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Training Handbook

SA4. SPECIAL PROCESS

Manual No.: TCT-0331 For Training Only Rev.: 0/12-03-2012


SA4. SPECIAL PROCESS
FOREWORD

This training handbook “SA4. Special Process” is developed and prepared for Aircraft Structure Technician / Engineer who will responsible to
perform maintenance task and activities in according with the specified requirements of the Aviation Regulations and to meet the Authority
requirements.
Base on the above mention, this hand book should be used only for training purposes and has been customized to GMF AeroAsia.
It must not be used as a reference at any time. For any aircraft related tasks, the updated aircraft manuals should be consulted. Any
suggestion for improving the content of this handbook should be addressed to GMF AeroAsia Learning Services.

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SA4. SPECIAL PROCESS
TRAINING OBJECTIVE

The objective of this training are:


1. Improve skill and technique of aircraft structure engineer within environment of work.
2. Be able to perform aircraft maintenance activities with a specific aircraft and tools.
3. Understands a handle safety and precautions in area of responsibility.

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SA4. SPECIAL PROCESS
REFERENCES

The following references materials have been used for the development of this Training Handbook:
1. Structure Repair Manual - Boeing.
2. Structure Repair Manual - Airbus.
3. SIFCO Process Manual.
4. SOPM – Boeing
5. ASTM International, In B374-96 (2003) Standard Terminology Relating to Electroplating.

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SA4. SPECIAL PROCESS
TABLE OF CONTENT
SUBJECT
1. FLAP PEENING
1.1. GENERAL
PEENING INTENSITIES
APPLICATION OF FLAP PEENING
SAFETY PRECAUTION
1.2. EQUIPMENT AND MATERIALS
FLAP PEENING EQUIPMENT
ALMEN TEST STRIPS
ALMEN TEST STRIP HOLDERS (MAGNETIC)
ALMEN TEST GAGE
POWER TOOL
TACHOMETER / STROBE LIGHT
MAGNIFYING GLASS 10X
1.3. FACTORS AFFECTING INTENSITIES
1.4. PREPARATION
ASSEMBLE THE PEENING WHEEL COMPONENT
ALMEN TEST PROCEDURES
1.5. PEENING PROCEDURES
PREPARATION
PEENING

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SA4. SPECIAL PROCESS
2. TAPER-LOK
2.1. GENERAL
NOMINAL TAPER-LOK
2.2. HOLE PREPARATION
USE OF HAND REAMER
TOOLS AND MATERIALS
HOLE REAMING
2.3. INSTALLATION
INSTALLATION OF TAPER-LOK BOLTS
2.4. INSPECTION AFTER INSTALLATION
REMOVAL PROCEDURES

3. COLD WORKING
3.1. GENERAL
STANDARD APPLICATION EXPANSION RANGE
3.2. TOOLING SELECTION
SLEEVE SELECTION AND INSTALLATION
3.3. PROCESS
COLD WORKING PROCESS
INSPECTION

4. ANODIZING
4.1. GENERAL
APPLICATIONS

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SA4. SPECIAL PROCESS
4.2. COMMON OF ANODIZING METHODS
CHROMIC ACID ANODIZING
SULFURIC ACID ANODIZING
ORGANIC ACID ANODIZING
BORATE AND TARTRATE BATHS
4.3. PRE-TREATMENT ANODIZING
PHOSPHORIC ACID ANODIZING

5. BRUSH PLATING
5.1. GENERAL
USES OF BRUSH PLATING
TYPICAL OPERATION USING BRUSH PLATING PROCESS
5.2. BRUSH PLATING EQUIPMENT
POWER PACKS
PLATING TOOLS
SOLUTIONS
OPERATORS
AUXILIARY EQUIPMENT
TURNING ACCESSORIES
5.3. PREPARATORY AND PLATING TOOLS SELECTION
SELECTING THE PROPER PREPARATORY TOOLS
STANDARD BRUSH PLATING TOOLS
5.4. PLATING TOOL COVERS

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SA4. SPECIAL PROCESS
TYPES OF COVER
COVERING PLATING TOOLS
PREPARATION OF COTTON
5.5. MASKING
TAPES
PAINTS
5.6. BRUSH PLATING PROCESS PREPARATION
PREPARE THE PART FOR PLATING
SET-UP OF BRUSH PLATING EQUIPMENT
PLATING THE PART
SETTING UP A JOB – LONGER PREPARATION
5.7. SELECTING PLATING SOLUTIONS AND DEPOSITS FOR APPLICATION
DEPOSIT USES
6. PLATING
6.1. GENERAL
ELECTROCHEMISTRY FUNDAMENTALS
SURFACE PREPARATION
ELECTROLYTIC METAL DEPOSITION
ELECTROLYTE
TYPES OF ELECTROPLATING PROCESSES
TYPES OF METAL COATINGS
RELATED PROCESS
CONCLUSIONS

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SA4. SPECIAL PROCESS
6.2. LOW HYDROGEN EMBRITTLEMENT CADMIUM PLATING
MATERIALS
SURFACE PREPARATION AND CONTROL
ANODES
PREPLATE TREATMENT
PLATING PROCEDURE
POST PLATE TREATMENT
6.3. LOW HYDROGEN EMBRITLLEMENT CADMIUM-TITANIUM ALLOY PLATING
MATERIALS
TANK AND SOLUTION PREPARATION
ANODES
PREPLATE TREATMENT
PLATING PROCEDURE
POST PLATE TREATMENT
QUALITY CONTROL
6.4. BRIGHT CADMIUM PLATING
MATERIALS
SOLUTION PREPARATION
STANDARD PLATING PROCEDURE
BRUSH CADMIUM PLATING
QUALITY CONTROL
6.5. HARD CHROME PLATING
MATERIALS

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SA4. SPECIAL PROCESS
PREPARING OF SOLUTION
PLATING SOLUTION SLUDGE REMOVAL
PREPARATION OF PARTS
PLATING PROCESSES
POST PLATE BAKING
CHROME PLATE RUNOUT
QUALITY CONTROL
6.6. ELECTRODEPOSITED NICKEL PLATING
MATERIALS
PREPARATION OF SOLUTION
NICKEL PLATING SOLUTION PURIFICATION
PLATING PROCESS
NICKEL PLATE RUNOUT
QUALITY CONTROL
6.7. ELECTROLESS NICKEL PLATING
MATERIALS
EQUIPMENT
PREPARATION OF SOLUTION
PREPARATION OF PARTS
ELECTROLESS NICKEL PLATING PROCEDURE
QUALITY CONTROL

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SA4. SPECIAL PROCESS

1. FLAP PEENING

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SA4. SPECIAL PROCESS

1.1. GENERAL

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SA4. SPECIAL PROCESS
lap peening is an ancient cold work usually used when it is necessary to pre-stress the surface of the component or part of the structure
F after being treatment like: grinding, sanding, machining, etc. This procedure will improve the fatigue performance of the component. This
procedure describes flap peening of relatively small areas of metal surfaces for the purpose of imparting a compressive layer. This
compressive surface stress strengthened the material, improving
resistance to fatigue fracture and stress corrosion cracking. For
small and/or hard to reach surfaces, the captive shot method is
more convenient and effective. The shot is integrated into a
rotating brush or flap. The spinning brush or flap is held near the
surface so that the captive shot strikes the metal surface with each
revolution. This procedure is suitable for in-situ repair work, the
repair of small areas up to 10000 sq.mm (15.5 sq.in). Holes down to
25 mm (0.984 in.) diameter and fillets radius. Flap Peening is not to
be used on al-clad aluminum alloys, plated, primed or painted
surfaces on steel, titanium or aluminum alloys. All coatings must be
stripped prior to flap peening. To do the peening, a flexible flap is
secured in a mandrel. The flaps have shot particles of tungsten
carbide bonded to them. The mandrel is Fitted to a suitable power
tool, and then rotated at a specific speed. Peening flaps must be discarded after 30 minutes use or after the loss of 20 % of the tungsten
carbide balls if this occurs sooner. Condition new wheels, If you replace a wheel during a peening operation, it is not necessary to do the
intensity procedure again.

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SA4. SPECIAL PROCESS
PEENING INTENSITIES
(a) Peening Intensities except Wing Structure.
The following intensities are only to be used when the intensity is not specified in a repair instruction.

(b) Peening Intensities for Wing Structure


For the wing structure outboard of the wing root joint, the following intensities are only to be used When the intensity
is not specified in a repair instruction.

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SA4. SPECIAL PROCESS
APPLICATION OF FLAP PEENING
Application of flap peening includes:

• Landing gear assemblies

• Wing structures and non wing structures

• Jet engine support members

• Peening after grinding

• Peening before plating

• Peening of surfaces subject to stress corrosion

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SA4. SPECIAL PROCESS
SAFETY PRECAUTION
The flap peening procedure can be dangerous. You must obey the warning that follow to make sure you do not cause injury or damage.
WARNING : YOU MUST WEAR APPROVED SAFETY CLOTHING WHEN YOU DO FLAP PEENING.
THIS PROCEDURE CAN BE DANGEROUS.
WARNING : EYE PROTECTION MUST BE USED AT ALL TIME DURING FLAP PEENING OPERATIONS..
WARNING : OBEY THE MANUFACTURER’S INSTRUCTIONS WHEN YOU USE THE CLEANING MATERIALS
AND THE OTHER ASSOCIATED MATERIALS SPECIFIED IN THIS PROCEDURE.
THESE MATERIALS ARE DANGEROUS.

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SA4. SPECIAL PROCESS

1.2. EQUIPMENT AND MATERIALS

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SA4. SPECIAL PROCESS
To do this procedure you need the equipment that is detailed below:
• Flap peening equipment.

• Almen test - strip type A, C or N.

• Almen test - strips holder (magnetic).

• Almen test gage.

• Power tool - The power tool you use must be capable of maintaining the required speed within plus / minus 5%.

• Tachometer.

• Magnifying glass 10x.

• Abrasive paper - 320 to 400 grit aluminum oxide or silicon carbide.

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SA4. SPECIAL PROCESS
FLAP PEENING EQUIPMENT
• Roto / Flap Peen flap Assembly.
A captive shot flap technology using high strength resin to bond tungsten carbide shot to a flexible polymeric flap.
This provides a cleaner, more precise method than loose shot “blasting.” Plus, the uniform 330 shot size contributes to consistent results.
Two polymeric flaps are bonded together with a specially formulated adhesive matrix for easy placement in a flap mandrel.

Flap peening wheel dimension; 1 x 2 in, 9 / 16 x 1 -1 / 4 in and 9 / 16 x 1 in.

• 9/16” x 1” flap for use with mandrel 7212. Single row of 330 shot. Suggested for 1/2” to 3/4” diameter hole peening.
• 9/16” x 1-1/4” flap for use with mandrel 7210. Double row of 330 shot. Suggested for 3/4” to 1-1/4” diameter holes and some smaller
flat surfaces.
• 1” x 2” flap for use with mandrel 7211. Double row of 330 shot. Suggested for large, flat unobstructed surfaces. If increased coverage is
needed, up to five 1” x 2” flaps can be loaded into the 7211.

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SA4. SPECIAL PROCESS

Mandrel and sleeve assembly

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SA4. SPECIAL PROCESS
ALMEN TEST STRIPS
John Almen of the Research Laboratories Division of General Motors developed such a method. Adopted by the SAE (Society of Automotive
Engineers), the Almen Scale of Peen Intensity measures the curvature of a standardized steel strip when peened on one side.
Three Almen strip thicknesses are available:
• Almen “A” generally used for most measurements
• Almen “C” for higher peening intensities
• Almen “N” for lighter peening intensities
The Almen strip is measured in an Almen test gage before and after peening. Curvature after peening is measured in thousandths of an inch
over a specified span. This number is used to specify the Almen intensity. Almen test strip type A, C, or N are made from SAE 1070 Cold Rolled
Spring Steel square edge. Those strips completed finishing Blue temper
( or bright ) uniformly hardened and tempered to HRc 44-50. The flatness of strips is ± 0.0015 inch

Note: all dimensions are in inches

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SA4. SPECIAL PROCESS
ALMEN TEST STRIP HOLDER (MAGNETIC)
The magnetic grip of the Almen Strip Holder eliminates hold-down screws for easier measurement. The same Almen strip can be used to
measure intensity and then used to check for saturation.

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SA4. SPECIAL PROCESS
ALMEN TEST GAGE
The Almen Gage Jr. in an analog style that's ideal for general purpose shot peening. The Almen Gage Jr. has a 1 3/4" dial indicator with .0005
graduations for easy reading of the Almen strip arc height. The Almen Gage Jr. also has many of the same features of the Advanced Almen
Gage including: precision machining, durable hard coat finish, patented magnetic grip, and stem mounted indicator.

Arc height of Almen test strip on test gage

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SA4. SPECIAL PROCESS
POWER TOOL
The power tool you use must be capable of maintaining the required speed within ± 5 % during peening operation, completed with air
pressure regulator which could arrange the speed of the power tool. The wheel speed can be measured with a tachometer, strobe light or
equivalent. Specification of the power tool is 5k RPM - 0.4HP - 90 PSI. Electric motor also can be used with the same specifications.

Pneumatic Motor Pistol Grip Pneumatic Motor Straight

Air Pressure Regulator Electric Motor

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SA4. SPECIAL PROCESS
TACHOMETER / STROBE LIGHT
Tachometer allows accurate measurement of RPM in almost any environment simply aim the highly-visible light beam at a reflective mark
placed on a rotating device, push the button and the RPM reading is immediately displayed. No contact with the shaft or wheel is necessary.

MAGNIFYING GLASS 10x

Loupes 10 x Magnifying Glass 10 x

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SA4. SPECIAL PROCESS

1.3. FACTOR AFFECTING INTENSITY

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SA4. SPECIAL PROCESS
The results of proper technique when using Roto Peen Flap Assemblies, three factors affect performance and dictate the amount of peening:

Flap rotation speed


Flap rotation speed is the most important factor affecting peening intensity. Increasing the speed of rotation increases the intensity.
Decreasing the speed decreases the intensity.

Peening time or duration


Peening time or duration controls surface coverage. Most peening specifications are stated to Almen intensity at 100 % coverage or
“saturation.” This means the entire surface is covered with peening impressions. Saturation is also defined as the point at which doubling the
peening time will produce less than a 15% increase in Almen intensity.

Mandrel height (Flap deflection)


Height of the mandrel above the surface controls flap deflection. And maximum deflection provides the best results. The point of maximum
deflection is also the easiest to maintain. It is the point at which the mandrel, parallel to the work surface, does not quite touch the surface. If
the mandrel is too high, there will be an uncomfortable vibration or bounce in the tool. To insure uniform peening coverage, use a circular or
oscillating motion over the entire area. 10X magnifier and re-peen any area that does not show full coverage. All areas must be covered with
peening impressions.

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SA4. SPECIAL PROCESS

Flap Deflection (mandrel height)

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1.4. PREPARATION

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SA4. SPECIAL PROCESS
Before you do the Peening procedure you must do a test. This test is done on an Almen test strip. The purpose of the test is to establish the
applicable rotational speed in revolutions per minute (r.p.m.) at which the flap must be turned. This speed is determined by measuring the
achieved Intensity (Arc Height) on the test piece. The repair procedure will give the intensity to be achieved. The Intensity will be given either
as a Range (for example: 0.016 − 0.020 A2), or a single dimension on which a tolerance of plus 10 % is permitted.

ASSEMBLE THE PEENING WHEEL COMPONENTS


If the wheel is new, its shot could have adhesive on it. To be sure the adhesive is gone before you use the wheel, clean the surface of the shot
with 320-400 grit silicon carbide or aluminum oxide paper.
Surface finish in areas to be peened must be the design value or smoother unless overhaul instructions specify a pre-peening surface
roughness.
Unless larger radius or chamfers are specified by overhaul instructions, give all sharp edges and corners a radius to prevent edge roll over and
bulges which are causes for peened part rejection.
If magnetic particle or penetrant inspection is specified, do it before shot peening. But, this does not prevent or replace such examination
necessary as a final operation (such as magnetic particle examination after nickel or chrome plating).
Areas of parts to be shot peened must be free from surface coatings such as paint, oil, grease, plating, chemical treatments, or corrosion if
necessary.

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SA4. SPECIAL PROCESS

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SA4. SPECIAL PROCESS
ALMEN TEST PROCEDURES
(1). Adjust the Arc Height measurement tool (Almen test gage) to zero. Do this with the applicable unpeened test strip.
Check the zero setting with both sides of the test strip.

(2). Mount the applicable Almen test strip (A or N) in a test strip holder.

(3). Fit the selected flap into the mandrel. Make sure that:
- The flap is a tight fit in the mandrel; adjust the jaws of the mandrel if necessary. If you do not do this the flap could,
in subsequent steps, fly out and cause injury or damage. The flap is correct in relation to the rotation of the drill
machine.
- The flap is symmetrical in the mandrel.

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SA4. SPECIAL PROCESS
(4). Put the mandrel with the flap into the power tool. Adjust the r.p.m. of power tool to the speeds that follow.
Make the adjustments slowly using a tachometer or an equivalent machine. The speeds are:
- 2500 r.p.m. when you are using the large flap.
- 4800 r.p.m. when you are using the small flap.
These speeds are recommended for starting the test, you may to increase or decrease them in subsequent tests.

WARNING : DO NOT LET THE SHOT PARTICLES PASS OVER THE EDGE OF THE TEST STRIP.
THEY CAN CAUSE THE TEST STRIP TO FLY OUT AND CAUSE INJURY OR DAMAGE.

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Corrected Intensity VS Peening Wheel Speed

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SA4. SPECIAL PROCESS
(5). With the mandrel rotating at the applicable r.p.m. position the mandrel and flap over the test strip.
Make sure that the mandrel is parallel to the test strip surface. Lower the mandrel towards the surface until:
- You can feel a firm resistance to further downward movement
- You can hear the shot striking the surface.
- Both rows of shot are striking the surface.
Continue this step moving the flap over the entire surface of the test strip so that you achieve full coverage do this for 1 minute.
NOTE: Pressure against the work surface is a result of the distance between the mandrel and the surface.
This distance will cause the flap to deflect (bend).
Experience has shown that the maximum flap deflection is the easiest position to use.

(6). Move the flap away from the test strip and stop the power tool.
(7). Put the test strip on the Almen Test Gage with the unpeened surface towards the probe on the Dial Indicator (D.I).
NOTE: the reading on the D.I. Multiply this reading by the factor 0.77
(for example, D.I. reading 0.012 mm X 0.77 = 0.00924 mm), plot the result on a graph.

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SA4. SPECIAL PROCESS

(8). Repeat steps (5) thru (7) with the same test piece, but measure the Arc Height step (7) at 30 second intervals.
Do this until the Saturation time can be seen on the graph.
NOTE: The saturation time is that exposure time which when doubled has caused only a 10 % increase in Arc Height.
(9). The Arc Height achieved and plotted on the graph must be within the values given in the repair procedure.
If the Arc Height is outside these values - 0.002 and + 0.003 of a single specified intensity repeat the steps (5) thru (8) with a
new test piece and a different r.p.m.

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(10). For holes in this size range you must make an adjustment to the r.p.m. previously established.

Conversion Chart for Determining Wheel Speeds Needed When Peening Small Holes with 9/16 x 1-1/4 Roto Peen Wheel

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SA4. SPECIAL PROCESS
(11) The full test procedure must be repeated if:
- The procedure is interrupted for any reason.
- The operator is changed.
(12). Full coverage is achieved when the imprints on the peened surface all overlap each other. The estimation of coverage is difficult
when this is about 98 % of the total surface subjected treatment. At this time the impacts appear to cover the surface entirely.
You must increase the peening time about 15−20 % until the imprints begin to cover themselves. The coverage must be
visually evaluated with a magnifying factor of 10 x.

(13). Peen a series of Almen test strips for different exposure times. Peen the first strip to give it less than 90% coverage. The
intensity is the point at which two times the peening time causes 10% or less increase in arc height. The coverage must be at
least 100% on the strip that has the specified intensity.

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SA4. SPECIAL PROCESS
(14). The formula of Peening time (minutes) on required area is:

Area of required Part in square inches x Saturation Time


Peening Time =
2.25 square inches for Almen test strip

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SA4. SPECIAL PROCESS
Example for calculated the peening time

Required area to be peened is hollow cylinder after blend out the corrosion with inside diameter 2.5 inches and
the height 2 inches, the applicable intensity is 0.012 – 0.014 A2, the saturation time is 2 minutes and 45 seconds
get from saturation curve. The speed is 2500 r.p.m. The question is, find the peening time to get specified
intensity?

Area of required Part in square inches x Saturation Time (Ts)


Peening Time =
2.25 square inches for Almen test strip

a. saturation time = 2 minutes 45 seconds


= 2 minutes + (45 sec : 60 min)
= 2.75 minutes

3.14 x D x H x Ts
b. Peening Time =
2.25 sq.in.

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3.14 x 2.5 inches x 2 inches x (2.75 minutes)
Peening Time =
2.25 square inches

Peening Time = 19.19 minutes

= 19 minutes + (0.19 min x 60 sec)

= 19 minutes and 11 seconds

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SA4. SPECIAL PROCESS

1.5. PEENING PROCEDURES

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PREPARATIONS
• Remove the paint / primer, all coating from the required area.
• Clean the area with cleaning agent.
• Do the flaw detection and subsequent repairs if called up in the repair procedure.
• Make sure that all sharp edges fillets and radius in the area are blended and smooth. Minimum radius and chamfer is 3 mm (0.12 in.).
• Protect / masking the adjacent surface that are not to be peened.

PEENING
WARNING: YOU MUST WEAR APPROVED SAFETY CLOTHING WHEN YOU DO FLAP PEENING. THIS PROCESS CAN BE DANGEROUS.
• Peen the area specified in the repair procedure. Make sure that :
- You use the correct parameters.
- You keep the mandrel parallel to the surface,
- You move the mandrel around the inner face of a hole so that the shot does not drag on the surface.
• To achieve a uniform coverage move the flap in a 0° (lengthwise), a +45° and − 45° alternate criss−cross pattern.

• Examine the area to make sure that you have achieved full coverage.
• Treatment after Peening
- Clean and re protect the peened surface.

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NOTE: This must be done within 2 hours of completing the peening step.
• Repaint / prime, coatings the peened surface as applicable.
• The abrasion of a surface that has been flap peened is not permitted.
• You must make a record of the following information, pass this record to your Quality Assurance department :
- Part serial number if there is one.
- Date peened.
- Intensity specified and corrected.
- Type of flap used.
- Actual r.p.m. used.
- Actual peening time used.
• Unauthorized personal could not allow performing Flap Peening.

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SA4. SPECIAL PROCESS

2. TAPER - LOK

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SA4. SPECIAL PROCESS

2.1. GENERAL

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SA4. SPECIAL PROCESS

T APER−LOK fastener is a tapered bolt with a threaded end and a self locking nut. The nut is also threaded and includes its own washer. The
use of this fastener is almost the same as that of a standard nut and bolt. The TAPER−LOK fasteners are used in those areas of the
structure where a high fatigue performance is required. The TAPER−LOK fastener helps to achieve this performance because it has a constant
interference fit in the tapered hole in the structure. This causes a good compression of the structure material around the fastener hole, and a
balanced stress pattern.
When a TAPER−LOK group is changed for a given diameter:
• The height of the head does not change,
• The diameter of the head changes,
• The diameter of the under head radius changes.
Repair sizes of TAPER−LOK are one group higher than the nominal size:
• R1 - Group + 1
• R2 - Group + 2
The Diameter + measured grip - TAPER−LOK group number. There are five groups of nominal sizes. Each group corresponds to a different
reamer (reamers can also be designed to cover several groups).
An additional feature of the TAPER−LOK fastener is the good sealing effect that is given by the tapered interference fit.

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SA4. SPECIAL PROCESS
NOMINAL TAPER-LOK

Group Definition and Oversizing Principle

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The taper of the bolt and the hole to which it is fitted, is small. It is only 6.35 mm (0.250 in.) for each linear 305 mm (12.008 in.), a ratio of 1 in
48. The TAPER−LOK bolt is a light bolt with a good strength property. Bolts are available for tension or shear uses.
TAPER−LOK bolts are usually supplied with a special lubricant on them. The special lubricant must not be removed before the bolt is installed.
Before the TAPER−LOK bolts are installed in a repair, make sure that:
• They are made of the correct material.
• They have the correct type of head.
• They are of the correct diameter.
• They are of the correct grip length.
• The nuts are of the correct type.

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Measurement for the required grip length

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TAPER−LOK Installation Procedure

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IMBALANCED BALANCED

Example of a Stress Patterns in Standard Bolt and Taper-lok

It is very important to tightly clamp the parts together when they are prepared for the installation of TAPER−LOK bolts. TAPER−LOK bolts can
be installed with hand or power tools. It is very important to prepare the hole for a TAPER−LOK bolt to the highest possible precision. If this is
not done, it could have a bad effect on the fatigue of the structure. It is recommended that only suitable trained and approved personnel
prepare the holes for TAPER−LOK bolts. Drill reamers must not be re-sharpened by the operator; they must be returned to the manufacturer

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for re-sharpening. Before you install TAPER−LOK bolts, makes sure that all the holes are: Clean, smooth, fully deburred at the nut end. The
holes for protruding head bolts must have a relief radius at the head end of the hole.

Relief Radius Data for Protruding Head − TAPER−LOK Bolts

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If a hole that has been used before is found damaged or oversize, it must be repaired to use the correct oversize bolt.
The data given will help the operator to identify the correct bolt to fit in a hole of specified dimensions (nominal diameter and grip length).

TAPER−LOK Bolt Identification Coding

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The TAPER−LOK is a two part fastener. These two parts are:
• A tapered bolt with a threaded end,
• Self locking nut with an integral washer.
TAPER−LOK fasteners are available with a protruding or countersunk head in titanium or steel alloy. The TAPER−LOK bolts of different
nominal diameters are divided into grip length groups. Thus bolts of the same nominal diameter can be found for use on materials of
different thicknesses. TAPER−LOK drill reamers are available to prepare a hole for a TAPER-LOK bolt (countersunk or protruding head). The
drill reamers are identified by a part number. This part number gives the grip length and nominal diameter of the bolt to which the drill
reamer is applicable. There are two different types of nuts available for use on TAPER−LOK bolts. They are:
• Nuts with an attached washer. These are for use where the surfaces of the materials, that must be fastened, are out of parallel up to 2°.
• Nuts with a spherically dished washer that is not attached. These must be used where the material surfaces are out of parallel up to 7°.
On wing structure this limit is 5°.

Use of Self−Aligning Nuts

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These nuts do not have their part number engraved on them, thus they must be kept in different containers. The containers must be marked
with the applicable number.
The self locking property of these nuts is caused by a small elliptical deformation of the nut/body thread. When the nut is installed on a bolt,
the threaded part of the bolt causes the deformation to change shape. This causes the nut to tightly hold the bolt. These nuts must only be
used once. The subsequent table shows the nuts that are available for use with TAPER−LOK bolts on this aircraft.

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2.2. HOLES PREPARATION

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For holes preparations do as follows:
• Make a mark at the correct positions for the bolts.
• Accurately make a mark with a center punch at the positions.
• Carefully drill a pilot hole at each of the positions.
The correct twist drill size for this step is 0.4 mm (0.016 in.) smaller than the nominal diameter of the bolt to be installed.
The correct drill speed for this step is approximately 600 revolutions per minute (rpm).

TAPER−LOK Drill Reamer Data

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• TAPER−LOK drill reamers that countersunk head bolts cut the material in three continuous steps. These are:
− The pilot hole,
− The tapered hole of the correct taper and grip length,
− The correct countersink.
• Put the correct drill reamer in an adjustable TAPER−LOK micro stop cage. Adjust the cage to the necessary drill depth.
Put the cage in a pneumatic drill machine.

TAPER−LOK Micro Stop Cage Data

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The drill machine must be a machine on which the speed can be adjusted from 200 thru 400 rpm. For example, the hole for a bolt of 1/4
in. (6.4 mm) nominal diameter, must be drilled at a speed of approximately 300 rpm.
• Do a test drill on a piece of material that is of the same type and thickness as the material to be fastened. Repeat this step until you have
found:
− The necessary drill speed (rpm),
− The necessary drill depth.
• Put the drill reamer/micro stop cage accurately over the hole drilled. Make sure:
− That the pilot hole end of the drill reamer is in the center of the hole,
− That the drill reamer is in line with the vertical axis of the hole.
• Start the drill machine and drill the hole. Use the cutting lubricant FREON TB−1, or ICI ARCTON 113, during this step. Make sure that the
drill reamer moves through the material slowly, but with a constant hand pressure on it.
• Stop the drill machine when the drill reamer has reached the depth set on the adjustable micro stop cage. Carefully remove the drill
reamer from the hole. Because of the taper of the hole and the drill reamer, the drill reamer will move apart from the hole easily.
• If the hole is for a countersunk bolt, make sure that the hole countersink is correct. Do this with the applicable TAPER−LOK gage, or a
TAPER−LOK fastener of proper dimensions with the shank reduced for a slip fit in the mating TAPER−LOK hole.
• If the hole is for a protruding head bolt, make sure that the top edge of the hole has the correct radius.
• Deburr all the edges of the holes.

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Plug Gage Data

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• Do the steps that follow on all the prepared holes to make sure that they have the correct interference fit.
Put the plug gage into the hole and lightly hit it (use a composite head mallet to do this). Do this until only 25 % of the
length of the shank is visible (measured from the bottom face of the plug gage head to the top face of the material).
Carefully hit the end of the plug gage to free the plug gage from the hole. Take care not to change the marks in the engineers
blue on the plug gage by rotating the gage when you do this step. Look at the marks in the engineers blue on the shank of the
plug gage. If the marks show:
- That 60 % or more of the plug gage shank touched the face of the hole, the hole is satisfactory.
- That less than 60 % of the plug gage shank touched the face of the hole, you must hand ream the hole.

Use of a Plug Gage

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Data for Countersink Check Gage

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Data for Countersink Check Gage

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Acceptance Criteria for Surface Bearing

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USE OF HAND REAMER
The use of a hand reamer is permitted if it is necessary to improve the face of a hole or to reduce the maximum protrusion.
Hand reaming may be done using a commercially available 1:48 hand taper pin reamer. When it is necessary to use a hand reamer, the
subsequent steps must be done after each use:
• Deburr the edges of the hole.
• If it is applicable, make sure that the countersink is correct.
• If it is applicable, make sure that the radius around the top edge of the hole is correct.
• Make sure that the interference of the hole is correct.
It is very important to make sure that after a hole has been hand reamed, that the bolt protrusion is correct.

Commercially available 1:48 Hand Taper Pin Reamer

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Oversize TAPER−LOK Fasteners
This procedure defines general operations to oversize TAPER−LOK to R1 or R2. If it is necessary to create a tapered hole starting from a hole,
then specific adaptations are required.

