Dokumen - Tips - XDM 100 Product Line RM Etsi b02 83 en

8/9/2019 Xdm-100 Product Line Rm Etsi b02 8.
3 En
XDM®-100 Product Line

Version 8.3
Reference Manual
417006-2709-0H3-B02
http://slidepdf.com/reader/full/xdm-100-product-line-rm-etsi-b02-83-en 1/325
8/9/2019 Xdm-100 Product Line Rm Etsi b02 8.3 En
XDM-100 Product Line (ETSI) Reference Manual

V8.3
Catalog No: X39175

December 2011
10th Edition
© Copyright by ECI Telecom, 2007-2011. All rights reserved worldwide.

This is a legal agreement between you, the end user, and ECI Telecom Ltd. (“ECI Telecom”). BY OPENING THE
DOCUMENTATION AND/OR DISK PACKAGE, YOU ARE AGREEING TO BE BOUND BY THE TERMS OF THIS
AGREEMENT. IF YOU DO NOT AGREE TO THE TERMS OF THIS AGREEMENT, PROMPTLY RETURN THE
UNOPENED DOCUMENTATION AND/OR DISK PACKAGE AND THE ACCOMPANYING ITEMS (INCLUDING
WRITTEN MATERIALS AND BINDERS OR OTHER CONTAINERS), TO THE PLACE FROM WHICH YOU
OBTAINED THEM.
The information contained in the documentation and/or disk is proprietary and is subject to all relevant copyright,
patent, and other laws protecting intellectual property, as well as any specific agreement protecting ECI Telecom's
rights in the aforesaid information. Neither this document nor the information contained in the documentation and/or
disk may be published, reproduced, or disclosed to third parties, in whole or in part, without the express prior
written permission of ECI Telecom. In addition, any use of this document, the documentation and/or the disk, or the
information contained therein for any purposes other than those for which it was disclosed, is strictly forbidden.
ECI Telecom reserves the right, without prior notice or liability, to make changes in equipment design or
specifications. Information supplied by ECI Telecom is believed to be accurate and reliable. However, no
responsibility whatsoever is assumed by ECI Telecom for the use thereof, nor for the rights of third parties, which
may be affected in any way by the use and/or dissemination thereof.
Any representation(s) in the documentation and/or disk concerning performance of ECI Telecom product(s) are for
informational purposes only and are not warranties of product performance or otherwise, either express or implied.
ECI Telecom's
offered standard limited warranty, stated in its sales contract or order confirmation form, is the only warranty
by ECI Telecom.
The documentation and/or disk is provided “AS IS” and may contain flaws, omissions, or typesetting errors. No
warranty is granted nor liability assumed in relation thereto, unless specifically undertaken in ECI Telecom's sales
contract or order confirmation. Information contained in the documentation and in the disk is periodically updated,
and changes will be incorporated in subsequent editions. If you have encountered an error, please notify ECI
Telecom. All specifications are subject to change without prior notice.
The documentation and/or disk and all information contained therein is owned by ECI Telecom and is protected by
all relevant copyright, patent, and other applicable laws and international treaty provisions. Therefore, you must
treat the information contained in the documentation and disk as any other copyrighted material (for example, a
book or musical recording).
Other Restrictions. You may not rent, lease, sell, or otherwise dispose of the documentation and disk, as
applicable. YOU MAY NOT USE, COPY, MODIFY, OR TRANSFER THE DOCUMENTATION AND/OR DISK OR
ANY COPY IN WHOLE OR PART, EXCEPT AS EXPRESSLY PROVIDED IN THIS LICENSE. ALL RIGHTS NOT
EXPRESSLY GRANTED ARE RESERVED BY ECI Telecom.
All trademarks mentioned herein are the property of their respective holders.
ECI Telecom shall not be liable to you or to any other party for any loss or damage whatsoever or howsoever
caused, arising directly or indirectly in connection with this documentation and/or disk, the information contained
therein, its use, or otherwise. Notwithstanding the generality of the aforementioned, you expressly waive any claim
and/or demand regarding liability for indirect, special, incidental, or c onsequential loss or damage which may arise
in respect of the documentation and/or disk and/or the information contained therein, howsoever caused, even if
advised of the possibility of such damages.
The end user hereby undertakes and acknowledges that they read the "Before You Start/Safety Guidelines"
instructions and that such instructions were understood by them.
It is hereby clarified that ECI Telecom shall not be liable to you or to any other party for any loss or damage
whatsoever or howsoever caused, arising directly or indirectly in connection with you fulfilling and/or failed to fulfill
in whole or in part the "Before You Start/Safety Guidelines" instructions.
Contents
Ab ou t Thi s Manual ................................................................... xv
Overview ............................................................................................................ xv
Intended Audience ............................................................................................. xv
Document Organization ..................................................................................... xvi
Document Conventions ..................................................................................... xvi
Related Documentation ....................................................................................xviii
Obtaining Technical Documentation ................................................................xviii
Technical Assistance ......................................................................................... xix
Int ro duct ion .............................................................................. 1-1

XDM-50 Platform Overview .............................................................................. 1-2
XDM-50 Shelf Options ...................................................................................... 1-3
XDM-100 Platform Overview ............................................................................ 1-5
XDM-100 Shelf Configurations ......................................................................... 1-6
XDM-100 I/O Protection Options ...................................................................... 1-8
XDM-100H Overview...................................................................................... 1-10
XDM-300 Platform Overview .......................................................................... 1-16
XDM-300 I/O Protection Options .................................................................... 1-17
XDM-900 Platform Overview .......................................................................... 1-23
XDM-900 I/O Protection Options .................................................................... 1-25
DCC Functionality .......................................................................................... 1-30
Management Architecture .............................................................................. 1-33
XDM-50 Common Cards .......................................................... 2-1

Overview .......................................................................................................... 2-1
Main Cross-Connect and Control (MXC50) Card ............................................. 2-2
External Connection Unit (ECU50/ECU50-R) .................................................. 2-5
Fan Control Unit (FCU50) .............................................................................. 2-11
INF50.............................................................................................................. 2-13
CCP50-2......................................................................................................... 2-14
XDM-100 Common Cards ........................................................ 3-1

Shelf Overview ................................................................................................. 3-2
Fan Control Unit (FCU) .................................................................................... 3-3
External Connection Unit (ECU)....................................................................... 3-6
Main Cross-Connect and Control (MXC) Card ............................................... 3-11
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary i
Contents XDM-100 Product Line Reference

Manual
XDM-300 Common Cards ........................................................ 4-1

XDM-300 Shelf Overview ................................................................................. 4-1
External Connection Unit (ECU300)................................................................. 4-6
Main Cross-Connect and Control Card (MXC300) ......................................... 4-12
XDM-300 Platform with 100 Gbps Capacity ................................................... 4-15
XDM-900 Common Cards ........................................................ 5-1

XDM-900 Shelf Overview ................................................................................. 5-1
External Connection Unit (ECU900)................................................................. 5-6
Main Cross-Connect and Control Card (MXC900) ......................................... 5-11
XDM-900 Platform with 60 Gbps Capacity ..................................................... 5-14
I/O Cards and Modul es ............................................................ 6-1

Overview .......................................................................................................... 6-1
PDH Modules ................................................................................................... 6-4
SDH Cards and Modules................................................................................ 6-15
CWDM I/O Modules ....................................................................................... 6-39
Pluggable Interfaces (SFP/XFP) .................................................................... 6-42
Overhead Access Module (OHU) ................................................................... 6-45
MPLS and Ethernet Data Modules ......................................... 7-1

Overview .......................................................................................................... 7-1
Ethernet Switching Modules ............................................................................. 7-3
EISMB Functionality ......................................................................................... 7-4
EISMB Module Types ..................................................................................... 7-11
DIOM Modules ............................................................................................... 7-17
DIOM Module Types ...................................................................................... 7-17
MCSM ............................................................................................................ 7-25
ASON (A utomat ically Sw it ched Opt ic al Netw ork) ................ 8-1

Overview .......................................................................................................... 8-1
Optical Control Plane Architecture ................................................................... 8-2
ASON Traffic Management .............................................................................. 8-6
ACP100 Module ............................................................................................... 8-9
ACP900 Module ............................................................................................. 8-11
ii ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference Contents

Manual
Tribut ary Prot ection Unit (TPU).............................................. 9-1

Overview .......................................................................................................... 9-1
TC Modules ...................................................................................................... 9-5
TPMs ................................................................................................................ 9-8
TPU and I/O Slots Allocation for Protection ................................................... 9-15
Optical Amplifiers ........................................................................................... 9-19
TPU/OCU Shelf .............................................................................................. 9-24
CWDM Networking Modules .......................................................................... 9-24
Ac cessories ......................................................................... 10-35

Overview ...................................................................................................... 10-35
xRAP-100 ..................................................................................................... 10-36
xRAP-D ........................................................................................................ 10-40
RAP-BG........................................................................................................ 10-46
RAP-4B ........................................................................................................ 10-47
xDDF-21 Patch Panel for Unbalanced Electrical Connections..................... 10-50
Fiber Storage Tray (FST) ............................................................................. 10-51
Optical Distribution Frame ............................................................................ 10-52
Optical Patch Panel ...................................................................................... 10-54
Cable Guiding Accessories .......................................................................... 10-55
XDM Protection and Rest oration Mechanism s ................... 11-1

Overview ........................................................................................................ 11-1
ASON Protection and Restoration Capabilities .............................................. 11-2
MPLS Protection
Ethernet Schemes
PB Features ............................................................................11-11
................................................................................... 11-6
Fast IOP: 1:1 Card Protection ...................................................................... 11-13
SDH Protection Schemes............................................................................. 11-14
SDH Line Protection ..................................................................................... 11-19
Equipment Protection ................................................................................... 11-22
Integrated Protection for I/O Cards with Electrical Interfaces ....................... 11-23
Maintenance ........................................................................... 12-1

Overview ........................................................................................................ 12-1
Short MTTR .................................................................................................... 12-2
Built-In Test .................................................................................................... 12-3
Alarms System ............................................................................................... 12-4
Troubleshooting.............................................................................................. 12-5
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary iii
Contents XDM-100 Product Line Reference

Manual
Standards and References .................................................... A-1

Overview .......................................................................................................... A-1
Broadband Forum ............................................................................................ A-2
Environmental Standards ................................................................................. A-2
ETSI: European Telecommunications Standards Institute ............................... A-3
IEC: International Electrotechnical Commission .............................................. A-4
IEEE: Institute of Electrical and Electronic Engineers ...................................... A-5
IETF: Internet Engineering Task Force ............................................................ A-6
ISO: International Organization for Standardization ......................................... A-8
ITU-T: International Telecommunication Union ................................................ A-9
MEF: Metro Ethernet Forum ........................................................................... A-14
NIST: National Institute of Standards and Technology .................................. A-14
North American Standards ............................................................................. A-15
OMG: Object Management Group ................................................................. A-16
TMF: TeleManagement Forum....................................................................... A-16
Web Protocol Standards ................................................................................ A-16
Index .......................................................................................... I-1
iv ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
List of Figures
Figure 1-1: XDM-50 shelf ............................................................................................... 1-2
Figure 1-2: Basic XDM-50 shelf layout .......................................................................... 1-4
Figure 1-3: XDM-100 shelf ............................................................................................. 1-5
Figure 1-4: Basic XDM-100 shelf ................................................................................... 1-8
Figure 1-5: Expanded XDM-100 shelf ............................................................................ 1-9
Figure 1-6: Double-expanded XDM-100 shelf ............................................................... 1-9
Figure 1-7: XDM-100 with a TPU/OCU shelf ............................................................... 1-11
Figure 1-8: TPU and OCU slots designation................................................................ 1-12
Figure 1-9: Basic XDM-100 .......................................................................................... 1-13
Figure 1-10: Expanded XDM-100 ................................................................................ 1-14
Figure 1-11: Double-expanded XDM-100 .................................................................... 1-15
Figure 1-12: XDM-300 shelf ......................................................................................... 1-16
Figure 1-13: Basic XDM-300 shelf, horizontal installation ........................................... 1-18
Figure 1-14: Basic XDM-300 shelf, vertical Installation ............................................... 1-19
Figure 1-15: XDM-300 with TPU on top ....................................................................... 1-20
Figure 1-16: XDM-300 with TPUs on top and at the bottom ........................................ 1-21
Figure 1-17: XDM-300 with two TPUs and an OCU .................................................... 1-22
Figure 1-18: XDM-900 shelf ......................................................................................... 1-23
Figure 1-19: Basic XDM-900 shelf, horizontal installation ........................................... 1-26
Figure 1-20: Basic XDM-900 shelf, vertical Installation ............................................... 1-26
Figure 1-21: XDM-900 with TPU on top ....................................................................... 1-27
Figure 1-22: XDM-900 with TPUs on top and at the bottom ........................................ 1-28
Figure 1-23: XDM-900 with two TPUs and an OCU .................................................... 1-29
Figure 1-24: XDM-100 DCC capacity before modification ........................................... 1-30
Figure 1-25: XDM-100 DCC capacity after modification .............................................. 1-31
Figure 1-26: XDM-300/XDM-900 DCC capacity before modification........................... 1-31
Figure 1-27: XDM-300/XDM-900 DCC capacity after modification.............................. 1-32
Figure 1-28: Typical XDM-100 Shelf View ................................................................... 1-33
Figure 1-29: Typical XDM-100 Shelf window ............................................................... 1-34
Figure 2-1: Basic XDM-50 shelf layout .......................................................................... 2-2
Figure 2-2: MXC50 front panel ....................................................................................... 2-3
Figure 2-3: ECU50 front panel ....................................................................................... 2-6
Figure 2-4: ECU50_R front panel .................................................................................. 2-9
Figure 2-5: FCU50 front panel ..................................................................................... 2-11
Figure 2-6: Installed air filter......................................................................................... 2-12
Figure 2-7: INF50 front panel ....................................................................................... 2-13
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary v
List of Figures XDM-100 Product Line Reference

Manual
Figure 2-8: CCP50-2 module front panel ..................................................................... 2-14

Figure 3-1: Basic XDM-100 shelf ................................................................................... 3-2
Figure 3-2: FCU general view ........................................................................................ 3-3
Figure 3-3: Installed air filter........................................................................................... 3-5
Figure 3-4: ECU-F front panel ........................................................................................ 3-7
Figure 3-5: ECU front panel ........................................................................................... 3-9
Figure 3-6: XDM-100 with two MXC-100 slots capacity .............................................. 3-12
Figure 3-7: MXC-100 front panel ................................................................................. 3-12
Figure 3-8: XDM-100 with two MXC-100B slots capacity ............................................ 3-15
Figure 3-9: MXC-100B front panel ............................................................................... 3-15
Figure 3-10: XDM-100 with one MXC-100 and one MXC-BR slots capacity ............... 3-16

Figure 3-11: MXC-BR front panel ................................................................................ 3-16
Figure 3-12: Shelf with MXC-100 redundancy ............................................................. 3-17
Figure 3-13: Shelf without MXC redundancy ............................................................... 3-19
Figure 3-14: SAM1_4/E................................................................................................ 3-21
Figure 3-15: SAM1_4O/SAM1_4OB aggregate module .............................................. 3-22
Figure 3-16: SAM4_2 aggregate module ..................................................................... 3-23
Figure 3-17: SAM16_1/SAM16_1B.............................................................................. 3-24
Figure 4-1: FCU300 general view .................................................................................. 4-3
Figure 4-2: XDM-300 with air filter ................................................................................. 4-5
Figure 4-3: ECU300-F front panel .................................................................................. 4-6
Figure 4-4: ECU300 front panel ..................................................................................... 4-9
Figure 4-5: MXC300 front panel ................................................................................... 4-13
Figure 4-6: Warning labels on extractor handles ......................................................... 4-13
Figure 4-7: XDM-300_100G slot capacity .................................................................... 4-15
Figure 5-1: FCU900 general view .................................................................................. 5-3
Figure 5-2: XDM-900 with air filter ................................................................................. 5-5
Figure 5-3: ECU900-F front panel .................................................................................. 5-6
Figure 5-4: ECU900 front panel ..................................................................................... 5-9
Figure 5-5: MXC900 front panel ................................................................................... 5-12

Figure 5-6: Warning labels on extractor handles ......................................................... 5-12
Figure 6-1: PIM2_21 I/O module .................................................................................... 6-5
Figure 6-2: PIM2_42 front panel .................................................................................... 6-7
Figure 6-3: PIM2_63/B I/O module ................................................................................ 6-9
Figure 6-4: PIM2_63 front panel .................................................................................. 6-11
Figure 6-5: PIM2_63S traffic cable .............................................................................. 6-12
Figure 6-6: PIM345_3 I/O module ................................................................................ 6-13
Figure 6-7: SIM1_4/E I/O module ................................................................................ 6-16
Figure 6-8: SIM 1_4/O and SIM1_4OB I/O module ..................................................... 6-18
vi ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference List of Figures

Manual
Figure 6-9: SIM1_8 front panel .................................................................................... 6-20

Figure 6-10: SIM4_2 I/O module .................................................................................. 6-21
Figure 6-11: SIM4_4 front panel .................................................................................. 6-23
Figure 6-12: SIM4_8 front panel .................................................................................. 6-25
Figure 6-13: SIM16_1 front panel ................................................................................ 6-27
Figure 6-16: Warning labels on extractor handles ....................................................... 6-30
Figure 6-17: SIM16_8 ports and bandwidth assignment ............................................. 6-31

Figure 6-21: SIM64_XFP front panel ........................................................................... 6-36
Figure 6-25: CRPT25_2C module ............................................................................... 6-39
Figure 6-26: CTRP25_2C module ............................................................................... 6-40
Figure 6-27: CCMB25_2D module ............................................................................... 6-41
Figure 6-28: SFP transceiver ....................................................................................... 6-42
Figure 6-29: OHU front panel ....................................................................................... 6-45
Figure 7-1: EISMB_804 front panel ............................................................................. 7-13
Figure 7-2: EISMB_840 front panel ............................................................................. 7-16
Figure 7-3: DIOM_04 front panel ................................................................................. 7-19
Figure 7-6: MCSM functional block diagram ................................................................ 7-25
Figure 7-7: MCSM front panel ...................................................................................... 7-30
Figure 8-1: XDM control plane architecture ................................................................... 8-2
Figure 8-2: ASON family software structure .................................................................. 8-7

Figure 8-3: ASON software structure ............................................................................. 8-8
Figure 8-4: ACP100 front panel ..................................................................................... 8-9
Figure 8-5: ACP900 front panel ................................................................................... 8-11
Figure 9-1: XDM-50 with TPU ........................................................................................ 9-2
Figure 9-2: XDM-100 with TPU ...................................................................................... 9-3
Figure 9-3: XDM-300 with two TPUs ............................................................................. 9-3
Figure 9-4: XDM-900 with two TPUs ............................................................................. 9-4
Figure 9-5: TC module ................................................................................................... 9-5
Figure 9-6: TCF module ................................................................................................. 9-7
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary vii

Manual
Figure 9-7: TPM2_1 protection module ......................................................................... 9-9

Figure 9-8: TPM2_3 front panel ................................................................................... 9-10
Figure 9-9: TPM2_42_2 front panel ............................................................................. 9-11
Figure 9-10: TPM2_63_2 front panel ........................................................................... 9-12
Figure 9-11: TPM2_63_3 Front Panel ......................................................................... 9-13
Figure 9-12: TPMH_1................................................................................................... 9-14
Figure 9-13: MO_DC0_BAS front panel ...................................................................... 9-20
Figure 9-14: MO_PAS_DCM80 front panel ................................................................. 9-21
Figure 9-15: MO_OFA21 front panel ........................................................................... 9-23
Figure 9-16: MO_CMD4C module ............................................................................... 9-25
Figure 9-17: MO_CMD8 module .................................................................................. 9-26

Figure 9-18: MO_CMD4C_E module ........................................................................... 9-27
Figure 9-19: MO_CMD4SL module ............................................................................. 9-28
Figure 9-20: Typical MO_COADM1AB_xx module ...................................................... 9-29
Figure 9-21: Typical MO_COADM2AB_Gxx module ................................................... 9-30
Figure 9-22: MO_4CP4SPMM50 module .................................................................... 9-31
Figure 9-23: MO_4CP4SPMM62 module .................................................................... 9-32
Figure 9-24: MO_4CP4SPSM module ......................................................................... 9-33
Figure 10-1: xRAP-100 front panel ............................................................................ 10-37
Figure 10-2: xRAP-100 connectors ............................................................................ 10-39
Figure 10-3: xRAP-D power supply flow .................................................................... 10-40
Figure 10-4: xRAP-D front panel ................................................................................ 10-43
Figure 10-5: xRAP-D connectors ............................................................................... 10-44
Figure 10-6: Y-cable connection ................................................................................ 10-45
Figure 10-7: Double-Y cable connection.................................................................... 10-45
Figure 10-8: RAP-BG front panel ............................................................................... 10-46
Figure 10-9: RAP-4B front panel ................................................................................ 10-48
Figure 10-10: RAP-4B alarm connectors ................................................................... 10-49
Figure 10-11: xDDF-21 patch panel for unbalanced E1 interfaces............................ 10-50
Figure 10-12: Label inside xDDF-21 patch panel door .............................................. 10-50

Figure 10-13: FST top view ........................................................................................ 10-51
Figure 10-14: ODF internal view ................................................................................ 10-52
Figure 10-15: ODF front panel ................................................................................... 10-53
Figure 10-16: OPP top view ....................................................................................... 10-54
Figure 10-17: Cable guide.......................................................................................... 10-55
Figure 10-18: Fiber guide for ETSI A racks ............................................................... 10-55
Figure 10-19: PIM2_63S traffic cable box tray for above shelf installations .............. 10-56
Figure 10-20: PIM2_63S traffic cable box tray for under shelf installations .............. 10-57
Figure 10-21: Cable slack tray ................................................................................... 10-57
viii ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference List of Figures

Manual
Figure 11-1: 1++ protection .......................................................................................... 11-3

Figure 11-2: 1+R protection ......................................................................................... 11-4
Figure 11-3: Comprehensive protection ....................................................................... 11-6
Figure 11-4: P2MP link protection example ................................................................. 11-7
Figure 11-5: P2MP node protection example .............................................................. 11-8
Figure 11-6: H-VPLS with dual homing for access rings ............................................. 11-9
Figure 11-7: LAG scenario ......................................................................................... 11-10
Figure 11-8: Ethernet ring protection ......................................................................... 11-12
Figure 11-9: Fast IOP protection ................................................................................ 11-13
Figure 11-10: Typical SNCP-protected network sites ................................................ 11-15
Figure 11-11: SNCP-protected XDM sites ................................................................. 11-16

Figure 11-12: MSP protection modes ........................................................................ 11-19
Figure 11-13: Two-fiber protection ............................................................................. 11-21
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary ix

Manual
x ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
List of Supported
Table 1-1:
Tables modules in basic and hybrid XDM-100 .............................. 1-13
Table 1-2: Supported modules in expanded XDM-100 ........................................ 1-14
Table 1-3: Supported modules in double-expanded XDM-100 ............................ 1-15
Table 2-1: MXC50 indicators and functions............................................................ 2-4
Table 2-2: ECU50 indicators and functions ............................................................ 2-6
Table 2-3: ECU50-R indicators and functions ........................................................ 2-9
Table 2-4: FCU front panel LED indicators........................................................... 2-11
Table 2-5: INF50 front panel LED indicators ........................................................ 2-13
Table 2-6: CCP50-2 indicators and functions ....................................................... 2-14
Table 3-1: FCU front panel LED indicators............................................................. 3-4
Table 3-2: ECU300-F indicators and functions....................................................... 3-7
Table 3-3: ECU100 indicators and functions .......................................................... 3-9
Table 3-4: MXC-100 indicators and functions ...................................................... 3-13
Table 3-5: MXC-100B indicators and functions .................................................... 3-15
Table 3-6: Available aggregate module types ...................................................... 3-20
Table 3-7: SAM1_4/E front panel LED indicators ................................................. 3-21
Table 3-8: SAM1_4O/SAM1_4OB front panel LED indicators ............................. 3-22
Table 3-9: SAM4_2 front panel LED indicators .................................................... 3-23
Table 3-10: SAM16_1/SAM16_1B front panel LED indicators ............................... 3-24
Table 4-1: FCU300 front panel indicators ............................................................... 4-3
Table 4-3: ECU300 indicators and functions ........................................................ 4-10
Table 4-4: MXC300 indicators and functions........................................................ 4-14
Table 5-1: FCU900 front panel indicators ............................................................... 5-3
Table 5-3: ECU900 indicators and functions .......................................................... 5-9
Table 5-4: MXC900 indicators and functions........................................................ 5-13
Table 6-1: PDH and SDH I/O modules and cards .................................................. 6-2
Table 6-2: PDH I/O module types ........................................................................... 6-4
Table 6-3: PIM2_21 modules and E1 interfaces per shelf ..................................... 6-5
Table 6-4: PIM2_21 front panel LED indicators...................................................... 6-6
Table 6-5: PIM2_42 modules and E1 interfaces per shelf ..................................... 6-7
Table 6-6: PIM2_42 front panel LED indicators...................................................... 6-7
Table 6-7: PIM2_63/B modules and E1 interfaces per shelf .................................. 6-8
Table 6-8: PIM2_63/B front panel LED indicators .................................................. 6-9
Table 6-9: PIM2_63S modules and E1 interfaces per shelf ................................. 6-10
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xi
List of Tables XDM-100 Product Line Reference

Manual
Table 6-10: PIM2_63S front panel LED indicator ................................................... 6-11

Table 6-11: PIM345_3 modules and E3/DS-3/STS-1 interfaces per shelf ............. 6-13
Table 6-12: PIM345_3 front panel LED indicators .................................................. 6-14
Table 6-13: SDH I/O module and card types .......................................................... 6-15
Table 6-14: SIM1_4/E modules and OC-3 interfaces per shelf .............................. 6-16
Table 6-15: SIM1_4/E front panel LED indicators .................................................. 6-17
Table 6-16: SIM1_4/O or SIM1_4OB modules and OC-3 interfaces per shelf ...... 6-17
Table 6-17: SIM1_4/O and SIM1_4OB front panel LED indicators ........................ 6-18
Table 6-18: SIM1_8 modules and OC-3 interfaces per shelf ................................. 6-19
Table 6-19: SIM1_8 front panel LED indicators...................................................... 6-20
Table 6-20: SIM4_2 modules and OC-12 interfaces per shelf ............................... 6-21

Table 6-22: SIM4_4 modules and STM-1/4 interfaces per shelf ............................ 6-22
Table 6-24: SIM4_8 modules and STM-1/4 interfaces per shelf ............................ 6-24
Table 6-26: SIM16_1 modules and STM-16 interfaces per shelf ........................... 6-26
Table 6-27: SIM16_1 front panel LED indicators.................................................... 6-27
Table 6-28: SIM16_2 modules and STM-16 interfaces per shelf ........................... 6-28
Table 6-30: SIM16_4 cards and STM-16 interfaces per shelf ................................ 6-29
Table 6-32: SIM16_8 cards and STM-16 and STM-1/4 interfaces per shelf .......... 6-32
Table 6-36: SIM64_XFP cards and STM-64 interfaces per shelf ........................... 6-35
Table 6-37: SIM64_XFP front panel LED indicators............................................... 6-36

Table 6-40: CRPT25_2C front panel LED indicators .............................................. 6-40
Table 6-41: CTRP25_2C front panel LED indicators .............................................. 6-40
Table 6-42: CCMB25_2D front panel LED indicators ............................................. 6-41
Table 6-43: OHU indicators and functions .............................................................. 6-46
Table 7-1: Data module types................................................................................. 7-2
Table 7-2: EISMB_804 modules and Ethernet interfaces per shelf ..................... 7-12
Table 7-3: EISMB_804 main and protection module slots per shelf .................... 7-13
Table 7-4: EISMB_804 front panel LED indicators ............................................... 7-14
Table 7-5: EISMB_840 modules and Ethernet interfaces per shelf ..................... 7-15
xii ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference List of Tables

Manual
Table 7-7: Port cable options ................................................................................ 7-16
Table 7-9: DIOM_04 modules and Ethernet interfaces per shelf ......................... 7-18
Table 7-10: DIOM_04 main and protection module slots per shelf ........................ 7-18
Table 7-11: DIOM_04 front panel LED indicators................................................... 7-19

Table 7-17: Port cable options ................................................................................ 7-23
Table 7-19: MCSM port numbering and assignment .............................................. 7-26
Table 7-20: MCSM WAN port specifications .......................................................... 7-27
Table 7-21: MCSM modules and Ethernet interfaces per shelf .............................. 7-28
Table 7-22: MCSM main and protection module slots per shelf............................. 7-28
Table 7-23: MCSM front panel LED indicators ....................................................... 7-30
Table 8-1: ACP100 front panel LED indicators and connectors ........................... 8-10
Table 8-2: ACP900 front panel LED indicators and connectors ........................... 8-12
Table 9-1: TC front panel LED indicators ............................................................... 9-6
Table 9-2: TCF front panel LED indicators ............................................................. 9-7
Table 9-3: TPM2_1 front panel LED indicators ...................................................... 9-9
Table 9-4: TPM2_3 front panel LED indicators .................................................... 9-10
Table 9-5: TPM2_42_2 front panel LED indicators .............................................. 9-11
Table 9-8: TPMH_1 front panel LED indicators .................................................... 9-14
Table 9-9: XDM-50 slots allocation for protection schemes ................................. 9-15
Table 9-10: XDM-100 slots allocation for protection schemes ............................... 9-16

Table 9-13: MO_DC0_BAS indicators .................................................................... 9-20
Table 9-14: MO_PAS_DCM80 indicators ............................................................... 9-22
Table 9-15: MO_OFA21 indicators ......................................................................... 9-23
Table 9-16: MO_CMD4C front panel LED indicators ............................................. 9-25
Table 9-17: MO_CMD8 front panel LED indicators ................................................ 9-26
Table 9-18: MO_CMD4C_E front panel LED indicators ......................................... 9-27
Table 9-19: MO_CMD4SL front panel LED indicators............................................ 9-28
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xiii
List of Tables XDM-100 Product Line Reference

Manual
Table 9-20: MO_COADM1AB_xx front panel LED indicators ................................ 9-29

Table 9-21: MO_COADM2AB_Gxx front panel LED indicators ............................. 9-30
Table 9-22: MO_4CP4SPMM50 front panel LED indicators .................................. 9-31
Table 9-23: MO_4CP4SPMM62 front panel LED indicators .................................. 9-32
Table 9-24: MO_4CP4SPSM front panel LED indicators ....................................... 9-33
Table 10-1: xRAP-100 front panel component functions ...................................... 10-38
Table 10-2: xRAP-100 connectors........................................................................ 10-39
Table 10-3: xRAP-D front panel component functions ......................................... 10-43
Table 10-4: xRAP-D connector functions ............................................................. 10-44
Table 10-5: RAP-BG front panel component functions ........................................ 10-46
Table 10-6: RAP-4B front panel component functions ......................................... 10-48

Table 10-7: RAP-4B connector functions ............................................................. 10-49
Table 10-8: XDM-100 cables ................................................................................ 10-58
xiv ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
About This Manual
In this chapter:
Overview .......................................................................................................... xv
Intended Audience ............................................................................................ xv
Document Organization ................................................................................... xvi
Document Conventions ................................................................................... xvi
Related Documentation ................................................................................. xviii
Obtaining Technical Documentation ............................................................. xviii
Technical Assistance ....................................................................................... xix
Overview
The XDM®-100 Product Line Reference Manual describes the key
components of the XDM-50, XDM-100, XDM-300, and XDM-900 including
cards, modules, accessories, and related capabilities.
It also provides detailed descriptions for interpreting indicator functions,
enabling field personnel to troubleshoot hardware-related problems.
Intended Audience
The XDM®-100 Product Line Reference Manual is intended for field and other
qualified service personnel responsible for installing the XDM-50, XDM-100,
XDM-300, and XDM-900 and their accessories.
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xv
About This Manual XDM-100 Product Line Reference

Manual
Document Organization
This Reference Manual contains the following information:
 XDM-50, XDM-100, XDM-300, and XDM-900 shelves overview
 XDM-50, XDM-100, XDM-300, and XDM-900 common cards
 Cards and modules used in the three products
 Tributary Protection Unit (TPU)
 Accessories
 Additional functionality
Document Conventions
When applicable, this manual uses the following conventions.
Conventio n Indicates Example
Bold Names of windows, dialog On the Alarms menu...
boxes, menus, buttons, and
most other GUI elements
Menu > Option Selection from a menu, or Select Update > View
leading to another Objects
command
Italics New terms, emphasized Examples in text

text, and names of manuals
and documents
Borders around text Notes, cautions, and See examples below
warnings
xvi ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference About This Manual

Manual
NOTE: Text set off in this manner presents clarifying

information, specific instructions, commentary, sidelights, or
interesting points of information.
CAUTION: Text set off in this manner indicates that failure to

follow directions could result in damage to equipment or loss
of information.
WARNING: Text set off in this manner indicates that failure

to follow directions could result in bodily harm or loss of life.
LASER WARNING: Text set off in this manner indicates how

to avoid personal injury. All personnel involved in equipment
installation, operation, and maintenance must be aware that
laser radiation is invisible. Therefore, although protective
devices generally prevent direct exposure to the beam,
personnel must strictly observe the applicable safety
precautions and, in particular, must avoid staring into optical
connectors, either directly or using optical instruments.
ESD: Text set off in this manner indicates information on

how to avoid discharge of static electricity and subsequent
damage to the unit.
TIP: Text set off in this manner includes helpful information

and handy hints that can make your task easier.
IMPORTANT: Text set off in this manner presents essential

information to which you must pay attention.
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xvii

Manual
Related Documentation
The following publications may be of assistance to you in the installation and
commissioning processes of the XDM-100 Product Line:
 Multiservice Packet-Optical Transport Platform General Description
 XDM-50 Installation and Maintenance Manual
 EMS-XDM User Manual
®
 LightSoft User Manual
Obtaining Technical
Documentation
To obtain technical documentation related to ECI Telecom products, contact:
ECI Telecom Ltd.
Documentation Department
30 Hasivim St.
Petach Tikva 49130
Israel
Fax: +972-3-9268060
Email: techdoc.feedback@ecitele.com
xviii ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference About This Manual

Manual
Technical Assistance
The configuration, installation, and operation of the XDM-100 Product Line
and its operation in a network are highly specialized processes. Due to the
different nature of each installation, some planning aspects may not be covered
in this manual.
If you have questions or concerns about your network design or if you require
installation personnel to perform the actual installation process, ECI Telecom
maintains a staff of design engineers and highly trained field service personnel.
The services of this group are available to customers at any time.
If you are interested in obtaining design assistance or a network installation
plan from ECI Telecom's Customer Support team, contact your ECI Telecom
sales representative. With any support related issues, technical or logistic,
contact the ECI Telecom Customer Support center at your location or our
central customer support center action line at:
Telephone +972-3-9266000
Telefax +972-3-9266370
Email on.support@ecitele.com
ECI Telecom's XDM and BroadGate® product lines are

certified to comply with MEF9 and MEF14 standards.
ECI Telecom's qualification lab is accredited by A2LA for

competence in electrical testing according to the International
Standard ISO IEC 17025-2005 General Requirements for the
Competence of Testing and Calibration Laboratories .
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xix

Manual
xx ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
1
Introduction
In this chapter:
XDM-50 Platform Overview ........................................................................... 1-2
XDM-50 Shelf Options ................................................................................... 1-3
XDM-100 Platform Overview ......................................................................... 1-5
XDM-100 Shelf Configurations ...................................................................... 1-6
XDM-100 I/O Protection Options ................................................................... 1-8
XDM-100H Overview ................................................................................... 1-10
XDM-300 Platform Overview ....................................................................... 1-16
XDM-300 I/O Protection Options ................................................................. 1-17
XDM-900
XDM-900 Platform Overview
I/O Protection ....................................................................... 1-23
Options ................................................................. 1-25
DCC Functionality ......................................................................................... 1-30
Management Architecture ............................................................................. 1-33
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary 1-1
Introduction XDM-100 Product Line Reference

Manual

ECI Telecom's XDM-50 is a miniature add/drop multiplexer optimized
especially for metro-access and cellular networks.
The XDM-50 compact multiservice platform delivers a cost-effective and
affordable mix of Ethernet, SDH and PDH services, resulting in new revenue-
generating opportunities. It offers a wide variety of features and benefits,
including:
 Highly cost-effective, redundant, and flexible ADM-1/4 and TM-1/4
solution in line with the XDM build-as-you-grow architecture™, providing
significant savings in both OPEX and CAPEX.
 Minimal physical size, broad flexibility, and scalability.
 Operational within an extended range of environmental conditions.
 Ample versatility, supporting PDH, SDH, and Ethernet interfaces and
services.
 Compatible with XDM family counterparts, including most I/O TPU and
SFP modules.
 Upgradable to SDH/CWDM sublambda grooming for transporting SAN
and data services in the metro-access portion of the network.
The XDM-50 is compact and resilient, making it perfectly suited for both
indoor and outdoor enclosures. Due to its extended operating temperature
range, it is also well suited for harsh environmental conditions.

The XDM-50 shelf was designed to facilitate simple installation and
maintenance. Hot insertion of cards and modules is allowed, supporting quick
maintenance and repair without affecting traffic.
For a detailed description of the XDM-50 platform, see the Multiservice
Packet-Optical Transport Platform General Description.
Figure 1-1: XDM-50 shelf
1-2 ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference Introduction

Manual
XDM-50 Shelf Options

The XDM-50 boasts an extremely high modular structure and is offered in two
shelf configurations:
 Basic XDM-50 shelf with two identical MXC50 (Main Cross Connect)
cards for supporting system redundancy.
The lower part of the shelf consists of the INF50 redundant input DC
modules and the External Connection Unit (ECU50/ECU50-R). Above are
the MXC50 cards and the CCP50-2 connection and I/O protection module.
The upper part of the shelf consists of the modules cage which houses up to
four I/O modules. Various types of interface modules supporting PDH,
SDH, and data services are available.
All electrical connections are located directly in the tributary modules;
therefore, the XDM-50 does not need additional electrical interface
connections.
The FCU50 (Fan Control Unit) at the right of the shelf provides cooling air
to the system. It contains six separate fans for added system redundancy.
Air is drawn in by the fans from the right side of the chassis and exhausted
through the horizontally mounted cards and modules and the left side of the
chassis. Redundant controllers, located on the two MXC50 cards, activate
the fans.
In case of failure of one of the fans, the remaining fans provide redundancy
and start
can be to operate
extracted andinreplaced
turbo mode untilinterrupting
without the FCU50 the
is replaced. The FCU50
multiplexer
operation, provided the replacement does not exceed a few minutes.
The basic XDM-50 cage contains slots for I/O interface modules and
dedicated slots for the MXC50 cards, the CCP50-2, INF50, FCU50, and
ECU50/ECU50-R. The cage's design and mechanical practice conform to
international mechanical standards and specifications.
The module and card slots are distributed as follows:
 Four (4) slots, I1 to I4, optimally allocated for I/O interface modules
 One (1) slot allocated for the ECU50 or ECU50-R card
The ECU50 or ECU50-R card is located beneath the MXC50 cards. Its
front panel features several interface connectors for management, external
timing, alarms, and orderwire. It also includes alarm severity colored LED
indicators.

Manual
 Expanded XDM-50 shelf consists of the XDM-50 basic shelf and the TPU
expansion shelf mounted on top, to add protection of electrical I/O
modules.
The TPU is a single-shelf cage with slots for the Tributary Protection
Modules (TPMs), and a Tributary Control (TC) or Tributary Control and
Fan (TCF) module. The modules are distributed as follows:
 Four (4) slots flexibly allocated for TPMs (single-slot or double-slot
modules are supported)
 One (1) slot allocated for the TC or TCF module
Each TPM is connected to the operating and protection modules of the
XDM-50 shelf respectively. If a failure is detected in one of the operating
I/O modules, the XDM-50 control system sends control signals to the
appropriatemodule.
protection TPM toSeveral
switch traffic from
types of TPMthemodules
operating
forI/O module
1:1, 1:2, orto1:3
the
protection schemes are supported.
The TC or TCF is connected to the DC and control buses of the MXC50
cards via the TPU backplane. It controls the switching of traffic from the
main to protection I/O module by relays in the corresponding TPM. In
addition, the optional TCF has three fans that provide cooling air to the
modules installed in the TPU.
The TPU is a 231 mm deep, 443 mm wide, and 75 mm high unit. It
connects to a connector on top of the XDM-50 shelf that provides the
power and control buses required for its operation. When the TPU is not
installed, a protection cap covers this connector.
Figure 1-2: Basic XDM-50 shelf layout

Manual

ECI Telecom's XDM-100 compact multiservice platform delivers a cost-
effective and affordable mix of Ethernet, SDH, and PDH services, resulting in
new revenue-generating opportunities. It offers a wide variety of features and
benefits, including:
 Gradual in-service capacity expansion based on service provisioning needs.
An optical connection operating at a specific STM rate can be upgraded
from STM-1 to STM-4/STM-16 without affecting traffic.
 Sublambda grooming enabling high utilization of existing fibers and top
efficiency in transmission of different types of services.
 Multi-ADM and cross-connect functionality for deployment in flexible
network topologies, such as ring, mesh, and star.
The XDM-100 is compact and resilient. Due to its extended operating
temperature range, it is well suited to harsh environmental conditions.
For a detailed description of the XDM-100 platform, see the Multiservice
Packet-Optical Transport Platform General Description.

