XDM V9.2 System Specifications

XDM®
Version 9.2
System Specifications
XDM System Specifications
V9.2
Catalog No: X91670
Drawing No: 417006-2009-013-A06
March 2015
1st Edition
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Contents
1 About This Manual ...................................................................................... 1-1
1.1 Intended Audience................................................................................................................. 1-1
1.2 Document Organization ......................................................................................................... 1-1
1.3 Notes and Warnings............................................................................................................... 1-1
1.4 Related Documentation ......................................................................................................... 1-2
1.5 How to Obtain ECI Technical Documentation ....................................................................... 1-2
1.6 Technical Assistance .............................................................................................................. 1-3
2 XDM Overview ............................................................................................ 2-1

2.1 Intelligent and Scalable Optical Networking Platforms ......................................................... 2-1
2.2 Unparalleled Capabilities ....................................................................................................... 2-2
2.3 XDM Platforms ....................................................................................................................... 2-3
3 Physical Description .................................................................................... 3-1

3.1 XDM Shelf Configurations ...................................................................................................... 3-1
3.1.1 XDM-100 Shelf Layout ............................................................................................................. 3-1
3.1.2 XDM-900 Shelf Layout ............................................................................................................. 3-3
3.1.3 XDM-40 Shelf Layout ............................................................................................................... 3-7
3.1.4 XDM-450 Shelf Layout ............................................................................................................. 3-8
3.1.5 XDM-500 Shelf Layout ............................................................................................................. 3-8
3.1.6 XDM-1000 Shelf Layout ........................................................................................................... 3-9
3.1.7 XDM-2000 Shelf Layout ......................................................................................................... 3-10
3.1.8 XDM-3000 Shelf Layout ......................................................................................................... 3-11
3.1.9 Rack Layouts and Expansion Shelves .................................................................................... 3-12
3.2 XDM-100 Card and Module Layout ..................................................................................... 3-21
3.2.1 Basic XDM-100 Shelf ............................................................................................................. 3-21
3.2.2 Expanded XDM-100 Shelf with I/O Protection ...................................................................... 3-21
3.2.3 Nonredundant XDM-100 Shelf .............................................................................................. 3-22
3.2.4 XDM-100H Shelf .................................................................................................................... 3-22
3.3 MXC and ECU Cards ............................................................................................................. 3-22
3.3.1 MXC-100B.............................................................................................................................. 3-22
3.3.2 ECU ........................................................................................................................................ 3-23
3.4 XDM-900 Card and Module Layout ..................................................................................... 3-24
3.4.1 Basic XDM-900 Shelf ............................................................................................................. 3-24
3.4.2 Expanded XDM-900 Shelf with I/O Protection ...................................................................... 3-25
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XDM® System Specifications Contents
3.5 MXC900 and ECU900 Cards ................................................................................................. 3-25

3.5.1 MXC900 ................................................................................................................................. 3-25
3.5.2 ECU900 .................................................................................................................................. 3-26
3.6 XDM-40 Card Layout ............................................................................................................ 3-27
3.7 XDM-450 Card Layout .......................................................................................................... 3-28
3.8 XDM-500 Card Layout .......................................................................................................... 3-29
3.9 XDM-1000 Card Layout ........................................................................................................ 3-30
3.9.1 Modules Cage ........................................................................................................................ 3-30
3.9.2 Cards Cage ............................................................................................................................. 3-30
3.10 XDM-2000 Card Layout ........................................................................................................ 3-31
3.11 XDM-3000 Card Layout ........................................................................................................ 3-32
3.12 Control, Matrix, and I/O Cards for Large XDM Shelves ....................................................... 3-34
3.12.1 HLXC768/1536 and CPTS240 ................................................................................................. 3-34
3.12.2 XIO384F ................................................................................................................................. 3-35
3.12.3 xMCP/xMCP_B/xMACP ......................................................................................................... 3-35
3.12.4 MECP ..................................................................................................................................... 3-35
3.12.5 ECB or ECB3000 ..................................................................................................................... 3-36
3.12.6 ECM40 ................................................................................................................................... 3-36
4 XDM-100 Specifications ............................................................................... 4-1

4.1 Cross-Connect Specifications ................................................................................................. 4-1
4.1.1 Cross-Connect Levels............................................................................................................... 4-1
4.1.2 Cross-Connect Capacity ........................................................................................................... 4-1
4.1.3 XDM-100 Shelf Capacity .......................................................................................................... 4-1
4.2 Traffic Protection ................................................................................................................... 4-2
4.3 Redundancy ........................................................................................................................... 4-2
4.4 Synchronization ..................................................................................................................... 4-2
4.5 Jitter and Wander .................................................................................................................. 4-2
4.6 I/O Interfaces ......................................................................................................................... 4-3
4.6.1 2 Mbps (E1) ............................................................................................................................. 4-3
4.6.2 34 Mbps (E3) ........................................................................................................................... 4-3
4.6.3 45 Mbps (DS-3) ........................................................................................................................ 4-3
4.6.4 52 Mbps (STS-1) ...................................................................................................................... 4-3
4.6.5 STM-1 Electrical ....................................................................................................................... 4-3
4.6.6 STM-1/OC-3 Optical ................................................................................................................ 4-4
4.6.7 STM-4/OC-12 Optical .............................................................................................................. 4-4
4.6.8 STM-16/OC-48 Optical ............................................................................................................ 4-4
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4.7 Management.......................................................................................................................... 4-4

4.7.1 Management and Alarm Interfaces ........................................................................................ 4-4
4.7.2 Alarms and Performance......................................................................................................... 4-4
4.8 SDH/SONET Interfaces ........................................................................................................... 4-5
4.8.1 STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O Modules ............................................................... 4-5
4.8.2 STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O Modules .................................................................. 4-7
4.8.3 STM-16/OC-48 (2488.32 Mbps ±4.6 ppm) I/O Modules ......................................................... 4-8
4.8.4 2.5 Gbps Optical CWDM SFP Transceivers ............................................................................ 4-11
4.9 Data Modules ....................................................................................................................... 4-12
4.9.1 DIOM Specifications .............................................................................................................. 4-12
4.9.2 MCSM Specifications ............................................................................................................. 4-13
4.9.3 MCSM50 Specifications ......................................................................................................... 4-14
4.9.4 Client Transceivers for MCSM Cards ..................................................................................... 4-16
4.9.5 Data SFP+ Transceivers ......................................................................................................... 4-18
4.9.6 Electrical GbE SFP (ETGbE) .................................................................................................... 4-20
4.10 Optical Amplifier Modules for TPU/OCU ............................................................................. 4-21
4.11 GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for Transponders/Combiners ............ 4-22
4.12 STM-1 SFP Optical supervisory channel transceivers for OSC1_2 ....................................... 4-22
4.13 CWDM Modules ................................................................................................................... 4-23
4.13.1 Mux/Demux Modules ........................................................................................................... 4-23
4.13.2 OADM Modules ..................................................................................................................... 4-23
4.13.3 Splitter/Coupler Modules ...................................................................................................... 4-24
4.13.4 CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) ............................... 4-24
4.14 Physical Specifications ......................................................................................................... 4-24
4.14.1 Dimensions (H x W x D) ......................................................................................................... 4-24
4.14.2 Weight ................................................................................................................................... 4-25
4.14.3 Power .................................................................................................................................... 4-25
4.14.4 Power Dissipation.................................................................................................................. 4-25
4.14.5 XDM-100 Product Line Main Equipment Power Consumption ............................................. 4-25
4.15 Environmental Conditions ................................................................................................... 4-29
4.15.1 Operation .............................................................................................................................. 4-29
4.15.2 Storage (packed) ................................................................................................................... 4-29
4.15.3 Handling and Transportation ................................................................................................ 4-29
4.16 EMC ...................................................................................................................................... 4-29
4.17 Safety ................................................................................................................................... 4-29
4.17.1 Laser Safety ........................................................................................................................... 4-29
4.17.2 NEBS Compliance .................................................................................................................. 4-30
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4.18 Reliability ............................................................................................................................. 4-30

4.18.1 Life ......................................................................................................................................... 4-30
4.18.2 Availability ............................................................................................................................. 4-30
5 XDM-900 Specifications ............................................................................... 5-1

5.1 Cross-Connect Specifications ................................................................................................. 5-1
5.1.1 Cross-Connect Levels............................................................................................................... 5-1
5.1.2 Electrical Interface Connection Modules ................................................................................ 5-1
5.1.3 MXC300 Cross-Connect Capacity ............................................................................................ 5-3
5.1.4 MXC900 Cross-Connect Capacity ............................................................................................ 5-3
5.2 Traffic Protection ................................................................................................................... 5-3
5.3 Redundancy ........................................................................................................................... 5-3
5.4 Synchronization ..................................................................................................................... 5-4
5.5 Jitter and Wander .................................................................................................................. 5-4
5.6 I/O Interfaces ......................................................................................................................... 5-4
5.6.1 2 Mbps (E1) ............................................................................................................................. 5-4
5.6.2 34 Mbps (E3) ........................................................................................................................... 5-4
5.6.3 45 Mbps (DS-3) ........................................................................................................................ 5-5
5.6.4 52 Mbps (STS-1) ...................................................................................................................... 5-5
5.6.5 STM-1 Electrical ....................................................................................................................... 5-5
5.6.6 STM-1/OC-3 Optical ................................................................................................................ 5-5
5.6.7 STM-4/OC-12 Optical .............................................................................................................. 5-5
5.6.8 STM-16/OC-48 Optical ............................................................................................................ 5-6
5.6.9 STM-64/OC-192 Optical .......................................................................................................... 5-6
5.7 Management.......................................................................................................................... 5-6
5.7.1 Management and Alarm Interfaces ........................................................................................ 5-6
5.7.2 Alarms and Performance......................................................................................................... 5-6
5.8.2 STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O Modules .................................................................. 5-8
5.8.3 STM-16/OC-48 (2488.32 Mbps ±4.6 ppm) I/O Modules ....................................................... 5-10
5.8.4 2.5 Gbps Optical C/DWDM SFP Transceivers ........................................................................ 5-12
5.8.5 10 Gbps Optical XFP Transceivers ......................................................................................... 5-13
5.9 SIM Cards FEC Support ........................................................................................................ 5-14
5.10 Data Modules ....................................................................................................................... 5-15
5.10.1 DIOM Specifications .............................................................................................................. 5-15
5.10.2 MCSM Specifications ............................................................................................................. 5-16
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5.10.3 Client Transceivers for MCSM Cards ..................................................................................... 5-17

5.10.4 Data SFP+ Transceivers ......................................................................................................... 5-19
5.10.5 Electrical GbE SFP (ETGbE) .................................................................................................... 5-21
5.11 Optical Amplifier Modules for TPU/OCU ............................................................................. 5-22
5.12 CWDM Modules ................................................................................................................... 5-22
5.12.1 Mux/Demux Modules for XDM-300/900 .............................................................................. 5-22
5.12.2 OADM Modules for XDM-300/900 ........................................................................................ 5-22
5.12.3 Splitter/Coupler Modules for XDM-300/900 ........................................................................ 5-22
5.12.4 CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) ............................... 5-23
5.13.2 Weight ................................................................................................................................... 5-24
5.13.3 Power .................................................................................................................................... 5-24
5.13.4 Power Dissipation.................................................................................................................. 5-24
5.13.5 XDM-100 Product Line Main Equipment Power Consumption ............................................. 5-24
5.14.1 Operation .............................................................................................................................. 5-28
5.14.2 Storage (packed) ................................................................................................................... 5-28
5.15 EMC ...................................................................................................................................... 5-28
5.16 Safety ................................................................................................................................... 5-28
5.16.1 Laser Safety ........................................................................................................................... 5-28
5.16.2 NEBS Compliance .................................................................................................................. 5-29
5.17 Reliability ............................................................................................................................. 5-29
5.17.1 Life ......................................................................................................................................... 5-29
5.17.2 Availability ............................................................................................................................. 5-29
6 XDM-40/450/500/1000/2000/3000 Specifications ...................................... 6-1

6.1 Electrical, Optical, and Mixed Basecard Information ............................................................ 6-1
6.2 XDM Shelf Capacities ............................................................................................................. 6-1
6.2.1 XDM Shelf Capacities with HLXC or CPTS ................................................................................ 6-2
6.2.2 XDM Shelf Capacities with XIO ................................................................................................ 6-3
6.3 PDH/Async and SDH/SONET Interface Specifications............................................................ 6-4
6.3.1 2 Mbps (E1) ............................................................................................................................. 6-4
6.3.2 34 Mbps (E3) ........................................................................................................................... 6-4
6.3.3 45 Mbps (DS-3) ........................................................................................................................ 6-5
6.3.4 52 Mpbs (STS-1) ...................................................................................................................... 6-5
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6.3.5 STM-1 Electrical ....................................................................................................................... 6-5

6.3.6 STM-1/OC-3 Optical ................................................................................................................ 6-5
6.3.7 STM-4/OC-12 Optical .............................................................................................................. 6-5
6.3.8 STM-16/OC-48 Optical ............................................................................................................ 6-6
6.3.9 STM-64/OC-192 Optical .......................................................................................................... 6-6
6.4.2 MECP_OSC cards ..................................................................................................................... 6-7
6.4.3 STM-1/OC-3 SFP Optical Transceivers for OMS01_4 .............................................................. 6-8
6.4.4 STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O Modules ................................................................ 6-10
6.4.5 STM-4/OC-12 SFP Optical Transceivers for OMS04_1 .......................................................... 6-11
6.4.6 STM-16/OC-48 (2488.32 Mbps ±4.6 ppm) I/O Modules ....................................................... 6-13
6.4.7 SDH/SONET STM-16/OC-48 SFP Optical Transceivers ........................................................... 6-14
6.4.8 CWDM and DWDM STM-16/OC-48/OTU1 SFP Optical Transceivers .................................... 6-16
6.4.9 SDH/SONET STM-64/OC-192 (9953.28 Mbps ±4.6 ppm) I/O Modules ................................. 6-17
6.4.10 SDH/SONET STM-64/OC-192 XFP Optical Transceivers ........................................................ 6-18
6.4.11 SDH/SONET STM-64/OC-192 Bidirectional XFP Transceivers................................................ 6-19
6.4.12 SIO Cards FEC and EFEC Support ........................................................................................... 6-20
6.4.13 OW Unit Specifications .......................................................................................................... 6-21
6.5 XDM MPLS/Ethernet Card Summary ................................................................................... 6-21
6.6 Data Cards ............................................................................................................................ 6-22
6.6.1 DIOB Specifications ............................................................................................................... 6-23
6.6.2 MCS5 Specifications .............................................................................................................. 6-23
6.6.3 MCS10 Specifications ............................................................................................................ 6-25
6.6.4 MCS30_X10G Specifications .................................................................................................. 6-26
6.6.5 MCS50_X10G Specifications .................................................................................................. 6-27
6.6.6 ME_12 Specifications ............................................................................................................ 6-28
6.6.7 ATS Specifications ................................................................................................................. 6-28
6.6.8 Data Client Transceivers for MCS5, MCS10, MCS30_X10G, MCS50_X10G ........................... 6-28
6.6.9 Data Client XFP Transceivers for MCS30_X10G, MCS50_X10G ............................................. 6-30
6.6.10 Data Line XFP Transceivers for MCS30_X10G, MCS50_X10G ............................................... 6-31
6.7 Optical Components ............................................................................................................ 6-32
6.7.1 DWDM Mux/Demux Cards and Modules .............................................................................. 6-33
6.7.2 ROADM Cards ........................................................................................................................ 6-34
6.7.3 DWDM OADM Cards and Modules ....................................................................................... 6-37
6.7.4 CWDM Mux/Demux/OADM Components ............................................................................ 6-39
6.7.5 Transponders ........................................................................................................................ 6-40
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6.7.6 OMCM25_4 STM-1/OC-3 SFP Optical Transceivers .............................................................. 6-45

6.7.7 OMCM25_4 STM-4/OC-12 SFP Optical Transceivers ............................................................ 6-46
6.7.8 OMCM25_4 & AoC GbE/FC1 SFP Transceivers ..................................................................... 6-47
6.7.9 OMCM25_4 & AoC FC2G Client SFPs .................................................................................... 6-48
6.7.10 10 Gbps Optical Client XFP Transceivers for Transponders and CMBR40B........................... 6-49
6.7.11 AoC/OMTR27_2 STM-16/OTU1 Client .................................................................................. 6-50
6.7.12 TRP10_4 CWDM OTU2 Line/Client STM-64/10G LAN/FC10/OTU2 XFP Optical
Transceivers and CMBR40B Client Transceivers ................................................................... 6-51
6.7.13 TRP10_4 OTU2/OTU2e/OTU2f Optical Transceivers............................................................. 6-52
6.7.14 TRP10_4 OTU2/OTU2e Line, STM-64/10G LAN/FC10 Client, AoC, CMBR10,
TRP10_LAN, TRP10_2B, OTU2 XFP Line Transceivers and CMBR40B Client
Transceivers .......................................................................................................................... 6-53
6.7.15 AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2 Line Transceivers .......................................... 6-54
6.7.16 STM-16/OTU1 Optical SFP Line Transceivers for OMTR27_2 & OMCM25_4 ....................... 6-55
6.7.17 OTU-2/OTU-2e/OTU-2f XFP tunable optical transceivers ..................................................... 6-58
6.7.18 Optical Amplifiers .................................................................................................................. 6-59
6.7.19 Optical Auxiliary Cards and Modules .................................................................................... 6-62
6.7.20 Optical Auxiliary Cards for XDM-450 ..................................................................................... 6-63
6.7.21 DCF/DCM Units ..................................................................................................................... 6-63
6.7.22 Rack Mounted Single Channel DCM Units ............................................................................ 6-64
6.7.23 Auxiliary Cards and Miscellaneous Accessory Modules ........................................................ 6-64
6.7.24 Other Optical Cards ............................................................................................................... 6-65
6.8 C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for DWDM) ............... 6-65
6.9 CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) ............................. 6-68
6.10.2 Weight ................................................................................................................................... 6-70
6.10.3 Floor Loading ......................................................................................................................... 6-70
6.10.4 Power .................................................................................................................................... 6-70
6.11.1 Operation .............................................................................................................................. 6-75
6.11.2 Storage (Packed) ................................................................................................................... 6-75
6.12 EMC ...................................................................................................................................... 6-76
6.13 Safety ................................................................................................................................... 6-76
6.13.1 Laser Safety ........................................................................................................................... 6-76
6.13.2 NEBS Compliance .................................................................................................................. 6-76
6.14 Reliability ............................................................................................................................. 6-76
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6.14.1 Life ......................................................................................................................................... 6-76

6.14.2 Availability ............................................................................................................................. 6-76
6.15 Management Specifications ................................................................................................ 6-77
6.15.1 Management and Alarm Interfaces ...................................................................................... 6-77
6.15.2 Alarms and Performance....................................................................................................... 6-77
6.16 Other Specifications ............................................................................................................. 6-77
6.16.1 Cross-Connect Levels............................................................................................................. 6-77
6.16.2 Cross-Connect Capacity ......................................................................................................... 6-77
6.16.3 Traffic Protection................................................................................................................... 6-78
6.16.4 Redundancy........................................................................................................................... 6-78
6.16.5 Synchronization ..................................................................................................................... 6-78
6.16.6 Jitter and Wander.................................................................................................................. 6-78
7 Standards and References ........................................................................... 7-1

7.1 Broadband Forum .................................................................................................................. 7-1
7.2 Environmental Standards ...................................................................................................... 7-1
7.3 ETSI: European Telecommunications Standards Institute ..................................................... 7-1
7.4 IEC: International Electrotechnical Commission .................................................................... 7-2
7.5 IEEE: Institute of Electrical and Electronic Engineers ............................................................ 7-3
7.6 IETF: Internet Engineering Task Force ................................................................................... 7-3
7.7 ISO: International Organization for Standardization ............................................................. 7-5
7.8 ITU-T: International Telecommunication Union .................................................................... 7-6
7.9 MEF: Metro Ethernet Forum ................................................................................................. 7-9
7.10 NIST: National Institute of Standards and Technology ........................................................ 7-10
7.11 North American Standards .................................................................................................. 7-10
7.12 OMG: Object Management Group ...................................................................................... 7-11
7.13 TMF: TeleManagement Forum ............................................................................................ 7-11
7.14 Web Protocol Standards ...................................................................................................... 7-11
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List of Figures
Figure 2-1: Multiservice metropolitan optical network ................................................................................. 2-3
Figure 3-1: Basic XDM-100 shelf ..................................................................................................................... 3-1
Figure 3-2: XDM-100 with TPU (I/O protection)............................................................................................. 3-2
Figure 3-3: XDM-100 nonredundant configuration........................................................................................ 3-2
Figure 3-4: XDM-100H with one TPU/OCU shelf ............................................................................................ 3-3
Figure 3-5: Basic XDM-900 shelf, horizontal installation................................................................................ 3-4
Figure 3-6: Basic XDM-900 shelf, vertical Installation .................................................................................... 3-4
Figure 3-7: XDM-900 with TPU on top............................................................................................................ 3-5
Figure 3-8: XDM-900 with TPUs on top and at the bottom ........................................................................... 3-6
Figure 3-9: XDM-900 with two TPUs and an OCU .......................................................................................... 3-7
Figure 3-10: XDM-40 shelf layout ................................................................................................................... 3-7
Figure 3-11: XDM-450 platform ..................................................................................................................... 3-8
Figure 3-12: XDM-500 shelf open view .......................................................................................................... 3-8
Figure 3-13: XDM-1000 standard shelf open view ......................................................................................... 3-9
Figure 3-14: XDM-2000 open view ............................................................................................................... 3-10
Figure 3-15: XDM-3000 front view ............................................................................................................... 3-11
Figure 3-16: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI recommended ETSI rack .................. 3-13
Figure 3-17: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended ETSI rack ........................ 3-14
Figure 3-18: Two XDM-500 shelves installed in a 2200 mm ETSI rack ......................................................... 3-15
Figure 3-19: Two XDM-40 shelves installed in a 2200 mm ETSI rack ........................................................... 3-16
Figure 3-20: Two XDM-2000 shelves installed in a 2200 mm ECI recommended ETSI rack ........................ 3-17
Figure 3-21: Two XDM-1000 shelves installed in a 2600 mm ECI recommended ETSI rack ........................ 3-18
Figure 3-22: XDM-1000 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI
rack ............................................................................................................................................. 3-19
Figure 3-23: XDM-500 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI
rack ............................................................................................................................................. 3-20
Figure 3-24: XDM-100 slot allocation ........................................................................................................... 3-21
Figure 3-25: XDM-900 slot allocation ........................................................................................................... 3-24
Figure 3-26: XDM-40 card layout.................................................................................................................. 3-28
Figure 3-27: XDM-450 slot layout................................................................................................................. 3-28
Figure 3-28: XDM-500 standard card layout ................................................................................................ 3-29
Figure 3-29: XDM-1000 standard card layout .............................................................................................. 3-31
ECI Telecom Ltd. Proprietary xi

List of Tables
Table 4-1: STM-1 bidirectional transceivers ................................................................................................... 4-6
Table 4-3: STM-16 bidirectional transceivers ............................................................................................... 4-10
Table 4-4: GbE bidirectional client transceivers ........................................................................................... 4-17
Table 4-5: SFP+ client transceivers ............................................................................................................... 4-18
Table 4-6: SFP+ bidirectional client transceivers .......................................................................................... 4-19
Table 4-7: SFP+ C/DWDM transceivers ........................................................................................................ 4-20
Table 5-4: SIM cards FEC support ................................................................................................................. 5-14
Table 5-5: GbE bidirectional transceivers ..................................................................................................... 5-18
Table 5-6: SFP+ client transceivers ............................................................................................................... 5-19
Table 5-7: SFP+ bidirectional client transceivers .......................................................................................... 5-20
Table 5-8: SFP+ C/DWDM transceivers ........................................................................................................ 5-20
Table 6-1: STM-1 transceivers ........................................................................................................................ 6-8
Table 6-3: STM-4 transceivers ...................................................................................................................... 6-11
Table 6-4: STM-4 bidirectional transceivers ................................................................................................. 6-12
Table 6-5: STM-16 transceivers .................................................................................................................... 6-14
Table 6-7: STM-64 bidirectional transceivers (XFPs) .................................................................................... 6-19
Table 6-8: SIO cards FEC support.................................................................................................................. 6-20
Table 6-9: Bidirectional transceivers (XFPs) ................................................................................................. 6-31
ECI Telecom Ltd. Proprietary xii

1 About This Manual
The XDM System Specifications describes the technical specifications of the platforms, cards, modules, and
transceivers included in each platform.
1.1 Intended Audience

This manual is intended for field engineers, network designers, and other qualified service personnel
responsible for designing, installing, and maintaining the XDM products and its accessories.
1.2 Document Organization

This System Specifications contains the following information:
 Physical description
 XDM-100 specifications
 XDM-900 specifications
 XDM-40, 400, 450, 500, 1000, 2000, and 3000 specifications
 Standards and references
1.3 Notes and Warnings

When applicable, this guide uses the following notes and warnings:
NOTE: clarifying information, specific instructions, commentary, sidelights, or interesting

points of information.
CAUTION: failure to follow directions could result in damage to equipment or loss of

information.
WARNING: failure to follow directions could result in bodily harm or loss of life.
LASER WARNING: how to avoid personal injury. All personnel involved in equipment
installation, operation, and maintenance must be aware that laser radiation is invisible.
Therefore, although protective devices generally prevent direct exposure to the beam,
personnel must strictly observe the applicable safety precautions and, in particular, must
avoid staring into optical connectors, either directly or using optical instruments.
ECI Telecom Ltd. Proprietary 1-1

XDM® System Specifications About This Manual
ESD: information on how to avoid discharge of static electricity and subsequent damage to
the unit.
TIP: helpful information and handy hints that can make your task easier.
IMPORTANT: essential information to which you must pay attention.
1.4 Related Documentation

The following publications may be of assistance to you in the installation and commissioning processes of
XDM:
 XDM General Description
 XDM-100 Reference Manual
 XDM-1000 Reference Manual
 XDM-100 Installation and Maintenance Manual
 EMS-MPT Documentation Suite
 LCT-MPT Documentation Suite
 LightSoft® Documentation Suite
1.5 How to Obtain ECI Technical Documentation

To obtain technical documentation related to any ECI product, contact:
ECI Telecom Ltd.
ECI Documentation Group
30 Hasivim St.
Petach Tikva 4959388 – Israel
Fax: +972-3-9268060
Email: techdoc.feedback@ecitele.com

XDM® System Specifications About This Manual
1.6 Technical Assistance

For all product-related questions and issues, including installation, configuration, operation, and
maintenance, contact your local ECI Telecom Customer Support representative.
You can also contact the global ECI Telecom Customer Support Center at:
Telephone +972-3-9266000
Telefax +972-3-9266370
Email on.support@ecitele.com

2 XDM Overview
2.1 Intelligent and Scalable Optical Networking

Platforms
The telecommunications landscape is becoming more and more competitive. Carriers and operators are
demanding networking equipment that can do more for less money. Today's networking equipment must
be flexible, upgradeable, and highly intelligent. It must be able to successfully integrate with equipment
produced by other manufacturers according to accepted industry standards. Above all, today's networking
equipment must be scalable, easy to operate and maintain, and cost effective.
At ECI, we specifically addressed these issues when we designed the XDM platforms. The XDM offers
carriers unprecedented capacity, cost-savings, and ease of integration, placing it at the forefront of the
optical networking revolution.
The XDM offers a series of outstanding advantages, including:
 Data-services – the XDM facilitates migration from voice-oriented to data-oriented networks,
combining the cost-effectiveness and universality of Ethernet with the Quality of Service (QoS),
scalability, and resilience of SDH/SONET.
 Optical DWDM capabilities – the XDM implements low-cost all-optical networks by offering
sublambda grooming of multiple low-rate services (including SDH/SONET, IP, ATM, and GbE) onto a
single wavelength.
 Versatility and interoperability – the XDM coexists in perfect harmony with equipment from other
vendors by enabling the free flow of management information between network elements. Its
management software facilitates smooth integration with other high-level management systems.
 Readiness for future architectures – thanks to its inherently modular build-as-you-grow™
architecture, the XDM gives carriers the ability to meet all of tomorrow's networking environments,
be they ring, star, or mesh.
The innovative design of the XDM meets all the requirements of modern transmission networks in a single
shelf, consolidating key networking technologies in a modular infrastructure to create the world's most
accommodating and scalable single-shelf platform. XDM operators can choose to use only the features
required based on current demands, and add functions and services as requirements grow. This results in
flexible and scalable platforms that provide dynamic multiservice provisioning while reducing both capital
expenditures (CAPEX) and operating expenses (OPEX).

XDM® System Specifications XDM Overview
2.2 Unparalleled Capabilities

Typical metro networks span distances anywhere from 10 km to 300 km, serving large bandwidth-hungry
areas. Equipment serving these networks must therefore be able to interconnect a wide range of protocols,
from business customers in the access layer to service providers in the backbone.
As a true MultiService Provisioning Platform (MSPP), the XDM seamlessly integrates multiple network
types, traffic types and technologies, including:
 SDH/SONET
 Bitrates ranging from E1 all the way up to STM-64/OC-192
 Large nonblocking matrix for full connectivity
 Variety of port densities that can fit into any network layer from the network termination unit
all the way up to the central office
 Optical
 High density of lambdas (40 to 80) in the C band
 Ability to add/drop any lambda at any site
 Ability to provide metro solutions without amplification
 Long-haul solutions up to 1500 km
 Data
 Usable bandwidth to customers, including Layer 1 and Layer 2 Ethernet services, from 10BaseT
all the way up to 10 GbE
 Ability to route data over SDH/SONET or DWDM
 Additional cards can be added as needed, to reduce cost and protect against over-expansion
 Cellular
 Aggregates ATM traffic to optimize bandwidth utilization
 Unifies 2G and 3G networks
Several cross connect types are available, including broadband, wideband, and integrated
broadband/wideband, all of which comply with applicable standards.
The XDM does all of this while maintaining high levels of performance and reliability. Moreover, the
inherent DWDM capabilities of the XDM provide operators with an intelligent infrastructure offering
virtually unlimited expansion paths.
The multi-layer multiservice functionality of the XDM enables you to:
 Migrate from today's ring topologies to mesh architectures, segment by segment
 Add and activate bandwidth as requirements change

 Provide on-demand services across multiple network layers

Figure 2-1: Multiservice metropolitan optical network
2.3 XDM Platforms

The XDM family of integrated optical platforms consolidates key networking technologies in a modular
infrastructure that integrates all the transport functions of a complete Point of Presence (POP) in a single
shelf sized element. Cards can be interchanged between the various platforms, ensuring a flexible build as
you grow architecture for transporting all types of traffic, including voice, ATM, IP, and data.
These technical specifications address the following XDM shelf configurations.
 XDM®-100 – Miniature MSPP for Metro Access and Cellular Networks – an economical,
highly-scalable metro access multiservice Packet-OTS aggregation platform with add-on C/DWDM
capability. Ideal for developing organizations, this modular shelf accepts a large variety of interfaces,
supports a wide range of redundant/non-redundant configurations, and covers E1 to STM-16 with the
full range of carrier class Ethernet services.
The XDM®-100 capabilities can be enhanced by adding an ACP100 card that supports ASON
functionality. ASON provides a variety of bandwidth-efficient protection and restoration schemes for
a full range of ring, mesh, and P2P network topologies.

 XDM®-900 – MSPP for High Capacity Central Exchange Applications – designed for high capacity
central exchange applications, the XDM-900 is optimized for the metro core and features
unprecedented port densities.
The XDM-900 offers both native Ethernet and native TDM transport. By supporting the most
advanced carrier class Ethernet-based services (Layer 1, Layer 2, EoS, MPLS-TP over transport as well
as native Ethernet/MPLS-TP), the XDM-900 is well positioned to implement cellular backhaul
transition/migration plans while supporting full triple play services for residential NGN applications.
This platform lets you preserve your existing network structure and working procedures as you move
towards packet-based delivery. ASON functionality is provided by a dedicated ACP900 module that
can be installed in the MXC900 card.
The XDM-900 provides connectivity between central office legacy switches over E1, E3/DS 3, and STM
1/OC 3 trunks, and between POPs over native Fast Ethernet, Gigabit Ethernet, or POS, while
efficiently grooming traffic from edge rings.
 XDM®-40 – Modular C/DWDM and OTN Platform for Metro Access and CPE Applications – enables
service providers to build end to end flexible standards based OTN solutions that address the growing
demand for business data transport. It gives service providers the flexibility to take full advantage of
their existing networks, while providing a smooth and fully supported migration to IP over optics.
 XDM®-450 – Standalone Computer Control Panel (CCP) shelf for optics overlay – provides an
efficient cost effective way to add optical capacity to your network configuration and serves as an add
on to host additional OMs such as amplifiers and ROADMs. The XDM-450 is especially valuable for use
with the, XDM-1000, XDM-2000, and XDM-3000 platforms, enabling a smooth DWDM upgrade path
and supporting alien lambda extensions.
 XDM®-500 – Data Aware Access Gateway – designed for medium interface capacities and street
cabinet installations. It provides compact multiservice Packet-OTS with integrated all-range WSS
ROADM, for high capacity aggregation of TDM and Ethernet/MPLS services over optical infrastructure
in metro and regional networks. The XDM-500 is optimized for the metro-edge, where it collects
multiple services and delivers them to the COs and POPs in the core. The XDM-500 provides
traditional broadband services as well as sophisticated optical capabilities such as multidegree
ROADM technology and highly advanced data services such as adaptive rate GbE, sophisticated Layer
2 Ethernet, and Packet over SDH/SONET (PoS). It can be used either as a simple ADM or as a
multi-ADM/TM for distributed ring cross connectivity. ASON capabilities is supported using an ACP100
module that can be installed in any CCP slot.
 XDM®-1000 – MSPP for High Capacity Central Exchange Applications – designed for high capacity
central exchange applications, the XDM-1000 is optimized for the metro core and features
unprecedented port densities.
The XDM-1000 is a future-proof converged All-Native multiservice Packet-OTS with integrated
all-range WSS ROADM for high capacity aggregation of TDM and Ethernet/MPLS services over optical
infrastructure, optimized for metro and regional networks. The XDM-1000 offers a unique
convergence of SDH/SONET, TDM/ATM, Carrier Ethernet/MPLS, and all-range WDM/OTN ROADM on
a single platform, leading the Packet-OTS market segment. XDM-1000 also supports ASON
functionality.
The purpose of the ASON network control plane is to:
 Facilitate fast and efficient configuration of connections within a transport layer network to
support both switched and soft permanent connections.
 Reconfigure or modify connections that support calls that have previously been set up.
 Restore connections in the event of a failure.