TAPER−LOK Installation

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TAPER−LOK Installation

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TOOLS AND MATERIALS

Tooling

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HOLE REAMING
Select the applicable Single Flute Reamer. Perform a reaming test on a piece of material that is of the same type and thickness as the material
to be fastened. Do this step until you have reached the final hole dimension required for the repair Taper−Lok.
Progressive hole reaming with regular protrusion checking using the repair Taper−Lok:
• Put the final repair Taper−Lok into the original hole to assess the amount of material to be reamed.
• Put the reamer accurately over the hole. Make sure that the reamer is in line with the vertical axis of the hole.
• Progressively ream the hole. Use a cutting lubricant during this step. Make sure that the drill reamer moves through the material slowly,
but with a constant hand pressure applied in the axis of the hole. Regularly stop reaming to remove metallic chips and check the repair
Taper−Lok protrusion. To do this check, install the repair Taper−Lok in the cleaned hole. That defines when reaming is finished.
Keep on rotating the reamer in the same direction when removing the reamer from the hole for quality reasons.

Manual Reaming

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Taper-Lok Bolt Protrusion Measurement

Countersink Machining (For Countersunk Head Taper-loks only)


• Select the relevant countersink depth gauge. Put it into countersink hole to assess the amount of material to be removed to ensure a
flush installation. It will be necessary to remove only a small amount of material for the next oversize.
• Install the relevant tapered guide into the tapered hole.

Countersink Depth Gauge Usage

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Tapered Guide and Cutter Pilot Principle

Install the 100° Countersink Cutter in a pneumatic drill machine. A low rotation speed for the pneumatic drill machine must be selected for
quality reasons (150−200rpm). Align the cutter pilot in the tapered guide bushing to control the cutter position.
Progressively machine the countersink to the required depth defined by the adapted countersink depth gauge. Use a cutting lubricant.
Machining must be stopped on a regular basis to check the countersink dimension with the countersink depth gauge. This step is essential to
guarantee the correct final dimension of the countersink. Take care not to exceed the required dimension.

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100° Countersink Cutter in Machining Position

Under head Chamfer Machining (For Countersunk and Protruding Head TAPER−LOK). Slightly manually machine the under head chamfer
using the 60° or 90° countersink cutter keeping a good alignment of the tool and hole axis.

60° Countersink Cutter

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The objective of the chamfer is to avoid sharp edges and stress concentration below fastener heads, deburr the edges of the hole.

Under Head Chamfer

Under−Head Chamfer Values

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2.3. INSTALLATION

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INSTALLATION OF TAPER-LOK BOLTS
• TAPER−LOK bolts must be wet installed. Sealant must be applied under the head of the fastener prior to installation and residual
• Insert the correct TAPER−LOK bolt into the prepared hole. Only use a light hand pressure on the bolt head.
• Check the measurement between the material surface and the bolt head.
If the protrusion is greater than the maximum allowed, you must hand ream the hole. Take care to maintain the correct interference fit.
• Put the applicable nuts on the threaded ends of the bolts. Make sure that the nuts engage the bolt threads correctly. Torque the nuts to
the correct value.
• Make sure that the bolt has been fully pulled into the hole. Do the subsequent steps if it has not.
- Remove and discard the nut.
- Put a washer onto the bolt thread.
• The washer must have an inner diameter that is sufficient to go over the plain part of the bolt shank.

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TAPER−LOK Bolt Protrusion Data

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• Ensure that the nut does not interfere with the thread run out area (threads roots before shank). Washers may be required under the
nut.

TAPER−LOK Installation

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2.4. INSPECTION AFTER INSTALLATION

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After TAPER−LOK bolts have been installed, an inspection of them must be done. This inspection must look for the subsequent bad
conditions that can occur. The permitted limits for this condition are:
− A clearance that is not more than 0.04 mm (0.002 in.).
− 60 % or more of the bolt head must fully touch the material face.
− Only 10 % of the bolts in a row of bolts can have this condition.
− Two bolts that are adjacent to each other must not have this condition.

Bolt Head Separation Data

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One full thread of the bolt must show out of the end of the nut. Damage to the bolt head or nut, and the material around the bolt head, for
example:
− Scoring,
− Impact damage,
− Dishing of the bolt head,
− Cracks at the edge of the bolt head,
− Surface protection damaged.
Cracks in the bolt head are not permitted. If there are cracks, the bolt and the nut must be replaced.
If the surface protection is cadmium plating (golden color), and damaged, replace the bolt and the nut, or the nut only if necessary.

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REMOVAL PROCEDURES
The following procedures are applicable for fasteners up to 14.1 mm (0.555 in.) in diameter. For fasteners larger than this diameter, contact
manufacture.

Procedure 1
• Remove and discard the nut. Do this with the correct socket tool.
• Put the correct TAPER−LOK knock−out tool on the thread of the bolt. Make sure that the tool correctly engages the bolt thread
and is fully turned onto the bolt.
• Hit out the bolt. To do this, hit the end of the knock t tool with a hammer, this will cause the bolt to move apart from the hole.
• Hold the bolt head (if necessary, pliers can be used, but obey the caution given above), remove the knock−out tool from the bolt.
• Carefully remove the bolt from the hole.
• Examine the bolt. If its condition is satisfactory, it can be used again.

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TAPER−LOK Bolt Knock−out Tool Data

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Procedure 2
In this procedure a locally made extraction tool is used. This tool uses a standard bolt. The standard bolt must be correct for the dimensions of
the TAPER−LOK bolt that is to be removed.
• Drill a hole of the correct dimensions into the shank of the TAPERLOK bolt. Do this from the head end of the bolt.
• Cut a thread into the inner surface of the hole made.
• Put the extraction tool in its correct position above the TAPER−LOK bolt. Engage the standard bolt with the thread in the TAPER−LOK
bolt.
• Remove and discard the nut from the end of the TAPER−LOK bolt. Do this with the correct socket tool.
• Turn the nut on the standard bolt to remove the TAPER−LOK bolt from the structure.
• Remove the TAPER−LOK bolt from the extraction bolt. Discard the TAPER−LOK bolt.

Extraction Tool Data

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3. COLD WORKING

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3.1. GENERAL

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old working of fastener holes is used to improve joint fatigue properties by compressing the material around the edge of fastener holes.
C This is achieved by pulling a mandrel through an undersized hole, thus enlarging the hole and compressing the metal, and then sizing
the hole to final dimension. The cold working operation causes a radial plastic flow of material and produces a residual compressive
stress in the area surrounding the hole, which, in the case of the high interference cold working, extends approximately one radius from the
edge of the hole.
There are two cold working processes;
• The sleeve cold expansion process, which involves expanding a pre-existing hole by passing a tapered interference mandrel through, a
hole lined with a longitudinally split, disposable steel sleeve. This process is performed in highly stressed areas to increase the fatigue life
of structural members. Cold working the hole by expansion causes a radial plastic flow of material and produces high residual
compressive stresses around the hole. Interference fit fasteners are normally installed in cold worked holes.
• The sleeveless cold-working process expands a pre-existing hole by passing a split mandrel through it.
There are two classes used in both cold-working processes:
o Class I: The high interference class
o Class II: The low interference class
These classes differ by percentage of interference set between the tooling and the starting hole, which mean the degree to which a metal is
compressed. For the high interference split sleeve cold expansion process, subsequent sizing of the cold-worked hole is required to meet
drawing or repair requirements, whereas post-cold-work sizing is very limited for the low interference split sleeve cold working process. For
the high interference sleeveless cold- working process, a collapsible mandrel is inserted into the hole, then both the mandrel and the pilot are
pulled through the hole to cold work it.

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STANDARD APPLICATION EXPANSION RANGE
The applied expansion of a hole diameter is the total expansion during process.
• Aluminum alloys (80 ksi max) have an applied expansion from 3 to 6 percent (4 percent nominal).
• Titanium and steel alloys (250 ksi max) these metals have an applied expansion from 4.5 to 6.7 percent
(5.5 percent nominal)

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3.2. TOOLING SELECTION

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Select the proper mandrel, nose cap assembly, barrel, and puller gun. The minimum mandrel length is equal to the stack up thickness plus the
nose cap assembly length.

SLEEVE SELECTION AND INSTALLATION


• Select the proper sleeve for the task, i.e., flared or straight, or combination of both.
• Ensure the total sleeve length is a minimum of 1/32” longer than the material stack up.
• Stacked sleeves shall not have a separation within 1/16 “ of any faying surface. When stacking sleeves, it is recommended
that sleeve splits be aligned to facilitate their removal after cold working.
• Slide the split sleeve (s) onto the mandrel, until flush against the nose cap.
• The mandrel minor diameter length shall be a minimum 0.063” longer than the sleeve length.
• The outside surface of split sleeve shall be bare metal without any lubrication present. There shall be no burrs on the sleeve gap and
no nicks or scratches on the surface of the sleeve
• Dry film lubricant shall completely coat inside of the sleeve.
• Sleeves shall not be damage during hole expansion (e.g. sleeves breaking at the flared end). Axial slippage of the sleeve (e.g, opposite
end of the sleeve enter the hole) shall be unacceptable.
• Sleeves shall be discard after use and shall never be reused.

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3.3. PROCESS

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COLD WORKING PROCESS
• Drill and / or ream the hole to proper starting hole dimension. Clean the hole, removing all cutting fluid residue. The pre-cold worked
hole shall be free of all foreign materials including paint, sealant, metal particles and any other foreign materials.
• Verify the hole diameter using the correct start hole gage, or combination gage.
• Insert the assembled tooling completely into the hole. Ensure the nose cap is flush against the material to be cold worked. Do not
side load the mandrel in the material.
• Cold work the hole by pulling the trigger on the puller gun. This will cause the mandrel to be drawn through the sleeve, cold
expanding the hole. Remove the puller gun from the work piece and release the trigger, this will cause the mandrel to extend back to
the ready position.
• Remove the sleeve (s) from the hole and discard.
• Verify the cold working operation, utilizing the appropriate final reamer.

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INSPECTION
• Mandrel Check Fixture
Mandrel check fixture and gages shall be used as no-go gages. When the mandrel major diameter can be inserted into the
appropriate check gage, the mandrel shall be considered to be worn beyond the specification limit and shall no longer be used.
• Hole Check Gages
Hole check gages shall be used to determine whether the starting hole is within the specified hole diameter tolerances and after cold
work the holes prior to reaming to final size as the gage diameter.

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Cold Working Process of High Interference Sleeveless

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• Edge Margins

o Edge margins of cold worked open holes (where no fastener or stud is installed through the hole) or clearance fit fastener holes
shall be a minimum of 1.75 times of final hole diameter, unless otherwise specified by the Engineering drawing.
o Edge margins of cold worked fastener holes where there will be a minimum interference fit of 0.001 inch after fastener installation
shall be a minimum of 1.25 times the final hole diameter unless otherwise specified by the Engineering drawing.
• Minimum Material Thickness
o The minimum material thickness of a sheet or stack up of material of cold working is to be done shall not be less than 20 percent
of the diameter of the hole being cold worked.
o When a stack up of material is specified to be cold worked, the entire stack up shall be cold worked at the same time. Detail parts
shall not be cold worked separately and then combined into a stack up.
o A stack up of material shall have complete faying surface during starting hole for preparation and hole expansion. The structure
may be separated after cold work hole expansion for deburring and cleaning, the cold worked hole shall be realigned and
complete faying surface contact for the material stack up shall be obtained prior to reaming out the final hole.
• Equipment and Tooling
o The mandrel pulling equipment and adapters used to cold work holes shall be checked to ensure that they produce satisfactory
cold worked holes in setup.
o Mandrel, nosepieces, puller units and adapters, hole check gages and reamers are precision tools and shall be handled and stored
as such. Tools shall be kept in individual or partitioned containers which will prevent contact between the tools.
o Mandrels, sleeves and hole check gages shall be visually examined by the operator before each use to verify that they are free
from nicks, burrs, metal buildup or other damage which may cause , or prevent detection of, defects in the holes.
o Air supply pressure shall be 100 +/- 20 psi to the hydraulic Power Pack.
o Hydraulic Power Pak shall be capable to supply hydraulic pressure 0f 10.000 +/- 100 psi required for installation.

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o Puller unit shall be selected refer to the requirement of table for minimum hydraulic pressure requirement and maximum starting
hole diameter and maximum material stack up.

Cold Working Mandrel and Sleeve Dimension

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Puller Unit with Split Sleeveless Mandrel

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4. ANODIZING

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4.1. GENERAL

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nodizing is the controlled oxidation of aluminum using an electro-chemical process to create a porous surface. Anodizing converts the
A surface while aluminum naturally forms aluminum oxide on its surface (very thin film) to provide much thicker oxide coating that is 2-3
nm thick. Anodizing involves placing a sheet of aluminum into a chemical acid bath. The sheet of aluminum becomes the positive anode
of a chemical battery and the acid bath becomes the negative. An electric current passes through the acid, causing the surface of the
aluminum to oxidize (essentially rust). The oxidized aluminum forms a strong coating as it replaces the original aluminum on the surface but
heat can be distributed evenly across anodized aluminum, and the process of anodizing provides a naturally protective finish
The anodic oxide coatings consist of two layers:
• Inner layer which is thin and dense and called barrier layer.
• The porous thick-outer layer growing on an inner layer.

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Anodizing involves placing a sheet of aluminum into a chemical acid bath. The sheet of aluminum becomes the positive anode of a chemical
battery and the acid bath becomes the negative. An electric current passes through the acid, causing the surface of the aluminum to oxidize
(essentially rust). The oxidized aluminum forms a strong coating as it replaces the original aluminum on the surface but heat can be
distributed evenly across anodized aluminum, and the process of anodizing provides a naturally protective finish.
The anodic oxide coating consist of two layer:
• Inner layer which is thin and dense and called barrier layer.
• The porous thick-outer layer growing on an inner layer.

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APPLICATIONS
1. Protection
• Excellent electrical isolator.
• Creating a surface that is corrosion-resistant and nearly as hard as diamond.
2. Decorative
• Provide a pleasing aesthetic appearance of part.
• Many modern buildings use anodized aluminum in places where the metal framework is exposed to the elements. Special dyes
can also be used to color the anodized aluminum for decorative use. Anodized aluminum can simulate various materials such as
brass, copper and bronze, but at a fraction of the cost.
3. Architectural
• For external architectural applications where a combination of aesthetic appearance, corrosion resistance and
mechanical performance.
4. Hardening
• For engineering applications such as bearing surface.
• Anodizing film is an abrasion-resistant material that will never peel, chip or flake - regardless of age or weather.
• The automobile for trims and protective housings for exposed parts.
• Many part of the satellites are protected from space debris.
5. Pre-treatment
• Pre-treatment for painting.
• Pre-treatment for surface preparation adhesive bonding process.

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4.2. COMMON OF ANODIZING METHODS

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CHROMIC ACID ANODIZING
The oldest anodizing process uses chromic acid. It is widely known as Type I because it is so designated by the MIL-A-8625 standard, but it is
also covered by AMS 2470 and MIL-A-8625 Type IB. Chromic acid produces thinner, 0.5 µm to 18 µm (0.00002" to 0.0007") more opaque films
that are softer, ductile, and to a degree self-healing. They are harder to dye and may be applied as a pretreatment before painting. The
method of film formation is different from using sulfuric acid in that the voltage is ramped up through the process cycle.

SULFURIC ACID ANODIZING


Sulfuric acid is the most widely used solution to produce anodized coating. Coatings of moderate thickness 1.8 µm to 25 µm (0.00007" to
0.001") are known as Type II, as named by MIL-A-8625, while coatings thicker than 25 µm (0.001") are known as Type III, hard coat, or
engineered anodizing. Very thin coatings similar to those produced by chromic anodizing are known as Type IIB. Thick coatings require more
process control, and are produced in a refrigerated tank near the freezing point of water with higher voltages than the thinner coatings. Hard
anodizing can be made between 25 and 150 µm (0.001" to 0.006") thick. Anodizing thickness increases wear resistance, corrosion resistance,
ability to retain lubricants, and electrical and thermal insulation. Standards for thin sulfuric anodizing are given by MIL-A-8625 Types II and IIB,
AMS 2471 (undyed), and AMS 2472 (dyed). Standards for thick sulfuric anodizing are given by MIL-A-8625 Type III, AMS 2469, BS 5599, BS EN
2536 and the obsolete AMS 2468 and DEF STAN 03-26/1.

ORGANIC ACID ANODIZING


Anodizing can produce yellowish integral colors without dyes if it is carried out in weak acids with high voltages, high current densities, and
strong refrigeration. Shades of color are restricted to a range which includes pale yellow, gold, deep bronze, brown, grey, and black. Some
advanced variations can produce a white coating with 80% reflectivity. The shade of color produced is sensitive to variations in the metallurgy
of the underlying alloy and cannot be reproduced consistently. Integral color anodizing is generally done with organic acids, but the same
effect has been produced in laboratory with very dilute sulfuric acid. Integral color anodizing was originally performed with oxalic acid, but
suffocated aromatic compounds containing oxygen, particularly sulfosalicylic acid, have been more common since the 1960s. Thicknesses up
to 50µm can be achieved. Organic acid anodizing is called Type IC by MIL-A-8625.

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BORATE AND TARTRATE BATHS
Anodizing can also be performed in Borate or Tartrate Baths in which aluminum oxide is insoluble. In these processes, the coating growth
stops when the part is fully covered, and the thickness is linearly related to the voltage applied. These coatings are free of pores, relative to the
sulfuric and chromic acid processes. This type of coating is widely used to make electrolytic capacitors, because the thin aluminum films
(typically less than 0.5 µm) would risk being pierced by acidic processes.

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Coloring Anodizing

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4.3. PRE-TREATMENT ANODIZING

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PHOSPHORIC ACID ANODIZING
Phosphoric Acid Anodize (PAA) is the treatment of choice for critical applications in the aviation industry. Data collected from decades of use
substantiates that Phosphoric Acid Anodize is the preferred method of surface treatment for structural bonding of aluminum alloys. Bonds
formed with Phosphoric Acid Anodize treatment exhibit superior durability than those formed by other treatment methods (Forest Product
Laboratory Etching or Chromic Acid Anodize) during exposure to humid environments, especially when epoxy adhesives are used.
Phosphoric Acid Anodize treatment is two methods:
1. PINTA (Phosphoric Acid In Tank Anodizing)
The phosphoric acid anodizing tank shall be equipped with automated temperature control and recording equipment and a voltage
and amperage recorder capable of detecting discontinuous current events of a one second duration. Equip processing tanks with
suitable timing and temperature control devices designed to maintain solution operating conditions within the specification limits.
All aluminum anodizing, dyeing and sealing tanks must be of stainless steel construction or lined with a suitable inner material
o
capable of withstanding continuous temperatures of 212 F.

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2. PANTA (Phosphoric Acid Non Tank)
• The Phosphoric Acid Non Tank Anodizing System

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• The Phosphoric Acid Containment System (PACS)

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5. BRUSH PLATING

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5.1. GENERAL

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he SIFCO Process of Selective Electroplating is an advanced, well-engineered and complete method of selectively electroplating localized
T areas without having to use an immersion tank. Currently, fifteen pure metals and more than fifteen alloys can be electroplated with
good results on virtually all the commonly used metals and alloys. Quality of deposits and adhesion to base materials are equivalent or
superior to that which may be obtained using good tank plating practice. The SIFCO Process can also be used for localized electro polishing
and anodizing.

Principle of Brush Plating Process

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USES OF BRUSH PLATING
Brush plating Process electroplated coatings are used for the same purposes as tank electroplates. The coatings can:
• Provide corrosion protection.
• Improve wear resistance.
• Improve solderability or brazing characteristics.
• Decrease electrical contact resistance.
• Prevent galling.
• Serve as bearing surfaces.
• Salvage worn or mismachined parts.
• Improve appearance (decorative).

Advantages of the Brush Plating Process over Tank Plating


The Brush plating Process does not replace tank electroplating but rather complements it. Some of the advantages of the process are:
• It is portable and simple to operate.
• It plates very rapidly on small to medium size areas.
• It does not necessarily require the disassembly of a unit.
• It reduces the amount of masking required.
• It permits plating of parts too large for existing plating tanks.
• It reduces machine downtime and production delays.
• It is capable of plating exactly the desired thickness.
• It minimizes hydrogen embrittlement.
• It provides, in many cases, superior adhesion particularly on more difficult to plate materials.

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• It reduces disposal problems since small volumes of waste are involved.

Disadvantages of the Brush Plating Process


Disadvantage is limitation of the layer thickness of about 0.7 mm. Technically a thicker layer is no problem, but financially it can be a problem.
Also when a part has to be plated overall, bath plating often added will be more economical.

Other Uses
Anodizing, electro polishing, weld scale removal and application of black optical coatings may also be done using the brush plating Process.

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TYPICAL OPERATION USING THE BRUSH PLATING PROCESS
There are certain preliminary preparations, which must be made prior to the plating operation.
These include:
• Making available a suitable power pack.
• Selecting proper plating solution or solutions.
• Selecting proper preparatory solutions for the base material.
• Selecting appropriate tools for each solution to be used.
• Covering the tools.
• Precleaning and masking the part.
• Providing suitable accessories such as beakers or pans for holding and catching solution.
The actual brush plating process operation consists of several preparatory steps in which the work area is prepared to receive an adherent
deposit and the final plating step or steps. Each step looks more like a painting operation than a plating operation. The operator commonly
dips the tool into a container of one of the solutions and then rubs the tool on the surface to be plated. The operator closely watches the
surface in each step to ensure the operation is being carried out properly. An ampere-hour meter is normally used to control thickness of
plating. When the required ampere-hour have been passed, plating is stopped. A final water rinse and drying step completes the whole
operation.

Mechanization and Automation


The brush plating process has been mechanized and/or automated in some cases for high volume work. Again, it does not replace tank
plating but rather complements it in the plating of select, localized areas on a part. The tools and techniques used in automated applications,
however, differ somewhat from those commonly used in the brush plating process.

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Automatic Brush Plating Mechanical Brush Plating

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5.2. BRUSH PLATING EQUIPMENT

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Four basic elements are required to electroplate using the Brush Plating Process:
• A power pack.
• Plating tools.
• Preparatory and plating solutions.
• An operator.

POWER PACKS
A Brush Plating Power Pack transforms alternating current into the direct current necessary for electroplating. The direct current from the
power pack takes the following path during electroplating through:
• A lead to the plating tool.
• The plating tool.
• The solution in the plating tool cover.
• The work piece.
• Through a second lead connecting the work piece and the power pack.

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Power Pack Function
The Brush Plating Process power pack, also called a rectifier, is the source of electrical current in the preparatory and plating operations. The
power pack transforms the alternating current available at the electrical outlet into the direct current (dc), which is required for electroplating.
The power pack gives the operator control of volts, amps, and the direction or polarity of the current, forward or reverse.

Power Pack Components and their Purpose


Ammeter: The ammeter measures the rate of current flow through the plating tool. Since the rate at which metal is being applied is exactly or
nearly proportional to the rate of current flow, the ammeter gives a second-to-second idea of plating rate. The ammeter can also be used to
determine if the plating is being done rapidly and properly. Formula 4 in Section 10 can be used to determine what amperage should be
drawn with a given solution and tool. Readings on the ammeter can be compared against this value. One ammeter is provided on newer
model power packs. Larger, older power packs may have either a dual range ammeter or two ammeters. Some models with dual range
ammeters include an automatic range-switching feature; other models include a manual range switch. The ammeter range switch controls
which ammeter is being used. When plating at low amperages, the low ammeter range should be used to permit more accurate readings.
DC Overload Protection Device: Current power packs contain a dc overload protection device. Its purposes are to:
1. Minimize damage to the workpiece in case there is an accidental direct shorting of a lead or a tool on the workpiece.
2. Prevent overloading the power pack. Larger, older power packs, with dual range ammeters or two ammeters have two correlating dc circuit
breakers. A 100-40 power pack, for example, has a 0 to 10 amp ammeter, a 10 amp circuit breaker, a 0 to 100 amp ammeter, and a 100 amp
circuit breaker. In either range, the correlating circuit breaker will cut out when the current draw exceeds the value for the range. If the excess
current draw is due to a direct short, the cause should be remedied. If the low range circuit breaker cuts out because of excessive plating
current, switch to the high range and press the start button. If the high range circuit breaker cuts out because of excessive plating current,
lower the voltage and press the start button. The low range ammeter should be used when plating at low amperages. If there is an accidental
short, the power pack will cut off at lower amperage. Cutting out at a lower amperage minimizes damage to the part

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Voltmeter: The voltmeter measures the voltage (electrical pressure) applied across the dc circuit or through the solution. Different voltage
ranges are used with different solutions. The "volts" control knob allows the operator to make the adjustments for applied voltage, which is
the initial step in obtaining the proper plating conditions.
Ampere-Hour Meter: The amp-hr meter measures the quantity (amp x time) of electricity passed through the dc circuit and allows the
thickness of SIFCO Process deposits to be controlled. Formula 1, Section 10 is used to determine the amp-hr required for a particular job.
When going through a SIFCO Process plating operation, the reset button is pushed after the preparatory cycle is completed, and just before
the plating operation is started. This resets the meter to zero. When the computed amp-hr are passed, the plating operation has been
completed.
"ON-RES" or "Start": This energizes an ac power relay and makes the dc circuit operative.
"OFF" or "Stop": This de-energizes the ac power relay and makes it inoperative.
Output Terminals: At least one black and one red output terminal is provided. Larger power packs provide a number of black and red
terminals, sometimes of various sizes.
Plating tool leads, usually color-coded red are always connected to a red terminal. The alligator clamp lead, usually color-coded black, is
always connected to a black terminal.
"FWD" and "REV" Buttons or Forward/Reverse Switch: These change the direction of current flow in the dc circuit. They are operated per
instructions found on technical data sheets of the solutions being used, e.g. FWD (forward) for plating or REV (reverse) for etching.
Output Leads: Large power packs have a number of different size wire leads. Small leads are correlated with small terminals for small tools
where low amperages will be drawn. Large size wire leads are correlated with large terminals for large tools where high currents will be
drawn.

THE DIFFERENT TYPES OF POWER PACKS

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A broad range of power packs has been developed by SIFCO to meet all standard selective plating requirements. Differences in the various
power packs are maximum amperage output capability and the inclusion of microprocessor controllers on some models. Models range from
a small unit with a 10 amp output to a heavy duty power pack with a 500
amp output. Ac input ranges from 115 volts, single phase to 460 volts, three phase and is available for both 50 and 60 Hz operation. All power
packs have variable stepless voltage control, reverse current switches and safety cutoff devices to protect the operator, the part and the
power pack itself.

SPL Series Power Packs


SPL Series power packs were designed with portability in mind. These units are available in 15, 30 and 75 amp outputs. Also included in the
SPL Series, is the SPL 10-45 Power Pack. This unit, which can be pre-set to regulate a given current and limit the voltage used, is primarily used
for anodizing, but it can also be used for conventional plating operations.

HD Series Power PacksHD Series power packs were designed for routine plating operations, larger in nature than for the SPL Series. These
power packs are available in 75, 300, and 500 amp outputs. This series of power packs can be modified to accept an interface, which is very
useful for long-run jobs of a repetitive nature.

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PLATING TOOLS
Brush plating tools consist of an insoluble anode, normally graphite, and an insulated
handle. Since high currents are passed through the plating tool, heat is developed. Large
tools are cooled by pumping solution through the anode to the work area. Rapid plating
of a particular part is assisted by a high percentage of plating tool to work piece contact
area. A wide variety of shapes and sizes of brush plating tools are used to efficiently
plate a variety of sizes and shapes of parts.
The anodes are covered with an absorbent material such as cotton batting and sleeving.
The purpose of the cover is to:
• Hold and distribute the solutions.
• Prevent a direct short of the anode with the work piece.
• Brush the surface of the part while plating which is important in developing fast plating rates.

SOLUTIONS
Brush Plating solutions include preparatory solutions for preparing base materials for plating, bonding solutions to
improve adhesion of the final deposit, plating solutions for plating pure metals and alloys, stripping solutions for
stripping-off defective coatings, and special solutions such as anodizing, black nickel, electro polish, and conversion
coatings. The solutions have been developed with goals of:
• Being as non-toxic as possible.
• Eliminating the need for chemical control prior to or during usage.
• Being effective and easy to use.

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OPERATORS
Brush Plating operators need no previous experience with tank electroplating procedures, equipment, and solutions. Some experiences in
evaluating electroplate quality and adhesion, however, is helpful. Common sense, capability to thoroughly carry out instructions, ability to
use mathematics to the point of simple formulas and a desire to learn new techniques are the most important requisites for a Brush Plating
operator. Machinists, mechanics and technicians, for example, usually have the attributes of a good brush plating operator. New brush plating
process operators should attend a formal training program in order to get first hand instruction in the Brush Plating Process and in the use of
the related equipment.

AUXILIARY EQUIPMENT

Flow Plating Components and Equipment


The following items have been selected and/or designed for use with solution-fed plating tools:

Pumps
Small submersible pump, Model S - for work in the 0 to 60 amp range. Large submersible pump, Model L - for work in the 0 to 150 amp range.
Peristaltic pump - for work in the 0 to 30 amp range.

Catch Trays
11 in. x 14 in. with corner drain (Overall dimensions: 381 mm W x 457 mm L x 70 mm H)
(Overall dimensions: 15 in. W x 18 in. L x 2 3/4 in. H) 14 in. x 17 in. with corner drain
(Overall dimensions: 451 mm W x 521 mm L x 89 mm H)
(Overall dimensions: 17 3/4 in. W x 20 1/2 in. L x 3 1/2 in. H)
20 in. x 24 in. with corner drain (Overall dimensions: 603 mm W x 705 mm L x 92 mm H)
(Overall dimensions: 23 3/4 in. W x 27 3/4 in. L x 3 5/8 in. H)

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Pump Pans
Submersible pump pan (Overall dimensions: 318 mm W x 371 mm L x 140 mm H)
(Overall dimensions: 12 1/2 in. W x 14 5/8 in. L x 5 1/2 in. H)
Submersible pump bucket (Overall dimensions: 279 mm D x 254 mm H)
(Overall dimensions: 11 in. D x 10 in. H)

Flow Systems
AeroNikl Flow Systems
Model Capacity Features
Model 75 4 to 6 liters (heat and filter)
Model 150 8 to 11 liters (heat and filter)
Model 250 23 to 38 liters (heat, cool and filter)
Solution Flow Systems
Model Capacity Features
Model 15 4 to 6 liters (filter)
Model 23 8 to 11 liters (filter)
Model 68NC 23 to 38 liters (filter)

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TURNING ACCESSORIES
A number of turning accessories have been designed and are available to:
• Increase plating current and decrease plating time.
• Decrease operator fatigue.
• Maximize deposit quality.
• Improve uniformity of thickness.
• Perform jobs that otherwise could not be done.