Manual
XDM-100 Shelf Configurations

The XDM-100 shelf is available in the following shelf configurations:
 Pure MSPP (also known as XDM-100) for pure SDH and data services.
By default, the pure MSPP is configured with two matrix cards and an
optional TPU shelf. The pure SDH platform may be configured with two
matrix cards or, alternatively, with a single matrix card and a single MXC-
BR card. The exact configuration can be tailored to meet specific client
requirements.
 Converged MSPP/CWDM platform (also known as XDM-100H)
supports the complete range of SDH and data services and adds CWDM
functionality, serving as a single converged platform for both data and
optical features. By default, the converged platform is configured with two
matrix cards and a TPU/OCU (Optical CWDM Unit) shelf. A second
optional TPU is also available. The exact configuration can be tailored to
meet specific client requirements.
 Pure CWDM platform (also known as XDM-200) focuses on pure
CWDM optical services. By default, the pure CWDM platform is
configured with one matrix card and a TPU/OCU shelf. As with all XDM
platforms, the exact configuration can be tailored to meet specific client
requirements.
Pure SDH MSPP

In its maximum Configuration
configuration, (XDM-100)
the pure SDH MSPP accommodates the
following modules:
 Eight (8) slots, I1 to I8, allocated for I/O interface modules.
 Two (2) slots, A and B respectively, allocated for the MXC cards (main and
protection). Each MXC card has two slots (A1 and A2 and B1 and B2) to
accommodate SDH aggregate modules.
 One (1) slot allocated for the ECU card.
 A TPU single-shelf cage with slots for the TPMs and TC or TCF modules.
The modules are distributed as follows:
 Four (4) slots flexibly allocated for TPMs (single-slot or double-slot
modules are supported).
 One (1) slot allocated for the TC or TCF module.

Manual
Converged MSPP/CWDM Configuration

(XDM-100H)
The converged configuration of the XDM-100 integrates the modularity
features of both the pure MSPP and the pure CWDM:
 Pure MSPP XDM-100 shelf, as described in Pure SDH MSPP
Configuration (XDM-100) (page 1-6), including:
 ECU
 Two (2) MXC-100/B cards
 I/O modules cage with eight slots as described in Pure SDH MSPP
Configuration (XDM-100) (page 1-6)
 FCU
 TPU/OCU mounted on top of the basic shelf. Either one or two TPU/OCU
units may be mounted on top of the shelf, including:
 Four (4) slots for supporting any mix of Mux/DeMux, splitter/coupler,
OADM, optical amplifiers, or TPM modules
 One (1) TC or TCF module for carrying the power and control from the
main shelf to the TPU/OCU backplane

Manual
XDM-100 I/O Protection Options

The XDM-100 shelf boasts an extremely high modular structure and can be
configured with or without I/O protection:
 Basic XDM-100 shelf housed in a compact equipment cage. I/O protection
is not supported in this option.
 Expanded XDM-100 with I/O protection. A TPU is mounted on top of the
basic shelf providing protection to the I/O modules.
 Double-expanded XDM-100 shelf with I/O protection and enhanced
CWDM networking capabilities. An OCU is mounted on top of the
expanded XDM-100 shelf and provides increased CWDM networking
functions in addition to I/O protection.
NOTE: It is recommended that the XDM-100 shelf be

installed in an ETSI A rack (2200 mm or 2600 mm). However,
it can also be installed in 19" 600 mm depth racks (without air
filters) that have been approved by ECI Telecom. (For detailed
information about ETSI A racks, see section Rack Installation
in the XDM-100 IMM.)
Basic XDM-100 Shelf

The basic
(17.44 in.)XDM-100
wide, and shelf
200 mmis housed in ahigh
(7.87 in.) 231 equipment
mm (9.1 in.) deep,
cage. The443 mm part of
lower
the shelf consists of the card cage and accommodates the MXC cards (main
and protection) and the ECU. The upper part of the shelf consists of the module
cage and houses up to eight I/O modules.
I/O protection is not supported in this option.
Figure 1-4: Basic XDM-100 shelf

Manual
Expanded XDM-100 with I/O Protection

A TPU is mounted on top of the basic shelf and provides protection to the I/O
modules. Each TPM is connected to both operating and protection I/O modules
in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of
the operating I/O modules, the active MXC via the TC module in the TPU
switches the traffic from the active I/O module to the protection module.
Figure 1-5: Expanded XDM-100 shelf
Double-Expanded XDM-100
An OCU is mounted on top of the expanded XDM-100 shelf. This option
provides I/Ocapabilities
networking protection to
as the
the XDM-100.
expanded XDM-100, and adds CWDM
Figure 1-6: Double-expanded XDM-100 shelf

Manual
XDM-100H Overview
The XDM-100H integrates the Ethernet, SDH, and PDH capabilities of the
XDM-100 with the Coarse Wavelength Division Multiplexing (CWDM)
functionality of the XDM-200. It is compact, fully modular, and redundant.
NOTE: The XDM-100H is a cost option and can only be

implemented if your XDM-100 is licensed appropriately.
A TPU/OCU shelf can be mounted on top of the XDM-100 basic shelf to add
I/O protection and optical CWDM networking capabilities. The TPU/OCU is
identical in physical dimensions to the TPU and supports any mix of TPMs,
OADMs, Mux/DeMux, and couplers/splitters. Up to two TPU/OCU shelves
can be installed on the basic XDM-100 shelf.
Due to the high capacity of the traffic carried by the XDM-100H, protection is
of the utmost importance. The protection mechanisms incorporated into the
system ensure traffic reliability. These include hardware redundancy of
specified critical circuits, highly reliable trail protection mechanisms, and
Optical Channel (OCH) 1+1 protection and Optical Multiplex Section
Protection (OMSP) for line protection.

Manual
XDM-100H Description
The XDM-100H consists of the following units:
 Basic XDM-100 shelf as described in Basic XDM-100 Shelf (page 1-8).
The shelf includes the ECU or ECU-F, two MXC cards, the I/O modules
cage with eight slots, and the FCU.
Each MXC houses an NVM module which contains the licensed optional
software.
 The eight slots of the I/O modules cage support installation of XDM-100
I/O modules, as well as XDM-200 CWDM I/O modules (transponders and
combiners).
 A TPU/OCU shelf mounted on top of the basic XDM-100 shelf with five
slots: four for supporting any mix of Mux/DeMux, OADM,
splitters/couplers, and TPMs, and one for a TC module. One or two
TPU/OCUs can be mounted on the basic XDM-100 shelf.
NOTE: When two TPU/OCUs are installed, the second

(upper) TPU/OCU does not support low order (E1 or DS-1)
signals due to cabling limitations.
Figu re 1-7: XDM-100 with a TPU/OCU shel f

Manual
XDM-100H Configuration Options

The XDM-100H has three configuration options:
 Basic shelf
 Expanded shelf (with one TPU/OCU)

 Double-expanded shelf (with one TPU/OCU and one OCU)
All these options can be configured based on the type of system license
purchased.
TPU/OCU slots designation
One or
cage ontwo
top TPU/OCUs
of the basic can
shelfbeismounted on M1;
designated top of
thethe basic
cage on XDM-100. Thecage
top of the M1
is designated M2.
 Slots in M1 are M1-1 to M1-5.
 Slots in M2 are M2-1 to M2-5.
Figure 1-8: TPU and OCU slots desi gnatio n
When the hybrid option is enabled, the M1 cage is designated TPU/OCU. It

can accommodate any mix of TPM and CWDM modules. The M2 cage is
always designated OCU and can accommodate only CWDM modules.

Manual
Assignment options for TPU/OCU cages
The following figure shows the layout of the basic XDM-100 shelf
configuration.
Figure 1-9: Basic XDM-100
Table 1-1: Suppor ted modul es in basic and hybri d XDM-100

I/O modul es cage slots I1 to I8
Regular Hybrid
Only XDM-100 I/O modules (PIMs, Any mix of I/O modules (PIMs, SIMs,
SIMs, EISMBs, EISMs, DIOMs) EISMBs, EISMs, DIOMs) and CWDM
modules (transponders and combiners)

Manual
The following figure shows the layout of the expanded XDM-100 shelf
configuration.
Figure 1-10: Expanded XDM-100
Table 1-2: Suppor ted modul es in expanded XDM-100
I/O modul es cage slot s I1 to I8 M1 modu les cage slot s M1-1 to M1-4
Regular Hybrid Regul ar Hybrid

Only XDM-100 Any mix of I/O Only TPMs Any mix of TPM and
I/O modules modules (PIMs, CWDM optical
(PIMs, SIMs, SIMs, EISMBs, modules (Mux/DeMux,
EISMBs, EISMs, EISMs, DIOMs) and splitters/couplers,
DIOMs) CWDM modules OADM)
(transponders and
combiners)
NOTE: Slot M1-5 can accommodate TC modules only.

Manual
The following figure shows the layout of the double-expanded XDM-100 shelf
configuration.
Figure 1-11: Double-expanded XDM-100
Table 1-3: Suppor ted modul es in double-expanded XDM-100
I/O modu les cage slot s I1 to I8 M1 modu les cage slot s M1-1 to M2 modules cage slots M2-1
M1-4 to M2-4
Regular Hybrid Regular Hybrid Regular Hybrid
Only I/O Any mix of I/O Only TPMs Any mix of TPM -- Only CWDM
modules (PIMs, modules (PIMs, and CWDM optical modules
SIMs, EISMBs, SIMs, EISMBs, optical modules (Mux/DeMux,
EISMs, DIOMs) EISMs, (Mux/DeMux, splitters/couplers,
DIOMs) and splitters/couplers, OADM)
CWDM OADM)
modules
(transponders
and combiners)
NOTE: Slots M1-5 and M2-5 can accommodate TC modules

only.

Manual

ECI Telecom's XDM-300 is a powerful flexible MSPP optimized for metro
networks. It supports multitude technologies in a cost-effective fashion to
address the market increasing traffic demands.
The XDM-300 supports scalable STM-1/4/16/64/OTN aggregates and flexible
access topologies. It offers a wide range of features and benefits including:
 Carrier class Ethernet as well as traditional SDH voice-centric services.
 Gradual in-service capacity expansion based on service provisioning needs.
An optical connection operating at a specific STM rate can be upgraded
from STM-1 to STM-4/STM-16/STM-64 without affecting traffic.
 Sublambda grooming resulting in high utilization of existing fibers and top
efficiency in transmission of different types of services.
 Supporting CWDM, OADM, transponder, combiner, OFA, and other
optical cards and modules used to process, amplify, and monitor
multichannel signals.
For a detailed description of the XDM-300 platform, see XDM General
Description.

Manual

The XDM-300 features an extremely high modular structure and can be
 Expanded XDM-300 with I/O protection as follows:
 A TPU mounted on top of the basic shelf, providing protection to the
I/O modules in the upper module cage.
 A TPU mounted at the bottom of the basic shelf, providing protection
to the I/O modules in the lower module cage.
 Two TPUs mounted, one on top and one at the bottom of the basic
shelf, providing protection to the I/O modules installed in both the
upper and the lower module cages.
 Expanded XDM-300 shelf with I/O protection and enhanced CWDM
networking capabilities. Two TPUs mounted one on top of the basic shelf
and one under it, for I/O protection. In addition, an OCU is mounted on top
of the upper TPU, which provides increased CWDM networking functions.
Basic XDM-300 Shelf

The basic XDM-300 shelf is housed in a 246 mm (9.68 in.) deep, 443 mm
(17.44 in.) wide, and 350 (13.78 in.) mm high equipment cage. The upper part
of the shelf consists of a module cage (upper module cage) and houses up to
eight I/O modules. In the middle of the shelf is a card cage that accommodate
the MXC300 cards (main and protection), the External Connection Unit
(ECU300), and up to two I/O cards. The lower part of the shelf consists of an
additional module cage (lower module cage) that can be equipped with up to
eight I/O modules.

Manual
The XDM-300 shelf can be installed in a horizontal or vertical position.
Figure 1-13: Basic XDM-300 shelf, ho rizontal i nstall ation

Manual
Figure 1-14: Basic XDM-300 shelf, vertical Ins tallatio n

Manual

TPUs can be attached to the XDM-300 shelf to protect installed I/O modules.
Each TPM is connected to both operating and protection I/O modules in the
shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the
operating I/O modules, the active MXC300/MXC900 via the TC module in the
TPU switches the traffic from the active I/O module to the protection module.
Several protection configurations are possible:
 A TPU mounted on top of the basic shelf, protects I/O modules residing in
the upper module cage.
 A TPU mounted at the bottom of the basic shelf, protects I/O modules
installed in the lower module cage.
 Two TPUs mounted one on top and one at the bottom of the basic shelf,
provide protection to I/O modules in both the upper and lower module
cages.
Figure 1-15: XDM-300 with TPU on top

Manual
Figure 1-16: XDM-300 wit h TPUs on top and at th e botto m

Manual
Expanded XDM-300 with CWDM Networking

Capabilities
An OCU can be mounted on top of a basic XDM-300 shelf or on top of an
expanded shelf to add enhanced CWDM networking capabilities to the
platform.
NOTE: An OCU is not supported at the bottom of the XDM-

300 shelf.
Figure 1-17: XDM-300 with two TPUs and an OCU

Manual

The XDM-900 is a high-density (120 Gbps TDM and 240 Gbps switching)
hybrid Ethernet/TDM multiservice platform optimized for high-capacity nodes
in metro and metro-core networks. The XDM-900 provides cost-optimized
native Ethernet and TDM handling, from MADM-16/64 to full blown 10 GbE
Layer 2 Ethernet and MPLS-TP switching, all in a single chassis, enabling
cost-effective network expansion and smooth migration to NG packet-based
transport networks. This future-proof platform offers best-of-breed capabilities
and optional ASON control support for enhanced protection and restoration
with minimal power consumption and footprint.
By supporting the most advanced carrier class Ethernet-based services
(Layer 1, Layer 2, EoS, MPLS-TP over transport as well as native
Ethernet/MPLS-TP), the XDM-900 is well positioned to implement cellular
backhaul transition/migration plans while supporting full triple play services
for residential NGN applications. This platform lets you preserve your existing
network structure and working procedures as you shift seamlessly towards
packet-based services.

Manual
The XDM-900 is a small footprint subrack that fits into ETSI, 19”, and 23”
racks. Its dimensions are 325 mm high, 443 mm wide, and 300 mm deep. Up to
three XDM-900 platforms can be installed per rack, providing up to 360 Gbps
capacity per rack with low power consumption. The XDM-900 standard shelf
is arranged as follows:
 Eighteen slots (I1 to I18) flexibly allocated to up to eighteen I/O interface
modules, including 2 SDH quad I/O modules (wide slots) and 16 tributary
interface modules (PIM, SIM, and Ethernet cards DIOM, EISMB, and
MCSM). These modules enable a combination of PDH, SDH, and Ethernet
services, supporting up to 12 x STM-64 or up to 48 x STM-16 interfaces.
 Two slots (MXC-A and MXC-B) allocated to the MXC900 cards, for
60/120 Gbps cross-connect control. Integrated ASON control capabilities
are available using an optional ASON module in the MXC900/MXC300.
 One slot allocated to the ECU900/ECU900-F card.
 One FCU900 that consists of eight separate fans to support cooling system
redundancy, activated by redundant controllers located on the MXC900
cards.
The XDM-900 can be expanded through three expansion shelves, using TPU
shelves to add tributary protection capability, and/or OCU shelves to add
CWDM modules (Mux/DeMux, OADM, optical filters).

Manual

The XDM-900 features an extremely high modular structure and can be
 Expanded XDM-900 with I/O protection as follows:
 A TPU mounted on top of the basic shelf, providing protection to the
I/O modules in the upper module cage.
 A TPU mounted at the bottom of the basic shelf, providing protection
to the I/O modules in the lower module cage.
 Two TPUs mounted, one on top and one at the bottom of the basic
shelf, providing protection to the I/O modules installed in both the
upper and the lower module cages.
 Expanded XDM-900 shelf with I/O protection and enhanced CWDM
networking capabilities. Two TPUs mounted one on top of the basic shelf
and one under it, for I/O protection. In addition, an OCU is mounted on top
of the upper TPU, which provides increased CWDM networking functions.
Basic XDM-900 Shelf

The basic XDM-900 shelf is housed in a 246 mm (9.68 in.) deep, 443 mm
(17.44 in.) wide, and 350 (13.78 in.) mm high equipment cage. The upper part
of the shelf consists of a module cage (upper module cage) and houses up to
eight I/O modules. In the middle of the shelf is a card cage that accommodate
the MXC900/MXC300 cards (main and protection), the External Connection
Unit (ECU900), and up to two I/O cards. The lower part of the shelf consists of
an additional module cage (lower module cage) that can be equipped with up to
eight I/O modules.

Manual
The XDM-900 shelf can be installed in a horizontal or vertical position.
Figure 1-19: Basic XDM-900 shelf, ho rizontal i nstall ation
Figure 1-20: Basic XDM-900 shelf, vertical Ins tallatio n

Manual

TPUs can be attached to the XDM-900 shelf to protect installed I/O modules.
Each TPM is connected to both operating and protection I/O modules in the
shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the
operating I/O modules, the active MXC900/MXC300 via the TC module in the
TPU switches the traffic from the active I/O module to the protection module.
Several protection configurations are possible:
 A TPU mounted on top of the basic shelf, protects I/O modules residing in
the upper module cage.
 A TPU mounted at the bottom of the basic shelf, protects I/O modules
installed in the lower module cage.
 Two TPUs mounted one on top and one at the bottom of the basic shelf,
provide protection to I/O modules in both the upper and lower module
cages.
Figure 1-21: XDM-900 with TPU on top

Manual
Figure 1-22: XDM-900 wit h TPUs on top and at th e botto m

Manual
Expanded XDM-900 with CWDM Networking

Capabilities
An OCU can be mounted on top of a basic XDM-900 shelf or on top of an
expanded shelf to add enhanced CWDM networking capabilities to the
platform.
NOTE: An OCU is not supported at the bottom of the XDM-

900 shelf.
Figure 1-23: XDM-900 with two TPUs and an OCU

Manual
DCC Functionality
Data Communication Channels (DCC) are incorporated in the SDH overhead
(SHO) sections to provide management capabilities to management systems.
The communication channels enable to transfer OAM&P (Operation,
Administration, Maintenance, and Provisioning) data between the management
system and the NEs.
Two types of DCC channels are included in the SDH overhead (SOH):
 RS_DCC: three bytes (D1 - D3) within the RS part of the SOH.
The RS_DCC channel bit-rate is 192 Kbit/s.
 MS_DCC: nine bytes (D4 – D12) within the MS part of the SOH
The MS_DCC channel bit-rate is 576 Kbit/s.
DCC in the XDM-100

The DCC channels in XDM-100 are connected through two hardware buses
over the backplane. Each bus carries 16 time slots (or DCC channels). The two
buses are connected to all I/O modules in the shelf.
Figure 1-24: XDM-100 DCC capacity befor e modi ficati on

Manual
The communication processor (COM unit) on the MXC-100B has two internal
DCC buses that connect through interface ports to the backplane DCC. The
total number of DCC channels in the XDM-100 (with MXC-100B only) is up

to 64. Because each module in the XDM-100 can connect to only one bus,
mixed MS and RS DCC on the same bus is not supported for these shelves.
Figure 1-25: XDM-100 DCC capacity after m odi ficati on
DCC in the XDM-300/XDM-900

The DCC channels in XDM-300/XDM-900 are connected through four
hardware buses over the backplane. Each bus carries 16 time slots (or DCC
channels). Two buses are connected to the upper half of the shelf, and the other
two to the lower half of the shelf.
Figure 1-26: XDM-300/XDM-900 DCC capacity before modification

Manual
The communication processor (COM unit) on the corresponding MXC card has
four internal DCC buses that connect through interface ports to the backplane
DCC.
The DCC frame has two parts; the first half is used to place the DCC data on its
16 time slots. The second half of the frame (slip byte) that was not used in the
past is used now to double the DCC frame capacity to 32 channels. This
expands the number of available DCC channels in the XDM-300/XDM-900 to
84 channels.
Figure 1-27: XDM-300/XDM-900 DCC capacity after modification
Because each module in the XDM-300/XDM-900 can connect to only one bus
mixed MS and RS DCC on the same bus is not supported for these shelves.

Manual
Management Architecture
EMS-XDM
The EMS-XDM is an Element Management System (EMS) that provides a
wide range of XDM management functions, including alarms, configuration,
inventory, provisioning, and security management.
The EMS-XDM can operate standalone or directly under ECI Telecom's
LightSoft network management system on the same platform. It can also be
integrated under a non-ECI Telecom network management system or
Telecommunications Management Network (TMN) umbrella system.
The EMS-XDM
interface communicates
based on with the Forum
the TeleManagement networkMultiTechnology
manager via an open CORBA
Network
Management (TMF MTNM) standard.
The application uses its station’s Ethernet port to communicate with the
gateway network element (NE). The Digital Communications Channel (DCC)
is used to communicate with other NEs in the network (usually other elements
use only the DCC for management communication).
Figure 1-28: Typical XDM-100 Shelf View

Manual
LCT-XDM
The LCT-XDM is a PC-based installation, maintenance, commissioning, and
configuration tool for field technicians. It provides rapid direct connection to
deployed NEs using a standard simple serial interface. The LCT-XDM is
version-independent since the necessary software is embedded in the NE itself.
LCT-XDM supports all the functionality required by a technician arriving at a
site: full installation, NE commissioning (including slot assignment, IP routing,
and DCC ports configuration), full definition of cross connections, and
troubleshooting. The system provides the user with a clear view and control of
NE internals, cards and objects, status, and configuration. Access from the
LCT-XDM is password-protected to ensure that only authorized personnel can
access the field-installed equipment.
Figure 1-29: Typical XDM-100 Shelf w indo w

Manual
LightSoft Network Manager

LightSoft is a multidimensional Network Management System (NMS) that
manages the complete family of EMSs offered by ECI Telecom. LightSoft
enables network operators to assume full control of network equipment.
The application is a unified NMS that provisions, monitors, and controls all
network layers, enabling users and operators to manage multiple technology
layers independently of the physical layer. The system offers on-demand
service provisioning, pinpoint bandwidth allocation, and dramatic reductions in
the equipment and operating costs that multiple management systems often
require. It does this by providing all facets of network management, netwide,
from a single platform.
Management features include configuration, fault detection, performance
management, administrative procedures, maintenance operations, and security
control. Within one integrated management system, LightSoft enables full
control of all NEs regardless of the manufacturer, and allows a complete view
of the network at a glance. With LightSoft, multiple operators can
simultaneously configure the network while preventing any configuration
conflicts.

Manual
2
XDM-50 Common Cards
In this chapter:
Overview ......................................................................................................... 2-1
Main Cross-Connect and Control (MXC50) Card ........................................... 2-2
External Connection Unit (ECU50/ECU50-R) ............................................... 2-5
Fan Control Unit (FCU50) ............................................................................ 2-11
INF50 ............................................................................................................. 2-13
CCP50-2 ........................................................................................................ 2-14
Overview
This chapter describes the common cards used in the XDM-50 shelf. The
XDM-50 shelf supports the following common cards:
 Two MXC50 cards, each including three slots for SFP transceivers (see
"Main Cross-Connect and Control (MXC50) Card " page 2-2)
 One ECU/ECU-F or ECU/ECU-F-R card (see "External Connection Unit
(ECU50/ECU50-R)" page 2-5)
 One Fan Control Unit (FCU50) (page 2-11)
 Two INF50 (page 2-13)s
 One CCP50-2 (page 2-14)
XDM-50 Common Cards XDM-100 Product Line Reference

Manual
Main Cross-Connect and Control

(MXC50) Card
The XDM-50 shelf accommodates two identical MXC50 cards. By default, the
card in slot MXC-A is the main card and the card in slot MXC-B is the
protection card.
Figure 2-1: Basic XDM-50 shelf layout
Both cards perform the following functions simultaneously in a 1+1 protection

configuration:
 Communications and control
 Alarm and maintenance
 Cross connect
 Timing and synchronization
 Routing and handling of 16 DCC channels and one user channel
Each MXC50 contains a Non-Volatile flash Memory (NVM) card that stores a
complete backup of both the system's software and node configuration. This
ensures that the XDM-50 benefits from superior management and control
availability. Double redundancy for system software and configuration in every
shelf is provided using a redundant NVM unit in the second MXC50 card.
The active MXC50 card is configured via LightSoft, ECI Telecom Transport
Networking Division's multidimensional network manager.
The protection MXC50 card in slot MXC-B provides full 1+1 protection to the
cross-connect matrix and full 1:1 protection to all other functions, since it has
an identical database to the active MXC50 card installed in slot MXC-A.
The two MXC50 cards operate in parallel. Each XDM-50 matrix permits full
nonblocking connectivity at all VC levels. The matrices are connected to all
I/O modules, providing 2.5 Gbps capacity to every module.
XDM-100 Product Line Reference XDM-50 Common Cards

Manual
The MXC50 also has a PDH daughterboard (PDB2_21), which provides 21 E1

interfaces and mapping to SDH. The interfaces of the two MXC50 cards are
connected to the CCP50_2 module, which provides 1:1 I/O protection.

By default, after powerup, the TiMing Unit (TMU) in the MXC50 in slot
MXC-A is the active timing unit. This is indicated by the TMU LED on the
front panel of the MXC50.
In case of a hardware failure in the active MXC50 card or its traffic
interconnections, the I/O interface modules switch to the protection MXC50
within 50 msec. Similarly, in case of a hardware failure in the TMU of the
operational MXC50 card, the backup TMU takes over the timing control with
no disruption in traffic
When the red tabs on the extractor handles are pressed to replace the MXC50
card in slot MXC-A, control switches over to the MXC50 in slot MXC-B.
NOTE: This process takes several minutes and may affect

traffic if the timing or SubNetwork Connection Protection
(SNCP) functions were previously handled by the MXC50
card in slot MXC-A.
CAUTION: If the FAIL (red), MAIN (blue), and TMU

(orange) LEDs blink simultaneously, the MXC50 is not
mounted correctly, or the extractor handles are not properly
locked in the closed position.
Figure 2-2: MXC50 front panel

Manual
Table 2-1: MXC50 ind icators and func tion s
Item Functions
Switch that is concealed beneath the tab of the extractor handles
Microswitch and senses when the handles are not in the locked position. When
the red tabs in the extractor handles are pressed to extract the card,
it blocks MXC control to all I/O modules and SFP transceivers.
MAIN Blue indicator; lights when this MXC50 card is the current
multiplexer control processor.
If the FAIL, MAIN, and TMU LEDs blink simultaneously, this
indicates that the MXC50 is not mounted correctly.
ACT Green indicator; lights when the MXC50 is active and powered.
TR Orange indicator; lights when there is traffic cross connection
through the SFP transceivers in the MXC (A1, A2, A3, or
PDB2_21).
FAIL Red indicator; lights steadily when a fault is detected in the card
and flashes during software download.
TMU Orange indicator; lights when the TMU in the card is active.
IOP1 Orange indicator; lights when the PDH daughterboard (PDB2_21)
in the card is active.
ON Green indicator; lights when the laser is on and traffic is being
transmitted (separate LED for each SFP transceiver).
NVM Yellow indicator; lights when the NVM in the card is active.
Reset button Pushbutton switch that is concealed beneath the NVM cover. Press
to reset the corresponding aggregate modules (in slots A1, A2, and
A3, or B1, B2, and B3) without affecting the I/O modules in the
XDM-50 shelf.
Optical I/O Interfaces

The MXC50 card contains three I/O interface positions, which can
accommodate plug-in Small Form-factor Pluggable (SFP) transceivers. When
fully populated, one STM-4 or STM-1 and two STM-1 optical SFP transceivers
and their supporting section and path termination/monitoring are located on
each MXC50 card, which also provides their power feed and control. The
traffic buses connect each transceiver to both MXC50 switches.

Manual
External Connection Unit

(ECU50/ECU50-R)
The ECU50 is located in the lowest slot of the XDM-50 shelf. It is available in
two different configurations, ECU50 and ECU50-R, and provides the physical
interfaces between the XDM-50 and the external world.
ECU50
The ECU50 supports:
 Management interfaces, including:
 Management (NMS and EMS) interface (Ethernet)
 One Ethernet connection to NEs named MNG
 Serial (RS-232) interface for craft terminal
 Synchronization inputs and outputs (T3/T4)
 Engineering orderwire (OW) support
 Alarm interfaces and indications, including:
 Alarm severity outputs (Critical, Major, Minor, Warning)
 Alarm Cut Off (ACO)

External alarm outputs and inputs only to RAP
 LEDs for display of operation and alarms
 Activations, including:
 Laser activation during Automatic Laser Shutdown (ALS) for
maintenance purposes
 LEDs test for the entire shelf
 NetSelect switch for OW selection between two networks (rings)
NOTE: The first version of the ECU50 included a USB

connector on its front panel. This connector was removed on
later versions of the card. The functions of this connector are
available through the MNG RJ-45 connector.

Manual
The front panel of the ECU50 includes the various interface connectors.
Figure 2-3: ECU50 front panel
Table 2-2: ECU50 ind icators and fun ctio ns
Item Functions
F-CHANNEL 9-pin D-type female connector that provides a serial RS-232
communication channel supporting SLIP for connecting to a
craft terminal. Technical support personnel also use this
connector for debug functions.

An internal sensor detects if craft terminal debug is connected.
T3/T4 9-pin D-type male connector used for main timing input and
output using an ITU-T Rec. G.703 interface: T3 and T4 for 2.048
MHz signals.
It is also used for protection timing input and output using an
ITU-T Rec. G.703 interface: T3 and T4 for 2.048 MHz signals.
MNG RJ-45 connector for the main Ethernet 10BaseT management
interface.
Link State – Green indicator; lights steadily when the link
connected to the corresponding electrical port is up. Turns off
when the link is down. In this case, the Activity indicator will
also light steadily.
Activity – Orange indicator; flashes when the corresponding port
operates normally and receives and/or transmits data. Lights
steadily to indicate a problem (warning); appears only when the
link is down. Turns off when there is neither any activity nor any
warning.
ALARMS 36-pin SCSI female connector used to connect alarm input and
output lines via the RAP.
OW RJ-11 connector for accessing the 4W analog interface to the
engineering OW facility.
LASER Press this pushbutton to force laser activation during an ALS.
ACTIVE
LED TEST Press this pushbutton to turn on all the indicators located on
cards and modules installed in the shelf for test purposes.
ACO Alarm Cut-Off pushbutton; disables the buzzer activation line in
the RAP connector of the shelf while an alarm condition is
present. This mutes the RAP buzzer.
If a new alarm condition is detected, the buzzer is reactivated.
ACT Green indicator; lights when the ECU50 card is active and
powered.
FAIL Red indicator; lights when the highest unacknowledged alarm

Manual
Item Functions
severity in the shelf is a card failure alarm.
CRT Red indicator; lights when the highest unacknowledged alarm
severity in the shelf is a critical alarm.
MAJ Orange indicator; lights when the highest unacknowledged alarm
severity in the shelf is a major alarm.
MIN Yellow indicator; lights when the highest unacknowledged alarm
severity in the shelf is a minor alarm.
WAR Yellow indicator; lights when the highest unacknowledged alarm
severity in the shelf is a warning.
Also lights when the buzzer has been muted by the ACO
pushbutton.
OW Blue indicator; lights steadily to indicate a call coming from
network A.
Flashes to indicate a call coming from network B.
NET SEL Toggle switch for selecting the OW network, either A or B.
OrderWire
The purpose of the OrderWire (OW) facility is to provide an independent
communication means for communicating between various sites in a network
without requiring any other infrastructure beyond that installed for the XDM
shelves. This capability is particularly useful when it is not possible to use
phone lines, for example, during system installation or at remote locations.
The OW supports full-duplex communication, using Dual Tone Multi-
Frequency (DTMF) signaling for selective calling. A unique identification
number (the equivalent of a phone directory number) is assigned via LCT-
XDM to each shelf OW terminal.
The management station is used to provision the shelves in which the OW can
be accessed and the paths through the network that carry the OW. For
additional convenience, each network node (site) may have one or more
shelves with an OW facility.
The OW supports a wide range of call types to optimally meet the needs of
installation and maintenance personnel:
 Point-to-point – this type of call is established by dialing the phone ID of
the destination. Multiple point-to-point calls may concurrently be active in
the network.
 Conference call between several sites.
 Broadcast call addressed to all sites.
The various types of calls can be initiated by any person from any XDM shelf
equipped with a provisioned OW facility.

Manual
Implementation
XDM-50 shelves support a standard engineering OW facility with an analog
interface.
The analog interface is a standard 4 W analog interface terminated in an RJ-11
connector located on the ECU50. This connector enables connecting a standard
4 W handset using DTMF signaling, or other voice frequency equipment with
similar interface that serves the OW facility. The reception of a call is indicated
by ringing and a visual indication on the ECU50. A separate control enables
selecting the direction of transmission through the network.
The analog signals (voice and DTMF signaling) are digitized using a standard
64 kbps PCM, and are transmitted in the SDH overhead (bytes E1, E2, and/or
F1, as configured by the management station). By using the SDH overhead, the
OW avoids the need for reserving communication channels in the SDH

payload.
ECU50-R
The ECU50-R card is suitable for sites that do not require engineering OW. It
supports:
 Management (NMS and EMS) interface (Ethernet)
 One Ethernet connection to NEs, named MNG

Serial (RS-232) interface for craft terminal
 Alarm Cut Off (ACO)
 External alarm outputs and inputs only to RAP
 LEDs for the display of operation and alarms
NOTE: The first version of the ECU50-R included a USB

available through the MNG RJ-45 connector.

Manual
The front panel of the ECU50-R includes the various interface connectors.
Figure 2-4: ECU50_R front panel
Table 2-3: ECU50-R ind icators and func tion s
Item Functions
ALARMS 36-pin SCSI female connector that is used to connect alarm input
and output lines via the RAP.
F-CHANNEL 9-pin D-type female connector that provides a Serial RS-232
communication channel supporting SLIP for connecting to a craft
terminal. Technical support personnel also use this connector for
debug functions.
An internal sensor detects if a Debug of the craft terminal is
connected.
T3/T4 9-pin D-type male connector that is used for main timing input
and output using an ITU-T Rec. G.703 interface: T3 and T4 for
2.048 MHz signals.
It is also used for protection timing input and output using an
ITU-T Rec. G.703 interface: T3 and T4 for 2.048 MHz signals.
MNG RJ-45 connector for the main Ethernet 10BaseT management
interface.
Link State – Green indicator lights steadily when the link
connected to the corresponding electrical port is up. Turns off
when the link is down. In this case, the Activity indicator will also
light steadily.
Activity – Orange indicator flashes when the corresponding port
operates normally and receives and/or transmits data. Lights
steadily to indicate a problem (warning), appears only when the
link is down. Turns off when there is neither any activity nor any
warning.
LASER Press this pushbutton to force laser activation during Automatic
ACTIVE Laser Shutdown (ALS).
LED TEST Press this pushbutton to turn on all the indicators located on cards
and modules installed in the shelf for test purposes.
ACO Alarm Cut-Off pushbutton; disables the buzzer activation line in
the RAP connector of the shelf while an alarm condition is
present. This mutes the RAP buzzer.
If a new alarm condition is detected, the buzzer is reactivated.
ACT Green indicator; lights when the ECU50-R card is active and
powered.

Manual
Item Functions
FAIL Red indicator; lights when the highest unacknowledged alarm
severity in the shelf is a card failure alarm.
CRT Red indicator; lights when the highest unacknowledged alarm
severity in the shelf is a critical alarm.
MAJ Orange indicator; lights when the highest unacknowledged alarm
severity in the shelf is a major alarm.
MIN Yellow indicator; lights when the highest unacknowledged alarm
severity in the shelf is a minor alarm.
WAR Yellow indicator; lights when the highest unacknowledged alarm
severity in the shelf is a warning.
Also lights when the buzzer has been muted by the ACO
pushbutton.

Manual
Fan Control Unit (FCU50)

The FCU50 is positioned at the right side of the shelf and provides cooling air
to the system from nine separate fans. Air is drawn in by the fans from the right
side of the chassis, and is pumped out through the horizontally mounted cards
and modules through the left side of the chassis.
A controller in the active MXC50 controls the fans. If one of the fans fails, the
remaining ones start to operate in turbo mode and the fail LED lights until the
FCU50 is replaced. The FCU50 can be extracted and replaced without
interrupting the multiplexer operation (hot swapping) if the activity does not
take more than a few minutes.
W ARNING: Do not leave the system without an FCU50 unit

for more than a couple of minutes. If the FCU50 unit fails and
you do not have a replacement unit, you must shut down the
entire XDM-50 system.
Figure 2-5: FCU50 front panel
Table 2-4: FCU fron t panel LED ind icators
Marking Color Function

ACTIVE Green Lights steadily when the card is powered and operating
normally.
FAIL Red Normally off.
Lights steadily when a fault is detected.

Manual
Air Filters for FCU

XDM-50 shelves operating in extremely dusty and/or humid environments may
require installation of air filters.
Air filters can be ordered with the XDM-50; they can also be ordered
separately for installation on shelves at customer’s premises.
The purpose of the air filter is to reduce the accumulation of dust and dirt
carried by the cooling air flowing through the shelf on the internal components
of the shelf. The combination of dust and humidity produces a
capacitive/conductive layer between components installed on cards and
modules. This may degrade equipment performance or even cause
malfunctions. Moreover, the insulating effect of a dust layer causes
components to operate at higher temperatures, thus ultimately decreasing
equipment reliability.
An air filter reduces dirt accumulation and thus prevents degradation of
equipment reliability and performance. However, filters do increase the
resistance to airflow and, therefore, the appropriate type should be selected in
accordance with the actual operating conditions.
ECI Telecom offers an air filter to handle these problems. The filter is housed
in a special frame installed on the right side of the XDM-50 that is also used as
an installation bracket.
NOTE: Air filters are not supported for 19" rack installations.
Two types of air filters are available:

 Low density foam filter, with a density of 10 pores per inch (PPI)
 High density foam filter (45 PPI) in compliance with NEBS standards
Figure 2-6: Installed air filter

Manual
In extremely dusty sites or when NEBS compliance is required, the 45 PPI

filter can be used. For all other sites, the 10 PPI filter is preferred.
NOTE: It is not recommended to use air filters in

environments that enable normal operation without direct air
filtering.
Filter maintenance intervals must be strictly observed. These are application-

specific and depend on the environmental conditions. The XDM-50 is equipped
with a pair of sensors detecting when the filter is fully loaded, and reports an
alarm to the XDM-50 management. The alarm should be handled by cleaning
or replacing the filter. It is accepted for electronic equipment design to
recommend cleaning or replacing air filters every three months.
INF50
The INF50 (XDM-50 Input power Filter) serves as an input filter for the DC
input voltage connected to the XDM-50 and accommodates the FCU50 power
supply. For redundancy purposes, each shelf has two INF50 units, each
connected to a different power source. However, even when only one power
source is available, it is recommended to connect it to both units. The INF50
can then be replaced without affecting traffic.
Figure 2-7: INF50 front panel
The panel has a 2-pin D-type male connector designated POWER IN for
connecting the DC input power, and two indicators.
Table 2-5: INF50 fron t panel LED indi cators
Item Functions
ACTIVE Green indicator; lights steadily when the INF50 receives input power
and operates normally.
FAIL Normally off.
Red indicator; lights steadily when a fault is detected in the unit.
3
XDM-100 Common Cards
In this chapter:
Shelf Overview ................................................................................................ 3-2
Fan Control Unit (FCU) .................................................................................. 3-3
External Connection Unit (ECU) .................................................................... 3-6
Main Cross-Connect and Control (MXC) Card ............................................. 3-11

Manual
Shelf Overview
The basic XDM-100 shelf is 443 mm (17.44 in.) wide, 231 mm (9.1 in.) deep,
and 200 mm (7.87 in.) high. When the optional TPU is added to the shelf, the
combined height of the basic shelf and the TPU is 275 mm (10.83 in.).
On the right side of the shelf is a vertical slot, which houses the FCU. The
lower part of the shelf consists of the cards cage with three horizontal slots,
which accommodate (from bottom to top):
 ECU or ECU-F.
 One or two MXC-100/B cards, each including two slots for SDH aggregate
modules (SAMs). When only one MXC-100/B is used in slot MXC-A, an
MXC-BR bridging card is inserted in slot MXC-B.
The upper part of the shelf consists of the modules cage, where eight horizontal
slots can house up to eight I/O (PDH, SDH, or data) modules.
In an expanded XDM-100 shelf with I/O protection, one or two TPUs are
mounted on top of the basic XDM-100 shelf, including a TC or a TCF module,
TPMs, and CWDM networking modules.
Figure 3-1: Basic XDM-100 shelf

Manual
Fan Control Unit (FCU)

The FCU is positioned at the right side of the shelf and provides cooling air to
the system from nine separate fans. Air is drawn in by the fans from the right
side of the chassis, and is pumped out through the horizontally mounted cards
and modules through the left side of the chassis.
A controller in the active MXC-100/B controls the fans. If one of the fans fails,
the remaining ones start to operate in turbo mode and the fail LED lights until
the FCU is replaced. The FCU can be extracted and replaced without
interrupting the multiplexer operation (hot swapping) if the activity does not
take more than a few minutes.
W ARNING Do not leave the system without an FCU unit for
more than a:couple of minutes. If the FCU unit fails and you
do not have a replacement unit, you must shut down the entire
XDM-100 system.
Figure 3-2: FCU general vi ew

Manual
Table 3-1: FCU fron t panel LED ind icators

normally.
Air Filters for FCU

XDM-100 shelves operating in extremely dusty and/or humid environments
may require installation of air filters.
An air filter reduces dirt accumulation, and thus prevents degradation of
ECI Telecom offers an air filter to handle these problems. The filter is housed
in a special frame installed on the right side of the XDM-100 that is also used
as an installation bracket.

