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Tfswjdf
Tfswjdf
Service
Service Manual
TABLE OF CONTENTS
Chapter
Location of PCB Boards ............................................ 1-2
Versions Variation ...................................................... 1-2
Specifications ............................................................ 1-3
Measurement Setup .................................................. 1-4
Service Aids .............................................................. 1-5
ESD & Safety Instruction .......................................... 1-6
Lead-free soldering Information ................................ 1-7
Setting procedure & Repair Instructions........................ 2
Disassembly Instructions & Service positions .............. 3
Block & Wiring Diagram ................................................ 4
Diagram Quick Start Guide ............................................ 5
VFD Board .................................................................... 6
Main Board .................................................................... 7
Power Board .................................................................. 8
Touch Board .................................................................. 9
Mechanical Exploded View .......................................... 10
Revision List ................................................................ 11
©
Copyright 2012 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise
without the prior permission of Philips.
GB 3139 785 36004
Published by KC-RL1246 Service Audio Printed in The Netherlands Subject to modification
Version 1.4
1-
LOCATION OF PCB BOARDS
VERSION VARIATION:
Type/Versions HTS5553
Features /98 /78 /93 /12 /68
Output Power - 1000W x x x x x
Voltage (110-127V/ 220-240V) x x x
USB x x x x x
Voltage (220-240V) x x
SERVICE SCENARIO MATRIX:
Type/Versions HTS5553
Board in used /98 /78 /93 /12 /68
Main Board C C C C C
Power Board C C C C C
VFD Board C C C Bd C
Touch Board C C C Bd C
Tuner FM
Bandpass
DUT 250Hz-15kHz LF Voltmeter
e.g. 7122 707 48001 e.g. PM2534
RF Generator
e.g. PM5326
Ri=50
Use a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).
CD
Use Audio Signal Disc SBC429 4822 397 30184
(replaces test disc 3)
DUT
L
LEVEL METER
e.g. Sennheiser UPM550
with FF-filter
1-
SERVICE AIDS
Service Tools:
Universal Torx driver holder .................................4822 395 91019
Torx bit T10 150mm ...........................................4822 395 50456
Torx driver set T6-T20 .........................................4822 395 50145
Torx driver T10 extended .....................................4822 395 50423
Compact Disc:
SBC426/426A Test disc 5 + 5A ...........................4822 397 30096
SBC442 Audio Burn-in test disc 1kHz .................4822 397 30155
SBC429 Audio Signals disc .................................4822 397 30184
Dolby Pro-logic Test Disc ....................................4822 395 10216
All ICs and many other semi-conductors are Alle IC’s en vele andere halfgeleiders zijn
susceptible to electrostatic discharges (ESD). gevoelig voor electrostatische ontladingen
Careless handling during repair can reduce life (ESD).
drastically. Onzorgvuldig behandelen tijdens reparatie kan
When repairing, make sure that you are de levensduur drastisch doen verminderen.
connected with the same potential as the mass Zorg ervoor dat u tijdens reparatie via een
of the set via a wrist wrap with resistance. polsband met weerstand verbonden bent met
Keep components and tools also at this hetzelfde potentiaal als de massa van het
potential. apparaat.
Houd componenten en hulpmiddelen ook op
ditzelfde potentiaal.
F ATTENTION
D WARNUNG I AVVERTIMENTO
Tous les IC et beaucoup d’autres
semi-conducteurs sont sensibles aux Alle ICs und viele andere Halbleiter sind
décharges statiques (ESD). Tutti IC e parecchi semi-conduttori sono
empfindlich gegenüber elektrostatischen sensibili alle scariche statiche (ESD).
Leur longévité pourrait être considérablement Entladungen (ESD).
écourtée par le fait qu’aucune précaution n’est La loro longevità potrebbe essere fortemente
Unsorgfältige Behandlung im Reparaturfall kan ridatta in caso di non osservazione della più
prise à leur manipulation. die Lebensdauer drastisch reduzieren.
Lors de réparations, s’assurer de bien être relié grande cauzione alla loro manipolazione.
Veranlassen Sie, dass Sie im Reparaturfall über Durante le riparazioni occorre quindi essere
au même potentiel que la masse de l’appareil et ein Pulsarmband mit Widerstand verbunden
enfiler le bracelet serti d’une résistance de collegato allo stesso potenziale che quello della
sind mit dem gleichen Potential wie die Masse massa dell’apparecchio tramite un braccialetto
sécurité. des Gerätes.
Veiller à ce que les composants ainsi que les a resistenza.
Bauteile und Hilfsmittel auch auf dieses gleiche Assicurarsi che i componenti e anche gli utensili
outils que l’on utilise soient également à ce Potential halten.
potentiel. con quali si lavora siano anche a questo
potenziale.
LASER PRODUCT
NL 3122 110 03420
F GB Warning !
