INDEX
1% rule, 232, 348
Absorption, 68-69, 99, 129, 152, 164-171,
175-176, 178,210, 228, 230,247, 251,
288-300, 387; defined, 408
-based sensors, 300-306
Absorbance, optical,3, 203-204, 344
Acoustic
absorber,154,346
path fraction; defined, 408
plate mode.SeeAPM
spectroscopy,158
streaming,136
Acoustically thick film, 91-92 96-99, 348
inertial deformation,96
Acoustically thin film, 43, 91-92, 94-97, 161,
232, 348; defined, 408
Acoustoelectric interaction, 78, 83-90, 103,
109-Ill, 153,210, 234-237, 311,372
Activated charcoal,274, 276-278, 289, 386
Active device,355; defined,408
Admittance, 46,58
Adsorption, 152, 179-191,210,225, 247,
251,257-258,266-270, 378; defined,
4O8
at liquid/solid interface,193-197
kinetics of, 266-272
nonspecific,272, 279, 312
Adsorption isotherm, 179-180,82, t 190,211,
256, 258-265
BET, 182, 187, 189,263
Freundlich, 262-263, 269
Langmuir, 193,259-262
Adsorption-basedsensors,272-281
Aging, 188,385
Air-brushing. SeeCoating methods
Alumina, 277
gel, 274
porous,275
Aluminum nitride (AIN), 140,226-227, 247,
334, 337-338, 343
Amalgam, 282, 286-287; defined, 409
Amplifier, 355, 370; defined,409
Antibody, 3, 306; defined, 409
Antigen, 3, 306; defined, 409
Antoine equation,265
APM, 4, 36-37, 39, 99-111, 117, 120-121,
141-145, 152-153, 195-196, 199-204,
222, 224, 226-227, 233, 311,332, 334,
336, 342, 347, 361,371-372,381; defined,
408
Areal mass density,68, 223
Array, sensor,145,248, 313-320, 302-303,
306, 314, 390-394
classificationcriteria, 319-320
cluster classificationof coatings,317
data interpretation,315-320
430
Arrhenius relation,248, 272
Attachment, rate of,312
Attenuation,21-22, 33, 107, 152,237, 244,
302. Seealso Insertion loss;Damping
Attenuator,356, 370; defined, 409
A W. Seespecific acoustic-wavedevice
Bacterial growth, rate of, 312
Balun, 335, 356; defined,409
Bandwidth, 77,340, 342, 356, 384; defined,
334, 410
transducer,103,341-342
BET adsorption model,263-265
Biological sensor;biosensor.SeeSensor, bio-
chemical
Bond strength, chemical, 256-257
Bovine serumalbumin, 195-196
Brillouin scattering, 2l0
Bubble
evolution, 208
trappedin surface voids,63--64
Capillaries,258, 265
Capillary
condensation, 183-184, 265, 291
force, 63,259
pressure,63, 187
Cells, 112, 129, 140,174,200, 307-308
Characterizationof material properties.See
specific property
Charge-transfer
bonding, 257
complex, 255
electrode processes, 207
interaction,282
Chemical activity,257
Chemical surface modification, 151
Chemicalvapor deposition, 115, 117,150,344,
354
Chemiresistor,237
Chemisorption (chemical adsorption), 191-194,
210, 251-252, 256, 261,263, 266-267,
271,277; defined, 410
-based sensors, 279-287
Chromatography,99, 165,230-231,237,270,
292-293, 297-299, 306, 387
Cluster; cluster analysis,
316, 319
Coating, 6
passivating,182
protective, 182
selection criteria,347-355
temperature effects, 377
Coating material, selection of,
272-279, 302,
314-315
Coating methods
air brushing,224
chemical vapor deposition,354
 Index 431

dip coating,150,224, 350-351 Dielectric loading,57

evaporation,117, 150, 197-198, 343-345, Diels-Alder adduct, 279
348-354,365 Diffusion, 151-152,155, 159-160, 167-178,
electron-beam-induced evaporation, 343, 211-212,247-248,251,270-272;defined,
