From Technologies to Markets

Advanced
Packaging Current
Trends &
Challenges

© 2020
ADVANCED PACKAGING PLATFORMS –Classification at System Integration Level
Wafer level Substrate/Strip level (Panel based) Panel level

Level 1 - Die
FIWLP FOWLP 3D/2.5D
FOPLP
Silicon/
TSV/ Bump/
Interconnection TGV pillar
glass Flip-chip Wire-bond RDL
bridge

Standard organic substrate Organic/

Ceramic/
Substrate/ glass
Advanced
Mold leadframe
leadframe organic Organic interposer and others substrate
embedding
substrate etc.

Organic substrate Ceramic/

leadframe
CSP and others
CSP ED in
Level 2 -
BGA Standard FC laminate
Packaging FC WB BGA
BGA Advanced
WB
LGA LGA

Module SiP/PoP, etc.

Level 3 -
No SMT needed ED in PCB/Flex

AP platform 9
 ADVANCED PACKAGING MARKET SHARE EVOLUTION 2014-2025

$53B Advanced Packaging revenue as % of total packaging $85B

100.0%

90.0%

80.0%
50.6%
70.0% 57.4%
62.0%

60.0%
Advanced 50.0%
Packaging
revenue will 40.0%

almost equal 30.0%

to traditional 20.0% 42.6%
49.4%
38.0%
packaging
revenue by 10.0%

2025. 0.0%
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

AP Other

In 2019, the AP market share was 42.6%. Due to strong momentum in AP market driven by mega trends, the share of
AP in the total semiconductor market is increasing continuously and will reach almost 50% of the market by 2025.
In 2014, AP market share was 38% and there is strong possibility that in 2026, AP market share will exceed that of
traditional packaging.
©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018 10
ADVANCED PACKAGING REVENUE FORECAST 2019-2025
Advanced Packaging REVENUE SPLIT by packaging platform

• The Advanced Packaging market was

3D stacking*, 3D stacking*,
ED, $55 M,
$1,466 M, 5%
ED, $149 M,
$4,186 M, 10% worth ~$28.8B in 2019. It is
0.2% 0.4% Fan-out,
Fan-in , expected to grow at ~ 7%
Fan-in , Fan-out, $2,491 M, 6% $3,046 M, 7%
$2,068 M, 7% $1,256 M, 5%
CAGR2019-2025 to reach ~$42.2B in
2025.

2019 CAGR ~7% 2025 • Highest revenue CAGR expected

( $28.8B) ( $42.2B) from 2.5D / 3D stacking IC, ED (in
laminate substrate) and Fan-Out,
21%, 18% and 16%, respectively, as
high volume products further
Flip-chip, Flip-chip, penetrate the market: FO in mobile,
$23,938 M, $32,291 M, networking, automotive; 2.5D/3D TSV
83% 77% in AI/ML, HPC, datacenters, CIS,
MEMS/sensors; ED in automotive
Flip-chip CAGR2018-2025 ~ 5.9%% and medical.
Fan-out CAGR2018-2025 ~ 16%
Fan-in WLP CAGR2018-2025~ 3.2%
3D Stacking CAGR2018-2025 ~ 21.3%
Embedded Die CAGR2018-2025 ~ 18%

• NOTE:
• Values represent packaging services (assembly and test) and do not include FEOL Si die processing
• TSV* includes portion of package revenue not included in Flip-chip or fan-in
©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018 11
TECHNOLOGY ROADMAP: FROM NANO-SCALE TO MICRO-SCALE..

2015 2017 2019 2021 2023 2025

22nm 14nm 10nm 7nm 5nm

Advanced Nodes

28nm 14nm 10nm 7nm 5nm 3nm

20nm 16nm 10nm 7nm 5nm 3nm 2nm

20nm 14nm (licensed) Stopped

Assumed
Moore’s Law
16/14nm 10nm 7nm 5nm 3nm 2nm

Stacked Die
95 to 48 μm 44 to 20 μm 20 to 10 μm
Advanced Packaging*

µBump Pitch (μm)

Die to Substrate
FC Bump Pitch (μm) 200 to 150 μm 150 to 80 μm 60 to 40 μm <40 μm

Substrate to Board
BGA Ball Pitch (μm)
400/350 μm 300 μm

Industry is looking into the growing importance of functional roadmap Advanced Packaging is essential to bridge the scale-gap between die and PCB

Average trends based on technology and industry expectation

*Minimum dimension 12
 ADVANCED PACKAGING 2019 WAFER SPLIT BY MANUFACTURER

2019 ADVANCED PACKAGING WAFER SPLIT (300MM EQ WSPY)

TFME
Texas Instrument…
1%
Unisem
SJSemi China WLCSP… 1%
1% Sony… TSMC
Huatian 14%
1%
Winstek
1%
Others
TEN players, 4%
which includes 2 Global Foundries Samsung Electronics
IDMs (Intel, 2%LBSemicon 10%
Samsung), a 2% 31.2 M
foundry (TSMC), SK Hynix 300 mm eq. ASE
the top 5 global 3%
ChipMOS 9%
OSATs (ASE, SPIL,
Amkor, PTI, JCET) 4%NEPES
together with 4%
Nepes and Powertech
Chipbond, process 4%
approximately Amkor/Nanium SPIL
75% of Advanced 6% 8%
Packaging wafers. JCET/JCAP
6% Chip Bond Intel
7% 8%

