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SPP52N05: Buz 102 S

The document describes a SIPMOS power transistor. It provides specifications for the transistor including maximum ratings, electrical characteristics, and diagrams of the pin layout. The transistor can handle high currents and voltages and is rated for high temperature operation.

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Wee Chuan Poon
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© © All Rights Reserved
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0% found this document useful (0 votes)
112 views8 pages

SPP52N05: Buz 102 S

The document describes a SIPMOS power transistor. It provides specifications for the transistor including maximum ratings, electrical characteristics, and diagrams of the pin layout. The transistor can handle high currents and voltages and is rated for high temperature operation.

Uploaded by

Wee Chuan Poon
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

BUZ 102 S

SPP52N05

SIPMOS ® Power Transistor

• N channel
• Enhancement mode
• Avalanche-rated
• dv /dt rated
• 175°C operating temperature
• also in SMD available

Pin 1 Pin 2 Pin 3


G D S

Type VDS ID RDS(on) Package Ordering Code

BUZ 102 S 55 V 52 A 0.023 Ω TO-220 AB Q67040-S4011-A2

Maximum Ratings
Parameter Symbol Values Unit
Continuous drain current ID A
TC = 25 °C 52
TC = 100 °C 37
Pulsed drain current IDpuls
TC = 25 °C 208
Avalanche energy, single pulse E AS mJ
ID = 52 A, V DD = 25 V, RGS = 25 Ω
L = 181 µH, Tj = 25 °C 245
Avalanche current,limited by Tjmax IAR 52 A
Avalanche energy,periodic limited by Tjmax E AR 12 mJ
Reverse diode dv/dt dv/dt kV/µs
IS = 52 A, VDS = 40 V, diF/dt = 200 A/µs
Tjmax = 175 °C 6
Gate source voltage V GS ± 20 V
Power dissipation P tot W
TC = 25 °C 120

Semiconductor Group 1 30/Jan/1998


BUZ 102 S
SPP52N05

Maximum Ratings
Parameter Symbol Values Unit
Operating temperature Tj -55 ... + 175 °C
Storage temperature Tstg -55 ... + 175
Thermal resistance, junction - case RthJC ≤ 1.25 K/W
Thermal resistance, junction - ambient RthJA ≤ 62
IEC climatic category, DIN IEC 68-1 55 / 175 / 56

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter Symbol Values Unit


min. typ. max.

Static Characteristics
Drain- source breakdown voltage V (BR)DSS V
V GS = 0 V, ID = 0.25 mA, Tj = 25 °C 55 - -
Gate threshold voltage V GS(th)
V GS=V DS, ID = 90 µA 2.1 3 4
Zero gate voltage drain current IDSS µA
V DS = 50 V, V GS = 0 V, Tj = -40 °C - - 0.1
V DS = 50 V, V GS = 0 V, Tj = 25 °C - 0.1 1
V DS = 50 V, V GS = 0 V, Tj = 150 °C - - 100
Gate-source leakage current IGSS nA
V GS = 20 V, VDS = 0 V - 10 100
Drain-Source on-resistance RDS(on) Ω
V GS = 10 V, ID = 37 A - 0.016 0.023

Semiconductor Group 2 30/Jan/1998


BUZ 102 S
SPP52N05

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter Symbol Values Unit


min. typ. max.

Dynamic Characteristics
Transconductance gfs S
V DS≥ 2 * ID * RDS(on)max, ID = 37 A 10 - -
Input capacitance Ciss pF
V GS = 0 V, V DS = 25 V, f = 1 MHz - 1220 1525
Output capacitance Coss
V GS = 0 V, V DS = 25 V, f = 1 MHz - 410 515
Reverse transfer capacitance Crss
V GS = 0 V, V DS = 25 V, f = 1 MHz - 210 265
Turn-on delay time td(on) ns
V DD = 30 V, VGS = 10 V, ID = 52 A
RG = 6.8 Ω - 12 18
Rise time tr
V DD = 30 V, VGS = 10 V, ID = 52 A
RG = 6.8 Ω - 22 33
Turn-off delay time td(off)
V DD = 30 V, VGS = 10 V, ID = 52 A
RG = 6.8 Ω - 30 45
Fall time tf
V DD = 30 V, VGS = 10 V, ID = 52 A
RG = 6.8 Ω - 25 40
Gate charge at threshold Qg(th) nC
V DD = 40 V, ID = 0.1 A, V GS =0 to 1 V - 1.5 2.8
Gate charge at 7.0 V Qg(7)
V DD = 40 V, ID = 52 A, VGS =0 to 7 V - 35 55
Gate charge total Qg(total)
V DD = 40 V, ID = 52 A, VGS =0 to 10 V - 45 70
Gate plateau voltage V (plateau) V
V DD = 40 V, ID = 52 A - 5.9 -

Semiconductor Group 3 30/Jan/1998


BUZ 102 S
SPP52N05

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter Symbol Values Unit


min. typ. max.

