ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS 100 V Gate-Source Voltage VGS ±20 V TC = 25 °C 10 Continuous Drain Current ID TC = 100 °C 7 1 A Pulsed Drain Current IDM 30 Avalanche Current IAS 10 Avalanche Energy L =0.1mH EAS 5 mJ TC = 25 °C 35 Power Dissipation PD W TC = 100 °C 14 Junction & Storage Temperature Range Tj, Tstg -55 to 150 °C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RqJC 3.5 °C / W Junction-to-Ambient RqJA 62.5 1 Pulse width limited by maximum junction temperature.
REV 1.2 1 2015/7/29
PA410BD N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNITS MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250mA 100 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250mA 1.3 1.9 2.3 Gate-Body Leakage IGSS VDS = 0V, VGS = ±20V ±100 nA VDS = 80V, VGS = 0V 1 Zero Gate Voltage Drain Current IDSS mA VDS = 80V, VGS = 0V, TJ = 125 °C 10 Drain-Source On-State VGS = 4.5V, ID = 5A 103 170 RDS(ON) mΩ Resistance1 VGS = 10V, ID = 5A 93 140 Forward Transconductance1 gfs VDS = 10V, ID = 5A 13 S DYNAMIC Input Capacitance Ciss 330 Output Capacitance Coss VGS = 0V, VDS = 25V, f = 1MHz 50 pF Reverse Transfer Capacitance Crss 22 2 Qg Total Gate Charge 8.6 2 VGS = 10 V, Gate-Source Charge Qgs 1.2 nC VDS = 50V, ID = 5A 2 Qgd Gate-Drain Charge 3.5 2 td(on) Turn-On Delay Time 22 2 tr Rise Time VDS = 50V, 60 nS Turn-Off Delay Time 2 td(off) ID @ 5A, VGS = 10V, RGEN = 6Ω 30 Fall Time2 tf 40 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS 10 A 1 VSD IF = 5A, VGS = 0V Forward Voltage 1.1 V Reverse Recovery Time trr 25 nS IF = 5A, dlF/dt = 100A / μS Reverse Recovery Charge Qrr 25 nC 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature.