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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
 FDA20N50F — N-Channel UniFETTM FRFET® MOSFET
June 2014

FDA20N50F
N-Channel UniFETTM FRFET® MOSFET
500 V, 22 A, 260 mΩ
Features Description
• RDS(on) = 220 mΩ (Typ.) @ VGS = 10 V, ID = 11 A UniFETTM MOSFET is Fairchild Semiconductor’s high voltage
• Low Gate Charge (Typ. 50 nC) MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
• Low Crss (Typ. 27 pF)
provide better switching performance and higher avalanche
• 100% Avalanche Tested energy strength. The body diode’s reverse recovery perfor-
• Improved dv/dt Capability mance of UniFET FRFET® MOSFET has been enhanced by
lifetime control. Its trr is less than 100nsec and the reverse dv/dt
• RoHS Compliant
immunity is 15V/ns while normal planar MOSFETs have over
200nsec and 4.5V/nsec respectively. Therefore, it can remove
Applications additional component and improve system reliability in certain
applications in which the performance of MOSFET’s body diode
• PDP TV
is significant. This device family is suitable for switching power
• Uninterruptible Power Supply converter applications such as power factor correction (PFC),
• AC-DC Power Supply flat panel display (FPD) TV power, ATX and electronic lamp bal-
lasts.

G
G
D TO-3PN
S
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted.
Symbol Parameter FDA20N50F Unit
VDSS Drain to Source Voltage 500 V
VGSS Gate to Source Voltage ±30 V
- Continuous (TC = 25oC) 22
ID Drain Current A
- Continuous (TC = 100oC) 13
IDM Drain Current - Pulsed (Note 1) 88 A
EAS Single Pulsed Avalanche Energy (Note 2) 1110 mJ
IAR Avalanche Current (Note 1) 22 A
EAR Repetitive Avalanche Energy (Note 1) 39 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns
(TC = 25oC) 388 W
PD Power Dissipation
- Derate above 25oC 3.1 W/oC
o
TJ, TSTG Operating and Storage Temperature Range -55 to +150 C
Maximum Lead Temperature for Soldering Purpose, o
TL 300 C
1/8” from Case for 5 Seconds

Thermal Characteristics
Symbol Parameter FDA20N50F Unit
RθJC Thermal Resistance, Junction to Case, Max. 0.44 oC/W
RθJA Thermal Resistance, Junction to Ambient, Max. 40

©2007 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com

FDA20N50F Rev. C2
 FDA20N50F — N-Channel UniFETTM FRFET® MOSFET
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDA20N50F FDA20N50F TO-3PN Tube N/A 30 units

Electrical Characteristics TC = 25oC unless otherwise noted.

Symbol Parameter Test Conditions Min. Typ. Max. Unit

Off Characteristics
BVDSS Drain to Source Breakdown Voltage ID = 250μA, VGS = 0V, TJ = 25oC 500 - - V
ΔBVDSS Breakdown Voltage Temperature
ID = 250μA, Referenced to 25oC - 0.6 - V/oC
/ ΔTJ Coefficient
VDS = 500V, VGS = 0V - - 10
IDSS Zero Gate Voltage Drain Current μA
VDS = 400V, TC = 125oC - - 100
IGSS Gate to Body Leakage Current VGS = ±30V, VDS = 0V - - ±100 nA

On Characteristics
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 250μA 3.0 - 5.0 V
RDS(on) Static Drain to Source On Resistance VGS = 10V, ID = 11A - 0.22 0.26 Ω
gFS Forward Transconductance VDS = 40V, ID = 11A - 24 - S

Dynamic Characteristics
Ciss Input Capacitance - 2550 3390 pF
VDS = 25V, VGS = 0V
Coss Output Capacitance - 350 465 pF
f = 1MHz
Crss Reverse Transfer Capacitance - 27 40 pF
Qg(tot) Total Gate Charge at 10V - 50 65 nC
Qgs Gate to Source Gate Charge VDS = 400V, ID = 20A - 14 - nC
VGS = 10V
Qgd Gate to Drain “Miller” Charge (Note 4) - 20 - nC

Switching Characteristics
td(on) Turn-On Delay Time - 45 100 ns
tr Turn-On Rise Time VDD = 250V, ID = 20A - 120 250 ns
td(off) Turn-Off Delay Time RG = 25Ω - 100 210 ns
tf Turn-Off Fall Time (Note 4) - 60 130 ns

Drain-Source Diode Characteristics

IS Maximum Continuous Drain to Source Diode Forward Current - - 22 A
ISM Maximum Pulsed Drain to Source Diode Forward Current - - 88 A
VSD Drain to Source Diode Forward Voltage VGS = 0V, ISD = 22A - - 1.5 V
trr Reverse Recovery Time VGS = 0V, ISD = 20A - 154 - ns
Qrr Reverse Recovery Charge dIF/dt = 100A/μs - 0.5 - μC

Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature
2: L = 5mH, IAS = 20A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3: ISD ≤ 22A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4: Essentially Independent of Operating Temperature Typical Characteristics

©2007 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com

FDA20N50F Rev. C2
 FDA20N50F — N-Channel UniFETTM FRFET® MOSFET
Typical Characteristics

Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics

80 100
VGS = 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V

ID,Drain Current[A]
ID,Drain Current[A]

6.0 V
5.5 V
10
o
10 150 C

o
25 C

*Notes: *Notes:
1 1. 250μs Pulse Test 1. VDS = 20V
o
2. TC = 25 C 2. 250μs Pulse Test
0.5 1
0.1 1 10 4 6 8
VDS,Drain-Source Voltage[V] VGS,Gate-Source Voltage[V]

Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage

Drain Current and Gate Voltage Variation vs. Source Current
and Temperature
0.8 100

0.7
Drain-Source On-Resistance

IS, Reverse Drain Current [A]

0.6
o
10 150 C
RDS(ON) [Ω],

0.5
o
25 C
0.4
VGS = 10V

0.3 VGS = 20V 1

*Notes:
0.2 1. VGS = 0V
o
*Note: TJ = 25 C 2. 250μs Pulse Test
0.1 0.2
0 25 50 75 0.0 0.5 1.0 1.5
ID, Drain Current [A] VSD, Body Diode Forward Voltage [V]

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

6000 10
Ciss = Cgs + Cgd (Cds = shorted)
VDS = 100V
Coss = Cds + Cgd
VDS = 250V
VGS, Gate-Source Voltage [V]

Crss = Cgd
8 VDS = 400V
4500 Coss
*Note:
Capacitances [pF]

1. VGS = 0V
2. f = 1MHz 6
3000 Ciss

1500
2
Crss
*Note: ID = 20A
0 0
0.1 1 10 50 0 10 20 30 40 50 60
VDS, Drain-Source Voltage [V] Qg, Total Gate Charge [nC]

©2007 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com

FDA20N50F Rev. C2
 FDA20N50F — N-Channel UniFETTM FRFET® MOSFET
Typical Characteristics (Continued)

Figure 7. Breakdown Voltage Variation Figure 8. Maximum Safe Operating Area

vs. Temperature
1.2 200
100 30μs
Drain-Source Breakdown Voltage

100μs

ID, Drain Current [A]

1.1
BVDSS, [Normalized]

10 1ms

1.0 10ms
Operation in This Area
is Limited by R DS(on)
DC
1
*Notes:
0.9 o
*Notes: 1. TC = 25 C
1. VGS = 0V o
2. TJ = 150 C
2. ID = 250μA 3. Single Pulse
0.8 0.1
-100 -50 0 50 100 150 200 1 10 100 1000
o
TJ, Junction Temperature [ C] VDS, Drain-Source Voltage [V]

Figure 9. Maximum Drain Current

vs. Case Temperature
25

20
ID, Drain Current [A]

15

10

0
25 50 75 100 125 150
o
TC, Case Temperature [ C]

Figure 10. Transient Thermal Response Curve

1
ZθJC(t), Thermal Response [oC/W]
Thermal Response [ZθJC]

0.5

0.1 0.2

0.1 PDM
0.05
t1
0.02 t2
0.01
0.01 *Notes:
o
1. ZθJC(t) = 0.44 C/W Max.
Single pulse
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
1E-3
-5 -4 -3 -2 -1 0
10 10 10 10 10 10
Rectangular Pulse Duration [sec]
t1, Square Wave Pulse Duration [sec]

©2007 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com

FDA20N50F Rev. C2
 FDA20N50F — N-Channel UniFETTM FRFET® MOSFET
Figure 11. Gate Charge Test Circuit & Waveform

IG = const.