ASON in the XDM-1000 can be provided by an xMACP module that integrates the main controller
functions with ACP (and saves the use of a CCP slot), or by installing an ACP100 module in a CCP slot.
With a 100% non-blocking E1 to STM-64 switching matrix of 120 Gbps, up to 400 Gbps of
Ethernet/MPLS-TP switching capacity, and a variety of interfaces (E1, STM-1/4/16/64,
OC-3/12/48/192, FE/GbE/10 GbE) over up to 40/80 DWDM channels, it fits a broad range of
applications and services, including mobile backhaul, business, MSO, CoCs, and residential triple play.
With extensive support for both data (Layer 1, Layer 2, EoS, MPLS) and optics (C/DWDM and WSS
ROADM), the XDM-1000 supports a smooth migration path to packet-based networks.
The XDM-1000 provides connectivity between central office legacy switches over E1, E3/DS 3, and
STM 1/OC 3 trunks, and between POPs over native Fast Ethernet, Gigabit Ethernet, or POS, while
efficiently grooming traffic from edge rings.
XDM®-2000 – Multifunctional Intelligent Optical Switch – designed for the metro and metro regional
core, the XDM-2000 is optimized for pure DWDM and hybrid optical applications. This is a highly
dense DWDM platform that provides intelligent sublambda grooming and optimum wavelength
utilization.
As the most flexible optical switch on the market today, the XDM-2000 transports up to 400 Gbps
(upgradeable to 1.6 Tbps and above), and integrates the most advanced optical units with a variety of
interfaces and a sophisticated high capacity matrix in one small low cost package. ASON functionality
is supported by installing an xMACP module.
XDM®-3000 – High Capacity Metro Core MSPP – a high capacity Packet-OTS (240 Gbps TDM and up
to 500 Gbps Ethernet/MPLS-TP switching), ideal for regional metro-core networks. The platform
offers a large fan-out with 24 slots for service cards. Built-in support for both TDM and carrier class
Ethernet services enables efficient use of existing network infrastructure while supporting smooth
migration to NG networks.
The XDM-3000 is designed for ever-expanding optical transport traffic demands, with network
migration to n x 10G interfaces increasing the bulk bandwidth requirements for core platforms.
Adding the high capacity of the XDM-3000 to heavily populated sites relieves traffic bottlenecks on a
per-site basis without introducing changes to the rest of the network. The platform enables network
expansion and improved bandwidth efficiency through the use of 10 Gbps cards to maximize
utilization of available slots. ASON functionality is provided by a dedicated ACP3000 card installed in
an ASON slot.
As a multi ADM, the XDM-3000 provides multi ring closure, simultaneously closing STM 16/STM 64
core MS SPRing and multiple edge SNCP rings, and providing improved protection and restoration
capabilities. The XDM-3000 can also be used as a cost effective DXC for heavy traffic sites, forming a
fully protected mesh core. The large amount of low order traffic handled by this platform enables full
connectivity for TDM networks.

3 Physical Description
3.1 XDM Shelf Configurations

This section describes the XDM shelf configurations and slot assignments.
3.1.1 XDM-100 Shelf Layout

The XDM-100 is available in four configurations:
 Basic XDM-100 shelf
 XDM-100 with I/O protection
 Nonredundant XDM-100
 Hybrid XDM-100H
3.1.1.1 Basic XDM-100 shelf

The basic XDM-100 shelf is housed in a 231 mm deep, 443 mm wide, and 200 mm high equipment cage.
The lower part of the shelf consists of the card cage and accommodates the MXC-100B cards (main and
protection) and the ECU. The upper part of the shelf consists of the module cage that houses up to eight
I/O modules. Various types of interface modules supporting PDH, SDH, and data services are available. The
FCU fan control unit at the right side of the shelf provides cooling air to the system.
All electrical connections are located directly in the tributary modules; therefore, the XDM-100 does not
need additional electrical interface connections.
To support system redundancy, each MXC card contains an integrated xINF (XDM Input Filter) unit with
connectors for two input power sources.
Figure 3-1: Basic XDM-100 shelf

XDM® System Specifications Physical Description
3.1.1.2 XDM-100 with I/O protection

A TPU is mounted on top of the basic XDM-100 shelf to provide I/O protection to the I/O modules. The TPU
adds only 75 mm to the basic shelf height, allowing the XDM-100 to remain compact in size. It has five slots,
four allocated for TPMs and one for a TC module.
Each TPM is connected to both operating and protection I/O modules in the shelf in a 1:1, 1:2, or 1:3
configuration. If a failure is detected in one of the operating I/O modules, the TC switches the traffic from
the active to the protection I/O module.
Figure 3-2: XDM-100 with TPU (I/O protection)
3.1.1.3 Nonredundant XDM-100
NOTE: The nonredundant XDM-100 configuration is not recommended for data applications.
The nonredundant XDM-100 has the same physical dimensions as the basic shelf. It differs only by the
single MXC-100B card that it has in slot MXC A, compared with two cards in the basic shelf. Slot MXC B of
the nonredundant configuration accommodates a bridging unit, MXC-BR. No redundancy is provided for
the MXC-100B functions.
Figure 3-3: XDM-100 nonredundant configuration

3.1.1.4 XDM-100H
The XDM-100H combines the SDH/SONET and data capabilities of the XDM-100 with the optical CWDM
capabilities. This is provided by the software cost option incorporated within the NVM card in each of the
MXC-100 cards.
The XDM-100H consists of the basic XDM-100 shelf, and if required, one or two TPU/OCU shelves. The I/O
module cage can accept any mix of the XDM-100 I/O modules and CWDM I/O modules.
The TPU/OCU shelf is identical in its physical dimensions and number of slots (five) to the TPU. Four of the
slots can house any mix of TPMs and CWDM optical networking modules (mux/demux, OADM, and
splitter/coupler); the fifth slot always accommodates a TC module.
Figure 3-4: XDM-100H with one TPU/OCU shelf

The XDM-900 is available in following configurations:
 Basic XDM-900 shelf
 Expanded XDM-900 with I/O protection as follows:
 A TPU mounted on top of the basic shelf.
 A TPU mounted at the bottom of the basic shelf.
 Two TPUs mounted, one on top and one at the bottom of the basic shelf.
 Expanded XDM-900 with enhanced CWDM networking capabilities. An OCU is mounted on top of the
basic shelf, or on the expanded shelf (with a TPU).
3.1.2.1 Basic XDM-900 shelf

The basic XDM-900 shelf is housed in a 246 mm deep, 443 mm wide, and 350 mm high equipment cage.
The upper part of the shelf consists of a module cage (upper module cage) and houses up to eight I/O
modules. In the middle of the shelf is a card cage that accommodate the MXC900 cards (main and
protection), the External Connection Unit (ECU900), and up to two I/O cards. The lower part of the shelf
consists of an additional module cage (lower module cage) that can be equipped with up to eight I/O
modules.
I/O protection is not supported in this option.

The XDM-900 shelf can be installed in a horizontal or vertical position.

Figure 3-5: Basic XDM-900 shelf, horizontal installation
Figure 3-6: Basic XDM-900 shelf, vertical Installation

3.1.2.2 Expanded XDM-900 with I/O Protection

TPUs can be attached to the XDM-900 shelf to protect installed I/O modules. Each TPM is connected to
both operating and protection I/O modules in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is
detected in one of the operating I/O modules, the active MXC900 via the TC module in the TPU switches
the traffic from the active I/O module to the protection module. Several protection configurations are
possible:
 A TPU mounted on top of the basic shelf, protects I/O modules residing in the upper module cage.
 A TPU mounted at the bottom of the basic shelf, protects I/O modules installed in the lower module
cage.
 Two TPUs mounted one on top and one at the bottom of the basic shelf; provide protection to I/O
modules in both the upper and lower module cages.
Figure 3-7: XDM-900 with TPU on top

Figure 3-8: XDM-900 with TPUs on top and at the bottom
3.1.2.3 Expanded XDM-900 with CWDM Networking Capabilities

An OCU can be mounted on top of a basic XDM-900 shelf or on top of an expanded shelf to add enhanced
CWDM networking capabilities to the platform.
NOTE: An OCU is not supported at the bottom of the XDM-900 shelf.

Figure 3-9: XDM-900 with two TPUs and an OCU

The compact XDM-40 shelf is located in a 285 mm deep, 447 mm wide, and 256 mm high equipment cage.
The cards cage houses two I/O slots for optical cards (transponders, combiners, and/or optical amplifiers).
The upper cage houses two slots for the DWDM/amplifier modules. The shelf also includes an xMCP_B,
MECP, two xINF40s, and an xFCU40 that includes three separate fans to support system redundancy.
Figure 3-10: XDM-40 shelf layout


The standard XDM-450 is located in a 275 mm deep, 492 mm wide, and 374 mm high shelf with a single
cards cage section. The shelf consists of a single-row cage housing the DWDM, processor, and common
cards. The shelf also has two xINF and an xFCU unit.
Figure 3-11: XDM-450 platform

The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and 725 mm high equipment cage.
The shelf consists of a single-row cage housing the I/O, matrix, processor, and common cards in two slot
areas on either side of the shelf. The electrical interface connection modules and DWDM/OADM modules
are housed in the central slot area. The shelf also has two xINF and three xFCU units.
Figure 3-12: XDM-500 shelf open view


The standard XDM-1000 is located in a 285 mm deep, 450 mm wide, and 1100 mm high shelf with a
modules cage and a cards cage section. The cards cage houses the I/O, matrix, processor, and common
cards. The modules cage houses the electrical interface connection modules and DWDM/OADM modules.
The shelf also has two xINFs and three xFCUs.
Figure 3-13: XDM-1000 standard shelf open view


The XDM-2000 shelf is located in a 285 mm deep, 450 mm wide, and 775 mm high equipment cage. The
shelf consists of a single-row cage that houses optical cards (transponders, mux/demux, optical amplifiers),
and xMCP/xMCP_B and MECP cards.
XDM-500 and XDM-2000 shelves may be used in conjunction with the regular XDM-1000 shelf in the same
rack.
Figure 3-14: XDM-2000 open view


The XDM-3000 is located in a 350 mm deep, 492 mm wide, and 1550 mm high shelf. The XDM-3000
consists of an I/O card cage arranged in four sections, together with additional power, communication, and
control units.
Figure 3-15: XDM-3000 front view

3.1.9 Rack Layouts and Expansion Shelves

Most XDM shelves can be installed in both standard and ECI recommended ETSI racks, as well as in 19" and
23" racks, except for the XDM-3000 that can be installed in 19" racks. They can also be installed in 19" 7'
and 23" 7' bay racks, except for the XDM-100 that cannot be installed in 19" 7'bay racks.
The recommended ETSI rack offered by ECI is specially designed for installation of telecommunication
equipment and a wide range of equipment accessories. To facilitate cable routing, the rack has removable
rear and side panels which enable tidy leading and efficient maintenance of all rack cables. Two plastic
conduits on the rack's front rails support routing of up to 200 optical fibers. It also has open top and bottom
frames to facilitate easy routing of cables from suspension floors and/or ceiling ladders. The front door can
be mounted for right or left opening.
The XDM-100, or XDM-900 can be installed in either 2200 mm or 2600 mm standard or ECI recommended
ETSI racks.
NOTE: Installations of XDM-100, or XDM-900 in 19" racks must be approved by ECI's

Transport Networks Division – Mechanical Department.

Figure 3-16: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI recommended ETSI rack
The XDM-1000 can be installed in either a 2200 mm or 2600 mm ETSI rack. Two XDM-1000 shelves can be
installed in a 2600 mm rack, whereas a
2200 mm rack can accommodate only a single XDM-1000 shelf.
Alternatively, two XDM-500 and/or XDM-2000 shelves can be installed in a 2200 mm rack. One XDM-1000
shelf and one XDM-500 or XDM-2000 shelf can be installed in a 2600 mm rack.

The installation of XDM-500, XDM-1000, and XDM-2000 in 19" or 23" racks is supported as well.
In addition, a 600 mm deep rack can house XDM shelves in a back-to-back configuration, thus doubling the
capacity of the rack.
Figure 3-17: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended ETSI rack

Figure 3-18: Two XDM-500 shelves installed in a 2200 mm ETSI rack

Figure 3-19: Two XDM-40 shelves installed in a 2200 mm ETSI rack

Figure 3-20: Two XDM-2000 shelves installed in a 2200 mm ECI recommended ETSI rack

Figure 3-21: Two XDM-1000 shelves installed in a 2600 mm ECI recommended ETSI rack

Figure 3-22: XDM-1000 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack

Figure 3-23: XDM-500 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack

3.2 XDM-100 Card and Module Layout

3.2.1 Basic XDM-100 Shelf
The basic XDM-100 cage contains slots for I/O interface modules, and dedicated slots for the MXC cards
and the ECU. The cage's design and mechanical practice conform to international mechanical standards and
specifications.
The modules and cards are distributed as follows:
 Eight (8) slots, I1 to I8, optimally allocated for I/O interface modules.
 Two (2) slots, A and B respectively, allocated for the MXC cards (main and protection). Each MXC has
two slots (A1 and A2 and B1 and B2) to accommodate SDH/SONET aggregate modules.
 One (1) slot allocated for the ECU.
The ECU is located beneath the MXC cards. Its front panel features several interface connectors for
management, external timing, alarms, orderwire, and overhead (future release). It also includes colored
alarm severity LED indicators and selectors, and a display for selecting specific modules and ports for
monitoring purposes.
Figure 3-24: XDM-100 slot allocation
3.2.2 Expanded XDM-100 Shelf with I/O Protection

A TPU can be mounted on top of the basic XDM-100 shelf to add protection of electrical I/O modules. The
modules are distributed as follows:
 Four (4) slots flexibly allocated for TPMs (single-slot or double-slot modules are supported)
 One (1) slot allocated for the TC or TCF module
Each TPM is connected to the operating and protection modules of the XDM-100 shelf respectively. If a
failure is detected in one of the operating I/O modules, the XDM-100 control system sends control signals
to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module.
Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are supported.
The TC or TCF is connected to the DC and control buses of the MXC cards via the TPU backplane. It controls
the switching of traffic from the main to protection I/O module by relays in the corresponding TPM. In
addition, the TCF has four fans that provide cooling air to the modules installed in the TPU (optional).

3.2.3 Nonredundant XDM-100 Shelf

The XDM-100 is also available in a nonredundant configuration. This shelf is equipped with only one MXC.
The second position of the MXC houses an MXC-BG card that bridges the buses of the second slot to the I/O
modules. Redundancy for power supply, timing and synchronization, cross-connect, and all other MXC
functions is not supported in this configuration. However, since the MXC has two aggregate modules, SNCP,
MSP, and MS-SPRing traffic protection mechanisms are supported.
3.2.4 XDM-100H Shelf

The XDM-100H platform is based on the basic XDM-100 shelf, with a software cost option that supports
installation of any mix of the XDM-100 I/O modules with optical I/O modules in the module cage. In
addition, one or two TPU/OCU shelves can be mounted on top of the basic shelf to support any mix of TPM
and CWDM optical networking modules.
The XDM-100H consists of the following units:
 Basic XDM-100 shelf that includes the ECU or ECU-F, two MXC-100B cards, the I/O module cage with
eight slots, and the FCU. Each MXC-100B card houses an NVM module which contains the licensed
option software.
The eight slots of the I/O module cage support installation of XDM-100 I/O modules, as well as CWDM
I/O modules (transponders and combiners).
 TPU/OCU shelf (optional), mounted on top of the XDM-100 basic shelf. It contains five (5) slots: four
(4) for supporting any mix of mux/demux, OADM, splitter/coupler, and TPM modules, and one (1) for
a TC module. One or two TPU/OCUs can be mounted on the basic XDM-100 shelf.
3.3 MXC and ECU Cards

The MXC and ECU were designed to facilitate simple installation and maintenance. They feature:
 Electrical interface connectors that are integrated into the I/O modules, saving the need for separate
electrical interface modules
 Easy routing of external management interfaces
 Monitoring system for acceptance test purposes
 Hot insertion of cards and modules to support quick and non-traffic-affecting maintenance and repair
3.3.1 MXC-100B
The MXC-100B has two slots for housing aggregate modules in XDM-100. Two MXC-100B cards are usually
installed in the XDM-100, providing 1+1 protection. The MXC-100B features enhanced cross-connect and
timing functionality, and also supports OW.
The basic and expanded versions of the XDM-100 shelf accommodate two identical MXC-100B cards. By
default, the MXC-A is the main card and MXC-B is the protection card.
Both cards perform the following functions simultaneously in a 1+1 protection configuration:
 Communication and control
 Alarm and maintenance

 Cross-connect
 Timing and synchronization
 Distribution of power supply to all modules
 Routing and handling of 32 DCC channels
 Support for OW in conjunction with ECU100B
In addition, the MXC-100B accommodates the NVM compact flash memory card and houses SDH/SONET
aggregate modules (SAMs).
The additional MXC-100B card provides 1+1 protection to the cross-connect matrix and full 1:1 protection
to all other functions, since the standby MXC-100B has an identical database to the active MXC-100B.
In case of a hardware failure in the active MXC-100B or in its traffic interconnections, the I/O interface
modules switch to the protection MXC-100B within 50 ms. Similarly, in case of a hardware failure in the
TiMing Unit (TMU) of the operational MXC-100B card, the backup TMU takes over the timing control with
no disruption in traffic. The operational MXC-100B card is configured by LightSoft, ECI's Optical Network
Division's multidimensional network manager.
3.3.2 ECU
The ECU connects management, alarms, overhead access, and orderwire interfaces to the active MXC card.
This card also provides the physical connections for these interfaces.
Two types of ECU cards are available:
 ECU-F – supports full functionality, is usually used in the XDM-100
 ECU – supports reduced functionality and can also be used in XDM-100 installations
The ECU-F supports the following management and alarm interfaces and functions:
 Ethernet interface to LightSoft and EMS-XDM
 Ethernet hub for multiple NE connections
 Serial RS-232 interface for craft terminal
 USB interface
 Synchronization inputs and outputs (T3/T4)
 Alarm severity outputs (Critical, Major, Minor, Warning)
 External alarm outputs and inputs
 Alarm Cut Off (ACO)
 Operation and alarm LEDs
 Selection and display of traffic interfaces for monitoring purposes
 Monitor interface for STM-1/OC-3 ports
 Laser activation during ALS, for maintenance purposes
 Multiplexer reset
 Holdup capacitors
 Lamp test activation

The ECU supports all functions provided by the ECU-F except for Ethernet expansion to hub, monitoring
points, holdup capacitors, and alarms in/out.
3.4 XDM-900 Card and Module Layout

3.4.1 Basic XDM-900 Shelf
The basic XDM-900 shelf is 443 mm wide, 246 mm deep and 350 mm high. When the optional TPUs or OCU
are attached to the shelf, each of these expansion shelves adds 75 mm to the height of the basic shelf.
The rightmost slot of the shelf houses the FCU900. The middle part of the shelf consists of the cards cage
with five horizontal slots which accommodate:
 ECU900 or ECU900-F
 Two MXC900 cards (main and protect)
 Two ACP900 modules each in an MXC900
 Up to two quad I/O cards
NOTE: The XDM-900 can also be equipped with MXC300 matrix cards and operate with
reduced capacity ;60 Gbps per platform, 2.5 Gbps per I/O slot, and 10 Gbps per quad slot.
NOTE: The slots of the quad I/O cards can be adapted to accommodate one SIM16_1 I/O
module each instead of the I/O cards by using a mechanical adapter.
The upper and lower parts of the shelf consist of a module cage with eight horizontal slots. Each module
cage can house up to eight I/O (PDH, SDH, or data) single slot modules, totaling a maximum of 16 modules.
Figure 3-25: XDM-900 slot allocation

3.4.2 Expanded XDM-900 Shelf with I/O Protection

In an expanded XDM-900 shelf with I/O protection, one or two TPUs are mounted on the top and/or at the
bottom of the basic shelf, including a TC or TCF module and TPMs. An OCU with CWDM networking
modules can be mounted on top of a basic or expanded shelf.
The TPU modules are distributed as follows:
 Four (4) slots flexibly allocated for TPMs (single-slot or double-slot modules are supported)
 One (1) slot allocated for the TC or TCF module
Each TPM is connected to the operating and protection modules of the XDM-900 shelf respectively. If a
failure is detected in one of the operating I/O modules, the XDM-900 control system sends control signals
to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module.
Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are supported.
The TC or TCF is connected to the DC and control buses of the MX900 cards via the TPU backplane. It
controls the switching of traffic from the main to protection I/O module by relays in the corresponding
TPM. In addition, the TCF has four fans that provide cooling air to the modules installed in the TPU
(optional).
3.5 MXC900 and ECU900 Cards

The MXC900 and ECU900 were designed to facilitate simple installation and maintenance. They feature:
 Electrical interface connectors that are integrated into the I/O modules, saving the need for separate
electrical interface modules
 Easy routing of external management interfaces
 Monitoring system for acceptance test purposes
 Hot insertion of cards and modules to support quick and non-traffic-affecting maintenance and repair
3.5.1 MXC900
The XDM-900 is a redundant platform, and two MXC900 cards must always be installed in slots MXC-A and
MXC-B of the XDM-40 shelf.
The MXC900 performs the following functions:
 Communications and control (by CPU):
 Routing and handling of 128 DCC channels
 Control of all shelf cards and modules
 Management interface
 Support of the 256 Mb NonVolatile compact flash Memory (NVM) card
 Alarms and maintenance
 Control of TPU/OCU shelves
 5 Gbps capacity for all I/O module slots, and 20 Gbps for quad I/O card slots

 SDH/SONET-related functions:
 SDH/SONET timing and synchronization
 SDH/SONET cross connect 4/3/1
 120 Gbps HO/LO nonblocking matrix
 Accommodates the ACP-900 module and provides power supply, communication, and control
 Support for CWDM I/O modules (transponders and combiners) in all I/O module slots
 DC voltage supply:
 One 48 VDC power input that supplies voltages for all cards and modules
 Input Filtering (INF) function for the entire shelf
 Voltage and control for Fan Control Unit (VFCU)
3.5.2 ECU900
Two types of ECU900 cards are available:
 ECU900-F – supports full functionality
 ECU900 – supports reduced functionality
3.5.2.1 ECU900F
The ECU900F supports:
 Management interfaces:
 Management (LightSoft and EMS-XDM) interface (Ethernet)
 Ethernet hub for the connection of multiple NEs
 Serial (RS-232) interface for craft terminal
 Alarm interfaces and indications, including:
 External alarm outputs and inputs to client or xRAP-100
 ACO
 LEDs for display of operation and alarms
 Traffic monitoring, including:
 Selection and display of the traffic interface channel currently being monitored for all I/O
module (I1 to I16) slots, as well as, quad I/O card (I17 and I18) slots
 Monitor interface for STM-1 ports
 Activations, including:
 Laser activation during ALS for maintenance purposes
 LEDs test for the entire shelf
 Hold-up capacitors

3.5.2.2 ECU900
The ECU900 card is suitable for sites that do not require alarms dry-contacts, output system monitoring,
and Ethernet hub for management. It supports:
 Management interfaces, including:
 Management (LightSoft and EMS-XDM) interface (Ethernet)
 Ethernet hub for the connection of multiple NEs
 Serial (RS-232) interface for craft terminal
 Alarm interfaces and indications, including:
 External alarm outputs and inputs to client or xRAP-100
 ACO
 LEDs for the display of operation and alarms
 Activations, including:
 Laser activation during ALS for maintenance purposes
 LEDs test for the entire shelf
3.6 XDM-40 Card Layout

The XDM-40 standard shelf consists of a modules cage housing DWDM and amplification modules, a cards
cage housing the I/O cards and common cards, the xFCU40, and the power supply for the fan unit (PSFU).
Modules cage
 Two (2) slots (M1 and M2) allocated to DWDM/OADM, optical booster, and accessories modules
 Two (2) xINF40s designed for power supply redundancy
 One (1) ECM to facilitate routing of external management interfaces, connecting the management,
OHA, and OW interfaces to the active xMCP_B
Cards cage
 Two (2) slots (I1 and I2) flexibly allocated to I/O optical transponders, combiners, and/or amplifiers
 One (1) slot (C1) allocated to the xMCP_B card
 One (1) slot (C3) allocated to the MECP card, for user and management interfaces
 PSFU and xFCU40 that consists of three separate fans to support cooling system redundancy

Hot insertion of cards and modules is allowed to supports quick maintenance and repair activities without
affecting traffic.
Figure 3-26: XDM-40 card layout

The XDM-450 shelf consists of a single cage containing slots for nine DWDM modules and dedicated slots
for the processor, management and other common cards. The XDM-450 standard shelf is arranged as
follows.
 Nine CCP slots (M1 to M9) flexibly allocated to DWDM modules such as ROADMs, Mux/DeMuxes, and
amplifiers.
 One slot (C0) allocated to the xECM-450 card, for user and management interfaces.
 One slot (C1) allocated to the xMCP-B2G card.
 One slot for optional OSC Mux/DeMux module with integrated C/T filter (ACC4OSC5).
 Two xINF-450 modules designed for power supply redundancy.
 xFCU-450 fan unit to support cooling system redundancy.
The XDM-450 standard card layout is illustrated in the following figure.
Figure 3-27: XDM-450 slot layout


The XDM-500 shelf consists of a single cage containing slots for six I/O cards, four connection modules, and
dedicated slots for the matrix, processor, and common cards. The XDM-500 cage design and mechanical
practice conform to international mechanical standards and specifications. The cards are distributed as
follows:
 Six (6) slots, IC1 to IC6, flexibly allocated for I/O cards and/or transponders (depending on the
configuration)
 Four (4) slots, MC1 to MC4, allocated for electric interface connection modules or DWDM/OADM
modules
 Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards
 Two (2) slots, C1 and C2, allocated for the xMCP cards
An external connection module, the MECP, is located above the xMCP/xMCP_B cards for connecting the
management, overhead access, and orderwire interfaces to the active xMCP/xMCP_B.
Figure 3-28: XDM-500 standard card layout


The standard XDM-1000 consists of a modules cage housing the connection modules, a cards cage housing
the I/O and common cards, input filters, and fan control units. The XDM-1000 standard card layout is
illustrated in XDM-1000 standard card layout and is allocated as described in the following paragraphs.
3.9.1 Modules Cage

 Eleven (11) slots, M1 to M11, allocated for electric interface connection modules or DWDM/OADM,
optical booster, optical preamp modules
 Two xINFs
3.9.2 Cards Cage

 Twelve (12) slots, I1 to I12, flexibly allocated for I/O cards and/or transponders (depending on the
configuration)
 Two (2) slots, X1 and X2, allocated for the HLXC or CPTS matrix cards (only HLXC768 and CPTS240 are
supported)
 Two (2) slots, C1 and C2, allocated for the xMCP_B/xMCP-B2G/xMACP-B2G cards
An external connection module, the MECP, is located in the cards cage of the XDM-1000 above the
xMCP/xMCP_B cards. It is used to connect the management, overhead access, and orderwire interfaces to
the active xMCP/xMCP_B card.
The modules cage contains 11 double-slot connection modules. Electrical I/O cards installed in the cards
cage interface with the XDM-1000 via connection modules installed in the modules cage. The modules are
extractable, thus allowing a flexible assignment of physical I/O ports.

Optical I/O cards utilize internal slide-in I/O modules for signal interfacing and do not require connection
modules in the modules cage. The free modules cage slots in optical systems can therefore be allocated to
DWDM or OADM multiplexing and amplification modules.

The XDM-2000 consists of a single cage whose slots can be allocated as follows:
 Twelve (12) slots, I1 to I12, allocated for transponders and other optical modules
 Two (2) slots, X1 and X2, allocated for mux/demux or matrix cards (depending on the system
configuration)
 Two (2) slots, C1 and C2, allocated for the xMCP_B/xMCP-B2G/xMACP-B2G cards

The external connection module, the MECP, is located in the upper section of the cage.
The cage design and mechanical practice of the XDM-2000 conform to international mechanical standards
and specifications.

The XDM-3000 consists of an I/O card cage arranged in four sections, together with additional power,
communication, and control units, as follows:
 24 slots (I1 to I24) flexibly allocated to I/O cards and/or amplifiers, depending on the configuration.
I/O card options include combinations of up to 24 SIO1&4B, SIO164, DIOB, and/or MCS5/10 cards.
Single channel OFA2 or OFA_M amplifiers can be used for long distance applications.
 Two slots (X1 and X2) allocated to HLXC1536 matrix cards.
 Two slots (A1 and A2) allocated to ACP3000 ASON cards.
 Two slots (C1 and C2) allocated to the xMCP-B2G cards.
 One slot (C0) allocated to the MECP card, for user and management interfaces.
 One ECB3000 that provides external connections for the MECP card.
 Two INF3000s designed for power supply redundancy.
 Two FCU3000 fan units with ten fans each.

The XDM-3000 card layout is illustrated in the following figure.


3.12 Control, Matrix, and I/O Cards for Large XDM

Shelves
NOTE: HLXC and XIO matrix cards are offered in several versions for large XDM shelves. The
generic names HLXC and XIO are used in the following sections to describe the cards
functionality when the information applies to all versions.
XDM shelves have been designed to facilitate simple installation and easy maintenance. They incorporate
the following layout features:
 The connection modules in the modules cage (XDM-500 and XDM-1000) are located as close as
possible to the I/O cards in the cards cage
 The HLXC-L, HLXC-R, or XIO matrix cards are located near the sidewall of the shelf to facilitate the
routing of traffic buses to the I/O cards
 The xMCP/xMCP_B control cards are located such that they simplify the identification of any control
problem issues
 The MECP is located above the xMCP/xMCP_B to facilitate the routing of the external management
interfaces
3.12.1 HLXC768/1536 and CPTS240

Two versions of HLXC matrix cards are offered for XDM large shelves. They differ in their switching capacity
as follows:
 HLXC768 – supports 768 x 768 STM-1 streams
 HLXC1536 - supports 1536 x 1536 STM-1 streams
In addition a special dual matrix card, the CPTS240 can be configured into the XDM-1000 and XDM-2000
platforms.
The CPTS240 is a powerful, high capacity, non-blocking dual cross-connect matrix. It includes a TDM matrix
for native SDH/SONET switching and a packet switch to support native packet-level switching.
With earlier technologies, legacy TDM-level cross connect through the TDM matrix would consume much of
the available bandwidth, and the bandwidth was allocated statically. In the CPTS240, bandwidth is allocated
dynamically, ensuring high flexibility and efficient utilization of this limited resource. Furthermore, in the
event slot unassignment and reassignment is required, the matrix uses a sophisticated bandwidth
rearrangement algorithm to enable best bandwidth utilization.
NOTE: HLXC768 is not supported in XDM-500.
NOTE: HLX1536 is supported in XDM-3000 only.