Les normes de sécurité exigent que l’appareil soit remis à l’état Invisible laser radiation when open.
d’origine et que soient utiliséés les piéces de rechange identiques Avoid direct exposure to beam.
à celles spécifiées.
Less composants de sécurité sont marqués !
.
S Varning !
Osynlig laserstrålning när apparaten är öppnad och spärren
D är urkopplad. Betrakta ej strålen.
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu
beachten. Der Original zustand des Geräts darf nicht verändert werden;
für Reparaturen sind Original-Ersatzteile zu verwenden.
SF Varoitus !
Sicherheitsbauteile sind durch das Symbol !
markiert.
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina
näkymättömälle laserisäteilylle. Älä katso säteeseen!
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso
nelle condizioni originali e che siano utilizzati i pezzi di ricambio
DK Advarse !
identici a quelli specificati.
Componenty di sicurezza sono marcati con !
. Usynlig laserstråling ved åbning når sikkerhedsafbrydere er
ude af funktion. Undgå udsaettelse for stråling.
GB
F
After servicing and before returning set to customer perform a leakage
current measurement test from all exposed metal parts to earth ground "Pour votre sécurité, ces documents doivent être utilisés par
to assure no shock hazard exist, The leakage current must not des spécialistes agréés, seuls habilités à réparer votre
exceed 0.5mA. appareil en panne".
1-
Pb(Lead) Free Solder dependent of MSL-level seen on indicator-label in the
bag, the BGA-IC possibly still has to be baked dry.
When soldering , be sure to use the pb free solder. (MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
INDENTIFICATION: Do not re-use BGAs at all.
Regardless of special logo (not always indicated) • For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
one must treat all sets from 1 Jan 2005 onwards, according components, all needed spare-parts will be available
next rules: till the end of the service-period. For repair of such
sets nothing changes.
Important note: In fact also products of year 2004 must • On our website www.atyourservice.ce.Philips.com
be treated in this way as long as you avoid mixing solder- you find more information to:
alloys (leaded/ lead-free). So best to always use SAC305
and the higher temperatures belong to this. • BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Due to lead-free technology some rules have to be Philips-sets
respected by the workshop during a repair:
You will find this and more technical information
• Use only lead-free solder alloy Philips SAC305 with
within the “magazine”, chapter “workshop news”.
order code 0622 149 00106. If lead-free solder-paste
is required, please contact the manufacturer of your
For additional questions please contact your local
solder-equipment. In general use of solder-paste
repair-helpdesk.
within workshops should be avoided because paste is
not easy to store and to handle.
• Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
– To reach at least a solder-temperature of 400@C,
– To stabilize the adjusted temperature at the solder-
tip
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360@C – 380@C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400@C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off un-
used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).
• Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
• Special information for BGA-ICs:
– Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-
soldering always use the lead-free temperature profile,
in case of doubt)
– Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening,
2- 2-
Software upgrade & Procedure to restore product setting c) Remove solder joint on the ESD protection point.
a) Press <SETUP> button on R/C. a) Check for the latest software version on
b) Select <preference setup> , then press < OK >. www.philips.com/support.
c) Select <default> <Reset>, then press <OK> to confirm. Search for your model and click on ‘software&drivers’.
b) Copy the latest upgrading software onto a CD-R or USB storage
2) Version control change device.
a) Open the Door, then, press <1> <5> <9> on RC. c) Insert the CD-R program disc or connect the USB storage device
b) Press <OK> button on RC. to the home theater.
c) TV will show message as follow: d) Press <USB> button on R/C.
e) TV will show message as follow:
Model Switch to:_ _ The Top side view of OPU
00 HTS5533-55 Upgrade file detected Note: The ESD protection point on the Top side view of OPU must
01 xxxxxxx Doyou wish to continue with be soldered if
02 xxxxxxx the software upgrade? - the DVD Loader is OK and needs to be disconnected from
... connector “CN801” “CN802” “CN803” of the main board.
OK Cancel
15 xxxxxxx - the defective DVD Loader is needed to be send back to supplier
00 default 00 in eeprom f) Press <OK> button on R/C. for failure analysis and to support back charging evidence.
g) DVD door automatically open, TV will show message as follow:
d) Press <0> <0> <OK>, then the home theater automatically
switch to standby. Upgrade in progress...
HTS55XX MTK
3) Password change Please do not unplug or
a) Press <SETUP> button on R/C. switch off the device. CAUTION!
b) Select <preference setup> , then press <OK>. h) When the updated is complete, the DVD door automatically This information is confi dential and may not
c) Select <password> <change>, then press <OK> to confirm close, and the home theater automatically switch to standby.
be distributed.
“0000” is default password supplied. Note: when upgrade in progress, please do not unplug or switch off
the device.
4) Trade model
CN801
2- 2-
REPAIR INSTRUCTION - part one
2- 2-
REPAIR INSTRUCTION - part two
3-1 3-1
DISASSEMBLY INSTRUCTIONS
Note:In some service positions the components or copper patterns of one board may risk touching its 3) Loosen 7 screws and remove the Top Cover by lifting the rear portion upwards before sliding it out towards the rear.