Reverse Diode
Inverse diode continuous forward current IS A
TC = 25 °C - - 52
Inverse diode direct current,pulsed ISM
TC = 25 °C - - 208
Inverse diode forward voltage V SD V
V GS = 0 V, IF = 104 A - 1.2 1.7
Reverse recovery time trr ns
V R = 30 V, IF=lS, diF/dt = 100 A/µs - 70 105
Reverse recovery charge Qrr µC
V R = 30 V, IF=lS, diF/dt = 100 A/µs - 0.15 0.25

Semiconductor Group 4 30/Jan/1998


BUZ 102 S
SPP52N05

Power dissipation Drain current


Ptot = ƒ(TC) ID = ƒ(TC)
parameter: VGS ≥ 10 V

130 55

W
A
110
45
Ptot ID
100
40
90
35
80

70 30

60 25
50
20
40
15
30
10
20

10 5
0 0
0 20 40 60 80 100 120 140 °C 180 0 20 40 60 80 100 120 140 °C 180
TC TC

Safe operating area Transient thermal impedance


ID = ƒ(VDS) Zth JC = ƒ(tp)
parameter: D = 0, TC = 25°C parameter: D = tp / T

10 3 10 1

K/W

A 10 0
t = 19.0µs
p
ID ZthJC
D
/I
DS
V

10 2 10 -1
=
n)
(o
DS
R

100 µs

10 -2
D = 0.50
0.20
10 1 10 -3 0.10
1 ms
0.05
10 ms single pulse 0.02
10 -4 0.01
DC

10 0 10 -5
0 1 2 -7 -6 -5 -4 -3 -2 -1 0
10 10 V 10 10 10 10 10 10 10 10 s 10
VDS tp

Semiconductor Group 5 30/Jan/1998


BUZ 102 S
SPP52N05

Typ. output characteristics Typ. drain-source on-resistance


ID = ƒ(VDS) RDS (on) = ƒ(ID)
parameter: tp = 80 µs , Tj = 25 °C parameter: tp = 80 µs, Tj = 25 °C

120 0.070
Ptot = 120W l a b c d e f g
A k j i

V [V] 0.060
100 h GS
ID a 4.0 RDS (on)
0.055
90 b 4.5
g c 5.0 0.050
80 d 5.5 0.045
e 6.0
70 f 0.040
f 6.5
60 g 7.0 0.035
e h 7.5
50 0.030
i 8.0
j 9.0 0.025 h
40 d
k 10.0 i
0.020 j
30 l 20.0
c 0.015 k
20
0.010 V [V] =
b GS
10 a b c d e f g h i j k
0.005 4.0
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0
a
0 0.000
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V 5.0 0 20 40 60 80 A 110
VDS ID

Typ. transfer characteristics ID = f (V GS)


parameter: tp = 80 µs
VDS≥2 x ID x RDS(on)max

120

A
I
D

80

60

40

20

0
0 1 2 3 4 5 6 7 8 V 10
VGS

Semiconductor Group 6 30/Jan/1998


BUZ 102 S
SPP52N05

Drain-source on-resistance Gate threshold voltage


RDS (on) = ƒ(Tj ) V GS(th)= f (Tj)
parameter: ID = 37 A, VGS = 10 V parameter:VGS=VDS, ID =90µA

0.075 5.0
Ω V
0.065 4.4

0.060
RDS (on) VGS(th) 4.0
0.055
3.6
0.050
3.2
0.045
2.8
0.040
0.035 2.4 max
98%
0.030 2.0
0.025 typ 1.6
0.020 typ
1.2
0.015
0.8
0.010
min
0.005 0.4
0.000 0.0
-60 -20 20 60 100 °C 180 -60 -20 20 60 100 140 V 200
Tj Tj

Typ. capacitances Forward characteristics of reverse diode


C = f (VDS) IF = ƒ(VSD)
parameter:VGS = 0V, f = 1MHz parameter: Tj , tp = 80 µs

10 4 10 3

A
C IF
pF

10 2
Ciss

10 3

10 1
C Tj = 25 °C typ
oss
Tj = 175 °C typ
Tj = 25 °C (98%)
Crss
Tj = 175 °C (98%)

10 2 10 0
0 5 10 15 20 25 30 V 40 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0
VDS VSD

Semiconductor Group 7 30/Jan/1998


BUZ 102 S
SPP52N05

Avalanche energy EAS = ƒ(Tj) Typ. gate charge


parameter: ID = 52 A, VDD = 25 V VGS = ƒ(QGate)
RGS = 25 Ω, L = 181 µH parameter: ID puls = 52 A

260 16

mJ
V
220
EAS VGS
200
12
180

160 10
0,2 VDS max 0,8 VDS max
140
8
120

100 6
80
4
60

40
2
20
0 0
20 40 60 80 100 120 140 °C 180 0 10 20 30 40 50 nC 65
Tj Q Gate

Drain-source breakdown voltage


V(BR)DSS = ƒ(Tj)

65

V(BR)DSS
61

59

57

55

53

51

49
-60 -20 20 60 100 °C 180
Tj

Semiconductor Group 8 30/Jan/1998

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