Manual

Figure 3-3: Installed air filter


filtering.

specific and depend on the environmental conditions. The XDM-100 is
equipped with a pair of sensors detecting when the filter is fully loaded, and
reports an alarm to the XDM-100 management. The alarm should be handled
by cleaning or replacing the filter. It is accepted for electronic equipment
design to recommend cleaning or replacing air filters every three months.

Manual
External Connection Unit (ECU)

The ECU is located in the lowest slot of the XDM-100 shelf. It is available in
two configurations, ECU-F and ECU, and interfaces between the XDM-100
and the external world.
ECU-F
The ECU-F supports:
 Management interfaces:
 Management (LightSoft and EMS-XDM) interface (Ethernet)

Ethernet hub for the connection of multiple NEs
 External alarm outputs and inputs to client or xRAP/xRAP-100
 Alarm Cut-Off (ACO)
 Traffic monitoring, including:

Selection and display of the traffic interface channel currently being
monitored for all I/O (I1 to I8) and all aggregate (A1, A2, B1, B2) slots
 Monitor interface for STM-1 ports
 Hold-up capacitors
NOTE: The first version of the ECU-F included a USB

available through the MNG MAIN RJ-45 connector.

Manual
The front panel of the ECU-F card includes the various interface connectors
and a display for maintenance purposes.
Figure 3-4: ECU-F front panel
Table 3-2: ECU300-F ind icators and fun ctio ns
Name Item Functi on

ALARMS 36-pin SCSI Used to connect alarm input and output lines via the
connector xRAP/xRAP-100 or directly to the client.
DEBUG 9-pin D-type female Serial RS-232 communication channel for use by
connector technical support personnel.

F-CHANNEL 9-pin D-type female Serial RS-232 communication channel supporting
connector SLIP for connecting to an LCT-XDM terminal.
T3_1/T4_1 9-pin D-type male Main timing input and output using an ITU-T Rec.
connector G.703 interface: T3 and T4 for 2.048 MHz signals.
T3_2/T4_2 9-pin D-type male Protection timing input and output using an ITU-T
connector Rec. G.703 interface: T3 and T4 for 2.048 MHz
signals.
MNG MAIN RJ-45 connector Main Ethernet 10BaseT management interface.
MNG PROT RJ-45 connector Additional Ethernet 10BaseT management interface.
MODULE Selector Selects the module to be monitored (presented in the 2-
digit display). Press upward to increment and
downward to decrement.
CHANNEL Selector Selects the channel to be monitored (presented in the 2-
digit display). Press upward to increment and
STM 1 MON DIN 1.0/2.3 STM-1 monitoring port for all STM-1 output signals
connector (aggregate and tributaries).
LASER Pushbutton Forced laser activation during ALS.

ACTIVE
LED TEST Pushbutton Turns on all the indicators located on cards/modules
installed in the shelf, for test purposes.
ACO Pushbutton ACO pushbutton, used to temporarily disable the

xRAP/xRAP-100 and ECU-F buzzer when an alarm
condition is present. The buzzer is activated again
when a new alarm condition is detected.
MON Yellow LED Indicates that monitoring has been activated.
ACT Green LED Indicates that the ECU-F card is active and powered.
FAIL Red LED Card Failure Indicator. When there is more than one
alarm in the shelf, the alarm indicator that represents
the highest severity lights.

Manual
Name Item Functi on

CRT Red LED Critical Alarm Indicator. When there is more than one
MAJ Orange LED Major Alarm Indicator. When there is more than one
MIN Yellow LED Minor Alarm Indicator. When there is more than one
WAR Yellow LED Warning Alarm Indicator. When there is more than one
Also lights when buzzer has been muted by ACO
pushbutton.
ECU
The ECU card is the reduced functionality option of the XDM-100 external
connection unit. It supports:
 One management (LightSoft and EMS-XDM) interface Ethernet
connection named MNG MAIN
 Serial (RS-232) interface for local craft terminal

 Alarm severity outputs (Critical, Major, Minor, Warning) (via RAP
only)
 ACO
 External alarm outputs (via RAP only)
 Laser activation during ALS for maintenance purposes

LEDs test for the entire shelf
NOTE: The first version of the ECU included a USB

available through the MNG MAIN RJ-45 connector.

Manual
The front panel of the ECU includes the various interface connectors and a
display for maintenance purposes.
Figure 3-5: ECU front panel
Table 3-3: ECU100 ind icators and func tion s
Name Item Functi on

ALARMS 36-pin SCSI Used to connect alarm input and output lines
connector via the RAP.
DEBUG 9-pin D-type Serial RS-232 communication channel for
female connector use by technical support personnel.

F-CHANNEL 9-pin D-type Serial RS-232 communication channel
female connector supporting SLIP for connecting to an LCT-
XDM terminal.
T3_1/T4_1 9-pin D-type male Main timing input and output using an ITU-T
connector Rec. G.703 interface: T3 and T4 for 2.048
MHz signals.
T3_2/T4_2 9-pin D-type male Protection timing input and output using an
connector ITU-T Rec. G.703 interface: T3 and T4 for
2.048 MHz signals.
MNG MAIN RJ-45 connector Main Ethernet 10BaseT management
interface.
LASER
ACTIVE Pushbutton Forced laser activation during ALS.
LED TEST Pushbutton Turns on all the indicators located on

cards/modules installed in the shelf, for test
purposes.
ACO Pushbutton ACO pushbutton, used to temporarily disable
the RAP or ECU buzzer when an alarm
condition is present. The buzzer is activated
again when a new alarm condition is
detected.
ACT Green LED Indicates that the ECU card is active and
powered.
FAIL Red LED Card Failure Indicator. When there is more
than one alarm in the shelf, the alarm
indicator that represents the highest severity
lights.
CRT Red LED Critical Alarm Indicator. When there is more
lights.

Manual
Name Item Functi on

MAJ Orange LED Major Alarm Indicator. When there is more
lights.
MIN Yellow LED Minor Alarm Indicator. When there is more
lights.
WAR Yellow LED Warning Alarm Indicator. When there is
more than one alarm in the shelf, the alarm
lights.
Also lights when buzzer has been muted by
ACO pushbutton.

Manual

(MXC) Card
The MXC can be installed in slots MXC-A and MXC-B of the XDM-100 shelf
according to the configuration. It is available in two types, MXC-100 and
MXC-100B, and performs the control and cross-connect functions.
NOTE: The generic name MXC-100/B is used throughout this

manual whenever information applies to both card versions.
When installed in the redundant option, the XDM-100 accommodates two

identical MXC-100/B cards, one in slot MXC-A and the other in slot MXC-B.
This option is described in MXC-100/B Redundant Option (page 3-17).
When installed without the redundant option, the XDM-100 shelf contains one
MXC-100/B card installed in slot MXC-A, and a bridging unit, the MXC-BR,
installed in slot MXC-B. This option is described in MXC Nonredundant
Option (page 3-19).
One or two aggregate modules can be installed in each MXC-100/B,
as described in SDH Aggregate Modules (SAMs) (page 3-20).
MXC-100
The MXC-100 performs the following functions:
 Communications and control (by CPU):
 Routing and handling of 32 DCC channels
 Control of all shelf cards and modules
 Management interface
 Support of the 256 Mb NVM card
 Alarms and maintenance
 Control of TPU/OCU shelf
 SDH-related functions:
 SDH cross connect 4/3/1
 SDH timing and synchronization
 Support for SDH Aggregate Modules (SAMs)
 DC voltage supply:
 Dual DC power input and power supply for all modules
 Input Filtering (INF) function for the entire shelf
 Voltage and control for Fan Control Unit (VFCU)

Manual
The MXC-100 can house one or two SDH Aggregate Modules (SAMs) (page
3-20) out of the variety available.
CAUTION:
 If your system contains SAMs, always remove them from
the MXC-100 prior to removing the MXC-100 card from
the shelf.
 Do not extract/insert an MXC-100 while the DC cables
are connected to it.
 If the FAIL (red), MAIN (blue), and TMU (orange) LEDs
blink simultaneously, the MXC-100 is not mounted
correctly, or not all four screws are properly locked.
The total XDM-100 capacity accommodating two MXC-100 cards is 25 Gbps.

The capacity is distributed as follows: 8 slots with 2.5 Gbps and 4 slots with
1.25 Gbps.
The slots capacity is depicted in the following figure.
Figure 3-6: XDM-100 with two MXC-100 slots capacity
Figure 3-7: MXC-100 front panel

Manual
Table 3-4: MXC-100 ind icators and func tio ns
Name Item Functi on

Microswitch (Concealed Blocks MXC-100 control to all modules (I/O and
beneath tab) aggregate) when the MXC-100 screw is opened to extract
the card.
POWER IN A D-type 2-pin Main power input for the XDM-100 shelf.
connector
POWER IN B D-type 2-pin Protection power input for the XDM-100 shelf.
connector
ACT Green LED Indicates that the MXC-100 is active and powered.
MAIN Blue LED Indicates that this MXC-100 card is the current
Multiplexer Control Processor.
If the FAIL, MAIN, and TMU LEDs blink
simultaneously, the MXC-100 is not mounted correctly.
FAIL Red LED Normally off. Lights steadily when a fault is detected.
Flashes during software download.
TMU Orange LED Indicates that the TMU is active.
NVM Yellow LED Indicates that the NVM is active.
A2 slot Slot for aggregate module. See specific module
descriptions for module indicator and connector
descriptions.
RESET button (Concealed Resets the aggregate modules in slots A1 and A2 without
beneath NVM affecting the I/O modules in the XDM-100 shelf.
cover)
A1 slot Slot for aggregate or OSC module. See specific module
descriptions.

Manual
MXC-100B
The MXC-100B is the second generation of the MXC-100 that supports
enhanced cross-connect and timing capabilities. Its front panel interfaces are
identical to the MXC-100, and it performs the following functions:
 Routing and handling of 64 DCC channels (starting from XDM V8.2.2)
 Support of the 256 Mb NVM card
 Control of TPU/OCU shelf
 2.5 Gbps capacity for all I/O slots
 Support for SAMs
 Dual DC power input and power supply for all modules
 INF function for the entire shelf

Voltage and control for Fan Control Unit (VFCU)
CAUTION:
 If your system contains SAMs, always remove them from
the MXC-100B prior to removing the MXC-100B card
from the shelf.
 Do not extract/insert an MXC-100B while the DC cables
are connected to it.
blink simultaneously, the MXC-100B is not mounted
correctly, or not all four screws are properly locked.
The MXC-100B can house one or two SAMs out of the variety of available
SDH Aggregate Modules (SAMs) (page 3-20).
The total XDM-100 capacity accommodating two MXC-100B cards is 30
Gbps. The capacity is evenly distributed between all 12 slots and is 2.5 Gbps
per slot.

Manual
Figure 3-8: XDM-100 with two MXC-100B slots capacity
Figure 3-9: MXC-100B f ront panel
Table 3-5: MXC-100B ind icators and func tion s
Name Item Functi on

Microswitch (Concealed Blocks MXC-100B control to all modules (I/O and
beneath tab) aggregate) when the screw is opened to extract the card.
POWER IN A D-type 2-pin Main power input for the XDM-100 shelf.
connector
POWER IN B D-type 2-pin Protection power input for the XDM-100 shelf.
connector
ACT Green LED Indicates that the MXC-100B is active and powered.
MAIN Blue LED Indicates that this MXC-100B card is the current
simultaneously, the MXC-100B is not mounted correctly.
TMU Orange LED Indicates that the TMU is active.
A2 slot Slot for aggregate module. See specific module
descriptions.
RESET button (Concealed Resets the aggregate modules in slots A1 and A2 without
beneath NVM affecting the I/O modules in the XDM-100 shelf.
cover)
A1 slot Slot for aggregate or OSC module. See specific module
descriptions.

Manual
MXC-BR
The MXC-BR is a bridging card that supports protection of communication
lines in nonredundant options of the XDM-100. It is always installed in slot
MXC-B.
The MXC-BR connects the communication lines of each I/O and aggregate
module routed to the card in slot MXC-B back to the matrix of the card
installed in slot MXC-A. This provides protection to the communication lines,
without using an additional MXC in the XDM-100 shelf.
The total XDM-100 capacity accommodating one MXC-100/B and one MXC-
BR is 15 Gbps. The capacity is distributed as follows: 8 slots with 1.25 Gbps
and 2 slots with 2.5 Gbps.
Figure 3-10: XDM-100 with one MXC-100 and one MXC-BR slo ts capacity
Figure 3-11: MXC-BR fro nt p anel
The MXC-BR has a green LED indicator marked CONNECTED on its front
panel. It lights to indicate normal operation of the card.

Manual
MXC-100/B Redundant Option

When the XDM-100 system is installed in a redundant configuration, the
MXC-100/B card installed in slot MXC-A serves as the main control card and
the card installed in slot MXC-B as the protection control card.
You can insert four aggregate modules of any supported type, two in each
MXC-100/B card.
Figure 3-12: Shelf wit h MXC-100 redundancy
Both MXC-100/B cards perform their functions simultaneously in a 1+1

protection configuration.
The active MXC-100/B is configured via the EMS-XDM, ECI Telecom
Network Solutions Division’s EMS.
The protection MXC-100/B in slot MXC-B provides full 1+1 protection to the
cross-connect matrix and full 1:1 protection to all other functions, as it has an
identical database to the active MXC-100/B installed in slot MXC-A. The
matrices and power supplies on both MXC-100/B cards (MXC-A and MXC-B)
are active simultaneously.
By default, the TMU in the MXC-100/B in slot MXC-A is the active timing
unit after powerup. This is indicated by the TMU LED on the front panel of the
MXC-100/B.
In case of a hardware failure in the active MXC-100/B or its traffic
interconnection, or when the active MXC-100/B in slot MXC-A is unscrewed
(for example, when being replaced), the I/O interface modules traffic switches
to the protection MXC-100/B card within a maximum of 50 msec, and all
control functions switch from the main MXC-100/B to the protection MXC-
100/B card.

Manual
NOTE: This process takes several minutes and may affect

traffic if the timing or SNCP functions were previously
handled by the MXC-100/B card in slot MXC-A.
NOTE: In the event of a control failure in the MXC-100/B

card, the aggregate modules in that card cannot be controlled.
However, this does not affect traffic.
In the MXC-100/B redundant option, a separate power input is fed to each

MXC-100/B, providing the XDM-100 with protection in the event of a
malfunction in the power input of the main MXC-100/B.
NOTE: If the Input Filter (INF) block of the main MXC-

100/B in slot MXC-A fails, the 48 V supply voltage is
provided by the INF block of the MXC-100/B in slot MXC-
B. Only if the low voltage power supply in the MXC-100/B
in slot MXC-A fails, all its functions and aggregate modules
fail and common equipment redundancy is provided by the
MXC-100/B in slot MXC-B.
The system can be defined so that in this case the traffic
carried by the aggregate modules lines is protected by the
SNCP or Multiplex Section Protection (MSP) mechanism,
and switches over to the aggregate modules lines of the other
MXC-100/B.

Manual
MXC Nonredundant Option

In the nonredundant configuration of the XDM-100 system, only one MXC-
100 card is installed in slot MXC-A. In this case, an MXC-BR bridge card is
installed in slot MXC-B. The MXC-BR includes its aggregate connections
internally.
NOTE: The installation of MXC-BR in the XDM-100 is

supported only with an MXC-100 card.
You can insert two aggregate modules of any supported type in the MXC-100
card in slot MXC-A.
NOTE: The XDM-100 installation with the MXC-BR is not

recommended by for future growth.
Figure 3-13: Shelf without MXC redundancy

Manual
SDH Aggregate Modules (SAMs)

Two SAMs are associated with each MXC-100/B card. The MXC-100/B
provides power and control to its aggregate modules, and when there are two
MXC-100/B cards in the shelf, the traffic and timing buses of each module are
connected to both MXC-100/B cards.
NOTE: The SAMs must always be removed from the MXC-

100/B card before removing the card from the shelf.
A variety of aggregate modules with electrical and optical interfaces is

available, as listed in the following table:
Table 3-6: Available aggregate modu le types
Type Designation
Electrical SAM SAM1_4/E (page 3-21)
Optical SAMs SAM1_4O and SAM1_4OB (page 3-22)
SAM4_2 (page 3-23)
SAM16_1 and SAM16_1B (page 3-24)
All optical cards contain slots for the insertion of Small Form-factor Pluggable
(SFP) transceivers.
NOTE:
 All modules have a handle to facilitate easy removal and
insertion. The handle has been removed from the
illustrations in this section in order not to obscure the front
panel markings.
 The traffic of STM-1 modules (I/O or aggregate) can be
monitored via the STM_1 MON connector on the ECU-F
card.

Manual
Optical SAMs
NOTE: All optical modules incorporate SFP transceivers with

LC connectors, which should be purchased only through ECI
Telecom.
SAM1_4O and SAM1_4OB

The SAM1_4O/SAM1_4OB is an optical aggregate module with four STM-1
(155 Mbps) interfaces with slots for SFP transceivers.
A maximum of four SAM1_4O/SAM1_4OB modules, totaling 16 interfaces,
can be incorporated in an XDM-100 shelf with full MXC-100/B redundancy,
and a maximum of two SAM1_4O/SAM1_4OB modules, totaling 8 interfaces,
can be incorporated in an XDM-100 shelf with no MXC-100/B redundancy.
Channel monitoring is performed via the STM_1 MON monitoring port on the
ECU-F.
Mix of electrical and optical interfaces is possible using the ETR-1 SFP
Electrical Transceiver (page 6-43).
Figure 3-15: SAM1_4O/SAM1_4OB aggregate module
Table 3-8: SAM1_4O/SAM1_4OB fron t panel LED indi cators
Marking Full name Color Function

AC Active Green Lights steadily when the module is powered
and operating normally.
FL Fail Red Normally off.
Flashes during software download from the
MXC-100/B, after powerup, reset, or when
new software is available from the
management station.
TR Traffic Orange Lights when there is traffic cross connecting
through the module.
ON Laser Green Lights when traffic is being transmitted
active (separate LED for each SFP transceiver).
MON Monitor Yellow Indicates that the channel is being monitored
(separate LED for each SFP transceiver).

Manual
SAM4_2
The SAM4_2 is an optical aggregate module with two STM-4 (622 Mbps)
interfaces with two slots for SFP transceivers. The front panel has a 622 Mbps
monitoring point with a DIN 1.0/2.3 connector.
A maximum of four SAM4_2 modules, totaling eight interfaces, can be
incorporated in an XDM-100 shelf with full MXC-100/B redundancy, and a
maximum of two SAM4_2 modules, totaling four interfaces, can be
incorporated in an XDM-100 shelf with no MXC-100/B redundancy.
Figure 3-16: SAM4_2 aggregate mod ule
Table 3-9: SAM4_2 fron t panel LED indi cators

Normally off.
FL Fail Red Lights steadily when a fault is detected.
MXC-100/B, after powerup, reset, or when
management station.
through the module.

Manual
SAM16_1 and SAM16_1B

The SAM16_1/SAM16_1B is an optical aggregate module with one STM-16
(2.488 Gbps) interface and one slot for an SFP transceiver. The front panel has
a 2.5 Gbps monitoring point with an SMA connector.
A maximum of four SAM16_1/SAM16_1B modules, totaling four interfaces,
can be incorporated in an XDM-100 shelf with full MXC-100/B redundancy,
and a maximum of two SAM16_1/SAM16_1B modules, totaling two
interfaces, can be incorporated in an XDM-100 shelf with no MXC-100/B
redundancy.
Figu re 3-17: SAM16_1/SAM16_1B
Table 3-10: SAM16_1/SAM16_1B fron t panel L ED indicator s

AC Active Green Lights steadily when the module is powered and
operating normally.
MXC-100/B, after powerup, reset, or when new
software is available from the management
station.
through the module.
ON Laser Green Lights when traffic is being transmitted on the
active SFP transceiver.
MON Monitor Yellow Indicates that

transceiver the channel
is being on the SFP
monitored.
4
In this chapter:
XDM-300 Shelf Overview .............................................................................. 4-1
External Connection Unit (ECU300)............................................................... 4-6
Main Cross-Connect and Control Card (MXC300) ....................................... 4-12
XDM-300 Platform with 100 Gbps Capacity ................................................ 4-15
XDM-300 Shelf Overview

The basic XDM-300 shelf is 443 mm wide, 246 mm deep, and 350 mm high.
When the optional TPUs or OCU are attached to the shelf, each of these
expansion shelves adds 75 mm to the height of the basic shelf.
The rightmost slot of the shelf houses the FCU300. The middle part of the shelf
consists of the cards cage with five horizontal slots which accommodate:
 ECU300 or ECU300-F
 Two MXC300/MXC900 cards (main and protect)
 Up to two quad I/O cards (like: SIM16_4 or SIM64_XFP)
NOTE: The slots of the quad I/O cards can be adapted to

accommodate one SIM16_1 I/O module each instead of the
I/O cards by using a mechanical adapter.

Manual
The upper and lower parts of the shelf consist of a module cage with eight
horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or
data) single slot modules, totaling a maximum of 16 modules.

Each quad of the I/O slots (I1 to I4, I5 to I8, I9 to I12, and I13 to I16) can be
adapted to accommodate a quad I/O card, enabling to add up to four of these
cards.
In an expanded XDM-300 shelf with I/O protection, one or two TPUs are
mounted on the top and/or at the bottom of the basic shelf, including a TC or
TCF module and TPMs. An OCU with CWDM networking modules can be
mounted on top of a basic, or expanded shelf.
Fan Control Unit

The FCU300 is positioned (FCU300)
at the right side of the shelf and provides cooling air
to the system from eight separate fans. In horizontal installations of the XDM-
300, air is drawn in by the fans from the right side of the chassis, and is
pumped out through the horizontally mounted cards and modules through the
left side of the chassis. In vertical installations, the XDM-300 shelf is mounted
with the FCU300 facing downwards, and air is drawn in from the lower part of
the chassis and pumped through the vertically mounted modules and cards
through the top of the chassis.
The fans are fed through circuits that improve the system's performance and
support its redundancy, including:
 Separate psophometric filter with a separate fuse for each fan
 Large capacitor with a fuse on the DC supply bus
 Parallel dual inrush current circuit with a separate fuse for each circuit
A controller in the active MXC300 controls the fans operation. If one of the
fans fails, the remaining ones start to operate in turbo mode and the fail LED
lights until the FCU300 is replaced. The FCU300 can be extracted and replaced
without interrupting the multiplexer operation (hot swapping) if the activity
does not take more than a few minutes.
WARNING: Do not leave the system without an FCU300

unit for more than a couple of minutes. If the FCU300 unit
fails and you do not have a replacement unit, you must shut
down the entire XDM-300 system.

Manual
Air Filters for FCU300

ECI Telecom offers air filters for vertical installations of the XDM-300 to
handle these problems. The filter is housed in a special frame installed under
the shelf of the XDM-300 that is also used as an installation bracket.

Manual

Figure 4-2: XDM-300 wit h air f ilt er


filtering.


Manual

(ECU300)
The ECU300 is located in the lowest slot of the XDM-300 shelf card cage. It is
available in two configurations, ECU300-F and ECU300, and interfaces
between the XDM-300 and the external world.
ECU300-F
The ECU300-F supports:
 Ethernet hub for the connection of multiple NEs
 External alarm outputs and inputs to client or xRAP-D/xRAP-100
 ACO
 Selection and display of the traffic interface channel currently being
monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card
(I17 and I18) slots
The front panel of the ECU300-F card includes the various interface connectors
Figure 4-3: ECU300-F fron t p anel

Manual
Table 4-2: ECU300-F ind icators and func tio ns
Name Item Function
ALARMS 36-pin SCSI Used to connect alarm input and

connector output lines via the xRAP-D/xRAP-
100 or directly to the client.
DEBUG 9-pin D-type Serial RS-232 communication
female channel for use by technical
connector support personnel.
F-CHANNEL 9-pin D-type Serial RS-232 communication
female channel supporting SLIP for
connector connecting to an LCT-XDM
terminal.
T3_1/T4_1 9-pin D-type Main timing input and output using
male connector an ITU-T Rec. G.703 interface: T3
and T4 for 2.048 MHz signals.
T3_2/T4_2 9-pin D-type Protection timing input and output
male connector using an ITU-T Rec. G.703
interface: T3 and T4 for 2.048 MHz
signals.
MANAGEMENT MAIN RJ-45 Main Ethernet 10BaseT
connector management interface.
PROT/LCT RJ-45 Additional Ethernet 10BaseT
MODULE Selector Selects the module to be monitored
(presented in the 2-digit display).
Press upward to increment and
CHANNEL Selector Selects the channel to be monitored
STM 1 MON DIN 1.0/2.3 STM-1 monitoring port for all
connector STM-1 output signals (aggregate
and tributaries).
LASER ACTIVE Pushbutton Forced laser activation during ALS.
LED TEST Pushbutton Turns on all the indicators located
on cards/modules
shelf, installed in the
for test purposes.
ACO Pushbutton ACO pushbutton, used to
temporarily disable the xARP-
D/xRAP-B/xRAP-100 and
ECU300-F buzzer when an alarm
condition is present. The buzzer is
activated again when a new alarm
condition is detected.
MON Yellow LED Indicates that monitoring has been
activated.

Manual
ECU300
The ECU300 card is the reduced functionality option of the XDM-300 ECU. It
supports:

External alarm outputs to client or xRAP-D/xRAP-100
 ACO
The front panel of the ECU300 includes the various interface connectors and a

Manual
Name Item Functio n
ALARMS 36-pin SCSI Used to connect alarm output lines

connector via the xRAP-D/xRAP-100 or
directly to the client.
female channel for use by technical support
connector personnel.
connector connecting to an LCT-XDM terminal.
male connector using an ITU-T Rec. G.703 interface:
T3 and T4 for 2.048 MHz signals.
MANAGEMENT MAIN RJ-45 Main Ethernet 10BaseT management
connector interface.

cards/modules installed in the shelf,
for test purposes.
ACO Pushbutton ACO pushbutton, used to temporarily
disable the xARP-D/xRAP-B/xRAP-
100 and ECU300 buzzer when an
alarm condition is present. The
buzzer is activated again when a new
alarm condition is detected.

activated.
ACT Green LED Indicates that the ECU300 card is
active and powered.
FAIL Red LED Card Failure Indicator. When there is

more than one alarm in the shelf, the
alarm indicator that represents the
highest severity lights.
CRT Red LED Critical Alarm Indicator. When there

is more than one alarm in the shelf,
the alarm indicator that represents the

Manual
Name Item Functio n
MAJ Orange LED Major Alarm

more than oneIndicator. When
alarm in the there
shelf, theis
MIN Yellow LED Minor Alarm Indicator. When there is
WAR Yellow LED Warning Alarm Indicator. When there
Also lights when buzzer has been
muted by ACO pushbutton.

Manual
NOTE: Two separate DC power sources must be connected to

support system redundancy, one to each POWER connector on
the MXC300 cards.
CAUTION: Before extracting or inserting an MXC300 into

the shelf, release the extractor handles by pressing the brown
locks outward first, then pull/push both handles
simultaneously. Failure to do so may damage the card.
The following warning labels are attached to the corresponding right and left
extractor handles of the MXC300.
Figure 4-6: Warning labels on extractor handles

Manual
Table 4-4: MXC300 indi cators and func tio ns
Name Item Functi on

Microswitch (Concealed Blocks MXC300 control to all modules (I/O and
beneath tab) aggregate) when the MXC300 screw is opened to extract
the card.
POWER D-type 5-pin Main power input for the XDM-300 shelf.
connector
POWER IN Green LED Indicates that input power is connected to the MXC300.
TMU Orange LED Indicates that the TMU is active and is the timing source
for the shelf.
ACT Green LED Indicates that the MXC300 is active and powered.
MAIN Blue LED Indicates that this MXC300 card is the current
simultaneously, the MXC300 is not mounted correctly.
RESET button (Concealed Provides hard reset to the MXC300 without affecting its
beneath power supply and I/O modules in the XDM-300 shelf.
NVM cover)

Manual
XDM-300 Platform with 100

Gbps Capacity
In its regular configuration the XDM-300 is equipped with two MXC300 cards
and provides a total capacity of 60 Gbps. In this configuration the MXC300
allocates 2.5 Gbps to each I/O slot (I1 to I16) and 10 Gbps to the two quad I/O
card slots (I17, I18).
The capacity of the XDM-300 shelves that operate in the regular configuration,
described above, can be expanded to 100 Gbps by replacing the MXC300 with
MXC900 cards (for a description of the MXC900 refer to Main Cross-Connect
and Control Card (MXC900) (page 5-11)). The process can be implemented
without affecting traffic, performing an organized migration procedure
described in the EMS-XDM User Manual. The upgraded XDM-300 shelf is
referred to as XDM-300_100G trough out this manual.
NOTE: The total capacity of the XDM-300 equipped with two

MXC900 cards is 100 Gbps. The capacity is distributed as
follows: 16 I/O slots (I1 to I16) with 5 Gbps per slot and two
quad I/O card slots (I17 and I18) with 10 Gbps per slot.
The XDM-300_100G slot capacity is shown in the following figure.
Figure 4-7: XDM-300_100G slot capacity

Manual
5
In this chapter:
XDM-900 Shelf Overview .............................................................................. 5-1
External Connection Unit (ECU900)............................................................... 5-6
Main Cross-Connect and Control Card (MXC900) ....................................... 5-11
XDM-900 Platform with 60 Gbps Capacity .................................................. 5-13
XDM-900 Shelf Overview

The basic XDM-900 shelf is 443 mm wide, 246 mm deep, and 350 mm high.
When the optional TPUs or OCU are attached to the shelf, each of these
expansion shelves adds 75 mm to the height of the basic shelf.
The rightmost slot of the shelf houses the FCU900. The middle part of the shelf
consists of the cards cage with five horizontal slots which accommodate:
 ECU900 or ECU900-F
 Two MXC900/MXC300 cards (main and protect)
 Up to two quad I/O cards (like :SIM16_4, SIM64_XFP, SIM64_2, or
SIM16_8)
NOTE: The slots of the quad I/O cards can be adapted to

accommodate one SIM16_1 I/O module each instead of the
I/O cards by using a mechanical adapter.

Manual
Figure 5-1: FCU900 general view
Table 5-1: FCU900 fron t panel ind icators

normally.

Manual
Air Filters for FCU900

ECI Telecom offers air filters for vertical installations of the XDM-900 to
handle these problems. The filter is housed in a special frame installed under
the shelf of the XDM-900 that is also used as an installation bracket.

Manual

Figure 5-2: XDM-900 wit h air f ilt er


filtering.


Manual

(ECU900)
The ECU900 is located in the lowest slot of the XDM-900 shelf card cage. It is
available in two configurations, ECU900-F and ECU900, and interfaces
between the XDM-900 and the external world.
ECU900-F
The ECU900-F supports:
 External alarm outputs and inputs to client or xRAP-D/xRAP-100
 ACO
 Selection and display of the traffic interface channel currently being
monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card
(I17 and I18) slots
The front panel of the ECU900-F card includes the various interface connectors
Figure 5-3: ECU900-F fron t p anel

Manual
Table 5-2: ECU900-F ind icators and func tio ns
Name Item Functio n
ALARMS 36-pin SCSI Used to connect alarm input and

connector output lines via the xRAP-D/xRAP-
100 or directly to the client.
female connector channel for use by technical support
personnel.
female connector channel supporting SLIP for
connecting to an LCT-XDM terminal.
T3_1/T4_1 9-pin D-type male Main timing input and output using
connector an ITU-T Rec. G.703 interface: T3
T3_2/T4_2 9-pin D-type male Protection timing input and output
connector using an ITU-T Rec. G.703 interface:
MANAGEMENT MAIN RJ-45 connector Main Ethernet 10BaseT management
interface.
PROT/ RJ-45 connector Additional Ethernet 10BaseT
LCT management interface.
MODULE Selector Selects the module to be monitored
CHANNEL Selector Selects the channel to be monitored
STM 1 MON DIN 1.0/2.3 STM-1 monitoring port for all STM-1
connector output signals (aggregate and
tributaries).

for test purposes.

100 and ECU900-F buzzer when an
activated.
ACT Green LED Indicates that the ECU900-F card is
active and powered.
FAIL Red LED Card Failure Indicator. When there is

Manual
Name Item Functio n

MAJ Orange LED Major Alarm Indicator. When there is
ECU900
The ECU900 card is the reduced functionality option of the XDM-900 ECU. It
supports:

 External alarm outputs to client or xRAP-D/xRAP-100
 ACO

Manual
The front panel of the ECU900 includes the various interface connectors and a
Name Item Functio n
ALARMS 36-pin SCSI Used to connect alarm output lines

connector via the xRAP-D/xRAP-100 or
directly to the client.
female channel for use by technical support
connector personnel.
connector connecting to an LCT-XDM terminal.
male connector using an ITU-T Rec. G.703 interface:
MANAGEMENT MAIN RJ-45 Main Ethernet 10BaseT management
connector interface.

for test purposes.
100 and ECU900 buzzer when an

activated.
ACT Green LED Indicates that the ECU900 card is
active and powered.

Manual
Name Item Functio n
FAIL Red LED Card

more Failure
than oneIndicator.
alarm in When there
the shelf, theis

MAJ Orange LED Major Alarm Indicator. When there is


Manual

Card (MXC900)
The XDM-900 is a redundant platform, and two MXC900 cards must always
be installed in slots MXC-A and MXC-B of the XDM-900 shelf.
The MXC900 performs the following functions:
 Routing and handling of 84 DCC channels

Support of the 256 Mb NonVolatile compact flash Memory (NVM)
card
 Control of TPU/OCU shelves
 5 Gbps capacity for all I/O module slots, and 20 Gbps for quad I/O card
slots

120 Gbps HO/LO nonblocking matrix
 Accommodates the ACP-900 module and provides power supply,
communication, and control
 Support for CWDM I/O modules (transponders and combiners) in all I/O
module slots
 One 48 VDC power input that supplies voltages for all cards and
modules
 Input Filtering (INF) function for the entire shelf
 Voltage and control for Fan Control Unit (VFCU)
CAUTION:
 Do not extract/insert an MXC900 while the DC cables are
connected to it.
blink simultaneously, the MXC900 is not mounted
correctly, or the extractor handles are not inserted
properly.

Manual
NOTE: Two separate DC power sources must be connected

to support system redundancy, one to each POWER
connector on the MXC900 cards.
CAUTION: Before extracting or inserting an MXC900 into

extractor handles of the MXC900.

Manual
Table 5-4: MXC900 indi cators and func tio ns
Name Item Functi on

Microswitch (Concealed Blocks MXC900 control to all modules (I/O and
beneath tab) aggregate) when the MXC900 screw is opened to extract
the card.
POWER D-type 5-pin Main power input for the XDM-900 shelf.
connector
POWER IN Green LED Indicates that input power is connected to the MXC900.
TMU Orange LED Indicates that the TMU is active and is the timing source
for the shelf.
ACT Green LED Indicates that the MXC900 is active and powered.
MAIN Blue LED Indicates that this MXC900 card is the current
simultaneously, the MXC900 is not mounted correctly.
RESET button (Concealed Provides hard reset to the MXC900 without affecting its
beneath power supply and I/O modules in the XDM-900 shelf.
NVM cover)

Manual
XDM-900 Platform with 60 Gbps

Capacity
In its regular configuration the XDM-900 is equipped with two MXC900 cards
and provides a total capacity of 120 Gbps. In this configuration the MXC900
allocates 5 Gbps to each I/O slot (I1 to I16) and 20 Gbps to the two quad I/O
card slots (I17, I18).
XDM-900 shelves can also operate with a reduced capacity of 60 Gbps by
replacing the MXC900 with MXC300 cards (for a descriptions of the MXC300
see Main Cross-Connect and Control Card (MXC300) (page 4-12)).
NOTE: The total capacity of the XDM-900 equipped with two

MXC300 cards is 60 Gbps. The capacity is distributed as
follows: 16 I/O slots (I1 to I16) with 2.5 Gbps per slot and two
quad I/O card slots (I17 and I18) with 10 Gbps per slot.
6
I/O Cards and Modules
In this chapter:
Overview ......................................................................................................... 6-1
PDH Modules .................................................................................................. 6-4
SDH Cards and Modules ............................................................................... 6-15
CWDM I/O Modules ..................................................................................... 6-39
Pluggable Interfaces (SFP/XFP) .................................................................... 6-42
Overhead Access Module (OHU) .................................................................. 6-45
Overview
This chapter provides a detailed description of the I/O modules and cards
available for the XDM-50, XDM-100, XDM-300, and XDM-900 shelves.
The following table lists the I/O modules and cards that can be installed in the
slots of these platforms. Each of these modules requires a single I/O slot,
except for the PIM2_63 and PIM2_63B that require two slots, and SIM16_4,
SIM64_XFP, SIM64_2 that require a quad card slot or quad I/O module slots.
I/O Cards and Modules XDM-100 Product Line Reference

Manual
Table 6-1: PDH and SDH I/O mod ul es and cards
Service Module/Card In platfo rms

type
PDH PIM2_21: 21 E1 (2.048 XDM-50, XDM-100,
Mbps) tributaries balanced XDM-300, XDM-900
interfaces.
PIM2_42: 42 E1 (2.048 XDM-50, XDM-100,

interfaces.
PIM2_63/B: 63 E1 (2.048 XDM-50, XDM-100,
interfaces.
PIM2_63S: 63 E1 (2.048 XDM-100, XDM-300,

Mbps) tributaries balanced XDM-900
interfaces.
PIM345_3: 3 ports, XDM-50, XDM-100,

configurable for operation XDM-300, XDM-900
as E3 (34.368 Mbps) or DS-
3 (44.736 Mbps) interfaces.
SDH SIM1_4/E: 4 STM-1 XDM-50, XDM-100,
electrical interfaces. XDM-300, XDM-900
SIM1_4/O and SIM1_4OB: XDM-50, XDM-100,
supports 4 STM-1 optical XDM-300, XDM-900
interfaces for SFPs. The
ports can be equipped with
electrical (e) and/or optical
(o) interfaces.
SIM1_8: supports 8 STM-1 XDM-50, XDM-100,
optical interfaces for SFPs. XDM-300, XDM-900
The ports can be equipped
with electrical (e) and/or
optical (o) interfaces.
SIM4_2: supports 2 STM-4 XDM-50, XDM-100,
optical interfaces for SFPs. XDM-300
SIM4_4: supports 4 STM- XDM-100, XDM-300,
1/4 optical interfaces for XDM-900
SFPs.
SIM4_8: supports 8 STM- XDM-300_100G,
1/4 optical interfaces for XDM-900
SFPs.
SIM16_1: supports 1 STM- XDM-100, XDM-300,
16 optical interface for an XDM-900
SFP.
SIM16_2: supports two XDM-300_100G,
STM-16 optical interfaces XDM-900
for SFPs.
XDM-100 Product Line Reference I/O Cards and Modules

Manual
Service Module/Card In platfo rms

type
SIM16_4: supports 4 STM- XDM-300,

16 optical interfaces for XDM-300_100G,
SFPs. XDM-900
16 and 8 STM-1/4optical XDM-900
interfaces for SFPs.
64 optical interface for an XDM-900
XFP.
SIM64_XFP: supports 1 XDM-300,
STM-64 optical interface for XDM-300_100G,
an XFP.
XDM-900
SIM64_2: supports 2 STM- XDM-900,
64 optical interfaces for XDM-300_100G (I1
XFPs. to I16 only)
NOTES:
panel markings.
 The traffic of STM-1 I/O modules (as well as aggregate
modules) can be monitored via the STM_1 MON
connector on the corresponding ECU card (ECU-F in
XDM-100, ECU300-F in XDM-300, or ECU900-F in
XDM-900).