- 1 screw “A” each on the left & right side as shown in figure 4.
neighbouring pc boards or metallic parts. To prevent such short-circuit use a piece of hard paper or - 5 screws “B” at the back panel as shown in figure 5.
other insulating material between them. 4) Loosen 4 screws “C” at the front panel bracket as shown in figure 6 to remove the front panel.
Dismantling of the Front Panel Assemble
1) Open the DVD Tray by using the Open/Close Button while the Set is ON and disconnect the mains supply after removing the Tray
Cover.
Note: If this is not possible, the DVD Tray has to be open manually.
Take a mini screw driver about 2mm diameter and make a marking 24mm from the tip as shown in figure 2 . Place the set on its
side, insert the mini screw driver till the marking and slide it towards the left as shown in figure 1 until the Tray moves out of the Front
Panel.
2) Return the set to its upright position and remove the Tray Cover as shown in Figure 3 and close the tray manually by pushing it back
A
in.
Figure 4
B
Figure 5
C
Figure 1
Figure 6
24mm
Figure 2
Figure 3 Figure 7
3-2 3-2
Dismantling of Power Board Dismantling of VFD Board
1) Loosen 5 screws “E” on the top of Power Board as shown in figure 8. 1) Loosen 5 screws “H” on the top of VFD Board as shown in figure 11.
Figure 11
Figure 8
I
Dismantling of the Main Board Figure 12
1) Loosen 4 screws “F” on the top of Main Board as shown in figure 9.
2) At the back panel, loosen 6 screws “G” to remove Main Board as shown in figure 10.
Figure 9
Figure 10
3-3 3-3
SERVICE POSITIONS Service position C--All Board
V7
V8
MAIN PCB
V5
AC SOCKET
V4
VFLD04312-0500
V6 V3
V9
POWER PCB
V10
V2
V1 VFD PCB
TOUCH PCB
5- 5-
QUICK START GUIDE
The following excerpt of the QSG/DFU serves as an introduction to the set.
1
The complete Direction for Use can be download in the different languages from the internet site of
Philips Consumer Care Center:www.support.philips.com.
MIC-IN Converter
FM Antenna HDMI (only for 93)
4x
4x 12x
User Manual
4x
(only for 12)
4x
2
2
3x
FRONT FRONT
LEFT RIGHT
FRONT FRONT FRONT REAR REAR SUB- SUB
RIGHT LEFT CENTER RIGHT LEFT WOOFER WOOFER FRONT
CENTER
REAR REAR
LEFT RIGHT
3
1x
3
HDMI + COAXIAL
COAXIAL
AUDIO L/R
HDMI ARC L
L R
HDMI OUT (ARC)
HDMI IN AUDIO OUT
R
AUDIO IN
HDMI IN (ARC)
HDMI + OPTICAL
OPTICAL
4 5
EN Switch on the home theater EN Complete the ? rst time setup
1
HDMI
1
TV
110-127V 220-240V
3
HOME THEATER
4
5
HOME THEATER
5- 5-
6
EN Use your home theater
1 2
3.5MM
STEREO
1
2 MUSIC iLINK / MIC
2
1
3
2
1 3
ANTENNA
4
5- 5-
VFD+USB BOARD
TABLE OF CONTENTS
FTD Display Pin Assignment ............................................................. 6-1
Circuit Diagram ................................................................................. 6-2
PCB Layout Top & Bottom View........................................................ 6-3
PIN CONNECTION
6-2 6-2
CIRCUIT DIAGRAM
C301 A1 C310 B1 C802 C2 C807 B2 C813 A2 C818 B2 C822 B2 C826 A2 CN804 B2 IC801 B3 Q804 A2 R804 B2 R810 B2 R815 A1 R822 A1 R826 A2 R830 A2 ZD802 A2
C302 A1 C313 C1 C803 C2 C809 C2 C814 A3 C819 B3 C823 A2 C827 A2 DP801 A3 JK301 A1 R801 C2 R805 B2 R812 B2 R819 A1 R823 A2 R827 A2 SN801 C2 ZD803 C2
C303 A1 C314 C1 C805 A2 C810 A2 C815 A2 C820 B2 C824 A2 CN303 B1 FB303 A1 Q802 A2 R802 C2 R806 B2 R813 B2 R820 A1 R824 A2 R828 A2 USB301B1
C304 A1 C801 C2 C806 B2 C812 C2 C817 A2 C821 B2 C825 A2 CN304 A1 FB304 A1 Q803 A2 R803 C2 R807 C2 R814 A1 R821 A1 R825 A2 R829 A2 ZD801 C2
1 2 3
A A
B B
C C
1 2 3
6-3 6-3
PCB LAYOUT - TOP VIEW
C812 A2 C818 A1 C819 A1 C823 A1 C824 A1 C826 A1 CN303 A2 CN304 A2 CN804 A1 DP801 A2 JK301 A2 Q802 A1 Q803 A1 SN801 A2 USB301A2
1 2
A A
1 2
PCB LAYOUT - BOTTOM VIEW
C301 A2 C304 A2 C314 A2 C803 A2 C807 A1 C813 A2 C817 A1 C822 A1 FB303 A2 Q804 A1 R803 A1 R806 A1 R812 A1 R815 A2 R821 A2 R824 A1 R827 A1 R830 A1 ZD803 A1
