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To cite this article: S. Mala, H.K.E. Latha, A. Udayakumar & H.S. Lalithamba (2022) Green
synthesis of ITO nanoparticles using Carica�papaya seed extract: impact of annealing temperature
on microstructural and electrical properties of ITO thin films for sensor applications, Materials
Technology, 37:10, 1432-1438, DOI: 10.1080/10667857.2021.1954278
Green synthesis of ITO nanoparticles using Carica papaya seed extract: impact
of annealing temperature on microstructural and electrical properties of ITO
thin films for sensor applications
S. Malaa, H.K.E. Lathaa, A. Udayakumarb and H.S. Lalithambac
a
Department of Electronics and Instrumentation Engineering, Siddaganga Institute of Technology, Tumakuru, India; bMaterials Science
Division, Council of Scientific and Industrial Research-National Aerospace Laboratories, Bangalore, India; cDepartment of Chemistry,
Siddaganga Institute of Technology, Tumakuru, India
CONTACT H.K.E. Latha lathahke@gmail.com Department of Electronics and Instrumentation Engineering, Siddaganga Institute of Technology, B.
H. Road, Tumakuru, India
© 2021 Informa UK Limited, trading as Taylor & Francis Group
MATERIALS TECHNOLOGY 1433
50 mL of nitric acid (HNO3), and 50 mL of distilled evaporation parameters of the ITO thin film on the
water was added slowly with constant stirring and glass substrate are tabulated in Table 1.
refluxed for 3 h. The indium nitrate (InN3O9) solution The microstructural and electrical properties of the
thus obtained was placed on a magnetic stirrer for as-deposited and annealed ITO thin films were inves
18 h. To prepare the tin nitrate (N4O12Sn) solution, tigated using various characterization methods. The
1.2 g of tin (Sn) was dissolved in 5 mL of HNO3 and crystal orientation of the ITO thin films was examined
45 mL of distilled water, and the resulting solution was by XRD (Model: Rigaku, Monochromatized CuKα
stirred using a magnetic stirrer for 21 h. ITO nano radiation operated at 40 kV, 20 mA). The morphology
particles of 90:10 composition were prepared by mix and surface roughness of the ITO thin films were
ing 9 mL of indium nitrate solution, 1 mL of tin nitrate studied using an F-80 type AFM. The sheet resistance
solution, and 15 mL of fuel extract in silica crucibles of ITO thin films was measured using the four-probe
and heated at 600°C for 18 h in a muffle furnace. The method (in-situ) in the temperature range of 29–
ITO layer formed on the sides of silica crucibles was 500°C. The thickness of ITO thin films was measured
scratched using a spatula, and the powder obtained using a stylus profilometer (Dektak-XT). The gauge
was subjected to calcination at 650°C for 3 h to obtain factor (GF) of the ITO thin films was measured using
ITO 90:10 nanoparticles. a 4-point beam bending method at room temperature.
The carrier concentration and mobility were deter
mined using Hall effect measurements (Agilent
Preparation of ITO thin films using E- beam B1500A Semiconductor device analyser) by applying
evaporation a magnetic field strength of ±2.5 T.
The ITO thin films were deposited on a glass substrate
using an e-beam evaporation system (M/s Hind High Results and discussions
Vacuum Co. (P) Ltd., Model BC-300) with an electron
beam gun (EBG-PS-5 K). The green-synthesized ITO The XRD patterns of the as-deposited ITO thin
(90:10) nanoparticles were placed in four molybde films and those annealed at different temperatures
num crucibles for evaporation. The target (ITO nano are shown in Figure 1. The ITO thin films exhibit
particles) was water-cooled during the evaporation a polycrystalline structure. The XRD peaks indexed
process. Prior to the deposition, the nanoparticles at 30.47° (222), 35° (400), 38.37° (411), 44.36° (431)
were preheated at 5 mA for 5 min with the glass and 50.89° (440) are the diffraction peaks of the
substrate being covered by a shield or shutter. The as- ITO thin films corresponding to the cubic bixbyite
deposited ITO thin films were annealed at 200°C, structure of In2O3(JC-PDS 06–0416) [12,13]. The
400°C and 500°C in vacuum for 1 h. The optimized ITO thin films undergo a structural reorientation
as the annealing temperature increases.
Furthermore, the main peak intensity decreases
Table 1. Optimized evaporation deposition parameters.
and the preferential plane changes to (222)
Sl.No. Deposition parameter/condition ITO thin film
[14,15]. The absence of SnO2 peaks in the XRD
1 Base pressure 2 × 10−5 mbar
2 Working pressure 2 × 10−3mbar patterns indicates that Sn4+ ions are completely
3 Target substrate distance 13 cm incorporated into the In2O3 lattice. The crystallite
4 E beam gun voltage 5 KV
5 Evaporation current 20 mA size (D222), strain, and dislocation density were
6 Time of deposition 45 mins estimated using Scherrer’s formula [6,16–18], and
7 Thickness 100 nm
Figure 1. XRD patterns of ITO thin films (a) as-deposited and annealed at (b) 200°C, (c) 400°C, (d) 500°C.
1434 S. MALA ET AL.
Table 2. Average crystallite size, strain and dislocation density for the ITO peak (222).