345-346, 351-353 411
painting, 224 Fickian, 168-170, 175-176, 247,270-271
solution-phase,348-352 non-Fickian, 175
surface chemical derivatization,106,275, hindered, 270
352-355;defined, 420 Dilatation, 25
solvent casting,349 Dip coating.SeeCoating methods
spin casting,150,224, 349 Dipolar interactions,297
spray coating,150,224, 349 Debye, 252
sputtering,150, 198,343,354 dipole-dipole, 155,252
sublimation,224,235, 343, 353 dipole-induced dipole, 252
vapor-phase,352-354 dispersion, 252, 276
Coating-analyte interactions,248, 250--313 hydrogen bonding,252-253
Coaxial cable, rigid,383 Keesom, 252
Compensation, sensor, 234,238, 246-247, London, 252-253
375-378, 384-387,389 Direct electromagnetic feedthrough,380, 382;
Complexation,254-255,257,285 defined,411
Compressional mode or wave, 14, 19-21, 25, Directional coupler,356; defined,411
39, 59, 71-72, 91, 94,96-97, 99, 140, 153, Dispersion diagram,116
200, 233 Dispersion forces,297
Condensation, 179-180, 182-184, 258-259, London, 155
261,263,265, 294, 378 Dispersion relation, 20
Conducting polymer,176,235,237,208-209 Displacement
Conductive epoxy, 382 chemical, 284
Conductivity, 151,153-154,210,212, 223, electrical, 27
234-235,237 mechanical,12, 28
Constitutive relation, 6-18,
1 21, 24 Dissolution, 199-200
Coordination,254-255,257, 282; defined, DNA, 132, 140,196,210, 313
410 Dosimeter,242,279; defined,412. Seealso
Coplanar waveguide, 381-382 Reversibility defined, 412
Corrosion, 150-152,191,205-207,211-212, Draize test, 210
343-344 Drift, 245, 332, 376,384-387,389; defined,
Cosmicdust,199 412
Crosslinking; defined,410 Dubinin/Radushkevich isotherm equation, 265
in polymers,154, 157, 165,200-203,212, Dynamic range, sensor, 238, 244-245
275, 289, 352, 354
photo-induced,201-203,344 Elastic, defined, 412
Crystallography, 24 behavior, 155
CVD. SeeChemicalvapor deposition loading, 89, 97
moduli, 40, 156.Seealso Storage modulus,
Damping,21-22, 38-39, 67, 70-71,153,233, Loss modulus
366-367;defined,411 moduli, shear,201,229.Seealso Lam6 con-
Deactivation, 272 stants
Decay length Elastomer,156, 159, 165,247; defined,412.
evanescent,109, 127, 174 Seealso Polymer, rubbery
viscous,54, 56-57, 60, 62, 124, 132 Electrical loading.SeeAcoustoelectric
Deformation, 12 interaction
Delay line, 118,226-227,334-336,361,363, Electrical properties,152
368-369,371,382; defined,411 Electrochemicalcell, 136-138
Dendrogram,315-316 Electrochemistry,207-209,366; defined,412
Density, 6, 16, 18,33, 151, 153-154,212, 378 Electrochromic materials, 208
Depletion layer effects, 207 Electromechanical coupling coefficient,27-28,
Deposition, 6,211-212 31, 46, 83, 110-111,234,338, 340
electroless,199 Electronic nose,309, 390-391,393
from liquid, 199-200 Electroplating, 200
Desorption,266-270,378 Electropolymerization,237
thermal, 387-388 Electrostatic forces, in analyte-coating interac-
Detector, RF,357, 370;defined, 418 tions, 254
Detuning parameter, 76 ELISA immunoassay,140
Dielectric constant,154,212 Elongation, 155
432 Index
Energy, 28-34
Engineeringnotation,16--17
Enzyme,238,306,311-312;defined,412
Equationof motion, 15-16
Equivalent circuit,45, 48--62,68, 71, 83-84,
163,224, 313,360
distributedmodel,45
lumped-elementmodel,46