Model N Turning Head


The Model N Turning Head is used to rotate small components such as shafts and housings that require an OD, ID or flat washer shaped area
to be plated. The maximum size parts that can be accommodated with a Model N Turning Head is approximately as follows:
• Diameter: 152 mm (6 inches)
• Length: 610 mm (24 inches)
Weight: 23 kg (50 pounds) with base clamped to table or bench. A mini-turning head is used for rotating smaller parts. It usually is supplied as
a system, with an optional cart, which includes the turning head, tray, connecting hose, solution beakers and a multistrip connector for 115
VAC operations. This is a particularly useful accessory when combined with a Model 75 or 150 AeroNikl Flow System or Model 15 or 23
Solution Flow System. The maximum size part that can be accommodated with the Mini-Turning Head is approximately:
• Diameter: 102 mm (4 inches)
• Length: 305 mm (12 inches)
Weight: 5 kg (10 pounds) with base (may be attached to a cart or bench)

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Rotary Tool
The Rotary Tool is used to plate blind holes and small diameters ranging in size from approximately 1.5 to 38 mm (0.060 to 1.5 in.) The smaller
the diameter, the more difficult it is to manually obtain the recommended anode-to-cathode speed. With small through holes an in out
motion is used to get an adequate anode-to-cathode speed. This cannot be done with blind holes since a tapered deposit will result. The
Rotary Tool is supplied with modified tool handles to accommodate all small rod anodes. The unit may be used with larger rod anodes by
using special adapters.

Roto-Flo Accessory
The Roto-Flo Accessory has been designed to mechanize the plating process, reduce operator fatigue while plating and increase the speed of
plating moderate size bores which cannot be rotated. The unit attaches to the turning head by a flexible shaft matched to a rotary, flow
through handle made from corrosion resistant materials. The handle in operation consists of a stationary insulated plastic housing with
electrical and solution inlets and a hollow stainless steel rotating shaft to which anodes can be attached. Bore sizes, which can be plated with
the Roto-Flo Accessory range from 38 to 127 mm (1.5 in. to 5 in.).

ID Plater
The ID Plater facilitates plating larger bores in parts that cannot be rotated. It has been specifically designed to plate internal diameters in the
102 to 305 mm (4 to 12 in.) range, up to 203 mm (8 in.) long. The ID Plater has a variable speed motor. The unit, with adapters and/or minor
modifications, can also be used to plate:
• Internal diameters up to approximately 914 mm (3 ft) in diameter
• Outside diameters
• Flat, washer-shaped areas

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Example:
A complex turbine wheel with blades and internal passages can be rotated in a lathe. The part and the lathe, however, would be difficult to
mask, particularly when corrosive solutions are used. Masking can be greatly simplified by plating the part with an ID Plater with the bore
centerline vertical.

Standard Components of an ID Plater:


• 3 sets of titanium leaf springs:
Set 1 - For 102 to 178 mm (4 to 7 in. ID).
Set 2 - For 178 to 254 mm (7 to 10 in. ID).
Set 3 - For 229 to 305 mm (9 to 12 in. ID).
• Corrosion resistant graphite and ceramic, mechanical solution seals.
• Corrosion resistant 304 stainless steel and polypropylene components.
• Copper-graphite brush for plating current input.

Traversing Arm
The Brush Plating Process Traversing Arm provides mechanical oscillation or stroking-traversing motion for an otherwise manually moved
plating tool handle. Use of the Brush Plating Process Traversing Arm eliminates the need to have an operator move a plating tool, decreasing
operator fatigue and freeing him or her to perform other tasks. The mechanical motion control supplied by the Traversing Arm can help to
improve the efficiency of any plating or anodizing operation, and will help to decrease plating cycle time, maximize deposit quality and
improve uniformity. The Traversing Arm will accommodate all standard Brush Plating Process plating tool handles and provide motion to
virtually any size anode which can be attached to the plating tool handle. Speed control and effective length of movement are both easily
adjustable for this unit.

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5.3. PREPARATORY AND PLATING TOOLS SELECTION

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The selection of the proper preparatory and plating tools is a very important factor in determining how rapidly and effectively a particular job
will be carried out. In SIFCO Plating operations (preparation of the surface or plating) work is done only where and when the tool meets the
part. As a result of this, rapid, proper, and uniform processing of a part largely depends on:
• The tool providing an optimum amount of contact area with the part.
• The tool covering the full length of an ID, OD or flat area.
• Pumping solution through the plating tool when plating higher thicknesses on larger areas.

SELECTING THE PROPER PREPARATORY TOOLS


The preparatory steps (i.e. Electrocleaning, Etching, etc.) are relatively short steps when compared to the plating operation. Selection of the
preparatory tools is not as critical as selection of the plating tool. The preparatory tools should cover as much of the area to be plated as
possible, and if practical, cover the entire length of the area to be plated to assure uniform preparation. When practical, the minimum contact
area should be no less than 10 % of the area to be plated. In most instances, the greater the contact area the greater the efficiency of the
preparatory operation. However, in etching and activating operations, the current drawn per unit area is significantly higher than for plating
operations. Using too large of an anode at the recommended voltage for the operation may result in the power pack being overloaded. In
order to compensate for this condition, the voltage must be reduced, thus decreasing the efficiency of the etch. On the other hand, using too
small of an anode may result in an inefficient preparatory operation, with the potential for the work area to dry out.
The plating step generally represents the major part of the entire SIFCO Process operation and selection of the proper plating tool is more
critical than for the preparatory tools. The higher the thickness of plating to be applied, the larger the area to be plated and the larger the
number of parts to be plated, the more important it is to have the proper tool. It is also important to have the proper tool when uniformity of
deposit thickness is required.

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Optimum Contact Area for the Plating Tool
A good deposit will be applied as fast as possible when plating tool to workpiece contact area is at its optimum. Optimum Contact Area (OCA)
is the best possible contact area that can be achieved, given the shape of the part, the maximum amperage output of the power pack, and
the average current density of the plating solution being used. Maximum Contact Area (MCA) is calculated based upon the Maximum
Amperage Output (MAO) of the power pack being used and the Average Current Density (ACD) of the plating solution being used. Practical
Contact Area (PCA) is determined by the shape of the part. Flat surfaces and inside diameters have PCA's of 100% of the area to be plated.
Outside diameters have PCA's of 50% of the area to be plated. Optimum Contact Area is usually determined when designing a special plating
tool. This value, stated in either square centimeters or square inches, is the lesser of the Practical Contact Area
(PCA) or the Maximum Contact Area (MCA). For example: For an anode used to plate a flat 97 sq cm (15 sq in.) rectangle with a .93 amp/sq cm
(6 amp/sq in.) average current density plating solution, using a 75 amp power pack, the
optimum contact area (OCA) can be determined as follows:
1. The Maximum Contact Area (MCA) is 81 sq cm (13 sq in.)
2. The Practical Contact Area (PCA) for a flat surface is 100% of the area to be plated. In this case is 97 sq cm (15 sq in.)
3. The lesser of the PCA or the MCA is the Optimum Contact Area (OCA). In this case it is 81 sq cm (13 sq in.)

Covering Full Length


Covering the full length of an OD, ID, or flat surface with a tool makes it relatively easy to obtain a uniform thickness. When the tool does not
cover the full length, problems arise. Take for example, the case of attempting to plate an OD 76 mm (3 in.) long with a tool that will cover 51
mm (2 in.) of the length. If the tool is moved as shown in Sketch #1 on the left of Figure 4.1, the center 25 mm (1 in.) is always covered. At the
ends there is less coverage time. A plate distribution as shown at the bottom results. The alternative to this is to move the tool as shown in
Sketch #2 on the right of Figure 4.1. An even plate distribution is obtained, but now some time is wasted with the tool off the part. This
motion, also, may not be practical if there is a shoulder at one side. The same situation applies to ID and flat surfaces. Summarizing, always try
to have the tool cover the full length of OD or ID or the full length or width of a flat surface.

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Difficulties encountered when a plating tool does not cover the full length of an OD

(When the tool is moved as shown on the left, more plating is obtained in the center and less at the ends. When the tool is moved as shown
on the right, a uniform plating is obtained, but much time is wasted with the tool off the part.)

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STANDARD BRUSH PLATING TOOLS
Standard brush plating tools are available for efficiently preparing and plating a wide variety of sizes and shapes of parts. Standard tools may
be selected if they meet the following requirements.
Preparatory Tools - 1. Cover a minimum of 10% of the area to be plated, when practical.
2. Cover full length.
Plating Tools - 1. Provide adequate contact area.
2. Cover full length.
3. Allow for pumping solution when required.
Key:
PT = Platinum clad anode for preparing or plating small ID's or flats
ID = Graphite anode for preparing or plating ID's and small flats
OD = Graphite anode for plating OD's
FT = Graphite anode for preparing or plating flats and OD's
F = Flow designation for anode

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5.4. PLATING TOOL COVERS

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The plating tool cover, also known as anode wrap, is the absorbent material attached to the plating tool. It performs several important
functions including:
• Holding and uniformly distributing solution between the tool and the part.
• Insulate the tool from the part, preventing arc damage to the part by direct shorting. Forcing electricity to flow through the solution.
• Mechanically scrubbing the surface, permitting sound deposits to be rapidly applied.

TYPES OF COVERS
Several cover material groups are used with the SIFCO Process and they may be categorized as follows:
• Initial Cover. Highly absorbent material to hold and distribute solution. Requires a final cover since it is not wear resistant.
• Final Cover. Overlay for the initial cover to provide wear resistance.
• Dual Function Cover. Can be used by itself, since it holds and distributes solution uniformly and has satisfactory wear resistance.

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Advantages, Disadvantages, and Uses of Various Cover Materials

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COVERING PLATING TOOLS
The following figures illustrate how initial and final covers, as well as sheet-type dual function covers are applied. Cotton batting covers with
sleeving should generally be approximately 5 mm (3/16 in.) thick. They should also be as uniform in thickness as possible. Thick areas have
more resistance to current flow and less plating results in these areas.

PREPARATION OF COTTON
BATTING
Cut a piece of long-fiber cotton batting about one inch wider than the length of the brush plating anode and six to eight times longer than
the diameter. Split the cotton to about 2 mm (3/32 in.) thickness so that the final cover thickness after rolling will be 5 mm (3/16 in.). Lay the
cotton on a table and wet the anode with water so that it will adhere to the end of the cotton. Roll anode into cotton in the direction of the
cotton fibers, to gather it up (Picture 1). Feather the ends of the cotton so that the long fibers can be intertwined (Picture 2).

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SLEEVING SECURES COTTON

WRAP
The application of sleeving provides maximum wear resistance and reduces cutting through on sharp edges. Cut a piece of sleeving at least
three times as long as the anode and slip the first layer as on a finger. Twist the unused part of sleeving as shown in picture 3 and then slip
second layer over. Secure end of sleeving with a rubber band or polyester sleeving tie. The finished wrapping should be neat and compact
with no bulges or thin spots (Picture 4).

FOLD COTTON AROUND ANODE


The long-fiber cotton pad for flat anodes should be cut to provide a 13 mm (1/2 in.) overlap around the anode. Place the anode on the cotton
making sure that the length of the cotton fibers run in the direction of the long side of the anode (Picture 5). Fold the cotton evenly around
the anode and keep the bottom surface smooth. (Picture 6)

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INSERT INTO SLEEVING
Holding the wrapped anode by the bottom to keep the cotton smooth, insert it into a piece of sleeving at least three times as long as the
anode (Picture 7). Twist the unused part of sleeving and then slip the second layer over the anode and secure the end with rubber bands or
polyester sleeving ties (Picture 8).

CUT HOLE FOR HANDLE


Cut a hole in the sleeving large enough to screw the brush plating tool handle into the anode (Picture 9). The fully wrapped flat anode should
have a smooth even pad of cotton on the bottom, secured tightly by the sleeving (Picture 10).

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PREPARATION OF COTTON
BATTING
Cut a piece of cotton batting large enough to cover the concave side of the anode to be wrapped. It is important that the cotton fibers run
along the longest dimension of the pad. This pad can be split into two layers for use on smaller anodes (Picture 11). Thickness of the cotton
used may vary according to the application. Experience has shown that 5 mm (3/16 in.) thickness works well for the average application.

MOLD COTTON TO ANODE


Mold the cotton to the concave side of the anode (Picture 12). Wetting the anode with water will help the cotton adhere to the anode.

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FASTEN SLEEVING
Cut a suitable size of sleeving (at least three times the length of the anode) and slip half the sleeving over the anode and cover
(Picture 13). The remaining half of the sleeving is then twisted (Picture 14) and slipped over the anode. At least two layers of
sleeving cover are thus provided, the ends of which are secured with rubber bands or sleeving ties around the base of the
solution flow tube (Picture 15). Cut a hole in the sleeving for the brush plating tool handle and insert the handle (Pictures 16 & 17).
The finished tool should have a smooth concave surface. (Picture 18)

The sheet-type materials, including PermaWrap, jacket material and TuffWrap are cut so that the working face of the anode and, if desired, the
adjacent sides will be covered. A paper punch is used to punch holes in suitable areas and then polyester string or ties cut from polyester
sleeving are used to secure the cover to the anode. See figures below. White TuffWrap or other sheet type cover material may also be secured
by use of quick ties.

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PREPARATION OF TUFFWRAP
Cut a piece of TuffWrap 6-13 mm (1/4-1/2 in.) wider than the anode and long enough to cover the concave side of the anode and part way up
the end. Punch holes for sleeving ties (Picture 19).

MAKE TIES
Cut sleeving ties (#56 Polyester is best) as shown (Pictures 20, 21).

Tie Cover Tool


Secure cover to tool with ties (Picture 22). It may be necessary to make a cover with "ears" in some applications where a more secure cover is
required.

Step-by-Step Wrapping of OD Anodes with TuffWrap, PermaWrap, and Similar Materials

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PREPARE TUFFWRAP AND TIES
Cut a piece of TuffWrap 6-13 mm (1/4-1/2 in.) wider than the anode and long enough to cover the working surface and extend onto the top.
Punch holes and make sleeving ties (Picture 23).

TIE COVER TO TOOL


Secure cover to tool with ties (Picture 24).

Step-by-Step Wrapping of Flat and Some Special Anodes with TuffWrap, PermaWrap, and Similar Materials

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Presewn Jackets applied to various standard brush plating Tools

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5.5. MASKING

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Masking:
• Prevents plating from being applied to areas where it is not wanted.
• Defines exactly the size of the area that will be plated. This permits more accurate thickness control.
• Reduces the waste of metal from the plating solution.
• Reduces the possibility of contaminating the plating solution.
• Reduces the possibility of damage to parts from corrosive plating solutions.

TAPES
Masking tapes are generally used to mask off areas immediately adjacent to the area being plated. The materials used include vinyl tape,
polyester tape and aluminum tape. Absorbent tapes, such as painter’s masking tape, should not be used since they can lead to contamination
of preparatory and plating solutions. Masking must be done more carefully when a corrosive solution is to be used on a reactive base
material. Considerable heat will be developed while plating.
Careful masking includes:
• Careful cleaning of the surface before applying tape.
• Pressing tape into internal corners where a second layer of tape rises to cover a preceding layer of tape.
• Applying vinyl tape on surfaces such as ID without tension, since vinyl tape will tend to pull away from the ID when under tension.
Vinyl tape is used in most cases. Polyester tape is used when rhodium plating. AeroNikl vinyl tape is used with solutions plated at elevated
temperatures. Aluminum tape is used in combination with other masking materials on demanding masking jobs

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PAINTS
Paints are used to:
• Seal the edges of aluminum or vinyl tape when a large number of pieces of tape have been used.
• Protect larger and/or uneven surfaces on parts from corrosive attack by solution.
• Prevent contamination of the solution when it runs over large and/or uneven surfaces.
Tapes are almost always used in conjunction with paints; the tape should be close to the area being plated. When paint is used by itself,
plating may build up over the paint, particularly when high thicknesses of plating are applied. It then proves difficult to remove the paint at
the masked edge.

Example of using PVC sheet for masking

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5.6. BRUSH PLATING PROCESS PREPARATION

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Success in carrying out brush plating operations is assured by quickly and knowledgeably carrying out the various steps. The operator, as a
minimum, should be familiar with:
• The power pack, including the location and purpose of the various controls and meters.
• The appearance of the base material at the various stages of preparation.
• What a good and bad deposit looks like as it is being applied.
Some practice is recommended when the equipment is new to the operator, when a new base material is encountered, or when a new
plating solution is to be used. In practicing on a new base material, shorter and longer preparatory operations should be tried until the
operator is certain he is obtaining the desired appearance. In practicing with a new solution, very high and very low voltages should be tried
until the operator is certain that he recognizes a good deposit and a bad deposit (burned or otherwise). If possible, the operator should run a
plating test on a 25 mm x 25 mm (1 in. x 1 in.) area using a small anode. The operator should be able to plate a good deposit at the voltage
and current density given in the Technical Data Sheet for the particular solution.

PREPARE THE PART FOR PLATING


• The surface to be plated, as well as adjacent areas of the part, must be free of oil and grease, as well as other foreign, or non-
conductive coatings, prior to masking the part because they can impair adhesion of masking and plating. Some of these foreign
coatings may be an electroplate, paint, scale or anodized coating.
• Solvent cleaning is an effective method of removing most oils and greases. Choose an appropriate solvent for the specific surface
contamination. Other methods such as sand blasting, steam cleaning, etc. may be required to accomplish adequate precleaning. Oil
and grease should be removed prior to any mechanical cleaning of the surface. The part should look clean. Solvent cleaning should be
performed again after mechanical cleaning.
• Mask off the area to be plated.
• If the part is to be rotated in a lathe or turning head, or if a turning accessory is to be used, set the rpm to obtain optimum anode-to-
cathode speed. If the plating tool will be moved by hand, plan how proper tool movement speed will be obtained.

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SET-UP OF BRUSH PLATING EQUIPMENT
• Set the power pack near the work so that it is easily accessible and the meters or displays can be viewed. Connect the appropriate size
output leads to the power pack. Connect the alligator clamp lead to the part or lathe.
• Wrap tools making sure the covers do not get dirty.
• Pour sufficient solution into clean containers. Set up the solution pump and test its operation. Soak covered tools in their respective
solutions for at least five minutes.
• Arrange setup so all the equipment is handy.
• When using plating solutions that require heating, preheat the part and solution by suitable means. Methods used to preheat
solutions when a Flow System is not available include:
• Placing tightly capped bottles in a basin or tank of hot water.
• Pouring solutions into Pyrex or stainless steel containers and heating over a hot plate, taking care not to overheat the solution.
• Putting immersion heaters into the solution.

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General Set-Up
• The operator should be made as comfortable as possible, particularly on lengthy plating jobs. The operator then:
• Can concentrate his full attention on the job.
• Will not be diverted by unnecessary distractions.
• Will not have his efficiency decreased by fatigue.
• Adequate lighting should be provided, so that the operator can visually check that preparation and plating is proceeding properly.
• Refer to Material Safety Data Sheets (MSDS) for special safety precautions such as the necessity for ventilation, gloves and special
clothing.
• Provide for sufficient clean tap water or deionized water to rinse the part.
• Review the set-up procedure one last time to ensure that everything necessary for a successful operation is available and handy.

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PLATING THE PART
There are a few conditions relating to job set-up that must be met, and which will be taken for granted in this discussion. They are:
• The part is set up so that proper anode-to-cathode speed is being obtained.
• The correct plating tool is being used and adequate solution is being supplied to the work area.
• The plating solution is at its optimum temperature.
• All necessary calculations are made.
The part is ready to plate once the preparatory operation is properly carried out and the preplate, if required, is applied. The following is
typical of the steps the operator will carry out to plate a part, from start to finish, and to obtain satisfactory deposit quality. The part must be
thoroughly rinsed once the final preparatory operation has been carried out and the preplate applied, if one is required. Place the plating tool
on the part as rapidly as possible, without current if prewetting is required or with the voltage set to the recommended starting voltage if
prewetting is not required. At this point, observe the masked edges of the part or look at any external corners within the plating area. Burning
will occur here first. If there are minor burns, reduce the voltage one or two volts and continue plating. If the edge is heavily burned, stop
plating. Remove the defective deposit by etching or mechanical means. Prepare the base material as required and begin plating.
If there are no burns, observe the ammeter on the power pack. If the actual plating amperage is less than the maximum current density allows
and at least as great as the estimated plating amperage, continue plating. If the actual plating amperage is less than the estimated plating
amperage, the operator should increase the voltage by one or two volts. After plating a few seconds, observe the masked edges of the part
again, or look at any external corners within the plating area to check for burns. If necessary, adjust the voltage as described above. This cycle
is repeated until one of two things happens. Either the actual plating amperage will fall within the limits determined by the average current
density and the maximum current density with no burns at the masked edges, or the actual plating amperage will be less than the estimated
plating amperage due to less than optimal plating conditions. Once the optimum plating amperage has been obtained, the remaining
ampere-hours required to plate the part can be passed.

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Plating Conditions Under Direct Operator Control
The operator has under his direct control six plating conditions which, when properly set-up and controlled, lead directly or indirectly to good
final results. They are anode cover, voltage, freshness of solution, anode-to-cathode speed, plating temperature, and contact area.
Anode Cover
The anode cover directly affects the deposit quality. Using the proper cover material results in optimum deposit quality, adhesion, and
cohesion.
Voltage
Voltage is the most easily controlled plating condition, requiring only quickly made changes of the voltage control. Each solution is used
within a certain voltage range. The rather wide voltage range is broken down somewhat according to the size of the plating tool.

small tool large tool


Applied Voltage ________________ __________________
6 to 13 13 to 20

The above should be interpreted as follows:


Use the lower voltage range when using small tooling and plating conditions are less than favorable, such as when it is difficult to obtain
optimum anode-to-cathode speed or dipping for solution rather than using a pump, etc. Use the higher voltage range when using larger
tools and plating conditions are favorable.
Examples are as follows:

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Relationship between Current Density and Anode-to-Cathode Speed
In the interest of simplicity, most sections of this manual give only an optimum anode-to-cathode speed with voltage and current density
data based on it. Current density and anode-to-cathode speed, however, have an interrelated effect on the deposit quality, which can be
graphically expressed as follows.
It can be seen that near the optimum anode-to cathode speed, varying the speed has no appreciable affect on the optimum current density.
In some applications, however, it may be necessary to use considerably lower speeds such as when plating a small ID. In these cases, it will be
necessary to use considerably lower voltages and current densities to avoid burning.

Relationship between current density and anode-to-cathode speed

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SETTING UP A JOB - LONGER RANGE PREPARATION
The following deals with how to properly make long range preparations to carry out a job. This includes recommendations on selecting and
assuring that the proper solutions, power pack, preparatory tools, plating tools, etc. will be available when the job is to be done. The
recommendations are arranged in a step by step manner developed from practical experience. It is assumed that a basic SIFCO Applied
Surface Concepts installation is available including a power pack. Steps 1 through 7, however, can be used to select an appropriate
installation including a power pack or to assure that an appropriate installation has been purchased.
Step #1 Gather necessary information about the job, including:
• Number of parts to be done.
• Material on which SIFCO Process deposit will be applied. In most cases, it will be the material from which the part is made. If the part,
however, has had a surface treatment such as carburizing, an electroplate, etc., it should be understood that plating is to be applied to
the surface material and not to what is underneath.
• Area to be plated, i.e. size, shape.
• Purpose and requirements of deposit, that is why the coating is being applied and what it is expected to do.
• General idea of what is adjacent to the area to be plated.
• Thickness of deposit required.
Step #2 Select the plating solution.
This, in most cases, is an extremely important step. Proper selection assures that the desired results will be obtained with maximum ease and
minimum cost. In many cases, the pure metal or alloy will have already been chosen either by a
specification or blue print. In other cases, the metal or alloy will be obvious; for example, cadmium would be used to touch up a defective
cadmium deposit. In these cases, if there is a choice of solutions, only the selection of the proper
specific solution remains. This section should be carefully reviewed before making a selection. There are other cases, such as in salvage or
repair, where a particular metal or alloy is not specified or obvious. Section 4 should be carefully reviewed before making a selection.

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Step #3 Calculate amp-hr using Formula 1 in, Section 10.
Step #4 Decide on a general approach to the plating operation, i.e.:
• Will the part be rotated, will a turning accessory be used, or will the tool be moved by hand?
• Will the plating solution be dipped or pumped?
Answers to these questions are generally obvious, particularly after some experience has been gained with the SIFCO Process. If they are not
obvious, pursue possible approaches through Step #8.
Step #5 Decide what type of plating tool will be used, i.e. a standard SIFCO tool or a special tool. If a special tool is to be used, determine the
design.
On larger areas, the power pack size available, or to be selected, may become a factor. See Formula 6 in Section 10.
Step #6 Determine the contact area, if not determined in Step #5, based on the plating tool to be used.
Step #7 Determine the estimated plating amperage, if it was not established in Step #5. Use Formula 4 in Section 10.
Step #8 Determine the estimated plating time using Formula 7 in Section 10.
If you will dip for solution rather than pump solution, double the estimated plating time. Step #9 Determine the amount of plating solution
necessary for the job using Formula 8 in Section 10. Increase the amount of solution by some factor, if some solution will be inadvertently lost.
Factors vary from 1.5 to as much as 4.
Step #10 Determine the preparatory and preplate solutions required using Sections 12 and 15
Step #11 Determine the proper covers for all preparatory and plating tools using the Technical Data Sheets for each solution.
Step #12 Determine what kind and how much masking is required using Section 6. Two examples follow of the planning done on actual jobs.
Example #1 METRIC (US)
Step #1 Information gathered about the job.
• Number of parts: 1
• Base material: Steel

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• Area to be plated: A bore in a turbine wheel, 25 mm (1 in.) long x 89 mm (3.500 in.) diameter.
• Purpose of deposit: Repair worn ID. Color match was important. Good hardness, adhesion and cohesion were required.
• General idea of what is adjacent: The part overall had a 914 mm (3 ft) OD and a maximum thickness of about 25 mm (1 in.). Numerous
turbine blades were present on the OD.
• Thickness of deposit required: The diameter, after truing up ID by grinding, was 88.94 mm (3.5015 in.) A plating thickness of 25µ
(0.001 in.) would bring bore to the middle of the desired tolerance.
Step #2 Selecting the plating solution to be used. In this example, Cobalt met all requirements.
Step #3 Calculating amp-hr.
Area = 3.14 x D x L = 3.14 x 89 mm (3.50 in.) x 25 mm (1.00 in.)
Area = 70 sq cm (11 sq in.)
amp-hr = F x A x T = .0012 (200) x 70 (11) x 25 (0.001) = 2.1
Step #4 Deciding on general approach.
The small size of the area, the low thickness required, and the low amp-hr required suggested:
• A special tool was not required.
• Solution need not be pumped.
These ideas are justified in following steps. It was decided that the part would be cleaned, etched, desmutted, preplated, rinsed, and final
rinsed over a tray and then, being light enough, would be placed over a 356 mm x 432 mm (14 in. x 17 in.) collecting pan. A hole in the
collecting pan would direct solution back to a solution container. The solution container would be small but deep to:
• Minimize the amount of solution that had to be poured out.
• Permit thorough wetting of the tool while dipping.
Step #5 Deciding on plating tool to be used.
A 76 mm (3 in.) ID tool with a 5 mm (3/16 in.) thick cover was selected, since it would match the internal diameter.

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Step #6 Determining contact area.
The covered anode closely matched the ID, but pressure on the tool cover would compact it. It was estimated that 50% contact area, or 35 sq
cm (5.4 sq in.) would be obtained.
Step #7 Estimating plating amperage.
EPA = CA x ACD = 35 (5.4) x 1.08 (7) = 37.8 amp
Step #8 Estimating plating time.

The estimated plating time was doubled because the solution would be supplied by dipping. The total plating time, therefore, was estimated
to be 6.84 min. The plating time was so short that turning the part in a lathe or pumping solution was not necessary. The tool would be
moved by hand.
Step #9 Estimating plating solution required.

This obviously would not be enough to thoroughly wet the cover. It was estimated that 1 liter would be required.

Step #10 Determining preparatory and bonding solutions required and tools for them.
• Solutions: Electrocleaning, Etching, Desmutting, Bonding.

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• Tools: Small rod style, which would give a 13 mm (1/2 in.) x 25 mm (1 in.) contact area.
• Quantity of solution required: Approximately 0.1 liter for each. This amount, if a small beaker were used, would thoroughly wet the
anode cover.
Step #11 Selecting covers for tools.
Preparatory tools: Cotton batting and cotton sleeving.
Plating tool: Cotton batting and cotton sleeving were selected, since they are pure and inexpensive. Although cotton sleeving is not wear
resistant, it was felt that it should easily hold up during the 7 minute plating time.
Step #12 Deciding on masking required.
Aluminum tape and contact paper were selected to prevent the part from contaminating the plating solution.

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Example #2 METRIC (US)
Step #1 Information gathered about the job
• Number of parts: 1
• Base material: Steel with loose metal spray from a previous repair.
• Area to be plated: A 178 mm (7 in.) long area on a 61.87 mm (2.436 in.) OD.
• Purpose of deposit: Repair a loose fit on the shaft.
• General idea of what is adjacent: Although the part was a large recirculating fan 1524 mm (5 ft) long and with a maximum OD of 914
mm (3 ft), the area being plated was part of a simple small OD.
• Thickness of deposit required: It was decided to machine off the metal spray coating, leaving a gentle taper at edges. After machining,
the diameter was 58.01 mm (2.284 in.) The thickness required, therefore, was 3800µ (0.152 in.) on the dia. or 1900µ (0.076 in.) on the
radius. Since plating would have to be stopped several times for machining to remove edge build up and improve surface, a total of
approximately 2500µ (0.100 in.) of plating was planned.
Step #2 Selecting the plating solution to be used.
Copper was selected because of the high thickness required. Copper stays smooth to high thicknesses, is easily machined and is easy to
reactivate for more plating. The deposit, after enough copper was applied, would be machined .025 mm (0.001 in.) undersize on the diameter.
The machined copper would then be plated with 12.5µ (0.0005 in.) nickel for color match.
Step #3 Calculating amp-hr.

Step #4 Deciding on general approach.


The part would be rotated in a lathe. A flow-through anode would be used for copper plating.

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Step #5 Deciding on plating tool to be used.
It was decided that a special tool would be prepared for copper plating, since no standard tool was available to cover the full 178 mm (7 in.)
length. The largest power pack available was a 75 amp unit. The special tool was designed as
follows:

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A special anode, 191 mm (7 ½ in.) long x 60 mm (2 3/8 in.) wide x 48 mm (1 7/8 in.) high was made. It had a 38 mm (1 ½ in.) radius, 6 mm (1/4
in.) allowance for tool cover placed in the 60 mm (2 3/8 in.) x 191 mm (7 ½ in.) face. Solution would be fed through the tool handle to a 13 mm
(1/2 in.) hole in the anode. The 13 mm (1/2 in.) hole ran in the 178 mm (7 in.) direction and was plugged at each end. Solution would then flow
out through six 3 mm (1/8 in.) holes distributed
along the 178 mm (7 in.) direction of the anode. A 11 cm (4 ½ in.) square, flat anode was tentatively selected for nickel plating. Its use is
justified in later steps.