Strain
Sl. Annealing FWHM(β) Average crystallite size Є Dislocation density d222
No. temperature (oC) (deg) D (nm) (10−3) δ (1016 lines/m2) Lattice parameter (Å) (nm)
1. As-deposited 1.36 6.33 4.17 1.32 10.12 0.292
2. 200 1.56 5.51 6.58 3.29 10.27 0.296
3. 400 1.07 8.04 4.04 1.24 10.07 0.291
4. 500 0.97 8.88 2.66 0.62 10.02 0.290
an increase in crystallite size was observed in the direction gradually decreases (Table 2), and it has
film annealed at 400°C and 500°C (Table 2). a higher value than that of the In2O3 powder
The ITO thin film annealed at 200°C shows (0.292 nm up to 200°C) [21,22]. This is due to
a decrease in crystallite size and increase in strain the extensive structural defects in crystallized films
and dislocation density compared with that of the annealed below 200°C. The average lattice para
as-deposited ITO thin film (Table 2) due to impro meter of the (222) crystal orientation was 10.12 Å,
per crystallization. The increase in the I222 peak for and the result was in good agreement with the
the films annealed at 400°C and 500°C results in literature [6,20].
the improvement of crystallite size due to the com
plete incorporation of Sn4+ into In3+ sites [19,20].
As the annealing temperature increases (400°C and
500°C), the interplanar spacing along the (d222)
Figure 3. 3D AFM images of ITO thin films (a) as-deposited and annealed at (b) 200°C, (c) 400°C, (d) 500°C.
MATERIALS TECHNOLOGY 1435
Surface morphological studies films were annealed at 400°C and 500°C, due to the
proper reordering of grains, decrease in strain and
The elemental composition of the ITO thin film was
dislocation density (Table 2). Generally, the carrier
analysed using energy-dispersive X-ray spectroscopy
concentration and mobility affect the resistivity of
(EDX) on the surface of the as-deposited ITO thin
thin films. The resistivity values of the as-deposited
film, and the elements were confirmed through a low
film and the film annealed at 500°C were 2.4 × 10−3
excitation EDX. Figure 2 shows the EDX spectrum of
Ωcm and 1.3 × 10−3 Ωcm, respectively. Therefore,
the as-deposited ITO thin film.
a high annealing temperature resulted in low-
The 3D AFM images of the as-deposited ITO thin
resistivity films due to an increase in carrier concen
film and the films annealed at 200°C, 400°C and 500°C
tration and mobility [14,29,30].
are shown in Figure 3. The root mean square (RMS)
The GF of the ITO thin films was characterized to
roughness of the ITO thin films increases from
determine the applicability of the material in sensor
0.923 nm (as-deposited) to 2.313 nm (annealed at
applications. The GF or strain factor of a strain gauge
400°C) due to random and irregular growth of grains
is the ratio of the relative change in electrical resis
[20,23–25]. A decrease in RMS roughness (1.872 nm)
tance, R, of the thin films to the mechanical strain, ε.
is observed in the film annealed at 500°C, which is due
A four-point bending system was designed and devel
to the increase in crystallite size and decrease in strain
oped to measure the GF [31], as shown in Figure 5.
and dislocation density [26,27]. The ITO thin film
Before measuring the GF of the ITO thin films, the
annealed at 500°C exhibits a stimulated grain growth
four-point bending setup was calibrated using a metal
and smooth surface compared with that of the film
foil strain gauge (NiCr) that had a GF of 2. The ITO
annealed at 200°C and 400°C. It was observed that the
thin films deposited on the glass substrates and
optimized sputtering and annealing process used in
annealed at different temperatures were placed
this work ensured good roughness and surface quality.
between the rolling pins of the setup. Slotted weights
were placed on the upper slab of the setup for uniform
loading. When a load is applied, the sensing material
Electrical properties
(ITO thin films) is under tension, and the strain (Ɛ) is
Electrical properties such as the carrier concentration calculated using the following relation:
and mobility of the ITO thin films were evaluated
using Hall measurements at 27°C. The changes in 4tj@tj
ε¼ (1)
mobility and carrier concentration of the ITO thin d2
films at various annealing temperatures are illustrated
in Figure 4. The carrier concentration increases with where t is the thickness of the glass substrate in mm, ∂t
an increase in annealing temperature due to the lib is the deflection in microns (µm), d is the distance
eration of electrons by the substitution of Sn4+ ions between outer rollers in mm. The change in the resis
with In3+ ions in In2O3 and liberation of two electrons tance of the ITO thin films under strain was measured
by oxygen vacancies in the reduced state In2O3 using a Keithley 6 12 digital multimeter. The GF is
[28,29]. The mobility of the ITO thin film annealed calculated using the following relation [4,32,33]:
at 200°C decreased due to increase in grain boundary, ΔR=R
dislocation density and improper crystallization. The GF ¼ (2)
ε
mobility of the ITO thin films improved when the
Figure 4. Variation in Hall mobility (µ) and carrier concentration (n) as a function of annealing temperature for ITO thin films.
1436 S. MALA ET AL.
Figure 6. Effect of strain on ITO thin films annealed at (a) 200°C, (b) 400°C, (c) 500°C.
MATERIALS TECHNOLOGY 1437
Figure 7. TCR of ITO thin films annealed at 400°C and 500°C as a function of temperature.
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