C302 A2 C310 A2 C801 A2 C805 A2 C809 A2 C814 A1 C820 A1 C825 A1 FB304 A2 R801 A2 R804 A1 R807 A2 R813 A1 R819 A1 R822 A2 R825 A1 R828 A1 ZD801 A2
C303 A2 C313 A2 C802 A2 C806 A1 C810 A1 C815 A1 C821 A1 C827 A1 IC801 A1 R802 A1 R805 A1 R810 A1 R814 A2 R820 A1 R823 A1 R826 A1 R829 A1 ZD802 A1
2 1
A A
2 1
7-1 7-1
IC401 INTERNAL IC DIAGRAM - CS8422
MAIN BOARD
TABLE OF CONTENTS
Internal IC Diagram ........................................................................... 7-1
Circuit Diagram(part one) .................................................................. 7-8
Circuit Diagram(part two)................................................................... 7-9
Circuit Diagram(part three) ................................................................ 7-10
PCB Layout Top View ........................................................................ 7-11
PCB Layout Bottom View ................................................................... 7-12
7-2 7-2
IC303 INTERNAL IC DIAGRAM - CS5346
3.3 V to 5 V 3.3 V 5V
Level Translator
Control Data Internal Voltage Right PGA Output
Register Configuration
Reference
Interrupt Stereo Input 1
Overflow Stereo Input 2
Translator
Multibit Mic Input 1 & 2
Serial
Level
High Pass Low-Latency Oversampling PGA +32 dB
Audio
Filter Anti-Alias Filter ADC
Output
Stereo Input 5
Stereo Input 6
7-3 7-3
IC505 INTERNAL IC DIAGRAM - TAS5538
AVDD_REF
AVDD_PLL
AVSS_PLL
VRD_PLL
VRA_PLL
VR_PLL
VBGAP
DVDD
DVSS
AVDD
AVSS
MCLK
8
Device
SDIN1
SDIN2 Control 0 7 Soft Soft Loud DC De Interpolate SRC NS PWM
Det Biquads Tone Vol Comp DRC Block Emph
SDIN3
SDIN4
0 7 Soft Soft Loud DC De Interpolate SRC NS PWM
Det Biquads Tone Vol Comp DRC Block Emph
I2 C
SDA
Serial
0 7 Soft Soft Loud DC De Interpolate SRC NS PWM
SCL
Control Det Biquads Tone Vol Comp DRC Block Emph PWM AP and AM8
I/F
Subwoofer
DAP Control
0 7 Soft Soft Loud DC De Interpolate SRC NS PWM
RES ET Det Biquads Tone Vol Comp DRC Block Emph
PDN
0 7 Soft Soft Loud DC De Interpolate SRC NS PWM
MUTE Det Biquads Tone Vol Comp DRC Block Emph
HP_SEL
BKND_ERR 8 8 8
8 4 8 2
VALID
2
Volume
9 Control PSVC PSVC
EDB Qbdlbhf
)Upq!Wjfx*
PWM_HPM_L 1 56 PWM_P_6
PWM_HPP_L 2 55 PWM_M_6
PWM_HPM_R 3 54 PWM_P_5
PWM_HPP_R 4 53 PWM_M_5
AVSS 5 52 VR_PWM
PLL_FLTM 6 51 AVSS_PWM
PLL_FLTP 7 50 AVDD_PWM
VR_ANA 8 49 PWM_P_8
AVDD 9 48 PWM_M_8
ASEL_EMO2 10 47 PWM_P_7
MCLK 11 46 PWM_M_7
OSC_RES 12 45 PWM_P_4
DVSS2_CORE 13 44 PWM_M_4
DVDD2_CORE 14 43 PWM_P_3
EMO1 15 42 PWM_M_3
RESET 16 41 PWM_P_2
HP_SEL 17 40 PWM_M_2
PDN 18 39 PWM_P_1
MUTE 19 38 PWM_M_1
SDA 20 37 VALID
SCL 21 36 DVSS1_CORE
LRCLK 22 35 DVDD1_CORE
SCLK 23 34 BKND_ERR
SDIN1 24 33 PSVC
SDIN2 25 32 TEST
SDIN3 26 31 LRCLKO
SDIN4 27 30 SCLKO
VR_DIG 28 29 SDOUT
7-4 7-4
TERMINAL 5-V TERMINAL 5-V
TYPE (1) TERMINATION (2) DESCRIPTION TYPE (1) TERMINATION (2) DESCRIPTION
NAME NO. TOLERANT NAME NO. TOLERANT
AVDD_PWM 50 P 3.3-V analog power supply for PLL. This terminal can be connected to the same PWM_P_5 54 DO PWM 5 output (lineout L) (differential +)
power source used to drive power terminal DVDD; but to achieve low PLL jitter, PWM_P_6 56 DO PWM 6 output (lineout R) (differential +)
this terminal should be bypassed to AVSS_PLL with a 0.1-µF low-ESR
capacitor. PWM_P_7 47 DO PWM 7 output (differential +)
AVSS_PWM 51 P Analog ground for PWM. This terminal should reference the same ground as RESERVED Connect to digital ground
terminal DVSS; but to achieve low PWM jitter, ground noise at this terminal must RESET 16 DI 5V Pullup System reset input, active-low. A system reset is generated by applying a logic
be minimized. The availability of the AVSS terminal allows a designer to use low to this terminal. RESET is an asynchronous control signal that restores the
