Id=3.5A
5
150
4

100
3

2 50

1
0
100 200 300 400 500 600 700 800 900 1000 1100
0
0 5 10 15 20 25
Rg(ohm)
Qg(nC)

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

Turn Off Drain-Source Voltage Slope Capacitance Variations


dv/dt(v/us) C(pF)
600
300

250
500

Vin=3.5V f=1MHz
200 Vdd=15V Vin=0V
Id=3.5A 400

150

300
100

50 200

0
100
100 200 300 400 500 600 700 800 900 1000 1100
0 5 10 15 20 25 30 35

Rg(ohm) Vds(V)

Switching Time Resistive Load Switching Time Resistive Load


t(us) t(ns)
5.5 1600
tr
5
Vdd=15V tr 1400
4.5 Id=3.5A
td(off) Vdd=15V
4 Vin=5V 1200 Id=3.5A
tf Rg=150ohm
3.5
1000
3

2.5 800

2
600
1.5 td(off)
400
1 tf
td(on)
0.5 200
0 td(on)
0 250 500 750 1000 1250 1500 1750 2000 2250 2500 0
3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25
Rg(ohm) Vin(V)

Output Characteristics Normalized On Resistance Vs. Temperature

ID(A) Rds(on)
12 2.25

11
2
10
Vin=5V
Vin=5V Id=3.5A
9
Vin=4.5V 1.75
8 Vin=4V

7 1.5
6 Vin=3V

5 1.25

4
1
3
Vin=2.5V
2
0.75
1
Vin=2V
0 0.5
0 1 2 3 4 5 6 7 8 9 10 11 12 13 -50 -25 0 25 50 75 100 125 150 175

VDS(V) T(ºC)

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

Normalized Input Threshold Voltage Vs. Current Limit Vs. Junction Temperature
Temperature
Vin(th) Ilim (A)
1.15 15

1.1 14
Vds=13V
Vds=Vin 13
1.05 Vin=5V
Id=1mA
12
1
11
0.95
10
0.9
9
0.85
8
0.8
7

0.75 6

0.7 5
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
T(ºC) Tj (ºC)

Step Response Current Limit

Tdlim(us)
7

6.5
Vin=5V
Rg=150ohm
6

5.5

4.5

3.5
5 10 15 20 25 30 35
Vdd(V)

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

TO-251 (IPAK) MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031
B2 5.2 5.4 0.204 0.212
B3 0.85 0.033
B5 0.3 0.012
B6 0.95 0.037
C 0.45 0.6 0.017 0.023
C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047
L2 0.8 1 0.031 0.039

H
C
A

A3
C2

A1

L2 D L
B3

B6

B5
B
3
=

=
B2

G
E

2
=

=
1

L1

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

TO-252 (DPAK) MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.

A 2.2 2.4 0.086 0.094

A1 0.9 1.1 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.9 0.025 0.035

B2 5.2 5.4 0.204 0.212

C 0.45 0.6 0.017 0.023

C2 0.48 0.6 0.019 0.023

D 6 6.2 0.236 0.244

E 6.4 6.6 0.252 0.260

G 4.4 4.6 0.173 0.181

H 9.35 10.1 0.368 0.397

L2 0.8 0.031

L4 0.6 1 0.023 0.039

R 0.2 0.008

V2 0° 8° 0° 8°
D

C
A

C2

A1

V2
A2
L2

B
=
=

FLAT ZONE
=

0.60 MIN.
B2

G
E

=
=

L4
H

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

SOT-223 MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.

A 1.8 0.071

B 0.6 0.7 0.85 0.024 0.027 0.033

B1 2.9 3 3.15 0.114 0.118 0.124


c 0.24 0.26 0.35 0.009 0.01 0.014

D 6.3 6.5 6.7 0.248 0.256 0.264

e 2.3 0.09

e1 4.6 0.181

E 3.3 3.5 3.7 0.13 0.138 0.146

H 6.7 7 7.3 0.264 0.276 0.287

V 10 (max)

A1 0.02 0.1 0.0008 0.004

0046067

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

SO-8 MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.

A 1.75 0.068

a1 0.1 0.25 0.003 0.009

a2 1.65 0.064
a3 0.65 0.85 0.025 0.033

b 0.35 0.48 0.013 0.018

b1 0.19 0.25 0.007 0.010

C 0.25 0.5 0.010 0.019

c1 45 (typ.)

D 4.8 5.0 0.188 0.196

E 5.8 6.2 0.228 0.244

e 1.27 0.050

e3 3.81 0.150

F 3.8 4.0 0.14 0.157

L 0.4 1.27 0.015 0.050

M 0.6 0.023

F 8 (max.)

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

SOT-223 TAPE AND REEL SHIPMENT (suffix “13TR”)

REEL DIMENSIONS
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm.

End

Start

Top No components Components No components


cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1
SO-8 TUBE SHIPMENT (no suffix)

B
C Base Q.ty 100
Bulk Q.ty 2000
Tube length (± 0.5) 532
A A 3.2
B 6
C (± 0.1) 0.6

All dimensions are in mm.

TAPE AND REEL SHIPMENT (suffix “13TR”)

REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4

All dimensions are in mm.

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm. End

Start

Top No components Components No components


cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

17/20

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

DPAK FOOTPRINT TUBE SHIPMENT (no suffix)

A
6.7 1 .8 3 .0 1 .6 C Base Q.ty 75
Bulk Q.ty 3000
2 .3 Tube length (± 0.5) 532
6 .7
A 6
2 .3
B B 21.3
C (± 0.1) 0.6

All dimensions are in mm.

TAPE AND REEL SHIPMENT (suffix “13TR”)

REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm.


End

Start

Top No components Components No components


cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

18/20

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

IPAK TUBE SHIPMENT (no suffix)

A
C

Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
B A 6
B 21.3
C (± 0.1) 0.6

All dimensions are in mm.

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VNN7NV04 / VNS7NV04 / VND7NV04 / VND7NV04-1

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics

 2002 STMicroelectronics - Printed in ITALY- All Rights Reserved.

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