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Step #6 Determining contact area.
Copper: Not required (determined in Step #5).
Nickel: The contact area with the tool would be 114 mm (4 ½ in.) by 25 mm (1 in.) along the circumference.
CA = 114 mm (4.5 in.) x 25 mm (1 in.) = 29 sq cm (4.5 sq in.)
Step #7 Estimating plating amperage.
Copper: Not required (determined in Step #5).
Nickel: EPA = CA x ACD = 29 sq cm (4.5 sq in.) x 1.08 amp/sq cm (7 amp/sq in.) = 31.5 amp
Step #8 Estimating plating time.

If solution were supplied by dipping, the total nickel plating time would double to 15.2 minutes. This was felt to be a minimal increase in
processing time, which justified the use of the standard flat tools.
Step #9 Estimating plating solution required.

Since almost all of the solution could be caught for reuse, 28 liters of copper solution was estimated to be sufficient.

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A 11 cm (4 ½ in.) square, flat tool would be used to apply the nickel. It was felt that 0.16 liter would not be sufficient to wet the tool and area to
be plated. It was estimated that ½ liter would be required.
Step #10 Determining preparatory and preplate solutions required and tools for them.
• Solutions: To prepare base material: Electrocleaning, Etch, Desmut, and Nickel preplate.
To prepare copper for more copper, and copper for the final nickel coating: Electrocleaning, Etch.
• Tools: 11 cm x 11 cm (4 ½ in. x 4 ½ in.)
• Quantity of solution required:
Electrocleaning - 1 liter (would be used several times)
Etching - ½ liter (would be used once)
Desmutting - 1 liter (would be used several times)
Bonding - ½ liter (would be used once)
Step #11 Selecting covers for tools.
Preparatory tools: Cotton batting and cotton sleeving.
Copper plating tool: White TuffWrap. High wear resistance was required because of the long plating time. Its poor absorbency would present
no problems, since solution would be pumped. Nickel plating tool: Cotton batting and polyester sleeving. An absorbent cover was required,
since solution would not be pumped. Moderate wear resistance was required because of the 15.2 minute actual plating time.
Step #12 Deciding on masking required.
Aluminum tape and vinyl tape both 51 mm (2 in.) wide.

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THICKNESS TESTING
All the methods used to check thickness of tank electroplates may be used to check thickness of deposits. This includes use of micrometers,
microscopic methods, magnetic methods, eddy current methods or beta backscatter.

EVALUATING QUALITY OF DEPOSITS


The appearance of a deposit tells a great deal about its quality. Shiny, milky or slightly matte deposits are dense, while very matte or dull
deposits are porous or powdery; the latter may compress under load. In corrosion protection applications, freedom from surface to base
metal cracks or pores is important with non-sacrificial type coatings such as nickel. Close examination with a 5X or 10X eyepiece will usually
reveal any cracks or pores. Destructive evaluation of deposit quality may be performed by metallographic cross-section of the pre-
qualification sample. High magnification evaluation may be done of the highly polished cross-section, which will reveal any imperfections.

HARDNESS TESTING OF DEPOSITS


Microhardness tests are almost always the only suitable method for checking the hardness of SIFCO Process or tank electroplates. Other
methods require extremely thick deposits. The following table shows the recommended minimum thickness of deposit when taking various
hardness measurements on the surface of the deposit, i.e. with the indenter moving perpendicular to the surface of the deposit. It is based on
the deposit being 10 times thicker than the depth of the indentation and assumes that the base material is at least as hard as the deposit.

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Minimum Thickness of Deposit Required for Making Various Hardness Tests on Deposits of Various Hardnesses

Due to the excessive thickness required for the other tests, the Diamond Pyramid Hardness Test is usually the only test method suitable,
particularly with lighter loads. Microhardness tests should be run whenever possible on metallographic cross-sections. Metallographic cross-
sections provide very smooth, metallographically polished surfaces, the optimum surface for accurate measurements. Guidelines as to
minimum deposit thickness required using a 100 gm load are as given in the table below. With this method, there is no requirement that the
base material be at least as hard as the deposit.

Minimum Thickness of Deposit Required for 100 gram Load Knoop or DPH Microhardness Tests on Deposits of Various Hardnesses

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FORMULAS - METRIC
There are a number of formulas that prove very useful with the SIFCO Process. When used, they assure fast, efficient and trouble free plating
operations. Many individuals are reluctant to use formulas because they feel formulas are complicated, difficult to use, and/or require a lot of
thinking. A formula in fact is not complicated and is very simple to use. A formula simply tells what numbers to put where, and then what to
do with them. A formula, therefore, reduces the
amount of thinking required to get the desired information. A formula requires calculations. The calculations can be made using basic math
skills, but the use of a calculator is recommended to simplify the work and to reduce the possibility of error.
Example:
A formula commonly used in SIFCO Process plating is the formula for figuring the area of an outside diameter. The formula is:
A = 3.14 x D x L
In this formula: A = area of the outside diameter in square centimeters.
D = diameter in centimeters.
L = length of outside diameter in centimeters.
If the diameter measures 2.56 cm and the length measures 1.58 cm, these numbers are inserted in the appropriate place as follows:
A = 3.14 x 2.56 x 1.58
The x sign indicates the numbers should be multiplied, and when this is carried out the following results:
3.14 x 2.56 x 1.58 = 12.7007 round off to: 12.7
The area of the outside diameter is 12.7 square centimeters (sq cm).
Note: When using basic math skills, ordinarily only the first three significant numbers are used for following calculations. Three numbers
provide sufficient accuracy. The third, last number should be a rounding-off of the dropped numbers. In rounding-off, if the fourth number is
4 or less, leave the third number as is. If the fourth number is 5 or more increase the third number by a value of one. Zeros are not significant
numbers. The number 0.0012345, for example, should be rounded off to 0.00123.

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General Formulas
A. Formulas for determining the Area of typical surfaces requiring plating follow.
Dimensions are measured in centimeters and area results are in square centimeters

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Areas that require plating are often not simple squares or circles. They may be irregular shaped areas. There are three (3) methods that can be
used to determine the surface area of these irregular shapes.
• If the area is close in shape to one of the above geometrical shapes, use its formula.
• Break down a complicated shape into the above geometrical shapes and use their formulas.
• Trace the area on cross-section or graph paper and count the squares.

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B. Formula to determine REVOLUTIONS PER MINUTE when rotating the workpiece in a lathe or when using an ID Plater or ROTO-FLO Unit.
RPM = (MPM x 319) ÷ D
RPM = revolutions per minute at which the part or tool should be rotated.
MPM = recommended anode-to-cathode speed, in meters per minute, for plating solution to be used.
D = diameter, in millimeters, of the OD or ID to be plated.
Example:
MPM = 15.2
D = 50.8
Placing these values in the above formula:
RPM = (15.2 x 319) ÷ 50.8 = 95.5

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SIFCO Process Formulas
FORMULA 1. TO CONTROL THICKNESS OF METAL DEPOSITED.
This formula is used to determine the ampere-hours that should be passed while plating to obtain the desired thickness of deposit on the
area to be plated.
AMP-HR = F x A x T
F = factor (technical data sheet).
A = area of surface to be plated in square inches.
T = thickness of deposit desired in inches.
Example: Two thousandths (0.002) in. of a deposit is required on a surface having three square inches of area. Therefore:
F = 250
A=3
T = 0.002
Placing these values in the above formula:
AMP-HR = 250 x 3 x 0.002
AMP-HR = 1.5
The amp-hr required for the job is 1.5, and when this number of amp-hr is passed in plating, the desired amount of metal will have been
applied.

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FORMULA 2. TO DETERMINE PLATING TOOL TO WORKPIECE CONTACT AREA BY LENGTH TIMES WIDTH METHOD.
CA = L x W
CA = contact area made by the plating tool on the part in square inches.
L = distance of contact made along the length in inches. For ID and OD it will be in the direction parallel to the centerline.
For flat and square or rectangular contact areas it will be one dimension.
W = distance of contact made along the width in inches. For ID and OD it will be along the circumference and this can be
measured with a flexible rule or some other means. For flat and square or rectangular contact areas it will be the other
dimension.
Example: A flat rectangular tool 4 in. x 3 in. will be used to plate a 12 in. x 12 in.
flat area.
CA = L x W
CA = 4 x 3
CA = 12 sq in.
Example: A 1 in. x 2 in. flat area will be plated with a 4 in. x 4 in. flat tool.
CA = L x W
CA = 2 x 1
CA = 2 sq in.

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Example: A 3 in. I.D., 1.5 in. long will be plated with a 2 in. diameter plating tool covering the full length of the bore. It is estimated that there
will be a 1
in. distance covered along the circumference.
CA = L x W
CA = 1.5 x 1
CA = 1.5 sq in.
Example: A 2 in. OD, 2 in. long is to be plated with a special tool covering the full length and 1.75 in. of the circumference.
CA = L x W
CA = 2 x 1.75
CA = 3.5 sq in.

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FORMULA 3. TO DETERMINE PLATING TOOL TO WORKPIECE CONTACT AREA BY PERCENT METHOD.
CA = % x A
CA = contact area made by the plating tool on the part in square inches.
% = the percentage of the total area being plated that is in contact with the plating tool.
A = area being plated in square inches.
This formula is generally used on OD's and ID's. It is used occasionally on other types of areas.
Example: An OD having an area of 12 sq in. will be plated with a semi-circular tool that makes contact with 40% of the area.
CA = % x A
CA = 0.40 x 12
CA = 4.8 sq in.

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FORMULA 4. TO ESTIMATE PLATING AMPERAGE TO BE DRAWN WITH A GIVEN SOLUTION AND PLATING TOOL.
EPA = CA x ACD
EPA = estimated plating amperage.
CA = the plating tool to workpiece contact area.
ACD = the average current density for the solution (from the Technical Data Sheet).
Example: A semi-circular tool will be used to plate a 0.9554 in. OD x 1 in. long with 0.002 in. of a deposit. The tool will cover 50% of the area to
be plated. A 75 amp power pack is to be used. Plating solution will be pumped through the anode.
CA = 50% x 3 sq in. = 1.5 sq in. of contact area.
ACD = 7 amp/sq in.
Placing these values in the above formula:
EPA = 1.5 x 7
EPA = 10.5 amp
The estimated plating amperage in this example is 10.5 amp.

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FORMULA 5. TO DETERMINE CURRENT DENSITY
Current density is an important concept in SIFCO Process plating. This formula allows an operator to compute the actual current density for a
given plating operation.
CD = PA ÷ CA
CD = current density in amp/sq in.
PA = plating amperage.
CA = contact area made by the plating tool on the part in square inches.
Example: A semi-circular tool touching 50% of the O.D. is being used to plate the part from formula 4. With the solution being used, 6
amperes are being drawn. Therefore:
PA = 6
CA = 1.5 sq in.
Placing these values in the above formula:
CD = 6 ÷ 1.5
CD = 4 amp/sq in.
In this operation a current density of 4 amp/sq in. is being used. The average current density for this plating solution is 7 amp/sq in. In this
application then, only 57% of the average current density is being used. A low plating speed can be expected at this current density. This
value should be compared with the average current density for the given solution. If required, the operator should make appropriate
adjustments.

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FORMULA 6. TO DETERMINE OPTIMUM CONTACT AREA WHEN SELECTING A PLATING TOOL
MAO = The Maximum Amperage Output of the power pack to be used.
ACD = The Average Current Density of the solution to be used.
PCA = The Practical Contact Area. The amount of plating tool to
workpiece contact area that is physically practical, given the shape and size of the part to be plated.
MCA = Maximum contact area. MAO ÷ ACD.
OCA = Optimum contact area. The lesser of MCA or PCA.
Example: Copper is to be plated on an 8 in. internal diameter, 6 in. long. The part will be rotated in a lathe and a 75 amp power pack will be
used:
MAO = 75
ACD = 3 amp/sq in.
PCA = 100% of the area to be plated or 150.72 sq in.
MCA = MAO ÷ ACD = 75 ÷ 3 = 25 sq in.
Since the MCA (25 sq in.) is less than the PCA (150.72 sq in.), the OCA is 25 sq in..
Proof: Using 25 sq in. of tool contact at 3 amp/sq in., the Plating Amperage will be 75 amp.

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FORMULA 7. TO ESTIMATE PLATING TIME WHEN SETTING UP A JOB
EPT = AMP-HR ÷ EPA
EPT = estimated plating time.
AMP-HR = value to control thickness of deposit (formula 1).
EPA = value to estimate plating amperage (formula 4).
Example: AMP-HR = 1.26
EPA = 10.5
Placing these values in the above formula:
PT = 1.26 ÷ 10.5
EPT = 0.12 hr
To calculate EPT in minutes, multiply the value obtained above by 60:
EPT(min) = EPT x 60
EPT(min) = 0.12 x 60
EPT(min) = 7.2
The formula indicates that a plating time of 7.2 minutes can be expected. Many factors may increase the plating time.

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FORMULA 8. TO DETERMINE AMOUNT OF PLATING SOLUTION REQUIRED FOR A JOB
Liters = AMP-HR ÷ MRU
AMP-HR = the amp-hr to be passed on the particular job
MRU(L) = Maximum Recommended Use in amp-hr per liter.
Example: AMP-HR = 1.26
MRU = 25
Placing these values in the above formula:
Liters = 1.26 ÷ 25
Liters = 0.050 or 50 ml

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FORMULA 9. TO DETERMINE PARTS PER LITER
This formula should be used when repetitive low ampere-hour parts are to be plated, in order to determine the number of parts which can be
plated with a liter of solution.
MRU = The Maximum Recommended Use in amp-hr per liter, for the plating solution to be used.
AMP-HR = The calculated ampere-hours per part.
PARTS PER LITER = MRU ÷ A MP-HR
Example: There are 400 parts, each to be plated 1.26 amp-hr.
MRU = 25
AMP-HR = 1.26
Placing these values in the above formula:
PARTS PER LITER 25 ÷ 1.26 = 19.84 
Approximately 20 parts can be plated with a single liter of solution.

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FORMULA 10. TO CHECK AMPERE-HOUR METER ACCURACY
This formula is used periodically as a maintenance procedure to ensure that the amp-hr meter is accurate.
AMP-HR = AMP x HR
Example: The test is run by shorting the dc output leads and running the power pack for a set time (hr) at a set amperage. Assume a test is run
for 3 minutes at 20 amp. Therefore:
AMP = 20
HR = 3 ÷ 60 = 0.05
Placing these values in the above formula:
AMP-HR = 20 x 0.05
AMP-HR = 1.00
The computed value (1.00) should be close (within a few percent) to that shown on the amp-hr meter after shorting the dc output leads and
running for 3 minutes at 20 amp.

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5.7. SELECTING PLATING SOLUTIONS AND DEPOSITS FOR APPLICATION

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DEPOSIT USES
Cadmium Provide corrosion protection (indoor or outdoor) at room temperature [approximately 21° C (70 °F)] for various materials
particularly iron and steel in aircraft, military, marine and tropical applications. Anodic to iron and steel, it is sacrificial and does not have to be
pore-free. In comparison to zinc, the other common anodic coating:

Cadmium
• Is more expensive.
• Is more attractive.
• Produces fewer corrosion products.
• Provides lower coefficient of friction (threaded fasteners).
• Is more resistant to moisture and salt spray.

Chromium
• "Decorative" applications in which a thin coating, often on nickel or copper and nickel, serves as a non-tarnishing and durable
corrosion protection coating.
• "Hard Chrome." Product improvement or salvage applications where resistance to heat, wear, corrosion and/or erosion is desired.
• Mold release coating on dies and molds.
• Provide a low coefficient of friction.

Copper
• Stop-off in carburizing and nitriding.
• Undercoating for nickel and chrome in decorative corrosion protection applications.
Iron Salvage of worn or mismachined parts particularly in high thickness and on large areas. Softer, more ductile, easier to machine and lower
in cost than nickel. Lead Corrosion protection of iron and steel particularly in industrial, sulfuric acid and hydrofluoric acid environments.

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Nickel
• Corrosion protection of aluminum, copper, iron, steel, etc. by itself or over copper and/or under chromium.
• Salvage of worn or mismachined parts.
• Improve or permit brazing of stainless steel, high-temperature nickel or cobalt base super-alloys, tungsten carbide, etc.

Tin
• Corrosion protection of iron, steel, and copper where non-tarnishing properties are desired. Cathodic to iron and steel. It is, therefore,
not sacrificial and must be pore-free.
• Improve solderability.
• Bearing material, usually as an alloy.
• Anti-seize, anti-gall "break-in" coating.
• Low cost, low contact resistance coating on electrical connectors such as bus bars and printed circuit board contact fingers. Zinc
Provide corrosion protection (indoor or outdoor) at room temperature [approximately 21 oC (70 °F)] for various materials, particularly
iron and steel, in industrial environments. Anodic to iron and steel. It is, therefore, sacrificial and does not have to be pore-free. In
comparison to cadmium, the other common anodic coating, zinc is:
• Considerably less expensive.
• Forms heavier, less attractive corrosion products.
• More resistant to an industrial atmosphere.

Gold
• Provide oxidation resistance at high temperatures.

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• Corrosion resistance against chemical attack.
• Provide low electrical contact resistance on high quality connectors.
• Provide good solder ability after extended storage.
• Infrared reflectivity.
• Decorative.
• Improve brazing.
Indium Diffusion alloys with lead or silver in high-quality, high load bearings where corrosion must be resisted.

Palladium
• Diffusion barrier.
• Pre-placed brazing material, i.e. the plating serves as the brazing material when joining two parts.

Platinum
• High temperature 1000 ° C (1834° F) switches and connectors.
• Provide corrosion protection of various materials under heat and/or severely corrosive environments.

Rhodium
• Provide low electrical contact resistance on high quality parts where wear is a factor.
• Reflectors. Does not tarnish and therefore provides maximum reflectance of visible light for extended periods.
Silver
• Provide low electrical contact resistance on large connectors and bus bars at moderate cost.
• Reflectors. Maximum reflectivity of visible light but tarnishes.
• Provide corrosion resistance in chemical and food processing.

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• Anti-seize, anti-gall coating on stainless steel, titanium, steel and copper.
• Bearings. Diffused with lead and indium for high speed, high load applications.
• Pre-placed brazing material, i.e. the plating serves as the brazing material when joining two parts.
• Seal surface on seal rings.
• Coating to inhibit fretting corrosion.

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6. PLATING

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6.1. GENERAL

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lectroplating is an electrode position process for producing a dense, uniform, and adherent coating, usually of metal or alloys, upon a
E surface by the act of electric current. The coating produced is usually for decorative and=or protective purposes, or enhancing specific
properties of the surface. The surface can be conductors, such as metal, or nonconductors, such as plastics. Electroplating products are
widely used for many industries, such as automobile, ship, air space, machinery, electronics, jewelry, defense, and toy industries. The core part
of the electroplating process is the electrolytic cell (electroplating unit). In the electrolytic cell (electroplating unit) a current is passed through
a bath containing electrolyte, the anode, and the cathode. In industrial production, pretreatment and post treatment steps are usually needed
as well. The workpiece to be plated is the cathode (negative terminal). The anode, however, can be one of the two types: sacrificial anode
(dissolvable anode) and permanent anode (inert anode). The sacrificial anodes are made of the metal that is to be deposited. The permanent
anodes can only complete the electrical circuit, but cannot provide a source of fresh metal to replace what has been removed from the
solution by deposition at the cathode. Platinum and carbon are usually used as inert anodes. Electrolyte is the electrical conductor in which
current is carried by ions rather than by free electrons (as in a metal). Electrolyte completes an electric circuit between two electrodes. Upon
application of electric current, the positive ions in the electrolyte will move toward the cathode and the negatively charged ions toward the
anode. This migration of ions through the electrolyte constitutes the electric current in that part of the circuit. The migration of electrons into
the anode through the wiring and an electric generator and then back to the cathode constitutes the current in the external circuit. The
metallic ions of the salt in the electrolyte carry a positive charge and are thus attracted to the cathode. When they reach the negatively
charged workpiece, it provides electrons to reduce those positively charged ions to metallic form, and then the metal atoms will be deposited
onto the surface of the negatively charged workpiece. Fig. F1 illustrates a typical plating unit for plating copper from a solution of the metal
salt copper sulfate (CuSO4). The cathode, which is the workpiece to be plated, is charged negatively. Some of the electrons from the cathode
+
bar transfer to the positively charged copper ions (Cu2 ), setting them free as atoms of copper metal. These copper atoms take their place on
2_
the cathode surface and copper plate it. Concurrently, the same number of sulfate ions SO4 is discharged on the copper anodes, thereby
completing the electrical circuit. In so doing, they form a new quantity of copper sulfate that dissolves in the solution and restores it to its
original composition. This procedure is typical of ordinary electroplating processes with sacrificial anodes; the current deposits a given

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amount of metal on the cathode and the anode dissolves to the same extent (of the same electrical charge), maintaining the solution more or
less uniformly.

Fig.1 Principle of electroplating

ELECTROCHEMISTRY FUNDAMENTALS
When a direct electric current passes through an electrolyte, chemical reactions take place at the contacts between the circuit and the
solution. This process is called electrolysis. Electrolysis takes place in an electrolytic cell. Electroplating is one specific type of

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electrolysis. Besides electroplating, electrolysis has also been widely used for preparation of halogens and notably chlorine, and refining of
metals, such as copper and zinc. Understanding the electrochemical principles of electro deposition is essential to the development of
electroplating technologies. Some basic concepts are presented below.

Oxidation/Reduction
In a wider sense, all electron-transfer reactions are considered oxidation=reduction. The substance gaining electrons (oxidizing agent, or
oxidant) oxidizes the substance that is losing electrons (reducing agent, or reductant). In the process, the oxidizing agent is itself reduced by
the reducing agent. Consequently, the reduction process is sometimes called electronation, and the oxidation process is called ‘‘de-
electronation.’’ Because a cathode is attached to the negative pole of the electric source, it supplies electrons to the electrolyte. On the
contrary, an anode is connected to the positive pole of the electric source; therefore, it accepts electrons from the electrolyte. Various
reactions take place at the electrodes during electrolysis. In general, reduction takes place at the cathode, and oxidation takes place at the
anode.

Anode and Cathode Reactions


Electro deposition or electrochemical deposition (of metals or alloys) involves the reduction of metal ions from electrolytes. At the cathode,
electrons are supplied to cations, which migrate to the anode. In its simplest form, the reaction in aqueous medium at the cathode follows the
equation:
n+ -
M + ne M
with a corresponding anode reaction. At the anode, electrons are supplied to the anions, which migrate to the anode. The anode material can
be either a sacrificial anode or an inert anode. For the sacrificial anode, the anode reaction is:
n+ -
M M + ne

In this case, the electrode reaction is electro dissolution that continuously supplies the metal ions.

Faraday’s Laws of Electrolysis

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In 1833, the English scientist, Michael Faraday, developed Faraday’s laws of electrolysis. Faraday’s first law of electrolysis and Faraday’s second
law of electrolysis state that the amount of a material deposited on an electrode is proportional to the amount of electricity used. The amount
of different substances liberated by a given quantity of electricity is proportional to their electrochemical equivalent (or chemical equivalent
weight). In the SI system, the unit quantity of electricity charge and the unit of electric charge are coulomb (C); one coulomb is equivalent to
one ampere flowing for one second (1C ¼ 1Asec). The electrochemical equivalent of an element is its atomic weight divided by the valence
2+ 0
change involved in the reaction. For example, for the reaction, Fe Fe , the valence change is 2, and the electrochemical equivalent of iron
is 55.85 / 2 = 27.925 in this reaction. Depending on the specific reaction, one element may have different equivalent weights, although it has
only one atomic weight.

Current Efficiency, Current Density, and Current Distribution


Faraday’s laws give theoretical prediction of electro deposition in an ideal situation. In a real application, many factors influence the coating
quantity and quality. Current efficiency It is stated in Faraday’s laws that the amount of chemical charge at an electrode is exactly proportional
to the total quantity of electricity passing. However, if several reactions take place simultaneously at the electrode, side reactions may
consume the product. Therefore, inefficiencies may arise from the side reactions other than the intended reaction taking place at the
electrodes. Current efficiency is a fraction, usually expressed as a percentage, of the current passing through an electrolytic cell (or an
electrode) that accomplishes the desired chemical reaction. Or,
Current efficiency = 100 X WAct / WTheo
Where WAct is the weight of metal deposited or dissolved, and WTheo is the corresponding weight to be expected from Faraday’s laws if there is
no side reaction. Note that the cathode efficiency is the current efficiency applied to the cathode reaction, and the anode efficiency is the
current efficiency applied to the anode reaction. Current density Current density is defined as current in amperes per unit area of the
electrode. It is a very important variable in electroplating operations. It affects the character of the deposit and its distribution.

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Current distribution
The local current density on an electrode is a function of the position on the electrode surface. The current distribution over an electrode
surface is complicated. Current will tend to concentrate at edges and points, and unless the resistance of the solution is very low, it will flow to
the workpieces near the opposite electrode more readily than to the more distant workpieces. It is desired to operate processes with uniform
current distribution. That is, the current density is the same at all points on the electrode surface.
Potential Relationships In electroplating, sufficient voltage should be provided by the power source. The voltage–current relationship
follows Ohm’s law.
The concepts of electrode potentials, equilibrium electrode potential, over potential, and overvoltage are of fundamental importance.
The voltage–current relationship: Ohm’s law The current is driven by a potential difference, or voltage through the conducting medium,
either electrolytic or metallic. The voltage necessary to force a given current through a conductor is given by Ohm’s law:
E = IR
Where E is the voltage (V) and R the resistance of the conductor (Ω).

Electrode potentials
The electrode potential is the electrical potential difference between an electrode and a reference electrode. The absolute potential of an
electrode is not directly measurable. Therefore, the electrode potential must always be referred to an arbitrary zero point that is defined by
the potential of the reference electrode.

Equilibrium electrode potential


When a metal is immersed into a solution containing ions of that metal, equilibrium is set up between the tendency of the metal to enter
solution as ions and the opposing tendency of the ions to lose their charge and deposit on or in the metal.

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Depending on the conditions of the system, this can occur in either direction. At equilibrium, the driving forces for metal ions being
discharged and metal atoms being ionized are equal. The potential difference between the metal and the solution phases under these
conditions is the equilibrium potential difference. The equilibrium electrode potential is the electrical potential of an electrode measured
against a reference electrode when there is no current flowing through the electrode. It is also called open circuit potential (OCP). The
equilibrium potential between a metal and a solution
of its ions is given by the Nernst equation as follows:

0
where E is the standard electrode potential, which is a constant characteristic of the material of the electrode;
R the gas constant (8.3143 J/k/mol); T the absolute temperature (K); F the Faraday constant; n the valence change; a the activity of the metal
ion. In approximation, the concentration of the metal ion can be used instead of the activity.
If numerical values are substituted for R and F, and T is at 25°C (298 K), and base 10 logarithm is used instead of base e, the Nernst equation
can be expressed as:

0 0
In the above equation, if a = 1, then E = E . The standard potential of an electrode E is the potential of an electrode in contact with a solution
of its ions of unit activity. The standard potentials are always expressed against the standard hydrogen electrode, the potential of which is
zero by definition. The standard potentials are a function of temperature; they are usually tabulated for 25°C. Standard electrode potential is
also called normal electrode potential.

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Overpotential and overvoltage
The equilibrium is dynamic with metal ions being discharged and metal atoms being ionized, but these two effects cancel each other and
there is no net change in the system. For the realization of metal deposition at the cathode and metal dissolution at the anode, the system
must be moved away from the equilibrium condition. An external potential must be provided for the useful electrode reactions to take place
at a practical rate; this external potential may have several causes. Overpotential is the difference in the electrode potential of an electrode
between its equilibrium potential and its operating potential when a current is flowing. The overpotential represents the extra energy needed
to force the electrode reaction to proceed at a required rate (or its equivalent current density). Consequently, the operating potential of an
anode is always more positive than its equilibrium potential, while the operating potential of a cathode is always more negative than its
equilibrium potential. The overpotential increases with increasing current density. The value of the overpotential also depends on the
inherent speed of the electrode reaction. A slow reaction (with small exchange current density) will require a larger overpotential for a given
current density than a fast reaction (with large exchange current density). Overpotential is also referred to as polarization of the electrode. An
electrode reaction always occurs in more than one elementary step, and there is an overpotential associated with each step. Even for the
simplest case, the overpotential is the sum of the concentration overpotential and the activation overpotential.
Overvoltage is the difference between the cell voltage (with a current flowing) and the open-circuit voltage (OCV). The overvoltage represents
the extra energy needed to force the cell reaction to proceed at a required rate. Consequently, the cell voltage of an
electrolytic cell is always more than its OCV, while the cell voltage of a galvanic cell (e.g., a rechargeable battery during discharging) is always
less than its OCV. Occasionally, it is also referred to as polarization of the cell. The overvoltage is the sum of the overpotentials of the two
electrodes of the cell and the ohmic loss of the cell. Unfortunately, the terms overvoltage and overpotential
are sometimes used interchangeably.

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SURFACE PREPARATION
Workpieces to be plated may be put through a variety of pretreating processes, including surface cleaning, surface modification, and rinsing.
A schematic flowsheet of a typical electroplating plant, including surface treatment and waste treatment, is depicted in
Fig. F2. The purpose of surface pretreatment is to remove contaminants, such as dust and films, from the substrate surface. The surface
contamination can be extrinsic, composed of organic debris and mineral dust from the environment or preceding processes. It can also be
intrinsic, such as a native oxide layer. Contaminants and films interfere with bonding, which can cause poor adhesion and even prevent
deposition. Therefore, surface pretreatment is important to ensure plating quality. Most (metal) surface treatment operations have three basic
steps: surface cleaning, surface treatment, and rinsing.

Surface Cleaning
Cleaning methods should be able to minimize substrate damage while removing the contaminants, dust, film, and=or debris. Cleaning
processes are based on two approaches: chemical approach and mechanical approach. Chemical approaches A chemical approach usually
includes solvent degreasing, alkaline cleaning, (soak cleaning), and acid cleaning (acid pickling). Solvent Degreasing. Contaminants consist of
oils and grease of various types, waxes, and miscellaneous organic materials. These contaminants can be removed by appropriate organic
solvents, either by dipping the workpieces in the solvent or by vapor decreasing.
Alkaline Cleaning. Workpieces are immersed in tanks of hot alkaline cleaning solutions to remove dirt and solid soil. A special type of alkaline
cleaning is electrocleaning. In electrocleaning, the workpiece can be either the cathode (namely direct cleaning) or the
anode (reverse cleaning). Electrocleaning adds to the chemical action of the cleaner the mechanical action caused by plentiful gas evolution
at the surface of the workpiece.
Acid Cleaning. Acid cleaning can move heavy scale, heat-treat scale, oxide, and the like. The most commonly used acids include sulfuric and
hydrochloric. Pickling can also be combined with current to be more effective.