Figure 12. Resistive Switching Test Circuit & Waveforms

RL VDS
VDS 90%

VGS VDD
RG

10%
VGS
V
10V
GS
DUT
td(on) tr td(off)
tf
t on t off

Figure 13. Unclamped Inductive Switching Test Circuit & Waveforms

VGS

©2007 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com

FDA20N50F Rev. C2
 FDA20N50F — N-Channel UniFETTM FRFET® MOSFET
Figure 14. Peak Diode Recovery dv/dt Test Circuit & Waveforms

DUT +

VDS

I SD
L

Driver
RG
Same Type
as DUT VDD

VGS • dv/dt controlled by RG

• ISD controlled by pulse period

Gate Pulse Width

VGS D = --------------------------
Gate Pulse Period 10V
( Driver )

IFM , Body Diode Forward Current

I SD
( DUT ) di/dt

IRM

Body Diode Reverse Current

VDS
( DUT ) Body Diode Recovery dv/dt

VSD VDD

Body Diode
Forward Voltage Drop

©2007 Fairchild Semiconductor Corporation 6 www.fairchildsemi.com

FDA20N50F Rev. C2
 FDA20N50F — N-Channel UniFETTM FRFET® MOSFET
Mechanical Dimensions

Figure 15. TO3PN, 3-Lead, Plastic, EIAJ SC-65

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-
ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3PN-003

©2007 Fairchild Semiconductor Corporation 7 www.fairchildsemi.com

FDA20N50F Rev. C2
 FDA20N50F — N-Channel UniFETTM FRFET® MOSFET
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™ F-PFS™ ®*
AX-CAP®* FRFET® ® tm

BitSiC™ Global Power Resource SM

PowerTrench ®
TinyBoost®
Build it Now™ GreenBridge™ PowerXS™
TinyBuck®
CorePLUS™ Green FPS™ Programmable Active Droop™
® TinyCalc™
CorePOWER™ Green FPS™ e-Series™ QFET
TinyLogic®
CROSSVOLT™ Gmax™ QS™
TINYOPTO™
CTL™ GTO™ Quiet Series™
TinyPower™
Current Transfer Logic™ IntelliMAX™ RapidConfigure™
TinyPWM™
DEUXPEED® ISOPLANAR™ ™ TinyWire™
Dual Cool™ Marking Small Speakers Sound Louder
TranSiC™
EcoSPARK® and Better™ Saving our world, 1mW/W/kW at a time™
TriFault Detect™
EfficentMax™ MegaBuck™ SignalWise™
TRUECURRENT®*
ESBC™ MICROCOUPLER™ SmartMax™
μSerDes™
® MicroFET™ SMART START™
MicroPak™ Solutions for Your Success™
Fairchild® MicroPak2™ SPM®
Fairchild Semiconductor® MillerDrive™ STEALTH™ UHC®
FACT Quiet Series™ MotionMax™ SuperFET® Ultra FRFET™
FACT® mWSaver® SuperSOT™-3 UniFET™
FAST® OptoHiT™ SuperSOT™-6 VCX™
®
FastvCore™ OPTOLOGIC SuperSOT™-8 VisualMax™
OPTOPLANAR ® SupreMOS ® VoltagePlus™
FETBench™
FPS™ SyncFET™ XS™
Sync-Lock™ 仙童™

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or
intended for surgical implant into the body or (b) support or sustain life, system whose failure to perform can be reasonably expected to cause
and (c) whose failure to perform when properly used in accordance with the failure of the life support device or system, or to affect its safety or
instructions for use provided in the labeling, can be reasonably effectiveness.
expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
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proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
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PRODUCT STATUS DEFINITIONS

Definition of Terms
Datasheet Identification
Advance Information
Product Status Definition
Datasheet contains the design specifications for product development. Specifications
Formative / In Design
may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later

Preliminary First Production date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to

No Identification Needed Full Production
make changes at any time without notice to improve the design.

Datasheet contains specifications on a product that is discontinued by Fairchild

Obsolete Not In Production
Semiconductor. The datasheet is for reference information only.
Rev. I68
©2007 Fairchild Semiconductor Corporation 8 www.fairchildsemi.com
FDA20N50F Rev. C2
 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
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