optimizing techniques such as star ground connections, separate ground planes, TAS5538 to its default conditions, sets the valid output low, and places the
or other quiet ground-distribution techniques to achieve a quiet ground reference PWM in the hard-mute state (M-state). Master volume is immediately set to full
at this terminal. attenuation. On the release of RESET, if PDN is high, the system performs a 4-
BKND_ERR 34 DI Pullup Active-low. A back-end error sequence is generated by applying logic low to this to 5-ms device initialization and sets the volume at mute.
terminal. The BKND_ERR results in no change to any system parameters, with SCL 21 DI 5V I2C serial-control clock input/output
all H-bridge drive signals going to a hard-mute state (M-state).
SCLK 23 DI 5V Serial-audio data clock (shift clock) input
DVDD1_CORE 35 P 3.3-V digital power supply. It is recommended that decoupling capacitors of
0.1 µF and 10 µF be mounted close to this pin (see application schematics). SDA 20 DIO 5V I2C serial-control data-interface input/output
DVDD2_CORE 14 P 3.3-V digital power supply for PWM SDIN1 24 DI 5V Pulldown Serial-audio data input 1 is one of the serial-data input ports. SDIN1 supports
four discrete (stereo) data formats and is capable of inputting data at 64 fS.
DVSS1_CORE 36 P Digital ground
SDIN2 25 DI 5V Pulldown Serial-audio data input 2 is one of the serial-data input ports. SDIN2 supports
DVSS2_CORE 13 P Digital ground for PWM four discrete (stereo) data formats and is capable of inputting data at 64 fS.
HP_SEL 17 DI 5V Pullup Headphone in/out selector. When a logic low is applied, the headphone is SDIN3 26 DI 5V Pulldown Serial-audio data input 3 is one of the serial-data input ports. SDIN3 supports
selected (speakers are off). When a logic high is applied, speakers are selected four discrete (stereo) data formats and is capable of inputting data at 64 fS.
(headphone is off).
SDIN4 27 DI 5V Pulldown Serial-audio data input 4 is one of the serial-data input ports. SDIN4 supports
LRCLK 22 DI 5V Serial-audio data left/right clock (sampling-rate clock) four discrete (stereo) data formats and is capable of inputting data at 64 fS.
MCLK 11 DI 5V Pulldown MCLK is a 3.3-V master clock input. The input frequency of this clock can range VALID 37 DO Output indicating validity of PWM outputs, active-high
from 4 MHz to 50 MHz.
VBGAP P Band-gap voltage reference. A pinout of the internally regulated 1.2-V reference.
MUTE 19 DI 5V Pullup Soft mute of outputs, active-low (muted signal = a logic low, normal operation = Typically has a 1-nF low-ESR capacitor between VBGAP and AVSS_PLL. This
a logic high). The mute control provides a noiseless volume ramp to silence. terminal must not be used to power external devices.
Releasing mute provides a noiseless ramp to previous volume.
VR_DIG 28 P Voltage reference for 1.8-V digital core supply. A pinout of the internally
OSC_RES 12 AO Oscillator resistor regulated 1.8-V power used by digital core logic. A 4.7-µF low-ESR capacitor (3)
should be connected between this terminal and DVSS. This terminal must not
PDN 18 DI 5V Pullup Power down, active-low. PDN powers down all logic and stops all clocks be used to power external devices.
whenever a logic low is applied. The internal parameters are preserved through
a power-down cycle, as long as RESET is not active. The duration for system VR_PWM 52 P Voltage reference for 1.8-V digital PLL supply. A pinout of the internally
recovery from power down is 100 ms. regulated 1.8-V power used by digital PLL logic. A 0.1-µF low-ESR capacitor (3)
should be connected between this terminal and DVSS_CORE. This terminal
PLL_FLT_RET AO PLL external filter return must not be used to power external devices.