The XDM-500, XDM-1000, XDM-2000, and XDM-3000 contain two identical HLXC cards. Both cards perform
the cross-connect and node synchronization functions simultaneously in a 1+1 protection configuration. In
case of a hardware failure in the operational HLXC or in its traffic interconnections, the I/O interface cards
switch to the backup HLXC within 50 ms. Similarly, in case of a hardware failure in the TMU of the
operational HLXC, the backup TMU takes over the timing control with no traffic disruption. The operational
HLXC is determined by the LightSoft network manager.
3.12.2 XIO384F
XIO cards combine the functionality of an HLXC card with that of SDH I/O cards.
One versio of XIO, the XIO384F is offered for XDM large shelves. It has a switching capability of 384 x 384
STM-1 streams and upports 1 x STM-64/OC-192 interface or 4 x STM-16/OC-48 interfaces.
NOTE: XIO384F card is not supported in XDM-3000.
The XDM can optionally contain two identical XIO card. XIO cards consist of a matrix unit and SDH/SONET
interfaces on the same basecard. Like the HLXC, XIO cards perform the cross-connect and node
synchronization functions simultaneously in a 1+1 protection configuration. Upon detection of a hardware
failure in the XIO or in its traffic interconnections, I/O cards switch to the backup XIO card within 50 ms. If
required, the backup TMU takes over timing control from the operational XIO with no traffic disruption.
3.12.3 xMCP/xMCP_B/xMACP
The xMCP/xMCP_B performs the communications, control, alarm, and maintenance functions for the XDM.
An additional xMCP/xMCP_B may optionally provide full capability 1:1 protection since the standby
xMCP/xMCP_B has an identical database to the active xMCP/xMCP_B. Upon a failure of the active
xMCP/xMCP_B, the standby xMCP/xMCP_B becomes the active control unit.
The xMCP/xMCP_B is also responsible for communicating with external network elements and
management stations. It communicates with other SDH/SONET NEs via the DCC channel embedded in each
SIO link. In addition, the xMCP/xMCP_B provides multiple access to all overhead bytes in all incoming
SDH/SONET lines. It provides 64 kbps and N x 64 kbps trail capability for transporting management data,
external DCC channels or for external DCN purposes.
The xMACP_B provides all functionalities of the xMCP/xMCP_B and in addition supports ASON
functionality. The use of the xMACP_B also saves a CCP slot in the platform in which it is installed.
3.12.4 MECP
The MECP connects the management, overhead access, and orderwire interfaces to the active
xMCP/xMCP_B. The physical management connections are provided by the ECB located above the MECP.
The MECP supports standard OW as well as a special voice channel over the DCC when using VoIP and a
special router. This feature enables external calls from outside the network to a particular site. In addition,
the MECP generates system alarms and activates indicators, for example, software downloads, restarts,
configurations, and so on.
In pure optical networks and inline amplifier sites, one of two special MECP versions is supplied to support
the optical supervisory channel operating at 1510 nm or 1310 nm.

3.12.5 ECB or ECB3000

The ECB provides the physical interface between the XDM and external management and clock devices.
This card is also available in a special version, ECB3000 for the XDM-3000.
3.12.6 ECM40
The ECM40 provides the physical connections to the XDM-40 alarms, provisioning (LCT), and OW interfaces.
This unit is a dedicated module, used only in the XDM-40.

4 XDM-100 Specifications
4.1 Cross-Connect Specifications

4.1.1 Cross-Connect Levels
SDH cross-connect levels VC-4nc, VC-4, VC-3, VC-12
SONET cross-connect levels STS-nc, STS-1
4.1.2 Cross-Connect Capacity

SDH switch core options 192 x STM-1 with cross-connect capability of 4/3/1
SONET switch core options 192 x OC-3
4.1.3 XDM-100 Shelf Capacity

XDM-100 shelf slot capacities differ as a function of the type of matrix cards (MXC-100B, or combination of
MXC-100B, and MXC-BR) used. The bandwidth allocation capacity per I/O slot for MXC-100B is different
than that for MXC-100B and a MXC-BR.
NOTE: The following is applicable:

 The MXC-BR is supported only for SDH applications
The following table describes the MXC-100B, and MXC-BR bandwidth allocation capacity per slot for the
XDM-100.
MXC type Slot # Capacity per slot Total XDM-100 capacity

MXC-100B (x 2) I1 to I8 2.5 Gbps 30 Gbps
A1, A2, B1, B2 2.5 Gbps
1
MXC-100B (x 1) I1 to I8 1.25 Gbps 15 Gbps
MXC-BR2 (x 1) A1, A2 2.5 Gbps
1
This configuration is supported only for SDH applications.
2
This configuration is supported only for SDH applications.

XDM® System Specifications XDM-100 Specifications
4.2 Traffic Protection

Applicable specifications ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE
SNCP I/N LO, HO within 30 ms
MSP/APS 1+1 within 50 ms
MS-SPRing/BLSR within 50 ms
OCH 1+1 optical protection within 5 ms
4.3 Redundancy
Control and synchronization systems 1+1 duplicated
Switching matrix, power system, 1+1 duplicated
internal buses, external buses
I/O electrical modules protection 1:1, 1:2, and 1:3
4.4 Synchronization
There are several timing references available from multiple SDH/SONET and/or PDH/Async timing sources:
 From any 2 MHz/2 Mbps tributary interface
 From any 1.5 Mbps tributary interface
 From any SDH/SONET line
 External SDH 2 MHz/2 Mbps timing outputs (two per shelf)
 External SONET 1.5 Mbps timing outputs (two per shelf)
 G.813 internal clock
Synchronization Status Marker (SSM) support is also provided.
4.5 Jitter and Wander

Applicable specifications ITU-T G.823, G.825

4.6 I/O Interfaces

4.6.1 2 Mbps (E1)
Physical level G.703, Paragraph 6
Frame Unframed
Line code HDB3
Line impedance 120 Ω balanced/75 Ω3 unbalanced
Bitrate 2048 Kbps ± 50 ppm
4.6.2 34 Mbps (E3)

Frame G.751
Line code HDB3
Line impedance 75 Ω unbalanced
4.6.3 45 Mbps (DS-3)

Frame Unframed, ANSI T1.107
Line code B3ZS
4.6.4 52 Mbps (STS-1)

Physical level GR-253-CORE
Frame G.253
Line code CMI
4.6.5 STM-1 Electrical

Bitrate 155.52 Mbps ±20 ppm
Frame G.707
Line code CMI
3
Through an external DDF.

4.6.6 STM-1/OC-3 Optical

Physical level G.957, Table 2
Wavelength 1310 nm, 1550 nm
Bitrate 155.52 Mbps ±4.6 ppm
Transmission range S3, L3, L5

Bitrate 622 Mbps ±4.6 ppm
Transmission range S3, L3, L5, V5

Transmission range I3, S3, L3, L5, C/DWDM (G.694.2 and G.695)
4.7 Management
Applicable specifications G.784, G.774, M.3010, M.3100
LightSoft (network manager) server and client for on SUN workstation(s)
managing all ECI equipment
EMS-XDM (XDM element manager) on SUN workstation
LCT-XDM local craft terminal on PC
EMS-XDM and LightSoft can work on the same SUN workstation.
4.7.1 Management and Alarm Interfaces

CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to LightSoft or other TMN; RS-232 to LCT-XDM;
OverHead Access (OHA); orderwire; RAP.
4.7.2 Alarms and Performance

Performance concept G.821, G.826
Alarm concept G.783
Alarm types LED indicators, dry contacts, audible alarms (per subrack), external
alarm inputs and outputs
Alarm classes Critical, Major, Minor, Warning

4.8 SDH/SONET Interfaces

4.8.1 STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O Modules
SFP TRANSCEIVER NAME OTR1_S3 OTR1_L3 OTR1_L5 OTR1_X5 OTR1_VL5
APPLICATION CODE4 S-1.1 L-1.1 L-1.2
Operating wavelength (nm) 1261-1360 1263-1360 1480-1580 1500-1520 1500-1520

5
Source type MLM SLM SLM SLM SLM
Max. RMS width (nm) 7.7 - - - -
Min. side mode suppression ratio (dB) - 30 30 > 30 > 30
Min. mean launched power (dBm) -15 -5 -5 0 +1
Max. mean launched power (dBm) -8 0 0 +5 +5
Min. extinction ratio (dB) 8.2 10 10 10 10
Min. sensitivity (BER of 1*10-12) EOL dBm) -28 -34 -34 -35 -42
Min. overload (dBm) -8 -10 -10 -8 -5
Max. receiver reflectance (dB) - - -25 - -
Max. dispersion [ps/nm] 96 - - - -
Min. optical return loss of cable (dB) - - -20 -20 -
Max. discrete reflectance (dB) - - -25 -25 -25
Max. optical path penalty (dB) 1 1 1 1 1
NOTE: When selecting bidirectional transceivers, pay attention that they must operate in
complementary pairs. For example: OTR1-S3BD can work only vis-a-vis OTR1-S5BD;
OTR4-L3BD can work only vis-a-vis OTR4-L5BD, and so on. The transceivers in the following
table are arranged in complementary pairs.
4
Application code is in reference to ITU-T Recommendation G.691.
5
MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S-1.1 interfaces in reference to ITU-T
Recommendation G.957.

Table 4-1: STM-1 bidirectional transceivers
SFP transceiver name OTR1-S3BD OTR1-S5BD OTR1-L3BD OTR1-L5BD
Application code6 BD 37 BD 58 L3BD L5BD
Operating wavelength (nm) 1260-1360 1480-1580 1280-1360 1480-1580
TRANSMITTER
Source type MLM MLM MLM SLM
Max. RMS width (nm) 7 3 4 1
Min. side mode suppression ratio (dB) - - - 30
Min. mean launched power (dBm) -14 -14 -5 -5
Max. mean launched power (dBm) -8 -8 0 0
Min. extinction ratio (dB) 10 10 10 10
RECEIVER9
Min. sensitivity (BER of 1 * 10-12) EOL (dBm) -32 -32 -32 -32
Min. overload (dBm) -8 -8 0 0
Max. receiver reflectance (dB) - - - -
OPTICAL PATH BETWEEN S & R
Max. dispersion (ps/nm) - - - -
Min. optical return loss of cable (dB) -20 -20 - -
Max. discrete reflectance (dB) - - - -
Max. optical path penalty (dB) 1 1 1 1
6
7
BD 3: STM-1 single-fiber bidirectional SFP module with a 1310 nm TX wavelength.
8
9
Receiver units of SFPs (excluding bidirectional SFPs) are a wide-band type.

4.8.2 STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O Modules

SFP TRANSCEIVER NAME OTR4_S3 OTR4_L3 OTR4_L5 OTR4_V5
APPLICATION CODE10 S-4.1 L-4.1 L-4.2 V5
Operating wavelength (nm) 1274-1356 1296-1330 1480-1580 1550

1293-1334 1300-1325
TRANSMITTER
Source type MLM11 MLM12 SLM SLM
Max. RMS width (nm) 4/2.5 - - -
Max. -20 dB width (nm) - 1 <1 1
Min. side mode suppression ratio (dB) - 30 30 30
Min. mean launched power (dBm) -15 -3 -3 0
Max. mean launched power (dBm) -8 +2 +2 4
Min. extinction ratio (dB) 8.2 10 10 10
RECEIVER
Min. sensitivity (BER of 1*10-12) EOL (dBm) -28 -28 -28 -34
Min. overload (dBm) -8 -8 -8 -8
Max. receiver reflectance (dB) - -14 -27 -27
Max. dispersion [ps/nm] 46/74 92/109 1600 2400
Min. optical return loss of cable (dB) - 20 24 -
Max. discrete reflectance (dB) - -25 -27 -
10
11
12

SFP transceiver name OTR4_S3BD OTR4_S5BD OTR4_L3BD OTR4_L5BD
Application code13 S3BD S5BD L3BD L5BD
TRANSMITTER
Source type MLM SLM MLM SLM
Min. side mode suppression ratio (dB) - 30 - 30
Max. mean launched power (dBm) -8 -8 +2 +2
Min. extinction ratio (dB) 8.2 8.2 10 10
RECEIVER14
Min. sensitivity (BER of 1 * 10-12) EOL -28 -28 -28 -28

(dBm)
Max. dispersion (ps/nm) - - -
Min. optical return loss of cable (dB) - - - -

SFP TRANSCEIVER NAME OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5 OTR25_AVxx15 OTR25_ABxx16
APPLICATION CODE17 I-16 S-16.1 L-16.1 L-16.2 DW100S1D2/5(C) DW100L\--1D2/5(C)F

DW100S1A2/5(C) DW100C\--1A2/5(C)F
G.698.1/.2
Operating wavelength 1260-1360 1260-1360 1280-1335 1500-1580 1530-1565 1530-1565

(nm)
13
14
15
xx designates the transceiver's wavelength in nm.
16
17

SFP TRANSCEIVER NAME OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5 OTR25_AVxx15 OTR25_ABxx16
APPLICATION CODE17 I-16 S-16.1 L-16.1 L-16.2 DW100S1D2/5(C) DW100L\--1D2/5(C)F

DW100S1A2/5(C) DW100C\--1A2/5(C)F
G.698.1/.2
TRANSMITTER
Source type SLM SLM SLM SLM SLM SLM
Max. -20 dB width (nm) 2 1 1 <1 0.4 0.4
Max. RMS width (nm) - - - - - -
Min. side mode - 30 30 30 30 30

suppression (dB)
Min. mean launched -10 -5 -2 -2 0 0

power (dBm)
Max. mean launched -3 0 +3 +3 4 4

power (dBm)
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2 8.2 8.2
RECEIVER
Min. sensitivity (BER of -16 -18 -27 -28 -28 -28

1*10-12)
EOL (dBm)
Min. overload (dBm) 0 0 -9 -9 -9 -9
Max. receiver reflectance -27 -27 -27 -27 -27 -27

(dB)
Max. dispersion [ps/nm] - - - 1600 2400 3600

(120km G.652 (180 km G.652)
Min. optical return loss of -24 -24 -24 -24 -24 -24
cable (dB)
Max. discrete reflectance -27 -27 -27 -27 -27 -27

(dB)
Max. optical path penalty <1 1 1 2 <3 <2

dB)

18
Application code S3BD S5BD L3BD L5BD
TRANSMITTER
Source type SLM SLM SLM SLM
Min. side mode suppression ratio (dB) 30 30 30 30
Max. mean launched power (dBm) +2 +2 +5 +5
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2

19
RECEIVER

(dBm)
Min. overload (dBm) 0 0 -9 -9
18
19

4.8.4 2.5 Gbps Optical CWDM SFP Transceivers

CWDM DWDM
SFP TRANSCEIVER NAME OTC25_1PSxx20 OTC25_1ALxx21 OTR25_AVxx22 OTR25_ABxx23
APPLICATION CODE24 DW100S\-1D2/5(C) DW100L\--1D2/5(C)F

DW100S\-1A2/5(C) DW100C\--1A2/5(C)F
G.698.1/.2
TRANSMITTER
Max. -20 dB width (nm) 1 1 0.4 0.4
Max. RMS width (nm) - - - -
Min. side mode suppression (dB) 30 30 30 30
Min. mean launched power (dBm) 0 0 0 0
Max. mean launched power (dBm) +5 +5 4 4
RECEIVER
Min. sensitivity (BER of 1*10-12) -21.5 -28 -28 -28

EOL (dBm) (-23 GbE) (-32 GbE)
Min. overload (dBm) 0 -7 -9 -9
Max. receiver reflectance (dB) -27 -27 -27 -27
Max. dispersion [ps/nm] 800 1600 2400 3600

(40 km G.652) (80 km G.652) (120 km G.652) (180 km G.652)
Min. optical return loss of cable (dB) 24 24 -24 -24
Max. discrete reflectance (dB) -27 -27 -27 -27
Max. optical path penalty (dB) 1.5 2.5 <3 <2
20
21
22
23
24

4.9 Data Modules

4.9.1 DIOM Specifications
Module DIOM_04 DIOM_08 DIOM_40
Service interfaces 4 x 10/100/1000BaseT 8 x 10/100BaseT 4 x optical FX/GbE
with SFP
Size 1 slot 1 slot 1 slot
Data handling Layer 1 Layer 1 Layer 1
Network interfaces 4 x EoS 8 x EoS 4 x EoS
Total EoS bandwidth per Up to 16 x VC-4 Up to 8 x VC-4 Up to 16 x VC-4

module in slots 1, 2, 5, 6
Up to 48 x VC-3 Up to 24 x VC-3 Up to 48 x VC-3
(2.5Gbps)

(1.25Gbps)
Total bandwidth per EoS port 1 to 16 x VC-4 1 to 8 x VC-4 1 to 16 x VC-4

in slots 1, 2, 5, 6
1 to 48 x VC-3 1 to 24 x VC-3 1 to 48 x VC-3

in slots 3, 4, 7, 8
Encapsulation mode GFP-F GFP-F GFP-F
Differential delay 256 ms for VC-3/4 256 ms for VC-3/4 256 ms for VC-3/4
compensation
128 ms for VC-12 128 ms for VC-12 128 ms for VC-12
Maximum frame length 10240 bytes 10240 bytes 10240 bytes
Interfaces 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber),

1000BaseSX, 1000BaseLX, 1000BaseZX, 1000BaseT SFP
Protection IOP 1:1 for both EoS ports and optical user ports
Standards compliance IEEE 802.3z, G.707, G.783, G.7041 (GFP),G.7042 (LCAS)
LCAS Enabled or Disabled (VCAT mode), configurable per port
Flow control hitless following IEEE 802.3
Failure forwarding CSF, TSF

4.9.2 MCSM Specifications

Module MCSM
Service interfaces 8 x 10/100BaseT +

8 x optical FX/GbE with SFP
Size 2 slots
Maximum modules per shelf Up to 2 with MXC-100B
Data handling Layer 2 (Ethernet/MPLS)
Network interfaces 16 x EoS/MoT
Total EoS bandwidth per module Up to 32 x VC-4

Up to 96 x VC-3
Up to 252 x VC-12
Total bandwidth per EoS port 1 to 16 x VC-4

1 to 48 x VC-3
1 to 63 x VC-12
NG-SDH standards GFP-F, VCAT, LCAS
Differential delay compensation 256 ms for VC-3/4

128 ms for VC-12
Maximum frame length 9600 bytes
Interfaces 10/100BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX, 1000BaseLX,
1000BaseZX
Total EoS/MoT capacity 5 Gbps
Switch capacity 20 Gbps
MAC address memory 128,000 entries
Protection <50ms FRR link and node, <50ms Dual homed/attached, Ethernet UNI/NNI LAG and EoS
LAG, G.8032 (ERP)
Fast IOP – MCSM 1+1 hot standby card protection
MPLS-based services VPWS (Martini encapsulation), VPLS (Full mesh and star), H-VPLS
P2MP (Multicast drop and continue)
IGMP snooping and static MAC

Module MCSM
Hard QoS: 8000 policed flows per card supporting CIR, CBS and EIR, EBS Classification based on
port, CVLAN, CVLAN-P bits, SVLAN, SVLAN-Pbits (802.1p priority bits), Untagged Frame,
BPDU, and Wildcard (all VLANs that are not explicitly defined).
Untagged frame handling with port-based VLAN (attach/detach CVLAN and/or SVLAN to
untagged frames)
Eight Classes of Service (CoS), Classification rules, CoS mapping, 2 rate policing, 3 colors
marking, Admission Control (CAC)
WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing/Weighted Round
Robin)
MAC and VLANs: 4093 x 4093 VLANs with 16k VLAN mapping rules, SVLAN translation, S-VLAN
configurable Ether-type, FDB (Forwarding Data Base) with 128k MAC address entries
E2E OAM: Tunnel OAM with Connectivity Verification per ITU-T Y.1711, Link OAM (802.3ah)
Service OAM 802.1ag (CFM)
Security: VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, FIB quota, BSC (Broadcast
Storm Control)
Management: Point-and-click fast service creation, Management layers/Planes:

Data, TDM, optic, Supporting CAC for MPLS Tunnel and Service provisioning, Enhanced
protection by SRLG (Shared Risk Link Group) schemes
Services:
Triple Play DTV/IPTV, HDTV, Gaming, VoD, VoIP, and HSI
Business connectivity VPWS, VPLS, and H-VPLS
Mobile aggregation 3G Ethernet-based services, including VoIP, HSDPA, IPTV and video streaming, MP3
streaming, VoD, video and voice conferences
Wholesale/CoC Ethernet bandwidth and leased lines
Standards compliance:
IEEE 802.1ad, 802.3ah (Link OAM), 802.1D/P/Q, 802.1w, 802.3-2005, 802.3ad, 802.3x,
802.1ag
MEF MEF 4, MEF 6, MEF 7, MEF9, MEF 10, MEF 11, MEF 12 MEF14
ITU-T G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, G.8011.1/Y.1307.1,

G.8011.2/Y.1307.2, G.8012/Y.1308, Y.1710, Y.171, G.783, G.8032
IETF RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, RFC 4379, RFC 3812, RFC 3813, RFC
2702, RFC 4090, RFC 3916, RFC 3985, RFC 4125, RFC 412
4.9.3 MCSM50 Specifications

Module MCSM50
Service interfaces 4 x 10 GbE (optical)with SFP+

8 x 1 GbE (optical/electrical)
Size 2 slots

Module MCSM50

Up to 96 x VC-3
Up to 252 x VC-12

1 to 48 x VC-3
1 to 63 x VC-12

128 ms for VC-12
Interfaces 10GBase-SR (850nm MM), 10GBase-LR

(1310nm SM), 10GBase-ER (1550nm SM), 10GBase-ER (1550nm SM),
10GBase-ER (15XXnm DWDM, SM)
Intercard connectivity 20 GbE
Protection 50ms FRR link and node, <50ms Dual homed Ethernet UNI/NNI LAG and EoS LAG, G.8032 (ERP)
Fast IOP – MCS50_X10G 1+1 hot standby card protection
Synchronization SyncE synchronization mechanisms
MPLS-based services VPWS (Martini encapsulation), VPLS (Full mesh and star), Hierarchical VPLS (H-VPLS) with
multiple Split Horizon Groups and VPLS Spokes, P2MP (Multicast drop and continue) IGMP
snooping and static MAC
Hard QoS 8192 policed flows per card supporting CIR, CBS and EIR, EBS Classification based on port,
CVLAN, CVLAN-Pbits, SVLAN, SVLAN-Pbits (802.1p priority bits), DHCP field, Untagged Frame,
BPDU, and Wildcard (all VLANs that are not explicitly defined). Untagged frame handling with
port-based VLAN (attach/detach CVLAN and/or SVLAN to untagged frames) Eight Classes of
Service (CoS), Classification rules, CoS mapping, 2 rate policing, 3 colors marking, Connection
Admission Control (CAC) WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing /
Weighted Round Robin)
MAC and VLANs 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation,
S-VLAN configurable Ether-type, FDB (Forwarding Data Base)
E2E OAM VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, FIB quota, BSC (Broadcast Storm
Control)
Security VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, FIB quota, BSC (Broadcast Storm
Control)

Module MCSM50
Management Point-and-click fast service creation, Management layers/Planes: Data, TDM, optic, Supporting
CAC for MPLS Tunnel and Service provisioning, Enhanced protection by SRLG (Shared Risk Link
Group) schemes
Services:
Business connectivity VPWS, VPLS, H-VPLS
Mobile aggregation 3G Ethernet-based services, including VoIP, HSDPA, IPTV and video streaming, MP3 streaming,
VoD, video and voice conferences
IEEE 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x
ITU-T G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, G.8011.1/Y.1307.1,

G.8011.2/Y.1307.2, G.8012/Y.1308, Y.1710, Y.1711, G.783, G.8032/Y.1344, G.8261, G.8262,
G.8263, G.8264
IETF RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, RFC 4379, RFC 3812, RFC 3813, RFC 2702,
RFC 4090, RFC 3916, RFC 3985, RFC 4125
4.9.4 Client Transceivers for MCSM Cards

Card25 OTGBE_SX OTGBE_LX OTGBE_ZX
Transmitter type GbE short-reach laser, 850 GbE long-reach laser, 1310 GbE very long-reach laser,
nm, multimode nm, single mode 1550 nm, single mode
Data rate (nominal) (Gbps) 1.250 1.250 1.250
Average launch Max. -3 -3 5

power (dBm)
Min. -9.5 -11 0
Min. transmitter extinction ratio (dB) 9 9 9
Data format 8B/10B 8B/10B 8B/10B
Average receiver Min. -20 -22 -22

sensitivity (dBm)
Typical -21 -25.5 --
Max. receiver overload (dBm) 0 0 0
Typical Rx LOS level (dBm) -24 -29 -25
Connector LC LC LC
25
The EISM occupies two slots and may be installed in slot pairs I1-I2, I5-I6.

Card25 OTGBE_SX OTGBE_LX OTGBE_ZX
Fiber lengths 550 m 10 km 80 km

(50/62.5 µm MMF) (9 µm SMF) (9 µm SMF)
26
Card OTFE_FXS OTFE_FXSG OTFE_LXSG OTFE_MM OTFE_SM
Transmitter type FX, short-reach FX, short-reach LX, long-reach FX, short-reach FX, short-reach
laser, 1310 laser, 1310 laser, 1310 single laser, 1310 laser, 1310 nm,
multimode multimode mode multimode single mode
Data rate (nominal) (Gbps) 0.125 0.125 0.125 0.125 0.125
Average Max. -14 -14 -8 -14 -8

launch power
(dBm) Min. -20 -20 -15 -19 -15
Min. transmitter extinction 9 9 9 10 10

ratio (dB)
Data format N/A N/A N/A N/A N/A
Average Min. -30 --

receiver
sensitivity Typical -31.5 -31.5 -31.5 -31 -28
(dBm)
Max. receiver overload -8 -8 -8 -14 -8

(dBm)
Typical Rx LOS level (dBm) - - - < -29 < -28
Connector LC LC LC LC LC
Fiber lengths 2 km 2 km 10 km 550 m 10 km

(50/62.5 mm (50/62.5 mm (9 mm SMF) (50/62.5 µm MMF) (9 µm SMF)
MMF) MMF)
Table 4-4: GbE bidirectional client transceivers
OTGBE_S3BD OTGBE_S5BD OTGBE_L3BD OTGBE_L5BD OTGBE_L5BD80 OTGBE_L6BD80
Transmitter type Bidirectional SFP, Bidirectional SFP, Bidirectional SFP, Bidirectional SFP, Bidirectional SFP, Bidirectional SFP,
1310 nm 1490 nm 1310 nm e 1490 nm 1490 nm 1590 nm
Data rate (nominal) 1250 1250 1250 1250 1250 1250

(MBaud)
Average launch -3 Max. -3 +2 +2 +4 +4

power (dBm)
-10 Min. -10 -5 -5 -2 -2
Min. transmitter >9 >9 >9 >9 9 9

extinction ratio (dB)
26

OTGBE_S3BD OTGBE_S5BD OTGBE_L3BD OTGBE_L5BD OTGBE_L5BD80 OTGBE_L6BD80
Data format 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B
Average receiver < -21 < -21 < -23 < -23 -26 -26
sensitivity (dBm)
Typical Rx LOS level < -22 < -22 < -24 < -24 < -26 < -26
(dBm)
Connector LC LC LC LC LC LC
Fiber lengths 10 km 10 km 40 km 40 km 80 km 80 km
(9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF)
4.9.5 Data SFP+ Transceivers

Table 4-5: SFP+ client transceivers
SFP+ TRANSCEIVER NAME OTP10_ER OTP10_ZR OTP10_SR OTP10_LR OTP10_LRM
APPLICATION CODE27 10GBASE-ER L-64.2a 10GBASE-SR 10GBASE-LR 10GBASE-LRM

P1L1-2D2
TRANSMITTER
Source type SLM SLM SLM SLM SLM
Modulation N/A N/A N/A N/A N/A
Spacing (GHz) NA NA NA NA NA
Max. -20 dB width (nm) NA <1 NA NA NA
Min. side mode suppression (dB) 30 30 NA 30 NA
Min. mean launched power (dBm) -4.7 0 -7.3 -8.2 -6.5
Max. mean launched power (dBm) +4 +4 -1 +0.5 +0.5
Min. extinction ratio (dB) 3 9 3 3.5 3.5
RECEIVER
Max. attenuation (dB) 11.1 22 4 6.2 4
Min. Attenuation (dB) 5 11 0 0 0
Min. sensitivity (BER of 1*10-12) -14.1 (OMA) -24 -11 (OMA) -12.6 (OMA) -6.5 (Stressed)
EOL (dBm) -11.3 (Stressed) -7.5 (Stressed) -10.3 (Stressed)
Min. overload (dBm) -1 -7 -1 0.5 0.5
Max. receiver reflectance (dB) -27 -27 -27 -27 -27
27

Max. dispersion [ps/nm] N/A N/A N/A N/A N/A
Min. optical return loss of cable (dB) 21 21 12 12 20
Max. discrete reflectance (dB) -26 -27 -12 -12 -12
Max. optical path penalty (dB) 3 (Transmitter 3 3.9 (Transmitter and 3.2 (Transmitter and 4.7 (Transmitter and
and dispersion dispersion penalty) dispersion penalty) dispersion penalty)
penalty)
OCH switching time (ms) N/A N/A N/A N/A N/A
Table 4-6: SFP+ bidirectional client transceivers
SFP+ TRANSCEIVER NAME OPT10_S27BD OPT10_S33BD OPT10_L27BD OPT10_L33BD

28
APPLICATION CODE 10GBASE-S27BD 10GBASE-S33BD 10GBASE-L27BD 10GBASE-L33BD
Source type CWDM DFB CWDM DFB CWDM DFB CWDM DFB
Modulation N/A N/A N/A N/A
Operating output wavelength (nm) 1260-1280 1320-1340 1260-1280 1320-1340
Direct max.-20 dB width (nm) N/A N/A N/A N/A
Min. mean launched power (dBm) -5 -5 1 1
Max. mean launched power (dBm) 0 0 5 5
Maximum attenuation (dB) 9 9 19 19
Minimum attenuation (dB) 0 0 10 10
Max. dispersion (ps/nm) N/A N/A N/A N/A
Maximum optical return loss (dB) 12 12 12 12
Maximum discrete reflectance -12 -12 -12 -12
Maximum DGD (ps) N/A N/A N/A N/A
Sensitivity (BER of 1*10 12) (dBm) -14 -14 -18 -18
Min. overload (dBm) 05 0.5 -5 -5
Maximum optical path penalty 3.2 3.2 3.2 3.2
OCH switching time (ms) N/A N/A N/A N/A
28

Table 4-7: SFP+ C/DWDM transceivers
SFP+ TRANSCEIVER NAME OTP10C_PSxx OTP10D_ALxx

29
APPLICATION CODE PS AL
TRANSMITTER
Operating wavelength (nm) 1471, 1491, 1511, 1531, 1551, 1571, 1529.55-1561.61
1591, 1611
Source type CWDM DFB DWDM EML
Modulation - -
Spacing (GHz) 100
Max. -20 dB width (nm) 1 1
Min. side mode suppression (dB) 30 30
Min. mean launched power (dBm) -4.7 -1
Max. mean launched power (dBm) +4 +3
Min. extinction ratio (dB) 3 8.2
RECEIVER
Max. attenuation (dB) 11.1 22
Min. Attenuation (dB) 5 10
Min. sensitivity (BER of 1*10-12) EOL (dBm) -15.8 -23
Min. overload (dBm) -1 -7
Max. receiver reflectance (dB) -26 -27
Max. dispersion [ps/nm] 800 1600
Min. optical return loss of cable (dB) 21 27
Max. discrete reflectance (dB) - -
Max. optical path penalty (dB) 3 3.5
OCH switching time (ms) - -
4.9.6 Electrical GbE SFP (ETGbE)

ETGBE Notes
Data rate 1000 Mbps IEEE 802.3 compatible
29

ETGBE Notes
Connector RJ-45
Cable type CAT 5 STP (Shielded Twisted Pair)
Cable length 100m
4.10 Optical Amplifier Modules for TPU/OCU

The MO_DC0_BAS is an optical booster for the C band. MO_PAS_DCM80 is a single channel preamplifier
(Channel 35 in the C band).
MO_DC0_BAS MO_PAS_DCM80 MO_OFA21
Input power (dBm) -12–+4 -38 – -18
Output power (dBm) 14.5-16 -16 – -14 +16
Spectrum (nm) Channel 35 1530-1563

30
Gain tilt (Ch. 21-36) (dB) <3 N/A N/A
31
Gain tilt (Ch. 21-60) (dB) <7 N/A N/A
Passband width, < 0.5 dB loss (GHz) N/A N/A N/A
Passband width, < 1.0 dB loss (GHz) N/A N/A N/A
Noise figure (dB) <7 <6 < 6.5
Polarization-dependent gain (dB) < 0.5 < 0.5 N/A
Polarization mode dispersion (ps) < 0.1 < 0.3 N/A
Return loss (dB) < 40 < 40 < 45
Power consumption (Watt) <7 <7 14

32
Monitor port tap fraction (%) 4-6 0.5 – 2
Automatic Laser Shutdown (ALS) 100 ms
30
Measured peak-to-peak.
31
32
Over the entire C band.

4.11 GbE/FC/2 Gbps FC/FICON Optical SFP

Transceivers for Transponders/Combiners
OTGBE_SX OTGBE_LX OTGBE_ZX
Transmitter type GbE/FC/2 Gbps GbE/FC/2 Gbps FC/FICON GbE/FC/2 Gbps FC/FICON
FC/FICON short reach long reach laser, 1310 nm, very long reach laser, 1550
laser, 850 nm, single mode nm, single mode
multimode
Bitrate (Gbps) 1.250 1.250 1.250
Mean launch power (dBm) Max. -3 -3 5
Min. -9.5 -11 0
Min. transmitter extinction ratio (dB) 9 9 9
Data format 8 B/10 B 8 B/10 B 8 B/10 B
Average receiver sensitivity Min. -20 -22 -22

(dBm)
Typical -21 -25.5 --
Max. receiver overload (dBm) 0 0 0
Typical Rx LOS level (dBm) -24 -29 -25
Connector LC LC LC
Fiber lengths 550 m (50/62.5 µm 10 km (9 µm SMF) 80 km (9 µm SMF)

MMF)
4.12 STM-1 SFP Optical supervisory channel

transceivers for OSC1_2
Optical Supervisory Channel
OTR1_L3 OTR1_X3
Source type SLM SLM
Operating output wavelength (nm) 1263-1360 1270-1360
Spacing (nm) NA NA
Minimum side mode suppression ratio (dB) 30 30
Mean launched power (min.) (dBm) -5 0
Mean launched power (max.) (dBm) 0 +5
Min. extinction ratio (dB) 10 10

Optical Supervisory Channel
OTR1_L3 OTR1_X3
Sensitivity (BER of 1*10-10) (dBm) -34 -37
Max. dispersion (ps/nm) - -
Max. optical path penalty (dB) 1 1
4.13 CWDM Modules

4.13.1 Mux/Demux Modules
33
Module MO-CMD4C MO_CMD8 MO_CMD4C-E MO_CMD4SL
34
Insertion loss mux + demux (dB) < 4.2 < 5.5 < 4.9 < 7.3
Return loss (dB) < 40 < 40 < 40 < 40
Directivity (dB) < 45 < 45 < 45 < 45
4.13.2 OADM Modules

35 36
Module type Insertion loss
Through Drop Add

37
MO_COADM1AB_xx < 3.9 dB < 2.6 dB < 2.2 dB
38
MO_COADM2AB_xx < 4.4 dB < 3.2 dB < 3.2 dB
33
Module specifications are also applicable to XDM-100H.
34
Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2dB.
35
36
37
xx designates the channel dropped by the OADM.
38
xx designates the group of two channels dropped by the OADM.