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Mechanical approaches
Mechanical preparations include polishing, buffing, and some variations. Polishing is to remove small amounts of metal by means of
abrasives. It produces a surface that is free of the larger imperfections left by grinding, and is a preliminary to buffing. Buffing
is similar to polishing, but uses finer abrasives to remove very little metal. Buffing can produce an extremely smooth surface.

Surface Modification
Surface modification includes change in surface attributes, such as application of (metal) layer(s) and=or hardening.

Rinsing
In wet plating, when workpieces are transferred from one treating solution to another, or when they leave the final treating solution, they
carry some of the solution in which it has been immersed. This solution is called drag-out. In most cases, this residue solution
should be removed from the workpieces surface by rinsing before the workpieces enter the next step in sequence, or come out of the final
processing solution. The dirty rinse water will be sent to the wastewater treatment facilities before being discharged to a public
sewage system.

ELECTROLYTIC METAL DEPOSITION


There are three types of electrolytic metal deposition processes: direct current electrodeposition, pulse plating, and laser-induced metal
deposition.

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Direct Current Electrodeposition
In the direct current (DC) electrodeposition, the current source is. A power source in the form of a battery or rectifier (which converts
alternating current electricity to regulated low-voltage DC current) provides the necessary current. Electroplating is performed in a plating
unit. Electrodes, immersed in the electroplating bath (electrolyte), are connected to the output of a DC current source. The workpiece that is
to be plated acts as a negatively charged cathode. The positively charged anode(s) completes the electric circuit. This type of circuit
arrangement directs electrons (negative charge carriers) into a path from the power supply (rectifier) to the cathode (the workpiece to be
plated). The geometric shape and contour of a workpiece to be plated affect the thickness of the deposited layer. In general, workpieces with
sharp corners and features will tend to have thicker deposits on the outside corners and thinner ones in the recessed areas. The cause of this
difference in the resulting layer thickness is that the DC current flows more densely to sharp edges than to the less accessible recessed areas.
In other words, the current distribution is not uniform. Therefore, a judicial placement of the anode(s) as well as modifications of the current
density are required to overcome the thickness irregularity effects.

Pulse Plating
Electrodeposition using pulsed currents is known as pulse plating. The pulsed currents can be unipolar (on–off) or bipolar (current reversal).
Pulses can be used along or be superimposed on a DC feed. By using the bipolar pulse, metal deposition occurs in the cathodic pulse period,
with a limited amount of metal being redissolved in the anodic period. This repeated deposition and partial redissolution could improve the
morphology and the physical properties of the deposit. Laser-Induced Metal Deposition In laser-induced metal deposition, a focused laser
beam is used to accelerate the metal deposition. Experiments have shown that the deposition rate can be increased by 1000 times. The
plating equipment mainly consists of a laser head with focusing optics and the electrolytic cell. The focused laser beam can pass through a
hole in the anode through the electrolyte and impinge on the cathode surfaces.
ELECTROLYTE
Different metals may need different types of electrolyte. The composition and properties of the electrolyte is very important for the coating
quality. Types and Components Types of electrolytes include water solutions of acids, of high temperature or low pressure. In addition to

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metal salts, electrodeposition electrolytes usually contain a number of additives for various purposes. Some agents are used to increase
electrolyte conductivity (supporting electolytes). Others may be used for increasing bath stability (stabilizers), activating the surface
(surfactants or wetting agents), improving leveling or metal distribution (leveling agents), or optimizing the chemical, physical, or technology
properties of the coating. These coating properties include corrosion resistance, brightness or reflectivity, hardness, mechanical strength,
ductility, internal stress, wear resistance, or solderability.

Properties of Electrolyte
The properties of electrolyte are usually characterized by electrolytic conductance, covering power, macrothrowing power, and
microthrowing power. Electrolytic Conductance Electrolytic conductance is different from electrical conductance in metal. Electronic
conductance is called a ‘‘Class I’’ conductor, while electrolytic conductance is a ‘‘Class II’’ conductor. Both inorganic and organic salts, acids or
alkalis can be used to increase the electrolytic conductance. The conductivity of an electrolyte is a function of the degree of dissociation, the
mobility of the individual ions, the temperature and viscosity, and the electrolyte composition.

Covering Power
Covering power describes the extent to which an electrodeposition electrolyte can cover the entire surface of a workpiece being plated, with
reasonable uniform thickness. Covering power is influenced by the nature of the substrate surface, the electrolyte composition, the
temperature and viscosity, and the current density.

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Macrothrowing Power
Macrothrowing power predicts the ability of an electrolyte to lay down as nearly as possible a uniformly thick deposit across the surface of a
workpiece. A good covering power is a prerequisite for good macrothrowing power. Other factors that affect macrothrowing power include
the current distribution and current density, electrolyte composition, electrolytic conductance, and electrolyte agitation. Microthrowing
Power Microthrowing power indicates the extent to which metal electrodeposition occurs at the outer plane of the substrate or at the base of
valleys or cracks. Microthrowing power can be improved by activating the surfaces at the base of valleys or cracks to promote
electrodeposition there, while inhibiting the outer surfaces by using inhibitors preferentially. In many cases, microthrowing power is inversely
related to macrothrowing power.

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TYPES OF ELECTROPLATING PROCESSES
Depending on the size and geometry of the workpieces to be plated, different plating processes, including mass plating, rack plating,
continuous plating, and in-line plating, may be adopted.

Mass Plating
Mass plating is used for small workpieces to be plated in large quantities, such as nuts and bolts, but it is not used for delicate workpieces. The
most widely used mass plating system is called barrel plating, where the workpieces are loaded into a plating barrel. Other mass plating
containers include plating bells and vibratory units.

Rack Plating
Some workpieces cannot be mass plated because of their size, shape, or special features. Rack plating means workpieces are mounted on a
rack for the appropriate pretreatment plating and post treatments. Racks are fixtures suitable for immersion in the plating solution. Rack
plating is sometimes called batch plating.

Continuous Plating
Continuous plating means the workpieces to be plated move continuously passing either one row or between two rows of anodes.
Continuous plating is usually used for a workpiece of simple and uniform geometry, such as metal strip, wire, and tube.

In-Line Plating
In-line plating is used to integrate the plating and finishing processes into a main production line. The benefit of in-line plating includes
exclusion of pretreatment steps and a significant reduction in material, chemical and energy consumption, and waste discharge.

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TYPES OF METAL COATINGS
Plating metals can be roughly classified into the following categories with the typical applications.

Sacrificial Coatings
Sacrificial coatings are primarily used for the protection of the base metal, usually iron and steel. Another name for sacrificial coating is anodic
coating, because the metal coatings are anodic to the substrate metal, so the coatings sacrifice themselves to protect the base metal from
corrosion. Zinc (Zn) and cadmium (Cd) coatings can be used as sacrificial coatings. Because of high toxicity, cadmium plating is now forbidden
by law in many countries.

Decorative Protective Coatings


Decorative protective coatings are primarily used for adding an attractive appearance to some protective qualities. Metals in this category
include copper (Cu), nickle (Ni), chromium (Cr), zinc (Zn), and tin (Sn).

Engineering Coatings
Engineering coatings (sometimes called functional coatings) are used for enhancing specific properties of the surface, such as solderability,
wear resistance, reflectivity, and conductivity. Metals for engineering purpose include precious gold (Au) and silver (Ag), six platinum metals,
tin, and lead (Pb). The six platinum metals are ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir), and platinum (Pt). These
six metals are noble, i.e., with positive electrode potentials and they are relatively inert.

Minor Metal Coating


Minor metals here refer to iron (Fe), cobalt (Co), and indium (In). They are easily plated but have limited applications in electroplating.

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Unusual Metal Coating
The unusual metals are rarely electroplated and can be divided into the following categories: 1) easily platable from aqueous solutions but
not widely used, such as arsenic (As), antimony (Sb), bismuth (Bi), manganese (Mn), and rhenium (Re); 2) platable from organic electrolyte but
not aqueous electrolyte, such as aluminum (Al); and 3) platable from fused-salt electrolyte but not aqueous electrolyte, including refractory
metals (named because of their relatively high melting points), such as titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb),
tantalum (Ta), molybdenum (Mo), and tungsten (W). The periodic table in Fig. F3 shows that the metals that can be electrodeposited from
aqueous solutions are those inside the frame.

Alloy Coatings
An alloy is a substance that has metallic properties and is composed of two or more chemical elements, at least one of which is a metal. The
elements composing the alloy are not distinguishable by the unaided eye. Examples of alloy coating include gold–copper–cadmium, zinc–
cobalt, zinc–iron, zinc–nickle, brass (an alloy of copper and zinc), bronze (copper–tin), tin–zinc, tin–nickle, and tin–cobalt. Alloy coatings are
produced by plating two metals from the same solution.

Multilayered Coatings
Multilayered coatings are produced by plating different metals from the same solution at different potentials. A pulse train-shaped potential
is enforced, resulting in the multilayer deposition. For example, multilayered coatings based on copper, nickle, chromium, in that order, can
be applied to either metal or plastic components for visual appearance, corrosion
and wear resistance, and weight saving.

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Fig. 3 Periodic table (metals inside the frame can be electrodeposited from aqueous solutions)

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Composite Coatings
Composite materials can be defined as coatings consisting of minute second-phase particles dispersed throughout a metal matrix. The size of
the second phase particles may range from10 mm down to nano scale and the particles can be inorganic, organic, or occasionally metallic.
The presence of fine particles in a metal matrix generally improves its mechanical and chemical properties, resulting in a wide range of
applications. Composite coatings with an electrodeposited metal matrix and nonmetallic inclusions have excellent wear resistance and
permit emergency dry running of machinery.

Conversion Coatings
Conversion coatings are formed by a reaction of the metal on the surface of the substrate with a solution.[5] For example, chromate coatings
are formed by the reaction of water solutions of chromic acid or chromium salts. The chromate coatings can be applied to aluminum, zinc,
cadmium, and magnesium. The coatings usually have good atmospheric corrosion resistance. Chromate coatings are widely used in
protecting common household products, such as screws, hinges, and many hardware items with the yellow-brown appearance.

Anodized Coatings
Anodizing is produced by electrochemical conversion. In an anodizing process, the metal workpiece to be plated is the anode in a suitable
electrolyte. With the electric current passing through the electrolyte, the metal surface is converted to a form of its oxide. An anodizing
process is usually used on aluminum for protection and cosmetic purposes. The electrolyte provides oxygen ions that react with metal ions to
form the oxide, and hydrogen is released at the metal or carbon cathode. Anodizing differs from electroplating in two aspects. In
electroplating, the workpiece to be plated is the cathode, and the metallic coatings are deposited on the workpiece. In anodizing, the
workpiece is the anode, and its surface is converted to a form of its oxide.

RELATED PROCESSES
The related processes for metal deposition include electroless deposition, immersion plating, and electroforming. They follow the basic
principles of electrochemistry.

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Electroless Deposition (Autocatalytic Plating)
A special type of electroplating is called electroless deposition, autocatalytic plating, or ‘‘chemical deposition. In electroless plating, there is no
external power source. The deposited metal is reduced from its ionic state in solution by a chemical reducing agent. The reducing agent
supplies the electrons for the following reaction:

This reaction takes place only on a catalytic surface. Therefore, once deposition is initiated, the metal deposited must itself be catalytic for the
deposition to continue. Not all metals can be plated auto catalytically. The reducing agents are usually more expensive electron sources as
compared with the electric current. The major advantages of electroless deposition are as follows:
1. It can be used to deposit metal on nonconductive surfaces, such as plastics, glass, or ceramics. Some proper pretreatment steps
are needed to activate these surfaces. The metallizing of printed circuit board is one such example.
2. The throwing power is perfect. Deposits are laid down on the surface with no excess buildup on projections or edges.

Immersion Plating
Immersion plating is the deposition of a metallic coating on a substrate by chemical replacement from a solution of salt of the coating metal.
It requires no electric circuitry or source of power, but it differs from autocatalytic plating in not requiring a chemical reducing agent to
reduce the metal ions to metal. Immersion deposition stops when the substrate is completely covered by a layer of coating. The major
advantages of immersion plating include simplicity, minor capital expense, and the ability to deposit in recesses and on the inside of the
tubing. But, the applicability of immersion plating is limited.
Electroforming
Electroforming is to produce or reproduce a metal workpiece by electrodeposition in a plating bath over a base form (mold) or mandrel,
which is subsequently removed. In some cases, the mandrel or mold may remain within the finished metal workpiece. A mandrel is a form
used as a cathode in electroplating. The advantage of the process is that it faithfully reproduces a form of mandrel exactly, to within one
micrometer, without shrinkage and distortion associated with other metal forming techniques, such as casting, stamping, and drawing.

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Because the mandrel is machined as an outside surface, close dimensional tolerances and high surface finishes can be held and maintained
on complex interior configurations. The disadvantage of electroforming includes slow production, relatively high cost, design limitations of
the geometry, and the separation of workpieces from the mold or mandrel.

CONCLUSIONS
The electroplating industry has been experiencing continuous innovations and also facing significant challenges from economic and
environmental perspectives. The purpose of electroplating is to produce a qualified coating with the desirable attributes. Based on the
specifications of the coating and the substrate, one may select a specific electroplating process for a given application.

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6.2. LOW HYDROGEN EMBRITTLEMENT CADMIUM PLATING

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Low hydrogen embrittlement cadmium-titanium plating is an optional and preferred procedure to this low hydrogen embrittlement
cadmium procedure. But if the overhaul instructions specify low hydrogen embrittlement cadmium-titanium plating, and you cannot do it,
you can always use this low hydrogen embrittlement cadmium plating as an alternative. Stylus cadmium plating is optional for local areas not
larger than 72 square inches on components with no load applied during the plating procedure. The data in this subject comes from Boeing
Process Specification for low hydrogen embrittlement cadmium plating. The data is general. It is not about all situations or specific
installations. Use this data to help you write minimum standards. Equivalent procedures can be used. This plating is usually used on low alloy
steels, such as those heat-treated above 220 ksi. The plating makes a corrosion resistant layer that lets hydrogen ions come through from the
metal when the part is subsequently baked.

MATERIALS
• Sodium Cyanide, 97% NaCN minimum with not more than 5 PPM by weight sulfides as sulfur or 10 PPM by weight chloroform
extractable materials – Cyanogran M or Cyanobrick.
• Anodes, Cadmium
• Cadmium Oxide
• Sodium Hydroxide, Technical
• Sodium Dichromate Dihydrate, Technical
• Wetting Agent – Nacconol (Replaces Nacconol 90F)
• Filter Pads – Dynel Fabric or Polyethylene Fabric
• Carbon Filter Aid – Nerofil B
• Activated Charcoal – Norit A
• Sulfuric Acid, 668 Baume, Technical – O-S-809, Type 1
• Maskant - Turco 522. Equivalent maskants can be used if organic plasticizers cannot be leached out by the plating solution

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• Filter Aid – Celite 501
• Chromic Acid – Technical, 0-C-303

SOLUTION PREPARATION AND CONTROL


Solution Preparation
• Clean the tank. Fill it half full with water.
• Add sodium hydroxide and sodium cyanide to get the concentrations.
• Dissolve cadmium oxide into a portion of sodium cyanide solution.
• Fill the tank with water to the operating level.
• Completely dissolve all materials in the water.
• Add the cadmium anodes to the tank.
• Let the tank stand for 8-16 hours before you use the solution.

Table 1: Low Embrittlement Cadmium Solution

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Solution Control
• Be careful to keep organic contamination out of the plating solution. Organic materials in the plating solution will decrease or remove
its low hydrogen embrittlement characteristic.
• Carbonate can be removed from the plating solution by any approved method that will keep contamination below the level shown in
Table 1.
• Immediately after carbonate removal, adjust the solution back to the concentration limits shown in Table 1.
• Use filters as necessary to keep the plating solution clean. Use only the approved filtering systems, materials, and filtering aids.
• For hydrogen embrittlement control, do tests on the plating solution with a hydrogen detection instrument or with notched tensile
specimens. Make these tests at least twice a week, on the day of plating if more than 3 days after the last hydrogen test, after each time
the filter is recharged, and after each carbonate treatment.
• For all immersion rinse tanks, control the overflow rate to make sure that the maximum total dissolved solids are not more than 500
PPM at the time the parts are removed from the tank.
ANODES
Steel anodes that are completely plated with cadmium, no copper or nickel strike allowed, are considered as cadmium anodes. The cadmium
layer on the anodes must be continuous after plating of parts.
• Because of the relatively low covering power (ability to plate in recessed areas) of the plating bath, special anoding will be necessary to
plate recesses and inside diameter areas.
• If the part configuration makes you use contour conforming internal or external anodes, these anodes must be of cadmium or
corrosion resistant steel.
• Where the ratio of hole depth to inside diameter is more than 1:1 for open holes or 0.5:1 for blind holes, use cadmium internal
anodes.

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PREPLATE TREATMENT
• Before plating, stress relieves all low alloy and corrosion resistant steel parts per the applicable overhaul instructions.
• Manually solvent clean as necessary. Vapors degrease and make sure the parts are fully dry.
• Abrasive blast and use only dry blasting procedures and abrasives.
• Within 1 hour, cold water rinse for 1 minute maximum. (The parts can wait up to 6 hours before this rinse if they are covered with kraft
paper within 1 minute after the abrasive blast.)
• Within 1 minute after the rinse, start to plate the parts. If this is not possible, put the parts in cyanide holding bath (Table 2) until you are
ready to plate the parts. The parts can stay in this bath up to 4 hours. Do not rinse these parts when you remove them from the bath.

Table 2: Cyanide Holding Bath

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PLATING PROCEDURE
DO NOT STOP THE PLATING PROCEDURE OR SHUT OFF THE CURRENT UNTIL PARTS ARE READY FOR REMOVAL FROM THE TANK. REMOVE
PARTS IMMEDIATELY WHEN YOU SHUT OFF THE PLATING CURRENT.
• Put the parts in the plating bath and start to plate them.
• For the first part plated with a given setup, you can stop the plating procedure and remove the part from the bath for thickness and
coverage checks. But, after you make necessary adjustments to anode configuration, plating time and current, plate all of the other
equivalent parts as a continuous operation. (Parts used for the adjustment can be stripped, baked, and plated and on).
• Continue plating for the time necessary to set the thickness specified by the overhaul instructions.

Table 3: Time Selection for Plating

• Plating thickness and appearance


Plate to the thickness specified in the overhaul instructions. If the thickness is not specified, plate to a 0.0005-inch minimum
thickness. The specified thickness is applicable only to visible surfaces which can be touched with a 0.75-inch diameter ball, but the
cadmium plating must be continuous. Unless specified by overhaul instructions, the minimum plating thickness is not necessary on
inside diameter of hollow and tubular parts. The inside diameter surfaces must show a continuous layer of cadmium and must be

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plated for the time required to deposit 0.0005-inch plating per Table 3. The plating must be dull, granular and porous with a color
from a dull gray to a frosty white. A bright, shiny, dense plating is a sign of a malfunction in the procedure that could cause embrittled
parts. If you get plating with these properties, make hydrogen embrittlement tests on the plating bath. Stains because of the bake or
the rinse are acceptable. After plating, do not brush, polish, or brighten the layer.
• Cold water rinse for 5 minutes (maximum). Continue with post-plate treatment.
• When the plating bath is first started or was temporarily shut down, we recommend you plate some test panels with this procedure
before you plate parts.
Use test panels of low carbon cold rolled steel, 4 by 6 inches by 0.040 inch thick. Cadmium plate the test panels with this procedure.
Chromate treat two of the panels. Examine the test panels. The plating layer must have no blisters, pits, nodules or signs of burns. The
plating must be smoothly continuous and agree with the thickness and appearance requirements.
Make a check of the bond of the plating layer by one of these two steps:
- Scrape the plated surface with a knife to expose the base metal. Examine the scraped area at 4 diameters magnification to see how the
plating came off. If the plating was bonded and tore off, it was satisfactory. If plating pieces came off as flakes without a bond to the
surface, it was not satisfactory.
- Bend the test panel 1808 over a 0.040 -inch diameter. Examine at 4 diameters magnification for signs of separation of the cadmium
plating from the base metal. The plating was satisfactory if cracks occur in the cadmium plate deposit or base metal but do not result
in peeling, blistering or flaking of the plate layer.

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POST PLATE TREATMENT
• When post plate chromate treatment is not specified in applicable overhaul instructions:
- Rinse parts in chromic acid solution for 0.5-2.0 minutes. (To make the chromic acid solution, mix 34 pounds of chromic acid with 100
gallons of water. Control this solution at 4.1-6.9 oz/gal concentration and 65-95°F.)
- Cold water rinse 0.5-5.0 minutes.
- Air dry at 160°F maximum.
- Within 8 hours after plating, bake the parts per the overhaul instructions or per Table 4. This bake is not necessary for corrosion
resistant steels A-286 or 300-series; or for 15-5PH,17-4PH,17-7PH below 180 ksi.

Table 4: Post Plate Baking

• When post plate chromate treatment is specified by overhaul instructions:


- Rinse parts in chromic acid solution for 0.5-2.0 minutes. (To make the chromic acid solution, mix 34 pounds of chromic acid with 100
gallons of water. Control the solution at 4.1-6.9 oz/gal concentration and 65-90°F).
- Cold water rinse 0.5-5.0 minutes.
- Air dry at 160°F maximum.
- Within 8 hours, bake the parts per the overhaul instructions or per Table 4. This bake is not necessary for corrosion resistant steels A-
286 or 300 series; or for 15-5PH, 17-4PH, 17-7PH below 180 ksi. If the overhaul instructions specify chromate treatment, and Ultra

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chromate 300 will be used, you can chromate treat before the hydrogen embrittlement bake as an option. But the resistance to
corrosion will be better if you bake first, and then do the chromate treatment.
- Put the parts in chromate treatment solution per Table 5, or an equivalent chromate treatment solution. The parts must hang freely
to let all areas become wet with the solution. If the Table 5 solution is used, keep the parts in the solution for 10 seconds maximum.
- Remove the parts and let them drain a short time.
- Rinse the parts in hot water, 160°F maximum, for 0.5-2.0 minutes.
• Magnetic particle examine when specified by the overhaul instructions. Solvent clean the parts. Examine the quality of the plating.
• If applicable, apply primer and enamel. Do this as quickly as possible after plating, as a precaution against contamination or damage
to the plating.

Table 5: Chromate Treatment Solution

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6.3. LOW HYDROGEN EMBRITTLEMENT CADMIUM-TITANIUM ALLOY PLATING

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This low hydrogen embrittlement cadmium-titanium alloy plating is an optional and preferred procedure to the low hydrogen embrittlement
cadmium plating procedure. But if the overhaul instructions specify low hydrogen embrittlement cadmium-titanium plating and you cannot
do it, you can always use low hydrogen embrittlement cadmium plating as an alternative. Stylus cadmium plating is optional for local areas
not larger than 72 square inches on components with no load applied during the plating procedure.
The data in this subject comes from Boeing Process Specification for low hydrogen embrittlement cadmium-titanium alloy plating. The data is
general. It is not about all situations or specific installations. Use this data to help you write minimum standards. This plating is usually used on
low alloy, high-strength steels, such as those heat-treated above 220 ksi. The plating makes a corrosion resistant layer that lets hydrogen ions
come through from the metal when the part is subsequently baked.

MATERIALS
• Sodium Cyanide, 97% NaCN minimum – Cyanogran M or Cyanobrick
• Anodes, Cadmium
• Cadmium Oxide
• Sodium Hydroxide, Technical – O-S-598 or 48% solution
• Sodium Dichromate Dihydrate,
• Sulfuric Acid, 668 Baume
• Wetting Agent – Nacconol 90G,
• Titanium Paste – must be homogeneous and free of lumps, must contain a minimum of 1.9% titanium by weight, and contain no
more than 10 ppm chloroform extractable materials, example: Olympic Titanium Paste, Ti-plate 504, Titan Paste Type J.
• Hydrogen Peroxide 35%
• Filter Aid, Celite 501, V9K562. Equivalent filter aids include those prepared from diatomaceous earths. Organic-based aids, such as
those prepared from cellulose, are not acceptable.

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• Primer – BMS 10-11, Type 1
• Hydrochloric Acid
• Chromic Acid, Technical
• Fluoboric Acid, 48%
• Carbonate Remover
• Ultrachromate 300 Concentrate
• Nitric Acid, 408 or 428 Baume

TANK AND SOLUTION PREPARATION


This process uses a continuously filtered bath. The filter must be of a type that puts soluble titanium into the plating bath.
The filter must have sufficient free volume to contain all filter aid, titanium paste, and titanium in the bath, if all of these materials accidentally
come out of solution. The filter rate must be a minimum of 2 tank volumes per hour. We recommend a maximum rate of 4 tank volumes per
hour, and a filter cloth area of 6 square feet per 100 gallons of solution. The system can include a permanently installed carbon filter, if the
flow rate is not more than 2% of tank volume per hour. The carbon filter can be used on a continuous or intermittent basis. All surfaces of the
tank, filter, and related plumbing which continuously touch the plating solution must be made of, lined, or coated with one of the following
materials. When the tank is not used, put a cover on it which is made of, or coated with, one of these materials.
• 300 series CRES
• Titanium or titanium alloy
• Epoxy primer
• Rigid polyvinyl chloride or polyvinyl dichloride
• Polytetrafluoroethylene
• Unfilled polyethylene or polypropylene

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• Mylar
• Paraline AR
• Hypalon 70-H3
• Goodyear LS576 neoprene
A lining or coating of a nonconducting material is recommended on the tank interior so the tank does not become bipolar.

Precondition Tank
CAUTION: DO NOT LET ORGANIC MATERIALS GET INTO THE TANK, PLUMBING, OR PLATING SOLUTION, BECAUSE ORGANIC MATERIALS WILL
DECREASE OR REMOVE THE LOW HYDROGEN EMBRITTLEMENT PROPERTIES OF THE PLATED PARTS.
• Fill the tank with caustic cyanide holding solution (Table 1).
• Let this stand for one week. Operate the pump and filter system a minimum of 8 hours per day.
• Remove and discard this cyanide holding solution. Do not use this removed solution for the holding bath of Table 1.
• Rinse out the tank completely before you fill it with the plating solution.

Prepare Plating Solution


Fill the tank approximately half full with water which has an electrical resistivity of not less than 50,000 ohm-cm. This is equivalent to
approximately 10 ppm dissolved ionic solids. For each 100 gallons of final solution, add 100 pounds of sodium cyanide followed by 22 pounds
of cadmium oxide. Mix thoroughly until all components are dissolved. Fill the tank with remaining water. Stir to fully mix the solution. Then
electrolyze the solution with some of the anodes used as cathodes, until you get a satisfactory quality of plating.
After the new bath is correctly aged, add titanium to the bath as follows:
• Coat the filter cloth with filter aid.
• For each gallon of slurry, use one pound filter aid, three pounds titanium paste, 2.5 oz. sodium hydroxide, and water to make a gallon.
Use one gallon of slurry for each 100 gallons of plating solution. These amounts can be adjusted for best results.

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NOTE: Ti-plate 504 is a supplied as a slurry. If you use this product, add it to the system directly, without the sodium
Hydroxide or water.
• Add the slurry into the filter through a slurry tank or directly into the plating tank.
• Add 5 fluid ounces of 35% hydrogen peroxide directly to the tank for each 100 gallons of solution.
• After 30 minutes, analyze the plating solution for titanium content. Adjust the titanium to 55-97 parts per million (ppm) titanium. To
increase titanium, add more hydrogen peroxide. The titanium content will automatically decrease as the peroxide complex breaks
down with time.

Maintenance of Cadmium-Titanium Plating Bath


CAUTION: KEEP ORGANIC MATERIALS OUT OF THE PLATING BATH, BECAUSE THEY WILL DECREASE OR REMOVE THE LOW HYDROGEN
EMBRITTLEMENT PROPERTIES.
(1) Control the plating solution within these limits and adjust it when necessary.
• Cadmium metal – 2.8-3.5 oz/gal (21-26 g/liter)
• Total cyanide (as NaCN) – 13-17 oz/gal (97-128 g/liter)
• Sodium hydroxide – 2.0-2.5 oz/gal (15-19 g/liter)
• Sodium carbonate – 8.0 oz/gal maximum (60 g/liter max.)
• Total iron contamination – 300 ppm maximum
• Titanium – 55-97 ppm
• Total cyanide to cadmium ratio (NaCN/Cd), 4:1-5:1
• Operation temperature – 60-858°F (15-308°C)
NOTE: Cool or heat as necessary. A heat exchanger in the filter return line is recommended.

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(2) Analyze the bath for titanium content and adjust as necessary to control the concentration. Also, analyze the bath for titanium and adjust
as necessary before you put the bath back in operation after a shutdown. To increase titanium content, add 35% hydrogen peroxide
directly to the bath. We recommend approximately 4-6 fluid ounces of 35% hydrogen peroxide per 100 gallons of solution, added daily.
(3) When additions of hydrogen peroxide do not increase the titanium content, and there are no malfunctions in the filter system, add more
titanium paste to the filter. One pound of titanium paste will give the titanium to plate approximately 30 pounds of cadmium, or
approximately 6500 amp-hours of plating time.
(4) Remove unwanted sodium carbonate, as necessary. Carbonate remover ARP 210, used correctly, will not decrease the hydrogen
embrittlement properties of the bath. But you must do a test for hydrogen embrittlement after this treatment.

ANODES
300 series CRES anodes completely plated with cadmium, with no copper or nickel strike, are equivalent to cadmium anodes. Anodes must
stay completely coated with cadmium after plating of parts.
Use solid cadmium anodes or cadmium ball anodes in titanium anode holders. Do not let anode hooks, jigs, or racks touch plating solutions if
they are made of materials not approved for the tank. Use auxiliary (internal) anodes (300-series CRES or cadmium) to get the specified plating
thickness where the ratio of hole depth of inside diameter is more than 1:1 for open holes, or more than 0.5:1 for blind holes. You can control
current to the internal steel anodes independently from the current to the tank and the external anodes to be sure the current density is
correct on the inside diameters.

PREPLATE TREATMENT
• Complete all machining, forming, welding, or brazing before plating.
• Before you start to plate them, stress relieve low alloy and corrosion resistant steel parts by the overhaul instructions.
• Manual solvent clean as necessary, and then vapor degrease. Make sure the parts are fully dry.
• Mask the areas of parts not to be plated. This includes surfaces which have plasma flame spray coating.

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• Dry abrasive blast . A rougher particle size, such as 80 grit aluminum oxide, will help the plating bond and the low hydrogen
embrittlement property.
• If you must stop, the parts must show no rust, dirt, or bad color change after you use one of these alternatives:
You can keep parts for one hour maximum at ambient temperature with no special protection.
You can keep parts for 6 hours maximum at ambient temperature if you keep them in a clean area and give them protection from
dust and fumes. Within one hour, you can put the parts in a cyanide holding bath (Table 1). Keep the parts in this bath no longer than
4 hours.

Table 1: Cyanide Holding Bath

• Cold water rinse at 100°F max. for 0.5-5.0 minutes.


• Activate the surfaces of the part to be plated by immersion in acid solution for 5-30 seconds. Remove the part immediately when gas
occurs. Fluoboric acid solution (recommended): 2.5 volume parts fluoboric acid to 100 parts water. Control 1.25-2.50 oz/gal and 60-
95°F. Hydrochloric acid solution (alternate): 3 volume parts hydrochloric acid to 100 parts water. Control at 0.82-1.64 oz/gal and 60-
95°8F.
• Within 2 minutes, cold water rinse for minimum of 20 seconds and maximum of 6 minutes. Then start to plate within 2 minutes.

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PLATING PROCEDURE
• When the plating bath is first started, or after it was not used for a time, we recommend you plate samples and make adjustments
before you plate parts.
• Apply initial strike per Table 2.

Table 2: Initial Strike Current/Time

• Decrease the current and plate to the specified thickness at 20-35 ASF per Table 3. Do not use a current density below 20 ASF, because
low current density plating will decrease the low hydrogen embrittlement property of the deposit. You can temporarily stop the
plating cycle to move parts in the racks to get 100% coverage.
For the first part plated with a given set up, you can stop plating and remove the part from the bath for thickness and coverage
checks. When anode configuration, plating time and voltage adjustments are satisfactory, plate all parts of the same configuration as
a continuous operation. Parts used to adjust plating conditions must be stripped and plated again.
Do not mechanically remove material from, polish, or brush the plated areas.

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Table 3: Time/Current Selection for Plating Thickness

• Cold water rinse (100°F max) for approximately 1-10 minutes. Control the overflow rate on all immersion rinse tanks to keep the
dissolved solids below 1000 ppm at the rinse water outlet, measured at the time parts are removed from the tank.
• As an option, and to remove light powder films:
Rinse parts in chromic acid-water solution for 0.5-2 minutes at ambient temperature. To prepare this solution, mix 34 pounds of
chromic acid with 100 gallons of water. Control at 4.1-6.9 oz/gal. Cold water rinse (100°F max.) 0.5-5 minutes.
• Dry within 5 minutes. A one-minute-maximum hot rinse (130°F maximum) can be used to help dry the parts, but do not use this as the
regular rinse after plating.
• Remove masking materials.
• Low hydrogen embrittlement stylus cadmium plate all rack marks, contact areas, or surfaces which could not be plated by rack or
anode design.

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POST PLATE TREATMENT
• Hydrogen Embrittlement Relief Bake
Bake steel parts within 8 hours of plating as specified in Table 4, unless specified by the overhaul instructions. The bake is not necessary
for corrosion resistant steels A-286, and 300 series.
If parts are to get phosphate treatment or dry film lubricant, the bakes of those procedures can be combined with this bake if you start
the bake within 8 hours after plating, and bake. If the overhaul instructions specify chromate treatment, and Ultrachromate 300 will be
used, you can chromate treat before the hydrogen embrittlement bake as an option. But the resistance to corrosion will be better if you
bake first, and then do the chromate treatment.

Table 4: Hydrogen Embrittlement Relief Bake Data

• Magnetic particle examine if specified by the overhaul instructions. Then alkaline solvent or manually clean the parts.
• When the overhaul instructions specify chromate treatment:
Put the parts in one of the chromate solutions (Table 5). Ultrachromate 300 (normal) for 15-30 seconds, or Ultrachromate 300
(dilute) for 30-90 seconds, or Cronak for 5-10 seconds, or Any other chromate solution Type II. Rinse for 0.5-2 minutes. Hot
water at 160°F maximum can be used to help the parts dry. Do not use this rinse water for the usual rinse after the plating.
Within 5 minutes, dry at a temperature no hotter than 160°F.
• When the overhaul instructions specify phosphate treatment, apply the phosphate and bake. This phosphate treatment can be done
before or after the hydrogen embrittlement relief bake.

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Table 5: Chromate Treatment Solution

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QUALITY CONTROL
• Appearance
When examined without magnification, the deposit must be dull, continuous, smooth, fine grained, tightly bonded, and have no
blisters, pits, nodules, flakes, or burns. A frosty property is acceptable and recommended. If applicable, the chromate treatment
coatings must be tightly bonded and have no powder.
• Plating Thickness
Measure the thickness with a procedure that has a precision equal to or better than +/-10 percent of the thickness to be measured.
Measure the thickness on the plating after the bakes and chromate or phosphate treatments are completed. When not specified by
overhaul instructions, use a minimum thickness of 0.0005 inch and a maximum of 0.0008 inch. Thickness greater than 0.0008 inch is
permitted in areas where the cathode current density is usually high, such as corners and edges. Unless specified by overhaul
instructions, the thickness requirements apply only to visible surfaces that can be touched by a 0.75 inch diameter ball. But all visible
surfaces must be completely covered by the plating.
• Titanium Content
If you add hydrogen peroxide manually, do tests of the bath for titanium a minimum of one time each 8 hours of operation.
If you add hydrogen peroxide continuously and automatically, do tests of the bath for titanium a minimum of one time each day. You
can use a longer interval if your experience with the procedure makes you sure the titanium content stays within the specified limits.
• For hydrogen embrittlement control, do tests on the plating solution with a hydrogen detection instrument. Make these tests at least
twice a week, on the day of plating if more than 3 days after the last hydrogen test, after each time the filter is recharged, and after
each carbonate treatment.
• Adhesion.
As a check on the procedure, do tests on specimens or parts.
As a check on parts you plated, do a tape test, visually examine all surfaces for blisters or flakes.

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• Corrosion Resistance – Do a salt spray test on plated parts or specimens. .
• Do tests on samples at regular intervals to be sure of the plating quality, use an interval that agrees with standard industry practices,
your experience with the procedure, and to make sure you can find parts that could have bad plating.

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6.4. BRIGHT CADMIUM PLATING

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The data in this subject comes from Boeing Process Specifications cadmium plating, and brush cadmium plating. The data is general. It is not
about all situations or specific installations. Use this data to help you write minimum standards.
This procedure will make plating that agrees with AMS-QQ-P-416, but it is only for materials which cannot get hydrogen embrittlement. Thus
tests for hydrogen embrittlement are not necessary. The types and classes are the same as those specified in AMS-QQ-P-416:
• Type 1 – As plated (no supplementary chromate or phosphate treatment)
• Type 2 – With supplementary chromate treatment
• Type 3 – With supplementary phosphate treatment
• Class 1 – 0.0005 inch thick minimum
• Class 2 – 0.0003 inch thick minimum
• Class 3 – 0.0002 inch thick minimum
Do not use this procedure to plate steels heat treated above 220 ksi unless they are springs, or unless specified by the overhaul instructions.

MATERIALS
• Abrasives for Scouring
- Lea Buffing and Polishing Compound, E grade or finer
- Pumice
- Wyandotte F-2013
• Ammonium chloride, plating grade
• Ammonium sulfate, plating grade
• Bonderite 32 phosphate coating and Bonderite 32B replenisher
• Brighteners
- Rohco Super XL

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- Rohco 20-XL
- Cadmium Brightener LE Concentrate
- Aikoh Super CD, VS9291
- Colcad 100 Brightener
• Cadmium anodes, spherical or slab with titanium hook
• Cadmium oxide
• Chromate remover
• Carbon trolls
• Charcoal, activated, plating grade
• Chromic acid (chromium trioxide), technical
• Cryscoat GR conditioner
• Cryscoat MP phosphate coating
• Cryscoat Ultra Rinse
• Endox 214 solution
• Filter aid – Diatomaceous earth, filtering grade
• Filter pads
• Filters, plastic case, Dynel or polyethylene wound, 24 micron nominal
• Hydrochloric acid, 20-degree Baume’
• Inhibited hydrochloric acid solution
• Irco 52822 phosphate coating
• Iridite 80

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• Maskants
- Adcoat 828
- Micromask
- Microshield Stop-Off Lacquer
- Peel Coat B100
- Platers tape, yellow
- Protex 1321-D
- Turco 522 or 544
• Meta Bond 51414 phosphate coating
• Meta Bond 51504 additive
• Nacconal 90F wetting agent
- Novalyte PR
- Novalyte 370-A
- Novalyte 370-W wetting agent
- Novaplex stabilizer
- Oakite MRP
- Parcolene W
- Parcolene Z
- Parcolene 95
- Parcolene 95B
- Phosphoric acid
- Sodium cyanide, 97% NaCN minimum, plating grade

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- Sodium dichromate dihydrate
- Sodium hydroxide, flake or granulated
- Sulfuric acid, 66-degree Baume’, plating grade
- TSPG Solution
- Ultrachromate 300 concentrate
- Uninhibited hydrochloric acid solution

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SOLUTION PREPARATION
• Cyanide Cadmium Plating Solution
Fully clean the tank. Then fill it approximately one-half full with water. For each 100 gallons of final solution, add in this sequence:
- 87 pounds of sodium cyanide. Mix until fully dissolved.
- 25 pounds of cadmium oxide, mixed with water into a paste.
- Brightener. Use one of these:
6 pints Rohco Super XL Brightener, diluted with 2-3 parts warm water, 1 gallon Rohco 20-XL Liquid Brightener, diluted with 2-3 parts
warm water, 0.7 gallons (0.5-1.0% by volume) IMP Cadmium Brightener LE concentrate. Do not use IMP Cadmium Addition Agent. 6
pints Aikoh Super Cd Brightener, diluted with 2-3 parts warm water 1.2 gallons (1.0-1.5% by volume) Colcad 100 Brightener.
Mix until all of these components are fully dissolved. Add water to fill the tank to operating level. Install the cadmium anodes in the
tank. Before you start to use the new solution, mix it after each 2-3 hours for 12-14 hours. Then electrolyze the solution with some of
the anodes used as cathodes, until you can get a satisfactory plate. Then make an analysis of the solution and adjust it. Control the
solution at 2.3-4.5 oz/gal cadmium metal, 9.0-17.5 oz/gal total sodium cyanide, 8.0 oz/ gal maximum sodium carbonate, and 1.6-3.2
oz/gal sodium hydroxide. Add brightener as necessary to keep the plating bright. To control sodium carbonate, chill or freeze it out
of solution at approximately 25°F, or remove some of the plating solution and add new solution, or use carbonate remover. If
necessary, put the solution through a filter with filter aids or pads.
When you use filter aid, make a thin slurry of the filter material and send it though the filter to make a smooth deposit on the filter
plates. Use containers of glass, wood, stoneware, or bare steel to keep the plating solution.
• Noncyanide Cadmium Plating Solution
- Use a tank with a plastic lining. Fill the tank half-full with water.
- For each 100 gallons of final solution, add in this sequence:
1300 oz (81.25 pounds) of ammonium sulfate. Mix until fully dissolved, 13 gal Novaplex stabilizer

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- Cadmium chloride solution
1) To make this solution, mix 115 oz cadmium oxide with 6-10 gal water to make a slurry. Then slowly add 100-115 fl oz
hydrochloric acid and stir constantly until the solution is clear. If the solution is not clear after 1 hour, add more hydrochloric
acid, 1 fl oz at a time, up to a total of 120 fl oz.
2) Add this solution to the plating tank and fully mix until the solution is clear. 0.6 gal Novalyte 370-A brightener
- Add water to fill the tank to the operating level.
- Control the solution at 1.0-3.0 oz/gal cadmium metal, 3.0-5.0 oz/gal ammonium chloride, 10-15 oz/gal ammonium sulfate,
7-9 pH, 10-15 volume percent Novaplex, and 0.5-1.0 volume percent Novalyte 370-A.
- Use this solution at 65-100°F.
- Inorganic contamination, such as dissolved metals, can cause problems with the plating quality, as when bright dipping or
chromate treatments will be used. Low-current electrolysis will remove many of the metallic contaminations. An insoluble
metallic hydroxide such as Novalyte-PR, added at 1-2 fluid ounces per 100 gallons of plating solution, will usually make
neutral the effects of this contamination.
- Organic contamination is caused by oils, greases, or other contamination from parts not fully cleaned before they were put into
the plating solution. Regular treatment of the solution with activated charcoal will usually remove organic contamination, but it
could also remove some of the Novalyte 370-A brightener.
- To control pitting, use Novalyte 370-W wetting agent.
• Solutions for Type 2 Chromate Coating
- Cronak (sodium dichromate - sulfuric acid)
Fill an acid-resistant container with water to 2/3 of the final level. For each 100 gal of final solution, add 165 pounds of sodium
dichromate and 6.0 oz Nacconol 90F or 90G wetting agent. The wetting agent can first be dissolved in warm or hot water to make it
easier to mix into the solution. Slowly add 1 gal sulfuric acid per 100 gallons of final solution. Add
water to the final level and mix fully. Control the solution at 16-20 oz/gal chromic acid (as CrO3), or 24-30 oz/gal as sodium

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dichromate dihydrate. ontrol the solution pH at 0.65-1.00. To decrease the pH, add sulfuric acid. One quart of acid per 100 gallons of
solution will decrease the pH approximately 0.25. To increase the pH, add sodium hydroxide. Use this solution at room temperature.
- Ultrachromate 300 (normal strength)
For each 100 gallons of final solution, add 20 gal Ultrachromate 300 concentrate to 80 gal water. Control the solution pH at 0.8-1.1
and the Ultrachromate concentration at 5.0-10.1 oz/gal as CrO3. To increase CrO3 and decrease pH, add more Ultrachromate
concentrate. The pH can also be adjusted with sulfuric acid and sodium hydroxide. Use this solution at 65-95°F.
- Ultrachromate 300 (diluted strength)
For each 100 gallons of final solution, add 9 gal Ultrachromate 300 concentrate to 91 gal water. Control the solution pH at 0.9-1.3
and the Ultrachromate concentration at 2.2-5.5 oz/gal as CrO3. To increase CrO3 and decrease pH, add more Ultrachromate
concentrate. The pH can also be adjusted with sulfuric acid and sodium hydroxide. Use this solution of 65-95°8F.
- Iridite 80
Make a solution of 1.25-3.0 volume percent Iridite 80 in water. Control the solution pH at 0.8-1.5 Use this solution at 75-100°F.
• Solutions for Type 3 Phosphate Coating
- To the cleaned tank, add water to 1/2-2/3 of the final volume. For heated solutions, heat the water to 120-140°F to help dissolve the
chemicals. Add the chemicals. Stir as you add liquid chemicals. Sprinkle solid chemicals on the surface of the water and then stir until
dissolved. Add water to the final volume. Make final solution adjustments and heat to the specified
temperature range.
- Bonderite 32
Use 4.5 gallons or 37 pounds Bonderite 32 for each 100 gallons of final solution. Control the solution at 0.18-0.23 N total acidity, and
a temperature of 165-175°F.
- Meta Bond 51414
For each 100 gallons of final solution, add 2.0 gallons Meta Bond 51504 additive, and then add 3.0 gallons Meta Bond 51414. Control
the solution at 0.30-0.35 N total acidity, and a temperature of 170-180°F.

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- Cryscoat MP
For each 100 gallons final solution, add 3.5 gallons Cryscoat MP, and then add 0.1 gal Oakite MRP. Control the solution at 0.15-0.21 N
and a temperature of 110-150°F. Sludge will occur during solution adjustment and the phosphating procedure. Remove the sludge
with a continuous filter to keep the acidity constant.
- Parcolene W Conditioner
For each 100 gallons final solution, add 6 pounds Parcolene W. Control the solution pH at 8.0-10.0. To increase the pH, add more
Parcolene W. To decrease the pH, add a 5-10 volume percent solution of phosphoric acid. Control the solution temperature at 135-
145°F.
- Parcolene Z Conditioner
For each 100 gallons final solution, add 1 pound Parcolene Z. Control the solution temperature at 60-135°F. Discard the solution
when the phosphate coatings become granules.
- Cryscoat GR Conditioner
For each 100 gallons final solution, add 1 pound Cryscoat GR. Use this solution at 60-100°F. Discard the solution when the phosphate
coatings become granular or the solution pH is more than 9.0.
- Chromic Acid Rinse
For each 100 gallons final solution, add 4 oz chromium trioxide. Control the pH at 2.0-4.0 with chromium trioxide or a mixture of
chromium trioxide and phosphoric acid. Control the solution temperature at 150-200°F. Discard the solution when the total acid to
free acid ratio is greater than 7.0.
- Parcolene 95 Post-Treatment Solution
For each 100 gallons final solution, add 1 fluid ounce Parcolene 6 and then 8.3 lb Parcolene 95A. Control the solution pH at 6.0-6.5.
To decrease the pH, add Parcolene 6. (An amount of 4.3 oz per 100 gal will decrease the pH by 0.1.) To increase the pH, add
Parcolene 95A. If foam occurs, add Parcolene 95B in 0.1 fluid ounce increments until the foam goes away.
Control the solution temperature at 110-140°F.

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- Irco 52822
For each 100 gallons final solution, add 1 gal Irco 52822. The solution will have a pH of 7. Adjust the pH to 4.0-4.5 with sulfuric acid
mixed with an equal volume of water. Use this solution at room temperature.
- Cryscoat Ultra Rinse
For each 100 gallons final solution, add 1.5 gal Cryscoat Ultra Rinse. Use this solution at temperatures from room temperature up to
140°F.

STANDARD PLATING PROCEDURE


• Before plating, stress relieve low alloy and corrosion-resistant steel parts per the overhaul instructions. Where no stress relief details
are given, stress relieve. Do this stress relief if the parts were ground, machined, straightened, formed or proof loaded after they were
heat treated.
• Low alloy steels, including coil springs
- Alkaline clean and rinse to get a water-break-free surface.
- Remove scale on carburized steels, use dry abrasive blast.
- Activate the surface with one of these two procedures:
Put the part in inhibited hydrochloric acid solution for 2 minutes maximum, or uninhibited hydrochloric acid solution for 60
seconds maximum. Use shorter times if much smut occurs. Rinse in cold water for 30-120 seconds. Use shorter times for carburized
parts. Electrolytically clean in Endox 214 solution or TSPG solution. (This is not necessary if this was used to remove scale. After the
rinse, do the electrolytic treatment again for 1-2 minutes. Stop on the anodic cycle. Drain the parts. Rinse fully for 5 minutes.
- If the parts have smut, remove it with one of these four procedures:
Scour with abrasive and rinse. For parts to be plated in the cyanide solution, put them in Endox 214 solution. Anodic clean at 60-80 asf
for 2-6 minutes, or blast the parts with pumice and water, or put the parts in uninhibited or inhibited hydrochloric acid solution for
5-30 seconds. Rinse in cold water. Immediately put the parts in the plating bath. Do not let them dry.

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• Nitrided steels
Wet or dry abrasive blast the parts. Remove abrasive and unwanted matter with an air blast.
Within 4 hours, put the parts in the plating bath and start to plate them.
• Corrosion resistant steels, nickel or cobalt alloys, and nickel or cobalt plated areas – Prepare the parts.
• Aluminum alloys – Prepare the surfaces. Then put the parts in the plating bath and plate them.
• Copper alloys – Prepare the surfaces per Cleaning of Copper and Copper Alloys.
• Cadmium plating
- Put the parts in the plating solution and apply current. For the cyanide plating solution, use 10-60 asf. For the noncyanide
plating solution, use 10-20 asf.
- Plate to the thickness specified in the overhaul instructions, or 0.0005 inch minimum if the thickness is not specified. The approximate
time to plate 0.0006 inch is 17 minutes for the cyanide solution and 20 minutes for the noncyanide solution. Plate sample parts or
test panels to find the exact times for your conditions. Also, plate control coupons as necessary for bond and corrosion tests.
- Rinse fully. Dry. Do not bend or put a load on springs until after they are baked.
- Touch up locations that touched the rack with brush plating as necessary.
- Remove cadmium plating from chrome plated areas, as with a motor driven buffer and Lea compound.
• Post Plate Bake
- Type 1 parts (no chromate or phosphate treatment) can be alkaline or manually cleaned to prevent stains during the bake.
- Air dry all cleaned parts. The parts can be soaked in hot water to help them dry.
- If the parts will be phosphate treated, or given a solid film lubricant, the bakes necessary after those procedures can be replaced by
one bake at the end if you use the times and temperatures given below and start the bake within 8 hours after the plating. If the
overhaul instructions specify chromate treatment, and Ultrachromate 300 will be used, you can chromate treat before the

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hydrogen embrittlement bake as an option. But the resistance to corrosion will be better if you bake first, and then do the
chromate treatment.
- Ferrous parts – Within 8 hours after plating, bake per the overhaul instructions. If not specified, bake as follows:
Carburized parts and 440-series CRES: 5-8 hours at 250-300°F. Externally-threaded parts (unless carburized), 160-200 ksi, and all
other parts 180-200 ksi: 3 hours minimum at 350-400°F. Parts heat treated 200-220 ksi; 8 hours minimum at 350-400°F PH steels
180 ksi or above: 12 hours minimum at 350-400°F. This bake is not necessary for these alloys:
1) 15-5PH, 17-4PH or 17-7PH, if these are below 180 ksi
2) 17-7PH (CH900 condition)
3) A-286 and 300-series
- Other ferrous alloys below 180 ksi (unless they have external threads)
- Copper alloy parts – No bake is necessary.
- Aluminum alloy parts – Bake 1 hour at 200-225°F, or put in boiling water for 1 hour.
• Type 2 Chromate Treatment
- If the parts must wait before this treatment, dry the parts and give them protection from contamination. Then, before you apply the
chromate coating, alkaline clean the parts with a medium duty or aluminum cleaner, and rinse. Immediately apply the chromate
coating before the surface can dry.
- When Type 2 chromate treatment is specified, treat the parts with one of these solutions, or other solutions that make a
coating which agrees with the requirements of QQ-P-416, Type II. Put the parts in sodium dichromate-sulfuric acid (Cronak) solution
for 5-10 seconds. This solution can also be applied with a swab. Put the parts in Ultrachromate 300 normal strength solution for 15-
30 seconds, or Ultrachromate 300 dilute solution for 30-90 seconds. Put the parts in Iridite 80 solution for 5-30 seconds. This solution
can also be applied with a swab.
- Rinse for 30-120 seconds. Hot water (160°F max) can be used to help dry the parts. Dry the parts within 5 minutes at 195°F max.

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• Type 3 Phosphate Treatment
- Alkaline parts get a water-break-free surface. This cleaning is not necessary if the parts will get the phosphate coating within 2
hours of the last plating rinse and had protection from contamination.
- The phosphate solutions are heated. If the parts are large, they could cool the solutions and make necessary a longer soak time than
necessary. To prevent this, put the parts in hot water (130°F minimum) for 1 minute or more, immediately before you put them into
the phosphate solution.
- When Type 3 phosphate treatment is specified, treat the parts with one of these solutions:
Bonderite 32 – As an option, first put the parts in Parcolene W or Parcolene Z solution at 130-145°F for 30-60 seconds. If you use
Parcolene W, rinse the parts in hot water 30-60 seconds. Then soak the parts in Bonderite 32 at 165-175°F. Rinse in cold water for 60
seconds or more.
Put the parts in Meta Bond 51414 at 170-180°F for 2-5 minutes. Then rise in cold water for 60 seconds or more. Put the parts in
Cryscoat GR solution at 60-100°F for 110 minutes. Then put the parts in Cryscoat MP solution at 110-160°F for 3-5 minutes. Rinse in
cold water for 60 seconds or more.
- If the parts will be given solid film lubricant, dry them with clean air.
- Put all other parts in chromic acid rinse solution at 150-200°F for 1 minute or more. Do not rinse.
- As an option, apply a nonchromated post-phosphate treatment:
For parts coated with Bonderite 32, soak the parts in Parcolene 95 at 110-140°F for 30-60 seconds. Then rinse in cold water for 30-
60 seconds. For parts coated with Meta Bond 51414, soak the parts in Irco 52822 at room temperature for 30-60 seconds. Then
rinse in cold water for 30-60 seconds. For parts coated with Cryscoat MP, soak the parts in Cryscoat Ultra Rinse at room
temperature or up to 140°F for 30-60 seconds. Do not rinse.
- Dry the parts with clean air.
- Bake the parts as necessary.

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If the bake is applicable, use the times and temperatures. If the parts were baked before the phosphate treatment, bake them
again. For carburized parts, bake 5 hours minimum at 250-300°F. For parts over 180 ksi which were plated, bake 3 hours minimum
at 350-400°F. If the parts have nonchromated post-phosphate treatment, do not bake above 400°F or damage to the coating could
occur.

BRUSH CADMIUM PLATING


Brush cadmium plating can be applied to copper alloys, nickel alloys, cobalt alloys, and ferrous alloys below 220 ksi.
Do not use this procedure to brush cadmium plate ferrous parts 220 ksi or above.

Surface Preparation
Solvent clean or manually clean, if parts are greasy or oily. If necessary, remove scale and rust from all of the area to be brush plated. Use
abrasive paper, a brush, or other items. Make smooth the rough metal edges. Blend the damaged area into the good plating with a file or
sandpaper. Make the blends as long as possible. Remove unwanted matter and contamination with solvent cleaning. Apply masks around the
area to be brush plated. To decrease edge buildup or burrs, use metallic tape at the edges. Make electrical connection between this tape and
the part. Use a conductive adhesive, or turn an edge of the tape under to make contact with the part. Be sure to give all other areas protection
from the plating solutions. For titanium surfaces, blast the area with slurry of 180-240 grit aluminum oxide and water, until the area is a
constant color. Use air pressure of 50-115 psi, an air water gun, and a 1 to 15 gallon paint pressure pot that has a stirrer. Then flush off all grit
with water and start to plate within 1 minute or, as an alternative, blast clean the surface with the procedure for titanium. Brush cadmium
plate with the procedure for Dip Feed Plating (Handheld Electrodes). Post Plate Treatment after plating, bake parts.

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QUALITY CONTROL
• The cadmium plating must be smooth, fine grained, and have no blisters, pits, nodules, burrs or other defects when visually examined
without magnification. Unless specified by the overhaul instructions, the plating can be shiny or dull.
• The Type 2 chromate and Type 3 phosphate coatings must be continuous, smooth, and without powder. The coating must not be
loose or come off when wiped with a cloth.
• Unless specified by the overhaul instructions, the plating thickness must be Class 1 (0.0005 inch minimum) for all parts except
fasteners. For fasteners, the plating must be Class 2 (0.0003 inch minimum). Unless specified, the plating must not be thicker than
0.0008 inch.
• Unless specified by the overhaul instructions, the thickness requirements are for only visible surfaces which can be touched by a ball
0.75 inch in diameter. The plating must be continuous.
• Adhesion
• Aluminum parts must have no blisters or loose plating after the bake or boiling water soak. For parts other than aluminum, do a test
on the plating after the supplemental treatment and bake. The layer must stay tightly bonded to the surface.
• Corrosion Resistance (Type 2 plating only) – Give parts or specimens a salt spray test. This includes items given Ultrachromate 300
treatment before the bake.
• Do tests on samples at regular intervals to be sure of the plating quality.

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6.5. HARD CHROME PLATING

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The data in this subject comes from Boeing Process Specification. The data is general. It is not about all situations or specific installations. Use
this data to help you write minimum standards. Hard chrome plating done by this subject will agree with QQ-C-320, class 2 for steel parts heat
treated below 220 ksi and MIL-STD-1501 for steel parts heat treated to 220 ksi and above. Other procedures which give the same results can
be used as equivalents. BAC5709 puts chrome plating into 4 classes. Class 1 is decorative chrome plating. Class 2 is hard chrome plating (or
plating and grinding) to specified dimensions. Class 3 is the same as Class 2, but with a special pretreatment for a better bond of the plating.
Class 4 is a special thin, hard plating with a minimum hardness of Rockwell C 67. If the overhaul instructions do not give the class, use Class 2.

MATERIALS
• Plating Compound – Unichrome CR-110
• Plating Compound – Unichrome CR-204
• Plating Compound – Econochrome S
• Plating Compound – Econochrome 40
• Plating Compound – Econochrome 66
• Sulfuric Acid – 66 degree Baume’, Water White, 2.5 ppm Maximum Arsenic
• Hydrochloric Acid – 20 degree Baume
• Chromic Acid (Chromium Trioxide)
• Abrasives for Scouring
Wyandotte F-1013 pumice detergent, Pumice, Abrasive paper, silicon carbide, Tripoli powder, Scotch-Brite pads, No. 7448, silicon
carbide
• Anodes
Lead, 4 to 7 percent tin, Lead, 4 to 7 percent antimony, Chemical Lead, Nickel, 99% pure: rolled, depolarized, electrolytic grade or
carbon-nickel cast and rolled. Optional: sulfur depolarized (SD) nickel chips

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• Carbon, Platinum wire, lead or lead-tin plated steel wire
• Sodium Cyanide – 97% NaCN minimum, Plating Grade
• Sodium Hydroxide – Flake or Granulated
• Hydrofluoric acid
• Nickel Chloride Hexahydrateal
• Ammonium bifluoride
• Copper Sulfate (CuSO4.5H2O)
• Barium Carbonate (BaCO3)

PREPARATION OF SOLUTION
The dilute standard, concentrated standard, and self-regulated high speed chromium plating solutions are alternates for each other.
A. Use distilled or deionized water if the regular water supply is more than the following maximums:
- 450 ppm maximum dissolved solids.
- 50 ppm maximum dissolved chlorides.
B. Chromium Plating Solution, Dilute Standard Bath
- Clean the tank. Then add two-thirds total amount of water.
- Add 200 pounds chromic acid for each 100 gallons of final solution.
- Fill tank with water to the operating level and mix fully.
- Operate the solution at a temperature of 110-140°F. (Class 1 plating), 120-140°F (Class 2 plating;
130-140°F is best). 130-140°F (Class 3 plating), or 120-130°F (Class 4 plating).
- Control the solution at 30-35 oz/gal chromic acid, CrO3/SO4 ratio of 85-115 to 1 (Class 1, 2, or 4) or 85-105 to 1 (Class 3), maximum of
0.53 oz/gal trivalent chromium, and maximum of 1.00 oz/gal iron.

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NOTE: Do not add sulfuric acid on makeup. After the chromic acid is dissolved and diluted to the correct volume, analyze for sulfates
and add sulfuric acid as necessary to adjust the chromate/sulfate ratio. For Class 1, 2, or 4 plating, to make the plating bond better and
decrease chicken wire cracks, keep this ratio in the 95-100 to 1 range. For Class 3 plating, keep the ratio in the 90-95 to 1 range.
- Use anodes as necessary. Dummy plate to keep the anodes active, as indicated by a brownblack layer of lead peroxide. A bright yellow
surface layer is a sign of lead chromate, which is passive and will decrease plating efficiency. Use auxiliary anodes as necessary to get a
continuous plating thickness in recesses and corners. Remove and clean the anodes if the plating bath will not be used for a long
time. Keep the anodes in a clean dry place until you use them again.
NOTE: A very dark colored bath is usually a sign of too high a chromate concentration, and frequently will occur with passive yellow
anodes. This will cause unserviceable plating. To correct the bath you must dummy plate in it a long time, sometimes for days. Do not
let organic materials such as solvents, greases, or dirty oily surfaces get into the bath because these break down the chromic acid into
chromate ions.
- For Class 1, 2, or 4 plating plate at 1-4 asi (ferrous alloys) or 1-5 asi (aluminum and copper alloys). For Class 3, plate at 2-3 asi.
C. Chromium Plating Solution, Concentrated Standard Bath
- Clean the tank. Then add two-thirds total amount of water.
- Add 330 pounds chromic acid for each 100 gallons of final solution.
- Fill the tank with water to the operating level and mix fully.
- Operate solution at a temperature of 110-140°F for Class 1, 2, or 4, or 130-140°F for Class 3.
- Control the solution at 50-55 oz/gal chromic acid, the same CrO3/SO4 ratio as for the dilute bath above, maximum of 0.53
oz/gal trivalent chromium, and maximum of 1.00 oz/gal iron.
NOTE: Do not add sulfuric acid on makeup. After the chromic acid is dissolved and diluted to proper volume, analyze for chromates and
add sulfuric acid as necessary to adjust the chromate/sulfate ratio. For Class 1, 2, or 4 plating, to make the plating bond better and
decrease chicken wire cracks, keep this ratio in the 95-100 to 1 range. For Class 3 plating, keep the ratio in the 90-95 to 1 range.
- Use anodes as necessary.

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- Plate at the same current densities as for the dilute bath above.
D. Self Regulating High Speed Unichrome CR-110 Bath
- Clean the tank. Then add two-thirds total amount of water. Adjust temperature to 120°F.
- Add 230 pounds of Unichrome CR-110 for each 100 gallons of final solution. Mix into solution for 2-3 hours.
- Fill the tank with water to operating level and mix fully.
- Operate the solution at 120-140°F (Class 1, 2, or 4 plating) or 130-140°F (Class 3 plating).
- Control the solution at 33.6-40.0 ounces of Unichrome CR-110 per gallon of water. Adjust with CR-204 or CR-110 added by
the manufacturer’s instructions. Mix the solution for 2-3 hours after makeup or additions.
NOTE: If you must remove a small amount of CR-204 or CR-110 from a large container, be sure to mix the contents of the
container first to make sure the catalyst concentration is constant in all of the material.
- Use anodes as necessary.
- For Class 1, 2, or 4 plating, plate at 1-4 asi (ferrous alloys) or 1-5 asi (aluminum and copper alloys). For Class 3 plating, plate
at 2-3 asi.
E. Econochrome S Bath
- Clean the tank. Then add two-thirds total amount of water. Adjust temperature to 125°F.
- Add 125 pounds of Econochrome S for each 100 gallons of final solution. Mix until fully dissolved.
- Fill the tank with water to the operating level and mix fully.
- Operate the solution at 115-150°F (Class 1 plating), 120-140°F (Class 2 plating; 130-140°8F is best), 130-140°F (Class 3) or 120-130°F (Class
4).
- Control the solution at 18-21 oz Econochrome S per gallon with a CrO3/66 ratio of 5.0-6.7 and a CrO3/SO4 ratio of 105-200 to 1 (125-155
to 1 is best) for Class 1, 2, or 4, or 85-105 to 1 for Class 3.

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NOTE: The CrO3/66 ratio is ounces per gallon of chromates to units per gallon of Econochrome 66, where 1 unit is 1.28 fluid ounce of
Econochrome 66. For Class 1, 2, or 4 plating, to make the plating bond better and decrease chicken wire cracks, keep this ratio in the 95-
100 to 1 range. For Class 3 plating, keep the ratio in the 90-95 to 1 range.
- Add sulfuric acid to bring sulfate within limits.
- For Class 1, 2, or 4 plating, plate at 1.0-4.5 asi. For Class 3 plating, plate at 2-3 asi.
F. Econochrome 40 Bath
- Clean the tank, Then add two-thirds total amount of water.
- Add 205 pounds of Econochrome 40 for each 100 gallons of final solution, and mix until fully dissolved.
- Fill the tank with water to the operating level.
- Operate the solution at 115-150°F (Class 1 plating), 120-140°F (Class 2 plating; 130-140°F is best), 130-140°F (Class 3
plating) or 120-140°F (Class 4 plating).
- Control the solution at 18-40 ounces Econochrome 40 per gallon (28-32 oz/gal is best) with a CrO3/66 ratio of 25-50 to 1 and a
CrO33/SO4 ratio of 75-200 to 1 (75-125 is best), for Classes 1, 2, or 4, or 85-105 to 1 for class 3.
NOTE: The CrO3/66 ratio is ounces per gallon of chromates to units per gallon of Econochrome 66, where 1 unit is 1.28 fluid ounce of
Econochrome 66. For Class 1, 2, or 4 plating, to make the plating bond better and decrease chicken wire cracks, keep this ratio in the 95-
100 to 1 range. For Class 3 plating, keep the ratio in the 90-95 to 1 range.
- Add sulfuric acid to adjust the sulfate within limits.
- For Class 1, 2, or 4 plating, plate at 1.0-4.5 asi. For Class 3 plating, plate at 2-3 asi.
G. Sulfuric Acid Etch Solution
- Clean the tank. Then mix 10 gallons sulfuric acid and 90 gallons water for each 100 gallons final solution.
- Operate the solution at a temperature of 86°F maximum.
- Control the solution at 20.0-24.0 oz/gal sulfuric acid.
H. Chromic Acid Etch Solution

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- Clean the tank. Then mix a solution of 30-50 ounces chromic acid for each gallon of final solution.
- Operate the solution at room temperature.
I. Cyanide Holding Solution
- Clean the tank. Then add one-half total amount of water.
- Add 31.0 pounds sodium cyanide for each 100 gallons of final solution. Stir until dissolved.
- Add 10.0 pounds sodium hydroxide for each 100 gallons of final solution. Add chemical slowly, or the solution will get too hot. Stir
until dissolved.
- Fill the tank with water to the operating level.
- Operate the solution at room temperature.
- Control the solution at 4.0-5.0 oz/gal sodium cyanide and 1.0-2.0 oz/gal sodium hydroxide.
J. Sulfuric Acid - Hydrofluoric Acid Etch Bath
- Clean the tank. Then mix 25 gallons sulfuric acid, 4 gallons of 70% hydrofluoric acid, or 6.5 gallons of 45% hydrofluoric acid, or 46
pounds ammonium bifluoride, and 71 gallons of water for each 100 gallons of final solution.
NOTE: You can use other concentrations of hydrofluoric acid if you adjust the quantity of acid.
- Operate the solution at 60-100°F.
- Control the solution at 50-70 oz/gal sulfuric acid, 3-6 oz/gal fluoride, 1.5 oz/gal maximum dissolved iron.
K. Nickel Strike Bath
- Clean the tank. Then fill to three-quarter level with water.
- Add 200 pounds nickel chloride for each 100 gallons of final solution and stir until fully dissolved.
- Add 8.6 gallons hydrochloric acid for each 100 gallons of final solution and stir.
- Fill tank with water to operating level and stir.
- Operate the solution at 60-100°F.

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- Control the solution at 30-35 oz/gal nickel chloride hexahydrate, 3.7-4.3 oz/gal HCl, and 1 oz/gal maximum dissolved iron. Make up a
new bath when the maximum iron level is reached. Use nickel or carbon anodes, or both, as required to control the nickel
concentration. Remove the nickel anodes if the bath will not be used for a long time.
L. Procedure to Decrease Sulfates in Chrome Plating Bath
- Use this procedure only when the usual controls do not decrease the sulfates.
- Before you add the barium carbonate powder, mix up the plating bath for a minimum of 1 minute.
- Slowly add barium carbonate over the surface of the bath. Continue to mix the bath for a minimum of 30 minutes. Do not use too much
barium carbonate. One weight part of barium carbonate will remove 0.3 weight parts of sulfate ion.
- Turn off the agitation. Let the barium sulfate settle for a minimum of 4 hours.
- Carefully pump the liquid layer of the bath into a clean tank, but do not include the bottom layer of precipitates. Discard the layer of
precipitate and clean the tank.
- Send the removed chrome plating solution through a filter and back into the cleaned tank.
- Make an analysis of the plating solution and adjust the concentrations as necessary.

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PLATING SOLUTION SLUDGE REMOVAL
• Remove sludge from the self-regulating high speed chromium plating solution as follows:
- Heat the solution to 150°F.
- Stir the solution to put the sludge back into the solution.
- Let the bath settle for at least 30 minutes.
- Siphon off all but a few inches of the solution into a clean tank, heated if possible.
- Manually remove the sludge and the remaining solution from the plating tank.
- Fully clean the plating tank.
- Put the siphoned-off solution back in the plating tank.
- Adjust the solution to the correct concentration with Unochrome CR-110 plating compound added.
- Heat solution to a temperature of 135-145°F.
- Add 5 pounds Unichrome CR-204 plating compound for each 100 gallons of solution, as you stir, until no more plating compound will
dissolve. Too much of this plating compound is not a problem for the bath.
- Adjust solution temperature to 120-140°F.
• Remove sludge from the other plating solutions with a filter and an acid proof filter pump, or siphon off the liquid into a clean holding
tank and remove the sludge manually from the plating tank.
• Use a 5-micron filter to remove fine particulate matter when you siphon off the solution and when you put it back in the plating bath.

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PREPARATION OF PARTS
Unless specified by the overhaul instructions, surfaces to be Class 2 or 3 plated must have a 63 microinch finish or smoother.
Unless specified by overhaul instructions, the surfaces to be Class 4 plated must be smooth, without defects that will not let the part be
serviceable. All important surfaces to be Class 4 plated must have a 32-microinch finish or smoother. Unless specified, do not chrome plate
until all base-metal heat treatment and mechanical operations (machining, brazing, welding, forming, perforating, etc.) have been completed.
Some ferrous alloy parts heat treated 160 ksi and above must be stress relieved before plating. Before you plate, stress relieve low alloy and
corrosion-resistant steel parts as specified in the overhaul instructions.

PLATING PROCESSES
Unless specified by the overhaul instructions, the plating thickness must be 0.003 inch minimum for Class 2 and 3, and 0.0003-0.0005 inch for
Class 4. The maximum plating thickness is 0.015 inch. The minimum and maximum thickness limits apply after all specified metal finishing
operations are completed. See Table 1 to help you make estimates of time necessary for a specified plating thickness. Actual plating rates
could be smaller or larger by 50% or more from these values because of anodes or plating solutions.

Table 1: Nominal Plating Rates

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• Surfaces must be water-break-free after they were in a processing solution or rinse, unless after vapor degreasing, solvent cleaning, or
emulsion cleaning. A water-break-free surface is a surface which keeps a continuous water film for at least 30 seconds after they were
sprayed or put into clean water cooler than 100°F. Clean parts again if they get water breaks.
• You can temporarily stop the current during plating to measure dimensions with Procedure 1 or 2, as follows:
(a) Procedure 1
- Decrease the current to zero amperes.
- Remove the part and measure the dimensions. Keep the part wet with the chrome plating solution while the part out is of the
bath.
- Put the part back in the bath in 5 minutes or less.
- Let the part get back to solution temperature with the current off for 10 minutes.
- Anodic etch in plating bath at 1-2 asi for 30 seconds to 1 minute.
- Apply cathodic current at 5-60 asf (0.03-0.42 asi) for 10 minutes.
- Slowly increase the current to the specified plating density and continue plating.
(b) Procedure 2
- Decrease the current to zero amps but do not turn the power off.
- Remove the part from the bath and measure the dimensions. If the part is touched or rinsed, keep it wet with water or
the chrome plating solution. If the part is not touched or rinsed, you can let the solution dry on the part.
- Put the part back in the bath at zero amps in 5 minutes or less.
- Let the parts soak for 2-5 minutes at zero amps with the power on.
- Increase the current to the specified current density in the next 5-10 minutes and continue plating.

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• If you must temporarily stop the current, use one of these procedures to reactivate and continue plating:
• Ferrous Alloys
(1) Stress relieve, if necessary.
(2) Shot peen, if necessary.
(3) Vapor degrease, solvent clean, or emulsion clean.
(4) For parts to be Class 1, 2, or 4 plated:
- As an option for steels heat treated below 180 ksi, alkaline clean and rinse, then clean with specified abrasives, or
dry abrasive blast.
- If rust or scale is present.
Parts below 180 ksi: Clean and descale.
Parts above 180 ksi: Abrasive clean, grind or polish if required. If you grind the parts, stress relieve them again.
(5) For steels to be Class 3 plated, dry abrasive blast, with 80-120 grit aluminum only. As an option for Class 3 plating less than 0.0007 inch
thick on surfaces 32-microinch finish or smoother, lightly sand the surfaces, or polish them. If more masking is necessary, after you
apply the masks, manually solvent clean the unmasked areas with MEK, acetone, or .
(6) If plating must wait more than 10 minutes for wet parts:
- Put parts in cyanide holding solution for a maximum of 4 hours.
- Cold water rinse.
(7) If plating must wait more than two hours for abrasive cleaned parts or more than 16 hours for polished parts, make sure there are no
signs of corrosion, dirt, or discoloration after you use one of these two procedures:
- Hold the parts at ambient conditions for a maximum of six hours in a clean area with protection from dust and fumes.
- Put the parts in cyanide holding solution for a maximum of four hours.

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(8) For Class 1, 2, or 4 plating on corrosion resistant steel, nickel and cobalt based alloys, and other heat resistant alloys. Nickel strike
anodically in nickel strike bath for up to 2 minutes at 30-35 asf. Follow immediately with cathodic current for 3-4 minutes at 10-15 asf.
- Anodic etch in plating bath at 1-2 asi for 30 seconds to 5 minutes.
- Cathodically treat in sulfuric acid bath at 5-6 volts for 2-3 minutes at room temperature.
- Cold water rinse (100°F maximum).
(9) For Class 3 plating (and optionally for Class 2 plating) on PH or low alloy steels:
- Put the part in sulfuric-hydrofluoric acid etch solution with current off.
- Activate anodically at 3-4 asi (3-6 asi for PH steels) for 60-70 seconds.
- Cold water rinse.
- Examine the surfaces. A uniform brown to black smut will be on steel, but no change will occur on nickel plate, nickel alloys, or PH
steels. The smut on low alloy steel is necessary for a good bond of the chrome plating.
- Keep surfaces wet and move the parts to the plating bath within 7 minutes.
(10) For Class 3 plating (and optionally for Class 2 plating) on nickel-based alloys
- Air-water-pumice blast, then
- Periodic reverse treat in Endox 214 at 4-7 volts. Start anodic for 15-20 seconds. The anodic cycle time must be longer than the
cathodic cycle time. Always end on the anodic cycle. Continue to periodic reverse treat for 2-10 minutes or until surfaces are water-
break-free.
- Cold water rinse for a minimum of 2 minutes.
(11) Put the parts in the plating bath, with the current off, for 1-10 minutes as necessary to heat the parts to the temperature of the solution.
As an option, strike at 3-5 asi for 30-90 seconds. Reduce current to the correct range and plate to get the specified thickness, as follows:
- For Class 2, plate at the density specified for the solution you use. Adjust the current density to make allowance for the solution
temperature. A lower temperature requires a lower current density.

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- For Class 3 plating, decrease the current to 2-3 asi and plate to the specified thickness.
- For Class 4 plating, plate at a current density and temperature that gives the necessary hardness, usually at high current density and
lower temperature. Too thick a plating will have decreased bond strength and an increased risk of chicken wire cracks.
(12) Cold water rinse (100°F maximum), followed by hot water rinse (above 130°F), if necessary to help dry the parts.
(13) Remove maskants and dry with clean, moisture-free compressed air.
(14) Bake parts within 10 hours.
• Aluminum and Aluminum Alloys
- Prepare parts for plating. Do not let the part dry after the last rinse of the preparation procedure.
- Put the parts in the plating bath, with power off, for 1-10 minutes as necessary to heat the parts to the temperature of the
solution. Then strike at 3-5 asi for 30-90 seconds. Then plate at the same current density as given above for steels, to get the
specified plating thickness. Adjust the current density to make allowance for the solution temperature. A lower temperature goes
with a lower current density.
- Cold water rinse (100°F maximum), followed by hot water rinse (above 130°F), if necessary to help dry the parts.
- Dry parts and remove maskants.
- Bake parts within 10 hours.
• Copper and Copper Alloys
- Prepare the surface as specified in Cleaning of Copper and Copper Alloys.
- Put the parts in the plating bath, with power off, for 1-10 minutes as necessary to heat the parts to the temperature of the
solution. Then strike at 3-5 asi for 30-90 seconds. Then plate at the same current density as given above for steels, to get the
specified plating thickness.
- Rinse. Hot water (above 130°F) can be used to help dry the parts.
- Dry with clean, moisture free compressed air and remove maskants.

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- Bake beryllium-copper alloy parts within 10 hours.

POST-PLATE BAKING
• Within 10 hours after the plating, or within 24 hours after you first apply plating current to the part, whichever is shortest, bake
applicable parts as specified in Table 2, unless specified differently by the overhaul instructions. One bake can be used for more than
one chrome plating operation on the part, if the bake starts within 24 hours after you first apply plating current to the part.
• If the part must be chrome plated longer than 24 hours, you must remove the part from the bath in time to start the bake by the 24-
hour time limit. After this bake, reactivate the part, and then continue the plating process. A new set of 10-hour and 24-hour time
limits starts when you again apply the plating current. If the part must be plated longer, be sure to remove it from the bath to start
another bake by the new 24-hour time limit. Continue as necessary until the plating is completed, then bake the part within the final
10-hour or 24-hour limit.
• When the part will be later cadmium or cadmium titanium plated, the bake can be:
Stopped after 6 hours to let you grind and do more plating. A minimum 6 hour bake between each plating cycle is necessary. After the
last plating cycle, bake as necessary for the requirements of the last plating deposited, or to complete the minimum bake requirement
for chrome plating, whichever is longer not done until after the cadmium or cadmium titanium plating operation, if you are sure to
start the bake within 24 hours after you first applied the chrome plating current to the part. The bake and application of post
chromate treatment and primer (if applicable) must be completed before you start to grind.

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Table 2: Post-Plate Bake Requirements

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CHROME PLATE RUNOUT
• The chrome plate runout area is that area of the chrome plated surfaces where the chrome plating thickness changes from the
required thickness to zero. The specified runout is necessary to be sure the plating area is correct and to give clearance for grinding
(when applicable) and masking materials.
• Make the runout during the plating operation with special electrodes, a current robbing procedure, or metal tape and shields, to get a
gradual runout without a bead or a square edge.
• Unless specified by the overhaul instructions, make the chrome plating runout 0.080 inch wide at the edges of the plated area.

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Chrome Plate Runout Details


Figure 1 (Sheet 1 of 4)

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Chrome Plate Runout Details


Figure 1 (Sheet 2 of 4)

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Chrome Plate Runout Details


Figure 1 (Sheet 3 of 4)

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QUALITY CONTROL
• The plating must be smooth, fine grained, bonded tightly to the base metal, and have no blisters, pits, nodules, porosity, excessive
edge buildup, or signs of burns. No signs of cracks which can be seen by the unaided eye are permitted. This includes chicken wire
cracks. Small color changes because of the bakes or rinses are acceptable.
• To be sure your plating procedure makes plating bonded tightly to the base metal, do a chisel test or a bend test on a sample. Use the
chisel test on class 3 plating. Use the chisel test or the bend test on class 2 plating.
• Hardness of class 2 and 3 plating must be Rc 55 or more. Hardness of class 4 must be Rc 67 or more.
• For class 3 plating, analyze the bath for chromic acid and sulfate concentrations a minimum of one time per week while the bath is in
operation.
• Do tests on samples at regular intervals to be sure of the plating quality. Use an interval that agrees with standard industry practices,
your experience with the procedure, and to make sure you can find parts that could have bad plating.
• Do tests for hydrogen embrittlement on the chrome plating you made
- When you make a new chrome plating bath
- When you replace more than 30% of a chrome plating bath
- When you add barium carbonate to the chrome plating bath to remove sulfates. .

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Typical Hard Chrome

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6.6. ELECTRODEPOSITED NICKEL PLATING

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The data in this subject comes from Boeing Process Specification electrodeposited nickel plating. The data is general. It is not about all
situations or specific installations. Use this data to help you write minimum standards. This procedure makes nickel electroplating that agrees
with QQ-N-290. This nickel plating is a relatively soft, low stressed, ductile coating for the protection of steels and other alloys and for the
buildup of surfaces for repair purposes. Do not use this nickel plating on steels heat-treated above 220 ksi unless specified by the applicable
overhaul instructions. The distance from the nickel plated surface through the base metal to the nearest unplated surface must be less than 2
inches. The unplated surface must have an area at least one-third that of the nickel plated surface to let hydrogen be baked out. The surface
must be shot peened before you plate it.

Hydrogen Diffusion Paths


Figure 1

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MATERIALS
• Sulfamate Nickel Plating Solution (Concentrate), Purified. This material must not contain brighteners or stress reducers but can
contain bromides (Type SN makeup, SNR replenisher and SNR-24 concentrated replenisher)
• Sulfamic Acid, plating grade
• Wetting Agent (Anti-pit)
- Duponel ME
- SNAP, SNAP-L (liquid), or SNAP-A/M
• Boric Acid, Crystalsl
• Nickel Anodes, 99% nickel rolled depolarized or carbon-nickel cast and rolled
• Nickel Carbonate
• Activated Charcoal
• Bromide
- Additive No. B
- Nickel Bromide Concentrate, 18 percent
- Nickel Bromide Crystals, plating grade
- Sodium Bromide, pure or USP grade
• Inhibitors
- Amchem Rodine 100 or 213
- Turco Acryl
• Endox 214 cleaner solution
• Trisodium Phosphate - Glutamate (TSPG) cleaner solution

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• Nickel Sulfate Hexahydrate, plating grade
• Filter Aid, Diatomaceous earth
• Hydrogen Peroxide, 35%l
• Nickel Chloride Hexahydrate
• Hydrochloric Acid, 20-degree Baume’
• Anode bags – unbleached muslin, dynel or napped polypropylene
• Maskant, Turcoform 5696
• Anode Basket and Hooks, Titanium (CP is recommended)
• Nickel Chips, Sulfur Depolarized (SD)
• Sodium Hydroxide, Flake or Granulated
• Sulfuric Acid, 66-degree Baume
• Fluoboric Acid, 48 percent
• Hydrofluoric Acid, 70 percent
• Ammonium Bifluoride
• Conductive Silver Composition, DuPont No. 8535

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PREPARATION OF SOLUTIONS
WARNING: SOLUTIONS USED FOR NICKEL PLATING ARE CORROSIVE AND TOXIC. USE ADEQUATE PRECAUTIONARY
MEASURES TO AVOID INJURY TO PERSONNEL AND DAMAGE TO EQUIPMENT.

Sulfamate Nickel Plating Solution


• Clean the tank thoroughly. Fill it to 1/2 level with nickel sulfamate concentrate, diluted with an equal volume of water.
• The bath can be made with bromides or chlorides, or you can do without them if you use sulfur depolarized anodes.
- Add bromide as necessary to get a bromine concentration of 0.2-1.5 oz/gal in the final solution.
- Or add nickel chloride hexahydrate to get a chlorine concentration of 0.45-0.65 oz/gal in the final solution.
• Add boric acid as necessary to get a boric acid concentration of 4.0 oz/gal minimum in the final solution. You can dissolve the boric
acid crystals in deionized or distilled water and add this solution to the bath, or heat the bath to 150°F maximum and add the crystals
directly. Add the crystals slowly and stir the solution.
• Add more nickel sulfamate concentrate as necessary to get a nickel concentration of 10-15 oz/ gal in the final solution. Fill the tank to
operating level with water.
• Adjust the pH of the solution, as required, as follows:
- Decrease the pH with a solution of sulfamic acid and water.
- Increase the pH with nickel carbonate, added through the filter.
- Add the chemicals carefully, and let the solution come back to equilibrium before you add more chemicals. If you added nickel
carbonate, keep the solution at 120-140°F for at least 2 hours before you plate with it.
• Adjust the surface tension with wetting agent, if necessary. If powdered wetting agent is used, dissolve it 6 ounces per pint of warm
water before you add it.
• Control the solution at these values: nickel sulfamate 43 oz/gal minimum, 0.2-1.5 oz/gal bromide

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• or 0.45-0.65 oz/gal chloride, 28-40 dyne/cm surface tension, 10-15 oz/gal nickel (Types 1 and 3 plating) or 10 oz/gal minimum (Type 2
plating), and pH of 3.0-5.0. Control the boric acid as saturated with boric-acid-filled anode bags in the solution.
• Control the solution temperature at 120-140°F. During plating, control the temperature within +/- 5°F in that range.
• Use nickel anodes with anode bags. Use the bagged titanium anode basket with sulfur depolarized nickel chips.
• Remove metallic contamination if above these values: 150 mg/liter iron, 37.5 mg/liter copper, 52.5 mg/liter zinc, 2.25 mg/liter lead,
7.50 mg/liter hexavalent chromium.

Watts Nickel Plating Solution (for plating parts below 220 ksi)
• Clean tank thoroughly and fill to 1/2 level with warm (120-140°F) deionized or distilled water.
• Add 40.0 ounces nickel sulfate for each gallon of final solution and stir until the chemical is dissolved.
• Add 6.0 ounces nickel chloride for each gallon of final solution and stir until the chemical is dissolved.
• Dissolve 5.0 ounces boric acid for each gallon of final solution in warm water, add to Watts solution, and stir to mix.
• Add water to fill the tank to the operating level.
• Adjust the pH of the solution as follows:
- Decrease the pH with a solution of sulfuric acid and water.
- Increase the pH with nickel carbonate, added through the filter.
- Add the chemicals carefully, and let the solution come back to equilibrium before you add more chemicals. If you added
nickel carbonate, keep the solution at 120-140°F for at least 2 hours before you plate with it.
• Add wetting agent powder, 0.05 oz/gal, or liquid, 0.1 oz/gal.
• Control the solution at these values: 38.0-44.0 oz/gal nickel sulfate, 5.0-7.0 oz/gal nickel chloride, 4.0-5.0 oz/gal boric acid, 35.0-45.0
dyne/cm surface tension, 9.0-11.0 oz/gal nickel, and pH of 3.0-4.0.
• Control the solution at a temperature of 90-130°F. During plating, control the temperature within ±5°F in that range.

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• Use nickel anodes with anode bags. Use the bagged titanium anode basket with sulfur depolarized nickel chips.

Nickel Strike Solution


• Clean tank thoroughly and fill to 1/2 level with water.
• Add 32 ounces nickel chloride powder (or 0.33 gallon of a nickel chloride liquid that has 6 pounds nickel chloride hexahydrate per
gallon) for each gallon of final solution and stir until the chemical is dissolved.
• Add 10 fluid ounces hydrochloric acid for each gallon of final solution, or 44 fluid ounces per gallon for the optional high-chloride
bath.
• Fill the tank to operating level with water.
• Control the solution at these values: 30.0-35.0 oz/gal nickel chloride, 3-5 oz/gal as hydrochloric acid for the standard bath, or 15-17
oz/gal hydrochloric acid for the optional high-chloride bath, and 1.0 oz/gal, maximum, iron.
• If the iron concentration gets to 1.0 oz/gal, make a new nickel strike solution, or remove the iron . Remove copper contamination . if
you get dark deposits on the nickel plating or metallic copper immersion deposits on ferrous surfaces.
• Control the solution temperature at 60-100°F.
• Control anode to cathode ratio at 1 to 1 minimum.
• Use nickel anodes with anode bags. Use the bagged titanium anode basket with sulfur depolarized nickel chips.

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Fluoboric Acid Activation Solution (for copper surfaces only)
• Fill the tank to 9/10 level with water.
• Add an amount of fluoboric acid equal to 2.5% of the final tank volume.
• Fill the tank to the operating level with water.
• Control the fluoboric acid at 1.25-2.50 oz/gal HBF4. Control the solution temperature at 60-90°F.
Sulfuric Acid Bath
• Make this with 13-15 ounces sulfamic acid per gallon (97-112 grams per liter) of final solution in water.
• Use the solution at room temperature.

Inhibited Hydrochloric Acid (BAC5625 Solution 1 or BAC5751 Solution 1)


• Clean tank completely. Put 10 gallons of water in the tank.
• Add 54 gallons hydrochloric acid for each 100 gallons of final solution.
• Add 5 pints of inhibitor. Do not mix different inhibitors.
• Fill the tank with water to the final level.
• Keep the solution at room temperature (60-100°F).
• Control the solution at 23-38 oz/gal HCl, 5 oz/gal maximum iron, and 0.5 oz/gal maximum copper. When you add hydrochloride acid
to control the acid concentration, be sure to add 1 fluid ounce of inhibitor per gallon of acid (or 0.8 percent by volume).

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Sulfuric - HF Solution
NOTE: The quantities of hydrofluoric acid in this recipe are for 70% HF. If you use a different concentration of hydrofluoric acid, be sure to
adjust the quantities of this acid.
• Clean tank thoroughly and make up solution as follows:
- Fill tank to 1/2 level with cold water.
- While stirring, slowly add 25 gallons of sulfuric acid for each 100 gallons of final solution.
- Let the solution cool below 90°F, then add 4 gallons of hydrofluoric acid, or 25 pounds of ammonium bifluoride, for each 100
gallons of final solution.
- Fill the tank to operating level with cold water, stirring constantly.
• Control the solution temperature at 60-90°F.
• Control the solution at these values: 50-70 oz/gal sulfuric acid, 3-6 oz/gal fluoride, and 1.5 oz/gal maximum iron.
• Use acid resistant carbon electrodes or lead (Pb-7Sn) electrodes.

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NICKEL PLATING SOLUTION PURIFICATION
A. Removal of Organic Contamination
• Move the dirty solution to a different tank to permit removal of the contamination.
• Adjust the pH to 2.0-2.5 with careful use of these chemicals:
- For sulfamate solution, add sulfamic acid.
- For Watts solution, add sulfuric acid.
- For the nickel strike solution, add hydrochloric acid.
• Add 1.0 pint hydrogen peroxide for each 100 gallons of solution. Agitate solution for 2 to 4 hours.
• CAUTION: DO NOT HEAT THE SOLUTION ABOVE 150°F, BECAUSE THE CHEMICALS WILL DECOMPOSE AT
APPROXIMATELY 155°F.
• Heat the solution to 140-150°F. Add 5-7 pounds activated charcoal per 100 gallons of solution and agitate 3-4 hours, or let the heated
solution flow through an activated charcoal filter.
• Let the solution settle for at least 8 hours.
• Prepare a filter cake with 2 ounces of filter aid (as a 1 pound per gallon slurry) per square foot of filtering area. Let the solution flow
through the filter until it comes out transparent.
• Rinse the filter with clean water.
• Increase the solution pH to 5.5-5.8 with a slurry of nickel carbonate.
• Clean the plating tank thoroughly. Heat solution to 120-140°F and send the solution through the filter, back to the plating tank.
• Keep the solution at 120-140°F for at least 2 hours before you use it.
• Adjust the temperature, pH and surface tension of the solution to the correct operating values as applicable.

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B. Removal of Metal Impurities
• Electrolytic method (to remove copper, lead, iron, and zinc):
- Heat solution to operating temperature and agitate solution.
- With corrugated steel cathodes, fill the tank with as large a cathode area as possible.
- Plate something at 3.5-4.5 asf for 4-5 ampere hours per gallon of solution.
• High pH Precipitation Method (to remove iron and chromium):
NOTE: This procedure could remove some of the organic material.
- Move the solution to a different tank.
- Heat the solution to 120-140°F.
- Add 1.0 pint hydrogen peroxide per 100 gallons of solution.
- Increase the solution pH to 5.5-5.8 with a slurry of nickel carbonate.
- Add 4.0 pounds activated charcoal per 100 gallons of solution and agitate solution for 3 to 4 hours or let the heated solution flow
through an activated charcoal filter.
- Let the solution stand at a temperature of 130-140°F for at least 8 hours.
- Prepare a filter cake with 2 ounces of filter aid (as a 1 pound per gallon slurry) per square foot of filtering area.
- Clean the plating tank thoroughly. Send the solution, through the filter, back to the plating tank.
- Adjust the temperature, pH and surface tension of the solution to the correct normal operating values as applicable.

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PLATING PROCESSES
Before plating, stress relieve low alloy and corrosion-resistant steel parts per the overhaul instructions. Where no stress relief details are given,
stress relieve. The nickel plating solutions must be purified. when one or more of these conditions occur: The nickel plating you get is mirror-
bright or rough, or has cracks, flakes or streaks or bad color after all solution controls are within correct limits. Organic contamination, such as
solvent, lacquer, paint, oil, or grease, came into the solution. Cured masking materials on parts are not contamination if the plating results are
satisfactory. Metallic contamination is more than the limits specified for the plating solution. The sulfamate nickel plating stress. for plating on
parts 220 ksi and above, or -1 ksi (compressive) to 15 ksi (tensile) for plating on parts below 220 ksi. Surfaces must be water-break-free after
they are put in any processing solution or rinse, unless after vapor degreasing, solvent cleaning, or emulsion cleaning. A water-break-free
surface is a surface which keeps a continuous water film for 30 seconds minimum after spray or immersion in clean water at temperatures less
than 100°F. Clean parts again which do not have waterbreak-free surfaces. Unless the overhaul instructions are different, the part surface must
not be rougher than 125 microinches.

Nickel plating on parts below 220 ksi (BAC5746, Type 1)


NOTE: In this procedure, you can use the sulfamate or the Watts plating baths.
• Stress relieve, if required.
• Vapor degrease, emulsion clean, or solvent clean, if required.
• Mask and rack as required.
• For low alloy steels below 220 ksi.
(a) If necessary, remove scale and oxide with one of these procedures:
- Dry abrasive clean with glass beads or aluminum oxide abrasive. Then alkaline clean 10-12 minutes. Warm water rinse for 5 minutes
minimum. Then start to nickel plate within one minute.
- Etch in inhibited hydrochloric acid solution 30 seconds - 5 minutes to remove light

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amounts of oxides, or 1-10 minutes to remove scale. Rinse immediately in cold water. If the oxides and scale are not removed, put
the part back in the solution as necessary, but not more than 10 minutes (steels 180 ksi and above) or 25 minutes (steels below 180
ksi). Then fully rinse within one minute.
- For low alloy steels 180 ksi or below:
Periodic reverse clean in TSPG solution 10-20 minutes at 120-140°F and 100-250 asf. Rinse with water within one minute.
Periodic reverse clean in Endox 214 solution. Rinse with water and start to nickel plate, within one minute.
(b) Use one of these procedures to activate the part surface
1) TSPG (Preferred option for low alloy steels 180 ksi or below)
- Periodic reverse electroactivate in TSPG solution. End on the anodic cycle.
- Rinse 2-3 minutes.
- Put the part in sulfamic acid solution for 30-90 seconds. Then start to nickel plate, within one minute.
2) Endox 214 Solution
- Cathodic clean in Endox 214 solution at 50 asf for 1.5-2.0 minutes.
- Rinse in warm water for 2-3 minutes.
- Put the part in sulfamic acid solution for 30-60 seconds.
- Rinse in warm water for 2-3 minutes.
- Cathodic clean in Endox 214 solution again, at 50 asf for 1.5-2.0 minutes.
- Rinse in warm water for 2-3 minutes. Then rinse in cold water for 30-60 seconds.
- Put the part in sulfamic acid solution for 30-60 seconds.
- Do not rinse. Within 30 seconds, put the part in the nickel plating solution and plate them.
3) Inhibited Hydrochloric Acid
- Alkaline clean, then rinse in cold water.

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- Put the part in inhibited hydrochloric acid for 15 seconds maximum (parts cleaned with glass beads) or 10 seconds maximum (parts
cleaned with aluminum oxide).
- Rinse in cold water. Then start to nickel plate, within 30 seconds.
• For nickel surfaces, nickel, cobalt and chromium alloys, PH, 300 and 400 series CRES
(a) For PH steels, this procedure is preferred over the procedure:
- Soak or spray alkaline clean, or dry or wet abrasive clean.
- Rinse in cold water.
- Put the part in inhibited hydrochloric acid for 30 seconds to one minute.
- Rinse in cold water. As an option, parts can be held in an Endox 214 bath, a cyanide holding bath (BAC5625, Solution 11), or alkaline
cleaner. After this option is used, rinse the parts in cold water.
- Make electrical connections and put the parts in the nickel strike bath. Apply anodic current first for 3.0-3.5 minutes, then switch to
cathodic for 4-5 minutes. Use 20-25 asf at 3-7 volts. If the anodic strike causes smut or bond problems on PH steels, use only the
cathodic strike for 4-5 minutes.
- Rinse fully for 30-90 seconds. Do not let the parts dry. Start to nickel plate, before the parts dry.
(b) For nickel, cobalt, chromium alloys, and 300 and 400-series CRES, and optionally for PH steels.
- Electrolytic clean in Endox 214 or TSPG, or dry or wet abrasive clean.
- Rinse in cold water for a minimum of 5 minutes.
- Make electrical connections and put the parts in the nickel strike bath with the power energized. Use a current density of 25-35 as for
the anodic and cathodic strikes. Apply
anodic current for up to 3 minutes, then switch to cathodic for 4-5 minutes. If the anodic strike causes smut or bond problems, use
only the cathodic strike, for 4-5 minutes. The anodic strike is also not necessary for 15-5PH which was abrasive cleaned with glass
beads.
- Rinse for 30-90 seconds. Do not let the parts dry. Start to nickel plate.

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• For copper alloys.
- Put the parts in the fluoboric acid bath for 2-6 minutes.
- Rinse in cold water for 30-45 seconds. Do not let the parts dry. Within one minute, put the parts in the nickel plating solution and
plate them.
• Nickel plate the parts.
- Attach the electrical connections to the parts before you put them in the plating tank.
- Set the voltage at 0.25-0.50 volt and apply power as the part goes into the solution.
- Keep the voltage in this range until the parts get to the temperature of the solution.
- When the parts are at the solution temperature, slowly increase the voltage until the current density is in the operating range. A
current density of 70-100 asf is recommended. A higher density causes more edge buildup, and more risk of contamination such as
by fingerprints. See Table 1 for approximate relations between current density, time, and
plating thickness, but do not use that data as an alternative to measurements of the nickel plate you make.
- Plate to the thickness specified by the overhaul instructions. If not specified, the thickness must be 0.003 inch minimum on alloy
steels, and 0.0015 inch minimum on other metals. If the nickel plate will be machined, plate a minimum of 0.003 inch oversize on
each surface.
- If the current is stopped, activate the part surfaces as applicable.
- If the time to get the specified thickness will be more than 24 hours, stop the plating cycle and bake for hydrogen embrittlement
relief as necessary.
• Remove the parts from the tank. Rinse in cold water. A hot water rinse (above 130°F) can then be used to help dry the parts. Remove
masks if applicable.
• Dry with clean, moisture-free compressed air.
• Bake for hydrogen embrittlement relief, if necessary. Do not bend springs or other plated parts before this bake.

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Table 1: Nickel Plating Thickness Relations

Nickel plating on parts 220 ksi or above (Optional for low alloy steels below 220 ksi)
NOTE: In this procedure you can use only the sulfamate plating bath, not the Watts bath.
• Stress relieve, if required.
• Vapor degrease, emulsion clean, or solvent clean, if required.
• Mask and rack as required.
• Dry abrasive blast.
• Rinse in cold water.
• Soak in sulfuric-HF solution for 15-25 seconds. Then anodically etch for 60-90 seconds at 3-6 asi (432-864 asf). This will put a uniform
dark gray to black layer of smut on the surface.
• Cold water rinse within 30 seconds after you stop the anodic current. Keep the surfaces wet and move the parts to the plating

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bath within 5 minutes.
• Clean the parts.
- The sulfuric-HF etched surface does not have a layer of dark gray or black smut.
- The parts waited more than 5 minutes between the sulfuric-HF solution and the plating solution.
- The parts were not kept wet with water, but were permitted to dry.
• Nickel plate the parts
- Attach the electrical connections to the parts before you put them in the plating tank.
- Lower the parts into the solution.
- Within 3 minutes, strike-plate the parts at 60-100 asf for 1-3 minutes. Then reduce the current density to 20-30 asf until the parts get
to the temperature of the solution.
- When the parts are at the solution temperature, increase the voltage until the current density is in the operating range. A current
density of 70-100 asf is recommended. A higher density causes more edge buildup, and more risk of contamination such as by
fingerprints. See Table 1 for approximate relations between current density, time, and plating thickness, but do not use that data as
an alternative to measurements of the nickel plate you make.
- Plate to the thickness specified by the overhaul instructions. If not specified, the thickness must be 0.003 inch minimum on alloy
steels, and 0.0015 inch minimum on other metals. If the nickel plate will be machined, plate a minimum of 0.003 inch oversize on
each surface.
- If the current is stopped, activate the part surfaces.
- If the time to get the specified thickness will be more than 24 hours, stop the plating cycle and bake for hydrogen embrittlement
relief as necessary.

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Hydrogen Embrittlement Relief Bake
• Unless the overhaul instructions are different, start to bake the parts as necessary within 10 hours after plating or less than 24 hours
after the current was first applied to the part. One bake can be used for long or multiple plating cycles if the bake starts within 24
hours after the current was first applied to the part. More than one bake is necessary for longer cycles. Reactivate parts before you
start more plating cycles.
• Bake parts per Table 2 unless specified by the overhaul instructions. Set the control at the temperature specified. For parts 220 ksi or
higher with a hydrogen diffusion path longer than 1.0 inch, increase the bake time 8 hours for each 0.5 inch (or fraction of 0.5 inch)
that the diffusion path of the part is longer than 1.0 inch. The maximum hydrogen diffusion path length must not be longer than 2.0
inches.
• Unless specified, the bake is not necessary for these alloys:
- 300-Series CRES, A-286, nickel alloys 625 and 718
- PH steels below 180 ksi, unless they have external threads made after the part was age hardened.
- 17-7PH in the CH-900 condition.

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Table 2: Post-Plate Bake

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NICKEL PLATE RUNOUT
The nickel plate runout area is that area of the nickel plated surfaces where the nickel plating thickness changes from the required thickness
to zero. The specified runout is necessary to be sure the plotting area is correct and to give clearance for machining (where applicable) and
masking materials. Unless specified by the applicable overhaul instructions, make the nickel plating runout 0.080 inch wide at the edges of
the plated area, as shown in Figure 2.

Nickel Plate Runout Details


Figure 2

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QUALITY CONTROL
• The nickel plating must be smooth, fine grained, well bonded, and have no blisters, pits, nodules, porosity, burns or other defects.
Slight color differences because of bakes are acceptable. The unplated surfaces must have no pits, burns, or etch marks when
examined without magnification.
• Plate Thickness
- When the nickel plate thickness is not specified by the overhaul instructions it must be 0.003 inch minimum on alloy steels and
0.0015 inch minimum on other metals.
- Unless specified by overhaul instructions, the thickness requirements apply only to surfaces that can be touched by a ball 0.75 inch
in diameter. All other visible surfaces open to the plating current must be completely covered by the plating, except in recessed
areas where the depth is more than twice the width or diameter.
- These thickness requirements apply to nickel plating after all necessary metal finishing operations. Do not include the thickness of
other plating under the nickel when you measure the thickness of the nickel plating.
• Do tests on the strength of the bond and the stress in the layer of nickel plating.
• Do tests on samples at regular intervals to be sure of the plating quality. Use an interval that agrees with standard industry practices,
your experience with the procedure, and to make sure you can find parts that could have bad plating.

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6.7. ELECTROLESS NICKEL PLATING

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The data in this subject comes from Boeing Process Specification. The data is general. It is not about all situations or specific installations. Use
this data as a guide to help you write minimum standards. This nickel plating agrees with the requirements of MIL-C-26074 but, for parts 180
ksi and below, tests for hydrogen embrittlement are not necessary.
Class 1 is the basic electroless nickel plating same as MIL-C-26074, Class 1, 3 and 4. Use this plating if the overhaul instructions do not include
the class of electroless nickel plating. Class 2 is plating heat treated to make it hard, same as MIL-C-26074, Class 2. Class 3 is plating with
increased corrosion protection.

MATERIALS
NOTE: Equivalent substitutes can be used.
• Nickel sulfate, liquid, electroless nickel grade
• Potassium carbonate, anhydrous, reagent grade
• Sulfamic acid
• Acetic acid, glacial
• Ammonium hydroxide, technical
• Sulfuric acid, reagent grade
• Elnic 100 System, Elnic, Inc.
- C-5 concentrate
- RP-1 nickel replenisher
- RP-2 catalyst replenisher
• Duraposit 85 System, V21075
- Duraposit M catalyst concentrate
- Duraposit R nickel concentrate
- Duraposit S base/catalyst replenisher

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• Hydrochloric acid, 20 degree Baume
• Filter bags – Polypropylene, 1 or 5 micron
• Abrasive – Pumice, Grade FF
• Filter cartridges – 1 or 5 micron
• Ammonium Hydroxide, reagent grade
• Niklad 794 System
- Niklad 794A makeup concentrate
- Niklad 794B makeup additive
- Niklad 794HZ replenisher
• Niposit 65 System, V21079
- Niposit 65M, makeup concentrate
- Niposit 65R, nickel replenisher
- Niposit 65S, base replenisher
• Endox 214
• Disposable Tank Liner – Polyethylene or polypropylene up to 0.030 inch thick
• Abrasive Paper – Wet- or dry silica carbide (only), 600 grit
• Scotch-Brite – Silicon carbide Type S (grey), ultrafine or superfine
• Stop Off Material
- Turco 544 Maskant
- Adcoat AC-828 or AC-850 Maskant
- Adcoat AC-832 Topcoat

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- MIL-P-23377
• Nitric acid, technical grade

EQUIPMENT
• Use plating tanks with agitation devices such as filtered air, or mechanical stirring, rocker arm, or a recirculated solution sufficient to
make the temperature the same within +/- 5°F at all points in the tank. The tank can be of stainless steel (which can be acid
passivated) with a passivation voltage source, cathodes and rectifier. Other tank materials can be used if a disposable liner is used.
• Use filters that will agree with the filtration requirements specified for the plating solutions.
• Auxiliary equipment such as heaters, pumps, and tanks used for makeup must permit acid passivation of their surfaces, or if nonmetal
must be resistant to the passivating acid used. Cooling equipment is optional. The tanks must have covers.

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PREPARATION OF SOLUTIONS
General Makeup and Control Requirements
• Make up the solution in a clean tank.
- If a stainless steel tank is used before you make up the plating solution, passivate all stainless steel surfaces with concentrated nitric
acid at a temperature of 70-90°F. Let the nitric acid flow for 1 hour minimum throughout the system to include all pipes, filter
holders (empty), and pumps. Drain, collect, and keep the nitric acid in a stainless steel container at the end of this passivation
procedure to let you use it to clean and passivating the system again if the solution contains no more than 2 oz/gal nickel and 5
ppm copper. Then fully rinse and flush the system with water to be sure of the removal of all nitric acid from all surfaces that will
touch the electroless nickel plating solution. Hose down the tank walls.
Then, send small amounts of water through the system. Do this until the pH is 6.5 minimum. A maximum of 1 gallon of ammonium
hydroxide, technical grade, can be added for each 50 gallons of rinse water used here.
- When stainless steel tanks are used, apply and keep a 1.0-1.5 volt anodic potential on the tank.
• Add the specified chemicals in the sequence given by the plating procedure to be used.
• Use water with these properties:
- Water for plating solutions must have an electrical resistivity of not less than 50,000 ohmcm.
- Rinse water must not contain more than 750 ppm total solids.
• When you move the plating solution from the holding tank to the plating tank, send it through a 5-micron filter. During plating, send
at least 5 tank volumes per hour through a 5-micron filter. When you plate for long continuous times, 10 volumes per hour is the best
rate. As an alternative, batch-filter at least 5 tank volumes through a 5-micron filter at least once each 24 hour period that the solution
is used.
• Heat the solution to the operating temperature immediately before you start to plate.
• Cool the solution to below 150°F immediately after plating is complete.

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• Adjust the solution to the specified control limits (laboratory analysis) before plating, and while the solution is below 150°F. Mix fully
before you heat the solution to the plating temperature. Niposit 65 plating solution can be adjusted during the plating procedure by
its procedure for a hot solution.
• Decomposition of the bath will cause bubbles of gas with a black precipitate of finely divided nickel. If this occurs, quickly cool the
solution and discard it. Do not try to make it serviceable. Clean and passivate the tank again before you use it to make a new solution.
• Keep the cover on the tank at all times except when you add or remove parts for plating or during maintenance of solution.
Particulate matter that falls into the solution will cause rough plating.

Niposit 65 Plating Solution


WARNING: NIPOSIT CONCENTRATES ARE HARMFUL IF SWALLOWED. DO NOT TAKE INTERNALLY. AVOID BREATHING OF VAPORS. AVOID
CONTACT WITH SKIN, EYES, AND CLOTHING. WEAR PROTECTIVE CLOTHING, RUBBER GLOVES, AND SAFETY GLASSES.
• Clean the auxiliary tank and add these materials in the sequence given:

• Control the plating solution temperature within +/- 5°F of a value in the range of 180-205°F (195-200°F is best).
• Control the metallic nickel in the plating solution at 5.7 - 7.8 g/liter (6.9 - 7.1 g/liter is best). Control the pH at 4.6-5.2.
- For each gallon of solution and each 1.0 gram/liter (3.8 gram/gal) of nickel required, add 37 ml of Niposit 65R followed by 74 ml of
Niposit 65S. Add the concentrates slowly to a cold solution as you stir it. Add no more than one gallon at a time and add one
replenisher, then the other and stir each until the necessary amount is added. If a draw off is necessary, first adjust the solution up
to or evaporate down to its original makeup volume and make an analysis. If this is not done, imbalance will occur of the
proprietary additives which keep the plating rate stable.

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- Increase the pH with ammonium hydroxide. Decrease the pH with a sulfuric acid solution (1 volume acid added to 9 volumes water).
• Metal contamination limits:

• During the plating procedure, a hot solution can be adjusted when parts are in the bath with these precautions:
- At the same time, from opposite sides of the tank, slowly add two parts Niposit 65S and one part Niposit 65R. Add as you stir the
solution. For maximum plate and solution life, add sufficient replenishment to keep the chemical concentration of nickel in the
6.9-7.1 g/liter range as plating continues. The rate of addition can be made to agree with the calculated
decrease of nickel from the solution. Calculate this before the start of plating and make the adjustments in increments during the
expected plating time.
- Adjustment of nickel to the correct value usually keeps the solution pH in the correct range. More adjustments can be made with
reagent grade ammonium hydroxide or sulfuric acid. Dilute the concentrated sulfuric acid to 50% by volume before you add it to
the plating bath. The Niposit replenishers 65R and 65S can also be used individually to make small pH adjustments.
- If there is a large decrease in solution volume, as by spills or unusual drag out, add more solution made by the above instructions.

Duraposit 85 Plating Solution


• Clean the auxiliary tank and add these materials in the sequence given:

NOTE: Liquid nickel sulfate contains approximately 133.8 grams/liter metallic nickel or 600 grams/liter as nickel sulfate hexahydrate.

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• Control the nickel concentration at 80-100% (4.9-6.1 grams/liter as nickel).
- Add Duraposit R or liquid nickel sulfate as necessary but not more than 15% at one time.
- For each part of Duraposit R or liquid nickel sulfate added, subsequently and slowly add two parts of Duraposit S.
• Control the solution pH at 4.8-5.2. Increase the pH with liquid potassium carbonate (700 grams/ liter of the anhydrous
compound in deionized water). Decrease the pH with sulfuric acid approximately 20%.
• Control the solution temperature at 180-200°F (190°F is best).
• Control the load at 0.25-1.00 square feet per gallon (1.00 sq. ft./gal is best).
• Metal contamination limits:

• Replace the solution after 3 operational cycles.

Elnic 100 Plating Solution


• Clean the auxiliary tank. Then add 4 volume parts water and 1 volume parts C-5 concentrate.
• Control the nickel concentration at 75-95% (5-7 grams/liter as nickel).
- We recommend adjustment when the nickel concentration decreases to 85%. Add replenishers RP-1 and RP-2 as necessary while parts
are plating. For best results, add the replenishers in 5 or 10% increments. For a 10% increment adjustment, add 25 ml of RP-1 and 50
ml of RP-2 per gallon of plating solution.
- Add the RP-1 replenisher smoothly across the tank. Then add the RP-2 replenisher slowly to prevent foam. Do not add RP-2 around the
heaters or above the parts.

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- Make the analysis for nickel as frequently as necessary to be sure the nickel constration stays in the correct range.
• Control the solution pH at 4.6-4.8.
- Usually adjustment of the nickel to the correct value keeps the solution pH in the correct range. More adjustment can be made with
ammonium hydroxide or sulfuric or acetic acid. The ammonium hydroxide and the sulfuric acid must be first diluted with an equal
volume of deionized water.
- Checks of the pH are best made after the nickel adjustment is completed. Large changes in solution pH are usually a sign of
contamination that comes in from the pretreatment line.
• Control the solution temperature at 185-195°F.
• Control the load at 0.25-1.00 square feet per gallon (0.4 sq ft/gal is best).
• Metal contamination limits:

• At the end of each cycle of operation (a 100% replenishment which is the same as 250 ml RP-1 and 500 ml of RP-2), add 10% C-5
concentration. Then adjust the nickel concentration.

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Niklad 794 Plating Solution
• Clean the auxiliary tank and add these materials in the sequence given:

• Control the pH at 4.5-5.5. Increase the pH with ammonium hydroxide. Decrease the pH with a sulfuric acid solution (1 volume acid
added to 9 volumes water).
• Control the plating solution temperature at 185-205°F.
• Control the dissolved nickel in the solution at 0.4-0.9 oz/gal.
- For each 0.1 oz/gal of nickel deposited, add 2.0 fl oz/gal (1.5 gal/100 gal) each of Niklad 794A and Niklad 794B.
- When the plating thickness will be more than 0.003 inch, use 20 gal/100 gal Niklad 794B for make up. If not, use Niklad 794B only
when there is a large decrease in solution volume, as because of spills or unusual heavy drag out.
• Metal contamination limits:

• Adjustment of nickel to the correct value usually keeps the solution pH in the correct operating range. If more adjustment of

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pH is necessary.

Uninhibited Hydrochloric Acid Solution


- Add 14 gallons hydrochloric acid to 86 gallons water to make 100 gallons final solution.
- Maintain solution at a temperature of 60-140°F.
- Control solution at 5.5-8.0 oz/gal hydrochloric acid and 1.0 oz/gal (maximum) iron.

Sulfamic Acid Solution


- For each 100 gallons of solution, put 75 gallons water in a tank. Add and dissolve 90 pounds of sulfamic acid. Then add water as
necessary.
- Control the solution at 13-15 oz/gal. Operate at room temperature.
PREPARATION OF PARTS
The base metal must be free from defects that will be a problem for serviceability of the coating and part. Unless specified by the overhaul
instructions, the surfaces of parts to be plated must be 125 microinch finish or smoother, and have no blemishes, pits, tool marks or other
irregularities. Unless specified, apply this plating after all base-metal heat treatment and mechanical operations (machining, brazing, welding,
forming, perforating, etc.). Before plating, stress relieve all low alloy and corrosion resistant steel parts per the overhaul instructions. Cleaning,
Masking Racking If necessary, vapor degrease, emulsion clean, solvent clean, manual clean, or alkaline clean. Remove scale from clean ferrous
alloys, nickel alloys, cobalt alloys, and nickel plate and coil springs. Surfaces must be water-break-free after they are put in any processing
solution or rinse, except after vapor degreasing, solvent cleaning, or emulsion cleaning. A water-break-free surface is a surface which keeps a
continuous water film for a period of at least 30 seconds after spray or soak in clean water at temperatures less than 100°F. Clean parts which
do not have water-breakfree surfaces. Put parts in racks to prevent caught gas during the plating. Do not let parts touch other parts or the
tank. Turn parts to help them drain. Let the rack touch the parts in other than important areas if possible. Use electroless nickel stop-off on
racks, fixtures, and as a maskant on parts.
Activation and rinse water temperature must be less than 200°F:

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• Heat-Treated Alloy Steels
(a) For steels above 180 ksi, dry abrasive blast. For steels below 180 ksi, this is preferred option to the TSPG or Endox 214 activation
procedures.
(b) TSPG Procedure
- Periodic reverse clean in TSPG cleaner to remove heat scale, discoloration or rust. Usually 5-20 minutes is sufficient. As an option,
abrasive blast with sand or water and pumice.
- Put the parts in sulfamic acid solution for 1-2 minutes to remove smut. Examine the surface for water breaks and, if necessary, clean
again.
- Periodic reverse clean in TSPG solution for 1-2 minutes. Stop on the cathodic cycle.
- Rinse with water. If the parts have smut, put them in sulfamic acid solution for 30-60 seconds. Rinse again and put the parts in the
plating solution. Do not let the parts dry.
(c) Endox 214 Procedure
- Periodic reverse clean in Endox 214 solution. Scotch-Brite or water-pumice-air blast can be used to help in scale removal.
- Rinse with water. If the parts have smut or scale, hand scour thoroughly with silicon carbide Scotch-Brite (ultra-fine) or 600 grit
silicon carbide wet/dry paper and clean water. Rinse thoroughly for at least 5 minutes. Examine the surface for water-breaks again. If
water-breaks occur in less than 30 seconds, rescour, rinse, and examine again for water-breaks.
- When no water-breaks occur, activate with Endox 214 for 2-5 minutes at 3-7 volts with the periodic reverser set above. End up
anodically for 10-20 seconds before you turn off the rectifier.
- Rinse with water for 10-15 minutes. If the parts have smut, put the parts in sulfamic acid solution for 1-2 minutes. Rinse again with
water for 2-5 minutes.
- Periodic reverse activate in Endox 214 for 1-2 minutes at 3.5-4.5 volts. Use the same periodic reverse cycle as in the cleaning. Make
the last cycle 15-20 seconds anodic.

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- Do not let the activated parts dry. Keep parts wet at all times. Rinse in air-agitated tap water or deionized water for at least 5 minutes.
Continue to keep the parts wet until fully in the plating solution.
• Non-Heat-Treated Alloy Steel
- Put the parts in uninhibited hydrochloric acid solution for 1 minute maximum.
- Rinse and examine for smut. If the parts have no smut, rinse and continue with plating process. If the parts have smut, activate with
the procedure for heat-treated alloy steel.
- Nickel-Plate, Corrosion Resistant Steel, Nickel and Cobalt Base Alloys – Activate and nickel strike and continue with plating process.
- Aluminum Alloys – Prepare for plating.

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ELECTROLESS NICKEL PLATING PROCEDURE
• Do not let the parts dry after activation. Immediately put them in the plating solution. If gassing does not start immediately,
momentarily make the parts cathodic (negative) 1-3 volts or touch the parts with a nickel plated or soft iron wire. The tank
passivation system can be used as the activation voltage source.
• Constant agitation is necessary when the solutions are above 160°F. Air agitation is preferred, but mechanical agitation can be used
if this moves the solution satisfactorily. Also, air agitation or filtered plating solution pointed at some areas of the part can be used to
prevent gas pits or nodules because of contamination that comes down on surfaces, especially top surfaces. Mechanical movement
of the part to prevent nodules or rough surfaces is recommended.
• Include adhesion control coupons and, as applicable, corrosion and Class 2 and 3 control specimens with each tank load of parts.
Plate these coupons along with the parts and do not remove them until the plating is completed.
• The specimens used to monitor the plating thickness and calculate the plating rates can be removed at different times before
completion of the plating. A correctly adjusted electroless nickel bath will plate at approximately 0.0005 inch per hour per surface.
• Do not let parts touch each other or the tank.
• Turn and move parts to prevent problems caused by caught gas bubbles.
• Do not let the solution level decrease below 90% of the initial level. Add water to keep the level up. If a long plating cycle will
decrease the nickel below the minimum permitted concentration, adjust the solution as necessary during the plating operation.
• Plating thickness
- If the specified thickness is 0.004 inch or less, plate to get that thickness.
- If the specified thickness is more than 0.004 inch, remove the part from the plating bath at each 0.003-0.005 inch buildup.
Rinse and make the surface rough with silicon carbide paper or Scotch-Brite. (This surface treatment is not necessary if
there are no nodules or other buildups.) Activate and continue plating. Do not plate thicker than 0.015 inch.
- If the plating thickness is not specified by the overhaul instructions.

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• If the plating must be stopped, such as when bath decomposition occurs, immediately remove the parts and the test specimens from
the plating bath. Rinse and dry them. Examine the plating for defects. If the plating is satisfactory, periodic reverse clean (optional)
and then nickel strike. Then continue plating.
• Remove the parts from plating tank. Rinse, dry and visually examine the parts.
• Remove maskant. Parts can be rinsed again and dried or alkaline cleaned to remove stains.
• Post Plate Baking Requirements
If not specified by overhaul manual instructions, bake parts per Table 1.

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Table 1: Post-Plate Baking

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QUALITY CONTROL
• The nickel plating must be smooth, fine-grained, and have no blisters, pits, nodules, or porosity or separation when examined without
magnification. Discoloration resulting from baking is acceptable.
• On parts other than aluminum, the plating must not come off when tested per BSS 7235. As an alternative for parts plated per MIL-C-
26074, the plating must not come off from the outside radius of a part or specimen that was bent 180° on a 1/2-inch diameter
mandrel.
• Unless specified by overhaul instruction, the minimum thickness must be:
- On ferrous alloys with less than 12% chromium, 0.0020 inch
- On aluminum and aluminum alloys, 0.015 inch
- On all other metals, 0.0005 inch
• For tests of hardness, corrosion resistance and hydrogen embrittlement, refer to overhaul instruction

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