PLL_FLTM 6 AO PLL negative input. Connected to PLL_FLT_RET via an RC network AVDD 9
PLL_FLTP 7 AI PLL positive input. Connected to PLL_FLT_RET via an RC network SDOUT 29
PSVC 33 O Power-supply volume control PWM output GPIO_1 General Purpose IO
PWM_HPM_L 1 DO PWM left-channel headphone (differential –) GPIO_2 General Purpose IO
PWM_HPM_R 3 DO PWM right-channel headphone (differential –) GPIO_3 General Purpose IO
PWM_HPP_L 2 DO PWM left-channel headphone (differential +) EMO_1 Energy Manger Output interrupt
PWM_HPP_R 4 DO PWM right-channel headphone (differential +) ASEL_EMO2 10 I2C Address Select
PWM_M_1 38 DO PWM 1 output (differential –)
PWM_M_2 40 DO PWM 2 output (differential –)
PWM_M_3 42 DO PWM 3 output (differential –)
PWM_M_4 44 DO PWM 4 output (differential –)
PWM_M_5 53 DO PWM 5 output (lineout L) (differential –)
PWM_M_6 55 DO PWM 6 output (lineout R) (differential –)
PWM_M_7 46 DO PWM 7 output (differential –)
PWM_M_8 48 DO PWM 8 output (differential –)
PWM_P_1 39 DO PWM 1 output (differential +)
PWM_P_2 41 DO PWM 2 output (differential +)
PWM_P_3 43 DO PWM 3 output (differential +)
PWM_P_4 45 DO PWM 4 output (differential +)
7-5 7-5
IC502 & IC503 & IC504 INTERNAL IC DIAGRAM - TAS5352 IC202 INTERNAL IC DIAGRAM - STM32F100C8T6ATR LQFP
4 VDD
Under-
Usbdf!
OTW voltage 4 TX0KUBH qcvt
Dpou spm mfs QPXFS
KOUSTU
Protection
KUEJ
W EE >!3!up!4/7W
VREG VREG !WPMU/!SFH/
W TT
Gmbti pcm
Joufsgbd f
KUDL0TXDML Jcvt 4/4W!UP!2/9W
Dpsufy !N4!DQV Gmbti!239!LC
KUNT0TXEJP
SD
Power KUEP 43!cju AWEE
On bt!BG G nby ;!!!!!3
!NI{
1 Ecvt
M1
Reset AGND OWJD
Protection
CvtN busjy!
M2 and TSBN!
OWJD Tztu fn
9!LC AWEE
M3 Temp.
Sense GND QDML2 PTD`JO
HQ!ENB QMM !'! YUBM !PTD! PTD`PVU
QDML 3
DMPDL! 5.27!NI{
8!diboofmt ! IDML NBOBHU
RESET_AB GDML
GND_A
WTT`4!!
WEE`4!!
CPPU1!!
QD23!!
QD22!!
QD21!!
QB26!!
B0034-03
QF2!!
QF1!!
QC:!!
QC9!!
QC8!!
QC7!!
QC6!!
QC5!!
QC4!!
QB25!
QE8
QE7
QE6
QE5
QE4
QE3
QE2
QE1
IC801 INTERNAL IC DIAGRAM - AM5888
211
::
:9
:8
:7
:6
:5
:4
:3
:2
:1
9:
99
98
97
96
95
94
93
92
91
8:
89
88
87
QF3 2 86 WEE`3!
QF4 3 85 WTT`3!!
QF5 4 84 OD
QF6 5 83 QB!24!!
QF7 6 82 QB!23!!
WCBU 7 81 QB!22!!
QD24.UBNQFS.SUD 8 7: QB!21!!
QD25.PTD43`JO 9 79 QB!:!!
QD26.PTD43`PVU : 78 QB!9!!
WTT`6 21 77 QD:!!
WEE`6 22 76 QD9!!
PTD`JO 23
MRGQ211 75 QD8!!
PTD`PVU 24 74 QD7!!
OSTU 25 73 QE26!!
QD1 26 72 QE25!!
QD2 27 71 QE24!!
QD3 28 6: QE23!!
QD4 29 69 QE22!!
WTTB 2: 68 QE21!!
WSFG. 31 67 QE:!!
WSFG, 32 66 QE9!!
WEEB 33 65 QC26!!
QB1.XLVQ 34 64 QC25!!
QB2 35 63 QC24!!
QB3 36 37 62 QC23!!