4.13.3 Splitter/Coupler Modules

39
Module type Insertion loss
MO_4CP4SPMM50 4 dB
MO_4CP4SPMM62 4 dB
MO_4CP4SPSM 4 dB
4.13.4 CWDM Frequencies and Wavelengths (ITU-T Rec.

G.694.2 for CWDM)
Nominal central wavelengths (nm) for spacing of 20 nm 4-channel system 8-channel system
1471 
1491 
1511  
1531  
1551  
1571  
1591 
1611 
4.14 Physical Specifications

4.14.1 Dimensions (H x W x D)
XDM-100 200 x 443 x 231 mm (7.87 x 17.44 x 9.09 in)
SIM-1/4/16, PIM-2/345 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
SAM-4/16 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
DIOM 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
PIM2_63 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in)
TPM-xx_1/TPM-xx_3 72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in)
TCF/TC 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC-100B 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
39

TPU 75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in)
xRAP (optional) 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 (optional) 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
miniRAP (optional) 90 x 445 x 150 mm (3.54 x 17.53 x 5.9 in)
Racks 2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)

2134 x 584 x 305 mm (82 x 23 x 12 in)
4.14.2 Weight
Basic XDM-100 shelf 7.6 kg (16.76 lbs)
Basic XDM-100 fully populated 20.2 kg (44.53 lbs)
4.14.3 Power
Applicable specifications ETSI 300 132-2; FTZ 19 PFL 1
Input voltage -40 V dc to -75 V dc
Nominal power source -48 V or -60 V
Power consumption Typical 300 W, maximum 420 W
4.14.4 Power Dissipation

Power dissipation Typical 1024.5 Btu/hr, maximum 1434.4 Btu/hr
4.14.5 XDM-100 Product Line Main Equipment Power

Consumption
The following table lists the power requirements of the main equipment components. Determine the
expected power requirement of the equipment installed in the shelf, and compare it with the shelf
capabilities.
Type Component Power requirements
Common cards MXC-100 47 W
MXC-100B 47 W
MXC-BR 0W
MXC50 42 W
MXC-300 88.5 W
MXC-900 210 W
ECU 6.7 W

ECU-F 18.3 W
ECU50 68 W
ECU50_R 10 W
ECU300 6.7 W
ECU300_F 18 W
ECU900 6.7 W
ECU900_F 18 W
INF50 14 W
OHU 5W
TPU 0W
TC 2.5 W
TCF 7W
FCU-100-9F 21.6 W
FCU50 52 W
FCU300 79.2 W
FCU900 79.2 W
PDH modules PIM2_21 11 W
PIM2_42 14.3 W
PIM2_63 16 W
PIM2_63B 16 W
PIM2_63S 16 W
PIM345_3 11 W
CCP50_2 2W
SDH modules SAM1_4E 10 W
SAM1_4O 10 W
SAM1_4OB 10 W
SAM4_2 17 W
SAM16_1 19.7 W
SAM16_1B 30 W
SIM1_4E 12 W
SIM1_4O 12 W
SIM1_4OB 12 W

SIM1_8 12.8 W
SIM4_2 17 W
SIM4_4 30 W
SIM4_8 47 W
SIM16_1 26 W
SIM16_2 37 W
SIM16_4 63.3 W
SIM16_8 110 W
SIM64_XFP 73.6 W
SIM64_1 60 W
SIM64_2 137 W
Protection modules TPM2_1 5W
TPM2_3 5W
TPM2_42_2 5W
TPM2_63_2 5W
TPMH_1 5W
Data modules EISMB_804 32 W
EISMB_840 35 W
DIOM_04 22 W
DIOM_08 24 W
MCSM 75 W
Control module ACP100 12 W
ACP900 12 W
Optical modules MO_CMD4C 1.8 W
MO_CMD8 4.8 W
MO_CMD4C_E 4.8 W
MO_CMD4SL 4.8 W
MO_COADM1AB-Gxx 4.8 W
MO_COADM2AB-xx 4.2 W
MO_4CP4SPSM 4.2 W
MO_4CP4SPMM50 4.2 W
MO_4CP4SPMM62U5 4.8 W

CCMB25_2D 34 W
CRPT25_2C 4.5 W
CTRP25_2C 10 W
OSC1_2 12 W
Optical amplifiers MO_DC0_BAS 7W
MO_PAS_DCM80 4.9 W
Optical transceivers OTR1_YY 1W
OTR4_YY 1W
OTR25_YY 1W
OTC25_PSxx 1.5 W
OTC25_ALxx 1.5 W
Data transceivers OTFE_SM 1W
OTFE_MM 1W
OTGBE_LX 1W
OTGBE_SX 1W
OTGBE_ZX 1W
ETGBE 1W
OTFE_SM 1W
OTFE_MM 1W
OTGBE_LX 1W
OTGBE_SX 1W
OTGBE_ZX 1W
ETGBE 1W
OMS16-4T 8W
MO_DW16MDB-AVAV 4.8 W
MO_DW16MDB-ST 4.8 W
MO_DW16MDR-ST 10 W

4.15 Environmental Conditions

4.15.1 Operation
Applicable specification ETS-300-019-2-3 Class 3.2
Temperature range -5 ºC to +55 ºC
Relative humidity 5% to 90%
NOTE: Extended temperature range of -5 ºC to +65 ºC is supported for specific outdoor

configurations.
4.15.2 Storage (packed)

4.15.3 Handling and Transportation

Relative humidity up to 95%
4.16 EMC
Applicable specifications EN 300 386/2000
Applicable directive EMC directive 89/336 EEC
4.17 Safety
Applicable specifications EN 60950/2000
Applicable CE directive LVD directive 73/23/EEC
4.17.1 Laser Safety

Applicable specification EN 60825-1&2 (AS/NZS 2211.2)

4.17.2 NEBS Compliance

The XDM platforms are designed in accordance with NEBS regulations for EMC and Safety, including
GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 Revision 1, February 1999
(Level 3).
4.18 Reliability
4.18.1 Life
Expected lifetime of the XDM platforms 15 years
4.18.2 Availability
Availability of service for an end-to-end service trail better than 99.999%
passing through a protected SDH/SONET network

5 XDM-900 Specifications
5.1 Cross-Connect Specifications

SDH cross-connect levels VC-4nc, VC-4, VC-3, VC-12
5.1.2 Electrical Interface Connection Modules

Electrical I/O cards are assigned an interface connection module. This module serves as the I/O card
electrical line transceiver and is connected to the I/O cards via the XDM backplane. For example, when
eleven PIO2_84 I/O cards are installed in the XDM-1000 cards cage, eleven M2_84xx connection modules
should be installed in the modules cage. In this case, if hardware protection is required, one PIO2_84 I/O
card can be configured as the protection card, and the corresponding protection connection module
M2_84P I/O is installed in the appropriate slot of the XDM-1000 modules cage.
I/O slot 12 is always configured as a pure optical slot without a modules cage module.
5.1.2.1 Connection Module Data for Electrical I/O Cards
I/O card Bitrate (Mbps) I/O ports Module Interface type Function/Description
SIO1&4 155 16 M1_16BT SDH/SONET electrical Connection module
M1_16DIN SDH/SONET electrical Connection module

40
M1_16P - Connection module with protection
8 M1_8BT SDH/SONET electrical Connection module
M1_8DIN SDH/SONET electrical Connection module
PIO345 34/45/52 16 M345_16BT PDH/Async Connection module
M345_16DI PDH/Async Connection module

41
M345_16P PDH/Async Connection module with protection
8 M345_8BT PDH/Async Connection module
M345_8DI PDH/Async Connection module
M345_8BN PDH/Async Connection module
PIO2_84 2.048 84 M2_84B PDH Balanced (120 Ω) connection module
40
Protection modules are not supported in XDM-400.
41
Protection modules are not supported in XDM-400.

I/O card Bitrate (Mbps) I/O ports Module Interface type Function/Description
SIO1&4 155 16 M1_16BT SDH/SONET electrical Connection module
M2_84BR PDH Low-cost, balanced (120 Ω) connection

module, without protection
M2_84U PDH Unbalanced (75 Ω) connection module
M2_84UR PDH Low-cost, unbalanced (75 Ω) connection

module, without protection
M2_84P42 PDH Connection module with protection
PIO2_21 2.048 21 M2_21B PDH Balanced (120 Ω) connection module
M2_21U PDH Unbalanced (75 Ω) connection module
M2_84P43 PDH Connection module with protection
5.1.2.2 Optical transceivers for I/O cards

Optical I/O cards use a slide-in optical transceiver, which is directly plugged into the card for signal
interfacing.
I/O ports per

I/O card Optical module Connector type Modules per I/O card Ports per I/O card
optical module
SIO1&4 OM01_4 LC 4 4 16 x STM-1/OC-3
OM04_1 SC/LC 1 4 4 x STM-4/OC-12
SIO16 OM16_1 SC/LC 1 2 2 x STM-16/OC-48
SIO6444 OM64_1 LC 1 1 1 x STM-64/OC-192/OTU2
SIO16445 OMSC16_4 LC 4 1 4 x STM-16/OC-48/OTU1
OMTX10_EF LC 1 1 1 x STM-64/OC-192/OTU2
OMTX10 LC 1 1 1 x STM-64/OC-192/OTU2
OMTX10_S LC 1 1 1 x STM-64/OC-192/OTU2
XIO192 OM01_4 LC 4 1 4 x STM-1/OC-3
OM04_1 SC/LC 1 1 1 x STM-4/OC-12
OM16_1 SC/LC 1 1 1 x STM-16/OC-48
XIO384F46 OMSC16_4 LC 4 1 4 x STM-16/OC-48/OTU1
OMTX10_EF LC 1 1 1 x STM-64/OC-192/OTU2
OMTX10 LC 1 1 1 x STM-64/OC-192/OTU2
OMTX10_S LC 1 1 1 x STM-64/OC-192/OTU2
42
Protection module M2_84P can be used to protect PIO2_84. Protection modules are not supported in XDM-400.
43
Protection module M2_84P can be used to protect PIO2_84. Protection modules are not supported in XDM-400.
44
Cards are not supported in XDM-400.
45
46

5.1.2.3 Optical SFP transceivers for I/O cards

New optical I/O cards use a high flexibility concept, consisting of slide-in optical modules. Each module has
slots for up to four SFP transceivers.
I/O card Optical module Connector type I/O ports per Modules per I/O Ports per I/O card
optical module card
SIO1&4 OMS01_447 LC 1 to 4 4 16 x STM-1/OC-3
OMS04_148 LC 1 4 4 x STM-4/OC-12
SIO16 OM16_1SFP49 LC 1 2 2 x STM-16/OC-48/OTU1
SIO164 OMSC16_4 LC 4 1 4 x STM-16/OC-96/OTU2
5.1.3 MXC300 Cross-Connect Capacity

SONET switch core options 384 x OC-3/STS-1
5.1.4 MXC900 Cross-Connect Capacity

SONET switch core options 768 x OC-3/STS-1
5.2 Traffic Protection

SNCP I/N LO, HO within 30 ms
MSP/APS 1+1 within 50 ms
MS-SPRing/BLSR within 50 ms
5.3 Redundancy
Switching matrix, power system, internal buses, 1+1 duplicated

external buses
I/O electrical modules protection 1:1, 1:2, and 1:3
47
SFP SDH/SONET transceivers starting system version V 5.0, DWDM SFPs release V6.2.
48
49

5.4 Synchronization
There are several timing references available from multiple SDH/SONET and/or PDH/Async timing sources:
 From any 2 MHz/2 Mbps tributary interface
 From any 1.5 Mbps tributary interface
 From any SDH/SONET line
 External SDH 2 MHz/2 Mbps timing outputs (two per shelf)
 External SONET 1.5 Mbps timing outputs (two per shelf)
 G.813 internal clock
Synchronization Status Marker (SSM) support is also provided.
5.5 Jitter and Wander

5.6 I/O Interfaces

5.6.1 2 Mbps (E1)
Frame Unframed
Line code HDB3

50
Line impedance 120 Ω balanced/75 Ω unbalanced
Bitrate 2048 Kbps ± 50 ppm
5.6.2 34 Mbps (E3)

Frame G.751
Line code HDB3
50
Through an external DDF.

5.6.3 45 Mbps (DS-3)

Frame Unframed, ANSI T1.107
Line code B3ZS
5.6.4 52 Mbps (STS-1)

Frame G.253
Line code CMI

Bitrate 155.52 Mbps ±20 ppm
Frame G.707
Line code CMI

Transmission range S3, L3, L5

Bitrate 622 Mbps ±4.6 ppm
Transmission range S3, L3, L5, V5


Transmission range I3, S3, L3, L5, CDWM (G.694.2 and G.695)

Physical level G.691, G.957, Table 5
Short-haul, long-haul, very long-haul, 9953.28 Mbps ±4.6 ppm

C/DWDM (G.694.1) bitrate
5.7 Management
LightSoft (network manager) server and client for on SUN workstation(s)

managing all ECI equipment
EMS-XDM (XDM element manager) on SUN workstation

OverHead Access (OHA); orderwire; RAP.

Alarm concept G.783
Alarm types LED indicators, dry contacts, audible alarms (per subrack), external alarm inputs and outputs


SFP TRANSCEIVER NAME OTR1_S3 OTR1_L3 OTR1_L5
Operating wavelength (nm) 1261-1360 1263-1360 1480-1580
Source type MLM52 SLM SLM
Max. RMS width (nm) 7.7 - -
Min. side mode suppression ratio (dB) - 30 30
Min. mean launched power (dBm) -15 -5 -5
Max. mean launched power (dBm) -8 0 0
Min. extinction ratio (dB) 8.2 10 10
Min. sensitivity (BER of 1*10-12) EOL dBm) -28 -34 -34
Min. overload (dBm) -8 -10 -10
Max. receiver reflectance (dB) - - -25
Max. dispersion [ps/nm] 96 - -
Min. optical return loss of cable (dB) - - -20
Max. discrete reflectance (dB) - - -25
Max. optical path penalty (dB) 1 1 1

53 54 55
Application code BD 3 BD 5 L3BD L5BD
51
52
53
54
55


53 54 55
TRANSMITTER

56
RECEIVER

SFP TRANSCEIVER NAME OTR4_S3 OTR4_L3 OTR4_L5 OTR_V5
57
APPLICATION CODE S-4.1 L-4.1 L-4.2 V5
Operating wavelength (nm) 1274-1356 1296-1330 1480-1580 1550

1293-1334 1300-1325
TRANSMITTER
58 59
Source type MLM MLM SLM SLM
56
57
58
59

SFP TRANSCEIVER NAME OTR4_S3 OTR4_L3 OTR4_L5 OTR_V5

57
APPLICATION CODE S-4.1 L-4.1 L-4.2 V5
Max. RMS width (nm) 4/2.5 - - -
Max. -20 dB width (nm) - 1 <1 1
Min. side mode suppression ratio (dB) - 30 30 30
Min. mean launched power (dBm) -15 -3 -3 0
Max. mean launched power (dBm) -8 +2 +2 4
RECEIVER
Max. receiver reflectance (dB) - -14 -27 -27
Max. dispersion [ps/nm] 46/74 92/109 1600 2400
Min. optical return loss of cable (dB) - 20 24 -
Max. discrete reflectance (dB) - -25 -27 -

60
TRANSMITTER
60


60

61
RECEIVER

(dBm)

SFP TRANSCEIVER NAME OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
62
APPLICATION CODE I-16 S-16.1 L-16.1 L-16.2
TRANSMITTER
Max. -20 dB width (nm) 2 1 1 <1
Min. side mode suppression (dB) - 30 30 30
Max. mean launched power (dBm) -3 0 +3 +3
RECEIVER
61
62

SFP TRANSCEIVER NAME OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5

62
Min. sensitivity (BER of 1*10-12) -16 -18 -27 -28

EOL (dBm)
Max. dispersion [ps/nm] - - - 1600
Min. optical return loss of cable -24 -24 -24 -24

(dB)
Max. optical path penalty dB) <1 1 1 2
63
TRANSMITTER
63

63
RECEIVER64

(dBm)
5.8.4 2.5 Gbps Optical C/DWDM SFP Transceivers

CWDM DWDM
65 66 67 68
SFP TRANSCEIVER NAME OTC25_1PSxx OTC25_1ALxx OTR25_AVxx OTR25_ABxx
69
APPLICATION CODE DW100S\-1D2/5(C) DW100L\--1D2/5(C)F
DW100S\-1A2/5(C) DW100C\--1A2/5(C)F
G.698.1/.2
TRANSMITTER
Max. -20 dB width (nm) 1 1 0.4 0.4
Min. side mode suppression (dB) 30 30 30 30
Min. mean launched power (dBm) 0 0 0 0
Max. mean launched power (dBm) +5 +5 4 4
64
65
66
67
68
69

CWDM DWDM
65 66 67 68
SFP TRANSCEIVER NAME OTC25_1PSxx OTC25_1ALxx OTR25_AVxx OTR25_ABxx
RECEIVER
Min. sensitivity (BER of 1*10-12) -21.5 -28 -28 -28

EOL (dBm) (-23 GbE) (-32 GbE)
Min. overload (dBm) 0 -7 -9 -9
Max. dispersion [ps/nm] 800 1600 2400 3600

(40 km G.652) (80 km G.652) (120 km G.652) (180 km G.652)
Min. optical return loss of cable (dB) 24 24 -24 -24
Max. optical path penalty (dB) 1.5 2.5 <3 <2
5.8.5 10 Gbps Optical XFP Transceivers

Transceiver OTR64_I3 OTR64_S5 OTR64_L5 OTR10_ALxx OTR10_ASxx OTR10T_AL
I-64.1
S-64.2b L-64.2a
Application code P1I1_2D1 1L1-2D2F
P1S1_2D2b P1L1-2D2
VSR2000_2R1
Source type SLM SLM SLM SLM SLM SLM
Modulation External External External
Operating output 1528.38-1564.6

1290-1330 1529-1560 1530-1565 1529-1560 1529-1560
wavelength (nm) 8
192.1 + 0.1m 192.1 + 0.1m 191.7+0.05m

Central frequency (THz) -- -- --
m=0 to 40 m=0 to 40 m=0 to 88
Maximum central
-- -- -- ±12.5 ±12.5 ±2.5
frequency deviation (GHz)
Spacing (GHz) -- -- -- 50
Direct max. -20 dB width

<1 <1 <1 <1 <1 < 0.5
(nm)
Min. side mode suppression

30 30 30 30 30 35
ratio (dB)
Min. mean launched power -6 -1 0

-1 -1
(dBm)

Transceiver OTR64_I3 OTR64_S5 OTR64_L5 OTR10_ALxx OTR10_ASxx OTR10T_AL
I-64.1
S-64.2b L-64.2a
Application code P1I1_2D1 1L1-2D2F
P1S1_2D2b P1L1-2D2
VSR2000_2R1
Max. mean launched power -1 +2 +4

+3 +3
(dBm)
Min. extinction ratio (dB) 6 8.2 9 9 9 9
Maximum attenuation (dB) 4 11 22 NA --
Minimum attenuation (dB) 0 3 11 NA --
Max. dispersion (ps/nm) 6.6 800 1600 1600 1440
Minimum optical return

24 24 24 -- --
loss (dB)
Maximum discrete
-27 -27 -27 -27 -27
reflectance
Maximum DGD (ps) 30 30 30 --
Sensitivity (BER of 1*10-12)

-11 -14 -24 -24 -24
(dBm)
Min. overload (dBm) -1 -1 -7 -8 -7
Maximum optical path

1 2 2 2 2.5
penalty
OCH switching time (ms) <3 <3 <3 NA NA
5.9 SIM Cards FEC Support

Part of XDM SIM cards support EFEC. The following table lists the name of the card and the type of FEC they
support. The standards for FEC are defined by the ITU-T, and SIM cards support one type of EFEC per ITU-T
G.975.1. This recommendation designates two types of EFEC: I4 and I8. Cards that support EFEC type I8, are
not interoperable with those supporting EFEC type I4.
Table 5-4: SIM cards FEC support
Card type EFEC per ITU-T G.975.1 support and Comments

type (I4/I8)
SIM64_XFP ---
SIM64_1D  I8
SIM64_2  I8

5.10 Data Modules

5.10.1 DIOM Specifications
Module DIOM_04 DIOM_08 DIOM_40
Service interfaces 4 x 10/100/1000BaseT 8 x 10/100BaseT 4 x optical FX/GbE with SFP
Size 1 slot 1 slot 1 slot
Data handling Layer 1 Layer 1 Layer 1
Network interfaces 4 x EoS 8 x EoS 4 x EoS

(2.5Gbps)

(1.25Gbps)

in slots 1, 2, 5, 6

in slots 3, 4, 7, 8
Encapsulation mode GFP-F GFP-F GFP-F
Differential delay 256 ms for VC-3/4 256 ms for VC-3/4 256 ms for VC-3/4
compensation
128 ms for VC-12 128 ms for VC-12 128 ms for VC-12
Maximum frame length 10240 bytes 10240 bytes 10240 bytes
Interfaces 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber),

1000BaseSX, 1000BaseLX, 1000BaseZX, 1000BaseT SFP
Standards compliance IEEE 802.3z, G.707, G.783, G.7041 (GFP),G.7042 (LCAS)

5.10.2 MCSM Specifications

Module MCSM
Service interfaces 8 x 10/100BaseT +

8 x optical FX/GbE with SFP
Size 2 slots

Up to 96 x VC-3
Up to 252 x VC-12

1 to 48 x VC-3
1 to 63 x VC-12

128 ms for VC-12
Interfaces 10/100BaseT, 100BaseFX (single mode and multimode fiber),

1000BaseSX, 1000BaseLX, 1000BaseZX
Protection <50ms FRR link and node, <50ms Dual homed/attached, Ethernet UNI/NNI LAG and
EoS LAG, G.8032 (ERP)
Fast IOP – MCSM 1+1 hot standby card protection
MPLS-based services VPWS (Martini encapsulation), VPLS (Full mesh and star), H-VPLS
P2MP (Multicast drop and continue)
IGMP snooping and static MAC:
Hard QoS: 8000 policed flows per card supporting CIR, CBS and EIR, EBS
Classification based on port, CVLAN, CVLAN-Pbits, SVLAN, SVLAN-Pbits (802.1p priority
bits), Untagged Frame, BPDU,and Wildcard (all VLANs that are not explicitly defined).
Untagged frame handling with port-based VLAN (attach/detach CVLAN and/or SVLAN
to untagged frames)
Eight Classes of Service (CoS), Classification rules, CoS mapping, 2 rate policing, 3
colors marking, Admission Control (CAC)
WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing / Weighted Round
Robin)

Module MCSM
MAC and VLANs: 4093 x 4093 VLANs with 16k VLAN mapping rules, SVLAN translation, S-VLAN
configurable Ether-type, FDB (Forwarding Data Base) with 128k MAC address entries
E2E OAM: Tunnel OAM with Connectivity Verification per ITU-T Y.1711, Link OAM (802.3ah)
Service OAM 802.1ag (CFM)
Security: VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, FIB quota, BSC
(Broadcast Storm Control)
Management: Point-and-click fast service creation, Management layers/Planes:

Data, TDM, optic, Supporting CAC for MPLS Tunnel and Service provisioning, Enhanced
protection by SRLG (Shared Risk Link Group) schemes
Services:
Mobile aggregation 3G Ethernet-based services, including VoIP, HSDPA, IPTV and video streaming, MP3
streaming, VoD, video and voice conferences
IEEE 802.1ad, 802.3ah (Link OAM), 802.1D/P/Q, 802.1w, 802.3-2005, 802.3ad, 802.3x,
802.1ag
ITU-T G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, G.8011.1/Y.1307.1,

G.8011.2/Y.1307.2, G.8012/Y.1308, Y.1710, Y.171, G.783, G.8032
IETF RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, RFC 4379, RFC 3812, RFC 3813,
RFC 2702, RFC 4090, RFC 3916, RFC 3985, RFC 4125, RFC 412
5.10.3 Client Transceivers for MCSM Cards

OTGBE_SX OTGBE_LX OTGBE_ZX OTFE_MM OTFE_SM
Transmitter type GbE short-reach GbE long-reach GbE very FX, short-reach FX, short-reach
laser, 850 nm, laser, 1310 nm, long-reach laser, laser, 1310 laser, 1310 nm,
multimode single mode 1550 nm, single multimode single mode
mode
Average Max. -3 -3 5 -14 -8

launch power
(dBm) Min. -9.5 -11 0 -19 -15

ratio (dB)
Data format 8B/10B 8B/10B 8B/10B N/A N/A

OTGBE_SX OTGBE_LX OTGBE_ZX OTFE_MM OTFE_SM
Average Min. -20 -22 -22 -30 --

receiver
sensitivity Typical -21 -25.5 -- -31 -28
(dBm)
Max. receiver overload 0 0 0 -14 -8

(dBm)
Typical Rx LOS level (dBm) -24 -29 -25 < -29 < -28
Fiber lengths 550 m 10 km 80 km 550 m 10 km

(50/62.5 µm (9 µm SMF) (9 µm SMF) (50/62.5 µm (9 µm SMF)
MMF) MMF)
Table 5-5: GbE bidirectional transceivers
OTGBE_S3BD OTGBE_S5BD OTGBE_L3BD OTGBE_L5BD
Transmitter type Bidirectional SFP, Bidirectional SFP, Bidirectional SFP, 1310 nm e Bidirectional SFP,
1310 nm 1490 nm 1490 nm
Data rate (nominal) 1250 1250 1250 1250

(MBaud)
Average launch -3 Max. -3 +2 +2

power (dBm)
-10 Min. -10 -5 -5
Min. transmitter >9 >9 >9 >9

extinction ratio (dB)
Data format 8B/10B 8B/10B 8B/10B 8B/10B
Average receiver < -21 < -21 < -23 < -23
sensitivity (dBm)
Typical Rx LOS level < -22 < -22 < -24 < -24
(dBm)
Connector LC LC LC LC
Fiber lengths 10 km 10 km 40 km 40 km
(9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF)

5.10.4 Data SFP+ Transceivers

Table 5-6: SFP+ client transceivers
70
APPLICATION CODE 10GBASE-ER L-64.2a 10GBASE-SR 10GBASE-LR 10GBASE-LRM
P1L1-2D2
TRANSMITTER
Modulation N/A N/A N/A N/A N/A
Spacing (GHz) NA NA NA NA NA
Max. -20 dB width (nm) NA <1 NA NA NA
Min. side mode suppression (dB) 30 30 NA 30 NA
Min. mean launched power (dBm) -4.7 0 -7.3 -8.2 -6.5
Max. mean launched power (dBm) +4 +4 -1 +0.5 +0.5
Min. extinction ratio (dB) 3 9 3 3.5 3.5
RECEIVER
Max. attenuation (dB) 11.1 22 4 6.2 4
Min. Attenuation (dB) 5 11 0 0 0
Min. sensitivity (BER of 1*10-12) -14.1 (OMA) -24 -11 (OMA) -12.6 (OMA) -6.5 (Stressed)
EOL (dBm) -11.3 (Stressed) -7.5 (Stressed) -10.3 (Stressed)
Min. overload (dBm) -1 -7 -1 0.5 0.5
Max. dispersion [ps/nm] N/A N/A N/A N/A N/A
Max. optical path penalty (dB) 3 (Transmitter 3 3.9 (Transmitter 3.2 (Transmitter 4.7 (Transmitter
and dispersion and dispersion and dispersion and dispersion
penalty) penalty) penalty) penalty)
OCH switching time (ms) N/A N/A N/A N/A N/A
70

Table 5-7: SFP+ bidirectional client transceivers
SFP+ TRANSCEIVER NAME OPT10_S27BD OPT10_S33BD OPT10_L27BD OPT10_L33BD

71
APPLICATION CODE 10GBASE-S27BD 10GBASE-S33BD 10GBASE-L27BD 10GBASE-L33BD
Source type CWDM DFB CWDM DFB CWDM DFB CWDM DFB
Modulation N/A N/A N/A N/A
Direct max.-20 dB width (nm) N/A N/A N/A N/A
Min. mean launched power (dBm) -5 -5 1 1
Max. mean launched power (dBm) 0 0 5 5
Max. dispersion (ps/nm) N/A N/A N/A N/A
Maximum optical return loss (dB) 12 12 12 12
Maximum DGD (ps) N/A N/A N/A N/A
Sensitivity (BER of 1*10 12) (dBm) -14 -14 -18 -18
Min. overload (dBm) 05 0.5 -5 -5
Maximum optical path penalty 3.2 3.2 3.2 3.2
OCH switching time (ms) N/A N/A N/A N/A
Table 5-8: SFP+ C/DWDM transceivers
APPLICATION CODE72 PS AL
TRANSMITTER
Operating wavelength (nm) 1471, 1491, 1511, 1531, 1551, 1571, 1529.55-1561.61
1591, 1611
Source type CWDM DFB DWDM EML
71
72

Modulation - -
Spacing (GHz) 100
Min. mean launched power (dBm) -4.7 -1
RECEIVER
Max. attenuation (dB) 11.1 22
Min. Attenuation (dB) 5 10
Min. sensitivity (BER of 1*10-12) EOL (dBm) -15.8 -23
Max. receiver reflectance (dB) -26 -27
Max. dispersion [ps/nm] 800 1600
Min. optical return loss of cable (dB) 21 27
Max. discrete reflectance (dB) - -
Max. optical path penalty (dB) 3 3.5
OCH switching time (ms) - -
5.10.5 Electrical GbE SFP (ETGbE)

ETGBE Notes
Data rate 1000 Mbps IEEE 802.3 compatible
Connector RJ-45
Cable type CAT 5
Cable length 100m

5.11 Optical Amplifier Modules for TPU/OCU

The MO_DC0_BAS is an optical booster for the C band. MO_PAS_DCM80 is a single channel preamplifier
(Channel 35 in the C band).
MO_DC0_BAS (Booster) MO_PAS_DCM80
Input power (dBm) -12 – +4 -38 – -18

73
Output power (dBm) 14.5-16 -16 – -14
Spectrum (nm) Channel 35

74
Gain tilt (Ch. 21-36) (dB) <3 N/A
75
Gain tilt (Ch. 21-60) (dB) <7 N/A
Passband width, < 0.5 dB loss (GHz) N/A N/A
Passband width, < 1.0 dB loss (GHz) N/A N/A
Noise figure (dB) <7 <6
Polarization-dependent gain (dB) < 0.5 < 0.5
Polarization mode dispersion (ps) < 0.1 < 0.3
Return loss (dB) < 40 < 40
Power consumption (Watt) <7 <7

76
Monitor port tap fraction (%) 4-6 0.5 - 2
Automatic Laser Shutdown (ALS) 100 ms --
5.12 CWDM Modules

5.12.1 Mux/Demux Modules for XDM-300/900
See Section Mux/Demux Modules for detailed specifications.
5.12.2 OADM Modules for XDM-300/900

See Section OADM Modules for detailed specifications.
5.12.3 Splitter/Coupler Modules for XDM-300/900

See Section Splitter/Coupler Modules for detailed specifications.
73
For 10 G links, add a 3 dB attenuator to the output ports.
74
75
76
Over the entire C band.

