A Model for the DM to CM conversion for

unbalanced devices at PCB level

Johan Catrysse 1,2, Davy Pissoort 1,2, Filip Vanhee 1,2
1
MICAS/ESAT/KULeuven
2
Flanders’ Mechatronics Engineering Centre
KHBO – KULeuven Association
Zeedijk 101, B8400 Oostende
johan.catrysse@khbo.be
davy.pissoort@khbo.be
filip.vanhee@khbo.be

Abstract — A model describing the DM to CM mode conversion

at PCB level is developed. The model is based on a equivalent
circuit model of multi transmission lines (MTL), and
consequently, it can be introduced in any circuit simulator, with
a set of coupled transmission lines in its components library.

Keywords: PCB, Common Mode, Differential Mode, MTL

I. INTRODUCTION
Although PCB’s are designed to carry all currents between
components, and is intrinsically a Differential Mode (DM)
system with respect to the chassis, some leakages are observed Figure 2. Typical transmission line model (figure taken from [2])
and will generate a Common Mode (CM) current path, that will
radiate in the environment. However, when dealing with the radiation forthcoming
from components, a more detailed modeling of the structure is
A typical combination of PCB’s and chassis is shown needed. The combination of a PCB trace, the GND plane and
inpicture of figure 1. the chassis is given in figure 3.

Signal or Vcc trace

GND plane of PCB

Chassis

Figure 3. PCB with trace and GND plane above a chassis

The figure 3 above shows the fundamental behavior of a

PCB trace, GND plane and chassis as a 3 wire MTL.

Figure 1. Typical PCB and chassis structure

It is clear that a CM path, consisting of the PCB (and
mainly its ground plane or GND plane) and the chassis, will
cause the radiation, certainly in the case where an external
cabling is present and connected to the electronic system.
For a lot of applications, the system is typically modeled by
one single transmission line, as shown in next figure 2 [2], as it
is the case to understand PCB-chassis resonances in the overall
structure.
II. EXAMPLE OF RADIATED EMISSION
In today electronic systems, more and more distributed
power supplies components are used, also because of the
different power supply voltages needed in actual circuitry.
A typical example is shown in figure 4, where a main DC
voltage distribution is used all over the system (typical telecom
systems), and where “ad hoc” on board level, DC/DC
converters will generate the specific voltage needed.
 Figure 4. Schematics showing a distributed power supply system

A typical radiated emission spectrum graph is given in

Figure 7. Resulting radiated emission spectrum for an
figure 5 for a simple 5 Vdc on board voltage, obtained from a on board DC/DC converter with a filter at 12 Vdc
DC/DC converter with 12 Vdc input. The load was a simple
clock and counter circuit, so that only the clock frequency of
this digital component are identified in the radiated spectrum. III. MTL MODEL
A component may be described as a discontinuity of the
PCB traces, due to the internal bonding wiring and the height
of the substrate , when mounted inside a package. This effect
is sketched in figure 8.

Signal or Vcc trace

GND plane of PCB

Figure 8. Discontinuity of a package and the PCB traces

Figure 5. Typical radiated emission spectrum for an
on board DC/DC converter
In order to reduce the radiated emission, a filter was inserted
at the 5 Vdc level. The resulting radiated emission is shown in
figure 6, still showing some of the harmonics being radiated.
Basically, the system can now be described by a set of coupled
differential equations, and solved by using a well known
method of eigenvalues and eigenvectors [3], and will only
shortly be described.
trace 1

trace 2
Reference

Figure 9. Basic model of a 3 conductor MTL

Figure 6. Resulting radiated emission spectrum for an
on board DC/DC converter with a filter at 5 Vdc
 dv1
 dx = z11i1 + z12i2
The radiated emission only disappears when another filter is  dv
inserted at the 12 Vdc input of the DC/DC converter. This is  2 = z 21i1 + z 22i2
 dx
shown in figure 7.  di (1)
This means that this filter in front of the DC/DC converter is  1 = y11v1 + y12v2
reducing some resulting components, which caused the  dx
radiated emission by the system, and that the DC/DC  di2 = y v + y v
converter is generating some CM like signals from the clock  dx 12 1 22 2
generator and counter at its secundary side.
Or using matrix notation: IV. MODE DECOUPLING: 2 EXAMPLES

 d [v ] As a practical example, two different cases are studied:

 dx = [Z ][i ] - normal PCB trace, which is very close to the PCB GND

 d [i ] = [Y ][v ]
. (2)
plane (thickness of the dielectric insulator of a multilayer PCB
 dx could be estimated as 0.1 mm)
- trace, simulating bonding wiring and substrate traces inside a
package, at a given height above the PCB GND plane. For
The set of differential equations can be solved, by taking the actual SMD components, this is only a few mm.
eigenvalues and the eigenvectors of the following expression:

d 2 [v]
= [Z ][Y ][i ] , (3)
dx 2
with:
[Z ][Y ][w1 ] = γ 12 [w1 ]
 , (4)
[Z ][Y ][w2 ] = γ 22 [w2 ]

where γ i2 is an eigenvalue and [wi ] is the accompanying
eigenvector.
The complete solution is the sum of two partial expressions:
[v] = c1 ( x)[w1 ] + c2 ( x)[w2 ] ,
with:
ci ( x) = Ai e −γ i x + Bi e + γ i x .
The solution obtained by this method results in two
propagating waves c1 and c2, each with their own
characteristics of impedance and propagation constant. Both
components are orthogonal, due to the properties of the
eigenvectors used for the “weighting” of both parts in the
resulting voltages V1 and V2 occuring on both transmission
lines TL1 and TL2.
Figure 10. Picture of PCB showing the lifting of the traces
and the wiring at component level
In the above picture, it is clear that PCB traces are lifted at
component level by the pinning, and afterwards inside the
component by the attached bonding wiring and the traces on
(5) the substrate of the IC itself. For this purpose, an internal
height of the package wiring of 2 mm has been estimated and
used for the simulations and calculations.
(6)
A schematic cross section is given in figure 10. All
dimensions are in mm.

Finally, the currents and the accompanying characteristic

impedances for each propagation mode are obtained from:

[i ] = [Z ]−1 d [v] . (7)

dx
The most important property of this method is that both partial
solutions are orthogonal, which means that the wavefronts
described by each of the partial solution c1 and c2 are
completely decoupled with respect to each other.

The method allows an easy implementation in circuit

similators, by introducing either the set of the two
characteristic impedances, either by a macro-model directly Figure 11. Two cases of traces at different height above PCB GND plane:
based on the eigenvalue/eigenvector description. upper: PCB trace and PCB GND plane above chassis
lower: internal package wiring and PCB GND plane above chassis
The following figure summarizes the line parameters of the 
Vcm = 2 (V1 + V2 )
1
resulting transmission lines (by a 2D solver, giving the L and
C parameters), and the resulting eigenvectors for both cases. I = I + I
 cm 1 2
. (8)
V = V − V
 dm 1 2


 I dm = 2 (I 1 − I 2 )
1

L (H/m) matrix

Figure 14. Basic MTL model, showing the voltages

C (F/m) matrix V1 (trace to chassis) and V2 (GND plane to chassis)

For the PCB model, it is clear that one of the eigenvectors is

Resulting eigenvectors [w] (voltage expression)
Figure 12. Summary of the eigenvector calculation for the PCB trace
still describing a full CM mode component, and the other a
component closely related to one with a DM characteristic.
Due to the orthogonal properties of eigenvectors, there is still
a good decoupling between the PCB trace signals, and the CM
mode, resulting in only a very low CM radiated emission.
In case of the package wiring, both eigenvectors are no more
related to either a CM or DM mode description. It follows that
currents flowing mainly “on board” and have a nearly DM
characteristic, are no more described by an eigenvector mode
which is decoupled from the CM component. It follows that a
strong(er) CM signal will be generated.

V. CONCLUSIONS
In this paper, a methodology has been described to
understand the unbalanced DM in to CM conversion at PCB
level, by the use of a MTL model.
L (H/m) matrix The model calculates the voltages and currents for each of
the MTL components, and allows to estimate the CM and DM
signals, generated by a circuit.
The model can be implemented in a circuit simulator, which
C (F/m) matrix gives the possibility to estimate the CM contribution of a
system by simple calculations.
Part of this work has been performed with a grant of the
Flemish Government, HOBUfonds project EMCnsec [1].

Resulting eigenvectors [w] (voltage expression) REFERENCES

Figure 13. Summary of the eigenvector calculation for the package wire [1] A. Dekeyser and J.Catrysse, “Radiated Emission from distributed Power Supply
Structures”, report of research project EMCnsec, HOBUfonds, Flemish
Government, IWT 000173 – in Dutch
Given both eigenvectors, and the accompanying eigenvalues,
voltages, currents and related characteristic impedances for [2] T. Williams, “Controlling Resonances in PCB-chassis structures”
each propagation mode can be calculated.
[3] Cl. Paul, “Introduction to EMC”, Wiley press
An estimate of both CM and DM components can be obtained
[4] B. Audone, “Differential to Common Mode Conversion in Balanced Devices and
by calculating: Systems”, Proc. EMC Europe Wroclaw 2010, Sept. 2010