38
39
3:
41
42
43
44
45
46
47
48
49
4:
51
52
53
54
55
56
57
58
59
5:
61
QB4
QB5
QB6
QB7
QB8
QC1
QC2
QC3
QF8
QF9
QF:
QD5
QD6
QF21
QF22
QF23
QF24
QF25
QF26
QC21
QC22
WTT`5
WTT`2
WEE`2
WEE`5
bj25497c
7-6 7-6
IC202 Pin descriptions (refer to LQFP48)
)3*
Qjot
J!0!P!mfwfm
Bmufsobuf gvodujpot )4*
)3*
Qjot
J!0!P!mfwfm
)2*
Nbjo
)2*
Nbjo
Qjo!obnf gvodujpo)4*
Uzqf
MRGQ211
gvodujpo)4*
MRGQ59
MRGQ75
Qjo!obnf
Uzqf
MRGQ211
MRGQ75
)3*
Qjot
J!0!P!mfwfm
)3*
Qjot
J!0!P!mfwfm
Uzqf )2*
Nbjo
)2*
Nbjo
Qjo!obnf gvodujpo)4* Qjo!obnf gvodujpo)4*
MRGQ211
Uzqf
MRGQ211
MRGQ59
MRGQ75
MRGQ59
MRGQ75
)bgufs!sftfu* Efgbvmu Sfnbq )bgufs!sftfu* Efgbvmu Sfnbq
47 59 86 W EE`3 T W EE`3
1 2 3 4
A A
B B
C C
1 2 3 4
7 - 12 7 - 12
PCB LAYOUT - BOTTOM VIEW
C1001 A1 C104 B2 C201 B1 C214 B2 C248 A2 C305 B2 C338 A1 C411 A2 C527 B3 C589 A4 C612 B4 C621 C4 C630 C4 C647 C3 C706 A1 C824 C2 C835 C1 D302 A2 FB802 B1 R203 B1 R276 C2 R322 B2 R509 A4 R571 A4 R706 A1
C1002 A1 C109 A2 C202 B1 C215 B2 C249 A2 C310 B2 C361 A1 C412 A2 C530 B3 C590 A4 C613 A4 C622 C4 C631 B4 C648 C3 C718 A1 C825 C2 C838 B1 D303 B2 FB803 A1 R210 B3 R277 C2 R362 A1 R510 A4 R572 A4 R707 A1
C1003 A1 C111 A2 C203 B1 C217 B2 C250 A2 C323 A2 C362 A1 C415 A2 C538 B3 C593 A4 C614 A4 C623 A4 C632 C4 C649 C3 C721 A1 C826 C2 C839 B1 D304 B2 IC505 C3 R211 B3 R279 A1 R363 A1 R511 A4 R573 A4 R826 B1
C1004 A1 C113 A1 C204 B1 C218 C2 C251 A1 C324 A2 C366 B1 C416 A2 C540 C3 C594 A4 C615 B4 C624 A4 C633 C4 C650 C3 C802 B1 C827 C2 C840 B1 D504 A3 L101 A1 R213 A1 R285 C2 R378 A2 R512 A4 R574 A4 ZD502 C3
C1005 A2 C114 A1 C205 B1 C221 B2 C253 A1 C325 A2 C371 A2 C421 A2 C547 A3 C595 A4 C616 B4 C625 A4 C634 C4 C651 C3 C803 B1 C828 C2 C842 B1 FB201 B1 L102 A1 R214 A1 R295 A1 R380 A1 R565 A4 R575 A4
C1006 A2 C115 A1 C206 B1 C222 A2 C254 A1 C326 A2 C373 A2 C422 A2 C584 A4 C597 A4 C617 B4 C626 A4 C635 C3 C652 C3 C804 B1 C829 C2 C843 B1 FB205 A2 L201 B1 R218 B2 R296 A1 R384 A1 R567 A4 R576 A4
C1007 B3 C117 A1 C208 B2 C224 A2 C255 C2 C335 A1 C376 A3 C423 A2 C585 A4 C598 A4 C618 B4 C627 B4 C638 B3 C701 A1 C818 B1 C830 C2 C844 B1 FB226 B1 L202 A1 R243 B2 R297 A1 R425 A2 R568 A4 R577 A4
C1008 C3 C122 C3 C210 B1 C246 A2 C298 B2 C336 A1 C377 A2 C504 B3 C586 A4 C599 A4 C619 C4 C628 B4 C645 C3 C702 A1 C822 C1 C831 C2 C845 B1 FB701 A1 L203 A2 R269 A2 R299 C2 R507 A4 R569 A4 R639 A3
C101 C2 C124 C3 C213 B1 C247 A2 C299 A1 C337 A1 C409 A2 C506 A3 C588 A4 C611 A4 C620 C4 C629 B4 C646 C3 C704 A1 C823 C2 C833 C1 D301 A2 FB702 A1 Q701 A1 R270 A2 R311 A2 R508 A4 R570 A4 R645 A3
4 3 2 1
A A
B B
C C
4 3 2 1
8-1 8-1
D Q
9 E1
RT 6
OSCILLATOR
11 C2
CT 5
CONTROL
PWM
COMP
EA(+) 2 + 12
5V VCC
1
EA(-) 1 -
BAND GAP
14 VREF
PEFERENCE
0.7MA
EA(+) 16 +
2 7 GND
TABLE OF CONTENTS 15 -
EA(-)
Internal IC Diagram ........................................................................... 8-1
3
Circuit Diagram .................................................................................. 8-2
PCB Layout Top View ........................................................................ 8-3
COMP INPUT
PCB Layout Bottom View ................................................................... 8-4
1 2 3
A A
B B
C C
1 2 3
8-4 8-4
PCB LAYOUT - BOTTOM VIEW
C904 A1 C930 B2 C948 B3 C967 B3 C991 A3 D903 A2 D913 B3 IC903 A2 Q915 A3 R906 C1 R916 B3 R923 A2 R930B A1 R933 A2 R940A A2 R945E B2 R945L B2 R956 A2 R966 B2 R973 B3 R984 A3 R991 C3 ZD905 B3
C918 A3 C931 A3 C949 C3 C972 C3 C992 A3 D905 B1 D915 B3 IC907 A3 Q918 A3 R907 B1 R917 B3 R925 B3 R930C A1 R934 A2 R942 B2 R945F B2 R945MB2 R957 B3 R967 B2 R974 B3 R985 A3 R995 B3 ZD906 B3
C920 A2 C933 A3 C950 B2 C975 B3 C993 C3 D906 C1 D916 B3 Q905 B3 R901 C1 R908 B1 R918 B3 R926 B3 R931 A1 R937 A2 R945 B2 R945G B2 R945N B2 R959 A3 R968 B3 R976 C3 R986 B3 R997 A3 ZD907 B3
C924 A2 C938 A2 C951 B2 C977 C3 C994 C3 D909 C3 D917 B3 Q906 A3 R902 C1 R909 A1 R919 A2 R927 A2 R931A A1 R938 A2 R945A B2 R945H B2 R945P B2 R960 B3 R969 B3 R979 B3 R987 B3 R999 B3 ZD908 B3
C925 A2 C945 B2 C957 C3 C978 A3 C995 A3 D910 B3 D919 A3 Q908 B3 R903 C1 R910 A1 R920 A2 R928 A2 R931B A1 R939 A2 R945B B2 R945I B2 R952 B3 R961 B3 R970 B3 R980 A3 R988 C3 ZD902 A2 ZD909 C3
C928 B3 C946 B2 C958 C3 C980 B3 C997 B3 D911 B3 D926 B3 Q909 A3 R904 C1 R914 A3 R921 B3 R930 A1 R931C A1 R939A B2 R945C B2 R945J B2 R954 A2 R963 B2 R971 B3 R981 B3 R989 C3 ZD903 B1 ZD910 C3
C929 A3 C947 B2 C964 B3 C981 B3 C998 A3 D912 B3 IC901 A2 Q914 B3 R905 C1 R915 B3 R922 A2 R930A A1 R932 B2 R940 A2 R945D B2 R945K B2 R955 A2 R964 B2 R972 B3 R983 A2 R990 C3 ZD904 B1 ZD913 B3
3 2 1
A A
B B
C C
3 2 1
9-1 9-1
TOUCH BOARD
TABLE OF CONTENTS
Circuit Diagram ................................................................................. 9-2
PCB Layout Top & Bottom View........................................................ 9-3
9-2 9-2
CIRCUIT DIAGRAM
C10 B3 C2 A1 C3 A2 C4 A3 C5 A3 C6 B1 C8 B2 C9 B3 D1 A3 R1 A3 R10 B1 R11 B1 R12 B1 R13 B1 R14 B2 R15 B2 R3 A3 R5 A3 R6 A3 R9 B1 RB360A3 U1 B2
9-3 9-3
PCB LAYOUT - TOP VIEW
28
RC
HDMI
FM
A1=19+20
S1 HST050021-1080 SCREW T2.0x0.63PxL8mm NICKEL
S2 HSF143084-1060 SCREW M3xP0.5xL6mm NICKEL
S3 HSP140054-1080 SCREW T3.0x1.06PxL8mm NICKEL
S4 HST143084-1060 SCREW M3.0x0.5PxL6mm NICKEL
S6 HSP140054-1100 SCREW T3.0x1.06PxL10mm NICKEL
S7 HST143084-1080 SCREW M3.0x0.5PxL8mm NICKEL
S8 HSW053085-1080 SCREW M3x0.5PxL8mm WASHER HD NI PLATE
S9 HST143084-3060 SCREW M3x0.5PxL6mm BLACK OXIDE
S10 HST143084-1100 SCREW M3.0x0.5Px10mm NICKEL
S11 HST140074-1100 SCREW T3.5xL10.0xP1.41mm NICKEL PLATE
P6
P12
PACKING FOR 93 VERSION P11
P15
P10
P14
P8
P5
28
FM
RC
HDMI
SPK
P1
11 -
REVISION LIST
Version 1.0
*Initial release
Version 1.1
*Update to include 78 version .
Version 1.2
*Update to include 93 version .
Version 1.3
*Update to include 12 version .
Version 1.4
*Update to include 68 version .