5.12.4 CWDM Frequencies and Wavelengths (ITU-T Rec.

G.694.2 for CWDM)
1471 
1491 
1511  
1531  
1551  
1571  
1591 
1611 

XDM-900 350 x 443 x 246 mm (13.8 x 17.44 x 9.68 in)
SIM-1/4/8/16, PIM-2/345 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
DIOM 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
PIM2_63/B, MCSM 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in)
SIM16_4/SIM64_XFP/SIM64_2 34 x 381 x 203 mm (1.34 x 15 x 8)
TPM-xx_1/TPM-xx_3 72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in)
TCF/TC 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC-300 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
MXC900 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
ECU300 27 x 381 x 203 (1.06 x 15 x 8)
ECU900 27 x 381 x 203 (1.06 x 15 x 8)
TPU/OCU 75 x 443 x 246 mm (2.95 x 17.44 x 9.68 in)
xRAP-D (optional) 133 x 445 x 285 mm (5.24 x 17.53 x 7.29 in)
Racks 2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)

2134 x 584 x 305 mm (82 x 23 x 12 in)

5.13.2 Weight
Basic XDM-900 shelf 8.2 kg (18.06 lbs)
Basic XDM-900 fully populated 30 kg (66.08 lbs)
5.13.3 Power
Applicable specifications ETSI 300 132-2; FTZ 19 PFL 1
Input voltage -40 V dc to -75 V dc
Nominal power source -48 V or -60 V
XDM-900 power consumption Typical 1000 W, maximum 1400 W
5.13.4 Power Dissipation

XDM-900 power dissipation Typical 3414 Btu/hr, maximum 4780 Btu/hr
5.13.5 XDM-100 Product Line Main Equipment Power

Consumption
capabilities.
Common cards MXC-100 47 W
MXC-100B 47 W
MXC-BR 0W
MXC50 42 W
MXC-300 88.5 W
MXC-900 210 W
ECU 6.7 W
ECU-F 18.3 W
ECU50 68 W
ECU50_R 10 W
ECU300 6.7 W
ECU300_F 18 W

ECU900 6.7 W
ECU900_F 18 W
INF50 14 W
OHU 5W
TPU 0W
TC 2.5 W
TCF 7W
FCU-100-9F 21.6 W
FCU50 52 W
FCU300 79.2 W
FCU900 79.2 W
PDH modules PIM2_21 11 W
PIM2_42 14.3 W
PIM2_63 16 W
PIM2_63B 16 W
PIM2_63S 16 W
PIM345_3 11 W
CCP50_2 2W
SDH modules SAM1_4E 10 W
SAM1_4O 10 W
SAM1_4OB 10 W
SAM4_2 17 W
SAM16_1 19.7 W
SAM16_1B 30 W
SIM1_4E 12 W
SIM1_4O 12 W
SIM1_4OB 12 W
SIM1_8 12.8 W
SIM4_2 17 W
SIM4_4 30 W
SIM4_8 47 W

SIM16_1 26 W
SIM16_2 37 W
SIM16_4 63.3 W
SIM16_8 110 W
SIM64_XFP 73.6 W
SIM64_1 60 W
SIM64_2 137 W
Protection modules TPM2_1 5W
TPM2_3 5W
TPM2_42_2 5W
TPM2_63_2 5W
TPMH_1 5W
Data modules EISMB_804 32 W
EISMB_840 35 W
DIOM_04 22 W
DIOM_08 24 W
MCSM 75 W
Control module ACP100 12 W
ACP900 12 W
Optical modules MO_CMD4C 1.8 W
MO_CMD8 4.8 W
MO_CMD4C_E 4.8 W
MO_CMD4SL 4.8 W
MO_COADM1AB-Gxx 4.8 W
MO_COADM2AB-xx 4.2 W
MO_4CP4SPSM 4.2 W
MO_4CP4SPMM50 4.2 W
MO_4CP4SPMM62U5 4.8 W
CCMB25_2D 34 W
CRPT25_2C 4.5 W
CTRP25_2C 10 W

OSC1_2 12 W
Optical amplifiers MO_DC0_BAS 7W
MO_PAS_DCM80 4.9 W
Optical transceivers OTR1_YY 1W
OTR4_YY 1W
OTR25_YY 1W
OTC25_PSxx 1.5 W
OTC25_ALxx 1.5 W
Data transceivers OTFE_SM 1W
OTFE_MM 1W
OTGBE_LX 1W
OTGBE_SX 1W
OTGBE_ZX 1W
ETGBE 1W
OTFE_SM 1W
OTFE_MM 1W
OTGBE_LX 1W
OTGBE_SX 1W
OTGBE_ZX 1W
ETGBE 1W
OMS16-4T 8W
MO_DW16MDB-AVAV 4.8 W
MO_DW16MDB-ST 4.8 W
MO_DW16MDR-ST 10 W


5.14.1 Operation
5.14.2 Storage (packed)


5.15 EMC
Applicable specifications EN 300 386/2000
Applicable directive EMC directive 89/336 EEC
5.16 Safety
Applicable specifications EN 60950/2000
Applicable CE directive LVD directive 73/23/EEC
5.16.1 Laser Safety

Applicable specification EN 60825-1&2 (AS/NZS 2211.2)


The XDM platforms are designed in accordance with NEBS regulations for EMC and Safety, including
GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 Revision 1, February 1999
(Level 3).
5.17 Reliability
5.17.1 Life
5.17.2 Availability
Availability of service for an end-to-end better than 99.999%
service trail passing through a protected
SDH/SONET network

6 XDM-40/450/500/1000/2000/3000
Specifications
6.1 Electrical, Optical, and Mixed Basecard

Information
Card Ports/Bitrate
Electrical
PIO2_84 84 x E1 (2 Mbps) PDH/Async basecard for balanced and unbalanced interfaces

77
PIO345/PIO345M 16 x E3/DS-3/STS-1 (34/45/51 Mbps) interfaces
Optical
SIO16M 2 x STM-16/OC-48 (2.488 Gbps) interfaces
SIO64M/MF 1 x STM-64/OC-192 (10 Gbps) interface
XIO348F 1 x STM-64/OC-192 (10 Gbps) interface or

4 x STM-16/OC-48 (2.488 Gbps) interfaces
Mixed
SIO1&4B Supports various electrical (e) and/or optical (o) interfaces as follows:
 16 x STM-1o/OC-3/OC-3c
 16 x STM-1e/STS-3e
 4 x STM-4/OC-12
NOTE: For full interface support per card and shelf, please contact ECI's Product Management
or your local ECI representative.
6.2 XDM Shelf Capacities

XDM shelf slot capacities differ as a function of the type of matrix cards (HLXC or XIO) used. Although the
XIO and the HLXC have identical cross-connect capabilities, the bandwidth allocation capacity per I/O slot
for the XIO is different than that of the HLXC. The HLXC has uniform capacity distribution per slot,
regardless of the XDM shelf in which it is installed. In contrast, XIO capacity varies, depending on the XDM
shelf type in use.
77
The suffix M denotes SONET support; it also denotes MS-SPRing/BLSR support for SDH/SONET. The MF suffix denotes FEC 7% support according
to ITU-T Recommendation G.709.

XDM® System Specifications XDM-40/450/500/1000/2000/3000 Specifications
6.2.1 XDM Shelf Capacities with HLXC or CPTS

The following table describes the HLXC orv CPTS bandwidth allocation capacity (in VC-4s) per slot for each
XDM shelf type.
XDM-1000/2000 slot # XDM-1000/2000 slot capacity (CPTS240) XDM-1000/2000 slot capacity (HLXC768)
I/O1 128 64
(20 Gbps) (10 Gbps)
I/O2 128 64
(20 Gbps) (10 Gbps)
I/O3 128 64
(20 Gbps) (10 Gbps)
I/O4 128 64
(20 Gbps) (10 Gbps)
I/O20 128 64
(20 Gbps) (10 Gbps)
I/O6 128 64
(20 Gbps) (10 Gbps)
I/O7 128 64
(20 Gbps) (10 Gbps)
I/O8 128 64
(20 Gbps) (10 Gbps)
I/O9 128 64
(20 Gbps) (10 Gbps)
I/O10 128 64
(20 Gbps) (10 Gbps)
I/O11 128 64
(20 Gbps) (10 Gbps)
I/012 128 64
(20 Gbps) (10 Gbps)
Total capacity 1536 768

6.2.2 XDM Shelf Capacities with XIO

The following table describes the XIO bandwidth allocation capacity (in VC-4s) per slot for each XDM shelf
type.
XDM-500 slot # XDM-1000/2000 78 slot capacity (XIO384F) XDM-1000/2000 slot XDM-1000/2000 slot capacity
80
slot # capacity (XIO384F (XIO384F ConfigB)
79
ConfigA)
IC2 I/O1 32 (5 Gbps) 32 (5 Gbps) 0
IC3 I/O2 64 (10 Gbps) 32 (5 Gbps) 0
IC4 I/O3 64 (10 Gbps) 32 (5 Gbps) 64 (10 Gbps)
IC5 I/O4 32 (5 Gbps) 32 (5 Gbps) 64 (10 Gbps)
IC1 I/O5 32 (5 Gbps) 16 16

(2.5 Gbps) (2.5 Gbps)
IC6 I/O6 32 (5 Gbps) 16 16

(2.5 Gbps) (2.5 Gbps)
I/O7 16 16
(2.5 Gbps) (2.5 Gbps)
I/O8 16 16
(2.5 Gbps) (2.5 Gbps)
I/O9 16 16
(2.5 Gbps) (2.5 Gbps)
I/O10 16 16
(2.5 Gbps) (2.5 Gbps)
I/O11 16 16
(2.5 Gbps) (2.5 Gbps)
I/012 16 16
(2.5 Gbps) (2.5 Gbps)
XIO-L XIO-L 64 64 64
(10 Gbps)
XIO-R XIO-R 64 64 64
(10 Gbps)
78
The bandwidth capacities in the XDM-500 are suitable for cost-effective ADM-64s. Using the XIO384F with an STM-64 interface frees six slots in
the XDM-500 for PIO and SIO cards.
79
The bandwidth capacities in this configuration of the XDM-1000/2000 are suitable for a multi-ADM-16 with eight drop slots available for
SDH/SONET, PDH, and Ethernet services.
80
The bandwidth capacities in this configuration of the XDM-1000/2000 are a good solution for a double ADM64 with eight drop slots available for
SDH/SONET, PDH, and Ethernet services. Two slots are available for optical transponders and/or combiners for hybrid applications.

XDM-500 slot # XDM-1000/2000 78 slot capacity (XIO384F) XDM-1000/2000 slot XDM-1000/2000 slot capacity
80
slot # capacity (XIO384F (XIO384F ConfigB)
79
ConfigA)
OHA OHA -- -- --
Total capacity 384 384 384
The bandwidth capacities in the XDM-500 are suitable for cost-effective ADM-64s. Using the XIO384F with
an STM-64 interface frees six slots in the XDM-500 for PIO and SIO cards.
The bandwidth capacities in the XDM-1000 are suitable for cost-effective ADM-64s as well as an ADM-16
with many PIO interfaces. This is an excellent option for systems with a large number of E1 interfaces.
The bandwidth capacities in this configuration of the XDM-1000/2000 are suitable for a multi-ADM-16 with
eight drop slots available for SDH/SONET, PDH, and Ethernet services.
The bandwidth capacities in this configuration of the XDM-1000/2000 are a good solution for a double
ADM-64 with eight drop slots available for SDH/SONET, PDH, and Ethernet services. Two slots are available
for optical transponders and/or combiners for hybrid applications.
6.3 PDH/Async and SDH/SONET Interface

Specifications
The following sections provide a description of PDH and SDH interface specifications.
6.3.1 2 Mbps (E1)

Frame Unframed, G.704, I.431 (ISDN)
Line code HDB3
Line impedance 120 ohm balanced/75 ohm unbalanced
6.3.2 34 Mbps (E3)

Frame G.751
Line code HDB3
Line impedance 75 ohm unbalanced

6.3.3 45 Mbps (DS-3)

Frame G.751
Line code B3ZS
6.3.4 52 Mpbs (STS-1)

Frame G.253
Line code CMI

Frame G.707
Line code CMI

Short-haul, long-haul bitrate 155.52 Mbps ±4.6 ppm

Short-haul, long-haul, very long-haul, ultra long-haul 622 Mbps ±4.6 ppm
bitrate


Short-haul, long-haul, very long-haul, ultra long-haul, 2488.32 Mbps ±4.6 ppm
DWDM (G.694.1 and G.957) bitrate

Physical level G.691, G.957, Table 5
Short-haul, long-haul, very long-haul, DWDM 9953.28 Mbps ±4.6 ppm

(G.694.1) bitrate

This section describes the specifications for the SDH interfaces.

Card Name OM01_4I381 OM01_4S3 OM01_4L5
82
APPLICATION CODE S-1.1 L-1.2
TRANSMITTER
Source type MLM SLM SLM
Max. RMS width (nm) - 7.7 -
Max. -20 dB width (nm) - - 1
Min. side mode suppression ratio (dB) - - > 30
Max. mean launched power (dBm) -14 -8 0
Min. extinction ratio (dB) 10 8.2 10
RECEIVER
Min. sensitivity (BER of 1*10-12) EOL (dBm) -30 -28 -34
81
MLM transceiver for 2 km with multimode fibers.
82

Min. overload (dBm) - -8 -10
Max. dispersion (ps/nm) - 96 -
6.4.2 MECP_OSC cards

MECP_OC5OW MECP_OC5UOW83
Card Name MECP_OSC5
[MECP_OC5XOW]
Signal Rate 155 Mbps 155 Mbps 2 Mbps
TRANSMITTER
Source type SLM SLM SLM
Max. RMS width (nm) - - -
Max. -20 dB width (nm) 1 1 1
Min. side mode suppression ratio (dB) > 30 > 30 > 30
Min. mean launched power (dBm) 0 0 +1
Max. mean launched power (dBm) +2 +5 +5
Min. extinction ratio (dB) 10 10 10
RECEIVER
Min. sensitivity (BER of 1*10-10) EOL (dBm) -34 -35 [-40] -54
Max. receiver reflectance (dB) -25 - -
OPTICAL PATH BETWEEN S AND R
Min. optical return loss of cable (dB) -20 -20 -
Max. discrete reflectance (dB) -25 -25 -25
83
No interoperability possible between MECP_OC5UOW and the other MECP_OSC modules.

6.4.3 STM-1/OC-3 SFP Optical Transceivers for OMS01_4

Table 6-1: STM-1 transceivers
SFP Transceiver Name84 OTR1_S3 OTR1_L3 OTR1_L5 OTR1_X5 OTR1_VL5

85
APPLICATION CODE S-1.1 L-1.1 L-1.2

86
Min. side mode suppression ratio (dB) - 30 30 > 30 > 30
Min. mean launched power (dBm) -15 -5 -5 0 +1
Max. mean launched power (dBm) -8 0 0 +5 +5
Min. sensitivity (BER of 1*10-12) EOL (dBm) -28 -34 -34 -35 -42
Min. overload (dBm) -8 -10 -10 -8 -5
Max. dispersion [ps/nm] 96 - - - -
Min. optical return loss of cable (dB) - - -20 -20 -
Max. discrete reflectance (dB) - - -25 -25 -25
84
New optical SFP transceivers for existing SIO1&4B basecard.
85
86


87 88 89
TRANSMITTER

90
RECEIVER

(dBm)
87
88
89
90


92
APPLICATION CODE S-4.1 L-4.2
TRANSMITTER
Max. RMS width (nm) - 4 1
Max. -20 dB width (nm) - - 1
Min. side mode suppression ratio (dB) - - > 30
Max. mean launched power (dBm) -14 -8 +2
Min. extinction ratio (dB) 10 8.2 10
RECEIVER
Min. overload (dBm) - -8 -8
Max. dispersion (ps/nm) - 74 -
91
MLM transceiver for 2 km with multimode fibers.
92

6.4.5 STM-4/OC-12 SFP Optical Transceivers for OMS04_1

SFP Transceiver Name93 OTR4_S3 OTR4_L3 OTR4_L5

94

1293-1334 1300-1325
TRANSMITTER
95 96
Source type MLM MLM SLM
Max. RMS width (nm) 4/2.5 - -
Max. -20 dB width (nm) - 1 <1
Max. mean launched power (dBm) -8 +2 +2
RECEIVER
Max. receiver reflectance (dB) - -14 -27
Max. dispersion [ps/nm] 46/74 92/109 1600
Min. optical return loss of cable (dB) - 20 24
Max. discrete reflectance (dB) - -25 -27
93
New optical SFP transceivers for existing SIO1&4B basecard.
94
95
96


97
TRANSMITTER

98
RECEIVER
97
98


Card Name OM16_ OM16_ OM16_ OM16_ OM16_ OM16_ OM16_
1AX5xx 1AV5xx 1AB5xx 1AX5 1AL5 1PS3 1PI3
99
APPLICATION CODE X-16.2 V-16.2 U-16.2 X-16.2 L-16.2 S-16.1 I-16
Operating wavelength (nm) 1530- 1530- 1530- 1530- 1530- 1260- 1260-1360
1560 1565 1565 1560 1565 1360
TRANSMITTER
Source type SLM SLM SLM SLM SLM SLM SLM
Max. -20 dB width (nm) 1 1 1 1 1 1 2
Max. RMS width (nm) - - - - - - -
Min. side mode suppression 30 30 30 30 30 30 -

(dB)
Min. mean launched power +5.5 +1 +0 +5.5 +0 -5 -10

(dBm)
Max. mean launched power +7.5 +3 +2 +7.5 +3 0 -3

(dBm)
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2 8.2 8.2 8.2
RECEIVER
Photodiode type APD APD APD APD APD Pin Pin
Min. sensitivity -28 -28 -28 -28 -28 -18 -16

(BER of 1*10-12) EOL (dBm)
Min. overload (dBm) -7 -7 -7 -7 -7 0 0
Max. receiver reflectance (dB) -27 -27 -27 -27 -27 -27 -27
Max. dispersion (ps/nm) 1800 1800 3000 2160 1800 - -
Min. optical return loss of -24 -24 -24 -24 -24 -24 -24
cable (dB)
Max. discrete reflectance (dB) -27 -27 -27 -27 -27 -27 -27
Max. optical path penalty (dB) < 2 <2 <2 <3 <2 <2 <1
99

NOTES:
 For the maximum dispersion of OM16_1AB5 to reach distances of 150 km, OM16_1AB5
should be connected to a booster
 The dispersion value for OM16_1PS3 and OM16_1PI3 is relevant only in the 1500 nm
wavelength. PS3 is for 25 km and PI3 for 2 km.
6.4.7 SDH/SONET STM-16/OC-48 SFP Optical Transceivers

SFP TRANSCEIVER NAME100 OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
TRANSMITTER
Max. -20 dB width (nm) 2 1 1 <1
Min. side mode suppression (dB) - 30 30 30
Max. mean launched power (dBm) -3 0 +3 +3
RECEIVER
Min. overload (dBm) -3 0 -9 -9
Max. dispersion [ps/nm] - - - 1600
Min. optical return loss of cable (dB) -24 -24 -24 -24
Max. optical path penalty (dB) <1 1 1 2
100
New optical SFP transceivers for existing SIO16 basecard.

NOTES:
 When selecting bidirectional transceivers, pay attention that they must operate in
OTR4-L3BD can work only vis-a-vis OTR4-L5BD, and so on. The transceivers in the
following table are arranged in complementary pairs.
 Application code is in reference to ITU-T Recommendation G.691.
 All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the
OMSC16_4 module (up to 4 SFP transceivers per module).
101
TRANSMITTER

102
RECEIVER
101
102

6.4.8 CWDM and DWDM STM-16/OC-48/OTU1 SFP Optical

Transceivers
NOTES:
 All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the
OMSC16_4 module (up to 4 SFP transceivers per module).
CWDM DWDM
SFP TRANSCEIVER OTC25_PSxx OTC25_1A OTR25_A OTR25_AB OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
103
NAME Lxx Vxx xx
APPLICATION CODE S-C8S1-1D2/ S-C8L1-1D DW100L DW100L\-- I-16 S-16.1 L-16.1 L-16.2
5 2/5 \--1D2/5 1D2/5(C)F
(C)F
G.695 G.695 DW100C\--
DW100C 1A2/5(C)F
\--1A2/5
G.698.1/.2
(C)F
G.698.1/
.2
Operating wavelength 1464-1618 1464-1618 1530-156 1530-1565 1260-1360 1260-1360 1280-1335 1500-1580
(nm) 5
TRANSMITTER
Source type SLM SLM SLM SLM SLM SLM SLM SLM
Max. -20 dB width (nm) 1 1 0.4 0.4 2 1 1 <1
Max. RMS width (nm) - - - - - - - -
Min. side mode 30 30 30 30 - 30 30 30

suppression (dB)
Min. mean launched 0 0 0 0 -10 -5 -2 -2

power (dBm)
Max. mean launched +5 +5 4 4 -3 0 +3 +3

power (dBm)
Min. extinction ratio 8.2 8.2 8.2 8.2 8.2 8.2 8.2 8.2
(dB)
RECEIVER
Min. sensitivity (BER of -21.5 -28 -28 -28 -16 -18 -27 -28
1*10-12) EOL (dBm)
(-23 GbE) (-32 GbE)
Min. overload (dBm) 0 -7 -9 -9 0 0 -9 -9
103
New optical SFP transceivers for existing SIO16 basecard.

CWDM DWDM
SFP TRANSCEIVER OTC25_PSxx OTC25_1A OTR25_A OTR25_AB OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
103
NAME Lxx Vxx xx
Max. receiver -27 -27 -27 -27 -27 -27 -27 -27
reflectance (dB)
Max. dispersion [ps/nm] 800 1600 2400 3600 - - -24 1600

(40 km (80 km (120 km (180 km
G.652) G.652) G.652) G.652)
Min. optical return loss 24 24 -24 -24 -24 -24 -27 -24
of cable (dB)
Max. discrete -27 -27 -27 -27 -27 -27 1 -27

reflectance (dB)
Max. optical path 1.5 2.5 <3 <2 <1 1 2

penalty (dB)
6.4.9 SDH/SONET STM-64/OC-192 (9953.28 Mbps ±4.6

ppm) I/O Modules
NOTES:
 OM10 is supported, in all three SIO64 types.
 OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T
G.694.1 grid (n = 1-40).
 For OM64_1ALSxx / OM10_1ALSxx receiver, when adding FEC, there is a typical
improvement of 2 dB for nonamplified networks (sensitivity of -25 dBm instead of -23
dBm).
OM64_ OM64_
OM10_ OM10_ OM10_ OM10_
Card Name 1ALSxx 1ASSxx
1PSSxx 1PLSxx 1PSS3 1PIS3
OM10_1ALSxx OM10_1ASSxx
APPLICATION CODE L-64.2a S-64.2a I-64.2 L-64.2b S-64.1 I-64.1
Operating wavelength (nm) 1530-1565 1530-1565 1530-1565 1530-1565 1285-1330 1285-1330
TRANSMITTER
Source type EML EML EML EML EML EML
Min. mean launched power

0 -2 -2 -2 -4 -6
(dBm)

OM64_ OM64_
OM10_ OM10_ OM10_ OM10_
Card Name 1ALSxx 1ASSxx
1PSSxx 1PLSxx 1PSS3 1PIS3
OM10_1ALSxx OM10_1ASSxx
Max. mean launched power

+2 +3 +3 +3 +1 -1
(dBm)
Min. extinction ratio (dB) 9.0 8.2 8.2 10 6 6
RECEIVER
Photodiode type APD APD PIN PIN PIN PIN
Min. sensitivity
-23 -19 -14 -14 -15 -11
(BER of 1*10-12) EOL (dBm)
Min. overload (dBm) -8 -8 -1 -1 -1 -1
Max. optical path penalty (dB) <2 <2 <2 <2 <1 <1
Max. receiver reflectance (dB) -27 -27 -27 -27 -27 -27
Max. attenuation range (dB) 21 15 10 10 10 4
Min. attenuation range (dB) 10 10 3 3 1 0
Max. chromatic dispersion 105 106

104 1600 800 800 1600 40 7
(ps/nm)
6.4.10 SDH/SONET STM-64/OC-192 XFP Optical Transceivers

XFP Transceiver Name OTR64_I3 OTR64_S5 OTR64_L5 OTR10_ASxx OTR10_ALxx
107
APPLICATION CODE I-64.1 S-64.2b L-64.2a 1L1-2D2F
P1I1_2D1 P1S1_2D2b P1L1-2D2
VSR2000_2R1
TRANSMITTER
NA NA 192.1 + 0.1m 192.1 + 0.1m

Central frequency (THz) NA
m=0 to 40 m=0 to 40
104
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx sensitivity (EOL) minus max. optical
path penalty (dB).
105
The limitation for the long-range STM-64/OC-192 laser is 68 km. When adding FEC, the range can be extended up to 76 km.
106
The limitation for the long-range STM-64/OC-192 laser is 68 km. When adding FEC, the range can be extended up to 76 km.
107

XFP Transceiver Name OTR64_I3 OTR64_S5 OTR64_L5 OTR10_ASxx OTR10_ALxx

107
APPLICATION CODE I-64.1 S-64.2b L-64.2a 1L1-2D2F
P1I1_2D1 P1S1_2D2b P1L1-2D2
VSR2000_2R1
Maximum central frequency NA NA

NA ±12.5 ±12.5
deviation (GHz)
Max. -20 dB width (nm) <1 <1 <1 <1 <1
Min. side mode suppression (dB) 30 30 30 30 30
Min. mean launched power (dBm) -6 -1 0 -1 -1
Max. mean launched power (dBm) -1 +2 +4 +3 +3
Min. extinction ratio (dB) 6 8.2 9 8.2 9
RECEIVER
Min. sensitivity (BER of 1*10-12) -11 -14 -24 -24 -24

EOL (dBm)
Max. dispersion [ps/nm] 6.6 800 1600 800 1600
6.4.11 SDH/SONET STM-64/OC-192 Bidirectional XFP

Transceivers
Table 6-7: STM-64 bidirectional transceivers (XFPs)
XFP Transceiver Name OTR64_S27B OPT64_S33B OTR64_L27B OPT64_L33BD OTR64_E27B OTR64_E33BD

D D D D
108
CODEAPPLICATION CODE S27BD S33BD L27BD L33BD E27BD E33BD
Operating wavelength (nm) 1270 1330 1270 1330 1270 1330
TRANSMITTER
Source type DFB DFB DFB DFB DFB DFB
Modulation NRZ NRZ NRZ NRZ
108

XFP Transceiver Name OTR64_S27B OPT64_S33B OTR64_L27B OPT64_L33BD OTR64_E27B OTR64_E33BD

D D D D
108
CODEAPPLICATION CODE S27BD S33BD L27BD L33BD E27BD E33BD
Operating output wavelength NA NA NA NA 1 1

(nm)
Maximum central frequency NA NA NA NA NA NA

deviation (GHz)
Max. -20 dB width (nm) 1 1 1 1 1 1
Min. side mode suppression 30 30 30 30 30 30

(dB)
Min. mean launched power -5 -5 1 1 1 1

(dBm)
Max. mean launched power 0 0 5 5

(dBm)
Min. extinction ratio (dB) 6 6 5 5 6 6
RECEIVER
Min. sensitivity (BER of -14 -14 -15 -15 -20 -20

1*10-12) EOL (dBm)
Min. overload (dBm) 0.5 0.5 0.5 0.5 -6 -6
Max. receiver reflectance (dB) NA NA NA NA NA NA
Max. dispersion [ps/nm] NA NA NA NA NA NA
Min. optical return loss of cable NA NA NA NA NA NA

(dB)
Max. discrete reflectance (dB) NA NA NA NA NA NA
Max. optical path penalty (dB) 2 2 2 2 2 2
6.4.12 SIO Cards FEC and EFEC Support

Part of XDM SIO cards support FEC and/or EFEC. The following table lists the name of the card and the type
of FEC they support. The standards for FEC are defined by the ITU-T, and SIO cards support ITU-T G.709 and
two types of EFEC per ITU-T G.975.1 designated I4 and I8. Cards that support EFEC type I8, are not
interoperable with those supporting EFEC type I4.
Table 6-8: SIO cards FEC support
Card type No FEC FEC EFEC
I4 I8
SIO64M  (default) x x x
SIO64MF x  (default) x x

Card type No FEC FEC EFEC
I4 I8
SIO64B   (default) x x
SIO64_1D   (default) x 
SIO64_2   (default) x 
SIO164 with one STM-64 port   (default) x x
SIO164 with OMTX_EF transceiver   (default)  x
6.4.13 OW Unit Specifications

The OW unit supports omnibus conference call with two separate configurable networks (A and B). Any
user within the network can select another user in its network by direct dialing (DTMF).
Tx/Rx level 7 dBm, 600 Ω, (per CCITT G.711)
Speech coding and bit rate PCM A-law 8 Kbps
Number of VF channels 10 to 12
Band pass 300 to 3400 Hz
Subscriber side input/output level 7 dBm, 600 Ω, (per CCITT G.711)
Idle channel noise (-) 75 dBmOp
Number of data channels 3 (E1, E2, F1)
Interface connectors type Tel JACK 6P4C RCA
Data rates 64 Kbps
6.5 XDM MPLS/Ethernet Card Summary

The following table identifies the MPLS/Ethernet components and the platforms within which specific
modules are used. The different modules are listed by interface categories, where the modules within a
category generally share the same functionality. Specific details may vary from module to module.
Interface XDM-500 XDM-1000 XDM-2000 XDM-3000
Ethernet over SDH/SONET

Layer 1
DIOB    
Ethernet/MPLS Layer 1
and 2
MCS5 (only in 5 and 10    

Gbps slots)

Interface XDM-500 XDM-1000 XDM-2000 XDM-3000
MCS10 (only in 10 Gbps    

slots)
MCS30_X10G (only in 10    
Gbps slots)
MCS50_X10G (only in 10    
Gbps slots)
6.6 Data Cards

Intercard Data Network Bandwidth per EoS
Card109 Service interfaces
interfaces handling interfaces interface
110 112
DIOB 8 x FX/GbE (optical) + --- Layer 1 24 x EoS (1 to 16) x VC-4
[8 x 10/100BaseT + (1 to 48) x VC-3
111
8 x 10/100/1000BaseT] (1 to 63) x VC-12
113 114 116
MCS5 4 x FX/GbE (optical) + --- Layer 2 32 x EoS/MoT (1 to 16) x VC-4
(Ethernet/M 117
4 x FX (optical) + (1 to 48) x VC-3
PLS)
118
[12 x 10/100BaseT + (1 to 63) x VC-12
115
4 x 10/100/1000BaseT]
119 120 122
MCS10 8 x FX/GbE (optical) + --- Layer 2 32 x EoS/MoT (1 to 16) x VC-4
(Ethernet/M 123
[8 x 10/100BaseT + (1 to 48) x VC-3
PLS)
121 124
8 x 10/100/1000BaseT] (1 to 63) x VC-12
109
All data cards are not supported in XDM-40.
110
Optical ports on base cards, SFP for GbE or FX.
111
Electrical ports located on ME_16 module in the CCP. Not relevant for XDM-2000, XDM-3000, or NPT-1600C.
112
EoS – Ethernet over SDH/SONET.
113
Can be accommodated in 5 Gbps, or 10 Gbps slots only, with 5 Gbps EoS capacity.
114
115
116
Maximum EoS/MoT capacity per card: 5 Gbps (32xVC-4 or 96xVC-3) and per EoS port when using LAG.
117
118
Maximum n x VC-12 per card: 512 x VC-12.
119
Can be accommodated in 10 Gbps slots only.
120
121
122
123
124

Intercard Data Network Bandwidth per EoS

Card109 Service interfaces
interfaces handling interfaces interface
125
MCS30_X10G 1 x 10GbE (optical) XFP+ 1 x 10 GbE Layer 2 32 x EoS/MoT (1 to 64) x VC-4
126 (Ethernet/M
10 x FX/GbE (optical) SFP (1 to 192) x VC-3
PLS)
(1 to 64) x VC-12
MCS50_X10G 4 x 10GbE (optical) XFP+ 2 x 10 GbE Layer 2 96 x EoS/MoT (1 to 64) x VC-4/STS-3c

(Ethernet/M SPE
4 x 1GbE (optical) SFP
PLS)
(1 to 192) x
127
VC-3/ STS-1c SPE
128
(1 to 46) x VC-12
129
ATS 2 x VC-4 + 126 x E1 --- ATM 2 x VC-4 + 2 x VC-4 + 125 x E1
125 x E1
6.6.1 DIOB Specifications

Interfaces 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX,
1000BaseLX, 1000BaseZX
Standards compliance IEEE 802.3z, G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
EoS capacity with VC-4 or VC-3 granularity up to 2.5 or 5 Gbps
EoS capacity with VC-12 granularity up to 512 x VC-12
6.6.2 MCS5 Specifications

Interfaces 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX, 1000BaseLX,
1000BaseZX
125
Can be accommodated in 10 Gbps slots only.
126
Supported starting V8.2
127
128
129
ATS resources can be software-allocated to service or network interfaces as required

Protection 50ms FRR link and node, <50ms Dual homed

Ethernet UNI/NNI LAG and EoS LAG, G.8032 V1 (ERP)
Fast IOP – MCS5 1+1 hot standby card protection
MPLS-based services VPWS (Martini encapsulation), VPLS (Full mesh and star), Hierarchical VPLS (H-VPLS) with multiple
Split Horizon Groups and VPLS Spokes P2MP (Multicast drop and continue), H-VPLS IGMP
snooping and static MAC
Hard QoS 8192 policed flows per card supporting CIR, CBS and EIR, EBS Classification based on port, CVLAN,
CVLAN-Pbits, SVLAN, SVLAN-Pbits (802.1p priority bits), DHCP field, Untagged Frame, BPDU, and
Wildcard (all VLANs that are not explicitly defined). Untagged frame handling with port-based
VLAN (attach/detach CVLAN and/or SVLAN to untagged frames) 8 Classes of Service (CoS),
Classification rules, CoS mapping, 2 rate policing, 3 colors marking, Connection Admission Control
(CAC) WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing / Weighted Round Robin)
MAC and VLANs 4093 x 4093 VLANs with 16K VLAN mapping rules, S-VLAN translation, S-VLAN configurable
Ether-type, FDB (Forwarding Data Base)
E2E OAM Tunnel OAM (ITU-T Y.1711) with Connectivity Verification, Service OAM (802.1ag) with Continuity
Check, Loopback and Link Trace, Link OAM (802.3ah), Link Loss Carry Forward (LLCF), Port
Mirroring
Control)
Management Point-and-click fast service creation, Management layers/Planes: Data, TDM, optic, Supporting
CAC for MPLS Tunnel and Service provisioning, Enhanced protection by SRLG (Shared Risk Link
Group) schemes
Services:
Mobile aggregation 3G Ethernet-based services, including VoIP, HSDPA, IPTV and video streaming, MP3 streaming,
VoD, video and voice conferences
IEEE 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag, 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x
ITU-T G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, G.8011.1/Y.1307.1, G.8011.2/Y.1307.2,

G.8012/Y.1308, Y.1710, Y.1711, G.783, G.8032 V1/Y.1344
IETF RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, RFC 4379, RFC 3812, RFC 3813, RFC 2702,
RFC 4090, RFC 3916, RFC 3985, RFC 4125

6.6.3 MCS10 Specifications

Interfaces 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX, 1000BaseLX,
1000BaseZX
Protection 50ms FRR link and node, <50ms Dual homed Ethernet UNI/NNI LAG and EoS LAG, G.8032 V1 (ERP)
Fast IOP – MCS10 1+1 hot standby card protection
MPLS-based services VPWS (Martini encapsulation), VPLS (Full mesh and star), Hierarchical VPLS (H-VPLS) with multiple
Split Horizon Groups and VPLS Spokes, P2MP (Multicast drop and continue) IGMP snooping and
static MAC
Wildcard (all VLANs that are not explicitly defined). Untagged frame handling with port-based VLAN
(attach/detach CVLAN and/or SVLAN to untagged frames) Eight Classes of Service (CoS),
Classification rules, CoS mapping, 2 rate policing, 3 colors marking, Connection Admission Control
(CAC) WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing / Weighted Round Robin)
MAC and VLANs 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation, S-VLAN configurable
Ether-type, FDB (Forwarding Data Base)
E2E OAM Tunnel OAM (ITU-T Y.1711) with Connectivity Verification, Service OAM (802.1ag) with Continuity
Check, Loopback and Link Trace, Link OAM (802.3ah), Link Loss Carry Forward (LLCF), Port Mirroring
Control)
Management Point-and-click fast service creation, Management layers/Planes: Data, TDM, optic, Supporting CAC
for MPLS Tunnel and Service provisioning, Enhanced protection by SRLG (Shared Risk Link Group)
schemes
Services:
Business connectivity VPWS and VPLS, H-VPLS
Mobile aggregation 3G Ethernet-based services, including VoIP, HSDPA, IPTV and video streaming, MP3 streaming, VoD,
video and voice conferences

G.8012/Y.1308, Y.1710, Y.1711, G.783, G.8032 V1/Y.1344 G.8011.1/Y.1307.1, G.8011.2/Y.1307.2,
G.8012/Y.1308, Y.1710, Y.1711, G.783, G.8032 V1/Y.1344
IETF RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC
4090, RFC 3916, RFC 3985, RFC 4125

6.6.4 MCS30_X10G Specifications

Interfaces 10GBase-SR (850nm MM), 10GBase-LR (1310nm SM), 10GBase-ER (1550nm SM), 10GBase-ER (1550nm
SM), 10GBase-ER (15XXnm DWDM, SM)
Intercard connectivity GbE
Protection 50ms FRR link and node, <50ms Dual homed Ethernet UNI/NNI LAG and EoS LAG, G.8032 V1 (ERP) Fast
IOP – MCS30_X10G 1+1 hot standby card protection
Synchronization SyncE and 1588v2 synchronization mechanisms
MPLS-based services VPWS (Martini encapsulation), VPLS (Full mesh and star), Hierarchical VPLS (H-VPLS) with multiple Split
Horizon Groups and VPLS Spokes, P2MP (Multicast drop and continue) IGMP snooping and static MAC
(attach/detach CVLAN and/or SVLAN to untagged frames) Eight Classes of Service (CoS), Classification
rules, CoS mapping, 2 rate policing, 3 colors marking, Connection Admission Control (CAC) WRED,
Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing / Weighted Round Robin)
MAC and VLANs 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation, S-VLAN configurable Ether-type,
FDB (Forwarding Data Base)
E2E OAM VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, FIB quota, BSC (Broadcast Storm Control)
Security VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, FIB quota, BSC (Broadcast Storm Control)
Management Point-and-click fast service creation, Management layers/Planes: Data, TDM, optic, Supporting CAC for
MPLS Tunnel and Service provisioning, Enhanced protection by SRLG (Shared Risk Link Group) schemes
Services:

G.8012/Y.1308, Y.1710, Y.1711, G.783, G.8032 V1/Y.1344, G.8261, G.8262, G.8263, G.8264
IETF RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090,
RFC 3916, RFC 3985, RFC 4125

6.6.5 MCS50_X10G Specifications

Interfaces 10GBase-SR (850nm MM), 10GBase-LR
(1310nm SM), 10GBase-ER (1550nm SM), 10GBase-ER (1550nm SM), 10GBase-ER (15XXnm DWDM, SM)
Intercard connectivity 20 GbE
Protection 50ms FRR link and node, <50ms Dual homed Ethernet UNI/NNI LAG and EoS LAG, G.8032 V1 (ERP) Fast
IOP – MCS50_X10G 1+1 hot standby card protection
Synchronization SyncE synchronization mechanisms
MPLS-based services VPWS (Martini encapsulation), VPLS (Full mesh and star), Hierarchical VPLS (H-VPLS) with multiple Split
Horizon Groups and VPLS Spokes, P2MP (Multicast drop and continue) IGMP snooping and static MAC
(attach/detach CVLAN and/or SVLAN to untagged frames) Eight Classes of Service (CoS), Classification
rules, CoS mapping, 2 rate policing, 3 colors marking, Connection Admission Control (CAC) WRED,
Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing / Weighted Round Robin)
MAC and VLANs 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation, S-VLAN configurable Ether-type,
FDB (Forwarding Data Base)
E2E OAM VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, FIB quota, BSC (Broadcast Storm Control)
Security VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, FIB quota, BSC (Broadcast Storm Control)
Management Point-and-click fast service creation, Management layers/Planes: Data, TDM, optic, Supporting CAC for
MPLS Tunnel and Service provisioning, Enhanced protection by SRLG (Shared Risk Link Group) schemes
Services:
ITU-T G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,

G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, G.8012/Y.1308,
Y.1710, Y.1711, G.783, G.8032 V1/Y.1344, G.8261, G.8262, G.8263, G.8264
IETF RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090,
RFC 3916, RFC 3985, RFC 4125

6.6.6 ME_12 Specifications

Interfaces 1000Base-SX, LX, EX, ZX, BD (with optical SFP)
10/100/1000Base-T (with electrical SFP)
Total LAN connectivity 12 Gbps
Supported port types ETY, UNI/NNI, MoE
Standards compliance IEEE 802.1D/P/Q, 802.1w, 802.3-2005, 802.3x
6.6.7 ATS Specifications

Bandwidth 622.08 Mbps
Simultaneous IMA support 84 IMA groups per card with 1 to 32 E1 links each
ATM service classes CBR, rt-VBR, nrt-VBR, UBR
ATM signaling UNI 3.1, UNI 4.0, PNNI 1.0, PNNI SPVC Addendum V 1.0, IISP 1.0
IMA IMA 1.0, IMA 1.1
OAM ITU-T I.610
Traffic management ATMF TM 4.1
6.6.8 Data Client Transceivers for MCS5, MCS10,

MCS30_X10G, MCS50_X10G
OTGBE_SX OTGBE_LX OTGBE_ZX OTGBE_S3BD OTGBE_S5BD OTGBE_L3BD OTGBE_L5BD
Transmitter GbE GbE GbE very Bidirectional Bidirectional Bidirectional Bidirectional

type short-reach long-reach long-reach SFP, 1310 nm SFP, 1490 nm SFP, 1310 nm
SFP, 1490 nm
laser, 850 nm, laser, 1310 laser, 1550
multi-mode nm, single nm, single
mode mode
Data rate 1250 1250 1250 1250 1250 1250 1250

(nominal)
(Mbaud)
Average -3 Max. -3 5 -3 Max. -3 +2 +2

launch power
(dBm) -9.5 Min. -11 0 -10 Min. -10 -5 -5
Min. 9 9 9 >9 >9 >9 >9

transmitter
extinction
ratio (dB)
Data format 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B

Average -20 Min. -22 -- < -21 < -21 < -23 < -23
receiver
sensitivity -21 Typical -25.5 -22 < -22 < -22 < -24 < -24
(dBm)
Max. receiver 0 0 0 0 0 -3 -3
overload
(dBm)
Typical Rx LOS -24 -29 -25 -35 -35 -33 -33

level (dBm)
Connector LC LC LC LC LC LC LC
Fiber lengths 550 m 10 km 80 km 10 km 10 km 40 km 40 km

(50/62.5 µm (9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF)
MMF)
Card130 OTFE_FXS OTFE_FXSG OTFE_LXSG OTFE_MM OTFE_SM
Transmitter type FX, short-reach FX, short-reach LX, long-reach FX, short-reach FX, short-reach
laser, 1310 laser, 1310 laser, 1310 single laser, 1310 laser, 1310 nm,
multimode multimode mod multimode single mode
Average Max. -14 -14 -8 -14 -8

launch power
(dBm) Min. -20 -20 -15 -19 -15

ratio (dB)
Data format N/A N/A N/A N/A N/A
Average Min. -30 --

receiver
sensitivity Typical -31.5 -31.5 -31.5 -31 -28
(dBm)
Max. receiver overload -8 -8 -8 -14 -8

(dBm)
Typical Rx LOS level (dBm) - - - < -29 < -28
Fiber lengths 2 km 2 km 10 km 550 m 10 km

(50/62.5 mm (50/62.5 mm (9 mm SMF) (50/62.5 µm (9 µm SMF)
MMF) MMF) MMF)
130

6.6.9 Data Client XFP Transceivers for MCS30_X10G,

MCS50_X10G
Transceiver OTR103_ER OTR103_ZR OTR103_SR OTR103_LR
S-64.2b
L-64.2a
Application code P1S1_2D2b 10GBASE-SR 10GBASE-LR
P1L1-2D2
10GBASE-ER
Source type SLM SLM MLM SLM
Modulation External External Direct Direct
Direct max. -20 dB width (nm) <1 <1 NA <1
Min. side mode suppression ratio (dB) 30 30 NA 30
Min. mean launched power (dBm) -1 0 -4 -8.2
Max. mean launched power (dBm) +2 +4 -1 +0.5
Max. dispersion (ps/nm) 800 1600 NA 6.6
Minimum optical return loss (dB) 24 24 12 12
Maximum DGD (ps) 30 30 30 30
-11
Sensitivity (BER of 1*10-12) (dBm) -14 -24 -12.6
Stressed (-7.5)
3.9
Maximum optical path penalty 2 2 (Transmitter and 1
dispersion penalty)
OCH switching time (ms) <3 <3 <3 <3

Table 6-9: Bidirectional transceivers (XFPs)
XFP Transceiver Name OTR64_E27BD OTR64_E33BD

131
CODEAPPLICATION CODE E27BD E33BD
Operating wavelength (nm) 1270 1330
TRANSMITTER
Source type DFB DFB
Modulation
Operating output wavelength (nm) 1 1
Maximum central frequency deviation (GHz) NA NA
Min. mean launched power (dBm) 1 1
Max. mean launched power (dBm) 5 5
RECEIVER
Min. sensitivity (BER of 1*10-12) EOL (dBm) -20 -20
Max. receiver reflectance (dB) NA NA
Max. dispersion [ps/nm] NA NA
Min. optical return loss of cable (dB) NA NA
Max. discrete reflectance (dB) NA NA
Max. optical path penalty (dB) 2 2
6.6.10 Data Line XFP Transceivers for MCS30_X10G,

MCS50_X10G
Transceiver OTR10_ALxx OTR10_ASxx
Application code 1L1-2D2F
Source type SLM SLM
Modulation External, NRZ
131

Transceiver OTR10_ALxx OTR10_ASxx
Transmitter
192.1 + 0.1m 192.1 + 0.1m

Central frequency (THz)
m=0 to 40 m=0 to 40
Maximum central frequency deviation (GHz) ±12.5 ±12.5
Max. -20 dB width (nm) <1 <1
Min. side mode suppression ratio (dB) 30 30
Min. mean launched power (dBm) 0 -1
Max. mean launched power (dBm) 4 +3
Receiver
Optical Path
Maximum discrete reflectance -27 -27
Maximum DGD (ps) 30
Max. dispersion (ps/nm) 1600 800
Maximum optical path penalty 2 2
OCH switching time (ms) <3
6.7 Optical Components

The XDM optical layer can service pure optical networks as well as converged networks that integrate WDM
with data and SDH/SONET services in the same platform. To take full advantage of the XDM platform, a
variety of optical cards and modules are used for both the modules cage and the cards cage of the various
shelves, both in I/O slots as well as in the X1/X2 slots (otherwise used for the cross-connect matrix cards).

6.7.1 DWDM Mux/Demux Cards and Modules

This section describes the DWDM Mux/Demux cards and modules.
6.7.1.1 DWDM cards (cards cage of XDM-1000 and XDM-2000 shelves)
Card Width (slots) Function/Description
16/32-channel DWDM mux/demux cards (slots X1, X2)
DW16VMDRE-AG 1 Variable mux AWG, demux diffraction grating, 16 red channels, expandable
to 32 channels
6.7.1.2 DWDM modules (CCP cage of XDM-1000/XDM-450)
Module Conn. type Width (slots) Function/Description
Flat Top mux/demux for cascading applications for manual ROADM like operation
MO_DW16MDR-BB-AVAV LC 2 Mux AWG, demux AWG, 16 red channels, nonexpandable
MO_DW16MDRE-BB-AVAV LC 2 Mux AWG, demux AWG, 16 red channels, expandable to 32

channels
MO_DW16MDB-BB-AVAV LC 2 Mux AWG, demux AWG, 16 blue channels, expandable to

32 channels
MO_DW40MC-BB-AV LC 2 Mux AWG, 40 channels, C band
MO_DW40DC-BB-AV LC 2 Demux AWG, 40 channels, C band
6.7.1.3 Mux (CCP Flat Top) specifications
Type 16-channel 32-channel 40-channel
Insertion loss (dB): AWG < 6.5 < 9.5 < 6.5
Adjacent isolation (dB): AWG < -27 < -27 < -27
Cumulative isolation (dB): AWG < -24 < -24 < -24
PDL (dB) AWG <0.2 <0.2 <0.2
PMD (ps) AWG <0.5 <0.5 <0.5
Insertion Loss Uniformity (dB) <1 <2 <1.8
Return loss (dB) < -40 < -40 < -40

6.7.1.4 Demux (CCP Flat Top) specifications
Type 16-channel 32-channel 40-channel
Insertion loss (dB): AWG < 6.5 <8 < 6.5
Adjacent isolation (dB): AWG < -27 < -27 < -27
Cumulative isolation (dB): AWG < -24 N/A < -24
PDL (dB) AWG <0.2 <0.2 <0.2
PMD (ps) AWG <0.5 <0.5 <0.5
Insertion Loss Uniformity (dB) <1 <2 <1.8
Return loss (dB) < -40 < -40 < -40
6.7.2 ROADM Cards

This section describes the ROADM cards.
6.7.2.1 ROADM modules for XDM-1000/XDM-450 (CCP cage)
Module Conn. type Width (Slots) Function/Description
ROADM modules
MO_ROADM8A LC 2 Multi-degree optical

add/drop of any combination of channels (100GHz spacing) to 9
ports. WSS in add position.
MO_ROADM8A_50 LC 2 Multi-degree optical

ports. WSS in add position.
MO_ROADM8D LC 2 Multi-degree optical

ports. WSS in drop position.
MO_ROADM40 LC 3 100GHz spacing 2D PLC ROADM with forty Add/Drop ports in

East/West configuration. Any channel can be dropped or passed
through via management. Add/Drop channels are automatically
equalized. Can be used as VMUX for OTM sites.
MO_ROADM2A LC 1 100GHz spacing 2D WSS ROADM with Add/Drop ports in

East/West configuration. Requires external 40 Ch. Mux and
DeMux. Can be used as VMUX for OTM sites.
MO_ROADM2A_50 LC 1 50GHz spacing 2D WSS ROADM with Add/Drop ports in East/West

configuration. Requires external 80 Ch. Mux and DeMux. Can be
used as VMUX for OTM sites.

6.7.2.2 MO_ROADM8A – 100 GHz spacing –Multi Degree configuration
Basecard type ROADM8
Through Drop Local Add
MO_ROADM8A (dB) Add module 7.5 NA 7.5
MO_ROADM8A (dB) Drop module 11.5 11.5 9.5 NA
MO_ROADM8A (dB) multi-degree Add + Drop 19 -

module
Adjacent isolation (dB): <-40
PDL (dB) At 0 dB Atten <0.5
At 15 dB Atten <1.3
PMD at 0 dB attenuation (ps) <1
6.7.2.3 MO_ROADM8A_50 – 50 GHz spacing –Multi Degree

configuration
Basecard type ROADM8A_50
Through Drop Local Add
MO_ROADM8A_50 (dB) Add module 6.5 NA 6.5 6.5
MO_ROADM8A_50 (dB) Drop module 11.5 11.5 9.3 NA
MO_ROADM8A_50 (dB) multi-degree Add + Drop 18 -

module
Adjacent isolation (dB): <40
PDL (dB) At 0 dB Atten <0.5
At 15 dB Atten <0.8
PMD at 0 dB attenuation (ps) <0.5
6.7.2.4 MO_ROADM8D – 100 GHz spacing –Multi-Degree configuration
ROADM8
Basecard type
Through Drop Add
MO_ROADM8D (dB) Drop module 7 7 NA
MO_ROADM8D (dB) Add module 14 NA 14
MO_ROADM8D (dB) multi-degree Add + Drop module 21
Adjacent isolation (dB):- <-40

ROADM8
Basecard type
Through Drop Add
Cumulative isolation (dB): <-38
PDL (dB) <0.45
PMD (ps) <0.2
6.7.2.5 MO_ROADM40 2D ROADM 100 GHz spacing with equalization
ROADM40
Basecard type
Through Drop Add
MO_ROADM40 (dB) Drop module 4.2 10.6 -
MO_ROADM40 (dB) Add module 8.5 - 6.6

132
MO_ROADM40 (dB) protected Add + Drop module 12.7 10.6 6.6
MO_ROADM40 used as VMUX 10.6 - Demux 6.6 - Mux
Cumulative isolation (dB): <-20
PDL (dB) <1
PMD (ps) <0.5
6.7.2.6 MO_ROADM2A - 100 GHz spacing - 2D ROADM with

Equalization
Basecard type MO_ROADM2A
Through Local Drop Local Add
MO_ROADM2A (dB) Add module 8.7 N/A 9.2
MO_ROADM2A (dB) Drop module 9.0 3.0 N/A
MO_ROADM2A (dB) two degree Add + Drop module 14.5
Add module integrated channel isolation (dB): 35
PDL (dB) At 0 dB Atten 0.5
At 15 dB Atten 0.85
PMD at 0 dB attenuation (ps) 0.5
132
For protected sites using two East/West cards, the through insertion loss should be doubled.

6.7.2.7 MO_ROADM2A_50 - 50 GHz spacing - 2D ROADM with

Equalization
Basecard type ROADM2A_50
Through Local Drop Local Add
MO_ROADM2A_50 (dB) Add module 8.7 N/A 9.2
MO_ROADM2A_50 (dB) Drop module 6.0 5.0 N/A
Add module integrated channel isolation (dB): 11.5
Adjacent isolation (dB): 35
PDL (dB) At 0 dB Atten 0.5
At 15 dB Atten 0.85
DGD at 0 dB attenuation (ps) 0.5
6.7.3 DWDM OADM Cards and Modules

This section describes the DWDM OADM cards and modules.
6.7.3.1 DWDM OADM cards (cards cage)
Card Width (slots) Function/Description XDM-2000 XDM-1000 XDM-500
Active OADM basecards for I/O slots
OADM4EW 1 Basecard for 1 active OADM filter; east/west   

configuration
OADM4EW_SW 1 Basecard for 1 active OADM filter; east/west   

configuration with 2x2 switch OADM (Ready
Site)
6.7.3.2 DWDM OADM plug-in filters for OADM cards
Module Function/Description
OM_AD4RQEWxx 4-channel 100 GHz OADM filter with built-in equalization for east/west configuration, 4 skip 0,
10 bands in C-band

6.7.3.3 OM_AD4RQEW_xx 4skip0 OADM for I/O slots
Insertion Loss
Module type
Through Drop Add
133
OADM4EW (dB) <1.8 <3.3 <4.7
134
OADM4EW_SW (dB) <3.2 <4.0 <5.1
Non-adjacent isolation (dB): <-40
PDL (dB) <0.1
PMD (ps) <0.2
6.7.3.4 4-channel active OADM basecard only (no filters), 2 x 2 switch

through I/O slots
Type of OADM site Basecard + 2x2 switches
E/W unprotected 2.6
E/W protected both base cards with 2x 2 switches 5.2
6.7.3.5 DWDM components (CCP cage of

XDM-40/XDM-450/XDM-500/XDM-1000)
Module Conn. type Function/Description
Basecard for CWDM mux/demux/OADM modules
MO_CW2 NA Basecard for up to two 4/8-channel CWDM mux/demux/OADM modules;

occupies one slot
4 Channel DWDM OADM module
OM_OADM4GEW_xx LC 4-channel, 100 GHz DWDM OADM filter, 4skipe0, 10 channels in C-band
133
134

6.7.3.6 OM_OADM4GEW_xx 4 skip 0 OADM for CCP slots
Insertion Loss
Module type
Through Drop Add
OM_OADM4GEW (dB) < 1.1 < 3.1 < 3.1
Non-adjacent isolation (dB):: <-40
PDL (dB) <0.1
PMD (ps) <0.2
6.7.4 CWDM Mux/Demux/OADM Components

This section describes the CWDM Mux/Demux/OADM components.
6.7.4.1 CWDM components (CCP cage)
Module Conn. type Function/Description
Basecard for CWDM mux/demux/OADM modules
MO_CW2 NA Basecard for up to two 4/8-channel CWDM mux/demux/OADM

modules; occupies one slot
4/8-Channel CWDM mux/demux modules
OM_CWMD4C LC 4-channel CWDM mux/demux for 1511 nm, 1531 nm, 1551 nm,
157 nm, with built-in 1310 nm OSC filter
OM_CWM8C LC 8-channel CWDM mux for 1471 nm, 1491 nm, 1511 nm, 1531
nm, 1551 nm, 1571 nm, 1591 nm, 1611 nm with built-in 1310
nm OSC filter
OM_CWD8C LC 8-channel CWDM demux for 1471, 1491, 1511, 1531, 1551,
1571,1591, 1611 nm with built-in 1310 nm OSC filter
OM_CWMD4C_E LC Upgradeable 4-channel CWDM mux/demux for 1511 nm, 1531

nm, 1551 nm, 1571 nm with built-in 1310 nm OSC filter
OM_CWMD4SL LC 4-channel expansion CWDM mux/demux for 1471 nm, 1491 nm,
1591 nm, 1611 nm without OSC filter
1/2-Channel CWDM OADM modules
OM_OADMC1AB_xx LC 1-channel OADM for channel 1xx1nm, with built-in 1310 nm OSC
filter
OM_OADMC2AB_xxyy/Gzz LC 2-channel OADM for channels 1xx1+ 1yy1nm/1zz1 +

1(z+2)(z+2)1nm, with built-in 1310 nm OSC filter

6.7.4.2 Mux/Demux Specifications
OM-CWMD4C OM_CWM8C & OM_CWMD4C-E OM_CWMD4SL

OM_CWD8C
Insertion loss mux + demux < 4.2 < 5.5 < 4.9 < 7.3
135
(dB)
Return loss (dB) < 40 < 40 < 40 < 40
Directivity (dB) < 45 < 45 < 45 < 45
6.7.4.3 OADM specifications
Insertion loss 136
Module type Through Drop Add

137
OM_OADMC1AB_xx < 3.9dB < 2.6dB < 2.2dB
OM_OADMC2AB_xxyy/Gzz 138 < 4.4dB < 3.2dB < 3.2dB
6.7.5 Transponders
This section describes the transponders in various configurations.
6.7.5.1 TRP25_2 basecards
Card No. of slots Function/Description
TRP25_2C 1 Basecard for two 2.5 Gbps transponders with 3R (50 Mbps to 2.7 Gbps). Provides PM (for
SDH/SONET, SONET, GbE), OCH/UPSR 1+1 protection, and outband FEC.
TRP25_2CT 1 Add/Drop bidirectional transponder with tunable laser (add) and noncolored laser (drop)
with 3R (50 Mbps to 2.7 Gbps). Provides PM (for SDH/SONET, SONET, GbE), OCH/UPSR 1+1
protection, and outband FEC.
TRP25_2CTR 1 Bidirectional regenerator with two tunable lasers with 3R (50 Mbps to 2.7 Gbps). Provides
PM (for SDH/SONET, SONET, GbE), OCH/UPSR 1+1 protection, and outband FEC.
135
136
137
xx designates the channel dropped by the OADM.
138
xx designates the group of two channels dropped by the OADM.

6.7.5.2 Optical transmitters and receivers for TRP25_2
Module Description/Function
2.5 Gbps optical transmitters and receivers for TRP25_2
OMT25_Bxx 2.5 Gbps colored transmitter type B
OMT25_S3 2.5 Gbps 1310 nm short-haul transmitter type S3
OMT25_T Optical module tunable transmitter for C band
OMR25C_A Type A (APD) continuous receiver
OMR25C_P Type P (PIN diode) continuous receiver
6.7.5.3 CHTR_B basecard Configurations
CMBR25_2 1 Basecard for two SFP data (GbE/FC/FICON) modules and 2.7 Gbps line with G.709 FEC
CMBR10_T 1 Basecard for 4xSTM16 OTN combiner with G.709 FEC/EFEC
TRP10_2B 1 Basecard for 10.7 Gbps transponders with G.709 FEC/EFEC
6.7.5.4 CHTR_B Basecard Modules and Transceivers
CMBR25 modules
OMCD25_2 2.7 Gbps Client/line card with G.709 FEC for two SFP data (GbE/FC/FICON) modules
CMTR25 modules
OMTR27_2 Line and client module for STM16/OTU1 services. CWDM and/or DWDM. Supports on-board
protection. Two modules fit on each CHTR_B base card
OMCM25_4 Line and client module for up to four services of STM1/4, FICON, FC100, FC200, GbE to 2.7G
combiner''''. CWDM and/or DWDM. Supports on-board protection. Two modules fit on CHTR_B base
card
2.7 Gbps optical cards for TRP25_4
OMTR27 2.7 Gbps Client/line card with G.709 FEC for STM-16 SFP transceiver
2.7 Gbps line transceivers for CMBR25 & TRP25_4
OTX27_AT Tunable 2.7 Gbps transceiver, transmitter type B (with G.709 FEC) and APD receiver
2.7 Gbps line transceivers for CMTR25
OTC25_PSxx 2.7 Gbps CWDM transceiver (with or without outband FEC), short haul with PIN receiver
OTC25_ALxx 2.7 Gbps CWDM transceiver (with or without outband FEC), long haul with APD receiver

OTR25_AVxx DWDM SFP: 2.5/2.7G transceiver 2400 ps/nm, channel xx, LC connectors
OTR25_ABxx DWDM SFP: 2.5/2.7G transceiver 3240 ps/nm, channel xx, LC connectors
10Gbps client side cards/transceivers for CMBR10, CMBR10_T, CMBR10_8D, TRP10_2B/LAN
OMS16_4T Client card for four SFP STM-16 modules with timing transparency for all clients for CMBR10_T
OMSC16_4 Client card for four SFP STM-16 modules for CMBR10
OMTX10_S Client card for STM-64/OC-192 XFP transceivers for TRP10_2B
OMTX10_LAN Client card for XFP 10 GBE LAN transceivers for TRP10_LAN
OMCD_8 Line and client card for 8 x GbE/FC/FICON to 10.7G combiner for CMBR10_8D
OTR103_SR 10G LAN 10GBASE-SR transceiver module, 850nm MM fiber, PIN receiver, 300m
OTR103_LR 10G LAN 10GBASE-LR transceiver module, 1310nm , PIN receiver, 10Km
OTR103_ER 10G LAN 10GBASE-ER transceiver module, 1550nm , PIN receiver, 40Km
OTR103_ZR 10G LAN 10GBASE-ZR transceiver module, 1550nm , APD receiver, 80Km
OTR64_I3 STM-64/OC-192 client transceiver XFP, 1310nm short reach, 2km
OTR64_S5 STM-64/OC-192 client transceiver XFP, 1550nm short reach, 40km
OTR64_L5 STM-64/OC-192 client transceiver XFP, 1550nm long reach, 80km
10.7 Gbps line cards/transceivers for CMBR10, CMBR10_D, TRP10_2B/LAN
OMTX10 10.7 Gbps line card with G.709 FEC
OMTX10_S 10.7 Gbps Line card for XFP transceivers
OMTX10_EF 10.7 Gbps line card with G.709 FEC/EFEC
OTX10_ALxx 10.7 Gbps transceiver, colored transmitter type L (with G.709 FEC) and APD receiver
OTR10T_AL Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709 FEC/EFEC) and APD
receiver
OTX10_ATR Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709 FEC/EFEC) and APD
receiver, RZ modulation.
Client SFP transceivers for CMBR25, CMBR10 & TRP25_4, CMTR25
OTGBE_SX Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber
OTGBE_LX Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber
OTGBE_ZX Optical GbE/FC/FICON transceiver, very long reach, 1550 nm single-mode fiber
OTGBE_S3BD Bi-directional GbE SFP with 1310nm TX/1490nm Rx. Short Range (10km)
OTGBE_L3BD Bi-directional GbE SFP with 1310nm TX/1490nm Rx. Long Range (40km)
OTGBE_L5BD Bi-directional GbE SFP with 1490nm TX/1310nm Rx. Long Range (40km)
OTR16_I3 STM-16/OC-48 transceiver, intra-office 1310 nm

OTR16_S3 STM-16/OC-48 transceiver, short-haul 1310 nm
OTR16_L3 STM-16/OC-48 transceiver, long-haul 1310 nm
10.7 Gbps line XFP transceivers for OMTX10_S
OTR10_ASxx 40 Km DWDM color XFP
OTR10_ALxx 80 Km DWDM color XFP
6.7.5.5 AoC Basecard Configurations
AoC 1 Basecard for multirate combiner or ADM on Card (requires two cards) supporting 8 SFP ports of
GbE, FC1/2, FICON, STM-16, OTU1
6.7.5.6 AoC Basecard Modules and Transceivers
10.7 Gbps line cards/transceivers for AoC
OMTX10 10.7 Gbps line card with G.709 FEC
OMTX10_S 10.7 Gbps Line card for XFP transceivers
OMTX10_EF 10.7 Gbps line card with G.709 FEC/EFEC
OTX10_ALxx 10.7 Gbps transceiver, colored transmitter type L (with G.709 FEC) and APD receiver
OTR10T_AL Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709 FEC/EFEC) and APD receiver
OTX10_ATR Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709 FEC/EFEC) and APD receiver,
RZ modulation.
Client SFP transceivers for AoC
OTGBE_SX Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber
OTGBE_LX Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber
OTGBE_ZX Optical GbE/FC/FICON transceiver, very long reach, 1550 nm single-mode fiber

OTR16_I3 STM-16/OC-48 transceiver, intra-office 1310 nm
OTR16_S3 STM-16/OC-48 transceiver, short-haul 1310 nm
6.7.5.7 TRP10_4 Basecard Configurations
TRP10_4M 1 Multiservice dual 10G Transponder card for 10G LAN, STM-64/OC-192 and FC10 services.
Optimized for metro DWDM Networks - 2 x XFP client and 2 x XFP line
TRP10_4R 1 Multiservice dual 10G Transponder card for 10G LAN, STM-64/OC-192 and FC10 services.
Optimized for LH DWDM Networks, 2 x XFP client and 2 x XFP-EL line
6.7.5.8 TRP40_2B and CMBR40B Configurations
TRP40_2B 2 40G DWDM tunable transponder card for STM-256/OC-768 services
CMBR40B 2 Multiservice 40G DWDM tunable combiner card for up to 4 XFP clients for OTU2/10G LAN,
STM-64/OC-192 services
6.7.5.9 TRP10_4 Basecard Transceivers
10Gbps client side cards/transceivers for TRP10_4M and 4R
OTR103_SR 10G LAN 10GBASE-SR/FC10 transceiver module, 850nm MM fiber, PIN receiver, 300m
OTR103_LR 10G LAN 10GBASE-LR/FC10 transceiver module, 1310nm , PIN receiver, 10Km
OTR103_ER 10G LAN 10GBASE-ER/FC10 transceiver module, 1550nm , PIN receiver, 40Km
OTR103_ZR 10 LAN 10GBASE-ZR/FC10 transceiver module, 1550nm , APD receiver, 80Km
OTR64_I3 STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1310nm short reach, 2km

OTR64_S5 STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1550nm short reach, 40km
OTR64_L5 STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1550nm long reach, 80km
Line/Client transceivers for TRP10_4M
OTC10_PSxx 40 Km CWDM XFP
OTC10_ALxx 80 Km CWDM XFP
OTR10_ASxx 40 Km DWDM color XFP
OTR10_ALxx 80 Km DWDM color XFP
OTR10_AT 80 Km DWDM 80 ch. tunable XFP
Line transceivers for TRP10_4R
OTR10_ELT 80 Km DWDM 80 channels tunable XFP-EL
6.7.6 OMCM25_4 STM-1/OC-3 SFP Optical Transceivers