Mason,45
transmission-linemodel,45
Etching, 106, 115, 117,140, 199, 211,
345
plasma,198
Euler's identity,20
Evanescentfield distribution,83, 125
Evaporation.SeeCoatingmethods
Fick's Laws.SeeDiffusion, Fickian
Film
deposition,151-152,197-200.Seealso
Coating methods
growth, 181
growth, biological,200
removal, 197.Seealso Etching; Dissolution
resonance.SeeResonance, film
Filter
electrical,72, 76, 140,340, 356,368,
370-371; defined,412
physicalsize,174
SAW, 72, 76
Fixture, custom,381-382
Flatpack,381-382;defined,412
Flexuralplatewave.SeeFPW
Flory-Hugginstheory,298
Flow cell, 130, 135, 137,379
Flow-rate effects,332,378-379
Fluid flow, 181
Fourier transform, discrete,
76
FPW, 4,5, 36-37, 39, 111-145, 152-153,160,
174-175, 195,199-200,222, 224,227,
230, 233, 277,311,332, 334,336-337,
342, 347, 358,361,371,381;defined,
413
Frequency,12
counter,356; defined,413
response,357-361,363-364;defined,413
spectrum, acoustic, 4
Gallium arsenide (GaAs), 24-25,74, 87, 140,
338
Gel, 134, 174,309
Gibb's freeenergy,192,257,293,295
Glass transition,156-163,165, 168,209,212,
244, 288,377
temperatureof, 156-163,288; defined,413
Glue, 274
Hacskaylo-Levanequation,265
Harmonics,12, 40-41, 76, 99, 161, 163,370
Header,381; defined,411
Henry's Law, 263,290
Hildebrand solubility parameter, 295-300
Hooke'sLaw, 113
Hydration,of polymer layers,207
Hydrogel,275
Hydrogenbonding,155, 252-253,273,275
Hydrophilic, 62--63,195,352; defined,413
Hydrophobic,62-63, 195,278,291,352;
defined,413
Ideal GasLaw, 296
constant,257
IDT, 72-78, 102, 117,226,335-337, 339-342,
347, 361,368,370-375, 381,383; defined,
414
designing, 339-342
Immobilization,225, 230,273-274, 306,309,
312
lmmunoassay, 140, 306-308, 311-313; de-
fined, 413
Impedance matching, 370,383
network,356; defined,414
Impurity scattering,21
Inelasticity,233
Insertionloss,361,368,371-373, 383; de-
fined, 414
Insonication, 139-140
Instrumentation,355-375
Interdigital transducer.See IDT
Interference,75, 96
common-mode,385,410
Interferences,sensor,239, 284,320
lntermolecular forces,154
Inversionsymmetry,22
Irreversibility (chemical),191,241-245,248,
252, 256, 259,269,273, 279,285-287,
289
Kelvin equation, 184,265
Kinetic diameter(of molecules),273
Kinetic effects(mixing, pumping),113,
134-140
Kinetics, chemical,191, 193, 195,207,241,
244-247, 251,266--272, 288,342, 377,
385; defined,414
Knudsen effusion,270
Lamb wave,113.SeealsoFPW
Lam6constants,17-18,94-95. Seealso Elastic
moduli, shear
Langmuir-Blodgettfilm, 197, 209-210, 224,
235, 312,349-350;defined,414
Langmuir-Hinshelwoodmodel,269-270
Laser ablation,199
Levenspiel unreacted-core model,271
Lewis acid,283
Lift-off process,345; defined,414
Limit of detection(LOD), 243-244;defined,
414
Linear dynamicrange(LDR), 245; defined,
415
Linear-regressionanalysis,299
Lipid bilayer,209
film, 160, 209-210,309
Liquid crystals,209,314
Liquid loading, 38-39,54, 59, 102-103,
106-109,112, 124-131,145,226,233,
366, 381

Lithium niobate(LiNbO3), 18, 24-25, 74, 80,
85, 87, 110,234-238, 338
Lithium tantalate(LiTaO3), 238
London forces.SeeDipolar interactions;Dis-
persionforces
Loss modulus,66, 68, 91,156, 163,201,203
Loss. See Attenuation;Insertionloss; Damping
Love wave, 153
sensor,141
