ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS -20 V Gate-Source Voltage VGS ±12 TA = 25 °C -3 Continuous Drain Current ID TA = 70 °C -2.1 A 1 IDM Pulsed Drain Current -10 TA = 25 °C 1.38 Power Dissipation PD W TA = 70 °C 0.88 Operating Junction & Storage Temperature Range TJ, TSTG -55 to 150 °C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Ambient RqJA 90 °C / W 1 Pulse width limited by maximum junction temperature. 2 Duty cycle ≦ 1%
Ver 1.0 1 2012/4/12
PA102FMG P-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = -250mA -20 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250mA -0.45 -0.8 -1.2 Gate-Body Leakage IGSS VDS = 0V, VGS = ±12V ±100 nA VDS = -16V, VGS = 0V -1 Zero Gate Voltage Drain Current IDSS mA VDS = -16V, VGS = 0V , TJ = 125 °C -10 On-State Drain Current1 ID(ON) VDS = -5V, VGS = -4.5V -10 A VGS = -2.5V, ID = -1A 150 215 Drain-Source On-State RDS(ON) VGS = -4.5V, ID = -2A 98 118 mΩ Resistance1 VGS = -10V, ID = -2A 72 85 1 gfs VDS = -5V, ID = -2A Forward Transconductance 16 S DYNAMIC Input Capacitance Ciss 430 Output Capacitance Coss VGS = 0V, VDS = -6V, f = 1MHz 235 pF Reverse Transfer Capacitance Crss 95 2 Qg Total Gate Charge 7.6 10 2 VDS = 0.5V(BR)DSS, VGS = -4.5V, Gate-Source Charge Qgs 3.2 nC ID = -2A 2 Qgd Gate-Drain Charge 2 2 td(on) Turn-On Delay Time 11 22 2 tr Rise Time VDD = -10V 32 55 nS Turn-Off Delay Time 2 td(off) ID @ -1A, VGS = -4.5V, RG = 6Ω 38 68 Fall Time2 tf 32 55 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICE ( TJ = 25 ° C ) Continuous Current IS -1.6 A 1 VSD IF = -2A, VGS = 0V Forward Voltage -1.2 V 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature.