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2. (a) Draw the electron concentration vs. temperature and indicate the three regions: partial ionization, extrinsic
and intrinsic. (5%)
(b) For a PN junction, describe the conditions to obtain: (i) np > ni2 and (ii) np < ni2. (5%)
3. A Si semiconductor material at T = 300 K is doped with arsenic (As) atoms to a concentration of 2 × 1015 cm-3
and with boron (B) atoms to a concentration of 1.2 × 1015 cm-3. Determine n0 and p0. (10%)
n o N d N a 2 10 15 1.2 10 15
8 1014 cm 3
po
n i2
1.5 1010 2
2.81 10 5 cm 3
no 8 1014
4. Si at T = 300 K is doped with NA = 5 × 1015 cm-3. Donor atoms are added forming an n-type compensated
semiconductor such that 0.215 eV below the conduction band edge. What concentration of donor atoms are
added? (NV, Si = 1.04 × 1019 cm-3, NC, Si = 2.8 × 1019 cm-3, ni, Si = 1.5 × 1010 cm-3) (10%)
E c E F
n o N d N a N c exp
kT
0.
0.215
N d 5 1015 2.8 10 19 exp
0259
5 10 6.95 10
15 15
N d 1.2 10 16 cm 3
5. A Si sample is 2.5 cm long and has a cross-sectional area of 0.1 cm2. The silicon sample is n-type with ND = 2
× 1015 cm-3. The resistance of the sample is measured and found to be 70 Ω. What is the electron mobility?
(10%)
L L L
R
A A e n N d A
L 2.5
n 1116 cm 2 /V-s
eN d RA 1.6 10
19
2 10 700.1
15
12 μm. The hole diffusion coefficient Dp = 10 cm2/s. Calculate the hole diffusion current density at x = -6 μm.
(10%)
d 16 x
2
dp 10 16 x
J p eD p eD p 10 1 eD p 21
dx dx L L L
6
1.6 10 19 10 1016 2 1
12
Jp
12 10 4
7. Consider a bar of p-type silicon is uniformly doped at NA = 2 × 1016 cm-3 at T = 300 K. The applied electric
field is zero. A light source is incident at the end of the semiconductor as shown below. The steady-state
concentration generated at x = 0 is δp(0) = δn(0) =2 × 1014 cm-3. Assume μn = 1200 cm2/V-s, μp = 400 cm2/V-s,
τn0 = 10-6 s, and τp0 = 5 × 10-7 s. Neglecting surface effects. Determine the steady-state excess hole and electron
concentrations as a function of distance into the semiconductor. (15%)
e
L n D n n 0 31.08 10 6
1/ 2
5.575 10 3 cm
8. A p-type Si sample is doped at NA = 6 × 1015 cm-3. It is determined that EFn - EFi = 0.27 eV. (a) Determine the
excess carrier concentration. (b) Calculate EFi - EFp. (Eg, Si = 1.12 eV; ni, Si = 1.5 × 1010 cm-3) (15%)
n
(a) E Fn E Fi kT ln
ni
E Fn E Fi
or n ni exp
kT 0.270
1.5 10 10 exp
5.05 10 cm
14 3
0.0259
p o p 6 1015 5.05 10 14
(b) E Fi E Fp kT ln 0.0259 ln 0.33618 eV
1.5 1010
ni
9. Consider a uniformly doped Si junction with NA = 2 × 1017 cm-3 and ND = 4 × 1016 cm-3 at T = 300 K. The
junction area is 2 × 10-4 cm2 and the applied reverse bias is VR = -2.5 V. Calculate (a) Vbi; (b) s.c.r. width; (c)
maximum electric field; and (d) junction capacitance. (15%)
2 V V R N a N d
1/ 2 1/ 2
211.7 8.85 10 14 0.8081 2.5 2 10 17 4 1016
(b) W s bi
e N N
a d
1.6 10 19
2 10 4 10
17 16
0.3584 10 4 cm = 0.3584 m
2Vbi V R 20.8081 2.5
(c) max 1.85 10 5 V/cm
W 0.3584 10 4
1/ 2
1.6 10 19 11.7 8.85 10 14
1/ 2
e s N a N d 2 1017 4 10 16
(d) C A
2 10 4
2Vbi V R N a N d 20.8081 2.5 2 10 4 10
17 16