LPCVD (Low-pressurechemicalvapor deposi-
tion). See Chemicalvapor deposition
Lysis, 140
Mass
flow rate, 154,242
loading, 5, 52, 80, 104-106, 119-123,
151-152, 155, 169, 181,198, 200,
209-210, 225, 230, 232, 234-237, 285,
292, 302, 366
Mass sensitivity, 152,225-226, 235, 243
APM device, 104-107,109, 111
FPW device, 120-122
SAW device,79-82
Table of, 227
TSM device,43--45,193,207, 226
Material properties
acoustoelectric,87
adsorbentmaterials,274
adsorptionon activatedcharcoal,276
density, 18
elastic moduli, 94
piezoelectric,24
quartz. SeeQuartz
SAW propagation,ST-quartz,95
sorption in naturalrubber, 289
stiffness, 18
wave velocities,20
Materials modification, 152
MaxweUian fluid, 106-107
Meat freshnesssensor,210
Mechanicalimpedance,45, 51, 69, 96
Mechanicalproperties
density, 18
stiffness, 18
Melting (of polymers), 157, 160,244, 377
temperatureof, 157-163,289; defined, 415
Membrane
biomaterial,192, 306-308, 309, 311, 314
mechanical,111, 115, 117,119, 121,128,
131-132, 137, 140, 174,342
separation,150, 167,178, 182
Metallization, 342-345
Microbalance,4, 6, 39,44, 66-67, 89, 106,
191,207, 210, 222
Microfabrication,222, 342-346
Microflow, 139
Micromachining, 113-115,336
Microsensor,3
Mixing
acousticmodes,227
analyte/coating,288, 294, 295
fluids or gases,113, 134, 139-140
frequencies,134,376
Mixtures, 153,297, 309,319-320,345,390-391
Index 433
Mode hopping, 372-373
Molecular sieve(s),270, 274-275, 277-278
Molecular size, of adsorbate,171
Monitoring
chemicalprocesses.See specific process
materialprocesses.See specific process
Monitoring, real-time, 361-375
Monolithic, 393
Monomer, 154,288-289, 354
Motional impedance,46-57, 59, 63, 69-70
Nanotribology,181
Network analyzer,313, 356,358-359, 362; de-
fined, 416
Newton'sFirst Law, 16, 113
Newtonianfluid, 39, 54, 56, 59, 106-109
Noise, 121-122, 145,226, 244-245, 302-303,
337, 341,347, 362, 376,382-384, 389; de-
fined, 416
Non-slip boundarycondition. See Slip, interra-
cial
Normal boiling-point model,293-295
One-portdevice,36, 333-334, 336, 358-360,
363, 365-368, 380, 383
Organo-clays,278
Oscillator, 5, 27, 29, 77,109, 127, 142,245,
342, 391
circuit (loop) 4, 36, 39,44, 81, 109, 118,
121,311,335,341,361,363-374,376,
383
Oscillator, synthesized,357, 362, 372, 374;de-
fined, 420
Ozone,241,279, 286-287
Packaging,346, 377,379-382
Packedbed, 274
Palladium(Pd), 282,286-287, 343
Parallelresonantfrequency,48, 360, 366;de-
fined, 416
Parametricrepresentation
attenuation andvelocity, 34-35
SAW response,acoustoelectric,89-90, 305
SAW response,polymeric coating, 165,305
Particle
depositionand removal 197-200
formation, 210
sizing, 199
Partition coefficient, 160, 164, 176,210-211,
230-231,248,291-300, 309, 315, 377
Partitioning,242, 279,288, 293; defined,416
Passive device,355; defined,416
Patternrecognition,248, 313-320, 390-394
Permeability,288, 354,380
Permeation,155, 167, 178-179,247
Permittivity, 24, 110,223
Perturbation,22, 31, 34
FPW, 119, 133-134
SAW, 78
Pharmaco-chemical animal tests, 210
Phase
shift, 368
shifter, 357, 370;defined,416
slope,374; defined,417
434 Index
Phase transition, 181,209-210, 373
first-order, 157, 160.Seealso Melting
second-order, 157, 160. Seealso Glasstran-
sition
Phasevelocity,20, 30-31, 33, 115, 117