Manual
PDH Modules
PDH I/O (PIM) modules provide the interfaces for connecting PDH signals to
the central cross-connect matrix of the XDM-100 Product Line (MXC). PIM
modules are available only with electrical interfaces. They include line
interface circuits, PDH signal processing circuits, internal interfaces to the two
MXC cards, and physical line interfaces.
PIMs that occupy one slot can be inserted in any of the I1 through I4 positions
in the XDM-50, slots I1 through I8 in the XDM-100, and slots I1 through I16
in the XDM-300 without any limitations. PIM2_63/B PDH I/O modules
occupy two slots, and can be inserted in slots I1-I2 or I3-I4 in the XDM-50
shelf and in slots I1-I2, or I5-I6 in the XDM-100. The PIM2_63/B can be
installed in the XDM-300 or XDM-900 in slots I1-I2, I3-I4, I-I6, I7-I8 I9-I10,
I11-I12, I3-I14, or I15-I16.
Table 6-2: PDH I/O mod ul e typ es
Type Designation
PDH modules PIM2_21 (page 6-4)
PIM2_42 (page 6-6)
PIM2_63 and PIM2_63B (page 6-8)
PIM2_63S (page 6-10)
PIM345_3 (page 6-13)
PIM2_21
The PIM2_21 is a PDH I/O module with 21 x E1 (2 Mbps) electrical balanced
interfaces (two SCSI connectors) to which the traffic cables connect with a
special connector hood.
NOTE: The PIM2_21 is supported in the following shelves:

 XDM-50
 XDM-100
 XDM-300
 XDM-900
The maximum number of modules that can be installed in each of the

supported shelves and the resulting total number of E1 interfaces are listed in
the following table.

Manual
Table 6-3: PIM2_21 modu les and E1 int erfaces per shelf
Shelf Maximum Maximum E1 interfaces

PIM2_21 modules
XDM-50 4 84
XDM-100 8 168
XDM-300 16 336
XDM-900 16 336
PIM2_42 enables easy expansion of I/O slots equipped with PIM2_21 modules
by additional 21 E1s, while significantly reducing the cost per E1 interface.
This is done by removing the working PIM2_21, replacing it with a PIM2_42,
and connecting it with an appropriate traffic cable. The I/O slot must then be
reassigned through the management as a PIM2_42. The attributes (including
cross-connects, trails, and so on) of the first 21 E1s are retained as they were in
the replaced PIM2_21. For a detailed description of this procedure refer to
corresponding IMM.
For unbalanced interfaces, the PIM2_21 is connected to the xDDF-21
conversion panel described in xDDF-21 Patch Panel for Unbalanced Electrical
Connections (page 10-50).
NOTE: If a TPU protection scheme is employed, the

following TPMs can be used:
 TPM2_1, which provides 1:1 protection (one PIM2_21
module protects one PIM2_21 module).
 TPM2_3, which provides 1:3 protection (one PIM2_21
module protects three PIM2_21 modules).
Figure 6-1: PIM2_21 I/O module

Manual
Table 6-4: PIM2_21 fron t panel LED indi cators

corresponding MXC50/MXC-100/B/MXC300,
after powerup, reset, or when new software is
available from the management station.
TR Traffic Orange Lights when traffic is cross connecting through
the module.
MON Monitor Yellow Indicates that the module is being monitored
(single LED for the entire module).
PIM2_42
The PIM2_42 is a PDH I/O module with 42 x E1 (2 Mbps) electrical balanced
interfaces (two 100-pin SCSI connectors) to which the traffic cables connect.
PIM2_42 enables easy expansion of I/O slots equipped with PIM2_21 modules
by additional 21 E1s, while significantly reducing the cost per E1 interface.
This is done by removing the working PIM2_21, replacing it with a PIM2_42,
and connecting it with an appropriate traffic cable. The I/O slot must then be
reassigned through the management as a PIM2_42. The attributes (including
the replaced PIM2_21. For a detailed description of this procedure refer to
corresponding IMM.
The PIM2_42 features a clear channel that can be used to communicate with
other NEs through the management (DCC). The channel is designated in the
management as E1 number 43 and has no external connection.

 XDM-50
 XDM-100
 XDM-300
 XDM-900


Manual
For unbalanced interfaces, each transmit/receive SCSI pair on the module can
be connected to an xDDF-21 conversion panel, as described in xDDF-21 Patch
Panel for Unbalanced Electrical Connections (page 10-50).

TPM2_63_2 can provide 1:2 protection (one PIM2_63/B
module protects two PIM2_63/B modules).
Figure 6-3: PIM2_63/B I/O module
Table 6-8: PIM2_63/B fron t panel LED indi cators

operating normally.
FL Fail Red Normally off. when a fault is detected.

Lights steadily
powerup, reset, or when new software is available
from the management station.
the module.
MON Monitor Yellow Indicates that the module is being monitored
(single LED for the entire module).

Manual
PIM2_63S
The PIM2_63S is a PDH single slot I/O module with 63 x E1 (2 Mbps)
electrical balanced interfaces (one dense unique VHDCI connector with 272-
pins) to which the traffic cables connect with a special connector hood.
NOTE: The PIM2_63S is supported in the following shelves:

 XDM-100
 XDM-300
 XDM-900

Table 6-9: PIM2_63S modu les and E1 interf aces per shelf
Shelf Maximum Maximum E1 interfaces

PIM2_63S
modules
XDM-100 8 504
XDM-300 16 1008
XDM-900 16 1008
PIM2_63S enables easy expansion of I/O slots equipped with PIM2_63/B

modules by additional 63 E1 interfaces, while significantly reducing the cost
per E1 interface. This is done by removing the working PIM2_63/B, replacing
it with a PIM2_63S, and connecting it with appropriate cables. Note that
because the PIM2_63/B occupies two slots and the PIM2_63S only one, the
spacer between the two slots must be reinstalled before installing two
PIM2_63S modules in these positions. The I/O slots must then be reassigned
through the management as two separate PIM2_63S. The attributes (including
the replaced PIM2_63/B. For a detailed description of this procedure refer to
corresponding IMM.
For unbalanced interfaces, each transmit/receive VHDCI pair on the module
can be connected to an xDDF-21 conversion panel, as described in xDDF-21
Patch Panel for Unbalanced Electrical Connections (page 10-50).

TPM2_63_2 can provide 1:2 protection (one PIM2_63S
module protects two PIM2_63S modules).

Manual
Figure 6-4: PIM2_63 front panel
Table 6-10: PIM2_63S front p anel LED indicator

corresponding MXC-100/B/MXC300, after
powerup, reset, or when new software is
the module.
Traffic Cable for PIM2_63S

The PIM2_63S has a special 272-pin VHDCI female connector for connecting
to its 63 x E1 interfaces. A special cable offered by ECI Telecom is used to
make the connection.
The cable is constructed of three main parts:
 Double 136-pin VHDCI male connector with six 30AWG cable tails
 Conversion cable-size box
 Three pairs of 26AWG cables

Manual
The following figure shows the PIM2_63S traffic cable.
Figure 6-5: PIM2_63S traffi c c able
The six 30AWG cables connect on one side to the double 136-pin VHDCI
connector and on the other side to the conversion box. The conversion box
connects between the six 30AWG wires and three pairs of 26AWG wires,
making the wire-size conversion. The 26AWG cables are connected at the
other end to the customer's DDF. Each cable in a pair is bonded to the other,
shaping a figure-eight pattern.
Each pair of the 26AWG cables carries 21 E1s totaling 63 E1s; to facilitate
identification of the E1 groups each cable pair is marked with color strips along
its jacket, according to the following key:
 First pair, E1s No. 1 to 21 - Red strips
 Second pair, E1s No. 22 to 42 - Blue strips
 Third pair, E1s No. 43 to 63 - Yellow strips

Manual
PIM345_3
The PIM345_3 is an I/O module with 3 x E3/DS-3/STS-1 (34/45/51 Mbps)
interfaces (three pairs of DIN 1.0/2.3 connectors).

 XDM-50
 XDM-100
 XDM-300
 XDM-900

supported shelves and the resulting total number of E3/DS-3/STS-1 interfaces
are listed in the following table. The front panel has a monitoring point (with a
DIN 1.0/2.3 connector).
Table 6-11: PIM345_3 mod ul es and E3/DS-3/STS-1 in terf aces per shel f
Shelf Maximum Maximu m E3/DS-3/STS-

PIM345_3 1 interfaces
modules
XDM-50 4 12
XDM-100 8 24
XDM-300 16 48
XDM-900 16 48

TPMH_1 can provide 1:1 protection (one PIM345_3 protects
one PIM345_3).
Figure 6-6: PIM345_3 I/O module

Manual
Table 6-12: PIM345_3 front p anel LED indicator s

operating normally.
the module.
(separate LED for each pair of electrical
connectors).

Manual
SDH Cards and Modules

SDH I/O (SIM) modules provide the interfaces for connecting SDH signals to
the central cross-connect matrix of the XDM-100 Product Line (MXC). SIM
modules are available with electrical and optical interfaces. They include line
interface circuits, SDH signal processing circuits, internal interfaces to the two
MXC cards, and physical line interfaces.
All SIM modules occupy only one slot and can be inserted in any of the I1
through I4 positions in the XDM-50, slots I1 through I8 in the XDM-100, and
slots I1 through I16 in the XDM-300 or XDM-900 without any limitations.
SIM cards like: the SIM16_4, SIM64_XFP, and SIM64_2 are wide cards that
can be installed in quad I/O slots or in a quad of I/O module slots in the XDM-
300 or XDM-900 only.
NOTE: Optical SIMs incorporate SFP transceivers with LC

connectors. These SFPs should be purchased only through ECI
Telecom.
Table 6-13: SDH I/O modul e and card ty pes
Type Designation
SDH Electrical I/O module SIM1_4/E (page 6-16)
SDH Optical I/O modules SIM1_4/O and SIM1_4OB (page 6-17)

SIM1_8 (page 6-19)
SIM4_2 (page 6-21)
SIM4_4 (page 6-22)
SIM4_8 (page 6-24)
SIM16_1 (page 6-26)
SIM16_2 (page 6-28)
SDH Optical I/O cards SIM16_4 (page 6-29)
SIM16_8 (page 6-31)
SIM64_1 (page 6-33)
SIM64_XFP (page 6-35)
SIM64_2 (page 6-37)

Manual
SIM1_4/E
The SIM1_4/E is an electrical traffic module with 4 x STM-1e (155 Mbps)
interfaces (four pairs of DIN 1.0/2.3 connectors).
NOTE: The SIM1_4/E is supported in the following shelves:

 XDM-50
 XDM-100
 XDM-300
 XDM-900

supported shelves and the resulting total number of STM-1e interfaces are
listed in the following table.
Table 6-14: SIM1_4/E modul es and OC-3 interfaces per sh elf
Shelf Maximum Maximu m STM-1e

SIM1_4/E modules interfaces
XDM-50 4 16
XDM-100 8 32
XDM-300 16 64
XDM-900 16 64

TPMH_1 can provide 1:1 protection (one SIM1_4/E protects
one SIM1_4/E).
Channel monitoring is performed via the STM-1 monitoring port on the

ECU-F.
Figure 6-7: SIM1_4/E I/O module

Manual
Table 6-15: SIM1_4/E front p anel LED indicator s

operating normally.
the module.
(separate LED for each pair of electrical
connectors).
SIM1_4/O and SIM1_4OB

The SIM1_4/O and SIM1_4OB are optical traffic modules with four optical
STM-1 (155 Mbps) interfaces for SFP transceivers.
NOTE: SIM1_4/O and SIM1_4OB are supported in the

following shelves:
 XDM-50
 XDM-100
 XDM-300
 XDM-900

supported shelves and the resulting total number of STM-1 interfaces are listed
in the following table.
Table 6-16: SIM1_4/O or SIM1_4OB modu les and OC-3 in terf aces per shelf
Shelf Maximum SIM1_4/O or Maximum STM-1

SIM1_4OB modules interfaces
XDM-50 4 16
XDM-100 8 32
XDM-300 16 64
XDM-900 16 64

Manual
Channel monitoring is performed via the STM-1 monitoring port on the ECU-F
in the XDM-100, ECU300-F in the XDM-300, or ECU900-F in the XDM-900.
SIM1_8 enables easy expansion of I/O slots equipped with SIM1_4/O or
SIM1_4/OB modules by additional four STM-1 interfaces, while significantly
reducing the cost per STM-1 interface. This is done by removing the working
SIM1_4/O or SIM1_4/OB, replacing it with a SIM1_8, and connecting it with
appropriate fibers. The I/O slot must then be reassigned through the
management as a SIM1_8. The attributes (including cross-connects, trails, and
so on) of the first four STM-1s are retained as they were in the replaced
SIM1_4/O or SIM1_4/OB. For a detailed description of this procedure refer to
corresponding IMM.
Figure 6-8: SIM 1_4/O and SIM1_4OB I/O module
NOTE: The front panels of the SIM1_4 and SIM1_4OB are

similar and differ only in the module name marking.
Table 6-17: SIM1_4/O and SIM1_4OB fron t panel LED indi cato rs

the module.

Manual
SIM1_8
The SIM1_8 is an optical traffic module with eight optical STM-1 (155 Mbps)
interfaces for SFP transceivers.
NOTE: The SIM1_8 is supported in the following shelves:

 XDM-50
 XDM-100
 XDM-300
 XDM-900

Table 6-18: SIM1_8 modu les and OC-3 interfaces per shelf
Shelf Maximu m SIM1_8 Maximum STM-1

modules interfaces
XDM-50 4 32
XDM-100 8 64
XDM-300 16 128
XDM-900 16 128
Channel monitoring is supported in XDM-100, XDM-300, and XDM-900 via

the STM-1 monitoring port on the corresponding ECU-F, ECU300-F, or
ECU900-F card.
SIM1_8 enables easy expansion of I/O slots equipped with SIM1_4/O or
SIM1_4/OB modules by additional four STM-1 interfaces, while significantly
reducing the cost per STM-1 interface. This is done by removing the working
SIM1_4/O or SIM1_4/OB, replacing it with a SIM1_8, and connecting it with
appropriate fibers. The I/O slot must then be reassigned through the
management as a SIM1_8. The attributes (including cross-connects, trails, and
so on) of the first four STM-1s are retained as they were in the replaced
SIM1_4/O or SIM1_4/OB. For a detailed description of this procedure refer to
corresponding IMM.

Manual
Figure 6-9: SIM1_8 front p anel
Table 6-19: SIM1_8 fron t panel LED indicator s

corresponding MXC50/MXC-
100/B/MXC300, after powerup, reset, or
when new software

management station.is available from the
TR Traffic Orange Lights when traffic is cross connecting
through the module.
LSR_ON/ Laser Green/ Lights green when traffic is being
MON active/Monitor Orange transmitted (separate dual color LED for
each SFP transceiver).
Lights orange when the channel is being
monitored and the corresponding laser is
actually transmitting.

Manual
SIM4_2
The SIM4_2 is an optical traffic module with two STM-4 (622 Mbps)
interfaces for SFP transceivers.

 XDM-50
 XDM-100
 XDM-300

Table 6-20: SIM4_2 modu les and OC-12 interfaces per shelf

modules interfaces
XDM-50 4 8
XDM-100 8 16
XDM-300 16 32
SIM4_4 enables easy expansion of I/O slots equipped with SIM4_2 modules
by additional two STM-4 interfaces, while significantly reducing the cost per
STM-4 interface. This is done by removing the working SIM4_2, replacing it
with a SIM4_4, and connecting it with appropriate fibers. The I/O slot must
then be reassigned through the management as a SIM4_4. The attributes
(including cross-connects, trails, and so on) of the first two STM-4s are
retained as they were in the replaced SIM4_2. For a detailed description of this
procedure refer to corresponding IMM.
The front panel has a 622 Mbps monitoring point with a DIN1.0/2.3 connector.
Figure 6-10: SIM4_2 I/O module

Manual

operating normally.
the module.
SIM4_4
The SIM4_4 is an optical traffic module with four STM-1/4 (155 Mbps/622
Mbps) interfaces for SFP transceivers.

 XDM-100
 XDM-300
 XDM-900

supported shelves and the resulting total number of STM-1/4 interfaces are
Table 6-22: SIM4_4 mod ul es and STM-1/4 int erfaces per shel f
Shelf Maximu m SIM4_4 Maximu m STM-1/4

modules interfaces
XDM-100 4 (in slots I1, I2, 16
with I5, I6)
MXC100
XDM-100 8 32
with
MXC100B
XDM-300 16 64
XDM-900 16 64

Manual

through the module.
SIM4_8
The SIM4_8 is an optical traffic module with eight optical STM-1/4 (155/622
Mbps) interfaces for SFP transceivers.

 XDM-300_100G
 XDM-900

supported shelves and the resulting total number of STM-1/4 interfaces are
Table 6-24: SIM4_8 mod ul es and STM-1/4 int erfaces per shel f
Shelf Maximu m SIM4_8 Maximu m STM-1/4

modules interfaces
XDM- 16 128
300_100G
XDM-900 16 128

Manual
Channel monitoring is supported in XDM-300_100G and XDM-900 via the

STM 1 monitoring port on the corresponding ECU300 F, or ECU900 F card.
by additional four STM-1/4 interfaces, while significantly reducing the cost per
STM-1/4 interface. This is done by removing the working SIM4_4, replacing it
with a SIM4_8, and connecting it with appropriate fibers. The I/O slot must
(including cross-connects, trails, and so on) of the first four STM-1/4 are
retained as they were in the replaced SIM4_4. For a detailed description of this
procedure refer to corresponding IMM.
Mix of electrical and optical interfaces is possible using the ETR 1 SFP
Electrical Transceiver.
Figure 6-12: SIM4_8 front panel

corresponding MXC-300/MXC900, after
through the module.

Manual
SIM16_1
The SIM16_1 is an optical traffic module with one STM-16 (2.488 Gbps)
interface for an SFP transceiver.

 XDM-100
 XDM-300
 XDM-900

supported shelves and the resulting total number of STM-16 interfaces are
Table 6-26: SIM16_1 modu les and STM-16 interfaces per sh elf
Shelf Maximum SIM16_1 Maximum STM-16 in terfaces

modules
XDM-100 4 (in slots I1, I2, I5, 4

with I6)
MXC100
XDM-100 8 8
with
MXC100B
XDM-300 18 18
XDM-900 18 18

Manual
by an additional STM-16 interface, while significantly reducing the cost per
STM-16 interface. This is done by removing the working SIM16_1, replacing

it with a SIM16_2, and connecting it with appropriate fibers. The I/O slot must
(including cross-connects, trails, and so on) of the first STM-16 are retained as
they were in the replaced SIM16_1. For a detailed description of this procedure
refer to corresponding IMM.
Figure 6-13: SIM16_1 fron t p anel
Table 6-27: SIM16_1 front panel LED indicato rs

operating normally.
the module.

Manual
SIM16_2
The SIM16_2 is an optical traffic module with two STM-16 (2.488 Gbps)
interface for SFP transceivers.

 XDM-300_100G
 XDM-900

Table 6-28: SIM16_2 modu les and STM-16 interfaces per sh elf

modules interfaces
XDM-300_100G 16 32
XDM-900 16 32
by an additional STM-16 interface, while significantly reducing the cost
perSTM-16 interface. This is done by removing the working SIM16_1,
replacing it with a SIM16_2, and connecting it with appropriate fibers. The I/O
slot must then

attributes be reassigned
(including through trails,
cross-connects, the management as the
and so on) of a SIM16_2. The are
first STM-16
retained as they were in the replaced SIM16_1. For a detailed description of
this procedure refer to corresponding IMM.

Manual

through the module.
LSR_ON Laser active Green Lights when traffic is being transmitted on
the SFP transceiver.
SIM16_4
The SIM16_4 is an optical traffic card with four STM-16 (2.488 Gbps)
interfaces for SFP transceiver.

 XDM-300
 XDM-300_100G
 XDM-900
The card can be installed in the quad I/O slots (I17, I18) only.
The maximum number of cards that can be installed in each of the supported
shelves and the resulting total number of STM-16 interfaces are listed in the
following table.
Table 6-30: SIM16_4 card s and STM-16 in terf aces per shelf
Shelf Maximum Maximum STM-

SIM16_4 cards 16 interfaces
XDM-300 2 8
XDM-300_100G 2 8
XDM-900 2 8

Manual
CAUTION: Before extracting or inserting a SIM16_4 into the

shelf, release the extractor handles by pressing the brown
extractor handles of the SIM16_4.

AC Active Green Lights steadily when the card is powered and
operating normally.
MXC300, after powerup, reset, or when new
station.
the card.

Manual
SIM16_8
The SIM16_8 is an optical traffic card with eight STM-16 (2.488 Gbps) and
eight STM-1/4 (155 Mbps/622Mbps) interfaces for SFP transceiver.
The SIM16_8 supports multi-rate functionality with STM-1, STM-4, and STM-
16 interfaces based on two SFP cages (upper and lower). The upper ports (1 to
8) can be assigned as STM-16 and the lower ports (9 to 16) as STM-1/4. The
total card capacity is 20 Gbps (quad I/O slot). The following figure will help
you understand the bandwidth assignment in the SIM16_8 ports.
Figure 6-17: SIM16_8 ports and b andwidt h assignm ent
Actually, the SIM16_8 has two port groups (Group 1 and Group 2) as shown in
the preceding figure. Each group consists eight ports; four STM-16 ports in the
upper SFP cage, and four STM-1/4 ports in the lower SFP cage (just below
them). For example the left group (Group 1) includes the STM-16 ports 1 to 4,
and the STM-1/4 ports 9 to 12. The total capacity of a group is 10 Gbps.
The bandwidth of the four lower SFPs in a group is shared with the upper right-
most STM-16 port. This means that if the user assigns any lower (STM-1/4)
port as STM-1 or STM-4, the right-most STM-16 port (port 4 in Group 1 or
port 8 in Group 2) is automatically disabled.
The SIM16_8 allows any mix of STM-16, STM-4, and STM-1 up to 20 Gbps.

 XDM-300_100G (slots I1 to I16 only)
 XDM-900
The card can be installed in the XDM-900 quad I/O slots (I17, I18), and in a
quad of I/O slots (I1 to I4, I5 to I8, I9 to I12, and I13 to I16) in the XDM-
300_100G/XDM-900. This expands the number of SIM16_8 to maximum six
or four, and enables to configure the supported shelves as multi ADM-16
platforms.

Manual
To install a SIM16_8 in the positions of four I/O slots, the module guides
between the slots must be removed, and an adapter installed to the right of the
right-most slot, and to the left of the left-most slot in each quad. The procedure
for the SIM16_8 installation is described in the corresponding XDM shelf
IMM.
shelves and the resulting total number of STM-16 and STM-1/4 interfaces are
Table 6-32: SIM16_8 card s and STM-16 and STM-1/4 interf aces per shel f
Shelf Maximum Maximum Maximum

SIM16_8 STM-16 STM-1/4
cards interfaces interfaces
XDM-300_100G 4 32 32
XDM-900 6 48 48


Manual

operating normally.
MXC300/MXC900, after powerup, reset, or
when new software is available from the
management station.
the card.

SIM64_1
The SIM64_1 is an optical traffic card with one STM-64 (9.953 Gbps) or
OTU2 (10.7 Gbps) interface for an XFP transceiver.

 XDM-300_100G
 XDM-900
The card can be installed in a double I/O slots. This expands the number of
SIM64_1 to maximum eight, and enables to configure the supported shelves as
multi ADM-64 platforms.
To install a SIM64_1 in the positions of two I/O slots, the module guide
between the slots must be removed. The procedure for the SIM64_1 installation
is described in the corresponding XDM shelf IMM.

Manual


Shelf Maximum Maximum STM-

SIM64_1 cards 64 interfaces
XDM-300_100G 8 8
XDM-900 8 8

corresponding MXC300/B/MX900, after
through the module.
ON Laser active Green Lights when traffic is being transmitted on
the SFP transceiver.

Manual
SIM64_XFP
The SIM64_XFP is an optical traffic card with one STM-64 (9.953 Gbps) or
OTU2 (10.7 Gbps) interface for an XFP transceiver.
NOTE: The SIM64_XFP is supported in the following

shelves:
 XDM-300
 XDM-300_100G
 XDM-900

The card can be installed in the quad I/O slots (I17, I18), and in a quad of I/O
slots (I1 to I4, I5 to I8, I9 to I12, and I13 to I16). This expands the number of
SIM64_XFP to maximum six, and enables to configure the supported shelves
as multi ADM-64 platforms.
To install a SIM64_XFP in the positions of four I/O slots, the module guides
for the SIM64_XFP installation is described in the corresponding XDM shelf
IMM.
following table.
Table 6-36: SIM64_XFP cards and STM-64 in terf aces per shelf
Shelf Maximum Maximu m STM-64

SIM64_XFP interfaces
cards
XDM-300 6 6
XDM-300_100G 6 6
XDM-900 6 6
SIM64_2
by enablesSTM-64
an additional easy expansion ofwhile
interface, I/O slots equipped reducing
significantly with SIM64_XFP cards
the cost per
STM-64 interface. This is done by removing the working SIM64_XFP,
slot must then be reassigned through the management as a SIM64_2. The
attributes (including cross-connects, trails, and so on) of the first STM-64 are
retained as they were in the replaced SIM64_XFP. For a detailed description of

Manual
CAUTION: Before extracting or inserting a SIM64_XFP into

Figure 6-21: SIM64_XFP front panel
extractor handles of the SIM64_XFP.
Table 6-37: SIM64_XFP fron t panel L ED indicator s

operating normally.

station.
the card.
active XFP transceiver.
NOTE: When the TR and FL indicators blink simultaneously,

both brown levers on the extractor handles are not locked
properly.

Manual
SIM64_2
The SIM64_2 is an optical traffic card with two STM-64 (9.953 Gbps) or
OTU2 (10.7 Gbps) interfaces for XFP transceivers.

 XDM-300_100G (in slots I1 to I16 only)
 XDM-900
The card can be installed in the quad I/O slots (I17, I18), and in a quad of I/O
slots (I1 to I4, I5 to I8, I9 to I12, and I13 to I16) in XDM-900 and in a quad of
I/O slots (I1 to I4, I5 to I8, I9 to I12, and I13 to I16) only in XDM-300_100G.
This enables to configure the supported shelves as multi ADM-64 platforms.
To install a SIM64_2 in the positions of four I/O slots, the module guides
for the SIM64_2 installation is described in the corresponding XDM shelf
IMM.
following table.
Shelf Maximum Maximu m STM-64

SIM64_2 interfaces
cards
XDM-300_100G 4 8
XDM-900 6 12
SIM64_2 enables easy expansion of I/O slots equipped with SIM64_XFP cards
by an additional STM-64 interface, while significantly reducing the cost per
STM-64 interface. This is done by removing the working SIM64_XFP,
slot must then

attributes be reassigned
(including through trails,
cross-connects, the management as the
and so on) of a SIM64_2. The are
first STM-64
retained as they were in the replaced SIM64_XFP. For a detailed description of


Manual

operating normally.
station.
the card.
active XFP transceiver.
NOTE: When the TR and FL indicators blink simultaneously,

both brown levers on the extractor handles are not locked
properly.

Manual
CWDM I/O Modules

The XDM-100H contains eight slots (I1 to I8) and XDM-300, XDM-
300_100G, and XDM-900 contain 16 slots (I1 to I16) that can accommodate
any combination of the available types of CWDM I/O modules.
All modules incorporate SFP devices with LC connectors which are purchased
through ECI Telecom.
Each module can be inserted into any of the I1 through I8 positions in XDM-
100H, or I1 through I16 positions in XDM-300, XDM-300_100G, or XDM-
900, without limitations. Various types of I/O modules with a variety of client
interfaces for SDH, data services, and CWDM line transceivers are available,
as follows:
 CRPT25_2C (page 6-39)
 CTRP25_2C (page 6-40)
 CCMB25_2D (page 6-41)
CRPT25_2C
The CRPT25_2C is an optical traffic module for two bidirectional continuous
transponders (100 Mbps to 2.7 Gbps), each with two SFP transceivers: a 2.5
Gbps CWDM line SFP and an STM-16 client interface, for A/D mode only.
Figure 6-25: CRPT25_2C module

Manual
Table 6-40: CRPT25_2C fron t panel L ED indicator s

TR Traffic (Orange) (Not used in this module.)
LASER ON Laser Green Lights when traffic is being transmitted
active (separate LED for each of the SFP
transceivers).
CTRP25_2C
The CTRP25_2C is an optical traffic module for two bidirectional continuous
transponders (100 Mbps to 2.7 Gbps), each with two SFP transceivers: a 2.5
Gbps CWDM line SFP, and an STM-16 client SFP interface, or two line SFPs
for regenerator mode.
Figure 6-26: CTRP25_2C module
Table 6-41: CTRP25_2C fron t panel L ED indicator s


LASER ON Laser Green Lights when traffic is being transmitted
active (separate LED for each of the SFP
transceivers).

Manual
CCMB25_2D
The CCMB25_2D is an optical traffic combiner for two GbE/FC/FICON client
SFP transceivers and one 2.7 Gbps CWDM line interface with G.709 FEC
framing.
Figure 6-27: CCMB25_2D module
Table 6-42: CCMB25_2D fron t panel LED indi cators

AC Active Green Lights steadily when the module is
powered and operating normally.
LASER Laser Green Lights when traffic is being transmitted
ON active (separate LED for each of the SFP
transceivers).

Manual
Pluggable Interfaces (SFP/XFP)

SFPs and XFPs are a new variety of modular optical transceivers with a small
footprint and low power consumption. SFP transceivers operate at rates of up
to 2.7 Gbps with either electrical or optical ports, including both colored and
noncolored interfaces (C/DWDM). XFP transceivers operate at rates of up to
10.7 Gbps.
The SFP/XFP transceiver modules are used for the entire spectrum of
interfaces, including intraoffice, short and long ranges, and the interchangeable
transceiver components are utilized throughout the product line. The
standardized modular design of the transceiver components facilitates network
maintenance and upgrades. Instead of replacing an entire circuit board
containing a number of soldered modules, a single module can be removed or
replaced for repair or upgrade, providing significant cost savings.
All transceivers provide power monitoring capabilities. The SFPs for STM-16
have the added capability of using low-cost colored interfaces (C/DWDM),
further reducing maintenance costs. Transceivers provide a significant
advantage for the SIM, DIOM, EISMB, and MCSM cards used in small XDM
platforms.
Figure 6-28: SFP transceiver
The SFP and XFP transceivers support a variety of transmission rates for
several wavelengths and distances.

Manual
The SFP transceivers support:

 Short-haul and long-haul 1310 nm transceivers, ranging from STM-1 to
STM-16
 Short-haul and long-haul (1310/1550 nm) Bi-Directional (BD) transceivers
for STM-1, STM-4, and STM-16
 Short-haul and long-haul 1550 nm transceivers ranging from STM-1 to
STM-16
 Intraoffice 1310 nm STM-16 transceivers
 Short reach 850 nm optical GbE transceiver
 Long reach 1310 nm optical GbE transceiver
 Intraoffice 1310 nm CWDM STM-16 SFP transceivers
 Long-haul 1550 nm C/DWDM STM-16/OTU1 SFP transceivers
The XFP transceivers support:
 Intraoffice 1310 nm STM-64/10 GbE WAN transceiver
 Short-haul 1310 nm STM-64/10 GbE WAN transceiver
 Long-haul 1550 nm STM-64/10 GbE WAN transceiver
 T-XFP tunable XFP
ETR-1 ECI
SFP Electrical Transceiver
Telecom now offers the ETR-1 SFP electrical transceiver that enables full
duplex STM-1 electrical (155 Mbps) SDH transport over coaxial cables. The
interface fully complies with ITU-T G.703 signal specifications.
The SFP electrical transceiver is interchangeable with STM-1 optical SFP
modules and provides easy migration to STM-1 electrical interfaces. With this
SFP module, any system that already supports STM-1 optical SFPs can now
also support STM-1 electrical. This results in increased flexibility of the
equipment and reduced inventory and spare parts. While the system is in
operation, changing between the optical and electrical SFPs can be done in the
field to optimize the system port types to the application (hot insertion; non-
traffic-affecting).
The ETR-1 enables a mix of electrical and optical interfaces on the same
module for SAM1_4/O, SIM1_4/O, SIM1_4OB, and SIM1_8 STM-1 optical
modules.

Manual
The main features of the ETR-1 are as follows:

 Compliant with industry standard MSA for SFP ports
 Standard coaxial cable connector with 75 Ohm impedance
 Serial identification by built-in ID PROM
 Low power high performance CMI encoder/decoder integrated in the
module
 Fully interchangeable with STM-1 optical SFP modules
 Hot insertion without affecting traffic
ETGbE SFP Electrical Transceiver

ECI Telecom offers the ETGbE SFP electrical transceiver that enables full
duplex 1000BaseT electrical traffic over CAT5E SFTP copper cables. The
interface fully complies with 1000BaseT and GbE standards as per IEEE 802.3.
The SFP electrical transceiver is interchangeable with GbE optical SFP
modules and provides easy migration to 1000BaseT electrical interfaces. With
this SFP module, any system that already supports GbE optical SFPs can now
also support 1000BaseT. This results in increased flexibility of the equipment
and reduced inventory and spare parts. Changing between optical and electrical
SFPs can be done in the field while the system is in operation to optimize the
system port types for the application (hot insertion; non-traffic-affecting).
The ETGbE supports operation at 1000BaseT, as well as autonegotiation.

The ETGbE enables a mix of electrical and optical interfaces on the same
module for DIOM_40, EISMB_840, and MCSM modules.
The main features of the ETGbE are as follows:
 Compliance with industry standard MSA for SFP ports
 Compact RJ-45 connector assembly
 Serial identification by built-in ID PROM
 Low power dissipation
 Fully interchangeable with GbE optical SFP modules
 Hot insertion allowed

Manual
Overhead Access Module (OHU)

The OHU supports SDH overhead channels and OW functionality.
NOTE: The OHU is supported in the following shelves:

 XDM-50
 XDM-100
 XDM-300
 XDM-300_100G
 XDM-900
Only one OHU module can be assigned to any of the XDM-50, XDM-100 or
XDM-300 shelves, and it can be installed in any slot of the I/O cages.
The OW functions include:
 Connection to a 4 W handset
 Digital conference call for up to 10 simultaneous users
 Separation of the OW into two independent networks
 Internal buzzer to indicate an incoming call
Figure 6-29: OHU front p anel

Manual
Table 6-43: OHU ind icators and funct ions
Item Function
AC Green indicator; lights steadily when the module is powered and
operates normally.
FL Red indicator; lights steadily when a fault is detected. Flashes during
software download from the MXC, powerup, reset, or when new
software is available from the management station.
TR Red indicator; lights when traffic is cross connecting through the
module.
O.W Orange indicator; lights steadily to indicate OW traffic in network A,
blinks to indicate OW traffic in network B.
OHA 26-pin SCSI female connector with optional interfaces to two V.11
lines (via SDH overhead channels) (not currently supported by the
XDM-100 software).
O.W RJ-11 connector for connecting the handset to the 4 W analog
interface of the engineering OW facility.
NET SEL Dual position switch; selects OW network A or B.
MPLS and Ethernet Data Modules XDM-100 Product Line Reference

Manual
 Ethernet Interface Switch (EISB) modules for adding Layer 2 Ethernet

capabilities to the XDM-100 Product Line shelves. EISMB modules
support Fast Ethernet and GbE services, with both electrical and optical
interfaces. They are one slot modules, and feature enhanced switching
capabilities. The EISMB is supported in all XDM-100 Product Line
shelves.
 Data I/O Modules (DIOM) Layer 1 Ethernet modules for Fast Ethernet
and GbE services, with both electrical and optical interfaces. Enable
efficient data transport of Ethernet traffic over SDH infrastructures.
NOTE: Data modules, such as EISMB, DIOM, and MCSM

with optical ports, incorporate SFP transceivers with LC
connectors. These SFPs should be purchased only through
ECI Telecom.
Table 7-1: Data modu le types
Type Designation
Layer 2 data modules
EISMBs EISMB_804 (page 7-12)
EISMB_840 (page 7-14)
MPLS modules
MCSM (page 7-25)
Layer 1 data modules
DIOM_04 (page 7-17)
DIOM_08 (page 7-20)
DIOM_40 (page 7-22)
NOTES:
panel markings.
 The traffic of STM-1 I/O modules (as well as aggregate
modules) can be monitored via the STM_1 MON
connector on the corresponding ECU card (ECU-F in
XDM-100, ECU300-F in XDM-300, or ECU900-F in
XDM-900).
XDM-100 Product Line Reference MPLS and Ethernet Data Modules

Manual
Ethernet Switching Modules

ECI Telecom offers a family of Ethernet Interface Switching Modules
(EISMBs) for use with XDM-100 Product Line.
EISMB/EISM modules are used to provide Ethernet Layer 2 services with full
VLAN support to end users over SDH networks.
To support these services, EISMB modules installed in the shelves are
interconnected by SDH trails that serve as EoS links. Virtual Concatenation
(VCAT) with Generic Frame Procedure (GFP) encapsulation at VC-4, VC-3, or
VC-12 levels is used to provide the required bandwidth. The resulting network
appears as an Ethernet switch to the end users.
EISMB modules use LCAS to provide dynamic bandwidth allocation on trails
carrying the EoS links. The number of SDH containers in the link is
automatically decreased if one or more VCs fail, and automatically increased
when the fault is repaired.
Each member of the EISMB family is a single slot module offering Ethernet
over SDH capabilities. EISMBs provide four optical or electrical Ethernet
interfaces, according to the module type. The EoS side supports a granularity of
VC-12/3/4. EISMB offers full interoperability with the BG Family data cards
and 3rd party equipment.

Manual
EISMB Functionality
EISMB modules perform the following functions:
 Layer 2 provider bridge switching
 Wire-speed MAC and VLAN ID based forwarding
 Provider bridge double tagging (QinQ)
 Support of four Classes of Service (CoS)
 Support of GFP-F encapsulation
 High order and low order virtual concatenation:
 n x VC-4

n x VC-3
 n x VC-12 (only for EISMB)
 Support differential delay compensation of up to 128 msec (VC-12) and
256 msec (VC-3/4)
 Link Capacity Adjustment Scheme (LCAS)
 RMON statistic counters on ETY and EoS ports
 Traffic protection based on SDH (MS-SPRing and SNCP), Ethernet
(RSTP), and LCAS
 1:1 equipment protection by hot standby modules
The following sections provide a detailed description of the main functions.
Generic Framing Procedure (GFP)

GFP, defined in ITU-T Rec. G.7041, is a protocol for mapping data packets
into a synchronous transport system like SDH. GFP requires a fixed amount of
overhead for encapsulation that is independent of the data packets. This allows
deterministic matching of bandwidth between the Ethernet flow and the
virtually concatenated SDH stream.
To cater for all mapping requirements, two mapping modes are defined for
GFP:
 Frame mapped - used for connections where efficiency and flexibility are
essential and reasonable latency can be tolerated
 Transparent mapped - facilitates the transport of block-coded client signals
(like Fiber Channel, ESCON, or FICON) that require very low
transmission latency
EISMB modules support the GFP-F (frame-based) mode.