NOTE:
• This pie chart represents superpositions of all Advanced Packaging platforms (Fan-in/Fan-out WLP, Flip-chip including 2.5D/3D and
embedded die.
• Flip-chip values are entered as total capacity, fan-in, fan-out, 3D stacking and embedded die as total production.
• Flip-chip production values were not available by customer – global utilization is at ~85-90% of capacity.
©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018 13
 FINANCIAL OVERVIEW FOR TOP 25 OSATS
Revenue in 2019
TOP 25 OSAT ranking by 2019 revenue [$M]
ASE (rev w/SPIL & w/o USI) 8,456 Top OSATs with heavy investments
Amkor 4,053 were creating a disparity with the rest
JCET Group 3,285 of the pack.
Powertech Technology 2,209
TSMC ranks between 3rd &4th
Top 8 OSATs now include 3
Tongfu Microelectronics 1,169
Large OSATs Tianshui Huatian Microelectronics 1,085 If counted separately, SPIL revenue in 2019 is $2.88B, manufacturer HQ-ed in China.
UTAC maintained its 8th spot.
were King Yuan Electronics 848 which will place it as 4th among global OSATs.
separated UTAC 710
from the Chipbond Technology 678

rest. ChipMOS Technologies

Orient Semiconductor Electronics
675
582
Top 8 OSATs SFA semicon 484

continued Hana Micron (Rev w/o Hana Materials)

Greatek Elec
405
399
with heavy AOI Electronics 398
investment in Carsem 339
Companies in the tail are at a higher
CapEx and Sigurd Microelectronics 334 Players not within the Top 8 rankings need to catch up. risk if there is no differentiated
R&D. Formosa Advanced Technologies 314
Otherwise, they risk being acquired or incurring losses in business. technology or IP for merger and
Nepes Corporation 289 acquisition as an exit strategy.
Unisem Berhad 286
Ardentec 267
Inari Amertron Berhad 264
Tong Hsing 247
Walton Advanced Engineering 223
Lingsen Precision Industries 157

**Note: SPIL included in ASE figures from 2019 onwards Status|ofwww.yole.fr

Advanced Packaging 14
©2018 | StatusIndustry 2020 | Report
of the Advanced | www.yole.fr
Packaging | ©2020
Industry 2018
SEMICONDUCTOR SUPPLY CHAIN - 2020
Semiconductor production chain
PCB and substrate component suppliers
Substrate material suppliers
(FR4, BT resin, Cu clad, etc.…)
Equipment/materials suppliers
Passive components, connectors etc.
Package substrate PCB suppliers
laminate suppliers

Design Silicon Wafer Level Packaging Package Assembly & Final Sub-Module / System / Product
of chip & package Manufacturing « Middle -end » Test Sub-systems
« Front-end » Design & Assembly
« Back-end »

IDMs (Integrated Device Manufacturers) OEMs

(Original
Fab-light players (outsourcing + focused investment in manufacturing & critical IP) Equipment
Makers)
Integrated wafer / package manufacturing foundries

WLP houses (no need for traditional substrate)

ODM / EMS / DMS
Fab-less
IC players Wafer foundries
OSATs
OSATs with module/EMS capability

Wafer Bumping houses PCB houses with Embedded die capability

Front-end related BE Packaging materials Passive components,

SMT material suppliers
materials suppliers suppliers connectors, etc.
FE related BE Packaging equipment
SMT equipment suppliers
equipment suppliers suppliers

©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018 ‹#›

MOBILITY ACROSS SEMICONDUCTOR SUPPLY CHAIN AT VARIOUS LEVELS
In order to expand the business and
explore new areas, players in
semiconductor supply chains are
moving to different business models

Supply chain is undergoing changes at various levels to

adjust to changing business environment.. However, some of
them have successfully managed to expand in new
business model & have huge impact across IC
manufacturing chain while others have failed to take off.

©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018 ‹#›

OSATS PACKAGING BUSINESS CANNIBALIZATION TREND

Substrate /
EMS/ODM PCB suppliers
players

Traditional Advanced
Packaging Packaging

• Packaging / assembly business was

traditionally domain of OSATs & IDMs.
• Players from different business models
viz. Foundries, substrate/PCB suppliers, Foundries
EMS/DM are entering the assembly Total IC packaging business:
/packaging business & cannibalizing $67B (2019)
the OSAT business.

17
Thank you!

©2020 | www.yole.fr |