SFP Transceiver Name OTR1_S3 OTR1_L3 OTR1_L5 OTR1_S3BD139 OTR1_S5BD140
Operating wavelength (nm) 1261-1360 1263-1360 1480-1580 Tx: 1260-1360 Tx: 1480-1580
Rx: 1480-1580 Rx: 1260-1360
TRANSMITTER
142
Min. side mode suppression ratio - 30 30 - -

(dB)
Min. mean launched power (dBm) -15 -5 -5 -14 -14
Max. mean launched power (dBm) -8 0 0 -8 -8
RECEIVER
Min. sensitivity (BER of 1*10-12) EOL -28 -34 -34 -28 -28
(dBm)
Min. overload (dBm) -8 -10 -10 -8 -8
139
The OTR1_S3BD can only operate opposite the OTR1_S5BD, and vice versa. Total link budget is according to OTR1_S3BD parameters.
140
The OTR1_S3BD can only operate opposite the OTR1_S5BD, and vice versa. Total link budget is according to OTR1_S3BD parameters.
141
142

SFP Transceiver Name OTR1_S3 OTR1_L3 OTR1_L5 OTR1_S3BD139 OTR1_S5BD140
Min. optical return loss of cable (dB) - - -20 - -
Max. discrete reflectance (dB) - - -25 - -
6.7.7 OMCM25_4 STM-4/OC-12 SFP Optical Transceivers

SFP Transceiver Name OTR4_S3 OTR4_L3 OTR4_L5
143
TRANSMITTER
144
Max. RMS width (nm) 4/2.5 - -
Max. -20 dB width (nm) - 1 <1
Max. mean launched power (dBm) -8 +2 +2
RECEIVER
Max. receiver reflectance (dB) - -14 -27
Min. optical return loss of cable (dB) - 20 24
Max. discrete reflectance (dB) - -25 -27
143
144

SFP Transceiver Name OTR4_S3 OTR4_L3 OTR4_L5

143
6.7.8 OMCM25_4 & AoC GbE/FC1 SFP Transceivers

Transmitter type GbE/FC/FICON GbE/FC/FICON GbE/FC/FICON Bidirectional Bidirectional Bidirectional Bidirectional

short-reach long-reach very SFP, 1310 nm SFP, 1490 nm SFP, 1310 nm SFP, 1490 nm
laser, 850 nm, laser, 1310 long-reach e
multimode nm, single laser, 1550
mode nm, single
mode
Data rate 1250 1250 1250 1250 1250 1250 1250

(nominal)
(MBaud)
Average launch -3 Max. -3 5 -3 Max. -3 +2 +2

power (dBm)
-9.5 Min. -11 0 -10 Min. -10 -5 -5
Min. transmitter 9 9 9 >9 >9 >9 >9

extinction ratio
(dB)
Data format 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B
Average receiver -20 Min. -22 -- < -21 < -21 < -23 < -23
sensitivity (dBm)
-21 Typical -25.5 -22 < -22 < -22 < -24 < -24
Max. receiver 0 0 0 0 0 -3 -3
overload (dBm)
Typical Rx LOS -24 -29 -25 -35 -35 -33 -33

level (dBm)
Connector LC LC LC LC LC LC LC
Fiber lengths 550 m 10 km 80 km 10 km 10 km 40 km 40 km

(50/62.5 µm (9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF)
MMF)

6.7.9 OMCM25_4 & AoC FC2G Client SFPs

SFP Transceiver Name OTR16_MM OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
145
APPLICATION CODE FC-200-M5/6-S I-16 S-16.1 L-16.1 L-16.2
N-1
TRANSMITTER
Source type MM SLM SLM SLM SLM
Max. -20 dB width (nm) - 2 1 1 <1
Min. side mode suppression (dB) - - 30 30 30
Min. mean launched power (dBm) -9.5 -10 -5 -2 -2
Max. mean launched power (dBm) -2.5 -3 0 +3 +3
Min. extinction ratio (dB) 9 8.2 8.2 8.2 8.2
RECEIVER
Min. sensitivity (BER of 1*10-12) EOL -13 -16 -18 -27 -28
(dBm)
Min. overload (dBm) 0 0 0 -9 -9
Max. dispersion [ps/nm] - - - - 1600
Min. optical return loss of cable (dB) -24 -24 -24 -24 -24
Max. optical path penalty (dB) - <1 1 1 2
145

6.7.10 10 Gbps Optical Client XFP Transceivers for

Transponders and CMBR40B
Transceiver OTR64_I3 OTR64_S5/OTR103_ER OTR64_L5/OTR103_ZR OTR103_SR OTR103_LR
Application code I-64.1 S-64.2b L-64.2a 10GBASE-SR 10GBASE-LR

P1I1_2D1 P1S1_2D2b P1L1-2D2 1200-SM-LL-L
VSR2000_2R1 10GBASE-ER
1200-SM-LL-I 1200-SM-LL-V
Source type SLM SLM SLM MLM SLM
Modulation External External External Direct Direct
Operating output 1290-1330 1529-1560 1530-1565 840-860 1290-1330

wavelength (nm)
Direct max. -20 dB <1 <1 <1 NA <1

width (nm)
Min. side mode 30 30 30 NA 30

suppression ratio (dB)
Min. mean launched -6 -1 0 -4 -8.2

power (dBm)
Max. mean launched -1 +2 +4 -1 +0.5

power (dBm)
Min. extinction ratio 6 8.2 9 3 6

(dB)
Maximum attenuation 4 11 22 4 4
(dB)
Minimum attenuation 0 3 11 0 0
(dB)
Max. dispersion 6.6 800 1600 NA 6.6

(ps/nm)
Minimum optical 24 24 24 12 12
return loss (dB)
Maximum discrete -27 -27 -27 -27 -27

reflectance
Maximum DGD (ps) 30 30 30 30 30
Sensitivity (BER of -11 -14 -24 -11 -12.6

1*10-12) (dBm)
Stressed (-7.5)

Transceiver OTR64_I3 OTR64_S5/OTR103_ER OTR64_L5/OTR103_ZR OTR103_SR OTR103_LR
Application code I-64.1 S-64.2b L-64.2a 10GBASE-SR 10GBASE-LR

P1I1_2D1 P1S1_2D2b P1L1-2D2 1200-SM-LL-L
VSR2000_2R1 10GBASE-ER
1200-SM-LL-I 1200-SM-LL-V
Maximum optical path 1 2 2 3.9 1

penalty
(Transmitter
and dispersion
penalty)
OCH switching time <3 <3 <3 <3 <3

(ms)
6.7.11 AoC/OMTR27_2 STM-16/OTU1 Client

CWDM DWDM
SFP TRANSCEIVER NAME OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5 OTC25_1PSx OTC25_1ALx OTR25_Avxx OTR25_ABxx
x x
146
APPLICATION CODE I-16 S-16.1 L-16.1 L-16.2 DW100S1D2 DW100L\--1
/5(C) D2/5(C)F
DW100S1A2 DW100C\--1
/5(C) A2/5(C)F
G.698.1/.2
Operating wavelength (nm) 1260-136 1260-136 1280-133 1500-158 1464-1618 1464-1618 15300-1565 1530-1565
0 0 5 0
TRANSMITTER
Max. -20 dB width (nm) 2 1 1 <1 1 1 0.4 0.4
Max. RMS width (nm) - - - - - - - -
Min. side mode suppression - 30 30 30 30 30 30 30

(dB)
Min. mean launched power -10 -5 -2 -2 0 0 0 0

(dBm)
Max. mean launched power -3 0 +3 +3 +5 +5 4 4

(dBm)
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2 8.2 8.2 8.2 8.2
RECEIVER
Min. sensitivity (BER of -16 -18 -27 -28 -21.5 -28 -28 -28
1*10-12) EOL (dBm)
(-23 GbE) (-32 GbE)
146

CWDM DWDM
SFP TRANSCEIVER NAME OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5 OTC25_1PSx OTC25_1ALx OTR25_Avxx OTR25_ABxx
x x
Min. overload (dBm) 0 0 -9 -9 0 -7 -9 -9
Max. receiver reflectance (dB) -27 -27 -27 -27 -27 -27 -27 -27
Max. dispersion [ps/nm] - - - 1600 800 1600 2400 3600

(40 km (80 km (120 km (180 km
G.652) G.652) G.652) G.652)
Min. optical return loss of -24 -24 -24 -24 24 24 -24 -24
cable (dB)
Max. discrete reflectance (dB) -27 -27 -27 -27 -27 -27 -27 -27
Max. optical path penalty (dB) <1 1 1 2 1.5 2.5 <3 <2
6.7.12 TRP10_4 CWDM OTU2 Line/Client STM-64/10G

LAN/FC10/OTU2 XFP Optical Transceivers and
CMBR40B Client Transceivers
Transceiver OTC10_PSxx147 OTC10_ALxx148
Application code
Source type SLM SLM
Modulation NRZ NRZ
Transmitter
1471 + 20m 1471 + 20m

Central wavelength (nm)
m=0 to 7 m=0 to 7
Maximum central frequency deviation (nm) ±6.5 ±6.5
Min. mean launched power (dBm) 0 0
Max. mean launched power (dBm) 4 4
Min. extinction ratio (dB) 8.2 8.2
147
CWDM client in TRP10_4/CMBR40 also supports 10GbE LAN and STM-64.
148

Transceiver OTC10_PSxx147 OTC10_ALxx148
Application code
Receiver
S-band, C-band -16 S-band, C-band -23

Sensitivity (BER of 1*10-12) (dBm)
L- band -15 L- band -21
Optical Path
Maximum discrete reflectance
Maximum DGD (ps)
OCH switching time (ms)
6.7.13 TRP10_4 OTU2/OTU2e/OTU2f Optical Transceivers

Transceiver OTR10_ELT OTR10_AT149
Application code
Source type SLM SLM
Modulation External, NRZ External, NRZ
Transmitter
192.05 + 0.05m 192.05 + 0.05m

m=0 to 79 m=0 to 79
Max. -20 dB width (nm) <1
Receiver
149
Not supported in CMBR40.

Transceiver OTR10_ELT OTR10_AT149
Application code
Optical Path
Maximum DGD (ps) 30 30
6.7.14 TRP10_4 OTU2/OTU2e Line, STM-64/10G LAN/FC10

Client, AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2
XFP Line Transceivers and CMBR40B Client
Transceivers
Transceiver OTR10_ALxx150 OTR10_ASxx151
Source type SLM SLM
Transmitter
192.1 + 0.1m 192.1 + 0.1m

m=0 to 40 m=0 to 40
Receiver
150
151

Transceiver OTR10_ALxx150 OTR10_ASxx151
Optical Path
Maximum DGD (ps) 30 30
6.7.15 AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2 Line

Transceivers
Transceiver OTR10T_AL OTX10_ATR
Source type SLM SLM
192.05 + 0.05m 192.05 + 0.05m

m=0 to 79 m=0 to 79
Maximum central frequency deviation (GHz) ±2.5 ±5
Modulation External, NRZ External, RZ
Spacing (GHz) 50 50
Min. mean launched power (dBm) +4 +1
OCH switching time (ms) <3 <3

6.7.16 STM-16/OTU1 Optical SFP Line Transceivers for

OMTR27_2 & OMCM25_4
CWDM line transceivers DWDM line transceivers Continuous client transceivers152
OTC25_1PSxx153 OTC25_1ALxx OTR25_AVxx OTR25_ABx OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5

G.695154 x
G.695
Application code S-C8S1-1D2/5 S-C8L1-1D2/5 DW100S\-1 DW100L\-- P1I_1D1 P1S1_1D1 P1L1_1D1 L-16.2
D2/5(C) 1D2/5(C)F
DW100S\-1 DW100C\--
A2/5(C) 1A2/5(C)F
G.698.1/.2
Operating output 1464-1618 1464-1618 1530-1565 1530-1565 1285-1330 1285-1330 1280-1335 1500-1580
wavelength (nm)
Spacing (nm) 20 20 100 100 NA NA NA NA
Minimum side mode 30 30 30 30 30 30 30 30

suppression ratio
(dB)
Mean launched 0 0 0 0 -9.5 -5 -2 -2

power (min.) (dBm)
Mean launched +5 +5 4 4 -3 0 +3 +3
power (max.) (dBm)
Min. extinction ratio 8.2 8.2 8.2 8.2 8.2 8.2 8.2 8.2
(dB)
Sensitivity (BER of -21.5 -28 -28 -28 -18 -18 -27 -28
1*10-12) (dBm)
(-23 GbE) (-32 GbE) (-22 GbE) (-22 GbE) (-30 GbE) (-30 GbE)
Max. dispersion 800 1600 2400 3600 - - - 1600

(ps/nm)
(40 km G.652) (80 km G.652) (120 km (180 km
G.652 G.652)
Max. optical path 1.5 2.5 <3 <2 <3 <1 1 2

penalty (dB)
OCH switching time <3 <3 <3 <3 <3 <3 <3 <3
(ms)
152
Continuous transceiver (50 Mbps to 2.7 Gbps) including STM16 and OTU1.
153
Continuous transceiver (100 Mbps to 2.7 Gbps), xx designates the transceiver's wavelength in nm.
154
Continuous transceiver (100 Mbps to 2.7 Gbps), xx designates the transceiver's wavelength in nm.

6.7.16.1 TRP25_2 2.5 Gbps optical transmitters/receivers for

transponders, and transceivers for combiners
Each TRP25_2 basecard can accommodate any combination of two optical transmitters and receivers.
OMT25_T
+
OMR25C_A/
[OTX27_AT]155
Source type SLM
Operating output wavelength (nm) 1529-1560
Modulation EA156
Spacing (GHz) 100/50157
Max. dispersion (ps/nm) 3400

(200 km)
[>18000/1000 km]
Min. side mode suppression ratio (dB) 30
Min. mean launched power (dBm) +. 05 [+5.5]
Max. mean launched power (dBm) +5 [+7]
Min. extinction ratio (dB) 8.2
Sensitivity (BER of 1*10-12) (dBm)158 -30
Min. overload (dBm) -8
OCH switching time (msec) <3
6.7.16.2 TRP40_2B, CMBR40B Line Transceiver
Transceiver
Application code P1S1-3C2

P1S1-3C3
P1S1-3C5
Source type SLM
155
Data between square brackets corresponds to transceiver [OTX27_AT].
156
EA: External Absorption.
157
Spacing is 50 GHz for the OMT25_T only.`
158
Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC improvement of over 4 dB is typical.

Transceiver
Central frequency (THz) 192.05 + 0.05m

m=0 to 79
Maximum central frequency deviation (GHz) ±2.5
Modulation RZ-DQPSK
Spacing (GHz) 50
Min. mean launched power (dBm) +2
Max. mean launched power (dBm) +4
Min. extinction ratio (dB) 13
Sensitivity (BER of 1*10-12) (dBm) -18
Maximum optical path penalty 2
6.7.16.3 TRP40_2B Client Transceiver
Transceiver
Application code VSR2000-3R2

VSR2000-3R3
VSR2000-3R5
Source type SLM
Modulation External
Direct max. -20 dB width (nm) <1
Min. mean launched power (dBm) 0
Min. extinction ratio (dB) 8.2
Maximum attenuation (dB) 4
Minimum attenuation (dB) 0

Transceiver
Minimum optical return loss (dB) 24
Maximum discrete reflectance -27
Maximum DGD (ps) 7.5
Min. overload (dBm) +3
6.7.17 OTU-2/OTU-2e/OTU-2f XFP tunable optical

transceivers
Transceiver OTR10T_AL
Multi-rate OTU-2/e/f
Source type SLM
Transmitter
191.70 + 0.05m
Central wavelength (nm)
m=0 to 87
Maximum central frequency deviation (nm) ±2.5
Min. mean launched power (dBm) -1
Min. extinction ratio (dB) 9
Receiver
Optical Path
Maximum discrete reflectance -27
Max. DGD (ps) 30

Transceiver OTR10T_AL
Multi-rate OTU-2/e/f
6.7.18 Optical Amplifiers

Card/Module Width (slots) Function/Description
IO Cards cage
OFA2_I29I29C 1 Two inline amplifiers with a gain of 29 dB for the C band in a single-slot card
OFA2_I29C 1 One inline amplifier with a gain of 29 dB for the C band in a single-slot card
OFA2_I23I23C 1 Two inline amplifiers with a gain of 23 dB for the C band in a single-slot card
OFA2_I23C 1 One inline amplifier with a gain of 23 dB for the C band in a single-slot card
OFA2_I23I29C 1 Two inline amplifiers with a gain of 23 dB and 29 dB for the C band in a single-slot card
OFA_RM 2 High-power 500 mW RAMAN amplifier for long spans, reverse pumped configurations
OFA_HRM 2 High-power 700 mW RAMAN amplifier for long spans, in reverse pumped
configurations
CCP Module cage
MO_BAC 1 Optical booster for the C band
MO_PAC 1 Optical preamplifier for the C band
MO_BAS 1 Single-channel optical booster for the C band
MO_PAS 1 Single-channel optical preamplifier for the C band
MO_OFA_PHBC 1 High-power dynamic booster and pre-amplifier in E/W configuration for extended
long-haul metro applications. Optimized for ROADM sites.
MO_OFA_HBC 1 High-power dynamic booster for extended long-haul metro applications.
MO_OFA_PC 1 15 dBm dynamic gain pre-amp amplifier. CCP Card
MO_OFA_FBC 1 20 dBm fixed gain booster
MO_OFA_M 1 High-power dynamic multistage amplifier for extended long-haul and metro
applications
MO_OFA_MH 1 High power (23 dBm) regional amplifier for high capacity applications
MO_OFA_MHe 1 High power (23 dBm) regional amplifier for high capacity applications, E/W
configuration
MO_OFA_FHBC 1 High power (21 dBm) fixed gain booster amplifier with built-in output OSC filter

6.7.18.1 OFAs for single channel and DWDM applications
OFA2_I23C/ OFA2_I29C/
OFA2_I23I23C OFA2_I29I29C
(Inline159) (Inline160)
Max. total power (dBm) +16 +16
Gain (dB) Typ. 21161 Typ. 27162
Spectrum (nm) 1529-1561 1529-1561
Gain flatness (dB) < ±1 < ±1
Noise figure (dB) < 6163 < 6164
In/out isolation (dB) > 40 > 40
Return loss (dB) < 40 < 40
Power consumption (Watt) 13 13

(for OFA2_ (for OFA2_I29C)
I23C)
Power consumption of two amplifiers (Watt) 21 21

(for OFA2_ (for OFA2_
I23I23C) I29I29C)
159
Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in XDM-500, XDM-1000, and
XDM-2000 shelves, the site can be upgraded to a fully functional OADM site.
160
Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in XDM-500, XDM-1000, and
XDM-2000 shelves, the site can be upgraded to a fully functional OADM site.
161
Rating does not include the attenuation introduced by the built-in VOA.
162
Rating does not include the attenuation introduced by the built-in VOA.
163
Does not include the effect introduced by the built-in VOA.
164
Does not include the effect introduced by the built-in VOA.

6.7.18.2 RAMAN and very high power EDFA amplifiers
OFA_RM165 OFA_HRM166 RM_OFA_HBR/FBR RM_OFA_VHB
Max. total power (dBm) +27 +28.5 +30 +30
Gain (dB) 6-15167 10-20168 10-20169 14-24
Spectrum (nm) 1529-1561 1529-1561 1529-1564 1536-1562
Gain flatness (dB) < ±0.6 < ±0.65 < ±1 < ±0.75
Noise figure (dB) < -0.5 < -1.5 <0 <9
In/out isolation (dB) > 40 > 40 > 40 > 45
Return loss (dB) < 40 < 40 < 40 < 40
6.7.18.3 CCP Cage OFAs DWDM Applications
MO_OFA_FBC MO_OFA_PHBC/ MO_OFA_PHBC MO_OFA_ MO_OFA_M MO_OFA_FH MO_OFA_MHe

(Booster) MO_OFA_HBC MO_OFA_PC MH BC
(Booster) (Pre-amp)
Max. total power +20 +20 +15 +23 +20 +21 +23
(dBm)
Gain (dB) 10 to 25 10 to 25 12-27 17-41 17-39 10-23 17-40
Spectrum (nm) 1529-1561 1529-1561 1529-1561 1529-1561 1529-1561 1529-1561 1529-1561
Gain flatness (dB) < ±0.75 < ±0.6 < ±0.6 < ±0.75 < ±0.75 < ±0.5 < ±0.5
Noise figure (dB) < 6.5 + (25 - <9 <6 <7 < 6.5 < 6.5 + < 6.3 Gain >30
Gain) (23-Gain)
Gain >17 Gain >19 Gain >26 Gain >25 < 6.9 Gain >26
< 14 Gain >17 < 12.5 Gain
>17 < 13.5 Gain >17
< 21 Gain 10
< 19.5 Gain
10
In/out isolation > 30 > 40 > 40 > 40 > 40 > 40 > 40

(dB)
Return loss (dB) > 45 < 40 < 40 < 40 < 40 < 45 < 45
165
Not supported in XDM-40.
166
167
Depends on type of fiber. Actual gain is heavily dependent on splice quality and actual attenuation of fiber and can be drastically affected.
168
169

6.7.18.4 CCP Cage OFAs for Single-Channel Applications
MO_PAS MO_BAC MO_PAC

MO_BAS (Booster) (Booster)
(Preamplifier) (Preamplifier)
Max. total power (dBm) +15 +12 +17 +12
Gain (dB) Up to 16 Up to 30 Up to 18 Up to 32
Spectrum (nm) 1529-1561 1529-1561 1529-1561 1529-1561
< 5.5 at Pin –38 dBm < ±1 < ±1

Output power deviation
< ±1 < 2.5 at Pin –26 dBm
(dB)
< 1.0 at Pin –14 dBm
Noise figure (dB) < 6.5 < 5.5 <9 < 5.5
In/out isolation (dB) > 40 > 40 > 40 > 40
Return loss (dB) < 40 < 40 < 40 < 40
6.7.19 Optical Auxiliary Cards and Modules

Card/Module Function/Description
Cards cage cards
AUX-2I Auxiliary basecard installed in a single I/O slot. Each basecard accommodates any two of the
modules listed below.
AUX-2X Auxiliary basecard installed in either the X1 or X2 slot. Each basecard accommodates any
two of the modules listed below.
Modules
OM_4SP50 Four 50/50 splitters
OM_2COSC5 2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory channel
OM_2COSC5_RB 2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory channel, and 2 x red/blue
filters
OM_2COSC5_SP95 2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory channel, and 2 x 95/5
splitters
OM_2LCOSC5 2 x C/L/T filters (mux + demux) for the 1510 nm supervisory channel, including provision for
the L band
OM_2SP95 2 x 95/5 splitters
OM_2RB 2 x red/blue filters
OM_2VOA 2 x controlled variable optical attenuators for OADM-V implementation
OM_2COSC3 2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory channel
OM_2COSC3_RB 2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory channel, and 2 x red/blue
filters

OM_2COSC3_SP95 2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory channel, and 2 x 95/5
splitters
CCP module cage modules (single slot)
MO_ACC6CP Six couplers
MO_ACC6SP50 Six 50/50 splitters
MO_ACC6SP95 Six 95/5 splitters

170
MO_ACC4COSC5 Four C/T filters
MO_ACC6CPSP Six 50/50 splitters + six 50/50 couplers, Single-mode fiber
MO_ACC6CPSP5 Six 50/50 splitters + six 50/50 couplers, multi-mode fiber 50 μm
MO_ACC6CPSP6 Six 50/50 splitters + six 50/50 couplers, multi-mode fiber 62.5 μm
171
MO_ACC4CLOSC5 Four C/L/T filters
MO_ACC4COSC3 Four supervisory 1310 nm modules
MO_ACC4RB Four red/blue filters
6.7.20 Optical Auxiliary Cards for XDM-450

ACC4COSC5 Four C/T filters
6.7.21 DCF/DCM Units

Unit Function/Description
DCF-40-LF Dispersion compensation fiber for 160 ps/nm (40km LEAF)
DCF-40-TW Dispersion compensation fiber for 180 ps/nm (40km TrueWave)
MO_DCM-Lxx Single-channel dispersion compensation module for 700 ps/nm for channel "xx" for modules cage
MO_DCM-Vxx Single-channel dispersion compensation module for 1400 ps/nm for channel "xx" for modules cage
MO_DCM-Xxx Single-channel dispersion compensation module for 1600 ps/nm for channel "xx" for modules cage
170
171

6.7.22 Rack Mounted Single Channel DCM Units

Unit Function/Description
RM_DCM2 Rack-mounted tray for up to two single-channel dispersion compensation modules as detailed below
DCM-Lxx Single-channel dispersion compensation module for 700 ps/nm for channel "xx" for rack-mounted tray
DCM-Vxx Single-channel dispersion compensation module for 1400 ps/nm for channel "xx" for rack-mounted
tray
DCM-Xxx Single-channel dispersion compensation module for 1600 ps/nm for channel "xx" for rack-mounted
tray
6.7.23 Auxiliary Cards and Miscellaneous Accessory Modules

Module type Insertion loss (dB)
OM_ACC4SP50/ MO_ACC6SP50 4
OM_ACC2SP95/ MO_ACC4SP95 0.65
OM_2RB/ MO_ACC4RB Mux Red 0.7 Blue 1.2
Demux Red 1.2 Blue 0.7
OM_2COSC3/ MO_ACC4COSC3 Mux/demux C band 1.2 OSC 1310 nm 1.2
OM_2COSC5/ MO_ACC4COSC5 Mux C band 0.6 OSC 1510 nm 0.9
Demux C band 0.9 OSC 1510 nm 1.7
OM_2LCOSC5/MO_ACC4CLOSC5 Mux/demux C band 1.1 L band 1.6 OSC 1510 nm 2.0
DCF-40-LF 4.8
DCF-80-LF 6.5
DCF-120-LF 8.2
DCF-40-TW 3
DCF-80-TW 4
DCF-120-TW 5
MO_DCM_L_xx/ DCM_L_xx 3.5
MO_DCM_V_xx/ DCM_V_xx
MO_DCM_X_xx/ DCM_X_xx

6.7.24 Other Optical Cards

OPM 1 Optical performance monitoring card for four fiber monitoring points
OMSP 1 Optical MS protection card
6.7.24.1 OPM Card Specifications
Wavelength range 1529-1562 nm
Power range -50 to +5 dB
OSNR range 0 to 30 dB
6.7.24.2 OMSP Card Specifications
Insertion loss through two cards < 3 dB
Switching time < 4 ms
6.8 C Band Channel Frequencies and Wavelengths

(ITU-T Rec. G.694.1 for DWDM)
ITU-T Channel center Channel center 200 GHz channel 100 GHz channel spacing 50 GHz channel spacing
channelnum frequency (THz) wavelength (nm) spacing
ber
8 ch. 16 ch. 16 ch. 32 ch. 40 ch. 44 ch. 88 ch.
17 191.70 1563.86  
17.5 191.75 1563.46 
18 191.80 1563.05  
18.5 191.85 1562.65 
19 191.90 1562.24  
19.5 191.95 1561.84 
20 192.00 1561.44  
20.5 192.05 1561.01 
21 192.10 1560.61       
21.5 192.15 1560.20 
22 192.20 1559.79     

ber
8 ch. 16 ch. 16 ch. 32 ch. 40 ch. 44 ch. 88 ch.
22.5 192.25 1559.39 
23 192.30 1558.98       
23.5 192.35 1558.58 
24 192.40 1558.17     
24.5 192.45 1557.77 
25 192.50 1557.36       
25.5 192.55 1556.96 
26 192.60 1556.55     
26.5 192.65 1556.15 
27 192.70 1555.75       
27.5 192.75 1555.34 
28 192.80 1554.94     
28.5 192.85 1554.54 
29 192.90 1554.13       
29.5 192.95 1553.73 
30 193.00 1553.33     
30.5 193.05 1552.93 
31 193.10 1552.52       
31.5 193.15 1552.12 
32 193.20 1551.72     
32.5 193.25 1551.32 
33 193.30 1550.92       
33.5 193.35 1550.52 
34 193.40 1550.12     
34.5 193.45 1549.72 
35 193.50 1549.32       
35.5 193.55 1548.91 
36 193.60 1548.51     
36.5 193.65 1548.11 
37 193.70 1547.72    
37.5 193.75 1547.32 
38 193.80 1546.92   

ber
8 ch. 16 ch. 16 ch. 32 ch. 40 ch. 44 ch. 88 ch.
38.5 193.85 1546.52 
39 193.90 1546.12    
39.5 193.95 1545.72 
40 194.00 1545.32   
40.5 194.05 1544.92 
41 194.10 1544.53  
41.5 194.15 1544.13 
42 194.20 1543.73  
42.5 194.25 1543.33 
43 194.30 1542.94  
43.5 194.35 1542.54 
44 194.40 1542.14  
44.5 194.45 1541.75 
45 194.50 1541.35  
45.5 194.55 1540.95 
46 194.60 1540.56  
46.5 194.65 1540.16 
47 194.70 1539.77  
47.5 194.75 1539.37 
48 194.80 1538.98  
48.5 194.85 1538.58 
49 194.90 1538.19  
49.5 194.95 1537.79 
50 195.00 1537.40  
50.5 195.05 1537.00 
51 195.10 1536.61  
51.5 195.15 1536.22 
52 195.20 1535.82  
52.5 195.25 1535.43 
53 195.30 1535.04  
53.5 195.35 1534.64 
54 195.40 1534.25  

ber
8 ch. 16 ch. 16 ch. 32 ch. 40 ch. 44 ch. 88 ch.
54.5 195.45 1533.86 
55 195.50 1533.47  
55.5 195.55 1533.07 
56 195.60 1532.68  
56.5 195.65 1532.29 
57 195.70 1531.90  
57.5 195.75 1531.51 
58 195.80 1531.12  
58.5 195.85 1530.72 
59 195.90 1530.33  
59.5 195.95 1529.94 
60 196.00 1529.55  
60.5 196.05 1529.15 
6.9 CWDM Frequencies and Wavelengths (ITU-T

Rec. G.694.2 for CWDM)
1471 
1491 
1511  
1531  
1551  
1571  
1591 
1611 


This section describes the physical specifications of the product.
XDM-40 256 x 447 x 285 mm (10.08 x 17.60 x 11.22 in)
XDM-450 374 x 492 x 275 mm (14.72 x 19.37 x 10.82 in)
XDM-500 725 x 450 x 285 mm (28.54 x 17.72 x 11.22 in)
XDM-1000 1100 x 450 x 285 mm (43.31 x 17.72 x 11.22 in)
XDM-2000 775 x 450 x 285 mm (30.51 x 17.72 x 11.22 in)
XDM-3000 1550 x 492.5 x 350 mm (61 x 19.39 x 13.78 in)
MECP 120 x 50 x 225 mm (4.72 x 1.97 x 8.86 in)
xMCP 265 x 25 x 225 mm (10.43 x 0.98 x 8.86 in)
HLXC192/384/768, XIO, SIO, PIO, DIO, ACP1000, 415 x 25 x 225 mm (16.34 x 0.98 x 8.86 in)
ATS and cards cage mux/demux, OADM,
transponder, OFA, OPM, DIOB, MCS5, MCS10
Modules cage connection modules (electrical), 265 x 40 x 175 mm (10.43 x 1.57 x 6.89 in)
mux/demux, OADM, OFA
HLXC1536 550 x 48 x 255 mm (21.65 x 1.89 x 10.04 in)
ACP3000 116.5 x 38 x 220 mm (4.59 x 1.5 x 8.66 in)
xRAP (optional) 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
miniRAP (optional) 90 x 445 x 150 mm (3.54 x 17.53 x 5.9 in)
PRAP (optional) 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
Heat buffer 125 x 450 x 285 mm (4.92 x 17.72 x 11.22 in)
Racks 2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)

2134 x 584 x 305 mm (82 x 23 x 12 in)

6.10.2 Weight
XDM-40 7.5 kg (16.54 lbs)
XDM-40 fully populated 16 kg (35.28 lbs)
XDM-450 11.8 kg (26 lbs)
XDM-500 20 kg (44.09 lbs)
XDM-1000 25 kg (55.12 lbs)
XDM-2000 20 kg (44.09 lbs)
XDM-3000 50 kg (110.23 lbs)
XDM-3000 fully populated 180 kg (284 lbs)
6.10.3 Floor Loading

Floor loading of fully equipped rack 7.35 kn/m2
6.10.4 Power
This section describes the power requirements, power supply, power consumption and heat dissipation of
the product.
6.10.4.1 Power requirements
Applicable specifications ETSI 300 132-2; FTZ 19FS1
Input voltage -40 V DC to -75 V DC
Nominal power source -60 V or -48 V BTNR 2511

6.10.4.2 Power Supply Lines Surge Voltage
Applicable specification EN61000-4-5:1996
Line to line maximum surge voltage 2000 V
Line to ground maximum surge voltage 4000 V
6.10.4.3 Power consumption
XDM-40 Typical 380 W, maximum 450 W

172
6.10.4.4 Main equipment power consumption

capabilities.
NOTE: The listed power requirements do not include the power required by modules that
may be installed on the card.
Common cards xMCP 40 W
xMCP-B 20 W
MECP 15 W
MECP_OSC 20 W
HLXC192/HLXC384 90 W
HLXC768 140 W
HLXC1536 670 W
XIO192 68 W
XIO384F 127 W (without optical module)
172
Depending on shelf revision.

xFCU 14 W
xFCU-H 35 W
FCU3000 350 W
xFCU450 50 W
xINF450 50 W
xINF/xINF-H 8W
INF3000 64 W
PDH cards PIO2_84 45 W
PIO2_84F 33 W
M2_84 (all versions) 3W
PIO345_16 (all versions) 80 W
M345P_16P 10 W
M345_16 3W
M345_8 2W
STM1 and STM4 cards SIO1&4 48 W
SIO1&4B 86 W
OMS01_4 4W
OM01_4 4W
OMS04_1 1W
OM04_1 1W
M1_8 5W
M1_16 5W
M1_16P 3W
STM16 cards SIO16_2 60 W
SIO16_2B 83 W
SIO16_4B 96 W
OM16_1SFP Per specs
OMSC16_4 10 W
OM16_1 20 W
STM64 cards SIO64_1, SIO64_1M 125 W
SIO64_1-MF 135 W
SIO64B 106 W

SIO164 80 W
SIO164 OMSC16_4 83 W
SIO164 OMTX10 82 W
OMTX10_EF 15.5 W
OM10_1 10 W
OM64_1, OM10_1xx 18 W
DIO DIO (all versions) 57 W
DIO1_40R 64 W
DMGE_2 7W
OMGE_1SX 1W
DM16_1 4W
DOM16_I3 1W
MCS MCS5 100 W
MCS10 115 W
MCS30_X10G 125 W
MCS50_X10G 130 W
ME16 18 W
ME_12 13 W
ATS ATS 48 W
ROADM MO_ROADM8/E/I/D 15.5 W
MO_ROADM8A 25 W
MO_ROADM8A_50 25 W
MO_ROADM2A 24 W
MO_ROADM2A_50 24 W
MO_ROADM40/E 40 W
CCP OADM modules MO_CW2 4.5 W
OM_CWM8C 4.8W
OM_CWD8C 5.8 W
OM_CWMD4C 4.8 W
OM_CWMD4CE 4.8 W
OM_CWMD4SL 4.8 W
OM_COADM1AB 4.8 W

OM_COADM2AB 4.8 W
OM_OADM4GEW 5W
I/O OADM modules OADM4_EW 5W
OM_AD4RQEWxx 5W
Optical DWDM cards for X1/X2 slots DW16MVDRE 15 W
DWDM modules MO_DW16MDR-AVAV 10 W
MO_DW16MDRE-AVAV 10 W
MO_DW16MDB-AVAV 10 W
MO_DW16MDR-SAV 4.8 W
MO_DW16MDRE-SAV 4.8 W
MO_DW16MDB-SAV 4.8 W
MO_DW40MC-S 1W
MO_DW40MC-A 4.8 W
MO_DW40DC-A 4.8 W
MO_DW40VMD/E/I 47 W
AUX cards AUX_2IO 15 W
AUX_2X 15 W
Each Plug-in 1W
OPM OPM 15 W
OMSP OMSP 10 W
Accessory module Each MO_ACC 1W
Miscellaneous and Pluggable modules OTX10_ALxx 15 W
OTR103_SR/LR/ER, OTR64_PI3/PS5/AL5 3.5 W
OTR10T_AL 15 W
OTR10_ELT 7W
OTR10_ALxx/ASxx 3.5 W
OTC10_ALxx/PSxx 3.5 W
OTR25_AVxx/ABxx 2W
OTC25_ALxx/PSxx 1.5 W
OTR10_AT 3.5 W
OTR1_S3/L3/L5 1W
OTR4_S3/L3/L5 1W

OTR16_I3/S3/L3/L5 1W
OTGBE_SX/LX/ZX 1W
OTX27_AT 4W
6.10.4.5 Heat dissipation
XDM-500 Typical 2720 Btu/hr, maximum 3400 Btu/hr

This section describes the environmental conditions required for the operation, storage, handling and
transportation of the product.
6.11.1 Operation
Applicable specification ETSI-300-019-1-3 Class 3.1
6.11.2 Storage (Packed)



6.12 EMC
Applicable specifications EMC directive 89/336, (including EN 300 386-2: 1997, Class B, emission and immunity
requirements)
6.13 Safety
Applicable specifications EN 60950 edition 2 (including A1/1992, A2/1993, A3/1995, A4/1996); EN 41003
CE safety LVD directive 73/23/EEC
6.13.1 Laser Safety

Applicable specification EN 60825-1&2 (including A1/1997) (AS/NZS 2211.2)

The XDM platform complies with NEBS regulations for EMC and Safety, including GR-1089-CORE Issue 1,
October 1995 and GR-63-CORE Issue 2, December 1997 with Revision 1, February 1999 (Level 3).
6.14 Reliability
This section describes the reliability of the <product1/product2> platform with respect to the product life
and service availability.
6.14.1 Life
6.14.2 Availability
Availability of service for an end-to-end service trail passing better than 99.999%
through a protected SDH/SONET network

6.15 Management Specifications

LightSoft server and client for managing all ECI on SUN workstation(s)
equipment
EMS-XDM on SUN workstation

OverHead Access (OHA) and external alarms; orderwire; RAP.