Manual
Virtual concatenation
Virtual concatenation, defined in ITU-T Rec. G.707, is a technique used to give
SDH additional flexibility in transporting client signals requiring a bandwidth
that does not match the bandwidth granularity of SDH networks.
The approach used by virtual concatenation is to combine the bandwidth
available on an arbitrary number of SDH containers (configured as a Virtual
Concatenated Group - VCG) in a way that creates a single logical channel
capable of carrying a single byte-synchronous data stream.
With virtual concatenation, the individual containers are transported over the
SDH network independently and then recombined to restore the original
payload signal at the endpoint of the transmission path. Differential delay due
to the different path of each VC is compensated at the end of the path as part of
regrouping the VCs of a VCG.
Virtual concatenation has the following benefits:
 Scalability - allows bandwidth to be selected in VC-4, VC-3, or VC-12
increments as required, to match the desired payload data rate.
 Efficiency - the resulting signals are easily routed through the SDH
network, making more efficient use of available bandwidth on existing
networks.
 Compatibility - virtual concatenation requires only the end nodes to be
aware of the containers being virtually concatenated, making the signals
transparent to the core NEs.
The fine bandwidth management made possible by virtual concatenation is
particularly effective for the efficient transport of data services that inherently
comprise variable bitrates. For example, consider the transport of a partially
filled GbE signal. Although the nominal bandwidth is 1 Gbps, often the
instantaneous rate is only 200 Mbps to 300 Mbps. Thus, continuous allocation
of a bandwidth equal to the peak value (1 Gbps) to this GbE signal, as done in
pure transport applications, wastes on average 70% of the network bandwidth.
With virtual concatenation, an optimal bandwidth, close to the average
bandwidth requirement is selected, for example, a bandwidth of 300 Mbps. To
handle the peak bandwidth requirements, ingress buffers are used to shape the
peak traffic to match the provisioned bandwidth.

Manual
The Weighed Random Early Discard (WRED) technique used to smooth traffic
pattern under congestion conditions supports the policing procedure as follows:
 When traffic exceeds the module capabilities, it must discard packets. Any
TCP client detecting discarded packets will reduce its transmission rate to
half. After packets are no longer discarded, the rate will slowly be
increased as long as there is no packet loss.
 If the module would discard packets only during congestion conditions,
traffic volume would suffer from the sawtooth syndrome: after a series of
packets are discarded, all the clients would drop their rate to half, resulting
in partial utilization of the network, and will together again increase the
rate until the network is congested again.
WRED prevents this behavior by discarding a small part of the packets before
its buffers are full. As a result, only a small number of TCP clients will
decrease their rate and traffic utilization will not drop.
EISMB modules support WRED, and its characteristics are separately
configurable for each of the four priority classes of the internal Ethernet switch.
FDB quota provisioning

Ethernet frames are forwarded according to their Destination MAC address and
VLAN ID. The forwarding information is stored in a Filtering Data Base
(FDB) (routing table). The size of this database is limited; therefore, to free
space for new addresses, the entries are automatically removed after a
configurable agingthe
entry in the table, time. If the
packet is address
flooded and
(sentVID ofoutput
to all a packet do not match any
ports).
MAC address storm from a VPN may occupy all free resources of the address
table. In the absence of free resources, packets with new addresses are not
learned. This causes the addresses to be flooded and overload the egress ports.
The FDB quota provisioning minimizes this effect by letting the operator sets a
limited amount of entries (MAC addresses) per VPN (S-VLAN) and blocks
any client port that exceeds the limit. Although in EISMB any client may
exceed their quota, the EISMB cards, since FDB quota violation, reduce the
aging time to minimum to free the FDB from the new entries and block the
interfering client port to prevent it from continuing to overload the FDB.

Manual
Triggers for RSTP
RSTP
traffic prevents thetopologies
by the ring creation ofused
loops
in and
SDHenables the protection of Ethernet
networks.
Link bandwidth reduction as a result of failures in VC members of a VCG may
in turn cause service degradation performance. In such cases the RSTP is
activated to change the network topology and overcome the failure. The
EISMB has a set of link capacity related parameters that are used as triggers for
RSTP:
 No members provisioned on the Tx direction
 No members provisioned on the Rx direction
 Partial Loss of Capacity (PLCr) on the receive side
 Partial Loss of Capacity (PLCt) on the transmit side
 Total Loss of Capacity (TLCr) on the receive side
 Total Loss of Capacity (TLTr) on the transmit side
 Link Fail Detection (LFD)
 Remote Defect Indication (RDI) on at least one member in the VCG (only
for VCAT mode)
The threshold values of the TLCr and PLCr can be set by the user.
Standard BPDU frames

BPDUs (Bridge Protocol Data Units) are sent by every bridge in the network to
acknowledge the neighboring bridges of its port roles. This information serves
the system to figure out the roles all its ports play during activation of the
RSTP.
Until the current version of the XDM, the BPDU were proprietary frames.
Starting from XDM V6.2 the EISMB modules support standard BPDU frames,
which enable interoperability with other XDM data cards and modules as well
as with 3rd party equipment.

Manual
Port-based VLANs
Client framestagged
that provides may enter the attaches
frames provider's
hisnetwork
CVLAN tagged or VLAN
(Client untagged.
ID)Aand
client
priority bits to the Ethernet frames. The provider uses this information to
identify the client and decide how to handle the traffic within his network.
In many cases the provider is not allowed to change the client tagging because
the client needs it to continue the traffic handling at the far end. To facilitate
traffic handling, the provider attaches his SVLAN (Service Provider VLAN)
containing VLAN ID (VID) and CoS bits at the ingress port, and removes them
at the egress.
Attach/detach VLAN
EISMB enables the provider to add a VLAN tag to incoming untagged frames.
This VLAN is named PVID and is maintained throughout the network. The
PVID enables the operator to identify different clients arriving from different
ports, even after being multiplexed in point-to-multipoint configurations. The
PVID is detached from the frames that are outgoing from the same port which
was configured to attach and detach PVID.
UNI on EoS ports

The EISMB enables serving client traffic arriving through EoS ports as if they
were received from ETY ports. This enables the provider to give the client
“port extension” services. For example, a client that is far from the providers'
EISMB location uses a DIO card or DIOM module to map his Ethernet traffic
over SDH, and reaches the provider via the SDH network. This traffic is
directed to an EISMB module EoS port. The traffic is demapped and enters the
card/module. It is then handled as regular traffic that enters the card/module via
a regular ETY port.
NNI on ETY ports

The EISMB enables configuring the ETY port as NNI. Traffic in such ports use
QinQ where the S-VLAN of the EISMB network is maintained and transmitted
towards the client equipment.

Manual
EISMB Module Types

The following EISMBs are available:
 EISMB_804 - supports four external electrical Ethernet and eight internal
EoS ports.
The four electrical ports used to connect to the user's network include:
 2 x 10/100/1000BaseT interfaces
 2 x 10/100BaseT interfaces
The eight EoS ports can serve for “multi-ring closure” and “Hub and spoke
configuration” (aggregation of Layer 1 services), including:
 2 x GbE interfaces
 6 x FE interfaces
 EISMB_840 - supports four external optical Ethernet ports and eight
internal EoS ports.
The four optical ports used to connect to the user's network include:
 2 x FE or GbE SFP interfaces
 2 x FE SFP interfaces
NOTE: Electrical SFPs for GbE services are supported for

EISMB modules.
The eight EoS ports can serve for “multi-ring closure” and “Hub and spoke
configuration” (aggregation of Layer 1 services), including:
 2 x GbE interfaces
 6 x FE interfaces
NOTE: When there is an S-tag with one or more PVID ports

(i.e. ports that the EISMB attach/detach C-tag to the client
ingress/egress traffic), then other Layer 2 ports (i.e. without
PVID) are not allowed to map ingress untagged traffic to this
VPN.

Manual
EISMB_804
The EISMB_804 is an electrical Fast Ethernet/GbE module including two
10/100/1000BaseT ports and two 10/100BaseT ports with RJ45 connectors that
can be connected with the following cables:
 10/100BaseT – CAT5E SFTP 2-pair or 4-pair straight cable
 1000BaseT – CAT5E SFTP 4-pair straight cable
NOTE: To support the Autonegotiation feature on electrical

ports, use CAT5E SFTP 2-pair or 4-pair straight cable to
connect 10/100BaseT ports, or CAT5E SFTP 4-pair straight
cable to connect 1000BaseT ports.
Ports 1 and 2 support 10/100/1000BaseT interfaces, and ports 3 and 4 support

10/100BaseT interfaces.
NOTE: The EISMB_804 is supported in the following

shelves:
 XDM-50
 XDM-100
 XDM-300
 XDM-900
EISMB_804 modules require a capacity of 2.5 Gbps and can be installed in

allocated slots in the supported shelves. The allocated slots per shelf, maximum
modules per shelf, and the resulting total interfaces are described in the
following table.
Table 7-2: EISMB_804 modu les and Ethernet interfaces per shelf
Shelf Allocated slots Maximum Maximum Maximum

EISMB_804 10/100/1000BaseT 10/100BaseT
modules interfaces interfaces
XDM-50 I3, I4 2 4 4
XDM-100 with I1 to I8 (any slot) 4 8 8
MXC100B
XDM-100 with I1, I2, I5, I6 4 8 8
MXC100
XDM-300 I3, I4, I7, I8, I11, 8 16 16
I12, I15, I16
XDM-900 I3, I4, I7, I8, I11, 8 16 16
I12, I15, I16

Manual
Table 7-4: EISMB_804 fron t panel LED ind icators
Indicator Full name Color Function

AC Module Green Lights steadily when the module
active is powered.
Lights steadily when a fault is
detected.
Flashes after powerup, reset, if
the module is unassigned, or
when new software is available
TR Traffic Orange Lights when traffic is cross
connecting through the module.
ACT Port Orange Flashes when Ethernet traffic is

activity being transmitted/received
(separate LED for each port).
LNK Link Blue/Green/Yellow Indicates that the link is active;
lights blue for 1000BaseT, green
for 100BaseT, and yellow for
10BaseT (separate LED for each
port).
EISMB_840
The EISMB_840
ports and two FE is an optical
ports for the Fast Ethernet/GbE
insertion module with two FE/GbE
of SFP transceivers.
Ports 1 and 2 support FE and GbE SFPs, and ports 3 and 4 support FE SFPs.
NOTE: The EISMB_840 is supported in the following

shelves:
 XDM-50
 XDM-100
 XDM-300
 XDM-900
EISMB_840 modules require a capacity of 2.5 Gbps and can be installed in

following table.

Manual
Table 7-5: EISMB_840 modu les and Ethernet interfaces per shelf
Shelf Al lo cated Maximum Maximum Maximu m FE (SFP)

slots EISMB_840 FE/GbE (SFP) interfaces
modules interfaces
XDM-50 I3, I4 2 4 4
XDM-100 I1 to I8 (any 4 8 8
with slot)
MXC100B
XDM-100 I1, I2, I5, I6 4 8 8
with
MXC100
XDM-300 I3, I4, I7, I8, 8 16 16
I11, I12,
I15, I16
XDM-900 I3, I4, I7, I8, 8 16 16
I11, I12,
I15, I16
NOTE: XDM-100 equipped with an MXC100B supports

higher flexibility, allowing up to four EISMB_840 modules to
be installed in any I/O slot.
All shelves support I/O protection for EISMB modules. When protection is
required, the main and protection modules should be installed in the allocated
slots, as described in the following table.
Table 7-6: EISMB_840 main and protecti on module slots per shelf
Shelf Main modul e Protection module

slot slot
XDM-50 I3 I4
XDM-100 I5, I6, I7, I8 I1, I2, I3, I4
with
MXC100B2
XDM-100 I5, I6 I1, I2
with
MXC100
XDM-300 I5, I6, I13, I14 I7, I8, I15, I16
XDM-900 I5, I6, I13, I14 I7, I8, I15, I16
The cable options for the different ports are listed in the following table.
2
A maximum of four modules are supported.

Manual
Table 7-7: Port cable opti ons
Port Type Connector Fiber/Cable opti ons

1-2 Optical LC  100BaseFX multimode 50 µm
 100BaseFX multimode 62.5 µ m
 100BaseFX single mode 9 µm
 1000BaseSX
 1000BaseLX
 1000BaseZX
3-4 Optical LC  100BaseFX multimode 50 µm
 100BaseFX multimode 62.5 µ m
 100BaseFX single mode 9 µm
A mix of electrical and optical interfaces is possible on this module using the
ETGbE SFP Electrical Transceiver (page 6-44).
Figure 7-2: EISMB_840 front panel
Table 7-8: EISMB_840 main and protecti on module slots per shelf

AC Module Green Lights steadily when the module is
active powered.
Flashes after powerup, reset, if the module
is unassigned, or when new software is
through the module.
ACT Port activity Orange Flashes when Ethernet traffic is being
transmitted/received (separate LED for
each port).
LNK Link Blue/ Indicates that the link is active; lights blue
Green for 1000BaseSX/LX/ZX, and green for
100BaseFX (separate LED for each port).

Manual
DIOM_04 modules require a capacity of 2.5 Gbps and can be installed in

following table.
Table 7-9: DIOM_04 modu les and Ethernet interfaces per shelf
Shelf Al lo cated Maximum Maximum

slots DIOM_04 10/100/1000Base
modules T interfaces
XDM-50 Any slot (I1 4 16
to I4)
XDM-100 I1, I2, I5, I6 8 3 32
with MXC-
100
with MXC- to I8)
100B
to I16)
to I16)
All shelves support I/O protection for DIOM_04 modules. When protection is
Table 7-10: DIOM_04 main and prot ection mo dule slot s per shelf
Shelf Main module slot Protection module

slot
XDM-50 I2, I4 I1, I3
XDM-100 I5, I6 I1, I2
with MXC-
100
XDM-100 I5, I6, I7, I8 I1, I2, I3, I4

with MXC-
100B
XDM-300 I5, I6, I7, I8 I1, I2, I3, I4

I13, I14, I15, I16 I9, I10, I11, I12
XDM-900 I5, I6, I7, I8 I1, I2, I3, I4
I13, I14, I15, I16 I9, I10, I11, I12
3
Management configuration enables installation of additional four modules as DIOM_04H, with half capacity (1.25
Gbps) in slots I3, I4, I7, and I8 of the XDM-100.

Manual
Figure 7-3: DIOM_04 front panel
Table 7-11: DIOM_04 front p anel LED indicator s

AC Module active Green Lights steadily when the module is
detected.
Flashes after powerup, reset, if the
module is unassigned, or when new
software is available from the
management station.
ACT Port active Green Lights when Ethernet traffic is being
transmitted/received (separate LED
for each port).
LNK Link Blue/Green/ Indicates that the link is active; lights
Yellow blue for 1000BaseT, green for
100BaseT, and yellow for 10BaseT

Manual
DIOM_08
The DIOM_08 is an electrical Fast Ethernet module including eight
10/100BaseT ports with RJ45 connectors that can be connected with CAT5E
SFTP 2-pair or 4-pair straight cable.
All DIOM_08 ports support 10/100BaseT interfaces.

connect 10/100BaseT ports.
NOTE: The DIOM_08 is supported in the following shelves:

 XDM-50
 XDM-100
 XDM-300
 XDM-900

following table.
Table 7-12: DIOM_08 modules and Ethernet i nterfaces per shelf
Shelf Al lo cated Maximum Maximum

slots DIOM_08 10/100BaseT
modules interfaces
to I4)
to I8)
to I16)
to I16)
All shelves support I/O protection for DIOM_08 modules. When protection is

Manual
DIOM_40
The DIOM_40 is an optical Fast Ethernet/GbE module including four FE/GbE
ports for the insertion of SFP transceivers.
All ports support FE/GbE (100/1000 Mbps) interfaces.
NOTE: The DIOM_40 is supported in the following shelves:

 XDM-50
 XDM-100
 XDM-300
 XDM-900

following table.
Table 7-15: DIOM_40 modules and Ethernet i nterfaces per shelf
Shelf Allo cated Maximum Maximum

slots DIOM_40 10/100/1000BaseT
modules interfaces

to I4)
XDM-100 I1, I2, I5, I6 8 32
with MXC-
100
XDM-100with Any slot (I1 8 32
MXC-100B to I8)
to I16)
to I16)

Manual
Table 7-18: DIOM_40 front p anel LED indicator s

active powered and operating normally.
detected.
Flashes after powerup, reset, if the
module is unassigned, or when
management station.
ACT Port active Green Lights when Ethernet traffic is

being transmitted/received
LNK Link Blue/Green Indicates that the link is active;
lights blue for
1000BaseSX/LX/ZX and green for
100BaseFX (separate LED for
each port).

Manual
MCSM
The MCSM is an MPLS Carrier Class Switch Module for the XDM-100
Product Line. The module enables service providers to build a cost-effective
carrier class Ethernet network over new and existing SDH networks,
supporting any Ethernet-based application and service, including business
connectivity (VPLS), triple play (IPTV Drop and Continue multicast), 3G
mobile services, and wholesale/Carrier of Carrier (CoC) Ethernet leased line
(LL) and bandwidth services, all with carrier grade capability.
The MCSM offers a 20 Gbps Ethernet and/or MPLS switching capacity and up
to 5 Gbps EoS bandwidth.
NOTE: The MCSM is supported in the following shelves:

 XDM-100
 XDM-300
 XDM-900
The MCSM incorporates the following functions:

 Ethernet Provider Bridge (QinQ) switch – a standard base 802.1d/q/ad
bridge/switch.
 MPLS Layer 2 switch – a standard base IETF MPLS and ITU-T T-MPLS
switch supporting Ethernet PW (Pseudo Wire), VPLS (Virtual Private LAN
Service), and P2MP multicast trees.
 SDH/SONET mapper – supporting standard Ethernet, and MPLS mapping
to GFP/VCAT/LCAS with SDH VC-12/3/4 granularity and SONET STS-
1/STS-3c granularity.
 16 Ethernet ports – incorporating 8 x FX/GbE SFP ports and
8 x 10/100BaseT (RJ-45) ports.
 16 EoS/MoT (WAN) ports - with standard GFP/VCAT/LCAS mapping
with SDH n x VC-12/3/4 (VCG) granularity, and SONET STS1/STS3c
granularity.
Figure 7-6: MCSM functi onal blo ck diagram

Manual
The MCSM functional block diagram illustrates an Ethernet switch, an MPLS

switch, and an SDH mapper. A powerful Network Processor Unit (NPU)
fulfills the functions of the Ethernet and MPLS switches. This NPU is software
programmable, allowing the MCSM to work as an Ethernet Provider Bridge
(QinQ) switch and/or as Ethernet Provider Bridge plus MPLS switch.
The internal switch of the MCSM module has a total of 24 ports. Some of these
ports can be assigned by management as either Ethernet (LAN client) or EoS
(Ethernet over SDH/SONET)/MoT (MPLS over Transport) WAN ports.
Eight of the WAN ports are constantly allocated to the Ethernet optical SFP
ports. Eight other WAN ports can be configured to serve the eight Ethernet
electrical ports. The number of WAN ports can be flexibly extended with
maximum eight at the expense of Ethernet electrical ports that are not used.
The physical port numbering differs from the port numbers in the GUI. The
correlation between both, as well as, the port assignment possibilities is
presented in the following table.
Table 7-19: MCSM port n umberin g and assignment
ETY int erface Port ID (GUI EoS/MoT Port

5
order) interfaces assignment
(Ravel
4
Bank)
Physical port Interface type
number
1 OTGbE/OTFE 17 - ETY only


9 ETFE 1 1,2 ETY or
(10/100BaseT) EoS/MoT
10 ETFE 2 1,2 ETY or

4
N x VC-12 is supported only on the first 622 streams of Bank 1 (Ravel). (SDH only)
5
Some interfaces maybe assigned as Ethernet ports only, EoS/Mot ports only, or either as Ethernet or EoS/MoT.

Manual
ETY int erface Port ID (GUI EoS/MoT Port

5
order) interfaces assignment
(Ravel
4
Bank)
Physical port Interface type
number

- - 9 1,2 EoS/MoT only

The MCSM uses WAN ports (EoS/MoT) to connect to other data cards over
VCAT trails (VCG). WAN port specifications per VCG granularity are given
Table 7-20: MCSM WAN port specifi cations
Granul arit y VC-12 VC-3/STS-1 VC-4/STS-3c

Max. EoS/MoT 256 x VC-12 96 x VC-3/STS-1 32 x VC-4/STS-3c
capacity per card
VCG size per 1 to 63 1 to 48 1 to 16
EoS/MoT port
As shown in the previous table, the capacity of EoS/MoT trails (VCG) may
reach up to 2.5 Gbps of the effective Ethernet bandwidth (16 x VC-4 or 48 x
VC-3). WAN port capacity may increase above 2.5 Gbps using LAG (Link
Aggregation) up to the maximum EoS/MoT capacity, which is 5 Gbps in the
MCSM.
MCSM is a double-slot module. The allocated slots per shelf, maximum
following table.

Manual
Table 7-21: MCSM modu les and Ethernet interf aces per shelf
Shelf Allocated slots Max. Max. Max. Max.

MCSMs FX/GbE 10/100BaseT 1000BaseT
per shelf interfaces interfaces interfaces
XDM-100 I1 and I2 1 8 8 8 6
with
MXC-100
XDM-100 Any even 2 16 16 16 7
with double slot (for
MXC-100B example: I1 and
I2, I3 and I4,
and so on)
XDM-300 Any even 8 64 64 64 8
double slot (for
example: I1 and
I2, I3 and I4,
and so on)
XDM-900 Any even 8 64 64 64 9
double slot (for
example: I1 and
I2, I3 and I4,
and so on)
XDM-100, XDM-300, and XDM-900 shelves support I/O protection for

MCSM modules. When protection is required, the main and protection modules
should be installed in the allocated slots, as described in the following table.
Table 7-22: MCSM main and prot ection mod ule slot s per shelf
Shelf Main module slot Protection module slot

XDM-100 with MXC-100 I5 and I6 I1 and I2
XDM-100 with MXC-100B I5 and I6, I7 and I8 I1 and I2, I3 and I4
XDM-300 I5 and I6, I7 and I8 I1 and I2, I3 and I4
I13 and I14, I15 and I16 I9 and I10, I11 and I12
XDM-900 I5 and I6, I7 and I8 I1 and I2, I3 and I4

I13 and I14, I15 and I16 I9 and I10, I11 and I12
6
Up to eight 1000BaseT interfaces can be added, by inserting an ETGbE SFP electrical transceiver in each
position of an optical SFP port.
7
8
9

Manual
The MCSM card has eight positions for installing optical transceiver plug-ins,
where each one supports FX and GbE SFPs. The optical transceiver plug-ins
can be installed and replaced in the field.

The MCSM supports various combinations of the following Ethernet
interfaces:
 SFP-based optical GbE, dual fiber:
 1000Base-LX/ZX, single mode
 1000Base-SX, multimode
 GbE CWDM
 SFP-based optical GbE, single fiber:
 1000BaseLX/EX, single mode (1310/1550 nm or 1550/1310 nm)
 SFP-based 100BaseFX, optical interface for 100 Mbps FX, both single
mode and multimode
 Electrical SFP:
 1000BaseT (copper)
 Electrical interfaces:
 10/100BaseT electrical interface for 10, 100 Mbps Ethernet with auto
negotiation

connect 10/100BaseT ports, or CAT5E SFTP 4-pair straight
cable to connect 1000BaseT ports.
The LEDs corresponding to the optical SFP ports are located in the middle of
the MCSM front panel. Two LEDs are available for each port; one indicates
activity and the second connectivity and rate. Similarly, two LED indicators
reside on each electrical port and provide the same functionality as the optical
port LEDs.
The number of electrical interfaces can be increased by maximum eight, by
inserting an ETGbE SFP Electrical Transceiver (page 6-44) in the optical ports.
This results in a 1000BaseT copper port in each position where electrical SFP
is used.

Manual
The MCSM has an extensive set of indicators that enable technical personnel to
rapidly and reliably identify any problem. In addition to the module indicators,
each optical transceiver plug-in has indicators that indicate the state of each
optical port.
Figure 7-7: MCSM front panel
Table 7-23: MCSM fron t panel LED indicator s

active powered.
FL Fail Red Normally off. Lights steadily when a
fault is detected. Flashes after
powerup, reset, if the module is
unassigned, or when new software is
available from the management
station.
Electrical port i ndicators
activity being transmitted/received (separate
LED for each port).
LNK Link Green/Yellow Indicates that the link is active; lights
green for 100BaseT and yellow for
10BaseT (separate LED for each
port).
Optical port indicators
activity being transmitted/received (separate
LED for each port).
LNK Link Blue/Green Indicates that the link is active; lights
blue for GbE and green for FX
8
ASON (Automatically
Switched Optical Network)
In this chapter:
Overview ......................................................................................................... 8-1
Optical Control Plane Architecture ................................................................. 8-2
ASON Traffic Management ............................................................................ 8-6
ACP100 Module .............................................................................................. 8-9
ACP900 Module ............................................................................................ 8-11
Overview
ASON (Automatically Switched Optical Network) is an innovative networking
method that enables improved end-to-end provisioning and restoration,
efficient optical network planning and operation, as well as new transport
services, including GbE, optical virtual private networks (O-VPN), bandwidth
on demand (BoD), and differentiated CoS.
A distributed control plane is integrated in the network to enable ASON
capabilities. The principal functions of the control plane are signaling to
support the capability to create, delete, and maintain end-to-end connections,
and routing to select the most appropriate path.

The XDM networking tools are based on emerging standards from ITU, IETF,
and OIF, as well as advanced distributed control plane architectures. The XDM
also provides a variety of bandwidth protection and restoration schemes, while
supporting ring, mesh, and point-to-point topologies. Protection modes include
linear MSP, fast mesh restoration, SNCP, and MS-SPRing.
The XDM control plane architecture, protocols, and functionalities are
described in the following sections.
ASON (Automatically Switched XDM-100 Product Line Reference

Optical Network) Manual
Optical Control Plane

Architecture
The XDM architecture is fully ASON-compliant (ITU-T G.8080). The
following figure illustrates a high level view of XDM's ASON architecture.
The XDM architecture is completely interoperative with other vendor
equipment, including systems that do not have Optical Control Plane
technology.
The XDM architecture consists of three layers or planes:
 Transport layer
 Control plane
 Management layer
Figure 8-1: XDM control plane architecture
XDM-100 Product Line Reference ASON (Automatically Switched

Manual Optical Network)
Transport layer
The transport plane represents the switching equipment. This is the layer
responsible for carrying the client payload between endpoints of a connection
(trail) over any number of NEs, including switching and multiplexing services.
The transport layer is composed of the intelligent components and subsystems
that make up switching elements and line systems. The transport layer also
includes gateways for service adaptation. Note that legacy transmission
networks use the management plane for provisioning and operation (FCAPS)
of NEs in the transport plane.
With XDM, the transport layer is the XDM shelf itself. Among other value-
added features, the nonblocking lower order cross-connect capabilities of XDM
(the largest LO switch on the market today) is a key asset for carriers in metro
networks
traffic andinEthernet-over-SDH
general, and meshed networks
services are in particular.
usually Sinceatboth
generated TDM
VC-12
granularity, the XDM nonblocking solution enables carriers to provision
services between any two endpoints without the limitations that exist when
going through a HO trunk layer. This simplifies the planning and provisioning
stage as well as improving effective line utilization.
XDM also offers state-of-the-art built-in CWDM and DWDM layers. Equipped
with the latest Reconfigurable Optical Add Drop Multiplexer (ROADM)
technology and full range tunable lasers, XDM further simplifies carrier
networks by integrating two transmission layers into a single shelf, with a
single network management system. The XDM's integrated layers offer
networks far more flexibility than legacy WDM networks.
The XDM transport plane also implements two capabilities critical for ASON
architecture implementation. These are Automatic Discovery and Data
Communication Networks (DCN), both compliant with ASON standards, as
explained in the following section.
Control plane
The control plane is the layer that enables mesh restoration and intelligent
optical networking. The control plane in XDM networks consists of individual
processors (control plane instances) within each and every XDM NE. These
instances run control plane software and use a communication channel to create
an overlay plane that controls the switching elements.
The control plane is mainly responsible for restoring failed connections, for
which it establishes, releases, and supervises connections. A signaling
communication network (SCN) supports control plane instances by providing
the necessary communication channel. In the XDM the SCN is based on IP-
DCC, following the ASON architecture, and compliant with ITU-T G.7712.
The SCN may also be implemented over an external DCN.

The control plane uses various standard protocols to implement the different
roles of the ASON architecture. Control plane software interoperates with the
transport layer through a CCI (Connection Control Interface). Control plane

processors are interconnected with an I-NNI interface over a dedicated DCN
(in- or outbound). The control plane works with the following interfaces:
 I-NNI: The internal network-to-network interface (I-NNI) is a bidirectional
signaling interface between control plane instances within the same routing
domain. Complete topology and routing information is exchanged using the
OSPF-TE routing protocol over I-NNI, and connection requests are
propagated across the control plane using RSVP-TE signaling protocol.
Routing and signaling traffic is carried over the SCN. The signaling design
complies with ITU-T G.7713 and ITU-T G.7713.2, and routing with ITU-T
G.7715 and ITU-T G.7715.1.
 E-NNI: The external network-to-network interface (E-NNI) is a

bidirectional signaling interface between different routing domains and
different administrative domains. E-NNI is a key enabler for rapid delivery
of services that span across multiple domains. The E-NNI interface passes
reachability and domain level routing information only (not complete
routing information as for I-NNI). It is a UNI-like interface with some NNI
functions for exchanging address and topology summaries. The RSVP-TE
protocol is used for E-NNI protocol.
 UNI: The user-to-network interface (UNI) allows a client to signal for an
optical connection to be set up or torn down. The UNI is used by client
systems like routers. It is also used by elements of a higher layer transport
network
No to request
topology an optical
or routing connection
information or modify
is exchanged the UNI.
over service attributes.
OIF-UNI 1.0
R2 is used for this interface.
 NMI: The network-to-management interface (NMI) handles the
interactions between the management layer and the control plane.
The control plane for small XDM shelves is implemented through a dedicated
ASON Control Plane (ACP) modules named ACP-100 and ACP900. The ACP-
100 is supported for XDM-100 and XDM-300, and the ACP900 for the XDM-
900.

Management layer
The management layer, ECI's field-proven LightSoft NMS, provides full
FCAPS support, including fault, configuration, administration, performance,
and security management of the network. This approach is also further
extended when ASON is used to create an intelligent network.
With the introduction of the control plane, the management layer is expanded
to accommodate the operations, administration, maintenance, and provisioning
(OAM&P) of control plane related functions. Components of the control plane
are modeled as managed entities within the management plane, fitting into the
existing OAM architecture to minimize disruption to existing operational
procedures.

ASON Traffic Management

This section describes the distribution of ASON software throughout the
ASON network. The software referred to includes operating and management
software for each of the three planes that make up the ASON network:
 Management software:
 Network management software (LightSoft)
 Element management software (EMS-XDM)
 LCT software
 ASON ACP software
 Board software (for operating the system shelf)
Management Software
The ASON-XDM network is managed by the LightSoft NMS software and the
EMS, which support an array of critical management functions for the network.
These include Fault, Configuration, Administration, Performance, and Security
management (FCAPS). The LCT software enables assignment and
configuration of the ACP card locally. Together with the ASON standard, it
creates an intelligent network.
LightSoft features Corba north- and southbound interfaces, which enable it to
implement standard MTNM (multi-thread) architecture. LightSoft interoperates
with EMS-XDM as well as other ECI Telecom and third-party EMS systems to
complete the management system in large networks.
LightSoft prepares the configuration data to enable the control plane, acting as
a real-time tool, to set up and tear down services and preserve them in the event
of a network failure. Once correctly configured, the control plane is able to
operate even if LightSoft is temporarily unavailable.
LightSoft is also capable of overriding the control plane, if necessary. For
example, the ability to override the control plane via LightSoft enables the
operation to perform repairs, where necessary.

Location of ASON Software

ASON software is distributed throughout the entire product software system.
The ASON software and NE software run on the SCC board. The card software
runs on the relevant card, and the EMS-XDM and NMS software run on
dedicated management computers, to implement corresponding functions. You
can upgrade non-ASON versions to ASON by loading NE software which
contains ASON software.
Figure 8-2: ASON family sof tware struc ture

Structure of ASON ACP Software

According to ITU-T recommendations, ASON has three planes: a control
plane, a management plane, and a transmission plane. The management plane
refers to the NMS layer, and the transmission plane refers to the SDH network.
ASON software is used in the control plane, using CSPF, OSPF, and RSVP-
TE.
Figure 8-3: ASON softw are structu re
The structure of the ASON software includes the following modules:

Management and operation can be understood as follows:
 Signaling module: Creates or removes services according to requests from
users, and synchronizes and restores services as required.
 Routing module: Collects and floods TE link information; collects and
floods control link information; calculates the restoration of service route
and control routes.
 Switching controller module: Creates and deletes cross connections; reports
link state and alarms.

ACP100 Module
ACP100 module is the control plane for ASON networks based on XDM small
shelves.
NOTE: The ACP100 is supported in the following shelves:

 XDM-100
 XDM-300
The ACP100 can be installed in any I/O module slot in the supported shelves.
Each XDM shelf can be equipped with two ACP100 modules for 1:1
protection, preventing a single point of failure. When protection is required, the
two ACP-100 modules are interconnected with an Ethernet cable. One module
is configured as Main (working) and the other as Protection (standby). This
option will be supported in the next version of the XDM system.
An additional option for protecting the system with the ACP100 is to connect it
to two different DCNs. The ACP100 has two ports for connecting to DCNs to
support the system redundancy.
The ACP100 implements OIF based on GMPLS standards, as well as I-NNI, E-
NNI, UNI, and MNI as defined by ITU-T ASON standards.
Figure 8-4: ACP100 front panel

Table 8-1: ACP100 fron t panel LED indi cators and conn ectors
Indicator/Connector Full name Color Function

Module LEDs
AC Module active Green Lights steadily when the

module is powered.
FL Fail Red Normally off. Lights steadily
when a fault is detected.
Flashes after powerup, reset, if
the module is unassigned, or
when new software is
available from the
management station.
PR Protection Orange Lights when the module
operates as a protection
module.
Connectors (RJ-45)
ECU ECU N/A Connects to a management

connector on the
corresponding ECU card of
the shelf.
SCP1 Signaling N/A Two Signaling
Communication Communication Ports, SCP1
Port #1 and SCP2, are used to connect
to DCN networks. Two ports
are providedenabling
protection, for redundancy
connection to two different
DCN networks.
SCP2 Signaling N/A
Communication
Port #2
ACP_PROT ACP Protection N/A Enables connection to an
optional second ACP100 for
additional redundancy
protection (enabled next
release).
Port indicator LEDs

ACT Port activity Orange Flashes when Ethernet traffic
is being transmitted/received
(separate LED for each port)
LNK Link Green/Yel Indicates that the link is
low active; lights green for
100BaseT and yellow for
10BaseT (separate LED for
each port).

ACP900 Module
ACP900 module is the control plane for ASON networks based on XDM-900
shelves.
NOTE: The ACP900 is supported in the following shelves:

 XDM-300_100G
 XDM-900
The ACP900 can be installed only in a dedicated slot in the MXC900 card in
the supported shelves. Each XDM shelf can be equipped with two ACP900
modules for 1:1 protection, preventing a single point of failure. When
protection is required, the two ACP900 modules are interconnected with an
Ethernet cable. One module is configured as Main (working) and the other as
Protection (standby). This option will be supported in the next version of the
XDM system.
An additional option for protecting the system with the ACP900 is to connect it
to two different DCNs. The ACP900 has two ports for connecting to DCNs to
support the system redundancy.
The ACP900 implements OIF based on GMPLS standards, as well as I-NNI, E-
NNI, UNI, and MNI as defined by ITU-T ASON standards.
Figure 8-5: ACP900 front panel

Table 8-2: ACP900 fron t panel LED indi cators and conn ectors
Indicator/Connector Full name Color Function

Module LEDs
ACT Module active Green Lights steadily when the module

is powered.
FAIL Fail Red Normally off. Lights steadily
when a fault is detected. Flashes
after powerup, reset, if the module
is unassigned, or when new
software is available from the
management station.
PR Protection Orange Lights when the module operates
as a protection module.
Connectors (RJ-45)
ECU ECU N/A Connects to a management

connector on the corresponding
ECU card of the shelf.
SCP1 Signaling N/A Two Signaling Communication
Communication Ports, SCP1 and SCP2, are used
Port #1 to connect to DCN networks. Two
ports are provided for redundancy
protection, enabling connection to
two different DCN networks.
SCP2 Signaling N/A
Communication
Port #2
ACP_PROT ACP Protection N/A Enables connection to an optional
second ACP900 for additional
redundancy protection (enabled
next release).
Port indicator LEDs
ACT Port activity Orange Flashes when Ethernet traffic is

being transmitted/received
(separate LED for each port)
LNK Link Green/ Indicates that the link is active;
Yellow lights green for 100BaseT and
yellow for 10BaseT (separate
LED for each port).
9
Tributary Protection Unit
(TPU)
In this chapter:
Overview ......................................................................................................... 9-1
TC Modules ..................................................................................................... 9-5
TPMs ............................................................................................................... 9-8
TPU and I/O Slots Allocation for Protection ................................................. 9-15
Optical Amplifiers ......................................................................................... 9-19
TPU/OCU Shelf ............................................................................................. 9-24
CWDM Networking Modules ....................................................................... 9-24
Overview
The optional TPU shelf can be mounted on top of the XDM-50, XDM-100,
XDM-300, and XDM-900 shelves to add I/O protection capability to each of
the platforms. The TPU can also be installed under the XDM-300 and XDM-
900 to support protection for the modules installed in its lower module cage.
Each Tributary Protection Module (TPM) is connected to both operating and
protection I/O modules in the XDM-50, XDM-100, XDM-300, and XDM-900
shelves. If a failure is detected in one of the operating I/O modules, the TC

module in the TPU switches the traffic from the operating I/O module to the
protection module.
Tributary Protection Unit (TPU) XDM-100 Product Line Reference

Manual
There are three possible configurations:

 1:1 protection, when a redundant module is installed to protect an operating
module
 1:2 protection, when a redundant module is installed to protect two
operating modules
 1:3 protection, when a redundant module is installed to protect three
operating modules
The TPU shelf is 231 mm deep, 450 mm wide, and 75 mm high, and comprises
a single cage with slots for the TC module and the TPMs. The TPU connects to
a connector on top of each of the XDM-50, XDM-100, XDM-300, and XDM-
900 shelves. Similarly, the lower TPU in the XDM-300 or XDM-900 connects
to a connector under the shelf. These connectors provide the power and control
buses required for the TPU operation.
 The rightmost TPU slot is allocated for the TC module. The TC module is
described in TC (page 9-5).
 The other four slots are used for any combination of TPMs (single-slot,
double-slot, or triple-slot modules are supported). Various types of TPMs
for 1:1, 1:2, or 1:3 protection schemes are available. The modules are
described in TPMs (page 9-8).
Figure 9-1: XDM-50 with TPU
XDM-100 Product Line Reference Tributary Protection Unit (TPU)

Manual
Figure 9-2: XDM-100 with TPU
Figure 9-3: XDM-300 wi th two TPUs

Manual
Figure 9-4: XDM-900 wi th two TPUs

Manual
TC Modules
The TC module is installed in the rightmost slot of the TPU shelf. It is available
in two different configurations, TC and TCF, and controls the switching of
traffic from working to the protection I/O modules.
TC
The TC module is installed in the rightmost slot of the TPU. It is connected
through a connector on the top of the XDM-50, XDM-100, XDM-300, or
XDM-900 shelf to the DC and control buses of the corresponding MXC cards
via the TPU backplane. Similarly, for a lower TPU attached under a XDM-300
or XDM-900 shelf, the TC of the lower TPU is connected through a connector
at the bottom of the shelf to DC and control buses of the corresponding
MXC300 or MXC900 cards via the lower TPU backplane.
The TC module controls and monitors the switching of traffic from the
operating to the protection I/O modules by relays in the corresponding TPMs.
It also transfers power from the corresponding MXC to the TPU modules.
Extraction/insertion of the TC module does not affect traffic.
CAUTION: A microswitch is located under the tab to block

control of the TPMs when the TC is extracted. Therefore, if
the TC module is not properly inserted and/or one of its
screws is not secured in place, I/O protection will not be

implemented.
Figure 9-5: TC module

Manual
Table 9-1: TC fron t panel LED indi cators

ACTIVE Green Lights steadily when the module is powered and operating
normally.
Flashes during software download from the MXC, after
powerup, reset, or when new software is available from the
management station.
TCF
The TCF module is installed in the rightmost slot of the TPU. It is connected
through a connector on the top of the XDM-50, XDM-100, XDM-300, or
XDM-900 shelf to the DC and control buses of the corresponding MXC cards
via the TPU backplane. Similarly, for a lower TPU attached under a XDM-300
or XDM-900 shelf, the TCF of the lower TPU is connected through a connector
at the bottom of the shelf to DC and control buses of the corresponding
MXC300 or MXC900 cards via the lower TPU backplane.
The TCF module controls and monitors the switching of traffic from the
operating to the protection I/O modules by relays in the corresponding TPMs.
It contains three fans that provide cooling air to the TPMs. It also transfers
power from the corresponding MXC to the TPU modules. Extraction/insertion
of the TCF module does not affect traffic.
NOTE: A microswitch is located under the tab to block

control of the TPMs when the TCF is extracted. Therefore, if
the TCF is not properly inserted and/or one of its screws is
not secured in place, I/O protection will not be implemented.

Manual
Figure 9-6: TCF module
Table 9-2: TCF fron t panel LED indi cators
Indicator Functions
ACTIVE Green indicator; lights steadily when the module is powered and
operating normally.
FAIL Red indicator; lights steadily when a fault is detected.
Flashes during software download from the MXC, after power on,
reset, or when new software is available from the management
station. This indicator is normally off.

Manual
TPMs
The TPU has four slots for TPMs. The modules are connected to the main and
protection I/O modules by traffic cables, and the client’s traffic is connected
directly to the TPMs.
TPMs support the electrical PIMs and SIMs with the following protection
schemes:
 TPMs for a 1:1 protection scheme, where one protection module is
connected to a single I/O module
connected to one or two I/O modules
connected to two or three I/O modules
NOTE: TPMs must be inserted in the slot above the protected

I/O modules. For example, modules I1 and I5 can only be
protected by the module in slot TPM1 (leftmost slot).
The modules include:

 TPM2_1 (page 9-9)
 TPM2_3 (page 9-10)
 TPM2_42_2 (page 9-11)
 TPM2_63_2 (page 9-12)
 TPM2_63_3 (page 9-13)
 TPMH_1 (page 9-14)
The modules can be installed in various combinations in accordance with the
module width, for example:
 Four single-slot modules
 Two double-slot modules
 One double-slot module and two single-slot modules

 One triple-slot module and one single-slot module

Manual
TPM2_1
The TPM2_1 provides 1:1 protection for one PIM2_21. It is activated by the
MXC via the TC or TCF module, enabling a single I/O backup module to
protect the other I/O module when a failure is detected.
The TPM2_1 is connected as follows:
 The traffic connector on the protection I/O module is connected to the
PIM2_21 PROTECT 100-pin SCSI connector on the TPM2_1.
 The traffic connector on the active I/O module is connected to the PIM
2_21 100-pin SCSI connectors on the TPM2_1.
 The traffic cables from the DDF are connected to the DDF connector on the
TPM2_1.
Figure 9-7: TPM2_1 protecti on mo dul e
Table 9-3: TPM2_1 fron t panel LED indi cators

FL Fail Red Normally off. Lights steadily when a fault is
detected.
PROT Protection Orange Normally off. Lights when the active I/O
module is not functioning, and traffic is
being transferred through the protection I/O
module.

Manual
TPM2_3
The TPM2_3 provides 1:3 protection for up to three PIM2_21s. It is activated
by the MXC via the TC or TCF module, enabling a single I/O backup module
to protect any of the three other I/O modules when a failure is detected.
The TPM2_3 is connected as follows:
 The traffic connector on the protection I/O module is connected to the
PIM2_21 PROTECT 100-pin SCSI connector on the TPM2_3.
 The traffic connectors on the three active I/O modules are connected to the
PIM 2_21#1, PIM 2_21#2, and PIM 2_21#3 100-pin SCSI connectors on
the TPM2_3.
 The traffic cables from the DDF are connected to connectors DDF#1,
DDF#2, and DDF#3 on the TPM2_3.
Figure 9-8: TPM2_3 front panel
Table 9-4: TPM2_3 fron t panel LED indi cators

operating normally.
detected.
1, 2, 3 Orange Normally off. Lights when the respective active
I/O module (#1, #2, or #3) is not functioning,
and traffic is being transferred through the
protection I/O module.

Manual
TPM2_42_2
The TPM2_42_2 provides 1:2 protection for up to two PIM2_42 modules. It is
activated by the MXC via the TC or TCF module, enabling a single I/O backup
module to protect any of the two other I/O modules when a failure is detected.
The TPM2_42_2 is connected as follows:
 The traffic connectors on the PIM2_42 protection I/O module are
connected to the TPM2_42 PROT double 136-pin female VHDCI
connector on the TPM2_42_2.
 The traffic connectors on the two active PIM2_42 I/O modules are
connected to the PROTECTED 1 and PROTECTED 2 double 136-pin
female VHDCI connectors on the TPM2_42_2.
 The traffic cables from the customer's DDFs are connected to the DDF#1
CH 1-21, DDF#1 CH 22-42, DDF#2 CH 1-21, and DDF#2 CH 22-42
double 50-pin female SCSI connectors on the TPM2_42_2.
Figure 9-9: TPM2_42_2 front panel
Table 9-5: TPM2_42_2 fro nt panel LED ind icators

detected.
PROT 1, Orange Normally off. Lights when the
PROT 2 corresponding active I/O module (#1 or #2)
is not functioning and traffic is being
transferred through the protection I/O
module.

Manual
TPM2_63_2
The TPM2_63_2 provides 1:2 protection for up to two PIM2_63/B, PIM2_63S,
or PIM2_42 modules. It is activated by the MXC via the TC or TCF module,
enabling a single I/O backup module to protect any of the two other I/O
modules when a failure is detected.
NOTE: Though the TPM2_63_2 was originally planned to

protect PIM2_63/B modules it can also protect PIM2_42
modules, using appropriate cables. Cables connected to
PIM2_42 modules should be connected to the connectors on
the TPM2_63_2 marked PIM2_63.

 The traffic connectors on the protection I/O module are connected to the
PIM2_63/B PROTECT double 136-pin female VHDCI connector on the
TPM2_63_2.
 The traffic connectors on the two active I/O modules are connected to the
PIM 2_63#1 and PIM 2_63#2 double 136-pin female VHDCI connectors
on the TPM2_63_2.
 The traffic cables from the DDF are connected to the DDF#1, DDF#2, and
DDF#3 double 50-pin female SCSI connectors on the TPM2_63_2.
Figure 9-10: TPM2_63_2 front panel
Table 9-6: TPM2_63_2 fro nt panel LED indi cators

detected.
1, 2 Orange Normally off. Lights when the active I/O
module (#1 or #2) is not functioning and
traffic is being transferred through the

Manual
TPM2_63_3
The TPM2_63_3 provides 1:3 protection for up to three PIM2_63S cards. It is
activated by the MXC via the TC or TCF module, enabling a single I/O backup
module to protect any of the three other I/O modules when a failure is detected.
 The traffic connector from the protection I/O module is connected to the
PIM2_63S PROTECT double 136-pin female VHDCI connector on the
TPM2_63_3.
 The traffic connectors from the three active I/O modules are connected to
the PROTECTED 1, PROTECTED 2, and PROTECTED 3 double 136-pin
female VHDCI connectors on the TPM2_63_3.
 The traffic cables from the DDF are connected to the DDF 1, DDF 2, and
DDF 3 double 136-pin female VHDCI connectors on the TPM2_63_3.
CAUTION: The VHDCI connectors on the cables connected

to the card have a pin guide that must be inserted into the
corresponding hole, to the left of each VHDCI connector, on
the TPM2_63_3, before attaching the connectors to prevent
possible damage to the connectors.
Figure 9-11: TPM2_63_3 Front Panel
Table 9-7: TPM2_63_3 fro nt panel LED indi cators

detected.
1, 2,3 - Orange Normally off. Lights when the active I/O
module (#1, #2, or #3) is not functioning
and traffic is being transferred through the

Manual
TPMH_1
The TPMH_1 provides 1:1 protection for a single PIM345_3 I/O or a single
SIM1_4/E.
The module is activated by the MXC via the TC or TCF module, enabling a
single I/O backup module to protect a single I/O module when a failure is
detected.
The TPMH_1 is connected as follows:
 The protection I/O module is connected to the PROTECT connector on the
TPMH_1.
 The active I/O module is connected to the MAIN connector on the
TPMH_1.
 The traffic cables are connected to the OUT/IN connectors on the
TPMH_1.
Figu re 9-12: TPMH_1
Table 9-8: TPMH_1 fron t panel LED indi cators
AC Active Green Lights

and steadilynormally.
operating when the module is powered

detected.
PROT Protection Orange Normally off. Lights when the respective
active I/O module is not functioning and traffic
is being transferred through the protection I/O
module.

Manual
TPU and I/O Slots Allocation for

Protection
In the specific XDM-50, XDM-100, XDM-300, and XDM-900 protection
schemes, the location of the protection module (P) and the protected module
(M) is allocated by the system's management software. Therefore the I/O
modules must be installed in the allocated slots, and connected to the
corresponding TPMs.
The following sections describe the TPU and I/O slot allocation for XDM-50,
XDM-100, XDM-300, and XDM-900 in the various protection schemes.
XDM-50 and TPU Slot Allocation

The following table shows the slot association for 1:1, 1:2, and 1:3 protection
schemes for the various TPM modules and corresponding I/O modules in the
XDM-50.
Table 9-9: XDM-50 slot s allocati on for protectio n schemes
TPU Module I/O Module TPU Slots Allocation I/O Slots Allocation Protection
Type Type Scheme
TPM2_1 PIM2_21 M1-1 I1 I2 1:1

M1-2 I3 I4
TPM2_3 PIM2_21 M1-1+M1-2 I1 I2, I3,I4 1:3
TPM2_42_2 PIM2_42 M1-1+M1-2 I1 I2, I3 1:2
TPM2_63_2 PIM2_63/B M1-1+M1-2+M1-3 I1+I2 I3+I4 1:1

Manual

XDM-100.
Table 9-10: XDM-100 slot s allocatio n for pro tectio n schemes
TPU Module I/O Module TPU Slots Allocation I/O Slots Allocation Protection
Type Type Scheme
Protection Main
TPM2_1 PIM2_1 M1-1 I1 I5 1:1

M1-2 I2 I6
M1-3 I3 I7
M1-4 I4 I8
TPM2_3 PIM2_21 M1-1+M1-2 I1 I2, I5, I6 1:3
M1-3+M1-4 I3 I4, I7, I8
TPM2_42_2 PIM2_42 M1-1+M1-2 I1 I5, I6 1:2
M1-3+M1-4 I3 I7, I8
TPM2_63_2 PIM2_63 M1-1+M1-2+M1-3 I1+I2 I5+I6, I7+I8 1:2
TPM2_63_3 PIM2_63S M1-1+M1-2 I1 I2, I5, I6 1:3
M1-3+M1-4 I3 I4, I7, I8 1:3

Manual

XDM-300.
TPU Module I/O Module TPU Slot Allocation I/O Slot Allocation Protection
Type Type Scheme
Protection Main
TPM2_21 PIM2_21 M1-1 I1 I5 1:1

(upper TPU) (upper slots)
M1-2 I2 I6
M1-3 I3 I7
M1-4 I4 I8
TPM2_21 PIM2_21 M3-1 I9 I13 1:1
(lower TPU) (lower slots)
M3-2 I10 I14
M3-3 I11 I15
M3-4 I12 I16
TPU)TPM2_3 PIM2_21 M1-1+M1-2 I1 I2, I5, I6 1:3
M1-3+M1-4 I3 I4, I7, I8
TPM2_3 PIM2_21 M3-1+M3-2 I9 I10, I13, I14 1:3
M3-3+M3-4 I11 I12, I15, I16
TPM2_42_2 PIM2_42(upp M1-1+M1-2 I1 I5, I6 1:2
(upper TPU) er slots)
M1-3+M1-4 I3 I7, I8
TPM2_42_2 PIM2_42(low M3-1+M3-2 I9 I13, I14 1:2

(lower TPU) er slots)
M3-3+M3-4 I11 I15, I16
TPM2_63_2 PIM2_63 M1-1+M1-2+M1-3 I1+I2 I5+I6, I7+I8 1:2

TPM2_63_2 PIM2_63 M3-1+M3-2+M3-3 I9+I10 I13+I14, 1:2
(lower TPU) (lower slots) I15+I16
TPM2_63_2 PIM2_63S M1-1+M1-2+M1-3 I1 I5, I6 1:2
TPM2_63_2 PIM2_63S M3-1+M3-2+M3-3 I9 I13, I14 1:2
TPM2_63_3 PIM2_63S M1-1+M1-2 I1 I2, I5, I6 1:3
TPM2_63_3 PIM2_63S M3-1+M3-2 I9 I10, I13, I14 1:3
TPM2_63_3 PIM2_63S M1-3+M1-4 I3 I4 ,I7, I8 1:3
TPM2_63_3 PIM2_63S M3-3+M3-4 I11 I12, I15, I16 1:3

Manual

XDM-900.
TPU Module I/O Module TPU Slot I/O Slot Allocation Protection
Type Type Al loc atio n Scheme
Protection Main
TPM2_21 PIM2_21 M1-1 I1 I5 1:1

M1-2 I2 I6
M1-3 I3 I7
M1-4 I4 I8
TPM2_21 PIM2_21 M3-1 I9 I13 1:1
M3-2 I10 I14
M3-3 I11 I15
M3-4 I12 I16
TPU)TPM2_3 PIM2_21 M1-1+M1-2 I1 I2, I5, I6 1:3
M1-3+M1-4 I3 I4, I7, I8
TPM2_3 PIM2_21 M3-1+M3-2 I9 I10, I13, I14 1:3
M3-3+M3-4 I11 I12, I15, I16
TPM2_42_2 PIM2_42(upp M1-1+M1-2 I1 I5, I6 1:2
(upper TPU) er slots)
M1-3+M1-4 I3 I7, I8
TPM2_42_2 PIM2_42(low M3-1+M3-2 I9 I13, I14 1:2

(lower TPU) er slots)
M3-3+M3-4 I11 I15, I16
TPM2_63_2 PIM2_63 M1-1+M1- I1+I2 I5+I6, I7+I8 1:2

(upper TPU) (upper slots) 2+M1-3
TPM2_63_2 PIM2_63 M3-1+M3- I9+I10 I13+I14, 1:2
(lower TPU) (lower slots) 2+M3-3 I15+I16
TPM2_63_2 PIM2_63S M1-1+M1- I1 I5, I6 1:2
(upper TPU) (upper slots) 2+M1-3
TPM2_63_2 PIM2_63S M3-1+M3- I9 I13, I14 1:2
(lower TPU) (lower slots) 2+M3-3
TPM2_63_3 PIM2_63S M1-1+M1-2 I1 I2, I5, I6 1:3
TPM2_63_3 PIM2_63S M3-1+M3-2 I9 I10, I13, I14 1:3
TPM2_63_3 PIM2_63S M1-3+M1-4 I3 I4 ,I7, I8 1:3
TPM2_63_3 PIM2_63S M3-3+M3-4 I11 I12, I15, I16 1:3

Manual
Optical Amplifiers
XDM-100, XDM-300, and XDM-900 applications require support of long links
(with distances greater than 80 km) or high-loss links (with loss greater than 22
dB).
ECI Telecom addresses this demand by offering several optical amplifiers for
the XDM-100, XDM-300 and XDM-900.
 MO_DC0_BAS - booster amplifier for the entire C band without dispersion
compensation.
 MO_PAS_DCM80 - single channel preamplifier operating in Channel 35
of the C band with a dispersion compensation module.
 MO_OFA21 - fixed gain EDFA-based amplifier for long reach.
To facilitate link planning, the two first amplifier modules operate in constant
output power mode. The MO_OFA21 is a multipurpose module that can work
as a preamplifier, booster, or inline amplifier.
Each module occupies a single slot in the TPU. A TCF module must be
installed in the TPU to allow for adequate cooling of the amplifiers and proper
system configuration.

Manual
MO_DC0_BAS
The MO_DC0_BAS is a booster amplifier module without dispersion
compensation. It occupies a single slot in the TPU cage and can be installed in
any position.
NOTE: A TCF module must be installed in the TPU when the

MO_DC0_BAS is used, to enable adequate cooling air for the
amplifier.
Figure 9-13: MO_DC0_BAS f ront panel
Table 9-13: MO_DC0_BAS indicators
Indicator Functions
Tx Active Green indicator, lights when the module's output power is at a
normal level.
LOS Loss of signal (LOS) indicator, which is normally off. The
indicator lights red when the stage input signal is missing or is
too low for normal operation.
AC Green indicator, lights when the card is powered and operating
normally.
FL Red indicator, lights when a general fault condition is detected.
The module has three LC connectors: Rx (input), Tx (output), and MON (for
connecting monitoring test equipment). A spring-loaded cover protects the Rx
and Tx connectors.

Manual
Table 9-14: MO_PAS_DCM80 indicators
Indicator Functions
normal level.
normally.
The module has three LC connectors: Rx (input), Tx (output), and MON (for
connecting monitoring test equipment). A spring-loaded cover protects the Rx
and Tx connectors.
MO_OFA21
The MO_OFA21 is a fixed gain EDFA based DWDM amplifier for links of up
to 800 km with up to 16 channels. It occupies a double slot in the OCU shelf,
allowing up to two amplifiers to be installed.
NOTE: A TCF module must be installed in the TPU when the

MO_OFA21 is used, to enable adequate cooling air for the
amplifier.
The MO_OFA21 provides the following main functions:

 Operation as a preamplifier, booster, or inline amplifier
 Output power of 16 dBm with a gain of 21 dB
 Minimum input power of -24 dBm
 Monitoring and alarms
 Support for DWDM filters (Mux/Demux or OADM) in a separate Artemis
shelf
 Non-traffic affecting upgrade

Manual
 Output power monitoring point
Figure 9-15: MO_OFA21 fro nt panel
Table 9-15: MO_OFA21 indicators

Indicator Functions
normal level.
normally.
The module has three LC connectors: Rx (input), Tx (output), and MON (for connecting monitoring
test equipment). A spring-loaded cover protects the Rx and Tx connectors.

Manual
TPU/OCU Shelf
The TPU/OCU shelf can be mounted on top of the basic XDM-100 Product
Line shelves to add I/O protection and CWDM networking capabilities to the
system.
The TPU/OCU is 231 mm deep, 450 mm wide, and 75 mm high, and
comprises a single cage with five slots. One or two TPU/OCUs can be installed
on the XDM-100, XDM-300, or XDM-900 shelves. The first connects to a
connector on top of the XDM-100, XDM-300, or XDM-900shelves that
provides the power and control buses required for its operation. If an additional
TPU/OCU is required, it connects to a connector on top of the first unit.
 The rightmost slot is allocated to the TC module described in TC Module.

 The other four slots can accommodate any combination of TPM and
CWDM optical (Mux/DeMux, OADM, or splitter/coupler) modules. The
TPMs are described in TPMs (page 9-8). For a description of the optical
networking modules, refer to CWDM Networking Modules (page 9-24).
All connectors on the optical networking modules are LC connectors.
CWDM Networking Modules

The various CWDM optical networking modules are described in the following
sections:
 TC Modules (page 9-5)
 MO_CMD4C Mux/DeMux (page 9-25)
 MO_CMD8 Mux/DeMux (page 9-26)
 MO_CMD4C_E Mux/DeMux (page 9-27)
 MO_CMD4SL Mux/DeMux (page 9-28)
 MO_COADM1AB_xx OADM (page 9-29)
 MO_COADM2AB_Gxx OADM (page 9-30)
 MO_4CP4SPMM50 Splitter/Coupler (page 9-31)
 MO_4CP4SPMM62 Splitter/Coupler (page 9-32)
 MO_4CP4SPSM Splitter/Coupler (page 9-33)

Manual
MO_CMD4C Mux/DeMux
The MO_CMD4C is a four-channel nonexpandable Mux/DeMux for channel
wavelengths 1511 nm, 1531 nm, 1551 nm, and 1571 nm, with a built-in 1310
nm OSC filter.
Figure 9-16: MO_CMD4C module
Table 9-16: MO_CMD4C front p anel LED indic ators

corresponding MXC, after powerup, reset, or
when new software is available from the
management station.

Manual
MO_CMD8 Mux/DeMux
The MO_CMD8 is an eight-channel nonexpandable Mux/DeMux for channel
wavelengths 1471 nm, 1491 nm, 1511 nm, 1531 nm, 1551 nm, 1571 nm, 1591
nm, and 1611 nm, with a built-in 1310 nm OSC filter.
Figure 9-17: MO_CMD8 module
Table 9-17: MO_CMD8 front panel LED indicato rs

Flashes during software download from
the corresponding MXC, after powerup,
reset, or when new software is available

Manual
MO_CMD4C_E Mux/DeMux
The MO_CMD4C_E is a four-channel Mux/DeMux expandable to eight
channels for channel wavelengths 1511 nm, 1531 nm, 1551 nm, and 1571 nm,
with a built-in 1310 nm OSC filter.
Figu re 9-18: MO_CMD4C_E modul e
Table 9-18: MO_CMD4C_E front panel LED indi cators

FL Fail Red Normally off. when a fault is detected.

Lights steadily
corresponding MXC, after powerup, reset,
or when new software is available from the
management station.

Manual
MO_CMD4SL Mux/DeMux
The MO_CMD4SL is a four-channel expansion Mux/DeMux for channel
wavelengths 1471 nm, 1491 nm, 1591 nm, and 1611 nm, without an OSC filter.
Figure 9-19: MO_CMD4SL module
Table 9-19: MO_CMD4SL front panel LED indicato rs

management station.

Manual
MO_COADM1AB_xx OADM
The MO_COADM1AB_xx is a single-channel OADM module with a 1310 nm
built-in OSC filter in AB configuration and one I/O port. The channel dropped
by the OADM is designated by the xx in the module name.
Figure 9-20: Typi cal MO_COADM1AB_xx mo dule
Table 9-20: MO_COADM1AB_xx fron t panel LED indi cators

Flashes during software download from
the corresponding MXC, after powerup,
reset, or when new software is available

Manual
MO_COADM2AB_Gxx OADM
The MO_COADM2AB_Gxx is an OADM module that adds/drops two
channels. It has a 1310 nm built-in OSC filter in AB configuration with two I/O
ports. The group of two channels dropped by the OADM is designated by the
xx in the module name.
Figure 9-21: Typi cal MO_COADM2AB_Gxx mo dul e
Table 9-21: MO_COADM2AB_Gxx front panel LED indi cators

management station.

Manual
MO_4CP4SPMM50 Splitter/Coupler
The MO_4CP4SPMM50 is a module with four splitters and four couplers
designed to provide optical protection for an 850 nm or 1310 nm 50 µm
multimode fiber.
Figu re 9-22: MO_4CP4SPMM50 mod ule
Table 9-22: MO_4CP4SPMM50 fro nt panel LED indi cator s

operating normally.

Manual
MO_4CP4SPMM62 Splitter/Coupler
The MO_4CP4SPMM62 is a module with four splitters and four couplers
designed to provide optical protection for an 850 nm or 1310 nm 62.5 µm
multimode fiber.
Figu re 9-23: MO_4CP4SPMM62 mod ule
Table 9-23: MO_4CP4SPMM62 fro nt panel LED indi cator s


Manual
MO_4CP4SPSM Splitter/Coupler
The MO_4CP4SPSM is a module with four splitters and four couplers
designed to provide optical protection for a 1310 or 1550 nm single-mode
fiber.
Figure 9-24: MO_4CP4SPSM module
Table 9-24: MO_4CP4SPSM fron t panel LED indic ators


Manual
Accessories XDM-100 Product Line Reference

Manual
xRAP-100
The xRAP-100 is a power distribution and alarm panel for XDM and BG
shelves installed in racks. The xRAP-100 performs the following main
functions:
 Power distribution for up to four XDM or BG shelves : The nominal DC
power voltage is -48 VDC or -60 VDC. Since XDM and BG shelves can
use redundant power sources, the xRAP-100 supports connection to two
separate DC power circuits. The internal circuits of the xRAP-100 are
powered whenever at least one power source is connected. The presence of
DC power within the xRAP-100 is indicated by a POWER ON indicator.
Each DC power circuit of each shelf is protected by a circuit breaker, which
also serves as a power on/off switch for the corresponding circuit. The
required circuit breakers are included in the installation parts kit supplied
with the XDM or BG shelves, and therefore their current rating is in
accordance with the order requirements.
The xRAP-100 is designed to support three XDM or BG regular shelves
and one high-power XDM shelf, or four regular XDM or BG shelves. It has
three 3-pin D-type connectors and one 5-pin D-type high-power connector
for feeding the shelves. Each 3-pin connector can supply power to one of
the following regular shelves:
 XDM-50
 XDM-100
 XDM-500
 XDM-40
 Any BG shelf
The 5-pin high-power connector can supply power to one of the above
regular shelves, or to one of the following high-power shelves:
 XDM-300
 XDM-900
 XDM-1000
 XDM-2000
NOTE: When a regular XDM or BG shelf has to be

connected to the 5-pin connector, use a 5-pin D-type male to
3-pin D-type female adapter cable.
The circuit breakers are installed during the xRAP-100 installation. To

prevent accidental changing of a circuit breaker’s state, the circuit breakers
can be reached only after opening the front cover of the xRAP-100. The
circuit breaker state (ON or OFF) can be seen through the cover.
XDM-100 Product Line Reference Accessories

Manual
 Bay alarm indications: The xRAP-100 includes four alarm indicators, one
for each alarm severity. When alarms of different severities are received
simultaneously, the different alarm indications light simultaneously.
NOTE: BG shelves support only two alarm indications:

Major and Minor.
A buzzer is activated whenever a Major or Critical alarm is present in

XDM shelves connected to the xRAP-100. In case of BG shelves connected
to the xRAP-100, the buzzer is activated whenever a Major alarm is present
in the BG shelves.
 Connection of alarms from up to four XDM or BG shelves, each shelf
with maximum four alarm inputs and two alarm outputs.
The following figure shows the front panel of the xRAP-100, and the table lists
the functions of the front panel components corresponding to the figure callout
numbers.
Figure 10-1: xRAP-100 front panel

Manual
Table 10-1: xRAP-100 fro nt panel component fun ctio ns
No. Designation Function

1 SOURCE A Four circuit breakers (designated SHELF 1, SHELF 2,
SHELF 3, and SHELF 4 – one per XDM-100 Product
Line shelf installed in the rack). These circuit breakers
are used as ON/OFF power switches and overcurrent
protection for the DC power source A.
-- Buzzer (Concealed Operates when at least one unacknowledged Major or
under cover) Critical alarm is present in the shelves connected to the
xRAP-100.
2 TEST Pushbutton, pressing it activates the buzzer and turns
the indicators on for test purposes.
3 POWER ON Green indicator, lights whenever at least one DC power
source is connected to the xRAP-100.
4 CRITICAL Red indicator, lights when the severity of an alarm in
the shelves connected to the xRAP-100 is Critical.
5 MAJOR Orange indicator, lights when the severity of an alarm

in the shelves connected to the xRAP-100 is Major.
6 MINOR Yellow indicator, lights when the severity of an alarm
in the shelves connected to the xRAP-100 is Minor.
7 WARNING White indicator, lights when the severity of an alarm in
the shelves connected to the xRAP-100 is Warning.
8 SOURCE B Same as Item 1 for DC source B.

Manual
The xRAP-100 connectors are located on its circuit board, as shown in the
following figure. The table lists the connector functions. The index numbers in
the table correspond to those in the figure.
Figure 10-2: xRAP-100 connectors
Table 10-2: xRAP-100 conn ectors
1, 2, 3, 4 Shelf alarms Four 36-pin SCSI connectors designated SHELF 1,

SHELF 2, SHELF 3, and SHELF 4, for connecting
alarm input and output lines to XDM or BG
shelves and other equipment installed in the rack
5 ALARM IN/OUT 68-pin SCSI connector, for connecting alarm input
and output lines to the customer alarm monitoring
facility
6, 7, 8 Shelves DC input Three 3-pin D-type connectors designated Shelf 1,
power Shelf 2, and Shelf 3 for connecting DC power to
XDM or BG shelves
9 Shelf DC input, 5-pin D-type connector designated Shelf 4 for
high power connecting a high-power XDM, or a regular XDM
or BG shelf

Manual
xRAP-D
The xRAP-D is a power distribution and alarm panel for XDM platforms
installed in racks. The xRAP-D performs the following main functions:
 Redundant power distribution for one or two XDM platforms . The
xRAP-D can support either one or two XDM platforms. Each platform can
work with either one or two power inputs, where one is the main power
input (A) and the second is an optional protective backup power input (B).
The xRAP-D can work with up to two redundant input power sources,
depending on the user's electric infrastructure.
In the default configuration, the xRAP-D supplies independent streams of
power to two separate XDM platforms. Input power for one XDM platform
is kept completely separate from the input power for the second XDM
platform. Separate input power cables from the power sources feed into
independent circuit breakers on the xRAP-D unit. (There are a total of four
circuit breakers on the xRAP-D, supporting redundant power supplies for
up to two XDM platforms.) The power supply flow for two platforms is
illustrated in the following figure.
Figure 10-3: xRAP-D power suppl y flow

Manual
The xRAP-D has four 5-pin DC output connectors for supplying redundant
power to any platform in the XDM-1000 or XDM-100 family of products.
The maximum power supplied to each XDM platform is up to 2250 W, in

accordance with the platform type and version.
Note that with the default configuration, the power cables from the user's
power supply sources to the xRAP-D do not have to be more than 25 mm2
thick, and the circuit breakers do not have to be more than 55A, because the
maximum power consumption per cable is never more than 2250 W.
Previous xRAP units used a single heavy duty power cable to supply power
for up to two XDM platforms. The xRAP-D enables independent power
delivery to two shelves through separate cables, enabling use of thinner
cables and smaller circuit breakers. The xRAP-D was developed in
response to the needs of customers who are not able to support large
aggregate power feeding requirements when supporting two XDM
platforms.
NOTE: Users who prefer to work with a single power cable from

their main power supply (and optionally, a single power cable from
the protective power supply) can still work with a single cable if they
either:
 Work with a single 25 mm2 power cable to support a single XDM
platform only, with a maximum of 2250 W for that platform.
 Work with a single 25 mm power cable to support two XDM
2
platforms, where each platform is limited to a maximum of

1100 W for per platform. This configuration option requires the
use of an optional metal bridge component designed by ECI
Telecom for this purpose. (Note that this configuration option is
only available from V7.2, when the management software enforces
limitations on maximum power consumption.)
 Work with a single 50 mm power cable to support two XDM
2
platforms, with a maximum of 2250 W for each platform. This

configuration option requires the use of an optional metal bridge
component designed by ECI Telecom for this purpose.
For more information about the bridge-component configuration
options, see Connecting DC Input Power Cable to the xRAP-D with a
Bridge Component.
The nominal DC power voltage is -48 VDC, ranging to -72 VDC. The
internal circuits of the xRAP-D are powered whenever at least one power
source is connected. The presence of DC power within the xRAP-D is
indicated by a POWER ON indicator.
Each DC power circuit of each platform is protected by a circuit breaker
that also serves as a power on/off switch for the corresponding circuit. The
required circuit breakers are included in the installation parts kit supplied
with the XDM-100 Product Line shelves, and therefore their current rating
is in accordance with the order requirements.

Manual
The circuit breakers are installed during the xRAP-D installation. To

prevent accidental changing of a circuit breaker’s state, the circuit breakers
can be reached easily after opening the front cover of the xRAP-D. The
circuit breaker state (ON or OFF) can be seen through translucent covers.
 Bay alarm indications. The xRAP-D includes four alarm indicators, one
simultaneously, the corresponding alarm indications light simultaneously.
A buzzer is activated whenever a Critical alarm is present in XDM
platforms connected to the xRAP-D.
 Connecting external alarms from two XDM platforms, each platform
supporting up to four alarm inputs and four alarm outputs (via dry contacts)
to the customer's central alarm monitoring system. Customers who wish to
define external alarms should refer to the explanation of electrical capacity
requirements for external alarms in the XDM System Specification.
Note that the xRAP-D supports up to eight external alarms. These alarms
are by default allocated four to each platform. ECI Telecom offers the
option, when working with a single XDM-50 platform, to define up to eight
external alarms for that XDM-50 platform. A second XDM platform cannot
be used with the xRAP-D when working with this configuration, and a
special alarm connection cable must be used. Contact ECI Telecom
technical support for more information.
 Exporting severity alarms. Two separate groups of severity alarms (a
group of four for each XDM platform) are provided via dry contacts for the
customer's central alarm monitoring system.

 Exporting Critical buzzer signals. The Critical alarm signal is provided
via dry contacts to the customer's central alarm monitoring system for
activation of a Critical buzzer. A separate line is provided as well for
muting this buzzer, by connecting the line to a ground with a momentary
switch.
NOTE: Note that the xRAP-D supports the same alarm and

power functions as the xRAP-B and xRAP-HP. When
replacing an existing xRAP-HP with an xRAP-D you must
also use the appropriate xRAP-D accessory kit, including
cables.

Manual
The following figure shows the front panel of the xRAP-D, and the table lists
numbers.
Figure 10-4: xRAP-D front p anel
Table 10-3: xRAP-D fron t panel component fun ctio ns

1 SOURCE A Translucent cover for the two circuit breakers (designated
Shelf 1 and Shelf 2 – one per XDM platform installed in
the rack). These circuit breakers are used as ON/OFF
power switches and overcurrent protection for the DC
power source A.
2 TEST Pushbutton, pressing it activates the buzzer and turns the
indicators on for test purposes.
3 POWER ON Green indicator, lights whenever at least one DC power
source is connected to the xRAP-D.
4 CRITICAL Red indicator, lights when the severity of an
unacknowledged alarm in the platforms connected to the
xRAP-D is Critical.
5 MAJOR Orange indicator, lights when the severity of an
xRAP-D is Major.
6 MINOR Yellow indicator, lights when the severity of an
xRAP-D is Minor.
7 WARNING White indicator, lights when the severity of an
xRAP-D is Warning.
8 Buzzer Operates when at least one unacknowledged Major or
(concealed under Critical alarm is present in the platforms connected to the
cover) xRAP-D.

Manual
The xRAP-D connectors are located on the circuit board, as shown in the
the table correspond to those in the figures.
Figure 10-5: xRAP-D connectors
Table 10-4: xRAP-D conn ector funct ions

1, 2 Shelf 1 and Shelf 2 Two 5-pin D-type connectors, designated Shelf 1
DC input power and Shelf 2, used to connect DC power to the
XDM platforms.
3 ALARMS 68-pin SCSI connector, used to connect an alarm
cable to the customer alarm monitoring system.
This alarm cable transmits the received from the
XDM platforms by the SHELF 1 and SHELF 2
connectors, including external alarm inputs,
external alarm outputs, and XDM severity alarms.
4, 5 SHELF 1 and Two 36-pin SCSI connectors, designated SHELF 1
SHELF 2 and SHELF 2, used to connect alarm cables to the
XDM platforms installed in the rack. These cables
transmit alarms from the XDM platform to the
xRAP unit.
Alarm signals arrive at a SHELF connector on the xRAP unit from two
different connector sources on the XDM platform using a Y-Cable.
 A 9-pin connector on the XDM platform labeled xRAP is used for the four
XDM severity alarms. (CRITICAL, MAJOR, MINOR, and WARNING)
 A 50-pin connector on the XDM platform labeled ALARMS is used for
any external alarms defined by client request.

Manual
A Y-Cable is used to link these two connector sources to the single SHELF
connection point on the xRAP, as illustrated in the following figure.
Figure 10-6: Y-cable connecti on
The xRAP-D supports up to eight input plus eight output external alarms.
These alarms are by default allocated four to each platform. ECI Telecom
offers the option, when working with a single XDM-50 platform, to define up
to eight external input plus eight external output alarms for that XDM-50
platform. When working with this configuration, a second XDM platform
cannot be connected to the xRAP-D and a special double-Y alarm
connection cable must be used, as illustrated in the following figure. Contact

ECI Telecom technical support for more information.
Figure 10-7: Double-Y cable connection

Manual
RAP-BG
The RAP-BG is a DC power distribution panel for BG platforms installed in
racks. It distributes power for up to four 9300 platforms installed on the same
rack. The nominal DC power voltage is -48 VDC, -60 VDC, or 24 VDC. Since
9200 series platforms can use redundant power sources, the RAP-BG supports
connection to two separate DC power circuits.
Each DC power circuit of each platform is protected by a circuit breaker, which
also serves as a power ON/OFF switch for the corresponding circuit. The
required circuit breakers are included in the installation parts kit supplied with
the 9300 platforms, and therefore their current rating is in accordance with the
order requirements. The maximum current that can be supplied to a platform
fed from the RAP-BG is 16A.
The circuit breakers are installed during the RAP-BG installation. To prevent
accidental changing of a circuit breaker state, the circuit breakers can be
reached only after opening the front cover of the RAP-BG. The circuit breaker
state (ON or OFF) can be seen through translucent covers.
The following figure shows the front panel of the RAP-BG, and the table lists
the functions of the front panel components as indicated by the figure callouts.
Figure 10-8: RAP-BG front panel
Table 10-5: RAP-BG fron t panel compo nent funct ion s

1 SOURCE A Translucent cover for the four circuit breakers (Shelf 1, Shelf
2, Shelf 3, Shelf 4 - one per BG/XDM platform installed in
the rack). These circuit breakers are used as ON/OFF power
switches and overcurrent protection for the DC power source
A.

Manual
RAP-4B
The RAP-4B is a power distribution and alarm panel for ECI Telecom
platforms installed in racks.
NOTE: The RAP-4B supports operation with BG, XDM

(100, 300, 900), and 9600 series platforms.
The RAP-4B performs the following main functions:

 Power distribution for up to four protected platforms installed on the
same rack. The nominal DC power voltage is 48 VDC or 60 VDC. Since
the supported platforms can use redundant power sources, the RAP-4B
supports connection to two separate DC power circuits.
Each DC power circuit of each platform is protected by a circuit breaker,
which also serves as a power on/off switch for the corresponding circuit.
The required circuit breakers are included in the installation parts kit
supplied with the platforms, and therefore their current rating is in
accordance with the order requirements. The CB rating installed in the
RAP-4B for feeding a single platform is max. 35 A. The total power that
can be provided by the RAP-4B is max. 4 x 1.1 kW (4.4 kW).
NOTE: The maximum power that can be supplied by the

RAP-4B to a single platform is not more than 1.1 kW.
The circuit breakers are installed during the RAP-4B installation. To

prevent accidentally changing a circuit breaker state, the circuit breakers
can be reached only after removing the RAP-4B front cover. The circuit
breaker state (ON/OFF) can be seen through translucent covers.
 Bay alarm indications: The RAP-4B includes three alarm indicators, one
simultaneously, the different alarm indications light simultaneously.
NOTE: BG platforms support only two alarm indications,

Major and Minor.
A buzzer is activated whenever a Major or Critical alarm is present in an

XDM platform or a Major alarm in a BG or 9600 series platform connected
to the RAP-4B.
 Connection of alarms from up to four platforms, with max. four alarm
inputs and two alarm outputs.

Manual
The following figure shows the front panel of the RAP-4B, and the table lists
numbers.
Figure 10-9: RAP-4B fr ont panel
Table 10-6: RAP-4B front panel component fun ctio ns

1 SOURCE A Four circuit breakers (designated PLATFORM 1,
PLATFORM 2, PLATFORM 3, and PLATFORM 4 – one per
platform installed in the rack). These circuit breakers are used
as ON/OFF power switches and overcurrent protection for the
DC power source A.
--- Buzzer Operates when at least one unacknowledged Major or Critical

(concealed alarm is present in the platform connected to the RAP-4B.
under cover)
2 TEST Pushbutton. Press to activate the buzzer and turn the
indicators on for test purposes.
3 POWER Green indicator; lights when at least one DC power source is
connected to the RAP-4B.
4 CRITICAL Red indicator; lights when the severity of at least one of the
alarms in the platform connected to the RAP-4B is Critical.
5 MAJOR Orange indicator; lights when the severity of at least one of
the alarms in the platform connected to the RAP-4B is Major.
6 MINOR Yellow indicator; lights when the severity of at least one of
the alarms in the platform connected to the RAP-4B is Minor.
The RAP-4B alarm connectors are located on its circuit board, as shown in the
the table correspond to those in the figure.

Manual
Figure 10-10: RAP-4B alarm co nnecto rs
Table 10-7: RAP-4B connector fun ctio ns

1, 2, 3, 4 Platform alarms Four 36-pin SCSI connectors designated
PLATFORM 1, PLATFORM 2, PLATFORM 3,
and PLATFORM 4, for connecting alarm
input/output lines from the platforms to the RAP-
4B.
5 ALARM IN/OUT 68-pin SCSI connector, for connecting alarm
input lines from the customer's equipment to the
platforms, and alarm output lines from the
platforms to the customer alarm monitoring
facility.

Manual
xDDF-21 Patch Panel for

Unbalanced Electrical
Connections
When the user has unbalanced 75 Ω interfaces, the optional xDDF-21 patch
panel enables connection and conversion of these interfaces to the balanced
120 Ω interfaces of the PIM2_21, PIM2_63/B, or PIM2_63S used in the XDM-
100 Product Line shelf.
The xDDF-21 is 1U high and can be installed in ETSI A and ETSI B racks, as
well as in 19” racks. It has a capacity of 21 E1 lines. A separate xDDF-21 is
therefor required for each PIM2_21, or three such units for each PIM2_63/B, or
PIM2_63S used in the XDM-100 Product Line shelf.
The following figure shows a general view of the patch panel. The channel
numbers of the various connectors are marked on the patch panel, and the
inside of the cover contains a label for cable identification, as illustrated in
Label inside xDDF-21 patch panel door (page 10-50). The customer’s cables
are connected to the connectors inside the patch panel, while the cables leading
from the PIM2_21, PIM2_63/B, or PIM2_63S are connected to the SCSI
connectors at the rear of the xDDF-21. A special split cable is available to
convert the output from the PIM2_21, PIM2_63/B, or PIM2_63S to SCSI
connector pairs at the back of the xDDF-21.
The xDDF-21
connection cancustomer’s
to the be suppliedtraffic
with BT43,
cables.DIN1.6/5.6, or BNC connectors for
Figure 10-11: xDDF-21 patch panel fo r un balanced E1 interfaces
Figure 10-12: Label i nsid e xDDF-21 patch p anel door

Manual
Fiber Storage Tray (FST)

When optical modules are used, the XDM can be supplied with an FST where a
length of surplus optical fiber is stored to enable hot module replacement
without disconnecting fibers from other modules in the shelf. The FST can hold
up to 48 fibers, where the fiber size is 3 m x 2 mm (10 ft. x 0.08 in.).
The FST can be opened in two positions:
 Halfway (first click when pulling the tray out)
 Completely (to enable threading of the fibers in the tray)
Figure 10-13: FST top view

Manual
Optical Distribution Frame

When there are a large number of optical fibers connected to an XDM,
additional connection arrangements may be required.
ECI Telecom recommends using an ODF installed in the XDM racks to
terminate the external fibers with the proper optical connectors.
The ODF provides a flexible and reliable solution for interfacing between
outside plant optical fiber cables and fiber optical terminal equipment. It is
designed to handle termination, splicing, and storage for excess length of
pigtails and patch cords.
The unit is 1U high, and can be installed in ETSI A racks, as well as in 19"
racks using its configurable rack mounting brackets. An additional set of
brackets supplied with the installation kit enables installation in 23 in. 7 ft. bay
racks. The ODF is available with 12 or 24 ports, and SC, FC, or LC connectors.
Figure 10-14: ODF internal view

Manual
All fiber connections are made on a swing-out tray that opens to the right at 90°
and houses the splicing trays, optical adapter panels, and the fiber support. Left
side tray opening is available per order. The swing-out tray enables quick and
easy access to all internal parts for connection or maintenance activities. The
fiber connections are protected by a front cover, which latches to the assembly
and prevents unintended disconnection of fibers.
Figure 10-15: ODF front panel
Optical terminal fibers can enter the ODF from the right or left side and be
connected to the optical adapters from one side. Pigtails connect to the adapters
from the other side. Excess length of pigtails and patch cords are threaded on a
fiber support that maintains the minimum bend radius to prevent fiber breaks.
A durable and robust tube leads the external fibers cable to the swing-out tray
and protects them from breaks. The adapters are arranged on panels in groups
of four or two (depending on the total number of ports). A large space between
the adapters enables easy access to each individual fiber and quick
reconfiguration.

Manual
Optical Patch Panel

When a large number of equipment optical ports have to be connected to the
optical network and splicing to external fibers (as in the ODF) is not required,
ECI Telecom recommends the use of the Optical Patch Panel (OPP).
The OPP is designed for terminating and distributing optical fibers, and can
work as a cross connection and testing point between the optical network and
the equipment. It provides a quick and flexible solution for cable management.
The OPP is 1U high. It can be installed in 23 in. 7 ft. bay, ETSI, and 19 in.
racks using its configurable rack mounting brackets. The OPP is available with
12 or 24 ports, and SC, LC, and FC connectors.
All connections are made on the internal connector panel, which
accommodates duplex connectors. This prevents unintended disconnection of
fibers and supports the connection reliability. The optical fibers are connected
to the connectors from both sides. The fibers enter the OPP from the left or
right side and are threaded on special supports that maintain the minimum bend
radius to prevent fiber breaks.
A two-position moving tray provides easy access to the fibers for management
or maintenance purposes.
Figure 10-16: OPP top view

Manual
Cable Guiding Accessories

Different accessories are available for guiding cables and fibers in rack
installations.
Cable Guide Frame

The cable guide frame for the XDM-50, XDM-100, XDM-300, and
XDM-900 is used to obtain a tidy route of electrical interface cables connecting
to the panels of modules (or to the panels of the TPMs in I/O protected
installations).
The unit is fastened to the rack side rails just above the top of the XDM-50,
XDM-100, XDM-300, or XDM-900 shelves.
In case an XDM-300 or XDM-900 is installed, an additional cable guide is
attached under the shelf to handle cables connected to modules in the lower
module cage (or to TPMs in the lower TPU in protected installations).
Figure 10-17: Cable gu ide
Fiber Guide for ETSI A Racks

The fiber guide helps neatly route fibers in ETSI A racks. The guide also helps
to keep the recommended bend radius of the routed fibers.
Figure 10-18: Fiber g uide f or ETSI A racks

Manual
PIM2_63S Traffic Cable Box Tray

The special Traffic Cable for PIM2_63S (page 6-11) includes a cable-size
conversion box. ECI Telecom offers a tray to accommodate this box and
facilitate a tidy installation of the cables.
The PIM2_63S traffic cable box tray is available in two options:
 For installation above the shelf that accommodates the PIM2_63S in its
upper I/O slots (XDM-300 and XDM-900) or in XDM-100
 For installation under the shelf that accommodates the PIM2_63S in its
lower I/O slots (XDM-300 and XDM-900)
The box tray is supplied by default with reversible brackets for installation in
ETSI racks. Installation in 19" racks is supported by removing the brackets,
reversing their position, and installing them back. Brackets for installation in
23" racks are also available per order.
Figure 10-19: PIM2_63S traffic cabl e box tray for abo ve shelf inst allation s

Manual
Figure 10-20: PIM2_63S traffic cable box tray for under shelf installations
The box tray has four positions for accommodating the cable boxes, two in
each position and up to eight in total. The boxes are held by grooves on their
body that match corresponding support guides in the tray. The tray features a
cable guide that helps keep the path of the cable in the short rout between the
module on the shelf and the box. Holes on the cable guide, in front of each
cable box position, are used to insert cable ties that enable to fasten the cables
to the tray. The tray also has special grooves for inserting Velcro strips that can
also help (if necessary) to fasten the cables. The means used to fasten the
cables ensure smooth closure of the rack's door.
Cable Slack Tray

The cable slack tray is used to help keep the surplus of cables running under
the XDM-300 shelf organized.
The cable slack tray is used only in horizontal XDM-300 or XDM-900 shelf
installations.
Figure 10-21: Cable slack tray

Manual
Cables
The XDM-100 Product Line is supplied with a number of cables as described
Table 10-8: XDM-100 cabl es
Cable type Descriptio n Interconnect Length

SCSI 50-pin x 2-21 E1 cable PIM2_21 or PIM2_63/B From 5 m to 100 m
E1 to DDF
VHDCI 272-pin 63 E1 cable PIM2_63S From 5 m to 100 m
E1 to DDF
DIN1.0/2.3 to Single coax PIM345 to DDF From 5 m to 60 m
DIN1.0/2.3 cable SIM/SAM1_4 to DDF
(electrical interfaces)
LC to LC fiber Single fiber All optical interfaces to ODF From 0.5 m to
patch cord 10 m
RJ45 to RJ45 SFTP EISMB, DIOM, MCSM to From 0.5 m to 5 m
DDF
RJ45 to RJ45 SFTP ECU or ECU300 to ACP100 Jumpers
RJ45 to RJ45 SFTP ACP100 to NE From 0.5 m to 5 m
Power-3W3 Power cable XDM-100 Product Line 2 m and 2.7 m
(MXC) to xRAP/xRAP-100
Alarm to xRAP-100 Alarm signals ECU to xRAP/xRAP-100 2 m and 3 m
Alarm to client Alarm signals ECU to client connection 15 m, 35 m, and
panel 45 m
F-Channel Local ECU to notebook or PC 3m
connection of
the LCT-XDM
T3/T4 (Timing) Timing ECU to DDF 3m
input/output
Exp. Management Ethernet hub ECU to other NE 2m
Main Management Ethernet port From EMS to ECU or from 3m
ECU to other NE
SCSI 50 to SCSI E1 IOP PIM2_21 to TPU Jumpers
100
Triple twins of E1 IOP PIM2_63/B to TPU Jumpers
SCSI 50-pin to two
VHDCI 136-pin
Triple twins of E1 IOP PIM2_63S to TPU Jumpers
SCSI 50-pin to
VHDCI 272-pin
8W8 to 6/8 x single High rate IOP PIM345_3 to TPU or Jumpers
coaxial cable SIM1_4/E to TPU
11
XDM Protection and
Restoration Mechanisms
In this chapter:
Overview ....................................................................................................... 11-1
ASON Protection and Restoration Capabilities ............................................. 11-2
MPLS Protection Schemes ............................................................................ 11-6
Ethernet PB Features ................................................................................... 11-11
Fast IOP: 1:1 Card Protection ...................................................................... 11-13
SDH Protection Schemes ............................................................................. 11-14
SDH Line Protection ................................................................................... 11-19
Equipment Protection .................................................................................. 11-22
Integrated Protection for I/O Cards with Electrical Interfaces .................... 11-22
Overview
The XDM provides a comprehensive set of protection and restoration
mechanisms that supply complete overall protection for every aspect of your
network configuration. The XDM supports protection for all types of networks
based on the complete range of technologies. Protection mechanisms are
provided through the XDM's ASON capabilities, as well as a complete set of
MPLS and Ethernet traffic protection schemes and fast IOP (1:1 card
protection). The XDM supports full SDH path and line protection, optical layer
protection, equipment protection, and integrated protection for I/O cards with
electrical interfaces. These various protection capabilities are introduced in this
chapter.
XDM Protection and Restoration XDM-100 Product Line Reference

Mechanisms Manual
ASON Protection and

Restoration Capabilities
The unique value proposition of ASON for carriers is the ability to improve
existing network resiliency by introducing the well-known restoration approach
of IP networks. With restoration, the network itself monitors services and
restores them in the event of failure. Service re-establishment in case of failure
has been a key feature of SDH-based transmission networks, which offer
service protection in less than 50 msec. SDH technology defines various shared
and dedicated protection schemes. Over the years, these protection schemes
have proven to be highly reliable. They have achieved multivendor
interoperability and have paved the way to SDH technology becoming the most
reliable transmission technology available.

The high reliability of SDH is achieved through the allocation of networking
assets for protection. Linear protection schemes, such as MSP 1+1, use a
dedicated standby line. MS-SPRing uses 50% of the ring capacity for
protection. Path protection, which is suitable for mesh topologies, uses 50% of
the overall network bandwidth by duplicating all traffic at its origin.
Adding ASON to SDH-based networks brings added benefits without affecting
the already superior performance of SDH today. With ASON, the control plane
is capable of restoring services in case of multiple failures in the network.
Furthermore, network capacity is utilized more efficiently by sharing protection
resources.
XDM architecture supports differentiated CoS. Supporting a range of
protection schemes allows network planners to balance protection switching
time and dedicated resources. For mission-critical services, the XDM provides
distributed restoration mechanisms with 50 msec service recovery and
dedicated protection. For less critical services, distributed shared mesh
restoration schemes can be implemented. For efficient use of installed
resources, pre-emptible services can be established using the protecting
resources.
XDM-100 Product Line Reference XDM Protection and Restoration

Manual Mechanisms
Multiple Protection Schemes

The XDM control plane supports the coexistence of multiple protection and
restoration schemes. New restoration schemes and combined
protection/restoration solutions are offered, as follows:
 1++ (Gold): Similar to path protection with SNCP, where a failed path is
restored by the control plane to prepare for the next possible failure. A sub-
50 msec restoration time is kept for any number of failures, as long as a
restoration path is found for the failed connection. This is an extension of
the traditional 1+1 path protection, where failure in the main or protection
path results in the restoration of the failed path. Restoration is in addition to
protection at the SDH layer, which continues to be performed in less than
50 msec. Note that this protection scheme consumes the most bandwidth as
traffic is duplicated at all times.
Figure 11-1: 1++ protectio n

Mechanisms Manual
 1+R (Bronze): Reroute restoration (1+R). Dynamic restoration enables

shared protection with prioritization. This protection scheme is an
extension of unprotected trails, where failure in the path results in

restoration of the trail in a new path. The unused traffic may be used for
low priority traffic at all times.
In a variation of 1+R, preplanned shared protection enables shared
protection with prioritization. Preplanned priority reacts faster than
dynamic restoration as the processing time is performed in advance.
Figure 11-2: 1+R protectio n

Manual Mechanisms
 1+1+R (Silver): This hybrid protection scheme offers an efficient

combination of 1+1 protection for a first failure, followed by 1+R
protection for a subsequent failure.

 Preemptive (Iron): Preemption of bandwidth requirements enables more
efficient use of ASON reserved bandwidth by adding best effort services to
available resources. Best effort services can use ASON-reserved shared
resources when they are not required for use by ASON. With preemption,
ASON can discard the best effort services dynamically, releasing the
ASON-reserved shared resources for use in restoration in the event of a
failure.
 1+1 path protection: Standard SNCP protection. If protection trail fails,
service ends.
 Unprotected: No protection.
Path Computation
The XDM's ASON implementation supports intelligent path computation
mechanisms, both at provisioning and at restoration.
 When main and protection paths are initially provisioned, LightSoft ensures
that the links selected for the main trail and the links selected for the
protection trail are not members of the same SRLG, thereby improving
system robustness.
 When defining restoration paths, ASON utilizes a Constrained Shortest
Path First (CSPF) path computation algorithm that selects disjoint paths
based on considerations such as number of hops, fiber distance, and link
cost (TE metric). The relative importance of each of these factors can be
tailored to specific network requirements. Different routing constraint
weights may lead to different service path calculations, depending on the
context.

Mechanisms Manual
MPLS Protection Schemes

Comprehensive MPLS Network Protection
The following figure illustrates an XDM MPLS network that incorporates an
E2E combination of protection schemes to provide optimal protection at every
point. These include sub-50 msec FRR link and node protection, Dual-Homing,
and LAG, described in the following sections, as well as Fast IOP: 1:1 Card
Protection (page 11-13).
Figure 11-3: Comprehensive protection
Facility Backup FRR

Robust networks must protect tunnels against failure of a link or node along the
tunnel path. MPLS supports a protection mechanism called Facility Backup
FRR. FRR protects against link or node failure along a tunnel path through the
use of bypass tunnels.
With FRR, a backup LSP called bypass tunnel is pre-established by the NMS
to bypass a network link or node failure to a downstream node where the
alternative path merges with the path of the protected tunnel. Switching to a
bypass tunnel requires pushing a third MPLS tag called an FRR label into the
packet. The FRR label remains in the packet until the bypass tunnel merges
with the path of the protected tunnel, where it is removed (label pop) off the
packet. The primary advantage of FRR over other protection schemes is the
speed of repair. Due to the pre-establishment of the bypass tunnels and the fast
physical layer-based failure detection, FRR can provide sub-50 msec switching
time for both link and node protection, comparable to SDH protection
mechanisms.

Manual Mechanisms
FRR for P2MP Tunnels

With facility backup FRR link protection for a P2MP tunnel, the node
upstream from the failed link redirects the traffic through a bypass tunnel
whose destination is the NH. The bypass tunnel is an ordinary P2P bypass
tunnel that may be shared by both P2P and P2MP tunnels. As with FRR for a
P2P tunnel, an FRR label is pushed to the packets before they are directed to
the bypass tunnel. The FRR label remains until the bypass tunnel path merges
with the protected tunnel, where the label is removed.
When multiple subtunnels share a bypass tunnel, the data plane forwards only
one copy of the packet to that tunnel.
The following figure illustrates a P2MP tunnel that flows from P1 to P2, where
it branches towards destination PEs (PE3 and PE4). If P1 detects that the link
to P2 has failed, it switches the traffic to the bypass tunnel. When the rerouted
traffic merges at P2, the FRR label is removed.
Figure 11-4: P2MP link p rotecti on example
With facility backup FRR node protection for a P2MP tunnel, the node
upstream from the failure redirects the traffic through a bypass tunnel that
merges with the original P2MP tree at the NNH node. If the NH is a P2MP
branching point to N links, N bypass tunnels are required for complete
protection.

Mechanisms Manual
The following figure illustrates a P2MP tunnel that flows from P1 to P2, where
the tunnel branches towards destinations PE3 and PE4. If the P2 branching
point fails, P1 switches all traffic meant for PE3 to go through bypass tunnel 1
to PE3. P1 also switches all traffic meant for PE4 to go through bypass tunnel 2
to PE4.
Figure 11-5: P2MP node p rotecti on exampl e
Additional FRR Capabilities

With Facility Backup FRR, multiple protected tunnels share a bypass tunnel
through the addition of an FRR label. Facility Backup FRR is scalable in terms
of the number of bypass tunnels.
MCS supports Shared Protection BW (multiple bypass tunnels sharing
bandwidth), thereby enabling support of SRLGs.
SRLGs refer to situations where links or nodes in a network share a common
physical attribute, such as fiber duct. If a link or node fails, other links and
nodes in the group may fail too. Links and nodes in the group are said to have a
shared risk or shared fate.
By default, bypass tunnel path selections must avoid links/nodes in the same
SRLG as the link/node they are protecting. Otherwise, if that link or node fails,
the other SRLG members may fail too.
MCS further supports BE Protection and BW Protection per CoS. With BE
protection, a bypass tunnel can protect an unlimited number of tunnels, while in
BW protection, the bandwidth sum of the tunnels protected by a bypass tunnel
cannot exceed its bandwidth.

Manual Mechanisms
MCS also provides a set of FRR timers. To avoid switching to protection

while the underlying physical layer protection is also switching (for example,
with SDH MS-SPRing or SNCP), FRR switching may optionally be delayed

through Hold-Off time (configurable per port). Similarly, to prevent FRR
switching too frequently, the switch back from the bypass tunnel to the
protected tunnel after a failure is repaired may be delayed through a per-port
configurable Wait-to-Restore (WTR) time.
FRR switching from protected to bypass tunnels can be applied automatically
upon failure or forced. Similarly, FRR reversion from bypass to protected
tunnels can be applied automatically when the failure is resolved or forced.
Dual-Homed Device Protection in H-VPLS

Networks
MCS data cards support dual-homed device protection for H-VPLS networks.
Dual-homed protection for H-VPLS networks enables dual homing for multiple
access rings connected to a core ring. Typical configurations include full mesh
within each access ring and spokes reaching from each ring towards gateway
nodes in the core ring. The access rings may be either open or closed.
Redundant connectivity is enabled through use of ERP (see Ethernet Ring
Protection) in the access gateway nodes. Configuring ERP between the two
local MCS gateways prevents creation of loops in the network.
Figure 11-6: H-VPLS with dual hom ing f or access ring s

Mechanisms Manual
Link Aggregation
Ethernet LAG protection is based on standard Ethernet link aggregation
schemes (IEEE 802.3ad). LAG is available for both Ethernet and EoS WAN
ports. In LAG protection schemes, a single logical link is composed of up to
eight physical links. When one (or more) physical link fails, it is simply
removed until recovered. The network continues to function correctly without
the failed link, since the links for the LAG group as a whole are still
functioning.
Network operators can configure a LAG Link Down threshold, defining up to
how many links can go down and the whole LAG group still considered
operational, and at what point a LAG group is considered to have failed even if
there are still a few links functional.
MCS cards support LAG based on either IP or MAC address hashing,

depending on the packet header data. This capability enables superior load
balancing and enhanced IP traffic management efficiency.
The following figure illustrates the LAG approach. Two variations are
displayed, one for Ethernet ports and one for EoS WAN ports.
Figure 11-7: LAG scenario
Link members are added and removed through the NMS.

Manual Mechanisms
Ethernet PB Features
RSTP Protection
Ethernet traffic protection is usually implemented as a combination of SDH
protection schemes and RSTP-based restoration. SDH protection schemes are
used to protect each individual EoS trail, connecting every two EoS (WAN)
ports on any data card.
RSTP, initially used for loop resolution purposes on PB networks, may also
provide a means of protection in case of link failure (such as fiber cut) and NE
failure (such as data card failure). Although RSTP convergence time is much
shorter than STP, it is still slower than SDH protection. For that reason, RSTP
may be used as a “second line of defense”, restoring services in case of card
failure, while relying on the SDH sub-50 msec protection as the “first line of
defense”, providing much faster protection in the more likely event of fiber
failures. MCS RSTP can also be used in case of pure Ethernet PB access
networks interconnected by XDM platforms.
XDM platforms offer complete RSTP 802.1D-2004 compliance and
interoperability, supporting RSTP on UNI, I-NNI, and E-NNI ports. XDM
platforms also provide the ability to close access RSTP rings over MPLS
networks. This is accomplished through the MCS cards, which are able to both
participate in the access RSTP ring and also forward the BPDUs over the
relevant MPLS networks.
XDM platforms provide intelligent efficient responses to RSTP ring topology
changes through the use of CCN messages, which enable flushing of remote
PEs on the core MPLS network as a result of topology changes in the remote
access RSTP rings.
Bandwidth Scaling Protection for Ethernet

Traffic
The XDM enables GbE traffic processed by the data cards to be scaled to
accommodate traffic conditions (for example, a link failure). This provides
protection similar to that provided by the LCAS protocol. The data cards
automatically decrease the capacity of the Ethernet link if one or more of the
VC-4s fails. The capacity automatically increases after the network fault is
repaired.
The same protection method is applicable to traffic processed by the data cards.
The granularity of the protection method depends on the type of SDH container
(VC-3s or VC-4s) in use.

Mechanisms Manual
Ethernet Ring Protection (ERP) G.8032

Ethernet Ring Protection Switching (ERPS) is an enhanced protection
mechanism for Ethernet networks, defined by ITU-T G.8032 standard. It
supports improved resiliency, manageability, and reliability of metro Ethernet
networks, offering switching to protection time in less than 50 msec. The
standard has the ability to protect against both link and equipment faults.
Each node in the ring protection network has two ring ports (East and West)
and a number of local ports. One link in the ring is designated as the Ring
Protection Link (RPL) and used only for redundancy. One node, connected to
the RPL, is selected as the RPL owner, and is responsible to block traffic on the
RPL in normal operation (idle state) and unblock it when a failure is detected
(protection state).
When a failure is detected, the nodes adjacent to the failure block the failed
link and report this failure to the ring, using a R-APS Signal Failure (SF)
message. The message triggers the RPL owner to unblock the RPL and all
nodes to perform FDB flushing. The ring is now in protection state.
Figure 11-8: Ethernet ring protection

Mechanisms Manual
SDH Protection Schemes

SDH path protection schemes are used to protect each individual EoS trail,
connecting every two EoS (WAN) ports on any data card. These schemes range
from unprotected trails, which use the minimum amount of traffic, through
SNCP for 1+1 protection, and up to MS-SPRing, which is the most effective
means of ring protection. The XDM features proven redundancy mechanisms
to ensure the complete integrity of all traffic transfers. System protection
schemes offer highly reliable trail protection arrangements and equipment
duplication on all units. The platform supports protection schemes at the line
and service levels.
The XDM provides complete protection for internal traffic paths. All traffic is
fully redundant within the shelf, and is routed via separate traffic paths and
hardware units. In case of equipment or line failure, traffic protection switching
takes place within 8-12 msec.
The XDM supports mesh and ring traffic protection and restoration. The
restoration mechanism ensures traffic rerouting in the event of a major
contingency. Telecom operators may define their own major contingencies
based on individual operating parameters. Traffic restoration time is generally
dependent on network complexity and traffic load.
For more information about the traffic restoration feature, see the LightSoft
User Manual and the EMS-XDM User Manual.
SNCP
The XDM features path protection over mesh and SubNetwork Connection
Protection (SNCP). SNCP provides independent trail protection for individual
subnetworks connected to the XDM, thus enhancing reliability against multiple
failures. When implemented in dual-node interconnections, SNCP, combined
with the drop-and-continue capability of the XDM, is even more powerful
against multifailure conditions in mesh topologies. By integrating SNCP into
the XDM, operators achieve superior traffic availability figures. SNCP is
therefore extremely important for leased lines or other traffic requiring superior
SLA availability.
SNCP switching functions automatically in the XDM without operator

intervention or path redefinition. The result is an exceptionally fast protection
switching time of less than 30 msec, with typical switching time taking only a
few milliseconds. Protection switching is performed in a distributed way in the
service cards.

Manual Mechanisms
A major SNCP advantage is its flexibility. SNCP is topology-independent and

can be implemented in ring, chain, star, mesh, and hybrid topologies. It can be
implemented with platforms from other vendors, enabling the creation of a ring
where traffic originating from other ADMs is fully protected.
Leased lines are provided through single-link connections. In the event of
failure, leased-line traffic is protected by SNCP switching at the service
termination point.
In typical multi-ring or mesh networks, the SNCP drop-and-continue
functionality provides better traffic reliability and link redundancy in the event
of a site failure. In these networks, four ADMs are typically required to enable
this functionality (see the following figure showing only one direction).
Figure 11-10: Typic al SNCP-protected netw ork si tes

Mechanisms Manual
Having the XDM function as a multi-ADM enables the number of elements to

be reduced to just two (one per site). This results in better service availability
and reliability, as well as a reduction in floor space and equipment costs (see
the following figure).
Figure 11-11: SNCP-protected XDM sit es

Manual Mechanisms
The XDM supports SNCP at all STM-n levels (STM-1 to STM-64) and for all
VC objects, as follows:
 Any VC-4 in any STM-n
 Any VC-4nc in any STM-n
 Any VC-3 in any VC-4 in any STM-n
 Any VC-12 in any VC-4 in any STM-n
The XDM supports the following SNCP types:
 SNCP/I – SNC protection switching due to TU-AIS, AU-AIS, TU-LOP, or
AU-LOP events
 SNCP/N – SNC protection switching due to TU-AIS, AU-AIS, TU-LOP,
or AU-LOP events, and any other path overhead alarms (signal label
mismatch, path trace error, EBER)
The XDM enables users to set EBER thresholds for BER and Signal
Degradation (SD) conditions. The SNCP function is complemented by the user
option to set the hold-off time for switching (0-10 sec in 100 msec intervals)
and the WTR time (1-30 minutes), in accordance with applicable standards.
The EMS-XDM enables both automatic and manual switch-to-protection and
protection-lockout commands. When an automatic switch occurs, notification
is sent to the subnetwork management station. The status of the selectors and
the subnetwork connections is displayed in the EMS-XDM window.

Mechanisms Manual
Revertive SNCP
XDM platforms support revertive SNCP starting from V6.2 of the system.
When the system is protected by regular SNCP, it uses the protection path in
the event a failure is detected in the main path, and does not revert to the main
path even after it recovers. The protected path may incorporate links that are
more expensive and less reliable (for instance, leased lines).
Revertive SNCP is useful when the user has a preferred path for traffic and can
switch back to the main path after recovery. The user can now define the
operating mode as revertive or nonrevertive SNCP, giving him a higher degree
of flexibility.
The system provides several parameters to ensure that the failed (main) path is
stable and reliable before reverting to it after a fault condition. Most of these
are user-configured, including:
 Wait to Restore (WTR): The period of time after which a failed unit is
fault-free and can be considered as available again by the protection
processes.
 Wait to Switch (WTS): Factory-defined timer issued to prevent excessive
switching events in a nonstable condition. This timer disables switching to
protection path for X minutes if Y or more switches occurred in a period of
time of Z seconds.
 Hold-off time: Useful for interworking of protection schemes and
provisioned on an individual equipment basis. The failure condition is
monitored at the end of the hold-off time before switching to the protection
path.
 Switch time: Traffic switch operating as quickly as possible. The target
time is 50 msec.

Manual Mechanisms
SDH Line Protection

The XDM incorporates two independent MS protection mechanisms:
 Linear – Linear Multiplex Section Protection (MSP):Linear – Automatic
Protection Switch (APS):
 MSP 1+1 unidirectional
 MSP 1+1 bidirectional
 Ring – MS-SPRing
 Ring – BLSR
MSP
MSP is designed to protect single optical links. This protection is most suitable
for appendage TM/star links or for four-fiber links in chain topologies.
The XDM supports MSP in all optical line cards (STM-1, STM-4, STM-16,
and STM-64). MSP 1+1 unidirectional and bidirectional modes are supported.
MSP 1+1 is implemented between two SDH interfaces (working and
protection) of the same bitrate that communicate with two interfaces on another
platform. As with SNCP and path protection, in MSP mode the XDM provides
protection for both fiber and hardware faults.
The following figure shows a four-fiber star XDM with all links protected. This
ensures uninterrupted
automatically performsservice even in thewithin
MSP switching case of
50amsec.
double fault. The XDM
Figure 11-12: MSP protecti on mod es

Mechanisms Manual
MS-SPRing
In addition to SNCP protection that may also be implemented in mesh
topologies, the XDM supports MS-SPRing that provides bandwidth advantages
for selected ring-based traffic patterns.
Two-fiber MS-SPRing supports any 2.5 Gbps and/or 10 Gbps rings closed by
the XDM via SIM64_XFP, SAM_1/B, SIM16_4, and SIM16_1 cards, in
compliance with applicable ITU-T standards. This is fully automatic and
performed in less than 50 msec.
NOTES:
 In the XDM-100 product line, MS-SPRing is supported on
all STM-16 and STM-64 ports through the SAM16,
SIM16, and SIM64 card sets:
 SIM64_XFP
 SIM64_1
 SIM64_2
 SIM16_2
 SIM16_4
 SAM16_1B
 SAM16_1
 As explained in this section, MS-SPRing is a network
protocol that runs on the ring aggregate cards. The PDH,
STM-1, STM-4, and data cards (electrical and optical) that
serve as drop cards connected to the client are not part of
the MS-SPRing ring protocol. However, all client services
can be delivered via MS-SPRing on XDM networks
through the drop cards and the SDH aggregate cards that
create the MS-SPRing protection ring.
MS-SPRing can support low-order traffic arriving at the nodes in the same way
it does high-order traffic. LO traffic support on MS-SPRing is unique to XDM
as it is a genuine MSPP.
In MS-SPRing
capacity modes,
per MS. theofSTM-n
In case signal
a failure is divided
in one into
MS of the working
ring, and protection
the protection
capacity loops back the affected traffic at both ends of the faulty MS. The
XDM-100 Product Line supports the full squelching protocol to prevent traffic
misconnections in cases of failure at isolated nodes. Trails to be dropped at
such nodes are muted to prevent their being delivered to the wrong destination.
MS-SPRing is particularly beneficial in ring applications with uniform or
adjacent traffic patterns, as it offers significant capacity advantages compared
to other protection schemes.

Manual Mechanisms
The following figure shows an XDM in a two-fiber MS-SPRing. In this

configuration, two fibers are connected between each site. Each fiber delivers
50% of the active and 50% of the shared protection traffic. For example, in an
STM-16 ring, 8 VC-4s are active and 8 VC-4s are reserved for shared
protection.
In the event of a fiber cut between sites A and D, traffic is transported through
sites B and C on the black portion of the counterclockwise fiber. The switch in
traffic is triggered by the APS protocol that transmits control signals over the
K1 and K2 bytes in the fiber from site D to site A.
Figure 11-13: Two-fiber protection
Extra traffic capability is also supported, enabling users to use the protecting
VC-4s to carry extra traffic that is dropped in case of a failure in the protected
VC-4s. Thus, the total capacity of the ring is used, provided there are no
network failures. The extra traffic itself is, of course, not protected.
Non-preemptive Unprotected Traffic (NUT) is also supported. NUT refers to
unprotected traffic carried on channels with MS-SPRing MSP protection
switching mechanism that is disabled for certain working channels and their
corresponding protection. It allows the users to implement the MS-SPRing in a
smaller group of AU-4s enabling better BW efficiency. Traffic carried on these
channels is unprotected MS-SPRing and non-preemptive, but can be protected
using other protection schemes.

Mechanisms Manual
Dual-Node Interconnection with MS-SPRing
When
can be the workingvia
connected and protection
a dual fiber
link over pairs
two travel nodes.
different in separate
Thisducts, two
enables therings
network to overcome multiple failures like fiber cuts or node failures, so
improving traffic availability in the network.
Integration of LO SNCP and MS-SPRing

The XDM can simultaneously close MS-SPRing-protected metro-core rings
and SNCP-protected edge-access rings within the same NE. LO traffic can be
transported directly from multiple edge-access rings to the metro-core ring
transparently, without external XCs or mediation equipment. This reduces floor
space and costs, and improves site reliability.
Equipment Protection
The XDM's high-level reliability is achieved through comprehensive
equipment redundancy on all units (common units, traffic units, I/O cards, and
network connections). Automatic protection switching is initiated by a robust
internal BIT diagnostic system.
Common Unit
The XDM provides 1+1 and 1:1 protection of the power supply and FCU.
Traffic Unit (I/O Card)

The XDM provides 1: N (N = 1-3) protection to all PDH and SDH electrical
interfaces, and hardware protection to all SDH optical interfaces via a
simulation of two times MSP 1+1.
The XDM's robust architecture permits full 1:N protection for all bitrates in a
flexible manner and simultaneously for E1, E3, DS-3, and STM-1. In addition,
the shelf provides card protection flexibility, offering a range of protection slot
and ratio options. For example, up to 1:3 protection is available for the E1
tributaries, with the protection card in any available slot. For E3, DS-3, and
STM-1 bitrates. For more information about I/O card protection options, see
the XDM-50 Reference Manual.
Data cards also offer 1:1 hardware protection. By installing a backup data card,
all services and card functionalities are backed up on the standby card. Optical
interfaces are duplicated using splitter/coupler devices (Y-fibers or dedicated
splitter modules) and electrical interfaces are protected using an external
switch.

Manual Mechanisms
Integrated Protection for I/O

Cards with Electrical Interfaces
To provide protection for the traffic carried by I/O cards with electrical
interfaces, ECI Telecom offers electrical protection modules. Two steps are
required for using this feature:
1. Define one redundant I/O card of the same type as the cards to be protected
in one of the free slots.
2. Insert an electrical protection module in the corresponding TPU slot. This
module does not have any external ports.
The purpose of the protection module is to automatically replace a

malfunctioning I/O card with the redundant I/O card. When the protection is
activated, the protection module takes the external ports connected to the
electrical protection module of the malfunctioning I/O card, disconnects them
from that card, and connects them to the redundant card. In parallel, the MXC
card switches the traffic from the malfunctioning card slot to the protection slot
(the slot of the redundant I/O card).

Mechanisms Manual
12
Maintenance
In this chapter:
Overview ....................................................................................................... 12-1
Short MTTR .................................................................................................. 12-2
Built-In Test ................................................................................................... 12-3
Alarms System ............................................................................................... 12-4
Troubleshooting ............................................................................................. 12-5
Overview
The XDM family is a fully redundant all-in-one system that eliminates and
replaces interconnections and cables with a few ultra-reliable optical
connections in a self-contained integrated package. As a result, the XDM
inherently provides high reliability.
Operating features and benefits of the XDM include:
 Redundancy of all subsystems and optional switchover to protection,
offering the operator uninterrupted service.
 Comprehensive alarms system, detecting and reporting transmission and
equipment malfunctions.
 Loopback capabilities on the transmission interfaces and a sophisticated

BIT feature facilitating quick and accurate fault location, so minimizing
mean time to repair (MTTR).
 Maintenance configuration functions controlled by the management
system.
XDM-100 Product Line Reference Maintenance

Manual
Built-In Test
The BIT hardware and its related software assist in the identification of any
faulty card in the system. Outputs provide:
 Fault detection
 Maintenance alarms
 Redundancy switching
 System reset
 Bypass (when applicable)
 Management reports
On-card dedicated test circuits implement the BIT procedure under the control
of an integrated software package.
The xMCP cards perform the BIT procedures on all signal paths and buses. The
xMCPs also monitor the slave processors on the other XDM cards by means of
test messages.
A BIT program is automatically activated after the XDM is switched on. It is
performed for both the initialization and normal operation phases.
BIT testing covers general tests (including card presence tests and periodic
sanity checks of I/O card processors), traffic path tests, xMCP environment
tests, data tests, and more. The BIT detects traffic-affecting failures as well as
failures in cards.
redundant other system cards, including invisible failures in nonoperating
Maintenance XDM-100 Product Line Reference

Manual
Alarms System
Alarms generated by the XDM are classified as:
 Transmission: alarms associated with a malfunction of any transmission
path. The XDM supports a full set of alarms in compliance with applicable
standards.
 Timing: alarms associated with a malfunction of any XDM timing source.
 Equipment: alarms associated with any hardware malfunction.
The network administrator assigns severity levels to each alarm type:
 Critical: always requires immediate attention.
 Major: gives notice that attention is required, but does not require attention
outside normal working hours.
 Minor: does not require attention after normal hours.
 Warning: malfunction warning or unreleased maintenance action.
In addition to the management interfaces listed previously, additional optional
means can be provided for alarms control and display:
 Local displays, including LEDs that indicate malfunctions of specific plug-
in units or transmission paths
 Alarm contacts, delivering critical, major, and minor alarm indications to
the station alarm bus
 Rack alarm buzzer with station acknowledgment mechanism
 Alarm server, delivering network aggregated alarms from LightSoft to the
operator's Central Monitoring Station (CMS)
 Alarm inputs from in-station devices (such as security sensors, fire
detectors, external monitoring equipment) and other in-station
telecommunication equipment (like flexible multiplexers and DWDM
units)
XDM-100 Product Line Reference Maintenance

Manual
Troubleshooting
In the event of an alarm, troubleshooting procedures are used to determine the
severity and location of the problem and the appropriate alarm-clearing action.
Alarms are handled first by severity and then by type. In order of priority,
alarm types are:
 Equipment alarms
 Transmission alarms
 Timing alarms
Each card is a standalone unit. By adopting ECI Telecom's modular system
concept, the customer's planning and maintenance personnel achieve flexible
and efficient operation. By following a simple procedure, maintenance
personnel can quickly replace faulty cards or other assemblies. Faulty units are
then sent for repair to the assigned ECI Telecom Customer Support Center. The
easy maintenance concept of the XDM allows the user to perform these repairs
and test actions:
 Connecting/disconnecting cable fibers to/from the XDM
 Removing/inserting any cards in the XDM cards cage when power is on
 Connecting/disconnecting power cable(s) to/from the system
 Performing system test procedures

Removing/inserting I/O modules
Maintenance XDM-100 Product Line Reference

Manual
A
Standards and References
In this appendix:
Overview ........................................................................................................ A-1
Broadband Forum ........................................................................................... A-2
Environmental Standards ................................................................................ A-2
ETSI: European Telecommunications Standards Institute ............................. A-3
IEC: International Electrotechnical Commission ........................................... A-4
IEEE: Institute of Electrical and Electronic Engineers ................................... A-5
IETF: Internet Engineering Task Force .......................................................... A-6
ISO: International Organization for Standardization ...................................... A-8
ITU-T: International
MEF: Metro EthernetTelecommunication Union ........................................... A-9
Forum ........................................................................ A-14
NIST: National Institute of Standards and Technology................................ A-14
North American Standards ........................................................................... A-15
OMG: Object Management Group ............................................................... A-16
TMF: TeleManagement Forum .................................................................... A-16
Web Protocol Standards ............................................................................... A-16
Overview
The following is a list of standards and reference documents that relate to the
XDM platform families. The standards are listed alphabetically by groups.
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary A-1
Standards and References XDM-100 Product Line Reference

Manual
Broadband Forum
 Af-phy-0064.000 – ATM Forum E1 Physical Layer Interface.
 Af-phy-0086.000 – ATM Forum IMA V1.0.
 Af-phy-0086.001 – ATM Forum IMA V1.1.
 Af-phy-00121.00 – ATM Forum Traffic Management Specifications V4.1.
Environmental Standards
 EuP Directive 2005/32/EC: Ecodesign Requirements for Energy-Using
Products.
 OHSAS 18001: Occupational Health and Safety Management Systems-
Requirements.
 REACh Directive 2005/32/EC: Registration, Evaluation, Authorization,
and Restriction of Chemicals.
 RoHS Directive 2005/747/EC: Restriction of the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment.
 WEEE Directive 2002/96/EC: Waste from Electrical and Electronic
Equipment.
A-2 ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference Standards and References

Manual
ETSI: European
Telecommunications Standards
Institute
 EN 300 019-1-1 Class 1.2: Environmental Engineering (EE);
Environmental Conditions and Environmental Tests for
Telecommunications Equipment; Part 1-1: Classification of Environmental
Conditions; Storage.
Conditions; Transportation.
 EN 300 019-1-3 Classes 3.2 and 3.3: Environmental Engineering (EE);
Conditions; Stationary use at weather-protected locations.
Telecommunications Equipment; Part 2-4: Specification of Environmental
Tests; Stationary use at non-weather-protected locations.
 EN 300 132 -2: Environmental Engineering (EE); Power Supply Interface
at the Input to Telecommunications Equipment.
 EN 300-166: Physical and electrical characteristics of hierarchical digital
interfaces for equipment using the 2 048 kbit/s based plesiochronous or
synchronous digital hierarchies.
 EN 300 386: Electromagnetic compatibility and Radio spectrum Matters
(ERM); Telecommunication network equipment; Electromagnetic
Compatibility (EMC) requirements.
 EN 300-417-2-1: Transmission and Multiplexing (TM); Generic
requirements of transport functionality of equipment.
 EN 300-417-5-1: Generic requirements of transport functionality of
equipment.
 EN 300-462-5-1: Transmission and Multiplexing (TM); Generic
requirements for synchronization networks.
 EN 300-689: 34 Mbit/s digital leased lines (D34U and D34S); Terminal
equipment interface.
 EN 301-164: SDH leased lines connection characteristics.
 EN 301-165: SDH leased lines Network and Terminal interface
presentation.

Manual
 EN 55022: Radio Disturbance Characteristics of Information Technology

Equipment.
 ETR 114: Functional Architecture of SDH Transport Networks.
 ETR 275: Considerations on Transmission Delay and Transmission Delay
value for components on connections supporting speech communication
over evolving digital networks.
 FTZ 1TR9: Deutsche Telekom A.G. EMC Requirements.
 FTZ 153 TL 1part 1: Synchronous Multiplexing Equipment (SM) for
Synchronous Multiplex Hierarchy.
IEC: International
Electrotechnical Commission
 IEC 68: Environmental Testing.
 IEC 917: Modular Order for the Development of Mechanical Structures for
Electronic Equipment Practices.
 IEC 3309: Information Technology – Telecommunications and Information
Exchange between Systems – High-Level Data Link Control (HDLC)
Procedures – Frame Structure.
 IEC 9314-3: Information Processing Systems- Fiber Distributed Data
Interface (FDDI) Multiplex.
 IEC 9595, Information Technology: Open Systems Interconnection,
Common Management Information Services.
 IEC 9596, Information Technology: Open Systems Interconnection,
Common Management Information Protocol.
 IEC 13239: Information technology — Telecommunications and
information exchange between systems — High-level data link control
(HDLC) procedures.
 IEC 17025: General Requirements for Competence of Testing and
Calibration Laboratories.
 IEC 60825-1: Safety of Laser Products – Part 1: Equipment Classification
and Requirements.
 IEC 60825-2 (AS/NZS 2211.2): Safety of Laser Products – Part 2: Safety
of Optical Fiber Communication System (OFCS).
 IEC/EN/UL 60950-1: Information Technology Equipment- Safety- General
Requirements.
 IS 1249-1: Safety of Laser products: Equipment classification requirements
and users guide.

Manual
IEEE: Institute of Electrical and

Electronic Engineers
 IEEE 802.1ad: Virtual Bridged Local Area Networks—Revision—
Amendment 4: Provider Bridges.
 IEEE 802.1ag: Virtual Bridged Local Area Networks Amendment 5:
Connectivity Fault Management.
 IEEE 802.1D: Media access control (MAC) Bridges (Incorporates IEEE
802.1t and IEEE 802.1w).
 IEEE 802.1P: Traffic Class Expediting and Dynamic Multicast Filtering.

IEEE 802.1Q: Virtual Bridged Local Area Networks—Revision.
 IEEE 802.1w: Rapid Reconfiguration of Spanning Tree.
 IEEE 802.3: Carrier Sense Multiple Access with Collision Detection
(CSMA/CD) Access Method and Physical Layer Specifications.
 IEEE 802.3ad: Link Aggregation.
 IEEE 802.3ah: Ethernet in the First Mile (Link OAM).
 IEEE 802.3x: Full Duplex Operation and Flow Control Protocol.

Manual
IETF: Internet Engineering Task

Force
 RFC 1493: Definition of Managed Objects for Bridges.
 RFC 1643: Ethernet-like Interfaces.
 RFC 1662: PPP in HDLC-Life Framing.
 RFC 1757: Remote Network Monitoring Management Information Base.
 RFC 1823: LDAP Application Program Interface (API).
 RFC 1901: Introduction to Community-based SNMPv2.
 RFC 2108: Definitions of Managed Objects for IEEE 802.3 Repeater
Devices using SMIv2.
 RFC 2251: Lightweight Directory Access Protocol (v3) [specification of
the LDAP on-the-wire protocol].
 RFC 2252: Lightweight Directory Access Protocol (v3): Attribute Syntax
Definitions.
 RFC 2253: Lightweight Directory Access Protocol (v3): UTF-8 String
Representation of Distinguished Names.
 RFC 2254: The String Representation of LDAP Search Filters.
 RFC 2255: The LDAP URL Format.
 RFC 2256: A Summary of the X.500(96) User Schema for use with
LDAPv3.
 RFC 2401: Security Architecture for the Internet Protocol.
 RFC 2409: Internet Key Exchange Protocol (IKE).
 RFC 2474: Definition of the Differentiated Services Field (DS Field) in the
IPv4 and IPv6 Headers.
 RFC 2597: Assured Forwarding PHB Group.
 RFC 2615: PPP over SONET/SDH.
 RFC 2665: Definitions of Managed Objects for the Ethernet-like Interface

Types.
 RFC 2674: Bridge MIB with VLAN/Traffic Classes/Multicast Extensions.
 RFC 2702: Requirements for Traffic Engineering Over MPLS.
 RFC 2737: Entity MIB (Version 2).
 RFC 2819: Remote Network Monitoring Management Information Base.
 RFC 2829: Authentication Methods for LDAP.

Manual
 RFC 2830: Lightweight Directory Access Protocol (v3): Extension for

Transport Layer Security.
 RFC 2863: Interfaces Group MIB.
 RFC 3014: Notification Log MIB.
 RFC 3031: Multiprotocol Label Switching Architecture.
 RFC 3032: MPLS Label Stack Encoding.
 RFC 3246: An Expedited Forwarding PHB (Per-Hop Behavior).
 RFC 3270: Multi-Protocol Label Switching (MPLS) Support of
Differentiated Services.
 RFC 3377: Lightweight Directory Access Protocol (v3): Technical
Specification.
 RFC 3411: SNMP Framework MIB.
 RFC 3414: SNMP User-Based SM MIB.
 RFC 3415: SNMP Vies-Based ACM MIB.
 RFC 3443: Time To Live (TTL) Processing in Multi-Protocol Label
Switching (MPLS) Networks.
 RFC 3812: Multiprotocol Label Switching (MPLS) Traffic Engineering
(TE) Management Information Base (MIB).
 RFC 3813: Multiprotocol Label Switching (MPLS) Label Switching Router
(LSR) Management Information Base (MIB).
 RFC 3916: Requirements for Pseudo-Wire Emulation Edge-to-Edge
(PWE3).
 RFC 3985: Pseudo Wire Emulation Edge-to-Edge (PWE3) Architecture.
 RFC 4090: Fast Reroute Extensions to RSVP-TE for LSP Tunnels.
 RFC 4125: Maximum Allocation Bandwidth Constraints Model for
Diffserv-aware MPLS Traffic Engineering.
 RFC 4126: Max Allocation with Reservation Bandwidth Constraints Model
for Diffserv-aware MPLS Traffic Engineering & Performance
Comparisons.
 RFC 4379: Detecting Multi-Protocol Label Switched (MPLS) Data Plane
Failures.
 RFC 4448: Encapsulation Methods for Transport of Ethernet over MPLS
Networks.

Manual
 RFC 5462: Multiprotocol Label Switching (MPLS) Label Stack Entry:

"EXP" Field Renamed to "Traffic Class" Field.
 IETF Drafts:
 draft-ietf-l2vpn-vpls-ldp.
 draft-ietf-l2vpn-vpls-mcast-reqts.
 draft-ietf-magma-snoop.
 draft-ietf-mpls-rsvp-te-p2mp.
 draft-ietf-mpls-tp-nm-framework.
 draft-ietf-mpls-tp-nm-req.
 draft-ietf-pwe3-ethernet-encap.
 draft-martini-l2circuit-encap-mpls.
 draft-sajassi-l2vpn-vpls-multicast-congruency.
 draft-vasseur-mpls-backup-computation.
ISO: International Organization

for Standardization
 A2LA: Accredited Laboratory for Electrical and Mechanical Testing.
 ISO 9001: Quality Management System – Requirements.
 ISO 14001: Environmental Management Systems – Requirements With
Guidance for Use.
 ISO 27001: Information Security Management Systems – Requirements.
 TL 9000, QuEST Forum: Quality Management System – Requirements &
Measurements Handbooks for the Telecom Industry.

Manual
ITU-T: International
Telecommunication Union
 G.650: Definition and Test Methods for the Relevant Parameters of Single-
Mode Fibers.
 G.651: Characteristics of a 50/125 µm Multimode Graded Index Optical
Fiber Cable.
 G.652: Characteristics of a Single-Mode Optical Fiber Cable.
 G.653: Characteristics of a Dispersion-Shifted Single-Mode Optical Fiber
Cable.

G.654:
Cable. Characteristics of a Cut-off Shifted Single-Mode Optical Fiber
 G.655: Characteristics of a Non-Zero Dispersion Shifted Single-Mode
Optical Fiber Cable.
 G.661: Definition and Test Methods for the Relevant Generic Parameters of
Optical Amplifier Devices and Subsystems.
 G.662: Generic Characteristics of Optical Fiber Amplifier Devices and
Subsystems.
 G.663: Application Related Aspects of Optical Fiber Amplifier Devices
and Subsystems.
 G.664: Optical Safety Procedures and Requirements for Optical Transport
Systems.
 G.671: Transmission Characteristics of Passive Optical Components.
 G.691: Optical Interfaces for Single Channel SDH Systems with Optical
Amplifiers and STM-64 Systems (Draft).
 G.692: Optical Interfaces for Multi-Channel Systems with Optical
Amplifiers.
 G.694.1: Spectral Grids for WDM Applications: DWDM Frequency Grid.
 G.694.2: Spectral Grids for WDM Applications: CWDM Wavelength Grid.
 G.695: Optical Interfaces for Coarse Wavelength Division Multiplexing
Applications.
 G.703: Physical/Electrical Characteristics of Hierarchical Digital
Interfaces.
 G.704: Synchronous Frame Structures Used at 1544, 6312, 2048, 8448 and
44 736 kbps Hierarchical Levels.
 G.706: Frame Alignment and CRC Procedures Relating to Basic Frame
Structure Defined in Rec G.704.

Manual
 G.707: Network Node Interface for the Synchronous Digital Hierarchy.

 G.709: Interfaces for the Optical Transport Network (OTN).
 G.752: Characteristics of digital multiplex equipments based on a second
order bit rate of 6312 kbit/s and using positive justification.
 G.772: Protected Monitoring Points Provided on Digital Transmission
Systems.
 G.774 & G774.n: SDH Information Model.
 G.775: Loss of Signal (LOS), Alarm Indication Signal (AIS) and Remote
Defect Indication (RDI) defect detection and clearance criteria for PDH
signals.
 G.781: Synchronization Layer Functions.
 G.783: Characteristics of SDH Equipment Functional Blocks.
 G.784: Synchronous Digital Hierarchy (SDH) Management.
 G.798: Characteristics of OTN Hierarchy Equipment Functional Blocks.
 G.803: Architectures of Transport Networks based on the Synchronous
Digital Hierarchy.
 G.805: Generic Functional Architecture of Transport Networks.
 G.806: Characteristics of Transport Equipment –Description Methodology
and Generic Functionality.
 G.809: Functional Architecture of Connectionless Layer Networks.
 G.811: Timing Characteristics of Primary Reference Clocks.
 G.812: Timing Requirements of Slave Clocks Suitable for Use as Node
Clocks in Synchronization Networks.
 G.813: Timing Characteristics of SDH Equipment Slave Clocks (SEC).
 G.823: The Control of Jitter and Wander within Digital Networks Based on
the 2048 kbit/s Hierarchy.
 G.825: The Control of Jitter and Wander within Digital Networks Based on
the SDH (Draft).
 G.8251: The Control of Jitter and Wander within the Optical Transport
Network (OTN).
 G.826: Error Performance Parameters and Objectives for International,
Constant Bit Rate Digital Paths at or above the Primary Rate.
 G.828: Error Performance Parameters and Objectives for International,
Constant Bit Rate Synchronous Digital Paths.
 G.829: Error Performance Events for SDH Multiplex and Regenerator
Sections.

Manual
 G.831: Management Capabilities of Transport Networks Based on the

Synchronous Digital Hierarchy (SDH).
 G.841: Types and Characteristics of SDH Network Protection
Architectures.
 G.842: Inter-Working of SDH Protection Architectures.
 G.872: Architecture of Optical Transport Networks.
 G.874: Management Aspects of the Optical Transport Network Element.
 G.874.1: Optical Transport Network (OTN): Protocol-Neutral Management
Information Model for the Network Element View.
 G.957: Optical Interfaces for Equipment and Systems relating to the
Synchronous Digital Hierarchy.
 G.959.1: Optical Transport Network Physical Layer Interfaces.
 G.975: Forward Error Correction for Submarine Systems.
 G.985: 100 Mbit/s point-to-point Ethernet based optical access system.
 G.7041: Generic Framing Procedure (GFP).
 G.7042: Link Capacity Adjustment Scheme (LCAS) for Virtual
Concatenated Signals.
 G.7713: Distributed Connection Management.
 G.7713.2: RSVP-TE Implementation.
 G.7714: Generalized Automatic Discovery Techniques.

 G.7714.1: Protocol for Automatic Discovery in SDH & OTN network.
 G.7715: ASON Routing.
 G.7715.1: Based on PNNI, OSPF or IS_IS.
 G.8001/Y.1354: Terms and definitions for Ethernet frames over transport.
 G.8010/Y.1306: Architecture of Ethernet Layer Networks.
 G.8011/Y.1307: Ethernet Services Framework.
 G.8011.1/Y.1307.1: Ethernet Private Line Service.
 G.8011.2/Y.1307.2: Ethernet Virtual Private Line Service.

 G.8012/Y.1308: Ethernet UNI and Ethernet NNI.
 G.8080/Y.1304: Architecture for the automatically switched optical
network (ASON)
 G.8201/Y.1354: Error performance parameters and objectives for multi-
operator international paths within the Optical Transport Network (OTN)
 G.8261/Y. 1361: Timing and synchronization aspects in packet network.

Manual
 G.8262/Y. 1362: Timing characteristics of synchronous Ethernet

equipment slave clock (EEC).
 G.8080: Architecture for ASON.
 I.356: ATM Layer Cell Transfer Performance.
 I.361: ATM Layer Specification.
 I.371: Traffic Control and Congestion Control.
 I.610: ATM Operation and Maintenance Principles.
 M.2140: Transport Network Event Correlation.
 M.3010: Principles for a Telecommunications Management Network.
 M.3013: Considerations for a Telecommunications Management Network.
 M.3016.0: Security for the management plane: Overview. #####

 M.3017: Framework for the integrated management of hybrid circuit/packet
networks.
 M.3100: Generic Network Information Model.
 M.3180: Catalogue of TMN Management Information.
 M.3200: TMN Management Services and Telecommunications Managed
Areas: Overview.
 M.3300: TMN F Interface Requirements.

M.3400: TMN Management Functions.
 Q.821: Alarm Surveillance.
 Q.822: Performance Monitoring.
 X.217: Open Systems Interconnection, Service Definition for the
Association Control Service Element.
 X.219: Remote Operations- Model, Notation and Service Definition.
 X.227: Open Systems Interconnection, Connection-Oriented Protocol for
the Association Control Service Element- Protocol Specification.
 X.229: Remote Operations: Protocol Specification.
 X.710: Open Systems Interconnection, Common Management Information
Service.
 X.720: Open Systems Interconnection, Structure of Management
Information- Management Information Model.
 X.721 Information Technology: Open Systems Interconnection, Structure
of Management Information- Definition of Management Information.
 X.722: Open Systems Interconnection, Structure of Management
Information- Guidelines for the Definition of Managed Objects.

Manual
 X.731: Open Systems Interconnection, Systems Management- State

Management Function.
 X.733: Open Systems Interconnection, Systems Management- Alarm
Reporting Function.
 X.743: Open Systems Interconnection, Systems Management- Time
 X.744: Open Systems Interconnection, Systems Management- Software
 Y.1311: Network-based VPNs- Generic architecture and service
requirements.
 Y.1710: Requirements for Operation & Maintenance functionality for
MPLS networks.
 Y.1711: Operation & Maintenance mechanism for MPLS networks.
 Z.351: Data oriented human-machine interface specification technique –
introduction.
 Z.352: Data oriented human-machine interface specification technique –
scope, approach and usage.
 Z.361: Design guidelines for Human-Computer Interfaces (HCI) for the
management of telecommunications networks.

Manual
MEF: Metro Ethernet Forum

 MEF4 Metro Ethernet Network Architecture Framework Part 1: Generic
Framework.
 MEF6 Metro Ethernet Services Definitions.
 MEF7 EMS-NMS Information Model.
 MEF9 Test Suite for Ethernet Services at the UNI.
 MEF10 Ethernet Service Attributes.
 MEF11 User Network Interface (UNI) Requirements and Framework.
 MEF12 Metro Ethernet Network Architecture Framework Part 2: Ethernet
Services Layer.
 MEF14 Test Suite for Ethernet Traffic Management.
 MPLS-TP Network Management requirements (draft-ietf-mpls-tp-nm-req)
 MPLS-TP NM Framework (draft-ietf-mpls-tp-nm-framework)
NIST: National Institute of

Standards and Technology
 FIPS PUB 197: Advanced Encryption Standard (AES).
 FIPS PUB 140-2: Security Requirements for Cryptographic Modules.

Manual
North American Standards

 ANSI FC–F1-2: Fiber Channel Physical Interface REV 10.
 ANSI T1.102: Digital hierarchy electrical interface.
 ANSI T1.105: Synchronous Optical Network (SONET) - Basic Description
including Multiplex Structure, Rates, and Formats.
 ANSI X3.296: Single-Byte Command code sets CONnection (SBCON)
architecture.
 FCC CFR Title 47 Part 15: Radio Emission.
 FCC Part 101.147 Fixed microwave services: (i8, i7, K7, 7)
 NEBS GR1089 and GR63 (temperature aspect)
 NEBS Level 3 support for N.A. platforms.
 Rural Utility Service (RUS) Certification.
 Telcordia GR-63-CORE: Network Equipment Building System (NEBS)
Requirements: Physical Protection.
 Telcordia GR-253-CORE: Synchronous Optical Network (SONET)
Transport Systems: Common Generic Criteria.
 Telcordia GR-383-CORE: COMMON LANGUAGE® Equipment Codes
(CLEI™ Codes) – Generic Requirements for Bar Code Labels.
 Telcordia GR-487-CORE: Generic Requirements for Electronic Equipment
Cabinets.
 Telcordia GR-499-CORE: Transport System Generic Requirements
(TSGR): Common Requirements.
 Telcordia GR-1089-CORE: Electromagnetic Compatibility and Electrical
Safety – Generic Criteria for Network Telecommunications Equipment.
 Telcordia GR-1209-CORE: Generic Requirements for Passive Optical
Components.
 Telcordia GR-1230-CORE: SONET Bidirectional Line-Switched Ring
Equipment Generic Criteria.
 Telcordia GD-1244-CORE: Clock for the synchronization network:
Common generic criteria.
 Telcordia GR-1312-CORE: Generic Requirements for Optical Fiber
Amplifiers and Proprietary Dense Wavelength-Division Multiplexed
Systems.

Manual
 Telcordia GR-1400-CORE: SONET Dual-Fed Unidirectional Path

Switched Ring (UPSR) Equipment Generic Criteria.
 Telcordia GD-2979-CORE: Common Generic Requirements for Optical
Add-Drop Multiplexers (OADMs) and Optical Terminal Multiplexers
(OTMs).
OMG: Object Management Group

 Notification Service Specification V 1.0.
 The Common Object Request Broker: Architecture and Specification V 2.6.
TMF: TeleManagement Forum

 TMF 513: MTNM Business Agreement Release 3.5.
 TMF 518: Framework Document Delivery Package (DDP) Business
Agreement (BA) V1.1.
 TMF 518: Resource Provisioning DDP BA V1.0.
 TMF 608: Multi Technology Network Management Information
Agreement V 2.1 and V 3.5.
 TMF 814: Multi Technology Network Management Solution Set V 2.1 and
V 3.5.
 TMF 854: The MTOSI XML Solution Set Package Release 1.1.
Web Protocol Standards

W3C: World Wide Web Consortium
 SOAP 1.1: Simple Object Access Protocol.
 WSDL 1.1: Web Services Description Language.
WS-I: Web Services Interoperability Organization

 WS-I Basic Profile 1.1: Web Services Interoperability.
Index
A C
About This Manual • xv Cable Guide Frame • 10-55
Accessories • 10-35 Cable Guiding Accessories • 10-55
cable guiding • 10-55 Cable Slack Tray • 10-57
cables • 10-58 Cables • 10-58
fiber storage tray • 10-51 CCMB25_2D • 6-41
optical distribution frame • 10-52 CCP50-2 • 2-14
optical patch panel • 10-54 Common Cards, XDM-100 • 3-1

xDDF-21 patch panel • 10-50 Aggregate modules (SAM) • 3-20
xRAP-100 • 10-36 electrical • 3-21
ACP100 Module • 8-9 optical • 3-22
ACP900 Module • 8-11 ECU, ECU-F • 3-6, 3-8
Additional features • 7-10 FCU • 3-3
Additional FRR Capabilities • 11-8 MXC • 3-11
Air Filters • 2-12, 3-4, 4-4 MXC nonredundant • 3-19
Air Filters for FCU • 2-12, 3-4 MXC-100 • 3-11
Air Filters for FCU300 • 4-4 MXC-100/B redundant • 3-17
Air Filters for FCU900 • 5-4 MXC-100B • 3-14

Alarms System • 12-4 MXC-BR • 3-16
ASON (Automatically Switched Optical Common Cards, XDM-300 • 4-1
Network) • 8-1 ECU2 • 4-6
ASON Protection and Restoration FCU300 • 4-2
Capabilities • 11-2 MXC300 • 4-12
ASON Traffic Management • 8-6 Common Cards, XDM-50 • 2-1
Assignment options for TPU/OCU cages CCP50-2 • 2-14
• 1-13 ECU1, ECU1-R • 2-5
Attach/detach VLAN • 7-9 FCU50 • 2-11

B INF50
MXC50• 2-13
• 2-2
Bandwidth Scaling Protection for
Ethernet Traffic • 11-11 Common Cards, XDM-900 • 5-1
Basic XDM-100 Shelf • 1-8 ECU, ECU-F(900) • 5-6
Basic XDM-300 Shelf • 1-17 FCU • 5-2
Basic XDM-900 Shelf • 1-25 MXC900 • 5-11
Broadband Forum • A-2 Common Unit • 11-22
Built-In Test • 12-3 Comprehensive MPLS Network
Protection • 11-6
Control plane • 8-3
417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary I-1
Index XDM-100 Product Line Reference

Manual
Converged MSPP/CWDM Configuration Environmental Standards • A-2

(XDM-100H) • 1-7 Equipment Protection • 11-22
CRPT25_2C • 6-39 ETGbE SFP Electrical Transceiver • 6-44
CTRP25_2C • 6-40 Ethernet PB Features • 11-11
CWDM I/O Modules • 6-39 Ethernet Ring Protection (ERP) G.8032 •
CWDM Networking Modules • 9-24 11-12
Ethernet Switching Modules • 7-3
D
ETR-1 SFP Electrical Transceiver • 6-43
DCC Functionality • 1-30
ETSI
DCC in the XDM-100 • 1-30
European Telecommunications
DCC in the XDM-300/XDM-900 • 1-31 Standards Institute • A-3
DIOM Module Types • 7-17 Expanded XDM-100 with I/O Protection
DIOM Modules • 7-17 • 1-9
DIOM_04 • 7-17 Expanded XDM-300 with CWDM
DIOM_08 • 7-20 Networking Capabilities • 1-22
DIOM_40 • 7-22 Expanded XDM-300 with I/O Protection
Document Conventions • xvi • 1-20
Document Organization • xvi Expanded XDM-900 with CWDM
Double-Expanded XDM-100 • 1-9 Networking Capabilities • 1-29
Dual-Homed Device Protection in Expanded XDM-900 with I/O Protection
H-VPLS Networks • 11-9 • 1-27
Dual-Node Interconnection with External Connection Unit • See ECU2,
MS-SPRing • 11-22 See ECU, ECU-F, See ECU1,
ECU1-R
E External Connection Unit (ECU) • 3-6
ECU • 3-8 External Connection Unit (ECU300) • 4-6
ECU, ECU-F • 3-6, 3-8 External Connection Unit
ECU1, ECU1-R • 2-5 (ECU50/ECU50-R) • 2-5
ECU2 • 4-6 External Connection Unit (ECU900) • 5-6
ECU300 • 4-9 F
ECU300-F • 4-6
Facility Backup FRR • 11-6
ECU50 • 2-5
Fan Control Unit • See FCU
ECU50-R • 2-8
Fan Control Unit (FCU) • 3-3
ECU900 • 5-8
ECU900-F • 5-6 Fan Control Unit (FCU300) • 4-2
Fan Control Unit (FCU50) • 2-11
ECU-F • 3-6
Fan Control Unit (FCU900) • 5-2
EISMB Functionality • 7-4
Fast IOP
EISMB Module Types • 7-11
1
EISMB services • 7-10
1 Card Protection • 11-13
EISMB_804 • 7-12
FCU • 2-11, 3-3, 4-2
EISMB_840 • 7-14
FCU300 • 4-2
Electrical SAM • 3-21
FCU50 • 2-11
EMS-XDM • 1-33, See Management
I-2 ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02
XDM-100 Product Line Reference Index

Manual
FDB quota provisioning • 7-7 IEC

Fiber Guide for ETSI A Racks • 10-55 International Electrotechnical
Fiber Storage Tray (FST) • 10-51 Commission • A-4
FRR for P2MP Tunnels • 11-7 IEEE
FST • See fiber storage tray Institute of Electrical and Electronic
Engineers • A-5
G IETF
Generic Framing Procedure (GFP) • 7-4 Internet Engineering Task Force • A-6
I Implementation • 2-8
INF50 • 2-13
I/O Cards and Modules • 6-1
Integrated Protection for I/O Cards with
I/O Modules, all shelves Electrical Interfaces • 11-23
CWDM I/O modules • 6-39 Integration of LO SNCP and MS-SPRing
CCMB25_2D • 6-41 • 11-22
CRPT25_2C • 6-39 Intended Audience • xv
CTRP25_2C • 6-40 Introduction • 1-1
DIOM modules • 7-17 ISO
DIOM_04 • 7-17 International Organization for
DIOM_08 • 7-20 Standardization • A-8
DIOM_40 • 7-22 ITU-T
EISMB module types • 7-11 International Telecommunication
EISMB_804 • 7-12 Union • A-9
EISMB_840 • 7-14 L
EISMB/EISM functionality • 7-4 Layer 2 switching capabilities • 7-6
electrical I/O modules
LCT-XDM • 1-34, See Management
PIM2_21 • 6-4
LightSoft • See Management
PIM2_63, PIM2_63B • 6-8
LightSoft Network Manager • 1-35
PIM345_3 • 6-13
Link Aggregation • 11-10
SIM1_4/E • 6-16
Link Capacity Assignment Scheme
Ethernet switching modules • 7-3
(LCAS) • 7-6
MCSM • 7-25
Location of ASON Software • 8-7
optical I/O modules
SIM1_4/0, SIM1_40B • 6-17 M
SIM1_8 • 6-19 Main Cross-connect and Control • 2-2,

SIM16_1 • 6-26 3-11, 4-12
SIM16_4 • 6-29 Main Cross-Connect and Control (MXC)
SIM4_2 • 6-21 Card • 3-11
SIM4_4 • 6-22 Main Cross-Connect and Control
(MXC50) Card • 2-2
SIM64_XFP • 6-35
Main Cross-Connect and Control Card
I/O Protection Options • 1-8, 1-17, 1-20,
(MXC300) • 4-12
3-2, 4-1, 9-1, 9-24
Main Cross-Connect and Control Card
(MXC900) • 5-11

Manual
Maintenance • 12-1 MXC-100/B Redundant Option • 3-17

Management • 1-33 MXC-100B • 3-14
EMS-XDM • 1-33 MXC300 • 4-12
LCT-XDM • 1-34 MXC50 • 2-2
LightSoft • 1-35 MXC-BR • 3-16
Management Architecture • 1-33
N
Management layer • 8-5
NIST
Management Software • 8-6
National Institute of Standards and
MCSM • 7-25
Technology • A-14
MEF
NNI on ETY ports • 7-9
Metro Ethernet Forum • A-14
North American Standards • A-15
MO_4CP4SPMM50 splitter/coupler •

9-31 O
MO_4CP4SPMM50 Splitter/Coupler • Obtaining Technical Documentation •
9-31 xviii
MO_4CP4SPMM62 splitter/coupler • ODF • See optical distribution frame
9-32
OHU • See Overhead Access Module
MO_4CP4SPMM62 Splitter/Coupler •
OMG
9-32
Object Management Group • A-16
MO_4CP4SPSM splitter/coupler • 9-33
OPP • See optical patch panel
MO_4CP4SPSM Splitter/Coupler • 9-33
Optical Amplifiers • 9-19
MO_CMD4C mux/demux • 9-25
Optical Control Plane Architecture • 8-2
MO_CMD4C Mux/DeMux • 9-25
MO_CMD4C_E mux/demux • 9-27 Optical Distribution Frame • 10-52
Optical I/O Interfaces • 2-4
MO_CMD4C_E Mux/DeMux • 9-27
Optical Patch Panel • 10-54
MO_CMD4SL Mux/DeMux • 9-28
Optical SAMs • 3-22
MO_CMD8 mux/demux • 9-26
Orderwire • 2-7, 6-45
MO_CMD8 Mux/DeMux • 9-26
OrderWire • 2-7
MO_COADM1AB_xx OADM • 9-29
Overhead Access Module • 6-45
MO_COADM2AB_Gxx OADM • 9-30
Overhead Access Module (OHU) • 6-45
MO_DC0_BAS • 9-20
Overview • xv, 2-1, 6-1, 7-1, 8-1, 9-1,
MO_OFA21 • 9-22
10-35, 11-1, 12-1, A-1
MO_PAS_DCM80 • 9-21
MO-CMD4SL mux/demux • 9-28 P
MPLS and Ethernet Data Modules • 7-1 Path Computation • 11-5
MPLS Protection Schemes • 11-6 PDH Modules • 6-4
MSP • 11-19 PIM2_21 • 6-4
MS-SPRing • 11-20 PIM2_42 • 6-6
Multiple Protection Schemes • 11-3 PIM2_63 and PIM2_63B • 6-8
MXC • 3-11 PIM2_63, PIM2_63B • 6-8
MXC Nonredundant Option • 3-19 PIM2_63S • 6-10
MXC-100 • 3-11 Traffic cable for PIM2_63S • 6-11

Manual
PIM2_63S Traffic Cable Box Tray • SIM4_8 • 6-24

10-56 SIM64_1 • 6-33
PIM345_3 • 6-13 SIM64_2 • 6-37
Pluggable Interfaces • 6-42 SIM64_XFP • 6-35
ETGbE SFP electrical transceiver • SNCP • 11-14
6-44 Standard BPDU frames • 7-8
ETR-1 SFP electrical transceiver • Standards and References • A-1
6-43
Structure of ASON ACP Software • 8-8
Pluggable Interfaces (SFP/XFP) • 6-42
Support • xix
Port-based VLANs • 7-9
Pure SDH MSPP Configuration (XDM- T
100) • 1-6 TC • 9-5
TC Modules • 9-5
R TCF • 9-6
RAP-4B • 10-47
Technical Assistance • xix
RAP-BG • 10-46
TMF
Related Documentation • xviii
TeleManagement Forum • A-16
Revertive SNCP • 11-18
TPM2_1 • 9-9
RSTP Protection • 11-11
TPM2_3 • 9-10
S TPM2_42_2 • 9-11
SAM1_4/E • 3-21 TPM2_63_2 • 9-12
SAM1_4O and SAM1_4OB • 3-22 TPM2_63_3 • 9-13
SAM16_1 and SAM16_1B • 3-24 TPMH_1 • 9-14
SAM4_2 • 3-23 TPMs • 9-8
SDH Aggregate Modules (SAMs) • 3-20 TPU • See Tributary Protection Unit
SDH Cards and Modules • 6-15 TPU and I/O Slots Allocation for
SDH Line Protection • 11-19 Protection • 9-15
SDH Protection Schemes • 11-14 TPU/OCU Shelf • 9-24
SFP/XFP • See Pluggable Interfaces TPU/OCU slots designation • 1-12
Shelf Configurations, XDM-100 • 1-6 Traffic Cable for PIM2_63S • 6-11
Shelf Overview • 3-2 Traffic Unit (I/O Card) • 11-22
Short MTTR • 12-2 Transport layer • 8-3
SIM1_4/0, SIM1_40B • 6-17 Tributary Protection Unit • 9-1
SIM1_4/E • 6-16 CWDM networking modules • 9-24
SIM1_4/O and SIM1_4OB • 6-17 MO_4CP4SPMM50
splitter/coupler • 9-31
SIM1_8 • 6-19
MO_4CP4SPMM62
SIM16_1 • 6-26
splitter/coupler • 9-32
SIM16_2 • 6-28
MO_4CP4SPSM splitter/coupler •
SIM16_4 • 6-29
9-33
SIM16_8 • 6-31
MO_CMD4C mux/demux • 9-25
SIM4_2 • 6-21
MO_CMD4C_E mux/demux •
SIM4_4 • 6-22 9-27

Manual
MO_CMD8 mux/demux • 9-26 XDM-100 Platform Overview • 1-5

MO_COADM1AB_xx OADM • XDM-100 Product Line Overview
9-29 XDM-100 platform options • 1-5
MO_COADM2AB_Gxx OADM XDM-100H overview • 1-10
• 9-30 XDM-300 platform options • 1-16
MO-CMD4SL mux/demux • 9-28 XDM-50 platform options • 1-2
optical amplifiers • 9-19 XDM-100 Shelf Configurations • 1-6
TC modules • 9-5, 9-6 XDM-100H
TPMs • 9-8 description • 1-11
TPM2_1 • 9-9 options • 1-12
TPM2_3 • 9-10 XDM-100H Configuration Options • 1-12
TPM2_63_2 • 9-12 XDM-100H Description • 1-11
TPMH_1
TPU/OCU • 9-14
shelf • 9-24 XDM-100H Overview • 1-10
XDM-300
Tributary Protection Unit (TPU) • 9-1 accessories, cable guiding • 10-55
Triggers for RSTP • 7-8 common cards • 4-1
Troubleshooting • 12-5 I/O protection options • 1-17
U platform overview • 1-16, 4-1
TPU • 9-1
UNI on EoS ports • 7-9
XDM-300 and TPU Slot Allocation •
V 9-17
Virtual concatenation • 7-5 XDM-300 Common Cards • 4-1
W XDM-300
XDM-300 I/O Protection
Platform Options
Overview • 1-17
• 1-16
Web Protocol Standards • A-16 XDM-300 Platform with 100 Gbps
X Capacity • 4-15
XDM-300 Shelf Overview • 4-1
xDDF-21 patch panel • 10-50
XDM-50
xDDF-21 Patch Panel for Unbalanced
accessories, cable guiding • 10-55
Electrical Connections • 10-50
common cards • 2-1
XDM Protection and Restoration
Mechanisms • 11-1 shelf options • 1-3
XDM-100 TPU • 9-1
accessories, cable guiding • 10-55 XDM-50 and TPU Slot Allocation • 9-15
common cards • 3-1 XDM-50 Common Cards • 2-1
I/O protection options • 1-8 XDM-50 Platform Overview • 1-2
platform overview • 1-5 XDM-50 Shelf Options • 1-3
shelf configurations • 1-6 XDM-900 and TPU Slot Allocation •
9-18
TPU • 9-1
XDM-900 Common Cards • 5-1
XDM-100 and TPU Slot Allocation • 9-
16 XDM-900 I/O Protection Options • 1-25
XDM-100 Common Cards • 3-1 XDM-900 Platform Overview • 1-23
XDM-100 I/O Protection Options • 1-8

Manual
XDM-900 Platform with 60 Gbps

Capacity • 5-14
XDM-900 Shelf Overview • 5-1
xRAP-100 • 10-36
xRAP-D • 10-40

Dokumen - Tips - XDM 100 Product Line RM Etsi b02 83 en

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Dokumen - Tips - XDM 100 Product Line RM Etsi b02 83 en

Uploaded by

Copyright:

Available Formats

8/9/2019 Xdm-100 Product Line Rm Etsi b02 8.

XDM®-100 Product Line

XDM-100 Product Line (ETSI) Reference Manual

Catalog No: X39175

© Copyright by ECI Telecom, 2007-2011. All rights reserved worldwide.

Int ro duct ion .............................................................................. 1-1

XDM-50 Common Cards .......................................................... 2-1

XDM-100 Common Cards ........................................................ 3-1

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary i

Contents XDM-100 Product Line Reference

XDM-300 Common Cards ........................................................ 4-1

XDM-900 Common Cards ........................................................ 5-1

I/O Cards and Modul es ............................................................ 6-1

MPLS and Ethernet Data Modules ......................................... 7-1

ASON (A utomat ically Sw it ched Opt ic al Netw ork) ................ 8-1

ii ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

XDM-100 Product Line Reference Contents

Tribut ary Prot ection Unit (TPU).............................................. 9-1

Ac cessories ......................................................................... 10-35

XDM Protection and Rest oration Mechanism s ................... 11-1

Maintenance ........................................................................... 12-1

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary iii

Contents XDM-100 Product Line Reference

Standards and References .................................................... A-1

Index .......................................................................................... I-1

iv ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary v

List of Figures XDM-100 Product Line Reference

Figure 2-8: CCP50-2 module front panel ..................................................................... 2-14

vi ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

XDM-100 Product Line Reference List of Figures

Figure 6-9: SIM1_8 front panel .................................................................................... 6-20

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary vii

List of Figures XDM-100 Product Line Reference

Figure 9-7: TPM2_1 protection module ......................................................................... 9-9

viii ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

XDM-100 Product Line Reference List of Figures

Figure 11-1: 1++ protection .......................................................................................... 11-3

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary ix

List of Figures XDM-100 Product Line Reference

x ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xi

List of Tables XDM-100 Product Line Reference

Table 6-10: PIM2_63S front panel LED indicator ................................................... 6-11

xii ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

XDM-100 Product Line Reference List of Tables

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xiii

List of Tables XDM-100 Product Line Reference

Table 9-20: MO_COADM1AB_xx front panel LED indicators ................................ 9-29

xiv ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

About This Manual

417006-2709-0H3-B02 ECI Telecom Ltd. Proprietary xv

About This Manual XDM-100 Product Line Reference

Italics New terms, emphasized Examples in text

xvi ECI Telecom Ltd. Proprietary 417006-2709-0H3-B02

XDM-100 Product Line Reference About This Manual

NOTE: Text set off in this manner presents clarifying

CAUTION: Text set off in this manner indicates that failure to

WARNING: Text set off in this manner indicates that failure

LASER WARNING: Text set off in this manner indicates how

ESD: Text set off in this manner indicates information on

TIP: Text set off in this manner includes helpful information

IMPORTANT: Text set off in this manner presents essential