Phase-lockedloop, 373-374; defined, 417
Phonon scattering, 21
Photolithography,342,344-346
Photoresist, 198, 200-203, 344-345, 349;de-
fined, 417
Phthalocyanines, 235-237,248, 282,284,
353
Physisorption (physical adsorption), 179-191,
193, 251-252, 266-267,270,274; defined,
417
materials for 274-276
-based sensors, 277-279
Piezoelectric,defined,417
constitutive relations,24
coupling coefficient.SeeElectromechanical
coupling coefficient
material, 10, 45, 71-72, 74, 78,83, 87, 110,
117, 222, 225,234, 238,331,333,
337-340, 375-376
material,thin film, 115, 117,121,140, 247,
277, 337-339,342,376
point groups,24
stiffening, 28, 30; defined,417
stress constants, 24-25
transduction,36, 39, 48, 74, 102, 117, 121,
277, 337
Piezoelectricity,4, 10, 22-31,109, 117, 225,
234, 238, 247,277, 306,337-338, 375
Piezoresistivity,338
Plasticization,68, 99, 155, 164-167,171,244,
291,302
Platinum(Pt), 136,248,278, 282,284,
286-287, 343
Pogopin, 382; defined,417
Poisson'sratio, 17, 117
Polanyi adsorption potential concept,265
Polarity, 273,275
Polarization
electrical,22
mechanicalwave,19-20,30
Polymer,defined,154
glassy,92, 97, 156-159,176,232,247,
288-289
porous, 176,274
properties.SeeCh. 4.2, or specific property
rubbery,69, 92, 97,122,247,288-289, 291,
300, 348
table of materials, 421-427
Polymer sorption isotherm, 290-293
BET, 290-291
FIory-Huggins,290-291
Henry's Law, 290-291
Langmuir/Freundlich,290-291
Polymerization, 151,200-204,212,275
photo-induced,151
Poresize, 152, 181-191,259, 273-275
distribution, 152,181-184,188,259,273
Porosity,63, 66, 178-179,182-184,187-188,
258-259, 265,270,273-275, 380
Powders,274
Power,28, 31-34
consumption,sensorsystem,394
meter,357; defined,417
Power-lawmodel,269-270
Preconcentration; preconcentrator,
248,386-389
Pressure,224
effects,63, 112, 127-128, 153,156, 181,
224, 245, 267, 270,290,332, 334,375,
378, 382,385
Pressure,partial, 168-171,179-184,193,
257-263, 267,269, 296,378; defined,416
Pressure, saturationvapor,179, 182, 187, 258,
265, 273-274,296,314, 377; defined,419
sensing, 128,233
Principal-componentanalysis(PCA), 319
Printed-circuitboard,381
Process
characterization,209
monitoring, 197-212
Propagationfactor, complex,34, 71, 85
Pumping
in sensor systems, 387,389
with acousticwaves,113, 134-140
Pure-mode direction, 20-21, 72
Pyroelectricity,238; defined,417
Q. SeeQuality factor
QCM. SeeTSM; defined,418
Quality factor, 181,334, 342; defined,418
Quartz,4, 18, 24, 39, 43, 46, 48, 101, 110,
227, 234,247, 333,33%338, 346,348,
371,375, 378
AT-cut, 39, 40, 102,227, 334,338,375;
defined,409
BT-cut, 338; defined, 410
fundamental properties of 18, 24, 40,44, 49,
57, 74,87, 91, 95, 227,234, 341,376,378
ST-cut,74, 81, 87,89, 91-92, 95, 97, 102,
161,227, 234,238,247, 338,340-341,
375-376;defined,419
surface adsorption/chemistry of, 87, 106,
111, 181, 196, 199,237,279, 309,342,
351,352
Quasi-modes,21
Raoult'sLaw, 263, 290,296
Rayleigh
principle, 30, 43
wave, 71-72,340.Seealso SAW
Rayleigh,Lord, 71
Receptor-proteinpair, 306
Reciprocity,74
Redox (oxidation/reduction) reactions,
193,
208, 237,285-287;defined,418
Reduced notation,16-17,24
Regeneration,284
Regularsolutiontheory,295-300
Relativehumidity, 205, 237,239,245-246,