Alarm concept G.783
Alarm types LED indicators, dry contacts, audible alarms (per subrack)
6.16 Other Specifications

Cross-connect levels VC-4nc, VC-4, VC-3, VC-2, VC-12
6.16.2 Cross-Connect Capacity

SDH/SONET switch core options 192/384/768 x STM-1 with cross-connect capability of 4/3/2/1
SONET switch core options 576/1152 STS-1

6.16.3 Traffic Protection

SNCP I/N LO, HO, UPSR within 30 ms
MSP less than 50 ms
MS-SPRing
OCH 1 + 1 within 5 ms
Optical line protection (OPL) within 5 ms
OMSP
6.16.4 Redundancy
Switching matrix, power system, internal buses, 1+1 duplicated

external buses
I/O electrical modules protection 1: N (N=1 to 10)
6.16.5 Synchronization
The XDM supports four timing references, which can be selected from multiple timing sources, including:
 From any PDH/Async tributary interface
 From any SDH/SONET line173
 External 2 MHz and 2 Mbps/1.5 Mbps timing outputs (two T3 ports per shelf)
 G.813 internal clock.
6.16.6 Jitter and Wander

173
The XDM uses the original Synchronization Status Marker (SSM) byte from SDH/SONET tributary/aggregate lines and transmits it over
SDH/SONET lines.

7 Standards and References
The following is a list of standards and reference documents that relate to the XDM platform product line.
The standards are listed alphabetically by groups.
7.1 Broadband Forum

 Af-phy-0064.000 – ATM Forum E1 Physical Layer Interface.
 Af-phy-0086.000 – ATM Forum IMA V1.0.
 Af-phy-0086.001 – ATM Forum IMA V1.1.
 Af-phy-00121.00 – ATM Forum Traffic Management Specifications V4.1.
7.2 Environmental Standards

 EuP Directive 2005/32/EC: Ecodesign Requirements for Energy-Using Products.
 OHSAS 18001: Occupational Health and Safety Management Systems - Requirements.
 REACh Directive 2005/32/EC: Registration, Evaluation, Authorization, and Restriction of Chemicals.
 RoHS Directive 2005/747/EC: Restriction of the Use of Certain Hazardous Substances in Electrical and
Electronic Equipment.
 WEEE Directive 2002/96/EC: Waste from Electrical and Electronic Equipment.
7.3 ETSI: European Telecommunications

Standards Institute
 EN 300 019-1-1 Class 1.2: Environmental Engineering (EE); Environmental Conditions and
Environmental Tests for Telecommunications Equipment; Part 1-1: Classification of Environmental
Conditions; Storage.
Conditions; Transportation.
 EN 300 019-1-3 Classes 3.2 and 3.3: Environmental Engineering (EE); Environmental Conditions and
Conditions; Stationary use at weather-protected locations.
Environmental Tests for Telecommunications Equipment; Part 2-4: Specification of Environmental
Tests; Stationary use at non-weather-protected locations.
 EN 300 132 -2: Environmental Engineering (EE); Power Supply Interface at the Input to
Telecommunications Equipment.
 EN 300-166: Physical and electrical characteristics of hierarchical digital interfaces for equipment
using the 2 048 kbit/s based plesiochronous or synchronous digital hierarchies.

XDM® System Specifications Standards and References
 EN 300 386: Electromagnetic compatibility and Radio spectrum Matters (ERM); Telecommunication
network equipment; Electromagnetic Compatibility (EMC) requirements.
 EN 300-417-2-1: Transmission and Multiplexing (TM); Generic requirements of transport functionality
of equipment.
 EN 300-417-5-1: Generic requirements of transport functionality of equipment.
 EN 300-462-5-1: Transmission and Multiplexing (TM); Generic requirements for synchronization
networks.
 EN 300-689: 34 Mbit/s digital leased lines (D34U and D34S); Terminal equipment interface.
 EN 301-164: SDH leased lines connection characteristics.
 EN 301-165: SDH leased lines Network and Terminal interface presentation.
 EN 55022: Radio Disturbance Characteristics of Information Technology Equipment.
 ETR 114: Functional Architecture of SDH Transport Networks.
 ETR 275: Considerations on Transmission Delay and Transmission Delay value for components on
connections supporting speech communication over evolving digital networks.
 FTZ 1TR9: Deutsche Telekom A.G. EMC Requirements.
 FTZ 153 TL 1part 1: Synchronous Multiplexing Equipment (SM) for Synchronous Multiplex Hierarchy.
7.4 IEC: International Electrotechnical

Commission
 IEC 68: Environmental Testing.
 IEC 917: Modular Order for the Development of Mechanical Structures for Electronic Equipment
Practices.
 IEC 3309: Information Technology – Telecommunications and Information Exchange between Systems
– High-Level Data Link Control (HDLC) Procedures – Frame Structure.
 IEC 9314-3: Information Processing Systems - Fiber Distributed Data Interface (FDDI) Multiplex.
 IEC 9595, Information Technology: Open Systems Interconnection, Common Management
Information Services.
 IEC 9596, Information Technology: Open Systems Interconnection, Common Management
Information Protocol.
 IEC 13239: Information technology — Telecommunications and information exchange between
systems — High-level data link control (HDLC) procedures.
 IEC 17025: General Requirements for Competence of Testing and Calibration Laboratories.
 IEC 60825-1: Safety of Laser Products – Part 1: Equipment Classification and Requirements.
 IEC 60825-2 (AS/NZS 2211.2): Safety of Laser Products – Part 2: Safety of Optical Fiber Communication
System (OFCS).
 IEC/EN/UL 60950-1: Information Technology Equipment - Safety - General Requirements.
 IS 1249-1: Safety of Laser products: Equipment classification requirements and users guide.

7.5 IEEE: Institute of Electrical and Electronic

Engineers
 IEEE 802.1ad: Virtual Bridged Local Area Networks—Revision—Amendment 4: Provider Bridges.
 IEEE 802.1ag: Virtual Bridged Local Area Networks Amendment 5: Connectivity Fault Management.
 IEEE 802.1D: Media access control (MAC) Bridges (Incorporates IEEE 802.1t and IEEE 802.1w).
 IEEE 802.1P: Traffic Class Expediting and Dynamic Multicast Filtering.
 IEEE 802.1Q: Virtual Bridged Local Area Networks—Revision.
 IEEE 802.1w: Rapid Reconfiguration of Spanning Tree.
 IEEE 802.3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and
Physical Layer Specifications.
 IEEE 802.3ad: Link Aggregation.
 IEEE 802.3ah: Ethernet in the First Mile (Link OAM).
 IEEE 802.3x: Full Duplex Operation and Flow Control Protocol.
7.6 IETF: Internet Engineering Task Force

 RFC 1493: Definition of Managed Objects for Bridges.
 RFC 1643: Ethernet-like Interfaces.
 RFC 1662: PPP in HDLC-Life Framing.
 RFC 1757: Remote Network Monitoring Management Information Base.
 RFC 1823: LDAP Application Program Interface (API).
 RFC 1901: Introduction to Community-based SNMPv2.
 RFC 2108: Definitions of Managed Objects for IEEE 802.3 Repeater Devices using SMIv2.
 RFC 2251: Lightweight Directory Access Protocol (v3) [specification of the LDAP on-the-wire protocol].
 RFC 2252: Lightweight Directory Access Protocol (v3): Attribute Syntax Definitions.
 RFC 2253: Lightweight Directory Access Protocol (v3): UTF-8 String Representation of Distinguished
Names.
 RFC 2254: The String Representation of LDAP Search Filters.
 RFC 2255: The LDAP URL Format.
 RFC 2256: A Summary of the X.500(96) User Schema for use with LDAPv3.
 RFC 2401: Security Architecture for the Internet Protocol.
 RFC 2409: Internet Key Exchange Protocol (IKE).
 RFC 2474: Definition of the Differentiated Services Field (DS Field) in the IPv4 and IPv6 Headers.
 RFC 2597: Assured Forwarding PHB Group.
 RFC 2615: PPP over SONET/SDH.

 RFC 2665: Definitions of Managed Objects for the Ethernet-like Interface Types.
 RFC 2674: Bridge MIB with VLAN/Traffic Classes/Multicast Extensions.
 RFC 2702: Requirements for Traffic Engineering Over MPLS.
 RFC 2737: Entity MIB (Version 2).
 RFC 2819: Remote Network Monitoring Management Information Base.
 RFC 2829: Authentication Methods for LDAP.
 RFC 2830: Lightweight Directory Access Protocol (v3): Extension for Transport Layer Security.
 RFC 2863: Interfaces Group MIB.
 RFC 3014: Notification Log MIB.
 RFC 3031: Multiprotocol Label Switching Architecture.
 RFC 3032: MPLS Label Stack Encoding.
 RFC 3246: An Expedited Forwarding PHB (Per-Hop Behavior).
 RFC 3270: Multi-Protocol Label Switching (MPLS) Support of Differentiated Services.
 RFC 3377: Lightweight Directory Access Protocol (v3): Technical Specification.
 RFC 3411: SNMP Framework MIB.
 RFC 3414: SNMP User-Based SM MIB.
 RFC 3415: SNMP Vies-Based ACM MIB.
 RFC 3443: Time To Live (TTL) Processing in Multi-Protocol Label Switching (MPLS) Networks.
 RFC 3812: Multiprotocol Label Switching (MPLS) Traffic Engineering (TE) Management Information
Base (MIB).
 RFC 3813: Multiprotocol Label Switching (MPLS) Label Switching Router (LSR) Management
Information Base (MIB).
 RFC 3916: Requirements for Pseudo-Wire Emulation Edge-to-Edge (PWE3).
 RFC 3985: Pseudo Wire Emulation Edge-to-Edge (PWE3) Architecture.
 RFC 4090: Fast Reroute Extensions to RSVP-TE for LSP Tunnels.
 RFC 4125: Maximum Allocation Bandwidth Constraints Model for Diffserv-aware MPLS Traffic
Engineering.
 RFC 4126: Max Allocation with Reservation Bandwidth Constraints Model for Diffserv-aware MPLS
Traffic Engineering & Performance Comparisons.
 RFC 4252: The Secure Shell (SSH) Authentication Protocol.
 RFC 4253: The Secure Shell (SSH) Transport Layer Protocol.
 RFC 4254: The Secure Shell (SSH) Connection Protocol.
 RFC 4256: Generic Message Exchange Authentication for the Secure Shell Protocol (SSH).
 RFC 4379: Detecting Multi-Protocol Label Switched (MPLS) Data Plane Failures.
 RFC 4448: Encapsulation Methods for Transport of Ethernet over MPLS Networks.
 RFC 4553: Structure-Agnostic Time Division Multiplexing (TDM) over Packet (SAToP)

 RFC 5086: Structure-Aware Time Division Multiplexed (TDM) Circuit Emulation Service over Packet
Switched Network (CESoPSN)
 RFC 5254: Requirements for Multi-Segment Pseudowire Emulation Edge-to-Edge (PWE3).
 RFC 5462: Multiprotocol Label Switching (MPLS) Label Stack Entry: "EXP" Field Renamed to "Traffic
Class" Field.
 RFC 5659: An Architecture for Multi-Segment Pseudowire Emulation Edge-to-Edge.
 RFC 6073: Segmented Pseudowire.
 RFC 6427: MPLS Fault Management Operations, Administration, and Maintenance (OAM)
 RFC 6378: MPLS Transport Profile (MPLS-TP) Linear Protection
 IETF Drafts:
 draft-ietf-l2vpn-vpls-ldp.
 draft-ietf-l2vpn-vpls-mcast-reqts.
 draft-ietf-magma-snoop.
 draft-ietf-mpls-rsvp-te-p2mp.
 draft-ietf-mpls-tp-nm-framework.
 draft-ietf-mpls-tp-nm-req.
 draft-ietf-pwe3-dynamic-ms-pw-14.
 draft-ietf-pwe3-ethernet-encap.
 draft-ietf-pwe3-ldp-aii-reachability-04.
 draft-martini-l2circuit-encap-mpls.
 draft-sajassi-l2vpn-vpls-multicast-congruency.
 draft-vasseur-mpls-backup-computation.
7.7 ISO: International Organization for

Standardization
 A2LA: Accredited Laboratory for Electrical and Mechanical Testing.
 ISO 9001: Quality Management System – Requirements.
 ISO 14001: Environmental Management Systems – Requirements With Guidance for Use.
 ISO 27001: Information Security Management Systems – Requirements.
 TL 9000, QuEST Forum: Quality Management System – Requirements & Measurements Handbooks
for the Telecom Industry.

7.8 ITU-T: International Telecommunication

Union
 G.650: Definition and Test Methods for the Relevant Parameters of Single-Mode Fibers.
 G.651: Characteristics of a 50/125 µm Multimode Graded Index Optical Fiber Cable.
 G.652: Characteristics of a Single-Mode Optical Fiber Cable.
 G.653: Characteristics of a Dispersion-Shifted Single-Mode Optical Fiber Cable.
 G.654: Characteristics of a Cut-off Shifted Single-Mode Optical Fiber Cable.
 G.655: Characteristics of a Non-Zero Dispersion Shifted Single-Mode Optical Fiber Cable.
 G.661: Definition and Test Methods for the Relevant Generic Parameters of Optical Amplifier Devices
and Subsystems.
 G.662: Generic Characteristics of Optical Fiber Amplifier Devices and Subsystems.
 G.663: Application Related Aspects of Optical Fiber Amplifier Devices and Subsystems.
 G.664: Optical Safety Procedures and Requirements for Optical Transport Systems.
 G.671: Transmission Characteristics of Passive Optical Components.
 G.691: Optical Interfaces for Single Channel SDH Systems with Optical Amplifiers and STM-64 Systems
(Draft).
 G.692: Optical Interfaces for Multi-Channel Systems with Optical Amplifiers.
 G.694.1: Spectral Grids for WDM Applications: DWDM Frequency Grid.
 G.694.2: Spectral Grids for WDM Applications: CWDM Wavelength Grid.
 G.695: Optical Interfaces for Coarse Wavelength Division Multiplexing Applications.
 G.703: Physical/Electrical Characteristics of Hierarchical Digital Interfaces.
 G.704: Synchronous Frame Structures Used at 1544, 6312, 2048, 8448 and 44 736 kbps Hierarchical
Levels.
 G.706: Frame Alignment and CRC Procedures Relating to Basic Frame Structure Defined in Rec G.704.
 G.707: Network Node Interface for the Synchronous Digital Hierarchy.
 G.709: Interfaces for the Optical Transport Network (OTN).
 G.752: Characteristics of digital multiplex equipments based on a second order bit rate of 6312 kbit/s
and using positive justification.
 G.772: Protected Monitoring Points Provided on Digital Transmission Systems.
 G.774 & G774.n: SDH Information Model.
 G.775: Loss of Signal (LOS), Alarm Indication Signal (AIS) and Remote Defect Indication (RDI) defect
detection and clearance criteria for PDH signals.
 G.781: Synchronization Layer Functions.
 G.783: Characteristics of SDH Equipment Functional Blocks.
 G.784: Synchronous Digital Hierarchy (SDH) Management.
 G.798: Characteristics of OTN Hierarchy Equipment Functional Blocks.

 G.803: Architectures of Transport Networks based on the Synchronous Digital Hierarchy.

 G.805: Generic Functional Architecture of Transport Networks.
 G.806: Characteristics of Transport Equipment –Description Methodology and Generic Functionality.
 G.809: Functional Architecture of Connectionless Layer Networks.
 G.811: Timing Characteristics of Primary Reference Clocks.
 G.812: Timing Requirements of Slave Clocks Suitable for Use as Node Clocks in Synchronization
Networks.
 G.813: Timing Characteristics of SDH Equipment Slave Clocks (SEC).
 G.823: The Control of Jitter and Wander within Digital Networks Based on the 2048 kbit/s Hierarchy.
 G.825: The Control of Jitter and Wander within Digital Networks Based on the SDH (Draft).
 G.8251: The Control of Jitter and Wander within the Optical Transport Network (OTN).
 G.826: Error Performance Parameters and Objectives for International, Constant Bit Rate Digital Paths
at or above the Primary Rate.
 G.828: Error Performance Parameters and Objectives for International, Constant Bit Rate
Synchronous Digital Paths.
 G.829: Error Performance Events for SDH Multiplex and Regenerator Sections.
 G.831: Management Capabilities of Transport Networks Based on the Synchronous Digital Hierarchy
(SDH).
 G.841: Types and Characteristics of SDH Network Protection Architectures.
 G.842: Inter-Working of SDH Protection Architectures.
 G.872: Architecture of Optical Transport Networks.
 G.874: Management Aspects of the Optical Transport Network Element.
 G.874.1: Optical Transport Network (OTN): Protocol-Neutral Management Information Model for the
Network Element View.
 G.957: Optical Interfaces for Equipment and Systems relating to the Synchronous Digital Hierarchy.
 G.958: Digital Line Systems Based on the Synchronous Digital Hierarchy for Use on Optical Fiber
Cables.
 G.959.1: Optical Transport Network Physical Layer Interfaces.
 G.975: Forward Error Correction for Submarine Systems.
 G.985: 100 Mbit/s point-to-point Ethernet based optical access system.
 G.7041: Generic Framing Procedure (GFP).
 G.7042: Link Capacity Adjustment Scheme (LCAS) for Virtual Concatenated Signals.
 G.7713: Distributed Connection Management.
 G.7713.2: RSVP-TE Implementation.
 G.7714: Generalized Automatic Discovery Techniques.
 G.7714.1: Protocol for Automatic Discovery in SDH & OTN network.
 G.7715: ASON Routing.

 G.7715.1: Based on PNNI, OSPF or IS_IS.

 G.8001/Y.1354: Terms and definitions for Ethernet frames over transport.
 G.8010/Y.1306: Architecture of Ethernet Layer Networks.
 G.8011/Y.1307: Ethernet Services Framework.
 G.8011.1/Y.1307.1: Ethernet Private Line Service.
 G.8011.2/Y.1307.2: Ethernet Virtual Private Line Service.
 G.8012/Y.1308: Ethernet UNI and Ethernet NNI.
 G.8080/Y.1304: Architecture for the automatically switched optical network (ASON)
 G.8201/Y.1354: Error performance parameters and objectives for multi-operator international paths
within the Optical Transport Network (OTN)
 G.8261/Y. 1361: Timing and synchronization aspects in packet network.
 G.8262/Y. 1362: Timing characteristics of synchronous Ethernet equipment slave clock (EEC).
 G.8080: Architecture for ASON.
 I.356: ATM Layer Cell Transfer Performance.
 I.361: ATM Layer Specification.
 I.371: Traffic Control and Congestion Control.
 I.610: ATM Operation and Maintenance Principles.
 M.2140: Transport Network Event Correlation.
 M.3010: Principles for a Telecommunications Management Network.
 M.3013: Considerations for a Telecommunications Management Network.
 M.3016.x: Security for the management plane.
 M.3017: Framework for the integrated management of hybrid circuit/packet networks.
 M.3100: Generic Network Information Model.
 M.3180: Catalogue of TMN Management Information.
 M.3200: TMN Management Services and Telecommunications Managed Areas: Overview.
 M.3300: TMN F Interface Requirements.
 M.3400: TMN Management Functions.
 Q.821: Alarm Surveillance.
 Q.822: Performance Monitoring.
 X.217: Open Systems Interconnection, Service Definition for the Association Control Service Element.
 X.219: Remote Operations - Model, Notation and Service Definition.
 X.227: Open Systems Interconnection, Connection-Oriented Protocol for the Association Control
Service Element - Protocol Specification.
 X.229: Remote Operations: Protocol Specification.
 X.710: Open Systems Interconnection, Common Management Information Service.

 X.720: Open Systems Interconnection, Structure of Management Information - Management

Information Model.
 X.721 Information Technology: Open Systems Interconnection, Structure of Management
Information - Definition of Management Information.
 X.722: Open Systems Interconnection, Structure of Management Information - Guidelines for the
Definition of Managed Objects.
 X.731: Open Systems Interconnection, Systems Management - State Management Function.
 X.733: Open Systems Interconnection, Systems Management - Alarm Reporting Function.
 X.736: System management; security alarm reporting function.
 X.743: Open Systems Interconnection, Systems Management - Time Management Function.
 X.744: Open Systems Interconnection, Systems Management - Software Management Function.
 Y.1311: Network-based VPNs - Generic architecture and service requirements.
 Y.1710: Requirements for Operation & Maintenance functionality for MPLS networks.
 Y.1711: Operation & Maintenance mechanism for MPLS networks.
 Z.351: Data oriented human-machine interface specification technique – introduction.
 Z.352: Data oriented human-machine interface specification technique – scope, approach and usage.
 Z.361: Design guidelines for Human-Computer Interfaces (HCI) for the management of
telecommunications networks.
7.9 MEF: Metro Ethernet Forum

 MEF3 Circuit Emulation Service Definitions, Framework and Requirements in Metro Ethernet
Networks
 MEF4 Metro Ethernet Network Architecture Framework Part 1: Generic Framework.
 MEF6 Metro Ethernet Services Definitions.
 MEF7 EMS-NMS Information Model.
 MEF8 Implementation Agreement for the Emulation of PDH Circuits over Metro Ethernet Networks
 MEF10 Ethernet Service Attributes.
 MEF11 User Network Interface (UNI) Requirements and Framework.
 MEF12 Metro Ethernet Network Architecture Framework Part 2: Ethernet Services Layer.
 MEF14 Test Suite for Ethernet Traffic Management.
 MEF15 Requirements for Management of Metro Ethernet Phase 1 Network Elements
 MPLS-TP Network Management requirements (draft-ietf-mpls-tp-nm-req)
 MPLS-TP NM Framework (draft-ietf-mpls-tp-nm-framework)

7.10 NIST: National Institute of Standards and

Technology
 FIPS PUB 197: Advanced Encryption Standard (AES).
 FIPS PUB 140-2: Security Requirements for Cryptographic Modules.
7.11 North American Standards

 ANSI FC–F1-2: Fiber Channel Physical Interface REV 10.
 ANSI T1.102: Digital hierarchy electrical interface.
 ANSI T1.105: Synchronous Optical Network (SONET) - Basic Description including Multiplex Structure,
Rates, and Formats.
 ANSI X3.296: Single-Byte Command code sets CONnection (SBCON) architecture.
 FCC CFR Title 47 Part 15: Radio Emission.
 FCC Part 101.147 Fixed microwave services: (i8, i7, K7, 7)
 NEBS GR1089 and GR63 (temperature aspect)
 NEBS Level 3 support for N.A. platforms.
 Rural Utility Service (RUS) Certification.
 Telcordia GR-63-CORE: Network Equipment Building System (NEBS) Requirements: Physical
Protection.
 Telcordia GR-253-CORE: Synchronous Optical Network (SONET) Transport Systems: Common Generic
Criteria.
 Telcordia GR-383-CORE: COMMON LANGUAGE® Equipment Codes (CLEI™ Codes) – Generic
Requirements for Bar Code Labels.
 Telcordia GR-487-CORE: Generic Requirements for Electronic Equipment Cabinets.
 Telcordia GR-499-CORE: Transport System Generic Requirements (TSGR): Common Requirements.
 Telcordia GR-815-CORE: Generic Requirements for Network Element/Network system Security.
 Telcordia GR-1089-CORE: Electromagnetic Compatibility and Electrical Safety – Generic Criteria for
Network Telecommunications Equipment.
 Telcordia GR-1209-CORE: Generic Requirements for Passive Optical Components.
 Telcordia GR-1230-CORE: SONET Bidirectional Line-Switched Ring Equipment Generic Criteria.
 Telcordia GD-1244-CORE: Clock for the synchronization network: Common generic criteria.
 Telcordia GR-1312-CORE: Generic Requirements for Optical Fiber Amplifiers and Proprietary Dense
Wavelength-Division Multiplexed Systems.
 Telcordia GR-1400-CORE: SONET Dual-Fed Unidirectional Path Switched Ring (UPSR) Equipment
Generic Criteria.
 Telcordia GD-2979-CORE: Common Generic Requirements for Optical Add-Drop Multiplexers
(OADMs) and Optical Terminal Multiplexers (OTMs).

7.12 OMG: Object Management Group

 Notification Service Specification V 1.0.
 The Common Object Request Broker: Architecture and Specification V 2.6.
7.13 TMF: TeleManagement Forum

 TMF 513: MTNM Business Agreement Release 3.5.
 TMF 518: Framework Document Delivery Package (DDP) Business Agreement (BA) V1.1.
 TMF 518: Resource Provisioning DDP BA V1.0.
 TMF 608: Multi Technology Network Management Information Agreement V 2.1 and V 3.5.
 TMF 814: Multi Technology Network Management Solution Set V 2.1 and V 3.5.
 TMF 854: The MTOSI XML Solution Set Package Release 1.1.
7.14 Web Protocol Standards

W3C: World Wide Web Consortium
 SOAP 1.1: Simple Object Access Protocol.
 WSDL 1.1: Web Services Description Language.
WS-I: Web Services Interoperability Organization

 WS-I Basic Profile 1.1: Web Services Interoperability.

XDM V9.2 System Specifications

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XDM V9.2 System Specifications

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XDM®

ECI's NPT-1200, NPT-1020, and NPT-1010 are CE2.0 certified.

ECI's NPT-1600 complies with the MEF9 and MEF14 standards.

ECI's management applications run on VMWare virtualization hypervisors.

© Copyright by ECI, 2002-2015. All rights reserved worldwide.

2 XDM Overview ............................................................................................ 2-1

3 Physical Description .................................................................................... 3-1

ECI Telecom Ltd. Proprietary iii

3.5 MXC900 and ECU900 Cards ................................................................................................. 3-25

4 XDM-100 Specifications ............................................................................... 4-1

ECI Telecom Ltd. Proprietary iv

4.7 Management.......................................................................................................................... 4-4

ECI Telecom Ltd. Proprietary v

4.18 Reliability ............................................................................................................................. 4-30

5 XDM-900 Specifications ............................................................................... 5-1

ECI Telecom Ltd. Proprietary vi

5.10.3 Client Transceivers for MCSM Cards ..................................................................................... 5-17

6 XDM-40/450/500/1000/2000/3000 Specifications ...................................... 6-1

ECI Telecom Ltd. Proprietary vii

6.3.5 STM-1 Electrical ....................................................................................................................... 6-5

ECI Telecom Ltd. Proprietary viii

6.7.6 OMCM25_4 STM-1/OC-3 SFP Optical Transceivers .............................................................. 6-45

ECI Telecom Ltd. Proprietary ix

6.14.1 Life ......................................................................................................................................... 6-76

7 Standards and References ........................................................................... 7-1

ECI Telecom Ltd. Proprietary x

ECI Telecom Ltd. Proprietary xi

ECI Telecom Ltd. Proprietary xii

1.1 Intended Audience

1.2 Document Organization

1.3 Notes and Warnings

NOTE: clarifying information, specific instructions, commentary, sidelights, or interesting

CAUTION: failure to follow directions could result in damage to equipment or loss of

ECI Telecom Ltd. Proprietary 1-1

IMPORTANT: essential information to which you must pay attention.

1.4 Related Documentation

1.5 How to Obtain ECI Technical Documentation

ECI Telecom Ltd. Proprietary 1-2

1.6 Technical Assistance

ECI Telecom Ltd. Proprietary 1-3

2.1 Intelligent and Scalable Optical Networking

ECI Telecom Ltd. Proprietary 2-1

2.2 Unparalleled Capabilities

ECI Telecom Ltd. Proprietary 2-2

 Provide on-demand services across multiple network layers

2.3 XDM Platforms

ECI Telecom Ltd. Proprietary 2-3

ECI Telecom Ltd. Proprietary 2-4

ECI Telecom Ltd. Proprietary 2-5

3.1 XDM Shelf Configurations

3.1.1 XDM-100 Shelf Layout

3.1.1.1 Basic XDM-100 shelf

ECI Telecom Ltd. Proprietary 3-1

3.1.1.2 XDM-100 with I/O protection

3.1.1.3 Nonredundant XDM-100

ECI Telecom Ltd. Proprietary 3-2

3.1.2 XDM-900 Shelf Layout

3.1.2.1 Basic XDM-900 shelf

ECI Telecom Ltd. Proprietary 3-3

The XDM-900 shelf can be installed in a horizontal or vertical position.

Figure 3-6: Basic XDM-900 shelf, vertical Installation

ECI Telecom Ltd. Proprietary 3-4

3.1.2.2 Expanded XDM-900 with I/O Protection

ECI Telecom Ltd. Proprietary 3-5