248, 276-277,285,312; defined,418
Relaxation
effect; response, 85, 156-157, 175-176,
209,
289, 377
time, 106-107,110, 131-132,156-157
 Index 435

Reliability, 238, 245-246,320 Sensor, defined, 1

Remote sensor operation, 382-383 amperometric, 3
Repeatability,245-246,392 biochemical,2-3, 112, 117,200, 230,234,
Reproducibility,245-246,277,311,347, 238-239,246,251-252,254, 299,
349-350,352 306-313
Resolution, 2 chemical, 2, 4,38, 165,234,25l, 299, 318
frequency,356,362-363 enthalpimetric, 238
mass, 44,81,106, 193 force, 112
mode, 101 humidity, 232
spatial,345, 352,390 Love wave, 14l
Resonance,39-43, 45--46,57, 101;defined,418 optical, 3
film, 67, 69-71, 99, 161-163,167,232, 377 pH, 311
Resonator,226-227,333-335,347, 367; potentiometric, 3
defined, 418 SH-SAW, 311
bulk wave,333 surface transverse wave (STW), 141
SAW, 334,336-337,342, 361,364,371, Taguchi, 2
393-394 thin-film compressional wave, 140
TSM, 39. Seealso TSM thin-rod, flexural-wave,141
Response time,238,246-247.Seealso Kinet- vapor (chemical vapor), 4, 68, 121-123, 139,
ics, chemical 222, 229-230,232, 235,277, 318, 378,
Reversibility (chemical),38, 179,209, 229, 384, 389, 393
238, 241-243,245-246,248, 251-252, viscosity, 107, 132,145
255, 274, 279, 282,284-287,307-308, Sensor array.SeeArray, sensor
311,314 Series resonant frequency, 46-48, 51-52,
Rheology,233-234 56-57, 360, 366-367;defined, 419
SH-APM. SeeAPM; defined, 419
Saturationvapor pressure, defined, 419. See Shear,14
also Pressure, saturationvapor deformation,156
Sauerbrey equation, 44, 52 wave, 39, 41, 71
SAW, 4-5, 7, 36-37, 39, 71-99, 100, 117, Signal-to-background ratio, 380
141-145, 152-154,165, 168,170-171, Signal-to-noise ratio, 121-122, 140,244,337,
174-175, 178, 181, 185-187, 191-194, 347, 384
197-199,205-206,210, 222,224-227, Silanization,272-273,275-276,278, 307-308,
229-230, 232-234,236-237,240, 352
248-250,270,277-282,284-285,294, Silica, 277
297, 299-302,304-305,311, 318,320, gel, 274-275
332-338,341-342,347, 358,361, porous,278
363-364,367, 371-372,375, 378, Silicon (Si), 115,277, 338,371,376
382-383, 391-392;defined, 419 Silicon nitride (Si3N4),115, 117, 119,134
resonator,198,227, 333-338, 341-342, Simultaneous measurement
358-359,361,364, 371,393 acoustoelectricand mass-loading effects,89
Scattering parameters (S parameters),358,361 electrochemical current and surface mass
Scholte wave,126 change,207, 366
Selectivity, 2-3, 38, 129, 145, 167, 182,223, of multiple analytes,314
228, 232, 237-241,243,248,251, reflected and transmitted RF power, 357
255-256,273,275, 278-279,284-287, static and dynamic glass transition tempera-
289, 299, 302-303, 307-308,309, ture, 160
311-320,347-355,389-390 velocity and attenuation,107,200-201,306,
Self-assembledmonolayer(SAM), 192-193, 314, 365
208, 224, 285,349-351,354;defined, 419 SiO2.SeeQuartz;Silica
Sensitivity, 2,38, 200,223, 230, 238-239,243, Slip, interfacial, 62,181, 196,209
377; defined, 419 Sol gel, 184, 187-188, 275,277-278
adsorption-based sensors, 278 Solubility, 164,288
biochemically based sensors, 307-308 parameters.SeeHildebrand solubility para-
chemisorption-based sensors, 286-287 meters
gravimetric,81, 104, 120, 122, 151, Solvation,293
225-227.Seealso Mass sensitivity parameters, 299
gravimetric and density to, 127-129 Solvatochromic parameters, 298
gravimetric, comparison, 141-145 Solventcasting,SeeCoating methods
pressure,128 Solventeffects,207
sorptive polymer-based sensors, 303 Sorption, 159;defined, 419
to elastic modulus changes, 232 polymer, 288-300
to stiffness changes, 230 isotherm,245.Seealso Polymersorption
to temperature changes, 232,234 isotherm
436 Index

Spin TSM, 4, 7, 36--37,39-71, 54, 121,141-145,

casting.SeeCoating methods 153, 160, 176--177,179-181,187, 191,
coating.SeeCoatingmethods 193, 195-201,205,207,209-211,222,
Spraying.SeeCoating methods 224-227,230,232, 237,277-279, 282,
Sputtering.SeeCoating methods 285, 294, 302, 309,311,332-333,338,
Stability, 200,238,245-246,334,369 347, 352,358-360,365, 367,371,375,
thermal, 145 381,383; defined,420
Standingwave,41,333, 336 Turbulence, 154,379
Stationaryphase,297 Two-port device,36-37, 334-338,341,361,
Stiffened elastic constant,
30 363, 368---375,380,382-383
Stiffness,16-18,28, 223,230
Storagemodulus,66, 68, 91,156, 163,201, Vacuum deposition. SeeCoatingmethods,
203 evaporation;Electron-beam-induced evapo-
Strain, 12-18,22, 25 ration; Sputtering; Sublimation
Stress,12-18,212 Valve(s), 170, 385-386,389
Sublimation.SeeCoatingmethods Van der Waals
Superconductivity,209-210 equation,17l
Superlattices,209-210 interactions,179, 192-193,251-252, 257,
Surface acoustic wave,defined,419.Seealso 35O
SAW Vanadiumoxide,238
Surfacearea,152, 197, 243-244,247,258, Vapor sensing.SeeSensor,vapor
263-265, 271-274,387 Velocity, phase,40
of film, 181-191,211 Virus, 200, 307-309
Surface chemical derivatization (functional- Herpes,309
ization), defined,420.Seealso Coating Viscoelasticloading,66, 68, 89, 152
methods Viscoelasticity,151-152,155, 157-158,
Surfactant,195-196,208,21l 164-165,200,209,212, 223,228-234,
Swelling, 164-165,176,297 244, 302,373; defined,420
Symmetry,23, 25 Viscosity,6, 21-22, 153-155,201,209,223,
Synchronous 230, 271,309,31l; defined,420
frequency,74 Viscous loading,60, 107-108,131-133
modulationanddetection,385 Volcanic eruptions,199
System Voltmeter,vector,357, 362,370,372; defined,
design 384-393 420
system sensor, 394
Wave
Temperature equation,18-21,25-28
coefficient, 133,234, 238, 247,337-338, excitation,22, 27, 40, 69, 71-72, 74, 117
346, 375-377 path;defined,420
control, 233-234,238,375-378 propagation, 10-35
effects,232,238,247-250,272, 332,338, velocity, 6
375-378, 385 velocity in liquid, 153
Tension,18 Wavelength,12
Texture, surface, 59-66, 153, 198,212 Wavenumber,12, 34
Thermal expansion, 377,381 Wavesin solids
Thermal management, 381 bulk, lO, 21-22
Thermoelasticity,21 compressional,20
Thicknessshearmode.SeeTSM plate, lO
Thin-film interference,69 shear,22, 27,30
Time-temperature superposition principle,156 surface,10
Transduction,1 Wire bonding,382; defined,420
Transitionmetal,235,237,241,254-255,275,
277, 278,282-287,353 Young's modulus,17, I 17
Transmissionline, 383
Transport Zeolite, 274-275,277
phenomena, 113, 134, 139, 208,275 Zinc oxide(ZnO), 18, 24-25, 27-28, 117,119,
throughfilms, 247,270-272,288 121,134, 227,238,247,277-278,
Triple-transitecho/reflection,346 337-338, 371,376
Trouton'sRule,294 Zinc oxide-on-silicon,235, 277,371,376